[go: up one dir, main page]

Yazawa et al., 2013 - Google Patents

A Method for Failure Analysis for Devices With Simultaneous Imaging of Electron Emission and Near IR Thermoreflectance

Yazawa et al., 2013

View PDF
Document ID
921510593456679716
Author
Yazawa K
Kendig D
Christofferson J
Shakouri A
Publication year
Publication venue
International Electronic Packaging Technical Conference and Exhibition

External Links

Snippet

Thermal characterization is useful for identifying the cause of circuit failures. Unusually high local temperatures can occur due to unexpected and localized power dissipation in a particular device, which was not anticipated nor designed in the device. Unintended high …
Continue reading at www.academia.edu (PDF) (other versions)

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302Contactless testing
    • G01R31/308Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/311Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L31/00Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED, VISIBLE OR ULTRA-VIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry
    • G01J5/02Details
    • G01J5/04Casings Mountings
    • G01J5/041Mountings in enclosures or in a particular environment
    • G01J5/043Prevention or determination of dust, smog or clogging

Similar Documents

Publication Publication Date Title
Schmidt et al. Application of lock-in thermography for failure analysis in integrated circuits using quantitative phase shift analysis
US6107107A (en) Analyzing an electronic circuit formed upon a frontside surface of a semiconductor substrate by detecting radiation exiting a backside surface coated with an antireflective material
KR20040071686A (en) Time resolved non-invasive diagnostics system
Kendig et al. Thermal analysis of advanced microelectronic devices using thermoreflectance thermography
Trigg Applications of infrared microscopy to IC and MEMS packaging
Yazawa et al. Time-resolved thermoreflectance imaging for thermal testing and analysis
Breitenstein et al. Thermal failure analysis by IR lock-in thermography
Bahk et al. Ultra-fast thermoreflectance imaging for electronic, optoelectronic, and thermal devices
Komarov et al. A thermoreflectance thermography system for measuring the transient surface temperature field of activated electronic devices
Yazawa et al. A Method for Failure Analysis for Devices With Simultaneous Imaging of Electron Emission and Near IR Thermoreflectance
Christofferson et al. Thermoreflectance imaging of superlattice micro refrigerators
Yazawa et al. Challenges and opportunities for transient thermal imaging of microelectronic devices
Kendig et al. Thermal imaging based on Thermoreflectance addresses the challenges for thermal analysis of today's advanced complex devices
Kendig et al. Side-by-side comparison between infrared and thermoreflectance imaging using a thermal test chip with embedded diode temperature sensors
Perpiñà et al. Thermal issues in microelectronics
Tessier et al. High resolution thermal imaging inside integrated circuits
Yazawa et al. Ultrafast submicron thermoreflectance imaging
Yazawa et al. High-speed transient thermoreflectance imaging of microelectronic devices and circuits
Kendig et al. Thermal imaging of encapsulated LEDs
Shakouri et al. Ultrafast submicron thermal characterization of integrated circuits
Komarov et al. CCD thermoreflectance thermography system: methodology and experimental validation
Kim et al. Thermoreflectance Microscopy for Thermal Analysis of Electronics
Yazawa et al. Fast transient and steady state thermal imaging of CMOS integrated circuit chips considering package thermal boundaries
RU2392687C1 (en) Method of inspecting integrated circuits
Tangyunyong et al. Localizing Defects with Thermal Detection Techniques