WO2007114289A1 - 薄膜およびそれを用いた薄膜積層体 - Google Patents
薄膜およびそれを用いた薄膜積層体 Download PDFInfo
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- WO2007114289A1 WO2007114289A1 PCT/JP2007/056949 JP2007056949W WO2007114289A1 WO 2007114289 A1 WO2007114289 A1 WO 2007114289A1 JP 2007056949 W JP2007056949 W JP 2007056949W WO 2007114289 A1 WO2007114289 A1 WO 2007114289A1
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- Prior art keywords
- thin film
- heat
- film according
- fluid substance
- resistant fluid
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/16—Material structures, e.g. crystalline structures, film structures or crystal plane orientations
- H10F77/169—Thin semiconductor films on metallic or insulating substrates
- H10F77/1698—Thin semiconductor films on metallic or insulating substrates the metallic or insulating substrates being flexible
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2083/00—Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as moulding material
- B29K2083/005—LSR, i.e. liquid silicone rubbers, or derivatives thereof
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
- B29K2105/16—Fillers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2429/00—Carriers for sound or information
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
- H10F19/80—Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
- H10F19/85—Protective back sheets
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249994—Composite having a component wherein a constituent is liquid or is contained within preformed walls [e.g., impregnant-filled, previously void containing component, etc.]
- Y10T428/249995—Constituent is in liquid form
Definitions
- the present invention relates to a thin film having excellent heat resistance, water resistance, and flexibility, which can be used as a film substrate for a display, and a thin film laminate using the same.
- the display is rapidly changing to the conventional CRT liquid crystal system (LCD) from the viewpoint of mopile properties and space saving.
- LCD liquid crystal system
- organic EL devices that are self-luminous devices that are superior in terms of brightness, vividness, and power consumption have begun to be produced as next-generation displays. These are much more powerful in terms of mopile and space-saving than conventional CRT type glass. Since glass is still used as a substrate, there is a problem that it is relatively heavy and breaks. Also have.
- a film substrate (called a “Place”) is used in some liquid crystal type devices.
- a film substrate which are in the limelight as next-generation displays. Therefore, heat treatment exceeding 250 ° C is indispensable.
- the strength of conventional plastic substrates that can withstand such heat treatment conditions In recent years, clay thin films have attracted attention as materials that can meet these requirements.
- Clay thin films have excellent transparency and flexibility.
- the particles have a structure in which the layers are densely oriented, the gas barrier property is excellent.
- the main component is an inorganic substance, it is extremely excellent in heat resistance (see, for example, Patent Document 1).
- it when it is used as a film substrate for liquid crystal or organic EL displays, it has a problem of water resistance.
- Commonly used clay contains a hydrophilic cation between layers and is a highly hygroscopic substance. For this reason, there is a concern about organic EL degradation It is not suitable as a film substrate for display. In order to solve this problem, a method of exchanging hydrophilic cations contained between clay layers with hydrophobic cations has been proposed.
- Patent Document 1 Japanese Patent Laid-Open No. 2005-104133
- an object of the present invention is to provide a thin film and a thin film laminate that have sufficient heat resistance and water resistance and at the same time have flexibility.
- the thin film of the present invention includes a heat-resistant fluid substance between layers of a flaky heat-resistant material.
- the thin film laminate of the present invention has an inorganic thin film or an organic film on one or both sides of the thin film. It is characterized in that at least one of the thin films is laminated in a single layer or multiple layers.
- the thin film of the present invention is an excellent thin film having both heat resistance, water resistance and flexibility.
- the thin film of the present invention can be used for many products due to the above-mentioned properties.
- substrates for electronic paper, sealing films for electronic devices, lens films, films for light guide plates, prism films, retardation plates' polarizing film, viewing angle correction films, PDP films, LED films, optical communications Materials, touch panel films, various functional film substrates, electronic device films with a transparent structure inside, video discs' CDZCD—RZCD—RW / DVD / MO / MD, phase change discs, light power Can be used for films for optical recording media, sealing films for fuel cells, films for solar cells, and the like.
- the thin film laminate of the present invention has at least one of an inorganic thin film and an organic thin film laminated on one side or both sides of the thin film, a high gas noria property can be realized. It can be suitably used as a film substrate for liquid crystal and organic EL displays.
- FIG. 1 is a schematic cross-sectional view of an example of a thin film of the present invention.
- the thin film of the present invention has a structure in which flaky heat-resistant materials are oriented and laminated, and a heat-resistant fluid substance exists in the gap between the flaky heat-resistant materials.
- the film thickness is about 1 to 3,000 / zm.
- FIG. 1 is a cross-sectional view schematically showing an example of the thin film of the present invention.
- the thin film of the present invention has a thickness of 0.5 to 2 nanometers and a plurality of flaky heat-resistant materials 1 having a particle diameter of 1 m or less, oriented and laminated, and the flaky heat-resistant material It has a structure in which a heat-resistant fluid substance 2 is interposed between each individual.
- Examples of the flaky heat-resistant material 1 in the present invention include clay minerals having natural or synthetic power. Specifically, mica, vermiculite, montmorillonite, iron montmorillonite, piderite, sabonite, hectorite, stevensite, nontronite
- the heat-resistant fluid substance 2 present between the layers of the flaky heat-resistant material 1 is a liquid that does not cause degradation such as decomposition and boiling even when heated at 200 ° C or more, typified by a lubricating oil or the like. U, which prefers paste-like substances.
- the content of these heat-resistant fluid substances is preferably 1 to 60% of the entire thin film by weight.
- heat-resistant fluid substance examples include, for example, polyalkylene glycol, phosphate ester, alkylbenzene, poly-aolefin, polyol ester, alkyl naphthalene, silicone oil, halocarbon, polyarylalkane, polyphenol, silicate ester, And polyether ether.
- heat-resistant fluid substances those having a reactive functional group are preferred.
- silicone oil is preferable. This is because silicone oil has a smaller change in viscosity due to temperature than other heat-resistant fluid materials.
- silicone oils having various reactive functional groups are preferably used. More preferable is a reactive modified silicone oil.
- the reactive modified silicone oil refers to various reactive functional groups introduced into a part of the methyl group of the silicone oil, compatibility with organic substances, chemical reactivity, solubility in water, emulsification and repellency. Those with water-based properties.
- the reactive functional groups of the silicone oil are chemically bonded or cross-linked by the curing agent and the reaction aid.
- the fluid silicone oil becomes rubbery or flexible, and can play a role of imparting flexibility to the self-supporting membrane.
- methylphenyl silicone oil or a modified oil of methylphenylsilicone is desirable.
- the structural formula of methylphenyl silicone oil is shown below.
- an epoxy-modified silicone oil is also preferable.
- the heat-resistant fluid substance is epoxy-modified silicone oil and further contains an epoxy resin hardener or epoxy resin
- the epoxy group of the epoxy-modified silicone oil reacted and had a silicone rubber property. It becomes a self-supporting film.
- the epoxy resin is contained, a crosslinking reaction is established between the resin and the epoxy-modified silicone oil that is a heat-resistant fluid substance, and the silicone oil has a high strength and flexibility as described above.
- reactive functional groups that is, organic groups, are methyl phenyl groups and epoxy groups.
- various reactive functional groups can be selected as long as they have the above-mentioned effects that are not limited to these groups.
- the heat-resistant fluid substance used in the present invention preferably contains a hydrophobic cationic substance.
- a heat-resistant fluid substance tends to exist between the flaky heat-resistant materials.
- clay contains a hydrophilic exchangeable cation and can be easily exchanged for a hydrophobic cation.
- hydrophobic cationic substances include quaternary ammonium salts such as dimethylyl distearyl ammonium salt and dimethyl group and ammonium having a benzyl group and a polyoxyethylene group. Salt, quaternary phosphonium salt, pyridinium salt, and imidazolium salt.
- hydrophobic cation substances can be used to make organic using the ion exchange property of clay, for example, the cation exchange property of montmorillonite. This facilitates dispersion of the clay in the organic solvent and facilitates the silicone oil intercalation.
- hydrophobic cationic substances shown above are represented by the general formula below.
- the following general formula (1) is a quaternary ammonium salt
- general formula (2) is a quaternary phosphonium salt
- general formula (3) is a pyridinium salt
- general formula (4) is an imidazolium salt. Indicates.
- R1 to R11 represent an alkyl group or a phenyl group
- the heat-resistant fluid substance preferably contains a resin having a solid form at room temperature.
- the resin having a solid form at room temperature is not particularly limited, and examples thereof include epoxy resin, polyamideimide, and silicone resin that are polymerized by heat or ultraviolet light.
- the solid resin in the solid form at room temperature has an functional group capable of chemically reacting with the heat-resistant fluid substance.
- a combination of such a resin and a preferable heat-resistant fluid substance includes silicone oil having an epoxy group and epoxy resin as described above, silicone oil having an amino group and polyimide resin or silicone.
- silicone oil having an amino group and polyimide resin or silicone includes silicone oil having an amino group and polyimide resin or silicone.
- Various combinations such as greaves can be exemplified.
- the resin having a functional group is preferably 50% or less of the whole thin film by weight. If it is 50% or less, the preferred ratio of the flaky heat-resistant material can be maintained, so that good heat resistance and gas noria properties can be obtained more easily.
- the thin film of the present invention can be obtained, for example, as follows.
- a flaky heat-resistant material and a hydrophobic cationic substance are dispersed in pure water, then separated into solid and liquid and dried to obtain an organized clay.
- a self-supporting thin film can be obtained by removing and optionally drying at a temperature of 60 to 300 ° C.
- the flaky heat-resistant material is silylated with a silane coupling agent, a silane compound, etc. in advance, thereby improving compatibility with heat-resistant fluid substances, improving reactivity, etc. This is preferable since the above effect can be obtained.
- a curing aid when dispersing the flaky heat-resistant material and the hydrophobic cationic substance in pure water in the step (1), or in dispersing in an organic solvent in the step (2), a curing aid, It can be done by adding various additives such as antioxidants, surfactants, pigments and leveling agents.
- a flaky heat-resistant material and a heat-resistant fluid substance are dispersed in a solvent, and this is applied to a support to form a film, and then the support and the film are heat-treated.
- the support strength can also be obtained by peeling the film.
- the thin film of the present invention can be used alone as a self-supporting film, an inorganic thin film or an organic thin film is formed on one or both surfaces of the thin film in order to obtain higher gas noria properties, chemical resistance, and surface smoothness.
- a thin film laminate in which at least one of them is laminated in a single layer or multiple layers can be formed.
- the inorganic thin film or organic thin film is not particularly limited, and an optimum one can be selected depending on the application.
- silicon oxide or silicon oxide nitride is sputtered or plasma CV
- the surface can be made flat by applying an organic polymer to form an organic thin film.
- This solution was subjected to solid-liquid separation using a centrifuge to remove the liquid component, and then 50 g of pure water was further added for dispersion and solid-liquid separation. This dispersion / solid-liquid separation was repeated until no foaming occurred, and then water was completely removed by a dryer.
- the hydrophilic exchangeable cation and tetradecyltrimethylammonium ion contained in the clay were exchanged, and an organic clay with swelling property against toluene, which is a nonpolar solvent, was obtained.
- the organoclay obtained above was pulverized, and 5 g of the organoclay was dispersed and swollen in toluene lOOg, and 4 g of dimethylphenyl silicone oil was added as a heat-resistant fluid substance, followed by further dispersion.
- the obtained solution was poured into a fluorine resin container having a flat bottom and a depth of 2 mm. This was allowed to stand in a room temperature atmosphere to volatilize the solvent, and then the solvent was completely removed with a hot air dryer at 150 ° C. to obtain a thin film of this example.
- This thin film can be easily peeled off from the container, and is a transparent and flexible thin film containing silicone oil having a thickness of 100 m.
- Example 3 A thin film of the present invention was obtained in the same manner as in Example 1 except that the hydrophobic cation was octadecyltriphenylphospho-mubromide. [0031]
- Example 3 A thin film of the present invention was obtained in the same manner as in Example 1 except that the hydrophobic cation was octadecyltriphenylphospho-mubromide.
- a thin film of the present invention was obtained in the same manner as in Example 1 except that 2 g of thermosetting epoxy resin was added at the same time when dimethylphenyl silicone oil for forming a clay film was added.
- An ultraviolet curable acrylic resin was applied to both sides of the thin film obtained in Example 2 to a thickness of 2 m. Thereafter, a 60 nm thick silicon oxynitride silicon film was formed on the coated resin using a reactive sputtering apparatus to obtain a thin film laminate of this example.
- a thin film of this example was obtained in the same manner as in Example 2 except that the heat-resistant fluid substance was alkylbenzene (trade name: Grade Alkene 200P, manufactured by Nippon Oil Corporation).
- a thin film of this example was obtained in the same manner as in Example 2 except that poly-a-olefin (trade name: PAO5010 manufactured by Idemitsu Co., Ltd.) was used as the heat-resistant fluid substance.
- poly-a-olefin trade name: PAO5010 manufactured by Idemitsu Co., Ltd.
- Example 2 5 g of the same organized clay as in Example 1 was dispersed and swollen in 100 g of toluene, and the resulting solution was poured into a fluorine resin container having a flat bottom and a depth of 2 mm. This at room temperature After leaving it in the atmosphere to volatilize the solvent, it was further put into a 150 ° C hot air dryer to completely remove the solvent, and a comparative thin film was obtained. This thin film can be easily peeled off from the container, and is a transparent thin film having a thickness of 100 ⁇ m.
- the thin films and thin film laminates produced in Examples 1 to 8 and Comparative Examples 1 to 3 were cut into a size of 3 cm ⁇ 6 cm and evaluated when they were wound around a round bar having a diameter of 20 mm. The results are shown in Table 1.
- a thin film of this example having a thickness of 80 m was obtained in the same manner as in Example 5 except that 5 g of octadecyltriphenylphosphate bromide was used instead of 5 g of tetradecyltrimethylammonium bromide.
- Epoxy-modified dimethylphenyl silicone oil (trade name: X—22-2000, manufactured by Shin-Etsu Chemical Co., Ltd.) Amino-modified dimethyl phenyl silicone oil (trade name: X—22, manufactured by Shin-Etsu Chemical Co., Ltd.) instead of lg — 1660B— 3)
- a thin film of this example having a thickness of 80 ⁇ m was obtained in the same manner as in Example 5 except that lg was used.
- UV curable urethane acrylate made by Nippon Synthetic Chemicals Co., Ltd., trade name: Purple Light UV7600B
- Purple Light UV7600B which is a hard coat material
- Example 5 Disperse and swell 5 g of the organic clay obtained in Example 5 in toluene lOOg, and without applying a heat-resistant fluid substance, separate the solution obtained with an applicator and apply it on the treated PET film. To form a film. Then, it was put into a dryer at 100 ° C., the solvent was removed, and the PET film was peeled off to obtain a comparative thin film having a thickness of 80 ⁇ m.
- the thin film of Comparative Example 4 did not have flexibility due to warpage after bending.
- the thin film of Comparative Example 5 had a linear expansion coefficient of 53 ppmZ ° C and insufficient heat resistance, so that dimensional stability was poor and there was a problem in workability.
- Optical recording media film including optical cards, sealing film for fuel cells, film for solar cells, etc.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Laminated Bodies (AREA)
- Silicates, Zeolites, And Molecular Sieves (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
Claims
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200780011929.2A CN101415551B (zh) | 2006-03-30 | 2007-03-29 | 薄膜及使用该薄膜的薄膜层合体 |
| US12/294,436 US20090233083A1 (en) | 2006-03-30 | 2007-03-29 | Thin film and thin film laminate comprising the same |
| EP07740387.1A EP2030779A4 (en) | 2006-03-30 | 2007-03-29 | THIN FILM AND THESE USING THIN FILMLAMINATE |
| KR1020087016592A KR101446811B1 (ko) | 2006-03-30 | 2007-03-29 | 박막 및 그것을 이용한 박막 적층체 |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006095788A JP4763496B2 (ja) | 2006-03-30 | 2006-03-30 | 薄膜およびそれを用いた薄膜積層体 |
| JP2006-095788 | 2006-03-30 | ||
| JP2006229849A JP4763552B2 (ja) | 2006-08-25 | 2006-08-25 | 粘土薄膜及びその積層体 |
| JP2006-229849 | 2006-08-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2007114289A1 true WO2007114289A1 (ja) | 2007-10-11 |
Family
ID=38563557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2007/056949 Ceased WO2007114289A1 (ja) | 2006-03-30 | 2007-03-29 | 薄膜およびそれを用いた薄膜積層体 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20090233083A1 (ja) |
| EP (1) | EP2030779A4 (ja) |
| KR (1) | KR101446811B1 (ja) |
| TW (1) | TWI422487B (ja) |
| WO (1) | WO2007114289A1 (ja) |
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| EP2496886B1 (en) | 2009-11-04 | 2016-12-21 | SSW Holding Company, Inc. | Cooking appliance surfaces having spill containment pattern and methods of making the same |
| WO2014110780A1 (zh) * | 2013-01-18 | 2014-07-24 | Liu Tajo | 隔阻层结构 |
| US9960302B1 (en) | 2016-10-18 | 2018-05-01 | Tesla, Inc. | Cascaded photovoltaic structures with interdigitated back contacts |
| US10937915B2 (en) | 2016-10-28 | 2021-03-02 | Tesla, Inc. | Obscuring, color matching, and camouflaging solar panels |
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| CN110651428B (zh) | 2018-03-01 | 2023-01-31 | 特斯拉公司 | 用于封装光伏屋顶瓦片的系统和方法 |
| US11431279B2 (en) | 2018-07-02 | 2022-08-30 | Tesla, Inc. | Solar roof tile with a uniform appearance |
| US11082005B2 (en) | 2018-07-31 | 2021-08-03 | Tesla, Inc. | External electrical contact for solar roof tiles |
| US11245354B2 (en) | 2018-07-31 | 2022-02-08 | Tesla, Inc. | Solar roof tile spacer with embedded circuitry |
| US11245355B2 (en) | 2018-09-04 | 2022-02-08 | Tesla, Inc. | Solar roof tile module |
| CN109085272B (zh) * | 2018-09-12 | 2021-04-09 | 中海石油(中国)有限公司 | 一种生物降解成因类油藏中隔层的识别方法 |
| US11581843B2 (en) | 2018-09-14 | 2023-02-14 | Tesla, Inc. | Solar roof tile free of back encapsulant layer |
| US11431280B2 (en) | 2019-08-06 | 2022-08-30 | Tesla, Inc. | System and method for improving color appearance of solar roofs |
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| JP2000259025A (ja) * | 1999-03-10 | 2000-09-22 | Fuji Xerox Co Ltd | 離型剤供給ロール及び離型剤供給装置 |
| JP2002537148A (ja) * | 1999-02-16 | 2002-11-05 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | ポリマーフィルムおよびポリマー剛性容器用のガスバリヤ塗装系 |
| JP2004224815A (ja) * | 2003-01-20 | 2004-08-12 | Fuji Photo Film Co Ltd | ガスバリア性積層フィルムの製造方法及びガスバリア性積層フィルム |
| WO2005023714A1 (ja) * | 2003-09-08 | 2005-03-17 | National Institute Of Advanced Industrial Science And Technology | 粘土膜 |
| JP2006001156A (ja) * | 2004-06-18 | 2006-01-05 | Keiwa Inc | 高バリア性積層シート |
| JP2006057099A (ja) * | 2002-02-06 | 2006-03-02 | Sekisui Chem Co Ltd | 樹脂組成物 |
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| US3067223A (en) * | 1959-07-28 | 1962-12-04 | Shell Oil Co | Organometallic derivatives of acid clays |
| US4683162A (en) * | 1986-04-09 | 1987-07-28 | Essex Group, Inc. | Mica product |
| JPH04288381A (ja) * | 1991-01-23 | 1992-10-13 | Showa Electric Wire & Cable Co Ltd | 耐熱塗料 |
| JPH06187845A (ja) * | 1992-10-07 | 1994-07-08 | Mitsubishi Cable Ind Ltd | 耐熱絶縁電線 |
| JP3355716B2 (ja) * | 1993-09-01 | 2002-12-09 | 住友化学工業株式会社 | 疎水性樹脂組成物の製造方法 |
| JP2000238178A (ja) * | 1999-02-24 | 2000-09-05 | Teijin Ltd | 透明導電積層体 |
| US6770697B2 (en) * | 2001-02-20 | 2004-08-03 | Solvay Engineered Polymers | High melt-strength polyolefin composites and methods for making and using same |
| DE10209521B4 (de) * | 2001-03-08 | 2004-04-08 | Asahi Kasei Kabushiki Kaisha | Harzzusammensetzung |
| CA2441451C (en) * | 2001-03-16 | 2010-01-26 | Toshiyuki Yamamuro | Lightweight clay and manufacturing method thereof |
| KR100704320B1 (ko) * | 2002-02-06 | 2007-04-10 | 세키스이가가쿠 고교가부시키가이샤 | 수지 조성물 |
| JP4046322B2 (ja) * | 2002-07-24 | 2008-02-13 | 日新製鋼株式会社 | 意匠性に優れた耐熱クリアプレコート金属板 |
| JP3993877B2 (ja) * | 2004-06-17 | 2007-10-17 | 大日本印刷株式会社 | 熱転写シート |
| US8283288B2 (en) * | 2005-01-28 | 2012-10-09 | Oji Paper Co., Ltd. | Thermal transfer receiving sheet |
-
2007
- 2007-03-29 WO PCT/JP2007/056949 patent/WO2007114289A1/ja not_active Ceased
- 2007-03-29 EP EP07740387.1A patent/EP2030779A4/en not_active Withdrawn
- 2007-03-29 US US12/294,436 patent/US20090233083A1/en not_active Abandoned
- 2007-03-29 KR KR1020087016592A patent/KR101446811B1/ko active Active
- 2007-03-30 TW TW96111188A patent/TWI422487B/zh active
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| JP2002537148A (ja) * | 1999-02-16 | 2002-11-05 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | ポリマーフィルムおよびポリマー剛性容器用のガスバリヤ塗装系 |
| JP2000259025A (ja) * | 1999-03-10 | 2000-09-22 | Fuji Xerox Co Ltd | 離型剤供給ロール及び離型剤供給装置 |
| JP2006057099A (ja) * | 2002-02-06 | 2006-03-02 | Sekisui Chem Co Ltd | 樹脂組成物 |
| JP2004224815A (ja) * | 2003-01-20 | 2004-08-12 | Fuji Photo Film Co Ltd | ガスバリア性積層フィルムの製造方法及びガスバリア性積層フィルム |
| WO2005023714A1 (ja) * | 2003-09-08 | 2005-03-17 | National Institute Of Advanced Industrial Science And Technology | 粘土膜 |
| JP2006001156A (ja) * | 2004-06-18 | 2006-01-05 | Keiwa Inc | 高バリア性積層シート |
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Also Published As
| Publication number | Publication date |
|---|---|
| TWI422487B (zh) | 2014-01-11 |
| KR101446811B1 (ko) | 2014-10-01 |
| EP2030779A1 (en) | 2009-03-04 |
| US20090233083A1 (en) | 2009-09-17 |
| EP2030779A4 (en) | 2015-05-27 |
| TW200744838A (en) | 2007-12-16 |
| KR20080106162A (ko) | 2008-12-04 |
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