WO2019100183A1 - Touch control integrated display panel and preparation method therefor - Google Patents

Abstract

A method for preparing a touch control integrated display panel. The method comprises: providing an organic light-emitting diode panel (OLED), comprising an illuminant and a thin film encapsulation layer (S101); forming a first touch control conductive layer on the thin film encapsulation layer by means of printing technology, and patterning the first touch control conductive layer (S102); and forming a first insulating layer on the first touch control conductive layer (S103), so as to obtain a touch control integrated display panel. A touch control integrated display panel and a preparation method therefor have the advantages of a simple process and a good yield.

Description

Touch integrated display panel and preparation method Technical field

The present invention relates to the field of display technologies, and in particular, to a touch integrated display panel and a method for fabricating the same.

Background technique

In various flexible or non-flexible display panels, integrating touch functions into display panels is a technology trend. Taking an Organic Light-Emitting Diode (OLED) panel display as an example, touch integration can be realized by integrating an additional conductive film layer on the package film layer. The existing technical solutions depend on traditional deposition, yellow light processing, etching, etc., including various plasma processes and wet processes. The process steps are too complicated and risky damage to the substrate or device, that is, It is said that in the case where the display panel is completed, an overly complicated process may result in a significant loss of yield.

Summary of the invention

The embodiment of the invention discloses a touch integrated display panel with simple process and a preparation method thereof.

A method for preparing a touch integrated display panel includes the steps of: providing an organic light emitting diode panel (OLED), including an illuminant and a thin film encapsulation layer; forming a first touch on the thin film encapsulation layer by a printing technique a conductive layer, and patterning the first touch conductive layer; and forming a first insulating layer on the first touch conductive layer to obtain a touch integrated display panel.

A touch integrated display panel includes: an organic light emitting diode panel including an illuminant and a thin film encapsulation layer; and a patterned first touch conductive layer formed on the thin film encapsulation layer by a printing technique, A material of the touch conductive layer is a material containing at least one conductive particle; and a first insulating layer is formed on the first touch conductive layer.

The touch integrated display panel and the preparation method of the invention form a touch conductive layer by using a printing technology, and do not need to adopt a conventional plasma processing and etching process, thereby maximally avoiding temperature, pressure, etc. on the OLED display panel and internal devices. The damage helps to improve the process yield.

DRAWINGS

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings to be used in the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the present invention. Those skilled in the art can also obtain other drawings based on these drawings without paying any creative work.

FIG. 1 is a schematic flow chart of a method for fabricating a touch integrated display panel including a conductive layer according to an embodiment of the invention.

2 is a schematic flow chart of a method for preparing a touch integrated display panel including two conductive layers according to an embodiment of the invention.

3a-3f are schematic views of a method for fabricating a touch integrated display panel according to a first embodiment of the present invention; wherein, FIG. 3a is a top view of an OLED mother board; FIG. 3b is a cross section of the OLED mother board of 3a along III-III. FIG. 3c is a cross-sectional view showing the first touch conductive layer formed on the OLED; FIG. 3d is a cross-sectional view showing the first insulating layer formed on the first touch conductive layer; FIG. 3e is the first in the OLED and FIG. A schematic cross-sectional view of a conductive silver paste layer formed on the touch conductive layer; FIG. 3f is a top view of the plurality of touch integrated display panels.

4a-4h are schematic diagrams showing a method of fabricating a touch integrated display panel according to a second embodiment of the present invention; wherein, FIG. 4a is a top view of an OLED mother board; and FIG. 4b is a cross section of the OLED mother board of 4a along IV-IV. FIG. 4c is a cross-sectional view showing the first touch conductive layer formed on the OLED; FIG. 4d is a cross-sectional view showing the first insulating layer formed on the first touch conductive layer; FIG. 4e is a first insulating layer; FIG. 4f is a schematic cross-sectional view showing a second insulating layer formed on the second touch conductive layer; FIG. 4g is a schematic view showing formation of conductive silver on the OLED and the first touch conductive layer; FIG. 4h is a schematic plan view showing a plurality of touch integrated display panels.

5a-5b are cross-sectional and top plan views of a touch integrated display panel according to another embodiment of the present invention.

FIG. 6 is a top plan view of a touch integrated display panel according to still another embodiment of the present invention.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, but not all embodiments. . All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.

Please refer to FIG. 1. FIG. 1 is a schematic diagram of a method for fabricating a touch integrated display panel according to a technical solution of the present invention.

A method 100 for preparing a touch integrated display panel includes the steps of:

S101. An organic light emitting diode (OLED) panel is provided. The OLED panel includes an illuminant and a Thin Film Encapsulation (TFE).

S102. Form a first touch conductive layer on the thin film encapsulation layer by a printing technique, and pattern the first touch conductive layer.

S103, forming a first insulating layer on the first touch conductive layer to obtain a touch integrated display panel.

Wherein, the illuminant may include a base substrate, a plurality of thin film transistors formed on the base substrate, and a plurality of organic light emitting diode illuminating elements electrically connected to the plurality of thin film transistors.

The printing technique may be Ink-Jet Printing (IJP) or letterpress printing technology, etc., preferably, the first touch conductive layer is formed by an inkjet printing technique.

The touch conductive layer can be formed by a printing technique, and then the touch conductive layer can be patterned by laser ablation or the like to obtain a patterned first touch conductive layer; or directly formed by a printing technique. The patterned first touch conductive layer.

The material of the first touch conductive layer may be a material containing conductive particles, and preferably may be a material containing conductive particles such as nano conductive particles, metallic silver/copper nanowires, and graphene.

The first insulating layer may be formed by a conventional method, or may be formed by a printing technique, that is, by an inkjet printing technique or a letterpress printing technique or the like. The first insulating layer may be made of a resin material of a material. A first opening may be formed on the first insulating layer to expose a portion of the first touch conductive layer. The first opening may be directly formed when the first insulating layer is formed, that is, the first insulating layer having the first opening may be directly formed by a printing technique or the like, or may be integrated After the first insulating layer, the first opening is formed by a technique such as laser ablation. The first touch conductive layer exposed from the first opening is used to electrically connect other devices. The OLED panel may be divided into a display area and a non-display area located at an edge of the display area, and the first opening is located in the non-display area.

After forming the first insulating layer, the method may further include the steps of:

S104, forming a conductive silver paste layer.

The conductive silver paste layer is formed on a surface of the thin film encapsulation layer.

The conductive silver paste layer is located in the non-display area, and is electrically connected to the first touch conductive layer exposed from the first opening. The conductive silver adhesive layer is used for bonding and electrically connecting the touch integrated display panel to other devices, such as for bonding the touch integrated display panel to a flexible circuit board and electrically connection.

The conductive silver paste layer can also be formed by using printing technology, such as IJP technology, letterpress printing technology and screen printing technology.

The OLED panel may be a mother board, that is, a plurality of OLED sub-units, each of which can independently perform the display function of the OLED; the plurality of OLED sub-units are fabricated on one motherboard, and Forming the touch conductive layer, the insulating layer and the conductive silver adhesive layer on the mother board can save process and reduce cost; in this case, forming the first insulating layer or forming the conductive silver adhesive layer After that, it also includes the steps:

S105. The OLED panel is divided into a plurality of sub-boards to obtain a plurality of touch integrated display panels, wherein each touch integrated display panel includes an OLED sub-unit.

In order to achieve more touch design, a multi-layer touch conductive layer can also be designed on the TFE.

Please refer to FIG. 2. FIG. 2 is a schematic diagram of a method for fabricating a touch integrated display panel having two layers of touch conductive layers according to the technical solution of the present invention.

A method for preparing a touch integrated display panel 200 includes the steps of:

S201, providing an organic light emitting diode (OLED) panel, the OLED panel comprising an illuminant and a thin film encapsulation layer;

S202, forming a first touch conductive layer on the thin film encapsulation layer by using a printing technology, and Patterning the first touch conductive layer;

S203, forming a first insulating layer on the first touch conductive layer;

S204, forming a second touch conductive layer on the first insulating layer by a printing technique, and patterning the second touch conductive layer;

S205, forming a second insulating layer on the second touch conductive layer to obtain a touch integrated display panel.

Among them, the printing technology can be inkjet printing technology or letterpress printing technology. Preferably, the first and second touch conductive layers are formed by an inkjet printing technique.

An integrated touch conductive layer can be formed by a printing technique, and then the touch conductive layer is patterned by laser ablation or the like to obtain a patterned touch conductive layer; the pattern can also be directly formed by a printing technique. The first and second touch conductive layers.

The material of the first touch conductive layer and the second touch conductive layer may be a material containing conductive particles, and preferably may be conductive particles including nano conductive particles, metallic silver/copper nanowires, graphene, and the like. material. The materials of the first touch conductive layer and the second touch conductive layer may be the same or different, and are performed according to design requirements.

The first insulating layer and the second insulating layer may be formed by a conventional method, or may be formed by a printing technique such as an inkjet printing technique or a letterpress printing technique. The first and second insulating layers may each be made of a resin material of a material. The materials of the first insulating layer and the second insulating layer may be the same or different.

A first opening may be formed on the first insulating layer to expose a portion of the first touch conductive layer. The first opening may be directly formed when the first insulating layer is formed, that is, the first insulating layer having the first opening may be directly formed by a printing technique or the like, or after the integrated first insulating layer is formed, The first opening is formed by a technique such as laser ablation. The first touch conductive layer exposed from the first opening is used to electrically connect other devices.

A second opening may be formed on the second insulating layer to expose a portion of the second touch conductive layer. The second opening may be directly formed when the second insulating layer is formed, that is, the second insulating layer having the second opening may be directly formed by a printing technique or the like, or may be integrated After the second insulating layer, the second opening is formed by a technique such as laser ablation. The second touch conductive layer exposed from the second opening is used to electrically connect other devices.

The OLED may be divided into a display area and a non-display area located at an edge of the display area, and the first opening and the second opening may both be located in the non-display area.

After forming the first insulating layer, the method may further include the steps of:

S206, forming a conductive silver paste layer.

The conductive silver paste layer is formed in the non-display area. The conductive silver paste layer may be electrically connected to the second touch conductive layer exposed to the second opening, or may be electrically connected to the first touch conductive layer exposed to the first opening. The conductive silver paste layer is further divided into two spaced portions, and the two portions of the conductive silver paste layer are respectively exposed to the first touch conductive layer exposed to the first opening and The second touch conductive layer exposed to the second opening is electrically connected.

The conductive silver paste layer may be formed on the surface of the first insulating layer in the non-display area, or may be directly formed on the surface of the thin film encapsulation layer in the non-display area.

The conductive silver paste layer can also be formed by using printing techniques such as inkjet printing technology, letterpress printing technology, and screen printing technology.

When it is necessary to form two or more touch conductive layers, the steps S203 and S204 may be repeated.

Similar to the foregoing, the OLED panel may be a mother board, that is, a plurality of OLED sub-units. After forming the first insulating layer or after forming the conductive silver paste layer, the method further includes the steps of:

S207. The motherboard is divided into a plurality of sub-boards to obtain a plurality of touch integrated display panels, wherein each touch integrated display panel includes an OLED sub-unit.

The touch integrated display panel and the preparation method of the present invention are described below by using specific embodiments.

The first embodiment of the present technical solution provides a touch integrated display panel 3 and a preparation method thereof.

Referring to FIGS. 3a-3b, an organic light emitting diode (OLED) panel 30 is provided. The OLED panel 30 includes an illuminant 31 and a thin film encapsulation layer 32.

The OLED panel 30 is a motherboard, and includes a plurality of OLED sub-units 301. Each of the OLED sub-units 301 is divided into a display area 302 and a non-display area 303. The non-display area 303 is located at an edge of the display area 302.

Referring to FIG. 3c, a patterned first touch conductive layer 33 is formed on the thin film encapsulation layer 32 by a printing technique.

Referring to FIG. 3d, a first insulating layer 34 is formed on the first touch conductive layer 33 to obtain a touch integrated display panel 3. The first insulating layer 34 covers the first touch conductive layer 33 and fills the pattern gap of the first touch conductive layer 33. A first opening 341 is formed on the first insulating layer 34. A portion of the first touch conductive layer 33 is exposed from the first opening 341. The first opening 341 is located in the non-display area 303.

Referring to FIG. 3e, a conductive silver paste layer 35 is formed on the thin film encapsulation layer 32. The conductive silver paste layer 35 is electrically connected to the first touch conductive layer 33 exposed from the first opening 341.

In this embodiment, the conductive silver paste layer is formed on the non-display area 303.

Referring to FIG. 3f, the motherboard is divided into a plurality of sub-boards along the boundary of the OLED sub-unit 301 to obtain a plurality of touch integrated display panels 3.

Referring to FIG. 3e, the touch integrated display panel 3 includes an illuminant 31; a thin film encapsulation layer 32 formed on the illuminant 31; and a patterned first formed on the thin film encapsulation layer 32 by a printing technique. a first conductive layer 34 covering the pattern gap of the first touch conductive layer 33 and a first opening formed on the first insulating layer 34 341. The portion of the first touch conductive layer 33 is exposed from the first opening 341; and the conductive silver paste layer 35 is formed on the thin film encapsulation layer 32.

The touch integrated display panel 3 is divided into a display area 302 and a non-display area 303 located at an edge of the display area 302. The first opening 341 is located in the non-display area 303, and the conductive silver glue layer 35 is also formed in the non-display area 303, and the conductive silver glue layer 35 is electrically connected to the first touch conductive layer 33 exposed from the first opening 341.

Preferably, the first insulating layer 34 is made of a resin material.

Preferably, the first touch conductive layer 33, the first insulating layer 34 and the conductive silver paste layer 35 are all formed by a printing technique; more preferably, the first touch conductive layer 33, the The first insulating layer 34 and the conductive silver paste layer 35 are each formed by an inkjet printing technique.

The material of the first touch conductive layer may be a material containing conductive particles, and preferably may be a material containing conductive particles such as nano conductive particles, metallic silver/copper nanowires, and graphene.

The second embodiment of the present technical solution provides a touch integrated display panel 4 and a preparation method thereof.

Referring to FIGS. 4a-4b, an organic light emitting diode (OLED) panel 40 is provided. The OLED panel 40 includes an illuminant 41 and a thin film encapsulation layer 42.

The OLED panel 40 is a motherboard, and includes a plurality of OLED sub-units 401. Each of the OLED sub-units 401 is divided into a display area 402 and a non-display area 403. The non-display area 403 is located at an edge of the display area 402.

Referring to FIG. 4c, a patterned first touch conductive layer 43 is formed on the thin film encapsulation layer 42 by a printing technique.

Referring to FIG. 4d, a first insulating layer 44 is formed on the first touch conductive layer 43. The first insulating layer 44 covers a portion of the first touch conductive layer 43 and fills the first touch. The pattern gap of the conductive layer 43 is controlled.

The first insulating layer 44 is further formed with at least one first opening 441, and the at least one first opening 441 exposes a portion of the first touch conductive layer 43. The first opening 441 is located in the non-display area 403.

Referring to FIG. 4e, a patterned second touch conductive layer 46 is formed on the first insulating layer 44 by a printing technique;

Referring to FIG. 4f, a second insulating layer 47 is formed on the second touch conductive layer 46.

The second insulating layer 47 is further formed with at least one second opening 471, and the at least one second opening 471 exposes a portion of the second touch conductive layer 46. The second opening 471 is also located in the non-display area 403 and is different in position from the first opening 441.

Referring to FIG. 4g, a conductive silver paste layer 45 is formed on the thin film encapsulation layer 42. The conductive silver paste layer 45 is located in the non-display area 403 and is electrically connected to the first touch conductive layer 43 exposed in the first opening 441.

Referring to FIG. 4h, along the boundary of the OLED sub-unit 401, the motherboard is divided into sub-boards to obtain a plurality of touch integrated display panels 4.

The touch integrated display panel 4 includes an illuminant 41; a thin film encapsulation layer 42 formed on the illuminant 41; and a patterned first touch conductive layer 43 formed on the thin film encapsulation layer 42 by a printing technique; The first touch conductive layer 43 fills the first insulating layer 44 of the pattern gap of the first touch conductive layer 43 . The first insulating layer 44 is formed with at least one first opening 441. The first touch conductive layer 43 is exposed from the first opening 441; the second touch conductive layer 46 is formed on the first insulating layer 44 by a printing technique; and is formed on the second touch conductive layer. a second insulating layer 47 on the second insulating layer 47 is formed with at least one second opening 471, and a portion of the second touch conductive layer 46 is exposed from the second opening 471; A conductive silver paste layer 45 on the thin film encapsulation layer 42. The touch integrated display panel 4 is divided into a display area 402 and a non-display area 403. The first and second openings 441 and 471 are located in the non-display area 403, and the conductive silver glue layer 45 is also The conductive silver paste layer 45 is in contact with the first touch conductive layer 43 exposed in the first opening 441 to be electrically connected.

In this embodiment, the first touch conductive layer 43 is electrically connected to an electronic device (not shown) through the conductive silver paste layer 45; the second touch conductive layer 46 passes through other conductive media, such as The anisotropic conductive paste, gold wire or solder paste is electrically connected to another electronic device (not shown).

Preferably, the first and second insulating layers 44, 47 are made of a resin material.

Preferably, the first and second touch conductive layers 43, 46, the first and second insulating layers 44, 47 and the conductive silver paste layer 45 are all formed by a printing technique; more preferably, the The first and second touch conductive layers 43, 46, the first and second insulating layers 44, 47 and the conductive silver paste layer 45 are all formed by an inkjet printing technique.

The materials of the first touch conductive layer 43 and the second touch conductive layer 46 may be the same or different, and the materials 47 of the first insulating layer 44 and the second insulating layer may be the same or different. The material of the first touch conductive layer 43 and the second touch conductive layer 46 may be a material containing conductive particles, and preferably may be conductive materials including nano conductive particles, metallic silver/copper nanowires, graphene, and the like. The material of the particles.

In another embodiment, referring to FIGS. 5a-5b, the conductive silver paste layer 45 may also be electrically connected to the second touch conductive layer 46 exposed in the second opening 471.

In another embodiment, referring to FIG. 6 , the conductive silver paste layer 45 may further include a first portion 451 and the first portion 451 and the first portion exposed to the first opening 441 A touch conductive layer 43 is connected to be electrically connected, and the second portion 452 is electrically connected to the second touch conductive layer 46 exposed in the second opening 471. The first touch conductive layer 43 and the second touch conductive layer 46 may be electrically connected to the same or different electronic devices (not shown).

In other embodiments, the conductive silver paste layer may not be formed, and the first and second touch conductive layers 43 and 46 pass through other conductive media, such as an anisotropic conductive paste, a gold wire or a solder paste. , electrically connected to the electronic device.

The touch integrated display panel and the preparation method provided by the technical solution have the following beneficial effects:

1. The printing technology is used to form the touch conductive layer, which does not require traditional plasma processing and etching processes, and can avoid damage to the OLED display panel and internal components by temperature and pressure to the greatest extent, and helps to improve the process yield. .

2. Using the printing technology to form the touch conductive layer, the yellow light process and the etching process are not required, and the patterning of the touch conductive layer can be realized in one step, thereby saving the process and saving the cost.

3. The insulating layer and the conductive silver glue layer can also be formed by printing, so that the flatness of the formed touch integrated display panel is better, thereby facilitating the assembly of the touch integrated display panel and other devices, and improving the assembly quality. .

4. The touch integrated display panel can be formed on the motherboard and then divided, which can save process and cost; and, printing can be performed in a fixed area of the motherboard, and printing interference is less.

5. Printing technology can be compatible with a variety of conductive materials, so that the process can be selected in a wide range, according to the process and product needs, select the appropriate conductive materials for printing.

6. In order to realize more touch design, a multi-layer touch conductive layer can be printed and printed, and the design flexibility is high; and the conductive layer in the hole for interlayer connection can be formed simultaneously with the touch conductive layer for the build-up layer, the process It's simpler.

The above is a preferred embodiment of the present invention, and it should be noted that those skilled in the art can also make several improvements and retouchings without departing from the principles of the present invention. It is the scope of protection of the present invention.

Claims (20)

A method for preparing a touch integrated display panel, comprising the steps of: Providing an organic light emitting diode panel, including an illuminant and a thin film encapsulation layer; Forming a first touch conductive layer on the thin film encapsulation layer by a printing technique, and patterning the first touch conductive layer; Forming a first insulating layer on the first touch conductive layer to obtain a touch integrated display panel. The method for fabricating a touch integrated display panel according to claim 1 , wherein the patterned first touch conductive layer is directly formed on the thin film encapsulation layer by a printing technique. The method for fabricating a touch integrated display panel according to claim 1 , wherein an integrated touch conductive layer is formed on the thin film encapsulation layer by a printing technique, and then the touch conductive layer is formed by laser ablation. Patterning to obtain the patterned first touch conductive layer. The method of manufacturing a touch integrated display panel according to claim 1, wherein the first insulating layer is formed by an inkjet printing technique or a letterpress printing technique. The method for fabricating a touch integrated display panel according to claim 4, wherein at least one first opening is formed on the first insulating layer, and a part of the first touch conductive layer is exposed to the at least one a first opening; the organic light emitting diode panel is divided into a display area and a non-display area, and the at least first opening is located in the non-display area. The method of claim 5, wherein after the forming the first insulating layer, the method further comprises: forming a conductive surface on the surface of the thin film encapsulation layer of the non-display area The silver paste layer is electrically connected to the first touch conductive layer exposed in the at least one first opening. The method for fabricating a touch integrated display panel according to claim 5, wherein the first insulating layer having the at least one opening is formed on the first touch conductive layer directly by a printing technique. The method of claim 1 , wherein after forming a first insulating layer on the first touch conductive layer, the method further comprises the steps of: Forming a second touch conductive layer on the first insulating layer by a printing technique, and using the second Touch conductive layer patterning; and Forming a second insulating layer on the second touch conductive layer. The method for fabricating a touch integrated display panel according to claim 8 , wherein the patterned second touch conductive layer is directly formed on the thin film encapsulation layer by a printing technique. The method for fabricating a touch integrated display panel according to claim 8 , wherein an integrated touch conductive layer is formed on the thin film encapsulation layer by a printing technique, and then the touch conductive layer is formed by laser ablation Patterning to obtain the patterned second touch conductive layer. The method of claim 8 , wherein the first insulating layer is formed with at least one first opening, and a portion of the first touch conductive layer is exposed to the at least one a first opening; the second insulating layer is formed with at least one second opening, and the second touch conductive layer is exposed to the at least one second opening; the organic light emitting diode panel is divided into displays And the at least one first opening and the at least one second opening are located at different positions of the non-display area. The method of claim 11 , wherein after the forming the second insulating layer, the method further comprises: forming a conductive silver paste layer in the non-display area, the conductive The silver paste layer is in contact with the first touch conductive layer exposed in the at least one first opening or is in contact with the second touch conductive layer exposed in the at least one second opening. Electrical connection. The method of claim 11 , wherein after the forming the second insulating layer, the method further comprises: forming a conductive silver paste layer in the non-display area, the conductive The silver paste layer includes a first portion and a second portion that are separated from each other, and the first portion is electrically connected to the first touch conductive layer exposed in the at least one first opening, and the second portion is electrically connected And electrically contacting the second touch conductive layer exposed in the at least one second opening to be electrically connected. A touch integrated display panel comprising: An organic light emitting diode panel comprising an illuminant and a thin film encapsulation layer; The patterned first touch conductive layer is formed on the thin film encapsulation layer by a printing technique, and the first touch conductive layer is made of a material containing at least one conductive particle; The first insulating layer is formed on the first touch conductive layer. The touch integrated display panel according to claim 14, wherein the first At least one first opening is formed on the edge layer, and the first touch conductive layer is exposed to the at least one first opening, and the touch integrated display panel is divided into a display area and a non-display area, the at least one The first opening is located in the non-display area. The touch integrated display panel of claim 15 further comprising a conductive silver paste layer, said conductive silver paste layer being formed on said non-display area, said conductive silver paste layer being exposed and said The first touch conductive layers of the at least one first opening are connected to be electrically connected. The touch integrated display panel of claim 14 , further comprising a second touch conductive layer formed on the first insulating layer by a printing technique, and formed on the second touch conductive layer a second insulating layer; at least one first opening is formed on the first insulating layer, and part of the first touch conductive layer is exposed to the at least one first opening; and the second insulating layer is formed on the second insulating layer At least one second opening, a portion of the second touch conductive layer is exposed to the at least one second opening; the organic light emitting diode panel is divided into a display area and a non-display area, the at least one first opening And the at least one second opening is located at different positions of the non-display area, wherein the second touch conductive layer is made of a material containing at least one conductive particle. The touch integrated display panel of claim 17, wherein the first touch conductive layer and the second touch conductive layer and the inner conductive layer of the hole are made of nano conductive particles and metallic silver. / Copper nanowires and materials of at least one of the conductive particles. The touch integrated display panel of claim 17 further comprising a conductive silver paste layer, said conductive silver paste layer being formed on said non-display area, said conductive silver paste layer being exposed to said The first touch conductive layer in at least one first opening is connected to or in contact with the second touch conductive layer exposed in the at least one second opening to be electrically connected. The touch integrated display panel according to claim 17, further comprising a conductive silver paste layer, wherein the conductive silver paste layer is formed in the non-display area, and the conductive silver paste layer comprises a phase separation a portion and a second portion, the first portion is electrically connected to the first touch conductive layer exposed in the at least one first opening, and the second portion is exposed to the at least one The second touch conductive layers in the two openings are connected to be electrically connected.

Images