US3898138A - Method and bath for the electrodeposition of nickel - Google Patents
Method and bath for the electrodeposition of nickel Download PDFInfo
- Publication number
- US3898138A US3898138A US515130A US51513074A US3898138A US 3898138 A US3898138 A US 3898138A US 515130 A US515130 A US 515130A US 51513074 A US51513074 A US 51513074A US 3898138 A US3898138 A US 3898138A
- Authority
- US
- United States
- Prior art keywords
- nickel
- per liter
- diol
- grams per
- bath
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title claims abstract description 139
- 229910052759 nickel Inorganic materials 0.000 title claims abstract description 65
- 238000004070 electrodeposition Methods 0.000 title claims description 17
- 238000000034 method Methods 0.000 title claims description 11
- -1 aryl sulfon Chemical compound 0.000 claims abstract description 38
- 239000002253 acid Substances 0.000 claims abstract description 26
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 20
- 230000002378 acidificating effect Effects 0.000 claims abstract description 16
- 238000007747 plating Methods 0.000 claims abstract description 16
- ORTVZLZNOYNASJ-UPHRSURJSA-N (z)-but-2-ene-1,4-diol Chemical compound OC\C=C/CO ORTVZLZNOYNASJ-UPHRSURJSA-N 0.000 claims abstract description 8
- KXUSQYGLNZFMTE-UHFFFAOYSA-N hex-2-yne-1,1-diol Chemical compound CCCC#CC(O)O KXUSQYGLNZFMTE-UHFFFAOYSA-N 0.000 claims abstract description 8
- SIIVGPQREKVCOP-UHFFFAOYSA-N but-1-en-1-ol Chemical compound CCC=CO SIIVGPQREKVCOP-UHFFFAOYSA-N 0.000 claims description 15
- KDKYADYSIPSCCQ-UHFFFAOYSA-N ethyl acetylene Natural products CCC#C KDKYADYSIPSCCQ-UHFFFAOYSA-N 0.000 claims description 12
- 229910021585 Nickel(II) bromide Inorganic materials 0.000 claims description 10
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 claims description 10
- 150000001336 alkenes Chemical class 0.000 claims description 10
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 claims description 10
- IPLJNQFXJUCRNH-UHFFFAOYSA-L nickel(2+);dibromide Chemical compound [Ni+2].[Br-].[Br-] IPLJNQFXJUCRNH-UHFFFAOYSA-L 0.000 claims description 10
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 claims description 9
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 claims description 9
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 claims description 8
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 claims description 5
- IAQRGUVFOMOMEM-UHFFFAOYSA-N butene Natural products CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 claims description 5
- 230000001747 exhibiting effect Effects 0.000 claims description 2
- OOASIASMWXRLKE-UHFFFAOYSA-K nickel(2+) sulfamate sulfate Chemical compound S(=O)(=O)([O-])[O-].[Ni+2].S(N)([O-])(=O)=O.[Ni+2] OOASIASMWXRLKE-UHFFFAOYSA-K 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 abstract description 13
- 239000004615 ingredient Substances 0.000 abstract description 8
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 abstract description 7
- 239000011593 sulfur Substances 0.000 abstract description 7
- 229910052717 sulfur Inorganic materials 0.000 abstract description 7
- RNFNDJAIBTYOQL-UHFFFAOYSA-N chloral hydrate Chemical compound OC(O)C(Cl)(Cl)Cl RNFNDJAIBTYOQL-UHFFFAOYSA-N 0.000 abstract description 5
- 229960002327 chloral hydrate Drugs 0.000 abstract description 5
- 238000009713 electroplating Methods 0.000 abstract description 4
- 150000003839 salts Chemical class 0.000 abstract description 4
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 abstract description 3
- 150000001299 aldehydes Chemical class 0.000 abstract 1
- ZYGHJZDHTFUPRJ-UHFFFAOYSA-N coumarin Chemical compound C1=CC=C2OC(=O)C=CC2=C1 ZYGHJZDHTFUPRJ-UHFFFAOYSA-N 0.000 description 16
- 150000002815 nickel Chemical class 0.000 description 11
- 238000007792 addition Methods 0.000 description 8
- 229960000956 coumarin Drugs 0.000 description 8
- 235000001671 coumarin Nutrition 0.000 description 8
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 6
- XXROGKLTLUQVRX-UHFFFAOYSA-N allyl alcohol Chemical compound OCC=C XXROGKLTLUQVRX-UHFFFAOYSA-N 0.000 description 6
- GVNVAWHJIKLAGL-UHFFFAOYSA-N 2-(cyclohexen-1-yl)cyclohexan-1-one Chemical compound O=C1CCCCC1C1=CCCCC1 GVNVAWHJIKLAGL-UHFFFAOYSA-N 0.000 description 5
- 101150065749 Churc1 gene Proteins 0.000 description 5
- 102100038239 Protein Churchill Human genes 0.000 description 5
- 239000007857 degradation product Substances 0.000 description 5
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 238000009825 accumulation Methods 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 150000002009 diols Chemical class 0.000 description 3
- 238000010348 incorporation Methods 0.000 description 3
- IIACRCGMVDHOTQ-UHFFFAOYSA-M sulfamate Chemical compound NS([O-])(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-M 0.000 description 3
- GOLORTLGFDVFDW-UHFFFAOYSA-N 3-(1h-benzimidazol-2-yl)-7-(diethylamino)chromen-2-one Chemical compound C1=CC=C2NC(C3=CC4=CC=C(C=C4OC3=O)N(CC)CC)=NC2=C1 GOLORTLGFDVFDW-UHFFFAOYSA-N 0.000 description 2
- CJBDUOMQLFKVQC-UHFFFAOYSA-N 3-(2-hydroxyphenyl)propanoic acid Chemical compound OC(=O)CCC1=CC=CC=C1O CJBDUOMQLFKVQC-UHFFFAOYSA-N 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- MKUWVMRNQOOSAT-UHFFFAOYSA-N but-3-en-2-ol Chemical compound CC(O)C=C MKUWVMRNQOOSAT-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000002195 synergetic effect Effects 0.000 description 2
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- PWHVEHULNLETOV-UHFFFAOYSA-N Nic-1 Natural products C12OC2C2(O)CC=CC(=O)C2(C)C(CCC2=C3)C1C2=CC=C3C(C)C1OC(O)C2(C)OC2(C)C1 PWHVEHULNLETOV-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 150000001345 alkine derivatives Chemical class 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- JSPXPZKDILSYNN-UHFFFAOYSA-N but-1-yne-1,4-diol Chemical compound OCCC#CO JSPXPZKDILSYNN-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- KDOWHHULNTXTNS-UHFFFAOYSA-N hex-3-yne-2,5-diol Chemical compound CC(O)C#CC(C)O KDOWHHULNTXTNS-UHFFFAOYSA-N 0.000 description 1
- 159000000003 magnesium salts Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910000008 nickel(II) carbonate Inorganic materials 0.000 description 1
- ZULUUIKRFGGGTL-UHFFFAOYSA-L nickel(ii) carbonate Chemical compound [Ni+2].[O-]C([O-])=O ZULUUIKRFGGGTL-UHFFFAOYSA-L 0.000 description 1
- BFDHFSHZJLFAMC-UHFFFAOYSA-L nickel(ii) hydroxide Chemical compound [OH-].[OH-].[Ni+2] BFDHFSHZJLFAMC-UHFFFAOYSA-L 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
Definitions
- metasulfobenzoic acid or its salts are (1) metasulfobenzoic acid or its salts; (2) butynediol or hexyne diol; and (3) butene diol and butenol alcohols.
- Aldehydesy such as chloral hydrate and formaldehyde, may be added to assist in grain refinement and in reducing the sulfur content of the bath.
- nickel bromide and nickel chloride The nickel salts are present in amounts conventional in the art, e.g., up to about 100 grams per liter of NiCl .6I-I O).
- the patent discloses the addition to such baths of a specific aryl sulfon compound, namely metasulfobenzoic acid or its derivatives, such as Ni-carboxy benzene sulfonic acid can be utilized.
- aldehyde such as chloral hydrate or formaldehyde
- An aldehyde may be added to the patented bath for grain refinement and to reduce the sulfur content of the bath.
- the general purpose of nickel electroplating is to yield a semi-bright deposit having the desirable characteristics of ductility, uniformly fine grained appearance, and good leveling characteristics. Normally, these objectives are met by the use of coumarin and other additives.
- the deposit from a nickel solution containing coumarin generally deteriorates during use due to the gradual accumulation of the degradation products of the coumarin itself. These degradation products, such as melilotic acid and related compounds, are detrimental to the leveling and ductility of the deposit. As a result, these deposits must be removed by batch carbon treatments at periodic intervals, adding to the expense of the operation and normally resulting in time consuming, shortened scheduled production runs.
- the present invention utilizes a specific combination of compounds which results in nickel deposits which are fine grained, lustrous, and ductile and which have markedly improved leveling characteristics. Although the leveling characteristics of the bath of the present invention are not quite as good as those obtained through the use of coumarin, the present invention does permit continuous use of the nickel solution without the accumulation of those deleterious degradation products which are developed in coumarin solutions.
- the deposits from the solutions of the present invention generally contain less than about 0.005% sulfur.
- the present invention is directed to the addition to baths such as those defined in U.S. Pat. No. 3,264,200 of a combination of three specific compositions or compounds.
- the nickel-containing and pl-l-controlling elements of the bath are conventional and may be of any desired type, as defined in the noted patent.
- the bath of the present invention may be of the Watts or modified Watts type containing nickel sulfate; of the sulfamate type; of the nickel fluoborate type; of the nickel bromide type; or of the nickel chloride type.
- the pH of the bath is controlled by the use of boric acid (H 30 and an aldehyde, such as formaldehyde and/or chloral hydrate may be added, as above explained.
- boric acid H 30 and an aldehyde, such as formaldehyde and/or chloral hydrate may be added, as above explained.
- alkyne diol specifically butyne diol (l-IOH CC 5 CCH OH) or 3-l-Iexyne 2, 5 diol CH CH(OH)C 2 CCH(OH) CH being present in an amount ranging from about 0.05 to about 0.5 grams per liter of the bath; and
- an important object of the present invention to provide a bath for the electrodeposition of nickel plate from an aqueous acidic nickel plating bath containing dissolved therein an aryl sulfon, an alkyne diol and a short chain alkene alcohol.
- Another important object of the present invention is the provision of a method of electrodeposition of duetile, low-stress nickel plate having good leveling characteristics and including the step of electrodepositing semi-bright ductile nickel from an aqueous acidic nickel plating bath containing metasulfobenzoic acid or its salts, and a combination of at least one alkyne diol and at least one alkene alcohol containing four carbon atoms.
- Another object of the present invention is the provision of a method of electrodepositing ductile low-stress nickel plate from an aqueous acidic nickel plating bath containing at least one nickel salt and metasulfobenzoic acid or its salts, residing in the improvement of incorporating in the bath a mixture of an alkene diol selected from the group consisting of butyne diol and hexyne diol, and an alkene alcohol selected from the group consisting of butene diol, butenol, and isomeric forms of butenol.
- the present invention constitutes an improvement upon the invention disclosed and claimed in US. Pat. No. 3,264,200, assigned to the assignee of the present invention.
- This improvement resides in the discovery of the synergistic effect which can be obtained from the incorporation of a specific mixture of specific unsaturated alcohols into the aqueous acidic nickel plating baths proposed in said earlier patent.
- the earlier patent proposes the incorporation of metasulfobenzoic acid or the nickel salt of the compound into a bath for the electrodeposition of ductile, semibright nickel plate.
- the mentioned patent discloses the incorporation of from 0.1 to about 10 grams per liter of metasulfobenzoic acid.
- the metasulfobenzoic acid is usually neutralized with nickel hydroxide or nickel carbonate and is added to the bath as a nickel salt. It, however, can be added as the free acid, or as sodium or magnesium salt. If too high a concentration of the free acid is added to the nickel bath at one time, the pH of the bath will be substantially reduced. Therefore, the nickel salt of the acid is the preferred form, where additions of concentrations greater than about one gram per liter are added at one time. It should be understood that when metasulfobenzoic acid is referred to herein, this expression includes the nickel salt of the compound. Even where the free acid is added to the nickel bath, the metasulfobenzoic acid is generally in the form of the nickel salt, or the ionized nickel salt.
- the acetylenic diols which are added are preferably in the simple unreacted diol form, since it has been found that the derivatives thereof, such as the epichlorohydrin adduct of butyne diol are not very effective.
- the two preferred alkyne diols are butyne 1, 4 diol, HOCH CC CCH OH or 3-hexyne 2, 5 diol CH CH(OI-I)C E CCI-I(OH)CH This ingredient is added in an amount ranging from about 0.05 to about 0.5 grams per liter of the solution. Short chained alkene alcohols are used in conjunction with the alkyne diols.
- the alkene alcohols uniformly contain four carbon atoms and, as above noted, are effective whereas other specific unsaturated alcohols do not work in the combination, for example, allyl alcohol (CI-I :CI-ICH Ol-I) is ineffective.
- concentration of the alkyne alcohol and the concentration of the alkene alcohol is defined as falling within the same broad range. It has been found that it is not necessary to use equal amounts of the two compounds, nor is the utilization of a specific combination of compounds within a defined group essential.
- any suitable type of semi-bright nickel plating bath can be utilized, and the herein disclosed, three component combination is effective in sulfamate, fluoborate, bromide, and low chloride (less than 100 grams per liter NiC1 .6H O) baths.
- the preferred pH range is from about 2.8 to about 4.5, and the preferred bath temperature may range from 130 to 140F.
- the cathode current density may be an average of 40 to 60 amps per square foot with air agitation.
- the Examples yielded lustrous, ductile, very low-stressed semi-bright nickel deposits which contain less than about 0.005% sulfur, and which have remarkedly good leveling characteristics.
- the deposit which was obtained had improved leveling characteristics over the corresponding baths of US. Pat. No. 3,264,200.
- a bath for the electrodeposition of ductile, lowstress nickel plate from an aqueous acidic nickel plating bath containing at least one nickel salt selected from the group consisting of nickel sulfate, nickel sulfamate, nickel fluoborate, nickel bromide and nickel chloride, and containing dissolved therein from about 01 to about grams per liter of metsulfobenzoic acid, from about 0.05 to about 0.5 grams per liter of an alkyne diol selected from the group consisting of butyne diol and hexyne diol, and from about 0.05 to about 0.5- grams per liter of an alkene alcohol selected from the group consisting of butene diol, butenol and isomers of buteno].
- a bath for the electrodeposition of ductile low- Ill stress nickel plate from an aqueous acidic nickel plating bath said bath containing at least one nickel salt selected from the group consisting of nickel sulfate, nickel sulfamate, nickel fluoborate, nickel bromide and nickel chloride and containing dissolved therein from about 0.1 to about 10 grams per liter of metasulfobenzoic acid, the improvement of incorporating into said bath a combination of from about 0.05 to about 0.5 grams per liter of an alkyne diol and from about 0.05 to about 0.5 grams per liter of a butene alcohol.
- a method for the electrodeposition of ductle lowstress nickel plate exhibiting improved leveling characteristics comprising the step of electrodepositing semibright ductile nickel from an aqueous acidic nickel plating bath containing at least one nickel salt selected from the group consisting of nickel sulfate, nickel sulfamate, nickel fluoborate, nickel bromide and nickel chloride and having dissolved therein from about 0.1 to about 10 grams per liter of metasulfobenzoic acid, from about 0.05 to about 0.5 grams per liter of an alkyne diol selected from the group consisting of butyne diol and hexyne diol, and from about 0.05 to about 0.5 grams per liter of an alkene alcohol selected from the group consisting of butyne diol, butenol and isomers of butenol.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Priority Applications (11)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US515130A US3898138A (en) | 1974-10-16 | 1974-10-16 | Method and bath for the electrodeposition of nickel |
| CA219,108A CA1045578A (en) | 1974-10-16 | 1975-01-31 | Method and bath for the electrodeposition of nickel |
| FR7504079A FR2288163A1 (fr) | 1974-10-16 | 1975-02-10 | Bains de depot electrolytique de nickel ductile et procedes utilisant ces bains |
| DE2505499A DE2505499C2 (de) | 1974-10-16 | 1975-02-10 | Wäßriges saures Bad für die galvanische Abscheidung von duktilem Nickel |
| AU78178/75A AU484928B2 (en) | 1975-02-13 | Method and bath forthe electrodeposition of nickel | |
| JP50021396A JPS5823477B2 (ja) | 1974-10-16 | 1975-02-20 | ニツケルノデンキトキンホウホウ オヨビ トキンヨク |
| IT48268/75A IT1029808B (it) | 1974-10-16 | 1975-02-20 | Bagno e metodo per elettrodepositare nickel |
| NL7502531A NL7502531A (nl) | 1974-10-16 | 1975-03-04 | Werkwijze voor het electrolytisch neerslaan van nikkel. |
| AR258478A AR210076A1 (es) | 1974-10-16 | 1975-04-23 | Un bano para la electrodeposicion de niquelado |
| BR3346/75A BR7502634A (pt) | 1974-10-16 | 1975-04-30 | Banho para eletrodeposicao de revestimento de niquel e processo para eletrodeposicao de revestimento de niquel |
| GB22316/75A GB1484227A (en) | 1974-10-16 | 1975-05-22 | Method and bath for the electrodeposition of nickel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US515130A US3898138A (en) | 1974-10-16 | 1974-10-16 | Method and bath for the electrodeposition of nickel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US3898138A true US3898138A (en) | 1975-08-05 |
Family
ID=24050093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US515130A Expired - Lifetime US3898138A (en) | 1974-10-16 | 1974-10-16 | Method and bath for the electrodeposition of nickel |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US3898138A (es) |
| JP (1) | JPS5823477B2 (es) |
| AR (1) | AR210076A1 (es) |
| BR (1) | BR7502634A (es) |
| CA (1) | CA1045578A (es) |
| DE (1) | DE2505499C2 (es) |
| FR (1) | FR2288163A1 (es) |
| GB (1) | GB1484227A (es) |
| IT (1) | IT1029808B (es) |
| NL (1) | NL7502531A (es) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2583070A1 (fr) * | 1985-06-11 | 1986-12-12 | Limburgs Galvano Tech Bedri | Procede de protection contre l'usure et la corrosion de pieces en acier, en particulier de cylindres hydrauliques |
| US5269838A (en) * | 1992-04-20 | 1993-12-14 | Dipsol Chemicals Co., Ltd. | Electroless plating solution and plating method with it |
| EP1300487A1 (en) * | 2001-10-02 | 2003-04-09 | Shipley Co. L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
| WO2008154722A1 (en) * | 2007-06-18 | 2008-12-24 | Vale Inco Limited | Method for improving nickel cathode morphology |
| US20110155582A1 (en) * | 2009-11-18 | 2011-06-30 | Tremmel Robert A | Semi-Bright Nickel Plating Bath and Method of Using Same |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102014207778B3 (de) * | 2014-04-25 | 2015-05-21 | Kiesow Dr. Brinkmann GmbH & Co. KG | Verwendung einer Mischung zur Verwendung in einem galvanischen Bad oder eines galvanischen Bades zur Herstellung einer Glanznickelschicht sowie Verfahren zur Herstellung eines Artikels mit einer Glanznickelschicht |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3264200A (en) * | 1964-01-16 | 1966-08-02 | Udylite Corp | Electrodeposition of nickel |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1266377A (fr) * | 1960-09-01 | 1961-07-07 | Metal & Thermit Corp | Dépôt électrolytique de nickel brillant |
-
1974
- 1974-10-16 US US515130A patent/US3898138A/en not_active Expired - Lifetime
-
1975
- 1975-01-31 CA CA219,108A patent/CA1045578A/en not_active Expired
- 1975-02-10 FR FR7504079A patent/FR2288163A1/fr active Granted
- 1975-02-10 DE DE2505499A patent/DE2505499C2/de not_active Expired
- 1975-02-20 JP JP50021396A patent/JPS5823477B2/ja not_active Expired
- 1975-02-20 IT IT48268/75A patent/IT1029808B/it active
- 1975-03-04 NL NL7502531A patent/NL7502531A/xx not_active Application Discontinuation
- 1975-04-23 AR AR258478A patent/AR210076A1/es active
- 1975-04-30 BR BR3346/75A patent/BR7502634A/pt unknown
- 1975-05-22 GB GB22316/75A patent/GB1484227A/en not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3264200A (en) * | 1964-01-16 | 1966-08-02 | Udylite Corp | Electrodeposition of nickel |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2583070A1 (fr) * | 1985-06-11 | 1986-12-12 | Limburgs Galvano Tech Bedri | Procede de protection contre l'usure et la corrosion de pieces en acier, en particulier de cylindres hydrauliques |
| US5269838A (en) * | 1992-04-20 | 1993-12-14 | Dipsol Chemicals Co., Ltd. | Electroless plating solution and plating method with it |
| EP1300487A1 (en) * | 2001-10-02 | 2003-04-09 | Shipley Co. L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
| US6773573B2 (en) | 2001-10-02 | 2004-08-10 | Shipley Company, L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
| WO2008154722A1 (en) * | 2007-06-18 | 2008-12-24 | Vale Inco Limited | Method for improving nickel cathode morphology |
| US20110155582A1 (en) * | 2009-11-18 | 2011-06-30 | Tremmel Robert A | Semi-Bright Nickel Plating Bath and Method of Using Same |
| WO2012121829A1 (en) * | 2011-03-09 | 2012-09-13 | Macdermid Acumen, Inc. | Semi-bright nickel plating bath and method of using same |
| CN103415653A (zh) * | 2011-03-09 | 2013-11-27 | 麦克德米德尖端有限公司 | 半光亮镍电镀浴及使用其的方法 |
| EP2683853B1 (en) | 2011-03-09 | 2017-10-11 | MacDermid Acumen, Inc. | Semi-bright nickel plating bath and method of using same |
Also Published As
| Publication number | Publication date |
|---|---|
| AR210076A1 (es) | 1977-06-30 |
| FR2288163B1 (es) | 1979-06-29 |
| JPS5823477B2 (ja) | 1983-05-16 |
| DE2505499C2 (de) | 1982-01-21 |
| DE2505499A1 (de) | 1976-04-29 |
| GB1484227A (en) | 1977-09-01 |
| FR2288163A1 (fr) | 1976-05-14 |
| NL7502531A (nl) | 1976-04-21 |
| CA1045578A (en) | 1979-01-02 |
| IT1029808B (it) | 1979-03-20 |
| JPS5147538A (en) | 1976-04-23 |
| AU7817875A (en) | 1976-08-19 |
| BR7502634A (pt) | 1976-08-31 |
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| AS | Assignment |
Owner name: HOOKER CHEMICALS & PLASTICS CORP. Free format text: MERGER;ASSIGNOR:OXY METAL INDUSTRIES CORPORATION;REEL/FRAME:004075/0885 Effective date: 19801222 |
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