WO2011113760A1 - Procede d'assemblage de pieces en materiaux a base de sic par brasage non-reactif avec ajout d'un renfort; compositions de brasure; joint et assemblage obtenus par un tel procede - Google Patents
Procede d'assemblage de pieces en materiaux a base de sic par brasage non-reactif avec ajout d'un renfort; compositions de brasure; joint et assemblage obtenus par un tel procede Download PDFInfo
- Publication number
- WO2011113760A1 WO2011113760A1 PCT/EP2011/053692 EP2011053692W WO2011113760A1 WO 2011113760 A1 WO2011113760 A1 WO 2011113760A1 EP 2011053692 W EP2011053692 W EP 2011053692W WO 2011113760 A1 WO2011113760 A1 WO 2011113760A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- sic
- brazing
- parts
- solder
- silicon carbide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/32—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550 degrees C
- B23K35/327—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550 degrees C comprising refractory compounds, e.g. carbides
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/003—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts
- C04B37/005—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts consisting of glass or ceramic material
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- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/04—Tubular or hollow articles
- B23K2101/14—Heat exchangers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
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- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
- B23K2103/166—Multilayered materials
- B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
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- C04B2235/3817—Carbides
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- C04B2237/708—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the interlayers
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/82—Two substrates not completely covering each other, e.g. two plates in a staggered position
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/86—Joining of two substrates at their largest surfaces, one surface being complete joined and covered, the other surface not, e.g. a small plate joined at it's largest surface on top of a larger plate
Definitions
- the present invention relates to a method for assembling silicon carbide-based material parts by non-reactive brazing, with a non-reactive brazing composition and adding a reinforcement, in particular to make components entirely from silicon carbide base.
- the assembly process according to the invention is generally carried out at a temperature not exceeding 1150 ° C, preferably between 1020 ° C and 1150 ° C.
- the invention further relates to solder compositions and to the joint and assembly obtained by this process, the assembly of which the maximum use temperature is generally between 850 ° C and 880 ° C.
- the term “moderately refractory” means a maximum use temperature of the component assembled generally between 850 ° C. and 880 ° C.
- silicon carbide-based materials is generally meant a material whose SiC content is greater than or equal to 50% by weight, preferably greater than or equal to 80% by weight, more preferably 100% by weight. , in this last case it can be said that the material is made of or composed of silicon carbide.
- the silicon carbide may be in the form of silicon carbide fibers or silicon carbide powder sintered or bonded by a ceramic binder.
- silicon carbide-based materials may be in particular pure silicon carbide such as pure silicon carbide a (SiCOC) or ⁇ ( ⁇ ⁇ ), substrates silicon infiltrated silicon carbide (SiSiC), or materials SiC-based composites such as fiber and / or silicon carbide matrix composite materials.
- SiCOC pure silicon carbide a
- ⁇ ⁇ substrates silicon infiltrated silicon carbide
- SiC-based composites such as fiber and / or silicon carbide matrix composite materials.
- the technical field of the invention can be defined as brazing at a processing temperature (temperature equivalent to the temperature of the brazing stage) not exceeding generally 1150 ° C., preferably at a temperature of 1020 ° C. to 1150 ° C.
- the assemblies concerned by the present invention are therefore generally considered to be "moderately refractory", that is to say that the maximum temperature of use, of use, of these assemblies is generally of the order of 850 ° C. to 880 ° C. ° C.
- Such a technique is in particular necessary to manufacture structures of the heat exchanger type, and silicon carbide structural components having a use temperature of, for example, up to 900 ° C. or even 1000 ° C.
- refractory ceramic assemblies Common techniques for making refractory ceramic assemblies are solid phase diffusion welding, and sintering or co-sintering.
- the diffusion welding assembly pressure is applied at high temperature at the interfaces to allow atomic inter-diffusion between the two substrates.
- the temperature must always remain below the melting temperature of the least refractory material and therefore there is no liquid phase in the system.
- This type of assembly is carried out either in a press in a single direction or in an isostatic chamber.
- the diffusion welding is well suited to assemblies between two metal alloys and very little to the assembly of ceramic materials because the atoms constituting the ceramic diffuse very little at the joint.
- the process is unacceptable from a mechanical point of view, because it requires compressing substrates and porous and brittle materials such as silicon carbide-based composites, which may be strongly damaged during this process. mechanical loading in compression.
- the assembly-sintering or co-sintering of Sic parts also requires high pressures, but also high temperatures and long bearing times, because this process is based on the principle of 1 inter-diffusion between the SiC elements.
- the shape of the parts must remain simple if uniaxial pressing is used, or require complex tools and preparation comprising, for example, the manufacture of an envelope, the vacuum tight closure, hot isostatic compression, final machining of the envelope, using the CIC (Hot Isostatic Compression).
- Brazing is an inexpensive, easy-to-implement technique that is most commonly used. Parts of complex shapes can be made by brazing, and brazing operations are limited to placing between the parts to be assembled or near the joint between the two parts, a solder alloy, called solder, or an alloy of supply, and to melt this alloy, which is able to wet and spread over the interfaces to be assembled to fill the joint between the parts. After cooling, the solder solidifies and ensures the cohesion of the assembly.
- solder compositions for silicon carbide material parts are not sufficiently refractory. These are generally solder compositions consisting of metal alloys having a lower melting point, or even much lower, at 1000 ° C. Such a Melting temperature is clearly insufficient for applications at temperatures in the region of 800 ° C or 900 ° C, for example 850 ° C to 880 ° C.
- the less reactive alloys are also the least refractory, for example, the AgCuTi alloy with an Ag-Cu matrix, and a low concentration Ti active element.
- the applications more particularly targeted by the invention which are those of a moderately refractory assembly with a temperature of use of the assemblies that can generally be up to 850 ° C., or even 880 ° C.
- all the reactive solder compositions made up of mainly silver or silver-copper, copper, nickel, iron or cobalt, platinum, palladium or gold are therefore excluded because of their high reactivity with silicon carbide.
- solder alloy formulations solder compositions, more refractory and silicon-rich are presented in documents [1, 2, 3]. These solder compositions exhibit a very little reactive or non-reactive behavior with SiC, which prevents the formation of fragile compounds. This criterion of non-reactivity or very low reactivity is however not a sufficient condition to guarantee good mechanical strength of the brazed joints. Indeed, in the literature, the values of the breaking stresses of the silicon-based binary brazing alloys are very variable as a function of the second element involved in the silicon-based non-reactive solder composition.
- document [3] mentions an extremely low tensile tensile stress of the order of 2 MPa, despite the non-reactive Fe-Si system. reactivity of this composition indicated in the document [4], whereas for the Cr-Si system (25% Cr-75% Si by weight), this same document [3] gives a higher value, of the order of 12 MPa.
- Brazing temperatures of the solder compositions of documents [1, 2] and [3] are generally greater than 1300 ° C. These brazing temperatures are, for example, 1355 ° C. for the Ti-Si composition (22-78% by weight), 1355 ° C. for the Cr-Si composition (25-75% by weight), and 1400 ° C. for 1450 ° C for the composition Co-Si, and 1750 ° C for the composition Ru 2 Si 3 .
- the efficiency of this assembly process requires brazing temperatures greater than 1300 ° C to thermodynamically destabilize the layers of passivating silicon oxides that appear spontaneously on the surfaces of silicon carbide, because these oxide layers of silicon interfere with wetting by the solder composition, even if the brazing is carried out under vacuum. Therefore, the aforementioned brazing alloys, rich in silicon and used at a temperature above 1300 ° C are not suitable for brazing substrates made of silicon carbide material whose properties degrade after exposure to 1300 ° C. C, and a fortiori at 1150 ° C and even at 1100 ° C or above. This is particularly the case of some SiC / SiC composites which are degraded beyond 1300 ° C or 1150 ° and even 1100 ° C.
- Ni-53 "6Si ⁇ " 6 atomic whose brazing can be implemented at 1120 ° C for 16 hours.
- This brazing temperature is slightly above the preferred brazing temperature implemented according to the invention which is 1100 ° C, but with a very long duration of the brazing stage.
- the mechanical strength of the joint obtained with this composition (tensile breaking stress of 375 p.s.i., ie about 2.6 MPa) is very low, despite the non-reactivity of this composition mentioned in document [5]. This mechanical strength is insufficient for many applications and especially the applications mainly referred to herein, and this despite the low reactivity of this solder with SiC.
- Ni-Si alloys with Si concentrations of 40, 50, 67 and 85 atomic% are prepared and it is shown, in wetting studies, that for silicon contents greater than 40 atomic%, SiC / Ni-Si interface is not reactive, but no mechanical data concerning these alloys is provided.
- the melting starts at 966 ° C and the alloy is completely liquid at 1320 ° C, which requires soldering to 1350 ° C, which is clearly above the preferred limit temperature referred to herein.
- the document [6] mentions a ternary brazing alloy Ni-13.4 Cr-40 Si (in atomic%) whose melting point is 1150 ° C. and which is operated at a brazing temperature of 1200 ° C. The authors did not perform mechanical characterization on brazed joints and only metallurgical characterizations that indicate the absence of reactivity.
- Pt-Si whose soldering is carried out at 1200 ° C.
- the Pt content of this solder composition is very high (77% by weight of Pt), which leads to a very expensive process. This disadvantage is unacceptable for the production of large brazed parts.
- the document [7] has brazing alloys with an Si content of less than 50% by weight, preferably from 10 to 45% by weight, and with the addition of at least 2 elements selected from the following group: Li , Be, B, Na, Mg, P, Se, Ti, V, Cr, Mn, Fe, Co, Zn, Ga, Ge, As, Rb, Y, Sb, Te, Cs, Pr, Nd, Ta, W and In this group of elements at least one of them is preferably a metal selected from Fe, Cr, Co, V, Zn, Ti and Y. Nickel is not mentioned.
- Si-Cr-Co ternary solder compositions (11-38.5-50.5 mass%); Si-Cr-Co (40-26-34% by weight); Si-Fe-Cr (17.2-17.5-65.3% by weight); and Si-Fe-Co (20-20-60% by weight); and brazing at temperatures of 1230 ° C, 1235 ° C, 1460 ° C and 1500 ° C, respectively.
- solder compositions of document [7] never contain the nickel element.
- solder compositions having soldering temperatures below 1300 ° C. it is simply mentioned that a "strong" bond is obtained and no mechanical test proves that a good mechanical strength of the joints is effectively obtained. . Similarly, the low SiC reactivity / solder is neither mentioned nor mentioned.
- This process must make it possible to use in particular lower brazing temperatures or equal to 1150 ° C and preferably 1100 ° C which is a temperature that it is absolutely essential not to exceed for certain substrates, parts to assemble, based Sic.
- brazing process which makes it possible to obtain moderately refractory brazed joints (with use up to about 850 ° C. or even 880 ° C.) by using brazing cycles that do not generally exceed defined limit temperature being between 1020 ° C and 1150 ° C, in particular 1100 ° C depending on the Sic-based material to be assembled.
- the duration of the brazing stage at a temperature of 1150 ° C or less, for example 1100 ° C, should preferably be from one or a few minutes to two or three hours maximum to avoid degradation of the composite.
- the pure silicon carbide supports brazing at 1450 ° C.
- the brazing composition must make it possible to make a strong connection between the two parts made of silicon carbide material, which implies a non-reactive brazing composition, that is to say chemically compatible with the carbide of silicon, and that does not form brittle compounds with it.
- a non-reactive brazing composition that is to say chemically compatible with the carbide of silicon, and that does not form brittle compounds with it.
- non-responsiveness does not guarantee the creation of a strong link because it remains unpredictable.
- Non-responsiveness is a necessary condition for having a strong but not sufficient connection.
- the Fe-Si system cited in the literature [3] is non-reactive but its mechanical strength is very low.
- solder composition must wet the silicon carbide well and adhere to it. This very good wetting is essential for the quality of the joints because it ensures in particular a good quality of the filling of the joint but it does not make it possible to guarantee a good mechanical behavior, because this last one is a property not foreseeable. 3) the solder composition must be compatible with all heating devices, including fast and / or localized heaters.
- solder composition must allow the formation of joints with good mechanical strength.
- solder composition must consist of a limited number of elements, in order to facilitate its preparation and its implementation.
- the solder composition must not contain expensive elements, such as precious metals.
- the object of the invention is therefore to provide a method of assembly by soldering of parts or components made of silicon carbide materials which, among other things, meets the needs mentioned above, which satisfies, inter alia, the all the requirements and criteria mentioned above, which eliminates the disadvantages, defects, limitations encountered with the processes of the prior art, and which solves the problems of the processes of the prior art.
- the object of the invention is in particular to provide a method of assembly by brazing of parts or components made of silicon carbide materials which makes it possible to obtain a mechanical strength satisfactory assembly above 500 ° C and up to 850 ° C, or even 880 ° C, which uses brazing temperatures less than or equal to 1150 ° C, preferably between 1020 ° C and 1150 ° C, and more preferably less than or equal to 1100 ° C, for example from 1080 ° C to 1100 ° C, and which possibly allows to obtain seals with excellent sealing.
- a method of assembling at least two pieces of silicon carbide materials by non-reactive brazing in which the parts are brought into contact with each other. with a non-reactive solder composition, the assembly formed by the parts and solder composition is heated to a soldering temperature sufficient to fully or at least partially melt the solder composition, and the parts and composition are cooled. brazing to form after solidification thereof a moderately refractory joint; wherein the nonreactive brazing composition is a binary alloy, consisting, in atomic percentages, of 60% to 66% of silicon, and 34% to 40% of nickel, and wherein, prior to brazing, a addition, contribution, reinforcement.
- the fusion of the solder composition is generally considered to be total when it is in a liquid state, at a temperature greater than or equal to the liquidus. Fusion of the solder composition is generally considered as partial when it is in a state that can be described as semi-solid, viscous, softened, at a temperature between the solidus and the liquidus.
- brazing is carried out at a brazing temperature of 1150 ° C or lower, preferably 1020 ° C to 1150 ° C, more preferably 1080 ° C to 1100 ° C.
- moderately refractory joint is meant that this seal is generally able to withstand operating temperatures up to 850 ° C or 880 ° C.
- the process according to the invention which is a brazing process at a temperature of less than or equal to 1150 ° C, preferably from 1020 ° C to 1150 ° C, more preferably from 1080 ° C to 1100 ° C, implementing a specific solder composition has never been described in the prior art.
- solder composition used according to the invention which, surprisingly, allows soldering at a temperature of less than or equal to 1150 ° C., preferably from 1020 ° C. to 1150 ° C., more preferably from 1080 ° C to 1100 ° C, parts made of silicon carbide materials is in no way mentioned in the documents of the prior art cited above.
- document [7] does not mention nickel in the list of 27 elements, of which at least two must be chosen to form a solder composition with silicon, the latter always being present at less than 50% by weight.
- nickel in this list, Fe, Cr, Co, V, Zn, Ti and Y are preferred and nickel, is not fortiori not mentioned among the preferred elements.
- brazing alloys of this document which are alloys of silicon, chromium and cobalt, alloys of silicon, chromium and iron, and alloys of silicon, iron and cobalt, and none of the compositions solders exemplified herein contain nickel.
- the alloys described in this document are much more complex than the Si-Ni binary alloy implemented according to the invention.
- the brazing alloys of this document are at least ternary polyconstituted alloys whose development and control properties are much more delicate than those of binary alloys.
- the brazing compositions of the examples provided in document [7] are limited to the SiFeCo, SiFeCr, SiCrCo ternary systems with an Si content of less than 40% by mass. These compositions do not contain nickel, and overall a very small number of elements compared to the list of 27 possible add-on elements. It should also be added that the solder compositions according to the invention have silicon concentrations greater than 45 ⁇ 6 by mass, that is to say a concentration of Si greater than those indicated in document [7].
- Document [7] contains no indication that can lead to the preparation of a binary solder alloy, since it relates to alloys containing at least one minimum three elements.
- the document [7] then contains no indication that may lead to the choice of nickel, let alone a specific content thereof to prepare a binary alloy alloy, compatible with Sic, and ensuring brazing at a temperature of 1020.degree. ° C to 1150 ° C, preferably from 1080 ° C to 1100 ° C, Sic-based parts, and an effective assembly of these parts.
- the second essential characteristic of the process of the invention is the addition, addition of a Sic and / or C reinforcement prior to soldering.
- the addition of a SiC and / or C reinforcement makes it possible, on the one hand, to perfectly adapt the coefficient of the seal composition including the reinforcement plus the solder to the Sic-based material and, on the other hand, to achieve very thick joints, for example, beyond 500 ⁇ m or even 1 to 2 mm, by pre-placing reinforcements, for example between the parts to be brazed, reinforcements which thus ensure the capillary infiltration of the solder into the joint (brazing in capillary configuration).
- the method according to the invention makes it possible to produce very thick joints well beyond 500 ⁇ m.
- the document [2] does not specify the thicknesses of joints reached.
- the non-reactive solder compositions used in the process according to the invention ensure excellent chemical compatibility with the Sic-based material, wet it well and adhere well to that -this ; on the other hand, in order to limit the residual stresses, which occur during cooling, due to the difference in coefficient of expansion between the material and the solder, the overall composition in the joint includes, according to the invention, a metal alloy. silicon and a reinforcement of SiC and / or C, whose expansion coefficient is close to that of the SiC-based material. This is all the more true that the thickness of the seal is important, or that the mechanical stress is important. Thanks to the method according to the invention, the induced cracks are avoided either during the development of the seal, either during an operating operation of the assembly, which would be very damaging to the service life of the part or component.
- solder compositions used according to the invention associated with the reinforcements, allow the filling of very thick joints, for example beyond 500 ⁇ m, because the reinforcements constitute wettable capillaries by these solder compositions.
- the method according to the invention meets the needs, meets all the requirements and criteria mentioned above, and does not have the disadvantages of the processes of the prior art.
- the process according to the invention makes it possible for the first time to prepare medium-refractory assemblies, that is to say with an operating temperature of up to 850 ° C. or even 880 ° C. parts made of silicon carbide materials whatever their geometry, even very complex and / or their size.
- the method according to the invention ensures in all cases, in particular, a good filling of the joint by the solder, and completely surprisingly, excellent mechanical strength of the assembly at room temperature and hot, especially above 500 ° C and up to 850 ° C-880 ° C, and possibly a good seal seal.
- the method according to the invention is, moreover, simple, reliable, easy to implement and inexpensive in total.
- the many surprising advantages and effects of the invention can be enumerated as follows, without this enumeration being considered as limiting:
- the assembly obtained according to the invention makes it possible to guarantee a very good mechanical bonding between the substrates based on silicon carbide even for maximum use temperatures, of use, greater than 500 ° C. and which can be, for example, up to at 850 ° C, or even 880 ° C.
- the breaks take place in "cohesive" mode, that is to say that the cracks occur in substrates based on silicon carbide and not on the brazed joint;
- the brazing temperature is less than or equal to 1150 ° C, preferably from 1020 ° C to 1150 ° C, and more preferably from 1080 to 1100 ° C, it is therefore possible with the method according to the invention to assemble parts, substrates based on silicon carbide that can not withstand temperatures above 1150 ° C, such as ceramic matrix composite parts, substrates such as Cerasep A40C ® .
- the process according to the invention makes it possible to carry out the soldering of SiC-based materials which degrade from 1150 ° C., or even 1100 ° C. and even 1040 ° C.
- the process according to the invention applies, of course, to pure SiC, for example sintered SiC, for which it is possible to use brazing temperatures greater than 1300 ° C, but also less stable materials by implementing solder compositions adapted to these less thermally stable materials;
- the brazing carried out by the process according to the invention is reversible. It is thus possible to separate, separate, the parts, assembled substrates, for example with a view to their repair, by melting the brazing alloy in an oven during a second melting operation of this brazing alloy, without altering the parts, substrates. Parts, substrates can also be separated by chemical attack.
- the method according to the invention allows the repair of assembled parts made of silicon carbide material. This means that these parts can undergo a second soldering cycle, if necessary, for repair without degradation of joint properties. This repair capability is possible due to the lack of reactivity or the very low reactivity of the brazing alloys implemented according to the invention with silicon carbide;
- Another remarkable property obtained by the process according to the invention is the homogeneity of the joint obtained after brazing and the very good mechanical behavior of the joints formed;
- the angle is of the order of 40 ° from 5 minutes of bearing at 1100 ° C, and of the order of 30 ° after 30 minutes; and on sintered SiC, it is of the order of 60 ° from 5 minutes of bearing at 1100 ° C., and less than 40 ° after 30 minutes (see Examples 1 and 2).
- the joints are well filled by the solder composition according to the invention, even in capillary configuration.
- solder compositions according to the invention do not contain any valuable chemical elements, especially metals of the platinum or rhodium family, which limits their cost and the cost of the process using them, compared with many compositions of the invention. prior art;
- the brazed joints obtained by the process according to the invention are generally tight.
- the method according to the invention is, therefore, suitable for sealing operations to withstand maximum temperatures between 850 ° C and 880 ° C depending on the composition of the solder alloy.
- the solder composition according to the invention may be a binary alloy consisting of atomic percentages, from 63% to 65% of silicon and from 35% to 37% of nickel.
- the preferred composition according to the invention is a binary alloy consisting in atomic percentages of 64% of silicon and 36% of Ni, or in mass percentages of 54% of Ni and 46% of Si.
- This preferred composition has a solidus temperature of 966 ° C and a liquidus temperature of 1070 ° C.
- an addition is made, adding a reinforcement.
- This addition can be done, for example, in the solder composition, and / or on at least one of the surfaces to be assembled of at least one of the parts to be assembled, and / or in the vicinity of at least one of the surfaces to be assembled. at least one of the parts to be assembled, and / or between the surfaces to be assembled parts to assemble.
- This reinforcement may be made of a material chosen from ceramics such as SiC and C.
- This reinforcement may be in the form of particles, for example a powder; fiber; a nonwoven fiber; a fiber fabric; felt or foam.
- the addition of the reinforcement can be carried out in an amount of at most 50% by volume, preferably from 1 to 49% by volume, more preferably from 5 to 49% by volume, relative to the volume of the composition of the composition. solder.
- these particles or fibers may be suspended in an organic binder so as to obtain a suspension or paste of particles or reinforcing fibers, and coat at least one surface to be assembled of at least one of the parts to be assembled with the suspension or paste of particles or reinforcing fibers.
- reinforcement supply for example in the solder composition and / or on at least one of the surfaces to be assembled of at least one of the parts to be assembled, the reinforcement undergoes a heat treatment at a temperature of 1300 ° C to 1500 ° C, for example 1400 ° C, for a period of 2 to 4 hours, for example 3 hours, under secondary vacuum, then the reinforcement is optionally stored under an inert atmosphere, for example an atmosphere d argon, for example if it is not used the same day.
- an inert atmosphere for example an atmosphere d argon
- This heat treatment applies to SiC reinforcements, especially in fibers or particles because the SiC oxidizes and not the carbon.
- such a heat treatment may be necessary if the reinforcements, for example in the form of powders, to be used are highly oxidized.
- solder composition powder it is possible to form a solder composition powder, to suspend this powder in an organic binder so as to obtain a suspension or paste of solder composition, and to deposit on at least one a surface of at least one of the parts to assemble the suspension or paste of solder composition obtained.
- the surfaces to be assembled can be brought into contact with parts to be assembled by observing an offset between them so as to create a free surface capable of receiving the suspension or paste of solder composition, close to the joint formed by the surfaces to assemble parts to assemble, then we can deposit the suspension or paste solder composition on this free surface, for example in the form of a bead.
- the seal formed by the surfaces to be assembled parts to be assembled is advantageously occupied by a reinforcement which also preferably covers said free surface and on which the suspension or solder composition paste is deposited.
- a carbon deposit on at least one of the parts to be joined is not useful.
- brazing can be performed at a brazing temperature of at least 15 ° C, preferably at least 30 ° C, above the melting temperature of the solder composition.
- brazing of porous brazing surfaces for example for composite materials whose Sic surface coating is not thick enough, it may be useful to braze at a temperature between liquidus and solidus in order to have a solder in the semi-solid state during the brazing stage. The solder is then viscous and the infiltration of the solder in the pores can be better controlled.
- the brazing can be carried out by carrying out a soldering step at a soldering temperature of 1020 ° C. to 1150 ° C., preferably from 1080 ° C. to 1100 ° C., maintained for a period of 1 to 150 minutes, preferably from 30 to 150 minutes, more preferably from 60 to 120 minutes, more preferably from 90 to 120 minutes.
- At least one surface to be assembled parts to assemble is porous, one can perform a soldering step at a temperature of 1020 ° C to 1080 ° C for a period of 1 to 30 minutes.
- the current brazing time which is generally from 30 to 150 minutes, to a duration of a few minutes, namely a duration between 1 and 30 minutes, to avoid too much infiltration of the brazing in the porosities of the material at the expense of filling the joint.
- the lowest brazing temperatures are recommended to limit infiltration, ie between 1000 ° C or 1020 ° C and 1080 ° C.
- a first step can be observed at a temperature generally of 850 ° C. to 910 ° C., for example 900 ° C., maintained for a period of 30 to 180 minutes, preferably of 60 to 180 minutes. minutes, more preferably 90 to 180 minutes, for example 120 minutes.
- the silicon carbide-based materials may be chosen from pure silicon carbides such as pure silicon carbide a (SiCOC) or ⁇ ( ⁇ ⁇ ), and composite materials based on SiC such as fibers and / or silicon carbide matrix.
- pure silicon carbides such as pure silicon carbide a (SiCOC) or ⁇ ( ⁇ ⁇ )
- composite materials based on SiC such as fibers and / or silicon carbide matrix.
- the silicon carbide materials may be selected from the non-pressure sintered silicon carbide ("PLS-SiC”); silicon carbide infiltrated Si (“SiSiC” or “RBSC”); porous recrystallized silicon carbide (“RSiC”); silicon graphite ("C-SiC”) made of graphite and covered with a Sic layer; SiC / SiC composites; for example, fiber or "whiskers”; SiC / SiC composites with self healing ⁇ matrix; C / SiC composites, for example, carbon fiber or "whisker” and SiC matrix; single crystals of SiC; composites of SiC with another ceramic, for example SiC / Si 3 N 4 and SiC / TiN composites.
- PLS-SiC non-pressure sintered silicon carbide
- SiSiC silicon carbide infiltrated Si
- RSiC porous recrystallized silicon carbide
- C-SiC silicon graphite
- SiC silicon graphite
- said silicon carbide-based materials have a silicon carbide content of at least 50% by weight, preferably at least 80% by weight, and more preferably equal to 100% by weight.
- the invention further relates to a composition for brazing, for example, the non-reactive, moderately refractory brazing of silicon carbide material parts comprising a non-reactive brazing composition as described above. and, additionally, an addition, addition, of a reinforcement.
- a composition for brazing for example, the non-reactive, moderately refractory brazing of silicon carbide material parts comprising a non-reactive brazing composition as described above. and, additionally, an addition, addition, of a reinforcement.
- the invention further relates to a paste, suspension, solder for soldering, for example, the medium refractory, non-reactive brazing of silicon carbide material parts comprising a powder of a solder composition. as defined above, an addition of a reinforcement, and a binder, liquid organic cement, or a viscous organic gel.
- the invention further relates to the moderately refractory joint (maximum operating temperature of 850 ° C to 880 ° C), and the assembly comprising at least two pieces of Sic-based materials obtained by the process according to the invention. invention described above.
- Figure 1 is a schematic view showing the arrangement of SiC material plates and braze composition paste for brazing in sandwich configuration.
- Figure 2 is a schematic view showing the arrangement of Sic material boards and solder composition paste for soldering in a capillary configuration.
- FIG. 3 is a graph that represents the recommended soldering cycle for brazing a joint with a reinforcement of Sic particles or Sic fibers.
- the abscissa is the duration in minutes since the beginning of the heat treatment, and the ordinate is the temperature T in ° C.
- FIG. 4 is a schematic view showing the disposition of the SiC material plates and the braze composition paste for soldering in a capillary configuration, a seal with a reinforcement of SiC particles or of SiC fibers leading to of the seal.
- FIG. 5 is a graph which represents the brazing thermal cycle used in example 3.
- the abscissa is the duration in minutes since the beginning of the heat treatment, and the ordinate is the temperature T in ° C.
- Figure 6 is a schematic view of the test pieces used for the mechanical tests, including compression / shear joints and assemblies prepared in the examples.
- Figure 7 is a schematic view showing the arrangement of Sic material boards and the solder composition paste for brazing in a capillary configuration, as performed in Example 5, of a seal with a reinforcement of SiC particles or Sic fibers emerging from the anointed.
- Fig. 8 is a schematic view showing the arrangement of Sic material boards and the solder composition paste for brazing in a capillary configuration, as performed in Example 6, of a seal with a reinforcement constituted by a fabric of Sic fibers leading to the anointed.
- the first step of the process according to the invention consists, firstly, generally, in preparing, developing a solder composition, in other words a brazing alloy containing silicon, and nickel.
- the brazing alloy according to the invention is a silicon (Si) -Nickel (Ni) binary alloy.
- the mass proportions for the Si-Ni binary alloy are in atomic percentages from 60% to 66% of silicon, and from 34% to 40% of nickel.
- the solder composition is, generally, a powdery composition that can be prepared, for example, by first synthesizing, from the pure elements Si, and Ni, an intermetallic compound containing silicon and nickel.
- inter-metallic compound is, for example, by introducing the silicon - for example, in the form of pieces -, nickel - for example, in the form of pieces or other - in the proportions desired for the solder composition in a refractory alumina crucible, for example.
- the crucible, silicon, and nickel assembly is disposed in a heating apparatus, such as a graphite furnace or a metal furnace, and is heated to a temperature of typically 1200 ° C to 1300 ° C. example of 1250 ° C, preferably under argon, for a period of 60 to 120 minutes, for example 30 minutes, to melt the various constituents of the solder composition and obtain after cooling the desired inter-metal compound desired homogeneous in the form of an ingot.
- the heating temperature is preferably 1250 ° C for the preferred composition according to the invention.
- the manufacture of the ingot can also be done by development in a cold crucible. This non-contact melting technique (copper crucible cooled by circulating water and placed in an inductor) melts the alloy without contact with the crucible and recover it without machining the crucible.
- the ingot of intermetallic compound obtained is then ground in any suitable apparatus, for example, in a mortar to obtain a powder of adequate particle size, that is to say, whose grains have, for example, a diameter of 1 to 300 ym and which constitutes the solder composition.
- the binary solder composition according to the invention can be prepared, for example, by weighing pure silicon powder, and the powder of the NiSi 2 and / or NiSi intermetallic compound in the proportions chosen for the solder composition. according to the invention and then mixing these powders in a "Turbula" for at least 30 minutes.
- the powder composed of the mixture of inter-metal compound powders and Si constitutes, in this case, the solder composition.
- Said intermetallic compound NiSi 2 or NiSi can be synthesized, or it is a commercial compound in the form of an inter-metal compound powder of known particle size and purities.
- the pure silicon powder may be prepared from pieces of pure silicon milled in any suitable apparatus, for example, in a mortar, for obtain a suitable particle size powder whose grains have, for example, a diameter of 1 to 250 microns.
- said pure silicon powder may also be a commercial powder of known particle size and purity.
- these commercially available powders mention may be made of, for example: pure Si powder, CERAC brand, with a purity of 99.5% or 99.99% and a particle size of the order of 50 ⁇ m.
- an addition of a reinforcement prior to brazing is also carried out, in particular in order to improve the mechanical strength of the assembly.
- This reinforcement may be a reinforcement of C, or a ceramic such as SiC.
- This reinforcement may be in the form of particles, for example a powder such as an SiC powder; fibers for example SiC fibers or ceramics; a nonwoven in which fibers are isolated; a fiber fabric; felt or foam.
- the added reinforcement such as SiC powder is generally at most 50% by volume, preferably 1 to 49% by volume, more preferably 5 to 49% by volume, of the solder composition.
- the SiC powder may be, for example, a commercial powder, such as the STARCK brand powder, of 98.5% purity and with a particle size of less than 10 ⁇ m or Neyco brand powder, with a purity of 98.5% and a particle size of 50 ⁇ m.
- reinforcement such as a Sic powder
- the reinforcement such as a SiC powder, for example, can be suspended in a conventional manner in a binder, cementum, liquid organic gel, preferably both viscous and sticky, to obtain a paste, suspension reinforcement allowing homogeneous spreading on the surfaces of the parts, substrates made of silicon carbide material to be brazed.
- the binder, cement, gel generally decomposes for example between 100 and 300 ° C. without leaving traces.
- NICROBRAZ ® or a gel (VITTA ® gel).
- the second step of the process according to the invention generally consists in producing the assembly by brazing itself.
- the two (or more) surfaces of Sic-based parts to be assembled are generally degreased, cleaned, in an organic solvent for example of the ketone, ester, ether, alcohol type, or a mixture thereof, etc.
- a preferred solvent is acetone or an acetone-ethyl alcohol-ether mixture, for example in the proportions 1/3, 1/3, 1/3; it is also possible to clean the parts successively with several different solvents, for example with acetone and then with ethanol. The pieces are then dried.
- the pieces of Sic-based materials to be assembled are generally two in number, but it is also possible to assemble simultaneously a larger number of pieces up to 100.
- piece of Sic-based material is generally meant any element, or entity of any shape and size entering for example, after assembly with one or more other parts in structures of larger size.
- silicon carbide material is generally meant here all materials comprising at least 50% by weight of silicon carbide, preferably at least 80% by weight of silicon carbide, more preferably 100% by weight of carbide in the latter case, the material consists of only silicon carbide.
- the silicon carbide-based materials may especially be in the form of sintered or infiltrated powder or fibers bonded by a ceramic matrix.
- the silicon carbide-based materials may be selected from pure silicon carbides such as pure silicon carbide a (SiCOC) or ⁇ ( ⁇ ⁇ ), and composite materials based on SiC such as fiber composites and / or silicon carbide matrix.
- SiC based materials include pure dense silicon carbide or sintered silicon carbide without pressure ("PLS-SiC", ie "PressureLess Sintered SiC”); silicon carbide infiltrated Si (called SiSiC or RBSC containing 5 to 20% Si); porous recrystallized silicon carbide (called RSiC); graphite silicon (C-SiC) made of graphite and covered with a layer of SiC for example 0.1 to 1 mm thick; as well as SiC / SiC composites, for example, fiber or "Whiskers”; SiC / SiC composites with self healing ⁇ matrix; C / SiC composites, for example carbon fiber or "Whisker” carbon and SiC matrix; and again SiC single crystals; and SiC composites with another ceramic, for example, SiC / Si 3 N 4 and SiC / TiN composites.
- PLS-SiC silicon carbide infiltrated Si
- RSiC porous recrystallized silicon carbide
- the silicon-based material of the substrates, parts to be assembled according to the invention consists of 100% silicon carbide, chosen, for example, from pure sintered silicon carbide grades (SiC) or ⁇ ( ⁇ ). ⁇ ) or among the silicon carbide fiber composites with a silicon carbide matrix.
- SiC pure sintered silicon carbide grades
- ⁇ ⁇
- ⁇ silicon carbide fiber composites with a silicon carbide matrix.
- the two or more pieces to be assembled can be in the same material, based on silicon carbide, for example in PLS ("Pressureless Sintered") -SiC, or in SiC-SiC composite, or each of the pieces can be made of a material based on of different silicon carbide.
- the suspension, paste of the solder composition prepared as previously described is spread, coated, applied homogeneously, uniformly, for example with a brush, a spatula, a brush, or with the aid of a syringe. optionally attached to a robotic system, or by any other means for depositing a layer of solder paste uniformly on the surface of at least one of the silicon carbide material parts to be assembled.
- the suspension, reinforcement paste can also be spread according to the same principle.
- solder paste is not uniformly distributed but in the form of solder cords that do not touch each other to avoid an overly confined configuration.
- the quantity of paste, suspension of solder composition to be used in this configuration is generally from 10 mg / cm 2 to 60 mg / cm 2 , for example 20 mg / cm 2 .
- the "sandwich” configuration is applicable for "thin” joints, that is to say with a thickness of less than 500 micrometers, as well as for "thick” joints, that is to say a thickness greater than or equal to 500 micrometers.
- the parts to be assembled are brought into contact without having put a solder composition between them while observing a gap, offset (23 ) between them, generally a few mm, for example 1 mm, 2 mm, to 10 mm so as to create a free surface (24) capable of receiving the suspension or paste near the seal (25) formed by the surfaces to assemble parts to be assembled, then depositing the suspension or paste solder composition for example in the form of a solder bead (26) on this free surface (24) near the seal, in the vicinity of the joint, or at the edge of the seal (25).
- the liquid solder composition infiltrates the gasket.
- This soldering configuration is called "capillary configuration".
- capillary configuration With the solder compositions according to the invention, it is possible to perform such a capillary brazing, with an infiltration of the solder in the solder joint during the brazing cycle, without directly disposing the solder composition between the parts to be assembled as in the case of the "sandwich configuration".
- This capillary configuration is even preferred for the Ni-Si system because it makes it possible to obtain a better filling of the joint by the solder and makes it possible to produce very thick joints with reinforcements.
- the quantity of paste, suspension of solder composition to be used in this capillary configuration and without reinforcement is generally from 10 mg / cm 2 to 40 mg / cm 2 , for example 20 mg / cm 2 . It is superior in the case of joint with reinforcement and depends on the thickness of the joint.
- Capillary brazing is possible with the Ni-Si system for "thin" joints with a thickness of less than 500 ⁇ m in the absence of reinforcements previously placed in the joint. Capillary brazing has led to a good filling, by the NiSi solder joints whose thickness can vary between a few microns and almost 500 ym in the case of SiC / SiC composite parts that have surface defects.
- Capillary brazing may also be possible for joint thicknesses much greater than 500 ⁇ m and up to a few millimeters, for joints in which a "wetting reinforcement” (that is to say that the solder wets well the surface of the reinforcement, this is the case with reinforcements to Sic base for example) by the solder composition was disposed between the faces to be soldered.
- a "wetting reinforcement” that is to say that the solder wets well the surface of the reinforcement, this is the case with reinforcements to Sic base for example
- This reinforcement may consist for example of ceramic particles such as SiC, ceramic fibers such as SiC, C particles, SiC fibers, SiC fabric. For thicknesses greater than 500 ⁇ m, the seal quality is better with reinforcements of SiC particles or SiC fibers which reduce cracks in the joint.
- solder placed at the edge of the joint, goes into the liquid state during the brazing cycle, infiltrates into the joint and wets the reinforcements which makes it possible to obtain a joint well filled by the solder
- a thermal treatment of the reinforcement at a temperature generally from 1300 ° C. to 1500 ° C., for example 1400 ° C., under secondary vacuum in a graphite furnace, generally lasting 2 to 4 hours, before use; after the heat treatment of the reinforcement, if it is not used immediately, it must be stored, preferably under argon;
- the brazing cycle must be possibly constituted by a first bearing and necessarily by a second bearing, the soldering bearing, as described below (see FIG. 3):
- a first stage at a temperature of 850 to 910 ° C., for example 900 ° C., for a period of 30 to 180 minutes, for example from 120 minutes to 180 minutes. This bearing is essential for large parts;
- a second stage which is the brazing stage as described below and which is carried out especially at a temperature of 1080 ° C. to 1100 ° C. for 90 to 150 minutes, for example at a temperature of 1100 ° C. for 120 minutes to typically fill 3 cm in length of a seal made of Sic reinforcements.
- the solder composition may be disposed, for example in the form of a solder bead (47), away from the wafer (48) of the workpiece (46), i.e. at a distance of 2 to 5 mm from it and allow priming through the reinforcements coming out (49), open, seal (42) without risk of infiltrating the solder in the pores of the composite material such as CMC.
- the reinforcements are implemented in the form of a paste or suspension of particles or reinforcing fibers, for example made of SiC, but it would also be possible to use, for example, a fiber fabric, for example of interposed Sic. between the surfaces to be joined (43, 44).
- the seal is generally constituted by at least 50% by volume of the Si-Ni alloy, the latter having the composition mentioned above, and generally at most 50% by volume of reinforcements such as ceramic particles. or ceramic fibers (SiC or C for example).
- Parts ready to be brazed are then placed in a heating device such as a furnace or subjected to heating by any other suitable means.
- the oven is generally a graphite furnace, under vacuum or under a neutral gas atmosphere but it can also be a metal furnace.
- the vacuum is a secondary vacuum, that is to say that the pressure is 10 ⁇ 3 to 10 ⁇ 5 Pa, for example, 10 ⁇ 4 Pa.
- the neutral gas is argon.
- the invention even makes it possible to use argon of commercial quality (with generally 5 ppm of 0 2 )
- the parts to be assembled are subjected, for example, in the oven to a thermal cycle.
- the assembly formed by the parts and the solder composition can be brought to the brazing temperature by observing a temperature rise preferably "slow", with one or more temperature ramps from the ambient temperature.
- This rise in temperature can be done for example with a temperature ramp at a rate of 1 ° C to 5 ° C / minute.
- the brazing stage is generally carried out at a temperature, which is the brazing temperature, preferably greater than at least 15 ° C., and more preferably at least 30 ° C., at the melting temperature or liquidus temperature. braze composition, solder alloy retained.
- brazing of porous brazing surfaces for example for composite materials whose Sic surface coating is not thick enough, it may be useful to braze at a temperature between liquidus and solidus in order to have a solder in the semi-solid state during the brazing stage. The solder is then viscous and the infiltration of the solder into the porosities can be better controlled.
- This brazing temperature is therefore generally from 1020 ° C. to 1150 ° C., preferably from 1080 ° C. to 1100 ° C., depending on the solder composition and the relative proportions of Ni and Si in this composition.
- the liquidus temperature generally varies from 1005 ° C to 1125 ° C and the soldering temperature will therefore vary, for example, as specified above, from 1020 ° C to 1150 ° C.
- the highest brazing temperature can be 1155 ° C.
- Such a melting temperature of the compositions makes it possible, according to another advantage of the process of the invention, to use the assembly up to 850 ° C. and even up to 880 ° C.
- the brazing temperature of the solder compositions according to the invention is less than 1150 ° C.
- excellent adhesion and good wetting of the silicon carbide are obtained with rapid wetting kinetics as shown by the tests. posed with these solder compositions, so it is possible (see Examples 1 and 2) to obtain an angle of contact less than 40 ° after brazing for 30 minutes at 1100 ° C.
- the joints prepared with solder compositions according to the invention also have excellent mechanical properties.
- the brazing temperature defined above (1020 ° C to 1150 ° C, preferably 1080 ° C to 1100 ° C) is maintained for a period of 1 to 150 minutes, preferably 30 to 150 minutes, more preferably 60 to 120 minutes, better 90 to 120 minutes, for example 90 minutes, this is called the soldering bearing.
- the current brazing time which is generally 30 to 150 minutes, to a minimum. duration of a few minutes, namely for example a time between 1 and 30 minutes, to avoid too much infiltration of the solder in the pores of the material at the expense of filling the seal.
- the duration of the brazing stage depends on the size of the parts to be assembled and more precisely on the dimensions of the surfaces to be brazed. We can, indeed, go up to 150 minutes for very large pieces with large brazing surfaces, ie typically at least 50x50 mm 2 .
- a brazing stage of the process according to the invention may for example be carried out at a brazing temperature of 1100 ° C. for 60 to 90 minutes.
- the specific temperature of the soldering bearing chosen is a function of the composition of the solder alloy.
- a homogenization bearing for example at 900 ° C., is recommended and even essential for large pieces (typically from 50 ⁇ 50 mm 2 ) in order to guarantee thermal homogeneity at the level of the parts to be assembled.
- this first step is in the case of the compositions Ni-Si according to the invention essentially or only a step of homogenization.
- This bearing can be replaced by a slow rise in temperature, for example around 900 ° C.
- the duration of the first stage depends on the size of the furnace, the dimensions of the parts to be soldered and the tools for holding the pieces to be brazed.
- This first stage which is therefore a homogenization stage is generally observed at a temperature of 850 ° C. to 910 ° C., for example 900 ° C. with a minimum recommended duration of one hour, for example a duration of 60 to 180 ° C. minutes, before making the brazing bearing proper in the conditions already mentioned above.
- Such a first bearing is not essential for small parts.
- Such a first bearing is generally recommended and even essential in these two configurations for large parts, namely generally parts that have solder surfaces greater than 50x50 mm 2 , to ensure thermal homogeneity at the parts to be assembled.
- the duration of these bearings can be increased and for example be set at 180 minutes for the first bearing and 150 minutes for the second bearing for very large pieces, for example with 0.5 m 2 of solder surface or more.
- a thermal homogenization can also be obtained by eliminating this first step and by making a slow rise in temperature (at the rate for example of 0.5 ° C./minutes) generally between 850 ° C. and 910 ° C., for example towards 900 ° C, so that the exposure time of the assembly in this temperature range is, for example, of the order of 60 to 180 minutes.
- the assembly is cooled to room temperature at, for example, 5 ° C. or 6 ° C. per minute.
- the solder solidifies and the assembly of silicon carbide material parts is effective both in the case where a "sandwich" configuration has been used than in the case where it has been used. a "capillary" configuration.
- the assemblies made by the process according to the invention were subjected to compression / shear tests (see FIG. 6) at ambient temperature.
- the breaking stress obtained is of the order of 13 MPa, the weak point of the bond between the solder and the CMC being at the level of the coating of the CMC, which is SiC prepared by chemical vapor deposition (CVD).
- this mechanical strength is further improved, especially in the case of composite material parts such as CMC parts, by adding reinforcements for example in the solder composition, and / or on at least one of the surfaces to assemble parts to be assembled, and / or between the surfaces to be assembled parts to assemble.
- the weak point of the fracture is the SiC coating of the composite even with particle reinforcements, so we can not see clearly quantitatively the gain on the mechanical plane on the breaking stresses.
- the average on the raw CMC is 17 MPa and on the surface CMC 16 MPa.
- These reinforcements may be reinforcements of the particle type, for example in the form of an SiC powder, or of ceramic fiber type, for example in the form of single or woven fibers, for example of SiC.
- the content of reinforcement is generally at most 50% by volume, and may range generally from 1 or a few% by volume, for example 5% by volume, up to 49% by volume of the solder composition.
- Assemblies of silicon carbide parts comprising seals prepared by the method according to the invention make it possible to produce structures, apparatus and components of complex shapes. having high operating temperatures up to 850 ° C, or even 880 ° C with high accuracy.
- SiC has a very good chemical resistance to various acids, including hydrofluoric acid and very good resistance to oxidation in air at high temperatures up to 1300 ° C.
- the method according to the invention can especially be applied to the manufacture of any device, apparatus, structure, component requiring a moderately refractory assembly between at least two substrates, silicon carbide-based parts guaranteeing both good mechanical strength and a satisfactory seal at one assembly.
- This type of device, device, structure, component can meet needs in different areas: the field of thermal engineering, particularly to design high-performance heat exchangers because silicon carbide has good thermal conductivity and good resistance to high temperatures in extreme environments.
- silicon carbide is resistant to many corrosive chemicals such as bases and strong acids.
- SiC telescope mirror space optics
- aeronautics SiC / SiC composite part
- This example describes tests of put drop made with a solder composition, solder alloy according to the invention with a composition of 64% Si, 36% Ni, ⁇ % atomic, ie 46% Si and 54% Ni ⁇ %. Mass on pure sintered SiC, observing a single soldering bearing at 1100 ° C. a) Preparation of the solder composition and solder paste.
- the target composition braze 64 atomic% Si and 36 atomic% Ni was prepared from pieces of Si and pure Ni pieces.
- solder paste thus prepared is used to form a small mass of solder with a mass of the order of 50 mg. This mass of solder is deposited on a previously cleaned SiC plate.
- solder cluster and the plate is placed in a brazing furnace, in this case a metal furnace, and subjected to a secondary vacuum brazing heat cycle with a single bearing, which is the soldering bearing at 1100 ° C.
- the solder mass melts during this heat treatment and forms a drop that is called "drop posed".
- a porthole makes it possible to follow in situ the spreading of the drop.
- the wetting angle, contact, of the drop is measured on the liquid droplet in situ through the porthole.
- the wetting angle is of the order of 60 ° after 5 minutes, of the order of 50 ° after 20 minutes and less than 40 ° after 30 minutes of bearing, which corresponds to good wetting.
- the SiC and its solidified solder drop were cut, coated and polished and were observed by scanning electron microscopy.
- the SiC / braze interface does not show any reactivity at scanning electron microscopy scale, ie there is no formation of new compound. In particular, there has been no formation of brittle compounds at the interface.
- This example describes tests of put drop made with a solder composition, solder alloy according to the invention with a composition of 64% Si, 36% Ni, ⁇ % atomic, ie 46% Si and 54% Ni in%. mass on a SiC / SiC Cerasep A40C ® composite, observing a single soldering bearing at 1100 ° C. a) Preparation of the solder composition and solder paste.
- the braze composition of target 64 atomic% Si and 36 atomic% Ni was prepared as indicated in Example 1.
- a paste of solder composition was formed as in Example 1. b) Test of "drop put” at 1100 ° C
- solder paste thus prepared is used to form a small mass of solder with a mass of the order of 50 mg.
- This clump of solder is deposited on a SiC / SiC composite plate with an SiC matrix and Sic fibers.
- This composite is available from Snecma Propulsion Solid under the name CERASEP A40C ® . This plate was previously cleaned before removing the solder.
- the entire solder cluster and the plate is placed in a brazing furnace, in this case a metal furnace, and subjected to a secondary vacuum brazing heat cycle with a single bearing, which is the brazing stage at 1100 ° C for 60 minutes.
- the solder mass melts during this heat treatment and forms a drop that is called "drop posed".
- a porthole makes it possible to follow in situ the spreading of the drop.
- the wetting angle, contact, of the drop is measured on the liquid droplet in situ through the porthole.
- the wetting angle is of the order of 40 °
- the composite and its solidified solder drop were cut, coated and polished and were observed by scanning electron microscopy.
- the CMC / solder interface has no reactivity at scanning electron microscopy level, ie there is no formation of new compound. In particular, there has been no formation of brittle compounds at the interface.
- This example describes the preparation of bonds, assemblies between two pure sintered silicon carbide silicon parts, by implementing the soldering method according to the invention, the brazing being carried out in a capillary configuration using a solder composition, an alloy of brazing according to the invention consisting of 64% Si, 36% Ni, in atomic%, ie 46% Si and 54% Ni in% by weight.
- This example further describes tests and mechanical tests carried out on these assemblies. a) Preparation of solder composition, solder paste, and parts to be assembled
- the target composition solder namely 64 atomic% Si and 36 atomic% Ni, was prepared as described in Example 1.
- a solder composition paste was formed as in Example 1.
- Sintered Sic parts to be assembled are plates of dimensions 20x10 mm 2 and thickness 1.5 mm.
- the parts are cleaned with acetone then with ethanol and finally dried.
- the substrates, parts are brought into contact leaving a small offset of 1 to 2 mm, so as to leave a space to deposit the solder paste near the seal (this configuration is called capillary configuration).
- the paste is deposited with a spatula on the surface available at the edge of the joint, in the form of a bead of solder (see Figure 2).
- the amount of solder deposited is between 20 and 30 mg for this assembly.
- the parts contacted and ready to be brazed are placed in a brazing furnace (metal furnace in this case) under secondary vacuum and subjected to a vacuum brazing heat cycle which comprises a single step of 60 minutes at 1100 ° C. , which is the soldering bearing.
- a brazing furnace metal furnace in this case
- a vacuum brazing heat cycle which comprises a single step of 60 minutes at 1100 ° C. , which is the soldering bearing.
- the mechanics of ceramics being statistical, is prepared for testing more than one specimen but with the same manufacturing process.
- the specimens are shown schematically in Figure 6. They are fixed in a mounting and stressed in shear during a compression test / shear (63) at room temperature.
- the breaking stresses determined for each of the two specimens are 26 MPa and 90 MPa.
- the break occurs in the SiC, which is characteristic of strong bonds between the solder and the SiC substrate.
- This example describes the preparation of bonds, assemblies between two CMC parts, more precisely SiC / SIC composite with an SiC matrix and Sic fibers, by implementing the soldering method according to the invention, the brazing being carried out. in capillary configuration using a solder composition, solder alloy according to the invention consisting of 64% Si, 36% Ni, atomic%, ie 46% Si and 54% Ni% by weight. This example further describes tests and mechanical tests carried out on these assemblies. a) Preparation of solder composition, solder paste, and parts to be assembled
- the target composition solder namely 64 atomic% Si and 34 atomic% Ni was prepared as described in Example 1.
- a solder composition paste was formed as in Example 1.
- the parts, solder substrates, to assemble are SiC / SiC composite plates with an SiC matrix and SiC fibers.
- Such a composite material is available from the company Snecma Propulsion Solide under the name CERASEP A40C ®. These plates are 20x10 mm 2 and 1.5 mm thick.
- the parts are cleaned with acetone then with ethanol and finally dried.
- the substrates, parts are brought into contact leaving a small offset of 3 mm, so as to leave a space for depositing the solder paste near the seal (this configuration is called the capillary configuration).
- the paste is deposited with a spatula on the surface available at the edge of the joint, in the form of a bead of solder (see Figure 2), as described in Example 3.
- the amount of solder deposited is between 180 and 220 mg for this assembly.
- the thickness of the joint can reach 500 ⁇ m for the CMC plates because of flatness defects, whereas it is generally less than 100 ⁇ m for the SiC plates.
- the contacted and braze-ready parts are placed in a secondary vacuum brazing furnace and subjected to a vacuum brazing heat cycle which includes a single step of 60 to 90 minutes at 1100 ° C, which is the bearing. brazing.
- the thermal cycle is shown in Figure 5.
- the brazing is carried out either in metal furnace with a bearing of 60 minutes at 1100 ° C, or in graphite furnace with a bearing of 90 minutes. c) Observation of the joint
- the thickness of the seal is between 100 and 120.
- test pieces (3 test pieces) of mechanical tests were prepared by brazing 2 pieces of dimensions each 20x10x1.5 mm 3 with the solder paste prepared in a) above and under the brazing conditions described in b) above.
- test pieces have dimensions similar to those of Example 3, and are tested in the same way in compression / shear.
- the breaking stresses determined for each of the 3 test pieces are 11 MPa; 12 MPa; and 13 MPa.
- This example describes the preparation of bonds, assemblies between two CMC parts, more precisely SiC / SIC composite with an SiC matrix and SiC fibers, by implementing the soldering method according to the invention, the brazing being carried out.
- the brazing in capillary configuration using a solder composition, brazing alloy according to the invention consisting of 64 atomic% of Si and 36 atomic% of Ni, ie 46% of Si and 54% of Ni in% by weight, and reinforcements of SiC particles.
- the braze composition of target 64 atomic% Si and 36 atomic% Ni was prepared as indicated in Example 1.
- a solder composition paste was formed as in Example 1.
- the parts, solder substrates, to assemble are two SiC / SiC composite plates with an SiC matrix and SiC fibers.
- Such a composite material is available from the company Snecma Propulsion Solide under the name CERASEP A40C ®. These plates have dimensions of 10x20 mm and they each have a thickness of 1.5 mm.
- They can have two surface states: a surface condition in which local defects are eliminated or a raw state.
- the raw state leads to thicker joints because it has more defects.
- the parts are cleaned with acetone then with ethanol and finally dried.
- the plates are covered with particles of
- SiC particles are bonded together by an organic binder such as a cement type Nicrobraz ®, which provides an easy dough to drop on the plates in CMC.
- an organic binder such as a cement type Nicrobraz ®, which provides an easy dough to drop on the plates in CMC.
- the deposition is carried out as shown in FIG. 7, and the amount of particles deposited is 89 mg ⁇ 1 mg for CMC plates with a gross surface state and 71 mg ⁇ 1 mg for CMC plates with a surfaced surface state, this quantity being distributed between the two plates.
- the seal (75) is filled with the SiC reinforcement particle paste (76) protruding beyond the seal (75) on the available offset surface (74) of the bottom plate (72).
- the paste is deposited with a spatula on the available surface at the edge of the joint, in the form of a solder bead (77) (see Figure 7).
- the amount of solder deposited is between 200 and 220 mg for assembly with CMC plates with a surface-surfaced state, and between 280 and 310 mg for CMC assembly with a rough surface condition.
- the contacted and braze ready parts are placed in a secondary vacuum furnace (graphite furnace) and subjected to a vacuum brazing thermal cycle which includes a single 90 minute step at 1100 ° C. c) Preparation of mechanical test specimens and mechanical test results
- test pieces (9 test pieces) of mechanical tests were prepared by brazing 2 pieces of dimensions each 20x10x1.5 mm 3 with the solder paste prepared in a) above, with the coating of SiC particles described above. high, and under the brazing conditions described in b) above.
- the test pieces have dimensions similar to those of Example 3, and are tested in the same way in compression / shear. ⁇ Mechanical test results:
- the measured stress corresponds to the beginning of degradation of the composite.
- Table 2 Results of the compression / shear tests obtained on specimens in CMC surfaced and brazed with the NiSi solder with a reinforcement of SiC particles. d) Observation of joints with a scanning electron microscope
- test pieces are cut by the center.
- the joints are well filled by the solder.
- the thickness of the joint is between 100 and 700 ⁇ m depending on the areas observed due to local defects in the coating of the CMC and flatness defects. A very significant reduction in cracking in the joints was noted on these specimens compared to the unreinforced and lower thickness test pieces of Example 4.
- This example describes the preparation of bonds, assemblies between two CMC parts, more precisely SiC / SIC composite with an SiC matrix and SiC fibers, by implementing the method of brazing according to the invention, the brazing being carried out in a capillary configuration by using a solder composition, brazing alloy according to the invention consisting of 64 atomic% of Si and 36 atomic% of Ni, ie 46% of Si and 54% of Ni in% by weight, and a reinforcement constituted by a fabric of SiC fibers.
- the braze composition of target 64 atomic% Si and 36 atomic% Ni was prepared as indicated in Example 1.
- a solder composition paste was formed as in Example 1.
- the parts, solder substrates, to assemble are two plates (81, 82) of SiC / SiC composite with an SiC matrix and SiC fibers.
- Such a composite material is available from Snecma
- These plates have dimensions of 10x20 mm 2 and they each have a thickness of 1.5 mm.
- the parts are cleaned with acetone then with ethanol and finally dried.
- a fabric made of SiC fibers available under the trade name Nicalon NL 202 ® is placed between the brazing plates as indicated on the drawing.
- the CMC plates are brought into contact leaving a small offset of 3 mm (83), so as to leave a space, free surface, (84) to deposit the solder paste near the seal (this configuration is called capillary configuration) filled by the SiC fiber fabric (86).
- the paste is deposited with a spatula on the available surface at the edge of the joint, in the form of a solder bead (87) (see Figure 8).
- the amount of solder deposited is between 150 and 200 mg.
- the contacted and braze-ready parts are placed in a secondary vacuum furnace (metal furnace) and subjected to a vacuum brazing thermal cycle which includes a single 90-minute bearing at 1100 ° C.
- the solder penetrated well into the seal which has a thickness of 500 ⁇ m.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Ceramic Products (AREA)
Abstract
Description
Claims
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011800245338A CN103003018A (zh) | 2010-03-16 | 2011-03-11 | 用于通过具有添加加强物的非反应性钎焊接合由SiC为基础的材料制成的部件的方法,钎焊组合物以及通过所述方法获得的接合部和组件 |
| CA2793121A CA2793121A1 (fr) | 2010-03-16 | 2011-03-11 | Procede d'assemblage de pieces en materiaux a base de sic par brasage non-reactif avec ajout d'un renfort; compositions de brasure; joint et assemblage obtenus par un tel procede |
| JP2012557499A JP6026287B2 (ja) | 2010-03-16 | 2011-03-11 | 追加の強化材を使用した非反応性のろう付けによりSiC系材料製の部品を接合する方法、ろう付け組成物、ならびにそのような方法により得られる接合部および組付体 |
| US13/635,365 US9056369B2 (en) | 2010-03-16 | 2011-03-11 | Method for assembling, joining parts made of SiC-based materials by non-reactive brazing with addition of a reinforcement, brazing compositions and joint and assembly obtained by said method |
| EP11707431.0A EP2547479B1 (fr) | 2010-03-16 | 2011-03-11 | Procede d'assemblage de pieces en materiaux a base de sic par brasage non-reactif avec ajout d'un renfort ; compositions de brasure ; assemblage obtenus par un tel procede |
| KR1020127026694A KR20130060174A (ko) | 2010-03-16 | 2011-03-11 | SiC계 재료의 부품을 강화재의 첨가와 함께 비반응성 브레이징에 의해 접합하는 방법, 브레이징 조성물, 및 그 방법에 의해 얻어지는 접합부와 조립체 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR1051872 | 2010-03-16 | ||
| FR1051872A FR2957544B1 (fr) | 2010-03-16 | 2010-03-16 | Procede d'assemblage de pieces en materiaux a base de sic par brasage non-reactif avec ajout d'un renfort, compositions de brasure, et joint et assemblage obtenus par ce procede. |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2011113760A1 true WO2011113760A1 (fr) | 2011-09-22 |
Family
ID=42797424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/EP2011/053692 Ceased WO2011113760A1 (fr) | 2010-03-16 | 2011-03-11 | Procede d'assemblage de pieces en materiaux a base de sic par brasage non-reactif avec ajout d'un renfort; compositions de brasure; joint et assemblage obtenus par un tel procede |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US9056369B2 (fr) |
| EP (1) | EP2547479B1 (fr) |
| JP (1) | JP6026287B2 (fr) |
| KR (1) | KR20130060174A (fr) |
| CN (1) | CN103003018A (fr) |
| CA (1) | CA2793121A1 (fr) |
| FR (1) | FR2957544B1 (fr) |
| WO (1) | WO2011113760A1 (fr) |
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| WO2014013165A1 (fr) * | 2012-07-18 | 2014-01-23 | Herakles | Procede de brasage de pieces en materiau composite avec ancrage du joint de brasure |
| WO2014013166A1 (fr) * | 2012-07-18 | 2014-01-23 | Herakles | Procede de brasage de pieces en materiau composite avec integration d'un pion dans la liaison |
| US10335877B2 (en) | 2015-01-21 | 2019-07-02 | Rolls-Royce Corporation | Multilayer braze tape |
| US11110692B2 (en) | 2017-10-03 | 2021-09-07 | Rolls-Royce Corporation | Braze material for ceramic matrix composite articles |
| WO2022100281A1 (fr) * | 2020-11-12 | 2022-05-19 | 岭东核电有限公司 | Placage de carbure de silicium et procédé de raccordement par brasage associé, et barre de combustible et ensemble combustible |
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| CN119747784B (zh) * | 2025-01-24 | 2025-10-10 | 哈尔滨工业大学 | 一种三维网格铝酸镁复合中间层辅助钎焊SiC与Al/SiC复合材料大尺寸接头的方法 |
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- 2010-03-16 FR FR1051872A patent/FR2957544B1/fr not_active Expired - Fee Related
-
2011
- 2011-03-11 US US13/635,365 patent/US9056369B2/en not_active Expired - Fee Related
- 2011-03-11 JP JP2012557499A patent/JP6026287B2/ja not_active Expired - Fee Related
- 2011-03-11 CN CN2011800245338A patent/CN103003018A/zh active Pending
- 2011-03-11 CA CA2793121A patent/CA2793121A1/fr not_active Abandoned
- 2011-03-11 EP EP11707431.0A patent/EP2547479B1/fr active Active
- 2011-03-11 WO PCT/EP2011/053692 patent/WO2011113760A1/fr not_active Ceased
- 2011-03-11 KR KR1020127026694A patent/KR20130060174A/ko not_active Withdrawn
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014013165A1 (fr) * | 2012-07-18 | 2014-01-23 | Herakles | Procede de brasage de pieces en materiau composite avec ancrage du joint de brasure |
| WO2014013166A1 (fr) * | 2012-07-18 | 2014-01-23 | Herakles | Procede de brasage de pieces en materiau composite avec integration d'un pion dans la liaison |
| FR2993494A1 (fr) * | 2012-07-18 | 2014-01-24 | Herakles | Procede de brasage de pieces en materiau composite avec ancrage du joint de brasure |
| FR2993495A1 (fr) * | 2012-07-18 | 2014-01-24 | Herakles | Procede de brasage de pieces en materiau composite avec integration d'un pion dans la liaison |
| US9403240B2 (en) | 2012-07-18 | 2016-08-02 | Herakles | Method for the brazing of parts made from a composite material, incorporating a slug in the bond |
| US9573852B2 (en) | 2012-07-18 | 2017-02-21 | Commissariat à l'énergie atomique et aux énergies alternatives | Method for brazing parts made from a composite material, with anchoring of the brazed joint |
| EP2874975B1 (fr) * | 2012-07-18 | 2018-09-12 | Safran Ceramics | Procede de brasage de pieces en materiau composite a matrice ceramique avec ancrage du joint de brasure |
| EP2874976B1 (fr) * | 2012-07-18 | 2018-10-31 | Safran Ceramics | Procede de brasage de pieces en materiau composite a matrice ceramique avec integration d'un pion dans la liaison |
| US10335877B2 (en) | 2015-01-21 | 2019-07-02 | Rolls-Royce Corporation | Multilayer braze tape |
| US11110692B2 (en) | 2017-10-03 | 2021-09-07 | Rolls-Royce Corporation | Braze material for ceramic matrix composite articles |
| WO2022100281A1 (fr) * | 2020-11-12 | 2022-05-19 | 岭东核电有限公司 | Placage de carbure de silicium et procédé de raccordement par brasage associé, et barre de combustible et ensemble combustible |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20130060174A (ko) | 2013-06-07 |
| US20130064602A1 (en) | 2013-03-14 |
| JP6026287B2 (ja) | 2016-11-16 |
| US9056369B2 (en) | 2015-06-16 |
| JP2013522154A (ja) | 2013-06-13 |
| FR2957544B1 (fr) | 2012-05-11 |
| EP2547479A1 (fr) | 2013-01-23 |
| FR2957544A1 (fr) | 2011-09-23 |
| EP2547479B1 (fr) | 2019-07-10 |
| CA2793121A1 (fr) | 2011-09-22 |
| CN103003018A (zh) | 2013-03-27 |
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