[go: up one dir, main page]

Sircar, 2017 - Google Patents

Fabrication of a nanoporous membrane device for high heat flux evaporative cooling

Sircar, 2017

View PDF
Document ID
5213761684848286301
Author
Sircar J
Publication year

External Links

Snippet

We investigated the experimental performance of a nanoporous membrane for ultra-high heat flux dissipation from high performance integrated circuits. The biporous evaporation device utilizes thermally-connected, mechanically-supported, high capillarity membranes …
Continue reading at dspace.mit.edu (PDF) (other versions)

Classifications

    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L2021/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H01L2021/60007—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving a soldering or an alloying process
    • H01L2021/60022—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving a soldering or an alloying process using bump connectors, e.g. for flip chip mounting
    • H01L2021/60097—Applying energy, e.g. for the soldering or alloying process
    • H01L2021/60172—Applying energy, e.g. for the soldering or alloying process using static pressure
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids

Similar Documents

Publication Publication Date Title
Drummond et al. A hierarchical manifold microchannel heat sink array for high-heat-flux two-phase cooling of electronics
US9207540B1 (en) Integrating functional and fluidic circuits in joule-thomson microcoolers
US10784115B2 (en) Method of etching microelectronic mechanical system features in a silicon wafer
TW201116478A (en) Method for manufacturing microstructures
Narayanan et al. On-chip thermal management of hotspots using a perspiration nanopatch
Zhang et al. A novel heat transfer characterization method for a thermal management scheme of 3D-IC chips
Bevis High heat flux phase change thermal management of laser diode arrays
Sircar Fabrication of a nanoporous membrane device for high heat flux evaporative cooling
Sircar et al. High heat flux evaporation from nanoporous silicon membranes
Mahmoodi et al. A quick method to fabricate large glass micromodel networks
Hanks Evaporation from nanoporous membranes for high heat flux thermal management
Yang Experimental and numerical investigation of pool boiling heat transfer on engineered nano-finned surfaces
David et al. Vapor-venting, micromachined heat exchanger for electronics cooling
Eng et al. An experimental study on an electro-osmotic flow-based silicon heat spreader
Holke Development of silicon chemical wet etching toward the realization of an integrated thermal-electronic package
Drummond Characterization of manifold microchannel heat sinks during two-phase operation
Burk A Computational Examination of Conjugate Heat Transfer During Microchannel Flow Boiling Using Finite Element Analysis
Hazra Novel Thermal Management Solutions for Extreme Heat Flux Cooling
Liu Heat routing with liquid-vapor phase change phenomena in microscale porous media
Zhu Micro and nanostructures for two-phase fluid and thermal transport
Alexander Design of a microbreather for two-phase microchannel devices
Li et al. Microembossed copper microchannel heat sink for high‐density cooling in electronics
Hogue An Experimental Study of Enhanced Thermal Conductivity Utilizing Columnated Silicon Microevaporators for Convective Boiling Heat Transfer at the Microscale
US20250280511A1 (en) Nano/micro-channel evaporator for thermal management
TW201013443A (en) Systems, devices, and methods for semiconductor device temperature management