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Jiang et al., 2012 - Google Patents

Investigation of carbon-based aluminum thermal management composites sensitized by high-pressure impregnation method

Jiang et al., 2012

Document ID
781717762473753947
Author
Jiang N
Novak J
Publication year
Publication venue
International Journal of Material Science

External Links

Snippet

Power electronic packaging highly demands the innovative light-weight heat dissipation materials with a combination of the low coefficient of thermal expansion (CTE) and the high thermal conductivity. In this study, the highperformance carbon based aluminium thermal …
Continue reading at www.airitilibrary.com (other versions)

Classifications

    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates

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