US20060180297A1

US20060180297A1 - Conductor pipe of a temperature conductor

Info

Publication number: US20060180297A1
Application number: US11/056,427
Authority: US
Inventors: Hung-Tao Peng
Original assignee: Individual
Current assignee: Individual
Priority date: 2005-02-14
Filing date: 2005-02-14
Publication date: 2006-08-17

Abstract

The conductor pipe of a temperature conductor generally includes a conduction seat frame and a complex group of conductor pipes. And, the conduction seat frame is provided with an expanded surface and a narrow surface, whereas a mounting surface at one side can be mounted onto some heating units. The connecting side of conductor pipe is fixed into the conduction seat frame. The conductor pipes are radially arranged on expanded surface of conduction seat frame, while the end of conductor pipes spreads out spatially. Moreover, the conductor pipe is designed with spiral or curved profiles. Based on this innovative design, the number of installed and distributed conductor pipes can be multiplied considerably, so the conductor pipe offers a maximum piping length within a limited space, thereby promoting significantly temperature transfer effect thanks to its higher practicability.

Description

RELATED U.S. APPLICATIONS

Not applicable.

STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT

Not applicable.

REFERENCE TO MICROFICHE APPENDIX

Not applicable.

FIELD OF THE INVENTION

The present invention relates generally to a temperature conductor, and more particularly to a temperature conductor designed with innovative heat pipes.

BACKGROUND OF THE INVENTION

The temperature conductor of present invention generally refers to a device featuring heat-sinking, heating or cooling capability, e.g. heating modules of electronic elements (such as computer CPU). It is typically composed of a seat frame and heat pipes or radiating fins on the seat frame. The present invention is primarily to give an idea of how to combine the heat pipe with seat frame. Typically, this device is designed with a combined structure of a single heat pipe and a seat frame. However, such structure is normally applied to small-sized electronics due to limited heat-radiating effect. To meet the requirements of demanding environment for higher heat-radiating effect, the seat frame shall be fitted with some groups of heat pipes. According to a combined structure of heat pipes and seat frame, every group of heat pipes is laterally mounted at one side of seat frame. But, owing to the flat-type block design of seat frame, there is available with a spatial structure incorporating expanded top and bottom surfaces and a restricted lateral surface, leading to a limited permissible arrangement of heat pipes.
Besides, the conventional heat pipes are generally designed with straight or curved pipes, so they are only installed within a space of limited length. In the event of an extremely narrow space, the length of heat pipe must be shortened, thus generating possibly an undesirable heat-radiating effect.
Thus, to overcome the aforementioned problems of the prior art temperature conductor, it would be an advancement in the art to provide an improved one of higher availability.
To this end, the inventor has provided the present invention of practicability after deliberate design and evaluation based on years of experience in the production, development and design of related products.

BRIEF SUMMARY OF THE INVENTION

1. Based on innovative design that conductor pipes are mounted into expanded surface 12 of conduction seat frame 10, the number of installed and distributed conductor pipes can be multiplied considerably, thereby optimizing temperature conductivity in terms of heat-radiation, heating or cooling constructions.
2. Based on the design that conductor pipe is designed with curved or spiral profiles, it is possible to offer a maximum length within a limited installation space, leading to enhanced temperature conductivity.
3. Thanks to a combined design of conductor pipe and conduction plate, it is feasible to enlarge the conduction area for an increased temperature transfer effect.
4. Based on the spatial design that the shared groove chamber and various conductor pipes are connected within conduction seat frame, vacuum pumping can be performed against any conductor pipe to achieve the vacuum state of conductor pipes and shared groove chamber, thus saving considerably the manufacturing time and process of temperature conductors in a cost-effective manner.
5. Based on the unique design that capillary tissues are built-in the shared groove chamber of conduction seat frame, it is possible to transfer the capillary tissues from conductor pipe to shared groove chamber for an enhanced temperature transfer effect. And, thanks to a wider area of shared groove chamber than conductor pipe, capillary tissues function more easily and rapidly, thereby achieving a higher economical efficiency.
The above is a detailed description of the technical features of the present invention based on a typical preferred embodiment. However, it should be appreciated that the present invention is capable of a variety of embodiments and various modifications by those skilled in the art, and all such variations or changes shall be embraced within the scope of the following claims.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

FIG. 1 shows a decomposed perspective view of the preferred embodiment of the present invention.
FIG. 2 shows a vertical plane view of the preferred embodiment of the present invention.
FIG. 3 shows a combined cutaway view of the preferred embodiment of the present invention and the diagram of the flow of vacuum pumping.
FIG. 4 shows a decomposed perspective view of another preferred embodiment of the present invention.
FIG. 5 shows the preferred embodiment of the conduction plate.
FIG. 6 shows another preferred embodiment of the conduction plate.

DETAILED DESCRIPTION OF THE INVENTION

The features and the advantages of the present invention will be more readily understood upon a thoughtful deliberation of the following detailed description of a preferred embodiment of the present invention with reference to the accompanying drawings.
As shown in FIGS. 1-3, a conductor pipe of a temperature conductor embodied in the present invention comprises:
a conduction seat frame 10, designed with a flat-type block structure, is provided with a spatial construction incorporating expanded top and bottom surfaces and a restricted lateral surface. A mounting surface 11 at the bottom can be mounted onto preset heating units, e.g. CPU or other electronic elements of computers;
a complex group of conductor pipes 20 with hollow piping. A connecting side 21 is linked to the plughole 101 radially arranged on expanded surface 12 top surface in this embodiment of conduction seat frame 10. And, the conductor pipe 20 is designed with a spiral profile (as shown in FIG. 1), or the conductor pipe 20B designed with a curved profile as shown in FIG. 4. So, the conductor pipe offers a maximum length within a limited installation space;
A close-type shared groove chamber 30 is placed within the conduction seat frame 10 that allows the connecting side 21 of conductor pipes 20 to be connected to the shared groove chamber 30. As shown in FIG. 3, vacuum pumping is performed for any optional conductor pipe 20, while other conductor pipes and shared groove chamber are pumped out simultaneously.
A capillary tissue 40 is additionally installed within the shared groove chamber 30 of conduction seat frame 10. The so-called capillary tissue includes fiber cotton, cloth, blanket, metal, porcelain and glass.
As shown in FIG. 3, the shared groove chamber 30 of conduction seat frame 10 is designed with a groove 13 at mounting surface 11. And, a cover plate 31 is mounted at the open end of groove 13 for air-tightness. The cover plate 31 can be used for sealing by means of gumming, welding and screwing, as demonstrated by screw bolt 32 in this preferred embodiment.
Also, the conductor pipe 20 is provided with a conduction plate 22, whereby an enlarged conduction area can improve the conduction effect. As shown in FIG. 5, the conduction plate 22 is mounted onto a spiral conductor pipe 20, where this plate is designed with a cylinder. Also, as shown in FIG. 6, the conduction plate 22B is mounted onto a curved conductor pipe 20B, where this plate is designed with a flat profile fixed at one side of the conductor pipe.
Additionally, the temperature conductors of present invention are applied to both heat-radiating units and other heating or cooling units.

Claims

1. A conductor pipe of a temperature conductor comprising:

a conduction seat frame with an expanded surface and a narrow surface, a mounting surface at one side being mounted onto preset heating units, a complex group of conductor pipes, with connecting side of conductor pipes being linked to the conduction seat frame; and

a connecting side being radially arranged on the expanded surface while an end thereof spreads out spatially;

having a unique shape with spiral or curved profiles, offering a maximum length within a limited installation space.

2. A conductor pipe of a temperature conductor as defined in claim 1, wherein said conductor pipe is mounted onto the conduction plate.

3. A conductor pipe of a temperature conductor, comprising:

a connecting side of conductor pipe radially arranged on top of conduction seat frame opposite to the mounting surface, while the end of conductor pipe spread out spatially;

the conductor pipe having spiral or curved profiles;

the conduction seat frame being internally fitted with a close-type shared groove chamber, such that connecting side of conductor pipes are linked to the shared groove chamber.

4. A conductor pipe of a temperature conductor as defined in claim 3, wherein said conductor pipe is mounted onto the conduction plate.

5. A conductor pipe of a temperature conductor as defined in claim 3, wherein a shared groove chamber of said conduction seat frame is comprised of a groove at the mounting surface, and a cover plate is mounted at the open end of groove.

6. A conductor pipe of a temperature conductor as defined in claim 3, wherein capillary tissues are built-in the shared groove chamber of said conduction seat frame.