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Jaccottet et al., 2022 - Google Patents

Towards a wireless micropackaged implant with hermeticity monitoring

Jaccottet et al., 2022

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Document ID
12009003698111441862
Author
Jaccottet A
Feng P
Szostak-Lipowicz K
Keeble L
Constandinou T
Publication year
Publication venue
2022 IEEE Biomedical Circuits and Systems Conference (BioCAS)

External Links

Snippet

The development of reliable hermetic chip-scale micropackaging is one of the major challenges in the miniaturization of implantable medical devices. Protecting the patient from the implanted foreign body and the implant itself from the biological environment is crucial …
Continue reading at discovery.ucl.ac.uk (PDF) (other versions)

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