[go: up one dir, main page]

Chiang et al., 2012 - Google Patents

Aluminum electrode modulated bipolar resistive switching of Al/fuel-assisted NiO x/ITO memory devices modeled with a dual-oxygen-reservoir structure

Chiang et al., 2012

Document ID
110699680909498976
Author
Chiang K
Chen J
Wu J
Publication year
Publication venue
ACS applied materials & interfaces

External Links

Snippet

Bipolar resistive switching in Al/fuel-assisted NiO x (40 nm)/ITO devices is demonstrated in this work. XPS analysis reveals the simultaneous presence of metallic Ni, Ni2O3, and NiO components in the fuel-assisted NiO x. The concentration, as well as spreading of the …
Continue reading at pubs.acs.org (other versions)

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L45/00Solid state devices adapted for rectifying, amplifying, oscillating or switching without a potential-jump barrier or surface barrier, e.g. dielectric triodes; Ovshinsky-effect devices; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof
    • H01L45/04Bistable or multistable switching devices, e.g. for resistance switching non-volatile memory
    • H01L45/12Details
    • H01L45/122Device geometry
    • H01L45/1233Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L45/00Solid state devices adapted for rectifying, amplifying, oscillating or switching without a potential-jump barrier or surface barrier, e.g. dielectric triodes; Ovshinsky-effect devices; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof
    • H01L45/04Bistable or multistable switching devices, e.g. for resistance switching non-volatile memory
    • H01L45/14Selection of switching materials
    • H01L45/145Oxides or nitrides
    • H01L45/146Binary metal oxides, e.g. TaOx
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L45/00Solid state devices adapted for rectifying, amplifying, oscillating or switching without a potential-jump barrier or surface barrier, e.g. dielectric triodes; Ovshinsky-effect devices; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof
    • H01L45/04Bistable or multistable switching devices, e.g. for resistance switching non-volatile memory
    • H01L45/16Manufacturing
    • H01L45/1608Formation of the switching material, e.g. layer deposition
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L45/00Solid state devices adapted for rectifying, amplifying, oscillating or switching without a potential-jump barrier or surface barrier, e.g. dielectric triodes; Ovshinsky-effect devices; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof
    • H01L45/04Bistable or multistable switching devices, e.g. for resistance switching non-volatile memory
    • H01L45/14Selection of switching materials
    • H01L45/141Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L45/00Solid state devices adapted for rectifying, amplifying, oscillating or switching without a potential-jump barrier or surface barrier, e.g. dielectric triodes; Ovshinsky-effect devices; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof
    • H01L45/04Bistable or multistable switching devices, e.g. for resistance switching non-volatile memory
    • H01L45/08Bistable or multistable switching devices, e.g. for resistance switching non-volatile memory based on migration or redistribution of ionic species, e.g. anions, vacancies
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/7869Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00 - G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00 - G11C25/00 using resistance random access memory [RRAM] elements
    • G11C13/0021Auxiliary circuits

Similar Documents

Publication Publication Date Title
Chiang et al. Aluminum electrode modulated bipolar resistive switching of Al/fuel-assisted NiO x/ITO memory devices modeled with a dual-oxygen-reservoir structure
Wang et al. Overview of resistive random access memory (RRAM): Materials, filament mechanisms, performance optimization, and prospects
Rana et al. Endurance and cycle-to-cycle uniformity improvement in tri-layered CeO2/Ti/CeO2 resistive switching devices by changing top electrode material
Hsiung et al. Formation and instability of silver nanofilament in Ag-based programmable metallization cells
Hu et al. Highly controllable and stable quantized conductance and resistive switching mechanism in single-crystal TiO2 resistive memory on silicon
Jeon et al. Study of in situ silver migration in amorphous boron nitride CBRAM device
Wang et al. Excellent resistive switching properties of atomic layer-deposited Al2O3/HfO2/Al2O3 trilayer structures for non-volatile memory applications
Wang et al. Resistive switching induced by metallic filaments formation through poly (3, 4-ethylene-dioxythiophene): poly (styrenesulfonate)
Huang et al. Manipulated transformation of filamentary and homogeneous resistive switching on ZnO thin film memristor with controllable multistate
Won et al. Forming-less and non-volatile resistive switching in WOx by oxygen vacancy control at interfaces
Liu et al. Controllable growth of nanoscale conductive filaments in solid-electrolyte-based ReRAM by using a metal nanocrystal covered bottom electrode
Zhang et al. AgInSbTe memristor with gradual resistance tuning
Lee et al. High current density and nonlinearity combination of selection device based on TaO x/TiO2/TaO x structure for one selector–one resistor arrays
Tappertzhofen et al. Generic relevance of counter charges for cation-based nanoscale resistive switching memories
Kim et al. All solution-processed, fully transparent resistive memory devices
Nagashima et al. Intrinsic mechanisms of memristive switching
O’Kelly et al. A single nanoscale junction with programmable multilevel memory
Huang et al. Dual-functional memory and threshold resistive switching based on the push-pull mechanism of oxygen ions
Rehman et al. Resistive switching in solution-processed copper oxide (Cu x O) by stoichiometry tuning
Shuai et al. Key concepts behind forming-free resistive switching incorporated with rectifying transport properties
Chakrabarti et al. Temperature-dependent non-linear resistive switching characteristics and mechanism using a new W/WO3/WOx/W structure
Wang et al. Influence of metal electrode on the performance of ZnO based resistance switching memories
Baek et al. Nonvolatile memory devices prepared from sol–gel derived niobium pentoxide films
Park et al. Laser-assisted interface engineering for functional interfacial layer of Al/ZnO/Al resistive random access memory (RRAM)
Rahaman et al. Enhanced nanoscale resistive switching memory characteristics and switching mechanism using high-Ge-content Ge0. 5Se0. 5 solid electrolyte