Mishra et al., 2019 - Google Patents
Macroporous epoxy-carbon fiber structures with a sacrificial 3D printed polymeric mesh suppresses electromagnetic radiationMishra et al., 2019
View PDF- Document ID
- 165613935348425950
- Author
- Mishra S
- Katti P
- Kumar S
- Bose S
- Publication year
- Publication venue
- Chemical Engineering Journal
External Links
Snippet
Metals are known to be highly conducting and can shield electromagnetic waves quite well. In a quest to explore materials that are lightweight, corrosion free, easy to fabricate and integrate/embed, epoxy-carbon fiber composite structures have attracted a great deal of …
- 229920000049 Carbon (fiber) 0 title abstract description 140
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
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- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
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