TWM604059U - Anti-warpage fixing device for substrate - Google Patents

Abstract

A substrate anti-warping fixing device includes a main body for holding a semiconductor substrate. The main body is provided with multiple partitions. Each partition can provide a semiconductor substrate to be placed on the side opposite to the semiconductor substrate. An auxiliary jig is provided. The auxiliary jig includes a cover body, and one end of the cover body corresponding to the main body is provided with a plurality of tongue plates. When in use, the tongue plates cooperate with the partitions to clamp and fix the semiconductor substrate, In addition, the aforementioned two are used to generate a pressing force, which can maintain the flatness of the semiconductor substrate and prevent warpage during the baking process and the heat-releasing process, thereby improving the product yield.

Description

Anti-warping fixing device for substrate

This new model relates to semiconductor equipment, and in particular refers to a substrate anti-warping fixing device, which can stably clamp the substrate when the semiconductor substrate enters the oven for drying, preventing deformation and increasing output.

The anti-warping jig currently used in substrate packaging is shown in Fig. 1, and mainly consists of a box body 100 with a chamber 101 inside, and a plurality of symmetrically arranged partitions 102 in the chamber 101 , The substrate 103 is placed on the partitions 102 and sent to an oven for drying to remove moisture from the substrate 103.

As shown in Figure 2, when the substrate 103 is baked, sometimes the substrate 103 may be deformed due to water vapor or uneven heating. When the substrate is deformed, it will fall off the partition 102 and press the substrate 103 below. The problems of low yield and poor yield are caused by the above.

In order to solve the aforementioned problems, as shown in FIG. 2, the current solution by the industry is to space the substrate 103 at least one to two spacers 102 apart to prevent the deformed substrate 103 from being pressed against the substrate 103 below; but with this method Therefore, the number of anti-warpage jigs for substrate packaging that can be placed in the substrate 103 is greatly reduced, resulting in a decline in output.

How to improve the lack of customary structure is a goal that the relevant industry actively researches and wants to overcome as soon as possible.

The main purpose of the present invention is to provide a substrate anti-warping fixing device. An auxiliary jig is provided on the other side of the main body. When the substrate is put into the main body, the auxiliary jig is used to clamp the substrate so that the substrate will not be The partition of the main body falls off, greatly increasing the stability of the fixture.

The secondary purpose of the present invention is to provide a substrate anti-warping fixing device, which can control the deformation and shedding of the substrate by using an auxiliary jig, and further improve the yield and output.

The structure that can achieve the above-mentioned purpose mainly includes: a main body with a chamber inside the main body, and a plurality of symmetrical partitions are arranged on the left and right sides of the chamber. Each layer of the aforementioned partitions can hold a semiconductor Substrate; characterized by:

The main body has a first end for inserting the semiconductor substrate and a second end for assembling an auxiliary jig;

The aforementioned second end is provided with a connecting portion for assembling the auxiliary jig;

The auxiliary jig includes: a cover, a movable push plate, a positioning block and an elastic body;

The aforementioned cover body is used to close the second end. The cover body has a straight surface with several through openings. A plurality of symmetrical tongue plates are provided on the side of the cover body connected to the second end. The tongue plates can just abut against the partitions. When the partitions are placed with the semiconductor substrates, the tongue plates press the semiconductor substrates so that the semiconductor substrates are covered by the cover. The tongue plate is pressed down and clamped and positioned;

The positioning block is fixed to the connecting part of the second end through a plurality of coupling bolts, the movable push block is sleeved under the positioning block, and the movable push block is provided with a movable through hole, and the movable through hole is used to allow the movable The push block generates a linear sliding displacement with the positioning block as the starting point. The elastic body is connected between the movable push block and the positioning block. When the movable push block is pushed, the elastic body is used to automatically reset the aforementioned movable push block. In addition, a connecting inclined surface is provided between the movable pushing block and the cover body, and the connecting inclined surface of the movable pushing block is used as a bearing surface of the stop, and the main body and the auxiliary jig are combined into one body through the above-mentioned structure.

In the embodiment of the present invention, the left and right sides of the cover body are provided with a buckling part, and both sides of the main body are provided with buckling grooves corresponding to the two buckling parts, and the two buckling parts are combined in the two The buckling groove achieves that the cover is buckled and fixed to the main body.

In the embodiment of the present invention, a flange is provided in the center of the movable push block, and the elastic system is assembled between the flange and the positioning block.

In the embodiment of the present invention, the positioning block is a T-shaped structure.

In the embodiment of the present invention, the elastic body is a compression spring.

In addition to the above-mentioned structure, the structure of the second embodiment of the present invention is as follows:

A main body, the inner side of the main body has a chamber, and a plurality of sets of symmetrical partitions are arranged on the left and right sides of the chamber, and a semiconductor substrate can be placed on each layer of the aforementioned partitions; it is characterized in that:

The main body has a first end for inserting the semiconductor substrate and a second end for assembling an auxiliary jig;

The auxiliary jig includes: a cover and at least one locking device;

The aforementioned cover body is used to close the second end. The cover body has a straight surface with several through openings. A plurality of symmetrical tongue plates are provided on the side of the cover body connected to the second end. The tongue plates can just abut against the partitions. When the partitions are placed with the semiconductor substrates, the tongue plates press the semiconductor substrates so that the semiconductor substrates are covered by the cover. The tongue plate is pressed down and clamped and positioned;

The aforementioned locking device includes a fastener and a hook fastener, the hook fastener is installed at the aforementioned second end, the fastener is installed on the upper end of the cover, and the hook fastener is hooked on The buckle makes the main body and the cover of the auxiliary jig to be integrated.

The aforementioned locking device is a lap spring lock.

The aforementioned locking device is a hook type ring buckle.

The aforementioned locking device is a C-shaped clip.

Through the above structure, the functions that the present invention can provide are briefly described as follows:

1. The semiconductor substrate is clamped by the partition plate of the main body and the tongue plate of the cover, and the partition plate and the tongue plate are used to generate a pressing force on the semiconductor substrate. During the baking process and the heat reduction process, Maintain the flatness of the semiconductor substrate and prevent warping, thereby increasing the product yield.

2. Since the semiconductor substrate is clamped by the partition plate and the tongue plate without falling off, the semiconductor substrate can be placed on each layer of the partition plate, so that the space of the main body can be fully used, and the output can be greatly improved.

3. The structure of the new model has low cost, and can be put into production line use after simple modification, which can increase profits for the industry.

Example one

Please refer to FIG. 3 to FIG. 10, the first embodiment of the substrate anti-warping fixing device of the present invention includes a main body 10 and an auxiliary jig 20.

The inner side of the main body 10 has a chamber 11, and a plurality of symmetrical partitions 12 are arranged on the left and right sides of the chamber 11. Each layer of the aforementioned partitions 12 can hold a semiconductor substrate 30. Furthermore, the main body 10 has A first end 13 for placing the semiconductor substrate 30 and a second end 14 for assembling the auxiliary jig 20 are provided with a connecting portion 15 for assembling the auxiliary jig 20.

As shown in FIG. 4, the auxiliary jig 20 includes: a cover 21, a movable push plate 22, a positioning block 23 and an elastic body 24.

As shown in FIG. 4, the aforementioned cover 21 is used to close the second end 14. The cover 21 has an upright surface 211, and the upright surface 211 is provided with a plurality of through openings 212. The cover 21 and the second A plurality of symmetrical tongue plates 213 are provided on the side where the end 14 is connected. The tongue plates 213 can abut against the spacers 12. When the spacers 12 are placed on the semiconductor substrates 30, the The tongue plates 213 press the semiconductor substrates 30 so that the semiconductor substrates 30 are pressed and clamped by the tongue plates 213 of the cover 21.

In order to increase the combination of the main body 10 and the cover 21, as shown in Figs. 1, 2 and 5, a buckling portion 214 is provided on the left and right sides of the cover 21, and two corresponding parts are provided on both sides of the main body 10 The buckling groove 16 of the buckling portion 214 combines the two buckling portions 214 with the two buckling grooves 16, so that the cover 21 is buckled and fixed to the main body 10, so that the combination of the two is better.

As shown in Figures 3, 4, 6, 8, and 9, the positioning block 23 is a T-like structure, and the positioning block 23 is fixed to the connecting portion of the second end 14 through a plurality of coupling bolts. 15. The movable push block 22 is nested under the positioning block 23, and the movable push block 22 is provided with a movable through hole 221, and the movable push block 22 is generated with the positioning block 23 as a starting point by using the movable through hole 221 Linear sliding displacement, the elastic body 24 is a compression spring, and the elastic body 24 is connected between the movable push block 22 and the positioning block 23. When the movable push block 22 is pushed, the elastic body 24 is used to move the aforementioned movement The push block 22 is automatically reset. In addition, a connecting inclined surface 222 is provided between the movable pushing block 22 and the cover 21. The connecting inclined surface 222 of the movable pushing block 22 is used as a bearing surface for the stop. The main body 10 and the auxiliary jig 20 are combined into one body.

As shown in FIG. 7, the center of the movable push block 22 is provided with a flange 223, and the elastic body 24 is assembled between the flange 223 and the positioning block 23.

As shown in FIGS. 8 to 10, through the above structure, the semiconductor substrates 30 are put into the spacers 12 of each layer from the first end 13 one by one, and then the cover 21 of the auxiliary jig 20 is assembled on the main body 10. Use the movable push block 22 to cooperate with the positioning block 23 to position the cover body 21, and use the tongue plate 213 provided on the cover body 21 and the partition plate 12 provided on the main body 10 to clamp the semiconductor substrates 30. The partition plate 12 and the tongue plate 213 are used to generate a pressing force on the semiconductor substrates 30. During the baking process and the deheating process, water vapor escapes from the through opening 212 of the cover, which can maintain the semiconductor The flatness of the substrate 30 and the prevention of warpage, thereby improving the product yield.

In addition, since the semiconductor substrate 30 is clamped by the partition plate 12 and the tongue plate 213 without falling off, the semiconductor substrate 30 can be placed on each layer of the partition plate 12, so that the space of the main body 10 can be fully used, and the yield can be greatly improved.

Furthermore, the structure of the present invention is low in cost, and can be put into production line use after simple modification, which can increase profits for the industry.

Example two

Please refer to FIG. 11. The structure of the second embodiment is basically similar to that of FIGS. 3 to 10, except that the combination of the auxiliary fixture is different. The structure includes: a main body 40, the inner side of the main body 40 There is a chamber 41. A plurality of sets of symmetrical partitions 42 are arranged on the left and right sides of the chamber 41. Each layer of the aforementioned partitions 42 can hold a semiconductor substrate 60; the main body 40 has a space for placing the semiconductor substrate. A first end 43 of 60 and a second end 44 for assembling an auxiliary jig 50.

As shown in FIG. 11, the auxiliary jig 50 includes: a cover 51 and at least one locking device 52; the aforementioned cover 51 is used to close the second end 44, and the cover 51 has a straight surface 511, The upright surface 511 is provided with a plurality of through openings 512, and a plurality of symmetrical tongue plates 513 are provided on the side where the cover body 51 is connected to the second end 44, and the tongue plates 513 can abut against the partition plates 42 Above, when the spacers 42 are placed with the semiconductor substrates 60, the tongue plates 513 press the semiconductor substrates 60, so that the semiconductor substrates 60 are pressed and clamped by the tongue plates 513 of the cover 51 Hold positioning.

As shown in Fig. 11, the aforementioned locking device 52 is shown as a lap spring buckle, which includes a buckle 521 and a hook 522, and the hook 522 is installed on the aforementioned first At the two ends 44, the fastener 521 is installed on the upper end of the cover 51, and the hook 521 is hooked on the fastener 522, so that the main body 40 and the cover 51 of the auxiliary fixture 50 are integrated.

Through the above-mentioned technology, the cover 51 and the main body 40 are combined by the locking device 52, and the same semiconductor substrates 60 are put into each layer of the spacer 42 from the first end 43 one by one, and then the auxiliary fixture 50 The cover 51 is combined with the main body 40, and the buckle 521 of the locking device 52 is used in cooperation with the hook 522 to position the cover 51, and the tongue 513 provided on the cover 51 and the main body The partition plate 42 provided in the 40 clamps the semiconductor substrates 60, and the partition plate 42 and the tongue plate 513 are used to generate a pressing force on the semiconductor substrates 60. During the baking process and the deheating process, water vapor Spilling from the through opening 512 of the cover body can maintain the flatness of the semiconductor substrate 60 and prevent warping, thereby improving the product yield.

In addition, in addition to the lap spring buckle shown in FIG. 11, the locking device 52 can also be a hook-type loop buckle or a C-shaped clip buckle. The above-mentioned fasteners can integrate the main body 40 and the cover 51 into one. The efficacy.

To sum up, the new structure has never been seen in books or publicly used, and sincerely meets the requirements of a new patent application, I sincerely ask Jun Bureau to approve the patent as soon as possible.

"Learning"

100: box

101: Room

102: partition

103: substrate

"This model"

Example one

10: main body

11: Room

12: Partition

13: first end

14: second end

15: Connection part

16: buckle groove

20: auxiliary fixture

21: Lid

211: Upright

212: Penetration

213: Tongue Board

214: Fastening part

22: Activity push plate

221: activity

222: connecting slope

223: Flange

23: positioning block

24: elastomer

30: Semiconductor substrate

Example two

40: main body

41: Room

42: partition

43: first end

44: second end

50: auxiliary fixture

51: Lid

511: Upright

512: Through mouth

513: tongue

52: Locking device

521: Fastener

522: Hook fastener

60: Semiconductor substrate

Figure 1 is a conventional structural diagram. Figure 2 is a state diagram of the conventional structure. Figure 3 is a perspective view of the structure of the first embodiment of the present invention. Figure 4 is an exploded view of the structure of the present invention. Figure 5 is a top view of the present invention. Fig. 6 is an enlarged view of part A of Fig. 3. Fig. 7 is an enlarged view of part B of Fig. 3. Fig. 8 is a cross-sectional view of part C of Fig. 5. Fig. 9 is an enlarged view of part D in Fig. 8. Figure 10 is a diagram of the state of use of the present invention. Figure 11 is a structural diagram of the second embodiment of the present invention.

10: main body

12: Partition

13: first end

20: auxiliary fixture

21: Lid

211: Upright

212: Penetration

214: Fastening part

22: Activity push plate

23: positioning block

24: elastomer

Claims (9)

A substrate anti-warping fixing device mainly includes: a main body with a chamber inside the main body, and a plurality of symmetrical partitions are arranged on the left and right sides of the chamber, and each layer of the aforementioned partitions can hold a semiconductor Substrate; characterized by: The main body has a first end for inserting the semiconductor substrate and a second end for assembling an auxiliary jig; The aforementioned second end is provided with a connecting portion for assembling the auxiliary jig; The auxiliary jig includes: a cover, a movable push plate, a positioning block and an elastic body; The aforementioned cover body is used to close the second end. The cover body has a straight surface with several through openings. A plurality of symmetrical tongue plates are provided on the side of the cover body connected to the second end. The tongue plates can just abut against the partitions. When the partitions are placed with the semiconductor substrates, the tongue plates press the semiconductor substrates so that the semiconductor substrates are covered by the cover. The tongue plate is pressed down and clamped and positioned; The positioning block is fixed to the connecting part of the second end through a plurality of coupling bolts, the movable push block is sleeved under the positioning block, and the movable push block is provided with a movable through hole, and the movable through hole is used to allow the movable The push block generates a linear sliding displacement with the positioning block as the starting point. The elastic body is connected between the movable push block and the positioning block. When the movable push block is pushed, the elastic body is used to automatically reset the aforementioned movable push block. In addition, a connecting inclined surface is provided between the movable pushing block and the cover body, and the connecting inclined surface of the movable pushing block is used as a bearing surface of the stop, and the main body and the auxiliary jig are combined into one body through the above-mentioned structure. The substrate anti-warping fixing device according to claim 1, wherein a buckling portion is provided on the left and right sides of the cover, and two buckling grooves corresponding to the two buckling portions are provided on both sides of the main body. The buckling part is combined with the two buckling grooves, so that the cover body is buckled and fixed to the main body. The substrate anti-warping fixing device according to claim 1, wherein a flange is provided in the center of the movable push block, and the elastic system is assembled between the flange and the positioning block. The substrate anti-warping fixing device according to claim 1, wherein the positioning block is a T-shaped structure. The substrate anti-warping fixing device according to claim 1, wherein the elastic body is a compression spring. A substrate anti-warping fixing device mainly includes: a main body with a chamber inside the main body, and a plurality of symmetrical partitions are arranged on the left and right sides of the chamber, and each layer of the aforementioned partitions can hold a semiconductor Substrate; characterized by: The main body has a first end for inserting the semiconductor substrate and a second end for assembling an auxiliary jig; The auxiliary jig includes: a cover and at least one locking device; The aforementioned cover body is used to close the second end. The cover body has a straight surface with several through openings. A plurality of symmetrical tongue plates are provided on the side of the cover body connected to the second end. The tongue plates can just abut against the partitions. When the partitions are placed with the semiconductor substrates, the tongue plates press the semiconductor substrates so that the semiconductor substrates are covered by the cover. The tongue plate is pressed down and clamped and positioned; The aforementioned locking device includes a fastener and a hook fastener, the hook fastener is installed at the aforementioned second end, the fastener is installed on the upper end of the cover, and the hook fastener is hooked on The buckle makes the main body and the cover of the auxiliary jig to be integrated. The substrate anti-warping fixing device according to claim 6, wherein the locking device is a lap spring lock. The substrate anti-warping fixing device according to claim 6, wherein the locking device is a hook type ring buckle. The substrate anti-warping fixing device according to claim 6, wherein the locking device is a C-shaped clip.

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