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WO2018157179A3 - Atmospheric robotic end effector - Google Patents

Atmospheric robotic end effector Download PDF

Info

Publication number
WO2018157179A3
WO2018157179A3 PCT/US2018/024226 US2018024226W WO2018157179A3 WO 2018157179 A3 WO2018157179 A3 WO 2018157179A3 US 2018024226 W US2018024226 W US 2018024226W WO 2018157179 A3 WO2018157179 A3 WO 2018157179A3
Authority
WO
WIPO (PCT)
Prior art keywords
end effector
flag
actuator
robotic end
protrusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2018/024226
Other languages
French (fr)
Other versions
WO2018157179A2 (en
Inventor
Thomas Walton
Michael Dailey
Manon LEMOINE
Joe Garcia
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fabworx Solutions Inc
Original Assignee
Fabworx Solutions Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fabworx Solutions Inc filed Critical Fabworx Solutions Inc
Publication of WO2018157179A2 publication Critical patent/WO2018157179A2/en
Publication of WO2018157179A3 publication Critical patent/WO2018157179A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A robotic end effector is provided which includes a housing, an end effector blade, and an actuator disposed within the housing. The actuator has a protrusion which advances and retracts along an axis. The protrusion is equipped, on a terminal end thereof, with a resilient mass. The end effector is further equipped with a control unit, and a flag. The flag has a first end which is attached to the actuator, and a second end which is magnetically coupled to the control unit. The flag has a profile which reduces particle generation.
PCT/US2018/024226 2017-02-24 2018-03-24 Atmospheric robotic end effector Ceased WO2018157179A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201762462934P 2017-02-24 2017-02-24
US62/462,934 2017-02-24

Publications (2)

Publication Number Publication Date
WO2018157179A2 WO2018157179A2 (en) 2018-08-30
WO2018157179A3 true WO2018157179A3 (en) 2018-10-25

Family

ID=63253462

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2018/024226 Ceased WO2018157179A2 (en) 2017-02-24 2018-03-24 Atmospheric robotic end effector

Country Status (1)

Country Link
WO (1) WO2018157179A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020074719A1 (en) * 2018-10-12 2020-04-16 Syddansk Universitet A sorting system for sorting objects
WO2023150732A2 (en) * 2022-02-03 2023-08-10 Greene, Tweed Technologies, Inc. End effectors and end effector pads having crosslinked polymers for semiconductor applications to provide improved manufacturing speed and methods of making and using the same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5765889A (en) * 1995-12-23 1998-06-16 Samsung Electronics Co., Ltd. Wafer transport robot arm for transporting a semiconductor wafer
US20050021177A1 (en) * 2003-07-23 2005-01-27 Paul Bacchi Robot end effector position error correction using auto-teach methodology
US20120044609A1 (en) * 2009-05-15 2012-02-23 Cooke Richard A Electrostatic Chuck With Polymer Protrusions
US20130213169A1 (en) * 2012-02-17 2013-08-22 Mark K. Tan Mass damper for semiconductor wafer handling end effector
US20140265393A1 (en) * 2013-03-13 2014-09-18 Varian Semiconductor Equipment Associates, Inc. Wafer handling apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5765889A (en) * 1995-12-23 1998-06-16 Samsung Electronics Co., Ltd. Wafer transport robot arm for transporting a semiconductor wafer
US20050021177A1 (en) * 2003-07-23 2005-01-27 Paul Bacchi Robot end effector position error correction using auto-teach methodology
US20120044609A1 (en) * 2009-05-15 2012-02-23 Cooke Richard A Electrostatic Chuck With Polymer Protrusions
US20130213169A1 (en) * 2012-02-17 2013-08-22 Mark K. Tan Mass damper for semiconductor wafer handling end effector
US20140265393A1 (en) * 2013-03-13 2014-09-18 Varian Semiconductor Equipment Associates, Inc. Wafer handling apparatus

Also Published As

Publication number Publication date
WO2018157179A2 (en) 2018-08-30

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