[go: up one dir, main page]

Fidan, 1996 - Google Patents

The design, implementation, and performance analysis of a prototype SMD automated rework cell

Fidan, 1996

Document ID
11171701272374805372
Author
Fidan I
Publication year

External Links

Snippet

INFORMATION TO USERS Page 1 INFORMATION TO USERS This manuscript has been reproduced from the microfilm master. UMI films the text directly from the original or copy submitted. Thus, some thesis and dissertation copies are in typewriter free, while others may be …
Continue reading at search.proquest.com (other versions)

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions ; Methods of application thereof
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2201/00Articles made by soldering, welding or cutting by applying heat locally
    • B23K2201/36Electric or electronic devices
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10Using electric, magnetic and electromagnetic fields; Using laser light

Similar Documents

Publication Publication Date Title
CN114505553B (en) Laser soldering method, device and system
US5325582A (en) Multi-function workstation for assembly and repair of printed wiring board assemblies
JP3216033B2 (en) Inspection result output device, inspection result output method, substrate inspection system using this inspection result output device, and substrate inspection method using this inspection result output method
EP3616819B1 (en) Laser soldering method and device
CN114749745A (en) Automatic laser soldering method, device and system
Fidan The design, implementation, and performance analysis of a prototype SMD automated rework cell
Fidan et al. Designed experiments to investigate the solder joint quality output of a prototype automated surface mount replacement system
DE19639993C2 (en) Device for contactless, selective soldering or desoldering of components
Fidan et al. Integration steps of a fully-automated remanufacturing cell system for fine-pitch surface mounted devices
Blackwell 2. 4 Substrate Design Guidelines. 2.8 2. 5 Thermal Design Considerations 2.10
Fidan CAPP for electronics manufacturing case study: Fine pitch SMT laser soldering
Geren et al. Cost and performance analysis of a robotic rework cell
JPH05308187A (en) Soldering inspection and correction apparatus
Fidan et al. Internet-based electronics manufacturing troubleshooting tool for surface mount PCB assembly
Geren Automated removal and replacement of surface mounted devices in electronic assembly
Fidan et al. Integrated user interface design for electronics remanufacturing systems
Fidan et al. Designed experiments to analyze the solder joint quality output of a SMD remanufacturing system
Mistry Process Parameter Optimization and Barrel-Fill Prediction for Selective Wave Soldering in High-Density Printed Circuit Boards
ATED et al. ÇUKUROVA UNIVERSTY INSTITUTE OF NATURAL AND APPLIED SCIENCES
Fidan et al. Design and implementation of a flexible intelligent electronics remanufacturing system
JPH08195554A (en) Soldering correction processor
Srihari et al. SMT-TAB: A process planning system for PCB assembly using TAB and SMT
Yang Process' optimization'for surface mount printed circuit board assembly
Markstein SMT Advantages
Brink Decision analysis of a placement machine for low volume, high mix electronic manufacturing systems