Wolf, 2012 - Google Patents
Atmospheric pressure plasma for surface modificationWolf, 2012
- Document ID
- 7555277870814785976
- Author
- Wolf R
- Publication year
External Links
Snippet
This Book's focus and intent is to impart an understanding of the practical application of atmospheric plasma for the advancement of a wide range of current and emerging technologies. The primary key feature of this book is the introduction of over thirteen years of …
- 210000002381 Plasma 0 title abstract description 519
Classifications
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes, e.g. for surface treatment of objects such as coating, plating, etching, sterilising or bringing about chemical reactions
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Wolf | Atmospheric pressure plasma for surface modification | |
| Massines et al. | Atmospheric pressure low temperature direct plasma technology: status and challenges for thin film deposition | |
| Kostov et al. | Surface modification of polymeric materials by cold atmospheric plasma jet | |
| Roth | Industrial Plasma Engineering: Volume 2-Applications to Nonthermal Plasma Processing | |
| Pappas | Status and potential of atmospheric plasma processing of materials | |
| Chen | Industrial applications of low‐temperature plasma physics | |
| Kikuchi et al. | Rf microplasma jet at atmospheric pressure: characterization and application to thin film processing | |
| Hubert et al. | Etching processes of polytetrafluoroethylene surfaces exposed to He and He–O2 atmospheric post-discharges | |
| Tavares et al. | Plasma synthesis of coated metal nanoparticles with surface properties tailored for dispersion | |
| Watanabe | Dust phenomena in processing plasmas | |
| Friedrich et al. | Nonthermal Plasmas for Materials Processing | |
| Wang et al. | The effect of air plasma on barrier dielectric surface in dielectric barrier discharge | |
| JP2005516766A (en) | Method for performing homogeneous and heterogeneous chemical reactions using plasma | |
| Yamamoto et al. | Sub-micrometer plasma-enhanced chemical vapor deposition using an atmospheric pressure plasma jet localized by a nanopipette scanning probe microscope | |
| JP4182213B2 (en) | Vapor-liquid phase mixing apparatus and vapor-liquid phase reaction method by liquid level plasma reaction, generation of ammonia and hydrogen, and nitrogen fixing method and apparatus in organic solvent | |
| Jiang et al. | Ion fluxes and memory effects in an Ar–O2 modulated radiofrequency-driven atmospheric pressure plasma jet | |
| Wang et al. | Formation of wettability gradient surface on polyethylene terephthalate by maskless argon microplasma jet writing for droplet self-driven application | |
| Inayoshi et al. | Formation and micromachining of Teflon (fluorocarbon polymer) film by a completely dry process using synchrotron radiation | |
| Choi et al. | Surface structurization and control of CuS particle size by discharge mode of inductively coupled plasma and vapor-phase sulfurization | |
| Oh et al. | Localized DLC etching by a non-thermal atmospheric-pressure helium plasma jet in ambient air | |
| Liu et al. | Optical emission characteristics of medium-to high-pressure N2 dielectric barrier discharge plasmas during surface modification of polymers | |
| Ohtsu et al. | Atmospheric-pressure plasma jet system for silicon etching without fluorocarbon gas feed | |
| Schram et al. | Plasma processing and chemistry | |
| Svarnas et al. | Highly-selective wettability on organic light-emitting-diodes patterns by sequential low-power plasmas | |
| Pal et al. | Enhancement of Adhesion of Polymers by Plasma Treatment: A Critical Review |