WO2012028166A1 - Vorrichtung und verfahren zur verringerung eines keilfehlers - Google Patents
Vorrichtung und verfahren zur verringerung eines keilfehlers Download PDFInfo
- Publication number
- WO2012028166A1 WO2012028166A1 PCT/EP2010/005423 EP2010005423W WO2012028166A1 WO 2012028166 A1 WO2012028166 A1 WO 2012028166A1 EP 2010005423 W EP2010005423 W EP 2010005423W WO 2012028166 A1 WO2012028166 A1 WO 2012028166A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- receiving
- wedge error
- reducing
- approach
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/22—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring angles or tapers; for testing the alignment of axes
- G01B21/24—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring angles or tapers; for testing the alignment of axes for testing alignment of axes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/14—Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
- G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
- G01B11/272—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes using photoelectric detection means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
Definitions
- the present invention relates to a device for opposing alignment of a first surface of a first substrate with a second surface of a second substrate spaced between the first and the second surface according to claim 1 and a corresponding method according to claim 9.
- the surfaces of the substrates in a final position that is, for example, when embossing a microlens or when creating a mask in the lithographic process exactly paral lel be aligned with each other.
- the optical axis of the microlens has no alignment errors caused, in particular, by wedge errors.
- Microlenses are often stacked on top of each other so that the wedge errors increase accordingly and image quality suffers accordingly.
- the aforementioned wedge error is caused by a malposition of the
- a reduction of the wedge error has hitherto been achieved by the most accurate possible parallel alignment of the receiving devices before an approach of the receiving devices by the distance between the surfaces of the substrates before the actual embossing process, in which the substrates are moved toward each other in the translation direction, are aligned in parallel.
- Object of the present invention is to provide a device and a
- the invention is based on the idea, alignment error between two substrates not even before the approach of the substrates in the
- the introduction of a measuring device between the substrates to be aligned can therefore be dispensed with according to the invention.
- the distances or the angular position of the first to the second substrate or the first recording device and the second recording device during the approach of the substrates are inventively measured from outside the working space formed between the first and second surface, so that an in-situ measurement during the approach of Substrates is allowed, until the completion of the product to be manufactured with the device,
- microlens field in particular a microlens field or a mask.
- the wedge error is reduced shortly before or when the end position is reached, since errors can thus be virtually ruled out by further movement of the first and / or second substrate.
- the means for reducing the wedge error can be used continuously, in particular continuously, during the approach, in particular until reaching the end position.
- the embodiment of the invention in conjunction with Nanoimprint compiler as far as on the first surface and / or the second surface embossed structures are provided for embossing an embossing material between the first and the second surface.
- the first substrate and / or the second substrate or the first receiving device and / or the second receiving device can be moved by the means to reduce the
- the measuring means a plurality, in particular at least three, in particular in the first and / or second receiving device respectively below the first and / or second
- the means for reducing the wedge error drive means for changing the angular position of the first substrate to the second substrate, in particular the first surface to the second surface comprise, wherein the drive means are arranged on the first and / or second receiving means.
- drive means in particular motors for each receiving device in question, for at least one of
- Recording devices at least two, in particular three
- the means for reducing the wedge error an active control device for controlling the reduction of the wedge error, in particular for detecting measured values of the measuring means and for
- the active control device provides on the basis of the measured values of the measuring means, ie the distances between the sensors and the individual, according to the invention relevant surfaces (surfaces / bearing surfaces) for an automatic
- Figure 1 shows a cross-sectional view of the device according to the invention for reducing a wedge error.
- FIG. 1 shows a first receiving device of a device for
- an embossed structure 3 which serves for embossing an embossing material 4 applied to the surface 5 o.
- Embossing material 4 is, for example, a polymer which assumes the contour of embossed structure 3 during embossing, specifically in an end position in which embossed structure 3 dips into embossing material 4 in order to produce a multiplicity of precisely dimensioned products, in this case microlenses, corresponding to the contour of embossed structure 3 to produce.
- a microlens field is embossed from the embossing material and cured so that a large number of microlenses can later be produced from the microlens field.
- the first substrate 2 is first aligned and aligned parallel to the second substrate 5, wherein a - in the figure 1 exaggerated - wedge error, represented by the
- the key error may result from an imbalance of the first receiving device 1 or the second
- the first receiving device 1 is by a not shown
- Recording device 6 movable toward, also as a means of approach to
- the translation drive for example, a not shown
- the second receiving device 6 may be formed fixed in the device as a chuck. A reversal of the movement of both receiving devices is conceivable according to the invention.
- Embossed structure 3 to the second substrate 5 and the embossing material 4 are provided as a means for reducing the wedge error, among others, a plurality of sensors 8 in sensor chambers 7 of the second receiving device 6 distributed.
- the sensors 8 are designed as spectroscopic sensors such that each sensor 8 emits a light beam whose reflections and the spectroscopy of the reflected light enable the distances between the first surface 2o arranged in the light beam and the second surface 5o to the sensor 8 to be measured.
- the sensors 8 operate in particular with white light spectroscopy and, accordingly, the second substrate 5 is at least in the region of Sensor chambers 7 transparent to light and / or UV radiation.
- the distance between the sensor 8 and a support surface 2a of the first substrate on the receiving side 1a can also be measured by the sensors.
- Receiving side 6a measurable, so that the thicknesses of the substrates 2, 5 are measurable in the areas in which the beam paths of the sensors 8 extend.
- Recording device 1 in the translation direction T and a faulty initial orientation and errors of the thicknesses of the first substrate 2 or the second substrate 5 or unevenness of the receiving surfaces l a, 6a are compensated, while the approach of the first surface 2o to the second surface 5o.
- the embossed structure 3 and the embossing material 4 are arranged outside the beam path of the sensors 8.
- spurious evaluations of the spectroscopy are avoided and the accuracy of determining the distances is increased by the spectroscopy of the sensors.
- Path system consisting of a plurality of transmitter-receiver modules, namely the sensors 8, solved, with which the distance of the formed as an embossing die first substrate 2 to the surface 5o of the carrier wafer formed as a second substrate 5 actively measured and simultaneously during the approach of the embossed structure 3 by tilting or rotating the first Recording device 1 is readjusted so that the surface 2o is aligned parallel to the surface 5o, in the ideal case without
- the advantages of the invention lie in a higher yield of microlenses within the microlens field, since a consistent quality of the lenses along the entire carrier wafer can be ensured. Due to the higher yield of lenses with negligible error in the optical axis of the lenses clearly results in economic and technical advantages, especially when coupling several microlenses on top of each other. In addition to the economic benefits of falling unit price by higher yield also results in the technical advantage of a higher image quality.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Control Of Position Or Direction (AREA)
- Clamps And Clips (AREA)
- Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
Claims
Priority Applications (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010800689283A CN103069251A (zh) | 2010-09-03 | 2010-09-03 | 用于减少楔形误差的装置和方法 |
| KR1020137004380A KR101583894B1 (ko) | 2010-09-03 | 2010-09-03 | 웨지 에러를 줄이기 위한 장치 및 방법 |
| CN201710464995.0A CN107255485B (zh) | 2010-09-03 | 2010-09-03 | 用于减少楔形误差的装置和方法 |
| JP2013526318A JP5650328B2 (ja) | 2010-09-03 | 2010-09-03 | ウェッジエラーを減少させるための装置及び方法 |
| SG2013015193A SG188343A1 (en) | 2010-09-03 | 2010-09-03 | Device and method for reducing a wedge error |
| PCT/EP2010/005423 WO2012028166A1 (de) | 2010-09-03 | 2010-09-03 | Vorrichtung und verfahren zur verringerung eines keilfehlers |
| EP10757721.5A EP2612109B1 (de) | 2010-09-03 | 2010-09-03 | Vorrichtung und verfahren zur verringerung eines keilfehlers |
| US13/820,166 US9194700B2 (en) | 2010-09-03 | 2010-09-03 | Device and method for reducing a wedge error |
| TW100131808A TWI546886B (zh) | 2010-09-03 | 2011-09-02 | 用於減少楔形誤差之裝置及方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/EP2010/005423 WO2012028166A1 (de) | 2010-09-03 | 2010-09-03 | Vorrichtung und verfahren zur verringerung eines keilfehlers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2012028166A1 true WO2012028166A1 (de) | 2012-03-08 |
Family
ID=44343719
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/EP2010/005423 Ceased WO2012028166A1 (de) | 2010-09-03 | 2010-09-03 | Vorrichtung und verfahren zur verringerung eines keilfehlers |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US9194700B2 (de) |
| EP (1) | EP2612109B1 (de) |
| JP (1) | JP5650328B2 (de) |
| KR (1) | KR101583894B1 (de) |
| CN (2) | CN107255485B (de) |
| SG (1) | SG188343A1 (de) |
| TW (1) | TWI546886B (de) |
| WO (1) | WO2012028166A1 (de) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130147070A1 (en) * | 2010-09-02 | 2013-06-13 | Michael Kast | Die tool, device and method for producing a lens wafer |
| WO2015161868A1 (de) | 2014-04-22 | 2015-10-29 | Ev Group E. Thallner Gmbh | Verfahren und vorrichtung zum prägen einer nanostruktur |
| US9643366B2 (en) | 2010-10-26 | 2017-05-09 | Ev Group Gmbh | Method and device for producing a lens wafer |
| US10340161B2 (en) | 2014-12-23 | 2019-07-02 | Ev Group E. Thallner Gmbh | Device for prefixing of substrates |
| US10352694B2 (en) | 2017-04-18 | 2019-07-16 | Industrial Technology Research Institute | Contactless dual-plane positioning method and device |
| WO2022002372A1 (de) | 2020-06-30 | 2022-01-06 | Ev Group E. Thallner Gmbh | Vorrichtung und verfahren zum ausrichten von substraten |
| WO2024146688A1 (de) | 2023-01-03 | 2024-07-11 | Ev Group E. Thallner Gmbh | Vorrichtung und verfahren zum bearbeiten eines substrats in einem evakuierten bearbeitungsraum |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6501141B2 (ja) | 2014-11-21 | 2019-04-17 | 国立大学法人横浜国立大学 | 有機ハイドライド製造装置およびこれを用いた有機ハイドライドの製造方法 |
| JP6874692B2 (ja) * | 2015-12-28 | 2021-05-19 | 株式会社ニコン | 基板貼り合わせ装置および基板貼り合わせ方法 |
| CN118099068A (zh) | 2016-03-22 | 2024-05-28 | Ev 集团 E·索尔纳有限责任公司 | 用于衬底的接合的装置和方法 |
| KR102386005B1 (ko) | 2016-08-29 | 2022-04-12 | 에베 그룹 에. 탈너 게엠베하 | 기질을 정렬하기 위한 방법 및 장치 |
| KR102428754B1 (ko) * | 2017-03-16 | 2022-08-03 | 몰레큘러 임프린츠 인코퍼레이티드 | 광학 폴리머 필름 및 이를 캐스팅하기 위한 방법 |
| EP3697588B1 (de) | 2017-10-17 | 2024-04-03 | Magic Leap, Inc. | Ein system zum formen eines lichthärtbaren materials zu einem ebenen objekt |
| CN117141017B (zh) | 2018-10-16 | 2024-08-30 | 奇跃公司 | 用于浇铸聚合物产品的方法和装置 |
| US12399320B2 (en) | 2019-02-14 | 2025-08-26 | Magic Leap, Inc. | Method and system for variable optical thickness waveguides for augmented reality devices |
| CN115793139A (zh) * | 2019-02-14 | 2023-03-14 | 奇跃公司 | 波导显示器衬底的偏置总厚度变化 |
| JP7507860B2 (ja) * | 2019-12-10 | 2024-06-28 | エーファウ・グループ・エー・タルナー・ゲーエムベーハー | 複数の基板の位置合わせをする方法および装置 |
| CN115280187A (zh) * | 2020-03-12 | 2022-11-01 | 奇跃公司 | 用于浇铸光学聚合物膜的方法和装置 |
| CN115812179A (zh) | 2020-07-06 | 2023-03-17 | Ev 集团 E·索尔纳有限责任公司 | 制造微结构及/或奈米结构之方法及装置 |
| CN118355481A (zh) | 2021-12-17 | 2024-07-16 | Ev 集团 E·索尔纳有限责任公司 | 用于基板的对准的方法和设备 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPS5516457A (en) | 1978-07-24 | 1980-02-05 | Nippon Telegr & Teleph Corp <Ntt> | Gap detecting method |
| JPS58103136A (ja) | 1981-12-16 | 1983-06-20 | Nippon Kogaku Kk <Nikon> | 基板の傾き設定装置 |
| DE3623891A1 (de) * | 1986-07-15 | 1988-01-28 | Siemens Ag | Anordnung zur genauen gegenseitigen ausrichtung einer maske und einer halbleiterscheibe in einem lithographiegeraet und verfahren zu ihrem betrieb |
| DE10139586A1 (de) | 2001-08-11 | 2003-03-06 | Erich Thallner | Plattenförmiges Justierelement |
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| JP2001055825A (ja) * | 1999-08-17 | 2001-02-27 | Nisshin Steel Co Ltd | サイディング材用金属面板及び製造方法 |
| US6873087B1 (en) * | 1999-10-29 | 2005-03-29 | Board Of Regents, The University Of Texas System | High precision orientation alignment and gap control stages for imprint lithography processes |
| US6954275B2 (en) | 2000-08-01 | 2005-10-11 | Boards Of Regents, The University Of Texas System | Methods for high-precision gap and orientation sensing between a transparent template and substrate for imprint lithography |
| JP4690572B2 (ja) * | 2000-11-30 | 2011-06-01 | キヤノンアネルバ株式会社 | 基板重ね合わせ装置 |
| JP2005101201A (ja) * | 2003-09-24 | 2005-04-14 | Canon Inc | ナノインプリント装置 |
| JP5268239B2 (ja) * | 2005-10-18 | 2013-08-21 | キヤノン株式会社 | パターン形成装置、パターン形成方法 |
| CN101292195A (zh) | 2005-10-18 | 2008-10-22 | 佳能株式会社 | 压印装置、压印方法和压印模具 |
| CN101454636A (zh) | 2006-05-31 | 2009-06-10 | 佳能株式会社 | 间隙测量方法、压印方法和压印设备 |
| JP5732631B2 (ja) * | 2009-09-18 | 2015-06-10 | ボンドテック株式会社 | 接合装置および接合方法 |
| DE102010007970A1 (de) * | 2010-02-15 | 2011-08-18 | Suss MicroTec Lithography GmbH, 85748 | Verfahren und Vorrichtung zum aktiven Keilfehlerausgleich zwischen zwei im wesentlichen zueinander parallel positionierbaren Gegenständen |
| KR101508077B1 (ko) * | 2010-09-02 | 2015-04-07 | 에베 그룹 게엠베하 | 렌즈 웨이퍼를 제작하기 위한 장치 및 방법 |
-
2010
- 2010-09-03 CN CN201710464995.0A patent/CN107255485B/zh active Active
- 2010-09-03 EP EP10757721.5A patent/EP2612109B1/de active Active
- 2010-09-03 CN CN2010800689283A patent/CN103069251A/zh active Pending
- 2010-09-03 JP JP2013526318A patent/JP5650328B2/ja active Active
- 2010-09-03 SG SG2013015193A patent/SG188343A1/en unknown
- 2010-09-03 KR KR1020137004380A patent/KR101583894B1/ko active Active
- 2010-09-03 US US13/820,166 patent/US9194700B2/en active Active
- 2010-09-03 WO PCT/EP2010/005423 patent/WO2012028166A1/de not_active Ceased
-
2011
- 2011-09-02 TW TW100131808A patent/TWI546886B/zh active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5516457A (en) | 1978-07-24 | 1980-02-05 | Nippon Telegr & Teleph Corp <Ntt> | Gap detecting method |
| JPS58103136A (ja) | 1981-12-16 | 1983-06-20 | Nippon Kogaku Kk <Nikon> | 基板の傾き設定装置 |
| DE3623891A1 (de) * | 1986-07-15 | 1988-01-28 | Siemens Ag | Anordnung zur genauen gegenseitigen ausrichtung einer maske und einer halbleiterscheibe in einem lithographiegeraet und verfahren zu ihrem betrieb |
| DE10139586A1 (de) | 2001-08-11 | 2003-03-06 | Erich Thallner | Plattenförmiges Justierelement |
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9738042B2 (en) * | 2010-09-02 | 2017-08-22 | Ev Group Gmbh | Die tool, device and method for producing a lens wafer |
| US10668678B2 (en) | 2010-09-02 | 2020-06-02 | Ev Group Gmbh | Die tool, device and method for producing a lens wafer |
| US20130147070A1 (en) * | 2010-09-02 | 2013-06-13 | Michael Kast | Die tool, device and method for producing a lens wafer |
| US9643366B2 (en) | 2010-10-26 | 2017-05-09 | Ev Group Gmbh | Method and device for producing a lens wafer |
| US9662846B2 (en) | 2010-10-26 | 2017-05-30 | Ev Group Gmbh | Method and device for producing a lens wafer |
| EP3591470A1 (de) | 2014-04-22 | 2020-01-08 | EV Group E. Thallner GmbH | Verfahren und vorrichtung zum prägen einer nanostruktur |
| WO2015161868A1 (de) | 2014-04-22 | 2015-10-29 | Ev Group E. Thallner Gmbh | Verfahren und vorrichtung zum prägen einer nanostruktur |
| US10118381B2 (en) | 2014-04-22 | 2018-11-06 | Ev Group E. Thallner Gmbh | Method and device for embossing of a nanostructure |
| US10906293B2 (en) | 2014-04-22 | 2021-02-02 | Ev Group E. Thallner Gmbh | Method and device for embossing of a nanostructure |
| US10493747B2 (en) | 2014-04-22 | 2019-12-03 | Ev Group E. Thallner Gmbh | Method and device for embossing of a nanostructure |
| US10438822B2 (en) | 2014-12-23 | 2019-10-08 | Ev Group E. Thallner Gmbh | Method for prefixing of substrates |
| EP3671820A1 (de) | 2014-12-23 | 2020-06-24 | EV Group E. Thallner GmbH | Verfahren und vorrichtung zur vorfixierung von substraten |
| US10340161B2 (en) | 2014-12-23 | 2019-07-02 | Ev Group E. Thallner Gmbh | Device for prefixing of substrates |
| US11328939B2 (en) | 2014-12-23 | 2022-05-10 | Ev Group E. Thallner Gmbh | Method for prefixing of substrates |
| US12062521B2 (en) | 2014-12-23 | 2024-08-13 | Ev Group E. Thallner Gmbh | Method for prefixing of substrates |
| US10352694B2 (en) | 2017-04-18 | 2019-07-16 | Industrial Technology Research Institute | Contactless dual-plane positioning method and device |
| WO2022002372A1 (de) | 2020-06-30 | 2022-01-06 | Ev Group E. Thallner Gmbh | Vorrichtung und verfahren zum ausrichten von substraten |
| US12199062B2 (en) | 2020-06-30 | 2025-01-14 | Ev Group E. Thallner Gmbh | Device and method for the alignment of substrates |
| WO2024146688A1 (de) | 2023-01-03 | 2024-07-11 | Ev Group E. Thallner Gmbh | Vorrichtung und verfahren zum bearbeiten eines substrats in einem evakuierten bearbeitungsraum |
Also Published As
| Publication number | Publication date |
|---|---|
| SG188343A1 (en) | 2013-04-30 |
| TW201216405A (en) | 2012-04-16 |
| TWI546886B (zh) | 2016-08-21 |
| KR20130082499A (ko) | 2013-07-19 |
| EP2612109B1 (de) | 2014-06-04 |
| JP5650328B2 (ja) | 2015-01-07 |
| US20130162997A1 (en) | 2013-06-27 |
| JP2013542481A (ja) | 2013-11-21 |
| EP2612109A1 (de) | 2013-07-10 |
| KR101583894B1 (ko) | 2016-01-08 |
| CN107255485A (zh) | 2017-10-17 |
| CN107255485B (zh) | 2020-12-22 |
| CN103069251A (zh) | 2013-04-24 |
| US9194700B2 (en) | 2015-11-24 |
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