WO1995032493A3 - Arrangement for connecting a drive circuit to a planar display or matrix printer and method for connecting a drive circuit to a planar display or matrix printer - Google Patents
Arrangement for connecting a drive circuit to a planar display or matrix printer and method for connecting a drive circuit to a planar display or matrix printer Download PDFInfo
- Publication number
- WO1995032493A3 WO1995032493A3 PCT/FI1995/000251 FI9500251W WO9532493A3 WO 1995032493 A3 WO1995032493 A3 WO 1995032493A3 FI 9500251 W FI9500251 W FI 9500251W WO 9532493 A3 WO9532493 A3 WO 9532493A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- drive circuit
- planar display
- matrix printer
- arrangement
- mounting area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/22—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of impact or pressure on a printing material or impression-transfer material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
Abstract
The present invention relates to an arrangement on a flexible carrier vehicle for connecting a drive circuit to a planar display or matrix printer and a method for connecting said drive circuit to a planar display or matrix printer. The connection arrangement comprises a mounting area (1) for the drive circuit, output line conductors (2) terminating at said mounting area (1) and input line conductors (5, 6, 7) terminating at said mounting area (1). According to the invention, the connection arrangement includes chaining of the input line conductors (5, 6, 7) of the drive circuit for drive circuits operating in parallel.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FI940289U FI1499U1 (en) | 1994-05-19 | 1994-05-19 | Copying arrangements are required for plans or matrices |
| FIU940289 | 1994-05-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO1995032493A2 WO1995032493A2 (en) | 1995-11-30 |
| WO1995032493A3 true WO1995032493A3 (en) | 1995-12-28 |
Family
ID=8539611
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/FI1995/000251 Ceased WO1995032493A2 (en) | 1994-05-19 | 1995-05-11 | Arrangement for connecting a drive circuit to a planar display or matrix printer and method for connecting a drive circuit to a planar display or matrix printer |
Country Status (2)
| Country | Link |
|---|---|
| FI (1) | FI1499U1 (en) |
| WO (1) | WO1995032493A2 (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2470518A1 (en) * | 1979-11-23 | 1981-05-29 | Thomson Csf | CONNECTION METHOD, FOR MULTIPLEXING ELECTRONIC MICROCIRCUITS, AND WRITTEN READING HEAD AND DISPLAY PANEL USING THE SAME |
| US4288841A (en) * | 1979-09-20 | 1981-09-08 | Bell Telephone Laboratories, Incorporated | Double cavity semiconductor chip carrier |
| JPS63106628A (en) * | 1986-10-23 | 1988-05-11 | Toshiba Corp | Liquid crystal display device |
| US4958911A (en) * | 1988-10-19 | 1990-09-25 | Jonand, Inc. | Liquid crystal display module having housing of C-shaped cross section |
| US4973951A (en) * | 1989-03-09 | 1990-11-27 | Stanley Electric Co., Ltd. | Double-sided display apparatus |
| JPH04173267A (en) * | 1990-11-06 | 1992-06-19 | Nec Niigata Ltd | Led print head |
| US5148595A (en) * | 1990-04-27 | 1992-09-22 | Synergy Computer Graphics Corporation | Method of making laminated electrostatic printhead |
-
1994
- 1994-05-19 FI FI940289U patent/FI1499U1/en active
-
1995
- 1995-05-11 WO PCT/FI1995/000251 patent/WO1995032493A2/en not_active Ceased
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4288841A (en) * | 1979-09-20 | 1981-09-08 | Bell Telephone Laboratories, Incorporated | Double cavity semiconductor chip carrier |
| FR2470518A1 (en) * | 1979-11-23 | 1981-05-29 | Thomson Csf | CONNECTION METHOD, FOR MULTIPLEXING ELECTRONIC MICROCIRCUITS, AND WRITTEN READING HEAD AND DISPLAY PANEL USING THE SAME |
| JPS63106628A (en) * | 1986-10-23 | 1988-05-11 | Toshiba Corp | Liquid crystal display device |
| US4958911A (en) * | 1988-10-19 | 1990-09-25 | Jonand, Inc. | Liquid crystal display module having housing of C-shaped cross section |
| US4973951A (en) * | 1989-03-09 | 1990-11-27 | Stanley Electric Co., Ltd. | Double-sided display apparatus |
| US5148595A (en) * | 1990-04-27 | 1992-09-22 | Synergy Computer Graphics Corporation | Method of making laminated electrostatic printhead |
| JPH04173267A (en) * | 1990-11-06 | 1992-06-19 | Nec Niigata Ltd | Led print head |
Non-Patent Citations (2)
| Title |
|---|
| PATENT ABSTRACTS OF JAPAN vol. 012, no. 354 (P - 761) * |
| PATENT ABSTRACTS OF JAPAN vol. 016, no. 477 (M - 1320) * |
Also Published As
| Publication number | Publication date |
|---|---|
| FIU940289U0 (en) | 1994-05-19 |
| WO1995032493A2 (en) | 1995-11-30 |
| FI1499U1 (en) | 1994-09-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1006505A3 (en) | Flat display device | |
| TW338115B (en) | An LCD system, the manufacture and the electronic unit | |
| ATE208125T1 (en) | MODULAR CONTROL SYSTEM WITH INTEGRATED FIELD BUS CONNECTION | |
| CA2151940A1 (en) | Electrical safety system for electrical device | |
| EP1365488A3 (en) | Submount assembly packaging method | |
| TW229337B (en) | Jack module | |
| AU3105593A (en) | Computer interface board for electronic automotive vehicle service | |
| GB2282244B (en) | Integrated circuit | |
| CA2320417A1 (en) | Applications for electronic reusable paper | |
| WO1997049023A3 (en) | Dynamic device driver | |
| EP0697732A3 (en) | Driving circuit module | |
| CA2157058A1 (en) | Fault identification method and apparatus for use in complex systems | |
| EP0821385A3 (en) | Plasma display device and its manufacturing method | |
| ES2114794A1 (en) | Engine wiring system | |
| CA2097097A1 (en) | Heat sink mounting system for semiconductor devices | |
| CA2135518A1 (en) | Load System | |
| CA2270415A1 (en) | Flexible wearable computer system | |
| AU1151797A (en) | Optical circuit on printed circuit board | |
| EP0909975A3 (en) | Flat type display device and driving method and assembling method therefore | |
| EP0914029A3 (en) | Modular automation apparatus and unit for a modular automation apparatus | |
| CA2230977A1 (en) | Vehicle diagnosing apparatus | |
| CA2152255A1 (en) | Priority Control Method of Virtual Circuit and a Device Thereof | |
| EP1102236A3 (en) | Display apparatus and assembly of its driving circuit | |
| EP0708529A3 (en) | Power switch driver arrangements | |
| PH30714A (en) | Mult-chip electronic package module utilizing and an adhesive sheet. |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AK | Designated states |
Kind code of ref document: A2 Designated state(s): US |
|
| AL | Designated countries for regional patents |
Kind code of ref document: A2 Designated state(s): AT BE CH DE DK ES FR GB GR IE IT LU MC NL PT SE |
|
| AK | Designated states |
Kind code of ref document: A3 Designated state(s): US |
|
| AL | Designated countries for regional patents |
Kind code of ref document: A3 Designated state(s): AT BE CH DE DK ES FR GB GR IE IT LU MC NL PT SE |
|
| DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
| 122 | Ep: pct application non-entry in european phase |