[go: up one dir, main page]

Riegel et al., 2022 - Google Patents

Analysis of the stress state in QFN package during four point bending and temperature experiments utilizing piezoresistive stress sensor

Riegel et al., 2022

Document ID
7375238506461636046
Author
Riegel D
Gromala P
Rzepka S
Publication year
Publication venue
Microelectronics Reliability

External Links

Snippet

This article reports a comprehensive study on four point bending and temperature experiments and their correlation with numerical simulation. The test vehicle is a printed circuit board (PCB) with 16 Quad Flat No Leads Packages (QFNs) components mounted on …
Continue reading at www.sciencedirect.com (other versions)

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/02—Details not specific for a particular testing method
    • G01N2203/06—Indicating or recording means; Sensing means
    • G01N2203/0617—Electrical or magnetic indicating, recording or sensing means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/0058—Kind of property studied
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress in general
    • G01L1/24—Measuring force or stress in general by measuring variations of optical properties of material when it is stressed, e.g. by photoelastic stress analysis using infra-red, visible light, ultra-violet
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/08—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress in general
    • G01L1/14—Measuring force or stress in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress in general
    • G01L1/20—Measuring force or stress in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electro-kinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06F—ELECTRICAL DIGITAL DATA PROCESSING
    • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/50—Computer-aided design
    • G06F17/5009—Computer-aided design using simulation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00—Apparatus for, or methods of, measuring force, e.g. due to impact, work, mechanical power, or torque, adapted for special purposes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical means
    • G01B11/16—Measuring arrangements characterised by the use of optical means for measuring the deformation in a solid, e.g. optical strain gauge
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING STRUCTURES OR APPARATUS NOT OTHERWISE PROVIDED FOR
    • G01M7/00—Vibration-testing of structures; Shock-testing of structures
    • G01M7/08—Shock-testing

Similar Documents

Publication Publication Date Title
Park et al. Transient dynamic simulation and full-field test validation for a slim-PCB of mobile phone under drop/impact
Park et al. Development of the 6-axis force/moment sensor for an intelligent robot's gripper
Riegel et al. Analysis of the stress state in QFN package during four point bending and temperature experiments utilizing piezoresistive stress sensor
Van Driel et al. Prediction and verification of process induced warpage of electronic packages
Lall et al. Reliability of lead-free SAC electronics under simultaneous exposure to high temperature and vibration
US7769550B2 (en) Stress analysis method and stress analysis apparatus
Thukral et al. Board level vibration test method of components for automotive electronics: State-of-the-art approaches and challenges
Dudek et al. Combined simulation and optical measurement technique for investigation of system effects on components solder fatigue
Riegel et al. Analysis of the stress state in QFN package during four bending experiment utilizing piezoresistive stress sensor
Wu et al. Hybrid approach to conduct failure prognostics of automotive electronic control unit using stress sensor as in situ load counter
Alshahbouni et al. Designing and modeling U-notch fatigue sensor to predict the fatigue life of structural components
Tinca et al. Printed Circuit Board Orthotropic Material Calibration for Static and Dynamic Loading
JP2000046905A (en) Electronic device reliability evaluation method, reliability evaluation device thereof, and medium recording reliability evaluation program thereof
Riegel et al. Data-driven prediction of the remaining useful life of QFN components mounted on printed circuit boards
Park et al. Measurement of transient dynamic response of circuit boards of a handheld device during drop using 3D digital image correlation
Pustan et al. Modern test methods for a comprehensive thermo-mechanical deformation analysis in area-array-assemblies
Chung et al. The investigation of modified Norris-Landzberg acceleration models for reliability assessment of Ball Grid Array packages
Halwani et al. Enhancing sensitivity and measurement range by Multi-layered Vision-Based Tactile Sensor (ML-VBTS): A parametric study and comparative benchmarking
Metasch et al. Novel concept of an in-situ test system for the thermal-mechanical fatigue measurement for reliability evaluation of electronic solder joints
Bart et al. Coupled package-device modeling for microelectromechanical systems
Palczynska et al. Investigation of uncertainty sources of piezoresistive silicon based stress sensor
Yagnamurthy et al. Contact pressure and load measurement techniques for applications in semiconductor packaging
CN120542161B (en) A compression test method for LCD display production
Lishchenko et al. Strain in ANSYS Simulation and Real Testing
Otto et al. Prognostics and Health Management Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications