TWM610096U - Flexible heat dissipation device - Google Patents

Abstract

This invention creates a flexible heat dissipation device, including an evaporator, a vapor tube, a liquid tube, and a condenser. The evaporator has at least one vapor chamber containing a capillary structure and a working fluid. One end of the vapor tube One end of the evaporator is connected, and the other end of the evaporator is connected to a condenser. The two ends of the liquid pipe respectively communicate with the evaporator and the condenser and form a loop with the vapor pipe. At least one corrugated section is provided in either of the vapor pipe and the liquid pipe. For one or both, the corrugated section has a plurality of corrugations, and one or more of the height, width, and spacing of the plurality of corrugations are the same or different from each other.

Description

Flexible heat sink

This creation relates to a flexible heat dissipation device, especially a flexible heat dissipation device that can achieve a bending effect and absorb the bridging force of a pipeline.

With the continuous improvement of the power of electronic components such as the central processing unit, the heat dissipation problem has attracted more and more attention. The loop heat pipe is used as an effective heat transfer element in the field of heat dissipation due to its efficient heat conduction performance. Generally, the current general loop heat pipe includes an evaporating part, a condensing part, and a vapor pipe and a liquid pipe arranged between the evaporating part and the condensing part. The vapor pipe and the liquid pipe connect the evaporation part and the condensing part into a circuit, and the circuit is filled with pure water. The evaporation part is connected with a heating element (such as a central processing unit or a graphics processing unit). When the evaporating part of the loop heat pipe absorbs the heat from the heating element and receives heat, the pure water in it absorbs the heat and evaporates and expands into a gaseous state, flows through the steam pipe to the condensing part of the loop heat pipe, and radiates heat at the condensing part to condense and shrink to become In a liquid state, the condensed working medium returns to the evaporation part through the liquid pipe to complete a cycle. In this way, the pure water repeatedly evaporates and condenses, continuously absorbs and releases heat, so as to achieve the purpose of heat exchange. However, there are multiple electronic components (such as capacitors, transistors, resistors, inductances) around the heating elements on the motherboard in electronic devices (such as servers or communication chassis), and there will be a gap between the heating elements and other surrounding electronic components. The height difference, the vapor tube and liquid tube of the loop heat pipe must be designed in advance to avoid the multiple electronic components on the motherboard, so that the vapor tube, liquid tube and the condensing part can be placed, so that the loop heat pipe cannot be applied. On motherboards of various specifications or models, and because the vapor tube and the liquid tube bypass multiple electronic components, the problem of increased cost will be caused. In addition, the flatness of the outer surface of the evaporator attached to the heating element and the flatness of the outer surface of the condensing part assembled and fixed on a fixed platform are not at the same level, and the evaporating part and the condensing part are transparent. Inflexible (not bendable) non-flexible metal (through straight copper pipe welding) material vapor pipe and liquid pipe are connected to these pipes and the distance between the pipes is long, so that the evaporation part and the condensing part are flat on the assembly The degree is difficult to control. If the evaporator and the condensing part are assembled in two positions (that is, the heating element and the fixed platform), the flatness is different, it will cause the bridging force generated by the aforementioned pipeline to pull the evaporator and the condensing part. The problem that the contact surface of the evaporating part and the heating element cannot be in perfect contact with each other, and the contact surface of the condensing part and the fixed platform cannot be in perfect contact with each other.

One purpose of this creation is to provide a flexible heat dissipation device that can bend and absorb the bridging force of the pipeline. Another purpose of this creation is to provide an assembly that allows an evaporator and a heating element to be in contact with each other in a perfectly flat contact surface, and a condenser and a component in an electronic device to be in contact with each other. Flexible heat sink for stick contact. Another purpose of this creation is to provide a method that uses either or both of a vapor tube and a liquid tube to be provided with at least one corrugated section. The corrugated section can be bent and deformed in any angle or direction to make the vapor The tube and the condenser tube can be a flexible heat sink that can assemble, align and adjust the height difference corresponding to the evaporator, condenser, heating element and components. In order to achieve the above objective, this invention provides a flexible heat dissipation device, including an evaporator, a vapor tube, a condenser, and a liquid tube. The evaporator has at least one vapor chamber, a liquid inlet, and a vapor outlet. The vapor chamber contains at least one capillary structure and a working fluid, the liquid inlet and the vapor outlet are respectively connected to the vapor chamber, one end of the vapor tube is connected to the vapor outlet, and the other end of the vapor tube is connected to the condensation The two ends of the liquid pipe are respectively connected to the evaporator and the condenser, so that the evaporator, the vapor pipe, the condenser, and the liquid pipe form a circuit of the working fluid, and at least one corrugated section is arranged on the vapor pipe and the condenser. For any one or both of the liquid pipes, the corrugated section has a plurality of corrugations, and one or more of the height, width, and spacing of the plurality of corrugations are the same or different from each other. This creation also provides a flexible heat dissipation device, including an evaporator, at least one corrugated section, and a vapor-liquid return pipe. The evaporator has a vapor chamber, a liquid inlet and a vapor outlet, and the vapor chamber contains a capillary. Structure and a working fluid, the liquid inlet and the vapor outlet are respectively connected to the vapor chamber, the vapor-liquid return pipe is provided with a vapor section and a liquid section, one end of the vapor section and the liquid section respectively communicates the vapor outlet and the Liquid inlet, the other end of the vapor section is integrally extended outward and connected to the other end of the liquid section to form a condensation section, the condensation section is provided with a condensing element, and at least one corrugated section is provided in the vapor section and the liquid section Either or both, and the corrugated section has a plurality of corrugations, and one or more of the width, height, and spacing of the plurality of corrugations are the same or different from each other. The liquid tube is provided with a tube body capillary structure, and the tube body capillary structure is arranged on the inner surface of the liquid tube. Through the design of the above-mentioned embodiments of this creation, the effect of bending (bending) and absorbing the bridging force of pipelines can be achieved, and it can also be applied to circuits in various electronic devices (such as servers, computers or communication cases) Electronic components with different height differences on the board are used to effectively allow the evaporator to closely fit the heating element.

The above-mentioned purpose of this creation and its structural and functional characteristics will be described based on the preferred embodiments of the accompanying drawings. This creation provides a flexible heat sink, please refer to Figures 1A to 3, the flexible heat sink 1 can be, for example, a loop heat pipe (or loop heat pipe; LHP) or a two-phase thermosyphon loop system (LTS) The flexible heat sink 1 includes an evaporator 11, a vapor tube 12, a condenser 13, at least one corrugated section 16 and a liquid tube 14. The evaporator 11 is connected to an electronic device (such as a server, a computer) Or a communication chassis) in a circuit board 4 (such as a motherboard) with a heating element 42 (such as a central processing unit or a graphics processor) closely attached, and the circuit board 4 further includes a plurality of electronic components 41 with different heights (Such as capacitors, resistors, inductors or transistors) are arranged around the heating element 42. The evaporator 11 is provided with a shell 111, at least one vapor chamber 113, a liquid inlet 115 and a vapor outlet 116. The shell 111 is made of metal material (such as stainless steel, titanium, aluminum, copper or other metals) , And the inner wall of the shell 111 defines the at least one vapor chamber 113, the vapor chamber 113 contains at least one capillary structure 114 and a working fluid, the capillary structure 114 is a porous structure, which can be sintered powder , Fine grooves, woven mesh, fiber or braided body or any combination of the above composite capillary structure, and the capillary structure 114 is illustrated in this embodiment as a woven mesh, but it is not limited thereto. The working fluid is pure water, methanol, distilled water or a mixture thereof, and the vapor-liquid phase change mechanism of the working fluid is used to achieve heat transfer. In this implementation, the liquid inlet 115 and the vapor outlet 116 are respectively opened on the same side of the housing 111, and the liquid inlet 115 is located above the vapor outlet 116, but it is not limited to this. When the creation is actually implemented The liquid inlet 115 and the vapor outlet 116 can also be arranged on opposite sides of the casing 111 respectively. And the liquid inlet 115 and the vapor outlet 116 are respectively connected to the vapor chamber 113, a vapor channel 112 is defined between the vapor chamber 113 in the housing 111 and the corresponding vapor outlet 116, and the vapor channel 112 is connected to the vapor The outlet 116 and one end of the steam pipe 12 allow the steam generated after the working fluid is evaporated to enter the steam pipe 12 through the steam channel 112 through the steam outlet 116. The vapor tube 12 and the liquid tube 14 are made of metal materials (such as stainless steel, titanium, aluminum, copper or other metals). One end of the vapor tube 12 is connected to the vapor outlet 116 of the housing 111 to make the vapor One end of the tube 12 communicates with the vapor outlet 116 and the vapor chamber 113, and the other end of the vapor tube 12 communicates with the condenser 13, which is connected to a component in the electronic device (such as a fan frame or a heat-dissipating fixed platform) Connected to each other, the condenser 13 (which can be a cold row or a water row) in this embodiment has a vapor inlet 131, a liquid outlet 132, a vapor-liquid mixing channel 133, and a plurality of radiating fins 134. The vapor-liquid mixing The channel 133 extends from the vapor inlet 131 toward the upper liquid outlet 132 to connect to the liquid outlet 132 and communicate with each other. The plurality of heat dissipation fins 134 are arranged on the outer surface of the top of the condenser 13 at intervals. The other end is connected to the steam inlet 131 and communicated. And one end and the other end of the liquid pipe 14 are respectively connected to the liquid outlet 132 and the liquid inlet 115 and communicated with each other, so that the two ends of the liquid pipe 14 are respectively connected to the evaporator 11 and the condenser 13, so that the evaporator 11. The vapor pipe 12, the condenser 13 and the liquid pipe 14 form a circuit through which the working fluid flows. Therefore, when the evaporator 11 absorbs the heat from the heating element 42, the working fluid in the evaporator 11 is heated and evaporated to produce the working fluid of the vapor, and then pushes the working fluid of the vapor in the vapor channel 112 through the pressure difference The vapor outlet 116 flows through the vapor pipe 12 through the vapor inlet 131 to the vapor-liquid mixing channel 133 of the condenser 13, and the condenser 13 and the plurality of heat dissipation fins 134 absorb the heat of the working fluid of the vapor and condense it. Then it is converted into a liquid working fluid, so that the liquid working fluid flows back through the liquid outlet 132 through the smooth inner surface 145 in the liquid pipe 14 and enters the vapor chamber 113 of the evaporator 11 through the liquid inlet 115 for the next step. cycle. The connection between the vapor tube 12 and the liquid tube 14 and the evaporator 11 and the condenser 13 respectively can be welding, embedding or bonding. At least one corrugated section 16 is provided on either or both of the vapor tube 12 and the liquid tube 14. In this embodiment, the corrugated section 16 is provided on the vapor tube 12 and the liquid tube 14 respectively. The two ends of the section 16 are respectively connected to a straight section 15. The corrugated section 16 has a plurality of corrugations 161, which can be arranged at intervals or continuously, and the plurality of corrugations 161 are staggered with a plurality of concavities and convexities or a plurality of crests and troughs staggered. Because the corrugated section 16 itself has the functions of being bendable, facing concavely (in a U shape), good elasticity and shock absorption. In a feasible embodiment, the corrugated section 16 can be arranged on the vapor tube 12 or the liquid tube 14. In this embodiment, at least one of the vapor tube 12 and the liquid tube 14 has a smooth inner surface, or a tube capillary structure is provided on the inner surface of the tube diameter. In addition, one or more of the height X, the width Y, and the spacing 181 of the plurality of corrugations 161 are the same or different from each other, and the spacing 181 of the plurality of corrugations 161 can be arranged equidistantly or non-equally. Each corrugation 161 has a corrugated top end 1611 and a corrugated bottom end 1612, and the corrugated bottom end 1612 is located adjacent to an outer surface 124, 144 of each of the vapor tube 12 and the liquid tube 14 (that is, on the same outer surface 124, 144). The horizontal plane or a horizontal plane higher/lower than the outer surfaces 124 and 144), the corrugated top 1611 protrudes from the outer surfaces 124 and 144 of the vapor tube 12 and the liquid tube 14 respectively. And the height X of the corrugation 161 is defined between the top end 1611 of the corrugation and the bottom end 1612 of the corrugation. Refer to the figures, the height X of the plurality of corrugations 161 are the same or different from each other. For example, the height X of the plurality of corrugations 161 gradually decreases from high to the middle from the two sides of the corrugated section 161, that is, in the middle of the corrugated section 16. The height of the corrugations 161 is relatively short, and the height X of the corrugations 161 on both sides of the corrugation section 16 gradually becomes higher. Since the corrugations 161 located in the middle of the corrugated section 16 have a shorter height X than the corrugations 161 on both sides of the corrugated section 16, the multiple corrugations 161 inside the bend of the corrugated section 16 will not interfere, making it possible to bend in any angle or direction The effect of (bending) or folding in half and improving the problem of limited bending angle, and can also be used with various circuit boards 4 and electronic components 41 with different heights on the circuit board 4. In a possible embodiment, referring to Fig. 3, supplemented by referring to Figs. 1C and 1D, it is mainly to change the liquid pipe 14 and the vapor pipe 12 of the above embodiment into a single loop pipe. The two ends of the pipe are connected to the evaporator 11. The liquid inlet 115 and the vapor outlet 116 are called vapor-liquid return pipe 2 for convenience in the following description. The vapor-liquid return pipe 2 is provided with a vapor section 21 and a liquid section 22, and one end of the vapor section 21 and the liquid section 22 The vapor outlet 116 is connected to the liquid inlet 115 and the vapor chamber 113 respectively. The other end of the vapor section 21 extends outwardly and integrally connected to the other end of the liquid section 22 to form a condensation section 23. The condensation section 23 A condensing element 3 (such as a plurality of radiating fins) is provided outside, and at least one corrugated section 16 is provided in either or both of the vapor section 21 and the liquid section 22. In this embodiment, the corrugated section 16 represents two corrugations. The corrugations 161 in each section 16 with plural intervals (or continuous) are arranged in the vapor section 21 and the liquid section 22 respectively. The characteristics of the corrugation section 16 (ie, the height X, width Y, and spacing 181 of the corrugations 161 can be the same or Those that are different) are the same as the aforementioned corrugated section 16, so they will not be described. In addition, it should be noted that the plurality of corrugations 161 of the corrugated section 16 are annular corrugations, and the corrugations 161 are also in the form of a closed circular ring surrounding the steam tube 12 and the liquid tube 14. In another implementation, the plurality of corrugations 161 are spiral corrugations, that is, the corrugations are arranged in a spiral shape around the tube body of the vapor tube 12 and the liquid tube 14. Referring to the figures, when the flexible heat sink 1 is assembled on the electronic device, after the evaporator 11 is attached to the heating element 42, the corrugated section 16 of one of the vapor tube 12 and the liquid tube 14 can be Make any angle or direction bending (such as up, down, left, right bending) deformation adjustment, through the plurality of corrugations 161 has a better elasticity, so that it has a stretchable length, can bypass the higher electronics around the heating element 42 At the same time, the element 41 can absorb the pulling force of the evaporator 11 and the condenser 13 caused by the bridging force generated by the respective pipelines of the vapor tube 12 and the liquid tube 14 through the corrugated section 16.

1: Flexible heat sink 11: Evaporator 111: shell 112: Steam channel 113: Steam Chamber 114: Capillary structure 115: liquid inlet 116: steam outlet 12: Steam pipe 124, 144: outer surface 125, 145: inner surface 13: Condenser 131: Steam inlet 132: Liquid outlet 133: Vapor-liquid mixing channel 134: heat sink fins 14: Liquid tube 15: straight section 16: corrugated section 161: Ripple 1611: corrugated top 1612: corrugated bottom 181: Spacing 2: Vapor-liquid return pipe 21: Steam section 22: Liquid section 23: Condensing section X: height Y: width 3: Condensing element 4: circuit board 41: Electronic components 42: heating element

Figure 1A is a three-dimensional assembly schematic diagram of the flexible heat dissipation device of the first embodiment of creation. Figure 1B is a schematic cross-sectional view of the flexible heat dissipation device according to the first embodiment of the creation. Figure 1C is a partial enlarged schematic diagram of the cross-section of the vapor tube and the liquid tube in Figure 1B of the creation. Figure 1D is a partial enlarged schematic diagram of the cross-section of the corrugated section in Figure 1B of the creation. Figure 2 is a schematic diagram of the implementation of the flexible heat dissipation device in the first embodiment of the creation as an electronic device. Figure 3 is a schematic diagram of a three-dimensional combination of a possible embodiment of the first embodiment of the creation.

1: Flexible heat sink

11: Evaporator

111: shell

12: Steam pipe

15: straight section

13: Condenser

134: heat sink fins

14: Liquid tube

16: corrugated section

161: Ripple

Claims (7)

A flexible heat dissipation device, including: A condenser An evaporator having at least one vapor chamber, a liquid inlet and a vapor outlet, the vapor chamber contains a capillary structure and a working fluid, the liquid inlet and the vapor outlet are respectively connected to the vapor chamber; A steam pipe, one end of which is connected to the steam outlet, and the other end of the steam pipe is connected to the condenser; A liquid pipe, both ends of which are respectively connected to the evaporator and the condenser, so that the evaporator, the vapor pipe, the condenser, and the liquid pipe form a loop of the working fluid; and At least one corrugated section is provided in either or both of the vapor tube and the liquid tube. The corrugated section has a plurality of corrugations, and the height, width and spacing of the plurality of corrugations are the same or different from each other. For the flexible heat dissipation device described in claim 1, wherein each of the corrugations has a corrugated top end and a corrugated bottom end, and the corrugated bottom end is located on an outer surface of each of the vapor tube and the liquid tube. The top of the corrugation protrudes from the outer surface of the vapor tube and the liquid tube. In the flexible heat dissipation device described in item 2 of the scope of patent application, the height of each corrugation is defined between the top end of the corrugation and the bottom end of the corrugation. The flexible heat dissipation device described in item 1 of the scope of patent application, wherein the liquid tube is provided with a tube body capillary structure, and the tube body capillary structure is arranged on the inner surface of the liquid tube. In the flexible heat dissipation device described in item 1 of the scope of patent application, the plurality of corrugations are annular corrugations or spiral corrugations. In the flexible heat dissipation device described in item 1 of the scope of patent application, the height of the plurality of corrugations gradually decreases from high to the middle from both sides of the corrugated section. The flexible heat dissipation device described in item 1 of the scope of patent application, wherein the capillary structure is a composite capillary structure of sintered powder, fine grooves, woven mesh, fiber, or any combination of the foregoing.

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