Qian et al., 2002 - Google Patents
EDM texturing of multicrystalline silicon wafer and EFG ribbon for solar cell applicationQian et al., 2002
View PDF- Document ID
- 419881831132600837
- Author
- Qian J
- Steegen S
- Vander Poorten E
- Reynaerts D
- Van Brussel H
- Publication year
- Publication venue
- International Journal of Machine Tools and Manufacture
External Links
Snippet
This paper presents a novel electrical discharge machining (EDM) texturing method for roughening mc-Si wafers and EFG ribbons for solar cell application. Experiments were carried out on an EDM die-sinker using a specially designed conductive and soft magnetic …
- 229910021420 polycrystalline silicon 0 title description 7
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GASES [GHG] EMISSION, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/54—Material technologies
- Y02E10/547—Monocrystalline silicon PV cells
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H7/00—Processes or apparatus applicable to both electrical discharge machining and electrochemical machining
- B23H7/02—Wire-cutting
- B23H7/08—Wire electrodes
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L31/00—Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus peculiar to the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus peculiar to the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic System
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L31/00—Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0236—Special surface textures
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L31/00—Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L31/00—Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/0445—PV modules or arrays of single PV cells including thin film solar cells, e.g. single thin film a-Si, CIS or CdTe solar cells
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9768343B2 (en) | Damage free laser patterning of transparent layers for forming doped regions on a solar cell substrate | |
| US8399331B2 (en) | Laser processing for high-efficiency thin crystalline silicon solar cell fabrication | |
| Dongre et al. | Multi-objective optimization for silicon wafer slicing using wire-EDM process | |
| Qian et al. | EDM texturing of multicrystalline silicon wafer and EFG ribbon for solar cell application | |
| CN100433376C (en) | Cutting and texturing integrated processing method and device for solar silicon wafers | |
| US20120122272A1 (en) | High-throughput flat top laser beam processing for back contact solar cells | |
| KR101384853B1 (en) | Laser processing methods for photovoltaic solar cells | |
| KR101289787B1 (en) | Laser processing for high-efficiency thin crystalline silicon solar cell fabrication | |
| Wang et al. | High efficiency slicing of low resistance silicon ingot by wire electrolytic-spark hybrid machining | |
| US8852981B2 (en) | Electrical contacts to nanostructured areas | |
| EP2819181A1 (en) | Laser annealing applications in high-efficiency solar cells | |
| Dobrzański et al. | Influence of laser processing on polycrystalline silicon surface | |
| Trusheim et al. | Investigation of the influence of pulse duration in laser processes for solar cells | |
| Zhang et al. | The state of the art of wire sawing-based hybrid cutting technology: a review | |
| US8138442B2 (en) | Wire electric discharge machining method, semiconductor wafer manufacturing method, and solar battery cell manufacturing method | |
| Dobrzański et al. | Application of laser in multicrystalline silicon surface processing | |
| Dobrzański et al. | Processing of silicon surface by Nd: YAG laser | |
| Qiu et al. | Research on N-type silicon crystal processing by liquid-immersion wire electrical discharge machining | |
| Nawaz et al. | Effect of input parameters of wire electric discharge machining on surface integrity of DC53 die steel | |
| Ben Rabha et al. | Optoelectronic enhancement of monocrystalline silicon solar cells by porous silicon‐assisted mechanical grooving | |
| Bruckert et al. | Tailor cutting of crystalline solar cells by laser micro jet | |
| Lee et al. | Surface Quality Control of p-type Silicon Chip during Edge Insulation with Wire Electric Dischaarge Machining. | |
| Dobrzański et al. | Structure of laser treated multicrystalline silicon wafers | |
| Zhang et al. | Investigation of nanoscale quasi pyramid texture for HIT solar cells using n-type high performance multicrystalline silicon | |
| Qiu et al. | Experimental study on improving silicon crystal discharge cutting efficiency based on laser irradiation method |