TWM658640U - Illuminated keyswitch structure - Google Patents

Abstract

An illuminated keyswitch structure includes a base plate, a keycap, and a light-emitting die package. The keycap is movably disposed above the base plate in a vertical direction. The light-emitting die package is disposed under the keycap and includes a plurality of light-emitting dies. The plurality of light-emitting dies are monochromatic light-emitting dies. Therein, among the plurality of light-emitting dies, three light-emitting dies that are adjacently arranged in an arrangement direction perpendicular to the vertical direction emit light of different colors. The arrangement direction is respectively parallel to a long side of each of the three adjacent light-emitting dies.

Description

Luminous button structure

This creation relates to a key structure, and in particular to a luminous key structure.

One-to-one illuminated keys usually have a light source under each keycap, which is used to emit light to form backlight. When the keycap has a light-transmitting area corresponding to a character such as text or a symbol, the corresponding light source is usually set directly opposite the character and emits light toward the character. In actual products, there are often other components between the light source and the light-transmitting area of the keycap, such as a bracket, a base plate, a circuit board, etc., which interferes with the light transmission path and causes uneven color of the keycap characters. When the light source has multiple colors, serious color deviation problems will also occur.

In view of the problems in the prior art, the purpose of this invention is to provide a light-emitting key structure, using a single light-emitting die package with multiple light-emitting dies, so that the light emitted by each light-emitting die can be transmitted in a similar path.

According to an embodiment of the present invention, a light-emitting key structure includes a base plate, a key cap and a light-emitting chip package. The key cap is movably disposed above the base plate in a vertical direction. The light-emitting chip package is disposed below the key cap and includes a plurality of light-emitting chips. The plurality of light-emitting chips are all single-color light-emitting chips. Among the plurality of light-emitting chips, three adjacent light-emitting chips arranged in an arrangement direction perpendicular to the vertical direction emit three different colors of light, and the arrangement direction is parallel to the long sides of the three adjacent light-emitting chips. In this way, the plurality of light-emitting chips are in a single package, so that the light emitted by each light-emitting chip can be transmitted in a similar path. In addition, the arrangement of the plurality of light-emitting crystals reduces the excessive concentration of light-emitting crystals of the same color, and also helps to make the light irradiating the keycap uniform.

The advantages and spirit of this creation can be further understood through the following creation description and attached diagrams.

1,3,4: Luminous button structure

12: Keycaps

12a, 12a': light-transmitting indication area

12b,12b': length direction

12c,12c': major axis

12d,12d': short axis

14: Base plate

142,142',142",143,143',144,145:Through hole

142a',142b',142c',142a",144a,144b: Kong Yuan

142c: Upper surface

143a: Main hole

143b: Extension

146: Outer edge

16: First bracket

162: Lower surface

164: Upper surface

166a,166b: Frame

18: Second bracket

20: Switch circuit board

202,202',202",203a,203b,203c: switch contacts

202a: Flat edge

202b: Center of circle

202c: Radius

2032a,2032b: Outer periphery

2034a,2034b: Center

2036a,2036b:Connection part

204: Wire segment

206: Perforation

22a,22b,22c,22a',22b',22c',22a",22b",22c":luminescent grains

24: Light source circuit board

26: Elastic dome

28,28': Light guide

282: Storage tank

282a: Inner wall surface

284: Upper surface

30,30': Mask layer

302a, 302b: light-transmitting area

42,42',43,43a,43b,43c,43d: Light-emitting chip package

420,420':Carrier

420a: Protruding side wall

420b: Storage space

422a,422b,422c: Luminescent grains

424,424':Light-transmitting packaging materials

424a: Top surface

424b,424c: side surface

A1: Joint axis

D1: vertical direction

D2,D2',D2":Arrangement direction

D3,D3',D3",D4a,D4b: horizontal direction

d1,d1a,d1a',d1b,d1b',d2,d3: light output distance

G: Interstitial projection

Figure 1 is a schematic diagram of a luminous key structure according to an embodiment.

Figure 2 is an exploded view of the luminous key structure in Figure 1.

Figure 3 is a cross-sectional view of the luminous key structure along line X-X in Figure 1.

Figure 4A is a top view schematic diagram of the switch circuit board and the light-emitting chip.

FIG4B is a top view schematic diagram of another embodiment extending FIG4A.

FIG4C is a top view schematic diagram of another embodiment extending FIG4A.

FIG5 is a schematic diagram of a top view of the switch contacts and light-emitting die in FIG4A according to another embodiment.

FIG6 is a schematic diagram of a top view of the switch contacts and light-emitting die in FIG4A according to another embodiment.

Figure 7 is a top view of the luminous key structure in Figure 1.

FIG8 is a schematic diagram of a top view of a portion of a switch circuit board and a light-emitting chip according to an embodiment.

Figure 9 is a cross-sectional view along line Y-Y corresponding to the embodiment of Figure 8.

Figure 10 is an exploded schematic diagram of a luminous key structure according to another embodiment.

Figure 11A is a top view of the luminous key structure after the key cap is removed.

FIG. 11B is a top view of another embodiment extending FIG. 11A .

Figure 12 is a cross-sectional view taken along line Z-Z of Figure 11A.

FIG13A is a top view of the luminous key structure in FIG10.

FIG13B is a partial top view schematic diagram of another embodiment extending FIG13A.

FIG14 is a schematic diagram of a light-emitting chip package according to a first embodiment.

FIG15 is a cross-sectional view of the light-emitting chip package along line W-W in FIG14 .

FIG16 is a schematic diagram of a variation of the light-emitting chip package in FIG14 .

Figure 17 is a top view of the configuration of the light-emitting chip package in Figure 14.

FIG18 is a top view of a light-emitting chip package according to a second embodiment.

FIG19 is a top view of a light-emitting chip package according to a third embodiment.

FIG20 is a top view of a light-emitting chip package according to a fourth embodiment.

FIG21 is a top view of a light-emitting chip package according to a fifth embodiment.

FIG22 is a top view of a light-emitting chip package according to a sixth embodiment.

FIG23 is a schematic diagram showing the light-emitting chip in FIG4A being replaced by the light-emitting chip package of the sixth embodiment.

Figure 24 is a cross-sectional view of the luminous key structure corresponding to Figure 23.

Figure 25 is a schematic diagram of the top view of the switch contacts and the light-emitting chip package on the bottom plate in a variation of the through hole.

FIG. 26 is a schematic diagram showing the top view of the switch contacts and the light-emitting chip package on the base plate in another variation of the through hole.

FIG27 is a schematic diagram showing the light-emitting chip in FIG8 being replaced by the light-emitting chip package of the sixth embodiment.

FIG28 is a schematic diagram showing the light-emitting chip in FIG11A being replaced by the light-emitting chip package of the sixth embodiment.

FIG29 is a schematic diagram showing the light-emitting chip in FIG13B being replaced by the light-emitting chip package of the sixth embodiment.

Figure 30 is a cross-sectional view of a light-emitting key structure according to an embodiment.

FIG31 is a cross-sectional view of the luminous key structure in FIG30 further including a mask layer.

FIG32 is a cross-sectional view of a variation of the luminous key structure in FIG31.

FIG33 is a top view schematic diagram of the switch contacts, light-emitting chip package, and light-transmitting area of the mask layer on the bottom plate in FIG32.

Figure 34 is a cross-sectional view of the luminous key structure corresponding to Figure 33.

Please refer to Figures 1 to 3. Figure 1 is a schematic diagram of a light-emitting key structure according to an embodiment. Figure 2 is an exploded view of the light-emitting key structure in Figure 1. Figure 3 is a cross-sectional view of the light-emitting key structure along line X-X in Figure 1. According to an embodiment, the light-emitting key structure 1 includes a key cap 12, a base plate 14, a first bracket 16, a second bracket 18, a transparent switch circuit board 20 and one or more light-emitting crystals (for example, but not limited to three light-emitting crystals 22a, 22b, 22c, the light-emitting crystals are used to emit light of different colors, such as red light, green light and blue light; and the light-emitting crystals 22a, 22b, 22c can be made of, but not limited to, light-emitting diodes). The key cap 12 is disposed above the bottom plate 14, and the first bracket 16 and the second bracket 18 are connected between the key cap 12 and the bottom plate 14 to support the key cap 12 and enable the key cap 12 to move along a vertical direction D1 (indicated by a double-headed arrow in FIGS. 1 and 3 ) via the first bracket 16 and the second bracket 18. The switch circuit board 20 is placed on the bottom plate 14 (i.e., below the key cap 12). The light-emitting chips 22a, 22b, and 22c are disposed below the switch circuit board 20, for example, fixed on a light source circuit board 24 (the light source circuit board 24 is, for example, but not limited to, a flexible printed circuit board) located below the bottom plate 14. The bottom plate 14 forms corresponding through holes 142 to expose the light-emitting chips 22a, 22b, and 22c. In actual operation, the light-emitting chips 22a, 22b, and 22c can partially or completely enter the through holes 142. Please refer to Figures 1 and 3. The light-emitting chips 22a, 22b, and 22c are not higher than the bottom plate 14, and the light-emitting chips 22a, 22b, and 22c are all located within the projection of the through holes 142 in the vertical direction D1. The circuit of the switch circuit board 20 (part of which is shown in dotted lines in FIG. 2 ) does not shield the light-emitting chips 22a, 22b, and 22c, so that the light emitted upward by the light-emitting chips 22a, 22b, and 22c can pass through the switch circuit board 20 to illuminate the key cap 12.

In this embodiment, the switch circuit board 20 can be actually made of a thin film circuit board, which is usually formed by stacking three layers of transparent thin sheets (i.e., as a transparent carrier structure, so that the switch circuit board 20 is transparent), wherein the upper and lower transparent thin sheets form the required circuits thereon, and the middle transparent thin sheet provides the required insulation effect of the circuit. The circuit of the switch circuit board 20 includes a switch contact 202 and a plurality of wire segments (the hidden outlines of which are all shown in dotted lines in FIG. 2). The light-emitting key structure 1 uses a light-transmissive elastic protrusion 26 as a restoring element. The elastic protrusion 26 is aligned with the switch contact 202. The elastic protrusion 26 is disposed on the switch circuit board 20 and covers the switch contact 202 and the light-emitting chips 22a, 22b, and 22c in the vertical direction D1. The key cap 12 can be pressed (for example, the user presses it with a finger) to squeeze the elastic protrusion 26 downward, thereby triggering the switch contact 202. After the external force applied to the key cap 12 is removed (for example, the user removes the finger from the key cap 12), the squeezed elastic protrusion 26 can return to its original state to push the key cap 12 upward back to its original position.

Please also refer to FIG. 4A, which is a schematic top view of the switch circuit board and the light-emitting die of the light-emitting key structure in FIG. 2. The circuit of the switch circuit board 20 and the hidden outlines of the light-emitting die 22a, 22b, 22c are all shown in solid lines. The switch contact 202 has a non-circular outline, such as but not limited to a flattened circular outline, and the flattened circular outline has a flat edge 202a. The light-emitting die 22a, 22b, 22c are arranged along an arrangement direction D2 (indicated by a double-headed arrow in FIG. 4A), and the arrangement direction D2 is parallel to the flat edge 202a. There is a light-emitting distance d1 between the light-emitting chips 22a, 22b, 22c and the switch contact 202 in a horizontal direction D3 (indicated by a double-headed arrow in the figure) (i.e., the distance from the edge of the light-emitting range of the light-emitting chips 22a, 22b, 22c projected on the switch circuit board 20 to the flat edge 202a). In principle, the farther the light-emitting chips 22a, 22b, 22c are from the switch contact 202, the less likely the switch contact 202 will shield the light emitted by the light-emitting chips 22a, 22b, 22c; in actual operation, this light-emitting distance d1 can be designed to be between 0.3mm and 0.5mm. In addition, in this embodiment, the flattened circular profile has a center 202b and a radius 202c, and the ratio of the distance 202d from the center 202b to the flat edge 202a to the radius 202c is greater than 0.5. In principle, the switch contact 202 can maintain acceptable contact conduction properties.

4B and 4C , both of which are top view configuration diagrams of another embodiment extending from FIG. 4A , the through hole 142 ′ of the bottom plate 14 (whose outline projection is shown in the figure with dotted lines) has a portion of the arc edge parallel to the arc edge of the switch contact 202, and the other side consists of three edges perpendicular to each other, forming a bullet-shaped through hole 142 ′ as a whole. In FIG. 4B , all the light-emitting chips 22a, 22b, and 22c are arranged along an arrangement direction D2. The light-emitting chips 22a, 22b, and 22c are not only adjacent to the flat edge 202a of the switch contact 202, but also adjacent to the straight hole edge 142a' of the through hole 142' of the bottom plate 14. At this time, the appropriate configuration is that the arrangement direction D2 of the light-emitting chips 22a, 22b, and 22c is parallel (or approximately parallel) to the hole edge 142a' of the through hole 142' of the bottom plate 14, and is also parallel (or approximately parallel) to the flat edge 202a of the switch contact 202. In FIG. 4C , the light-emitting grains 22a, 22b, and 22c are arranged in a triangle, the light-emitting grain 22a faces the straight hole edge 142a' of the through hole 142' of the bottom plate 14, and the light-emitting grain 22c is not located in the union range of the light-emitting grains 22a and 22b, and the light-emitting grains 22b and 22c are arranged in a straight line along an arrangement direction D2 in a side-to-side parallel manner. At this time, the arrangement direction of at least two light-emitting grains 22b and 22c is parallel (or substantially parallel) to the straight hole edge 142a' of the through hole 142' of the bottom plate 14, and is also parallel (or substantially parallel) to the flat edge 202a of the switch contact 202. However, the implementation is not limited thereto. For example, at least two light-emitting chips 22b and 22c may also be arranged along the horizontal direction D3, so that the arrangement direction of the at least two light-emitting chips 22b and 22c is perpendicular (or substantially perpendicular) to the straight hole edge 142a' of the through hole 142' of the bottom plate 14, and also perpendicular (or substantially perpendicular) to the flat edge 202a of the switch contact 202, but parallel to the horizontal direction D3. In another embodiment, the three vertical edges of the bullet-shaped through hole 142' of the bottom plate 14 of Figures 4B and 4C can be reduced as needed to become a key-shaped through hole 142' with a circular arc at one end and a narrow elongated end; at this time, all or at least two of the light-emitting grains 22a, 22b, and 22c can be arranged in a straight line perpendicular to the flat edge 202a of the switch contact 202 and the hole edge 142a' at the end.

The hole edge 142a' of the through hole 142' of the aforementioned bottom plate 14 and the flat edge 202a of the switch contact 202 are both heterochromatic sensitive areas, which may cause heterochromatic problems such as uneven light mixing and color deviation. Therefore, the aforementioned technical solutions all arrange the plurality of light-emitting crystals 22a, 22b, and 22c on the same side of the heterochromatic sensitive area, that is, the light-emitting crystals 22a, 22b, and 22c are arranged on the same side of the hole edge 142a' of the through hole 142' of the bottom plate 14, and/or the light-emitting crystals 22a, 22b, and 22c are arranged on the same side of the flat edge 202a of the switch contact 202, and the distances of the plurality of light-emitting crystals 22a, 22b, and 22c to the same heterochromatic sensitive area are close to each other. Since the manufacturing technology of the light-emitting crystals 22a, 22b, and 22c has reached the millimeter or even micrometer level, even if the light-emitting crystals 22a, 22b, and 22c are not arranged in a straight line, the distance to the same heterochromatic sensitive area is very close to each other. For the sake of clear display, the multiple light-emitting crystals in each figure of this creation are drawn in a larger size, and the distance between the multiple light-emitting crystals is larger. The actual ratio of multiple light-emitting crystals is much smaller than the various figures in this creation.

In addition, in actual operation, the switch contacts of the switch circuit board 20 may have different shapes. For example, as shown in FIG. 5 , a switch contact 203a according to an embodiment includes a peripheral portion 2032a, a central portion 2034a located inside the peripheral portion 2032a, and two connecting portions 2036a. The two connecting portions 2036a are located on opposite sides of the central portion 2034a and connect the peripheral portion 2032a and the central portion 2034a. The peripheral portion 2032a extends incompletely along a circular path (indicated by a dotted line in the figure) and is C-shaped. The central portion 2034a has a circular outline. The light-emitting crystals 22a, 22b, 22c are located between the two ends of the peripheral portion 2032a (i.e., located at the C-shaped opening), and the circular path passes through the light-emitting crystals 22a, 22b, 22c (i.e., the light-emitting crystals 22a, 22b, 22c are arranged on the circular path). The light-emitting crystals 22a, 22b, 22c are closer to the central portion 2034a and have a light-emitting distance d1a between them and the central portion 2034a; similarly, in actual operation, the light-emitting distance d1a can be designed to be between 0.3 mm and 0.5 mm. If the light-emitting crystal grains 22a, 22b, and 22c are closer to the two ends of the peripheral portion 2032a and there is a light-emitting distance d1a' between the two ends of the peripheral portion 2032a; similarly, in actual operation, this light-emitting distance d1a' can also be designed to be between 0.3mm and 0.5mm.

For another example, as shown in FIG6 , a switch contact 203b according to an embodiment includes a peripheral portion 2032b, a central portion 2034b located inside the peripheral portion 2032b, and a connecting portion 2036b. The connecting portion 2036b connects the peripheral portion 2032b and the central portion 2034b. The peripheral portion 2032b extends incompletely along a convex polygonal path (for example, but not limited to a pentagonal path, indicated by a dotted line in the figure) and is slightly C-shaped. The central portion 2034b has a convex polygonal profile (for example, but not limited to a quadrilateral). The convex polygonal path passes through the light-emitting grains 22a, 22b, and 22c. The light-emitting crystal grains 22a, 22b, and 22c are closer to the central portion 2034b and have a light-emitting distance d1b between them. Similarly, in actual operation, the light-emitting distance d1b can be designed to be between 0.3 mm and 0.5 mm. If the light-emitting crystal grains 22a, 22b, and 22c are closer to the peripheral portion 2032b and have a light-emitting distance d1b' between them, similarly, in actual operation, the light-emitting distance d1b' can also be designed to be between 0.3 mm and 0.5 mm. In addition, in FIG. 5 and FIG. 6, the convex polygonal path may also be a triangular path, a hexagonal path, etc. in actual operation; the outline of the center portion 2034a, 2034b may also be other convex polygonal outlines, such as a triangular outline, a hexagonal outline, etc.

Please refer to Figures 1 to 3. In this embodiment, the key cap 12 has a light-transmitting indication area 12a (shown in a dotted frame in the figure), and the light emitted by the light-emitting crystals 22a, 22b, and 22c can pass through the light-transmitting indication area 12a to form a visual indication effect. In actual operation, the light-transmitting indication area 12a can be a number, a symbol, a letter, a text, a graphic or a combination thereof; in other words, the light-transmitting indication area 12a can include a plurality of light-transmitting characters, and the light-transmitting characters can be numbers, symbols, letters, text or graphics.

Please also refer to FIG. 7 (where the hidden outlines of the luminescent crystals 22a, 22b, and 22c are shown in thin solid lines), which is a top view of the luminescent key structure in FIG. 1. In this embodiment, the light-transmissive indication region 12a has a length direction 12b (e.g., the letter arrangement direction in the figure, indicated by a double-headed arrow in FIG. 7). The luminescent crystals 22a, 22b, and 22c are arranged perpendicularly to the length direction 12b below the light-transmissive indication region 12a (i.e., the arrangement direction D2 is perpendicular to the length direction 12b), thereby reducing or eliminating the effect of uneven light mixing caused by the staggered arrangement of the luminescent crystals 22a, 22b, and 22c on the light-transmissive indication region 12a. In other words, the two ends of the light-transmitting indication area 12a (and the light-transmitting indication area 12a' in the subsequent embodiments) are heterochromatic sensitive areas, which are prone to uneven light mixing and cause color difference problems when the key cap 12 emits light. The light-transmitting indication area 12a can include multiple light-transmitting characters, which are arranged along a long axis, and the so-called heterochromatic sensitive areas are the end characters on both sides of the multiple light-transmitting characters.

In addition, in this embodiment, the light-transmissive indicating area 12a is rectangular, on which a long axis 12c and a short axis 12d (both represented by chain lines in FIG. 7 ) can be defined, the long axis 12c is parallel to the long direction 12b, and the short axis 12d is perpendicular to the long direction 12b. The light-transmissive indicating area 12a is structurally symmetrical with respect to the long axis 12c and the short axis 12d, respectively. In terms of vertical projection, the entirety of the luminescent grains 22a, 22b, and 22c (i.e., a plurality of luminescent grains as a whole, the same below) passes through the long axis 12c, and the center of the entirety of the luminescent grains 22a, 22b, and 22c (in this embodiment, the luminescent grain 22b) is located on the long axis 12c. In actual operation, the light-emitting crystal grains 22a, 22b, and 22c can be designed to pass through the center of the long axis 12c as a whole, as shown in the dotted box in Figure 7; at this time, the light-emitting crystal grains 22a, 22b, and 22c also pass through the center of the short axis 12d as a whole, and the center of the light-emitting crystal grains 22a, 22b, and 22c as a whole (the light-emitting crystal grain 22b in this embodiment) is also located at the center of the long axis 12c and the short axis 12d; but this is not limited to it. For example, the light-emitting grains 22a, 22b, and 22c are offset parallel to the short axis 12d, so that the center of the light-emitting grains 22a, 22b, and 22c as a whole deviates from the center of the long axis 12c and the short axis 12d (for example, the light-emitting grain 22a or 22c is located at the center of the long axis 12c and the short axis 12d; for another example, the light-emitting grains 22a, 22b, and 22c are not located at the center of the long axis 12c and the short axis 12d, as shown in the dotted box in FIG. 7). In addition, in the luminous key structure 1, although the luminous crystals 22a, 22b, and 22c are arranged in a straight line, they can also be arranged in a non-straight line in actual operation, such as a triangular configuration; in this case, when the luminous crystals 22a, 22b, and 22c are close enough (this can be obtained through actual product testing), the effect of uneven light mixing caused by the luminous crystals 22a, 22b, and 22c being too large in arrangement can be reduced or eliminated. The technical solutions of this embodiment are to set multiple luminous crystals 22a, 22b, and 22c on the same side of the different color sensitive area, that is, the luminous crystals 22a, 22b, and 22c are simultaneously set on the same side of the last character of multiple light-transmissive characters. For the last character "L", the light-emitting crystals 22a, 22b, and 22c are simultaneously arranged on the same side of the last character "L"; and for the last character "d" on the other side, the plurality of light-emitting crystals 22a, 22b, and 22c are also arranged on the same side of the last character "d". As for the heterochromatic sensitive area of the last character "L", the arrangement direction of the light-emitting crystals 22a, 22b, and 22c is at least partially perpendicular to the light-transmissive indication area 12a, so that the distances to the same heterochromatic sensitive area (the last character "L") are close to each other, thereby reducing the heterochromatic problem. Similarly, for the heterochromatic sensitive area of the last character "d", the arrangement direction of the luminescent crystals 22a, 22b, and 22c is at least partially perpendicular to the light-transmissive indication area 12a, so that the distances to the same heterochromatic sensitive area (the last character "d") are close to each other, which can also reduce the heterochromatic problem.

In this invention, the key cap 12 has a heterochromatic sensitive area in the coverage range of the vertical direction D1. The heterochromatic sensitive area is, for example, the end of the light-transmitting indication area 12a of the key cap 12. The multiple light-emitting crystals 22a, 22b, and 22c are located on the same side of the projection of the heterochromatic sensitive area (the end of the light-transmitting indication area 12a) in the vertical direction D1. Since the distances from the multiple light-emitting crystals 22a, 22b, and 22c to the end of the light-transmitting indication area 12a are close, the different colored lights emitted by the multiple light-emitting crystals 22a, 22b, and 22c can travel to the end of the light-transmitting indication area 12a at a similar distance, thereby suppressing the effects caused by uneven light mixing and color deviation.

In the light-emitting key structure 1, the switch contact 202 is roughly located in the central area, but it is not limited to this in actual operation. For example, the switch contact 202 is set away from the central area and is triggered by the key cap 12 (such as a downwardly protruding structure) or the bracket (the first bracket 16 or the second bracket 18). At this time, the light-emitting chips 22a, 22b, and 22c can be separated from the bottom of the elastic protrusion 26, so that the light emitted by the light-emitting chips 22a, 22b, and 22c does not need to pass through the elastic protrusion 26, which can reduce the attenuation of the light intensity. In addition, the circuit of the switch circuit board 20 generally refers to a collection of multiple traces and multiple circuit elements (such as the aforementioned switch contact 202), all of which are objects that the light-emitting chips 22a, 22b, and 22c need to avoid. In detail, in the light-emitting key structure 1, the light-emitting chips 22a, 22b, and 22c are closer to the switch contact 202 than other parts of the circuit; however, in actual operation, the light-emitting chips 22a, 22b, and 22c may also be closer to other parts of the circuit than the switch contact 202.

For example, in another embodiment, as shown in FIG8 (where the hidden outline of the circuit of the switch circuit board 20 is shown in thin solid lines), the light-emitting chips 22a, 22b, and 22c are arranged near a wire segment 204. The wire segment 204 extends in a straight line, and the arrangement direction D2' of the light-emitting chips 22a, 22b, and 22c is parallel to the wire segment 204. The light-emitting chips 22a, 22b, and 22c have a light-emitting distance d2 in the horizontal direction D3' (that is, the distance from the edge of the light-emitting range of the light-emitting chips 22a, 22b, and 22c projected on the switch circuit board 20 to the wire segment 204). In actual operation, this light-emitting distance d2 can also be designed to be between 0.3 mm and 0.5 mm.

In actual operation, the switch circuit board 20 may also be arranged under the base plate 14 as needed. In this case, the switch circuit board 20 is closer to the light-emitting chips 22a, 22b, and 22c on the bottom layer and blocks a larger light-emitting range. It is necessary to avoid the circuit of the switch circuit board 20 to a greater extent. For the circuit elements (such as the switch contact 202) or the wires (such as the wire segment 204) that constitute the circuit, the appropriate light-emitting distances d1 and d2 may exceed the above-mentioned higher critical value of 0.5mm. In some actual manufacturing examples, the appropriate light-emitting distances d1 and d2 are 0.59mm, 0.66mm, and 0.78mm. When the circuit of the switch circuit board 20 is far away from the light-emitting chips 22a, 22b, and 22c, for example, a thicker base plate 14 is used, or the light-emitting key structure 1 has other structural parts (such as a moving plate, magnet, boss, etc. used for magnetic repositioning or sinking the keyboard), the appropriate light-emitting spacings d1 and d2 may be lower than the lower critical value; for example, in some actual manufacturing examples, the appropriate light-emitting spacings d1 and d2 are 0.27mm, 0.23mm, and 0.17mm. Therefore, based on the experimental data of different models, the light-emitting spacings d1 and d2 are preferably within the range of 0.17mm to 0.78mm.

Furthermore, the switch contacts 202 may be printed on the upper and lower transparent sheets of the switch circuit board 20, respectively, and the upper and lower switch contacts 202 may have different patterns and outer diameters. The light-emitting chips 22a, 22b, and 22c usually need to avoid the outermost edges of the upper and lower switch contacts 202 of the switch circuit board 20, that is, the aforementioned light-emitting distance d1 must be based on the overall outer contour of the upper and lower switch contacts 202.

In addition, please also refer to FIG. 8 and FIG. 9 . FIG. 9 is a cross-sectional view along the line Y-Y corresponding to the embodiment of FIG. 8 . In this embodiment, the switch circuit board 20 has a through hole 206 . The light-emitting crystals 22a , 22b , and 22c are arranged opposite to the through hole 142 ″ of the bottom plate 14 and opposite to the through hole 206 , so that the light emitted upward by the light-emitting crystals 22a , 22b , and 22c can pass through the through hole 142 ″ and the through hole 206 to illuminate the key cap 12 , which can eliminate the intensity attenuation caused by the light passing through the physical structure of the switch circuit board 20 . In the configuration shown in FIG. 4A , if the structural design allows, the switch circuit board 20 can also form a through hole facing the light-emitting chips 22a, 22b, and 22c near the switch contact 202 to reduce the attenuation of light intensity.

In addition, in this embodiment, all the light-emitting chips 22a, 22b, and 22c used to provide backlight for the keycap 12 are arranged in a straight line parallel to the flat edge 202a, but this is not limited to the actual operation. For example, the light-emitting chips 22a, 22b, and 22c are arranged in other arrangements (such as arcs, triangles, polygons, arrays, etc.), and the distance between the light-emitting chip 22a, 22b, or 22c closest to the switch contact 202 and the switch contact 202 in the horizontal direction D3 is defined as the light-emitting distance. Similarly, the outline of the switch contact 202 close to the light-emitting chips 22a, 22b, and 22c is not limited to a straight line, and the wire segment 204 close to the light-emitting chips 22a, 22b, and 22c is not limited to a straight line extension. The closer the light-emitting crystals 22a, 22b, and 22c are to the circuit, the greater the range in which the light-emitting crystals 22a, 22b, and 22c can be placed, which means that the design flexibility of the light-transmissive indication area 12a can be increased.

Please refer to FIG. 10 and FIG. 11A, which show a light-emitting key structure 3 according to another embodiment, which is similar to the light-emitting key structure 1. The light-emitting key structure 3 basically uses the component symbols of the light-emitting key structure 1. For other descriptions of the light-emitting key structure 3, please refer to the related descriptions of the same-named components and their variations in the light-emitting key structure 1 above. In the light-emitting key structure 3, the first bracket 16 and the second bracket 18 are arranged opposite to each other and are light-transmissive, and are connected to the bottom side of the key cap 12 and the top side of the bottom plate 14.

When the key cap 12 is not pressed, the light-transmissive first bracket 16 and the second bracket 18 are X-shaped scissor-leg support brackets in an extended state (as shown in FIG. 10 or refer to FIG. 3). In other words, the light emitted by the light-emitting chips 22a, 22b, and 22c located below the bottom plate 14 has different transmission paths and incident/reflection/refractive angles from different surfaces of the inclined upper half and the inclined lower half of the first bracket 16 and the second bracket 18, as well as the upper end and the lower end. The junction of the first bracket 16 and the second bracket 18 belongs to the heterochromatic sensitive area, or the vertical range covering the gap projection G between them is the heterochromatic sensitive area, which is prone to uneven light mixing and causes color difference problems when the light is emitted to the key cap 12. If a monochromatic light source is placed within the gap projection G range between the first bracket 16 and the second bracket 18 (indicated by dotted hatching in FIG. 11A, i.e., the projection of the gap between the first bracket 16 and the second bracket 18 in the vertical direction D1), the light will be transmitted directly or indirectly to the key cap 12 through different parts of the first bracket 16 and the second bracket 18, ultimately causing a serious problem of uneven illumination. If a multi-color light source such as the light-emitting crystals 22a, 22b, and 22c is placed within the gap projection G range (or overlapped with the gap projection G range), the uneven light mixing will cause a heterochromatic problem of color deviation at different positions on the key cap 12.

Please refer to FIG. 10 and FIG. 11A. Therefore, in this embodiment, all the light-emitting chips 22a, 22b, 22c (in FIG. 11A, their hidden outlines are shown in thick solid lines) used to provide backlight are arranged below the first bracket 16 (i.e., the light-emitting chips 22a, 22b, 22c are all located within the projection range of the first bracket 16 in the vertical direction D1) and are located in the through hole 144 (or facing the through hole 144 of the bottom plate 14 and located below the bottom plate; i.e., the light-emitting chips 22a, 22b, 22c are located within the projection range of the through hole 144 in the vertical direction D1). The light emitted by the light-emitting chips 22a, 22b, 22c moves upward from the through hole 144 and passes through the first bracket 16 (or passes through the through hole 144 and the first bracket 16) to illuminate the key cap 12. Since the light emitted by the light-emitting crystals 22a, 22b, and 22c passes through the same bracket, the light is in principle subjected to very similar effects (e.g., intensity attenuation, path divergence or deviation, etc.), thereby suppressing the degree of color deviation that may be generated after the light passes through the structural member. In addition, in this embodiment, the light emitted by the light-emitting crystals 22a, 22b, and 22c enters the first bracket 16 from the lower surface 162 of the first bracket 16, and is emitted from the first bracket 16 from the upper surface 164 of the first bracket 16. The lower surface 162 is parallel to the upper surface 164. This structural configuration also helps to suppress the degree of color deviation that may be generated after the light passes through the structural member. Similarly, in actual operation, the light-emitting crystals 22a, 22b, and 22c can also be arranged below the second bracket 18, as shown by the dotted line in FIG. 11A. In this way, as long as the gap projection G of the first bracket 16 and the second bracket 18 (that is, the projection area of the gap area of the first bracket 16 and the second bracket 18 in the vertical direction) does not overlap with the light-emitting crystals 22a, 22b, and 22c, the aforementioned color deviation problem can be avoided. The aforementioned situation that the gap projection G of the first bracket 16 and the second bracket 18 does not overlap with the light-emitting crystals 22a, 22b, and 22c not only means that the gap projection G does not directly overlap any light-emitting crystal 22a, 22b, and 22c itself, but also covers the situation that the gap projection G does not pass through the gap between any two adjacent light-emitting crystals 22a/22b, 22b/22c (that is, the gap projection G does not overlap or pass through the light-emitting crystals 22a, 22b, and 22c). c), the entirety of the luminescent crystals 22a, 22b, 22c can be logically represented by a single convex polygonal region that can cover all the luminescent crystals 22a, 22b, 22c. For example, the luminescent crystals 22a, 22b, 22c are not arranged in a straight line (as shown by the dashed box in the enlarged view of FIG. 11A), and their entirety can be represented by a convex hexagonal region (as shown by the dashed polygon in FIG. 11A, or a triangular arrangement in terms of the center line). Under the premise that the gap projection G does not overlap or pass through the entirety of the luminescent crystals 22a', 22b', 22c', the arrangement of the luminescent crystals 22a', 22b', 22c' and the gap projection G can also have a specific relative relationship. For example, at least two of the dotted light-emitting crystal grains 22a', 22b', and 22c' arranged in a triangle in FIG. 11A are arranged along the horizontal direction D3" (i.e., at least two of the light-emitting crystal grains 22a', 22b', and 22c' are parallel to the horizontal direction D3") and perpendicular to the gap projection G (i.e., the gap projection G extends approximately parallel to the arrangement direction D2").

Furthermore, as shown in FIG. 11B , the three dotted light-emitting grains 22a', 22b', and 22c' arranged in a triangle at the second bracket 18, when the dotted light-emitting grains 22a', 22b', and 22c' are arranged in a triangle (in terms of the center line), that is, the light-emitting grains 22b' and 22c' are arranged in a straight line along the arrangement direction D2" in a side-to-side parallel manner (i.e., parallel to each other), and the light-emitting grain 22a' is not located in the union range of the light-emitting grains 22b' and 22c' (for example, the axes of the light-emitting grains 22b' and the light-emitting grains 22c' are in a straight line, and the axis of the light-emitting grain 22a' is not on the straight line). In order to avoid at least two of the dotted light-emitting grains 22a', 22b', and 22c' being When the gap projection G is adjacent to the junction of the first bracket 16 and the second bracket 18, but the distance to the gap projection G is not equal, causing a slight local heterochromatic problem, the arrangement direction D2" of at least two dotted line light-emitting crystals 22a', 22b', 22c' adjacent to the gap projection G can be parallel to the gap projection G and perpendicular to the horizontal direction D3"; as for the third dotted line light-emitting crystal 22a', 22b' or 22c' in the triangle arrangement, it is roughly located on the center line of the connection between the two dotted line light-emitting crystals 22a', 22b' or 22c'. The third dotted line light-emitting crystal 22a', 22b' or 22c' can be far away from the gap projection G, or closer to the gap projection G than the other two.

In addition, in this embodiment, the first bracket 16 is in the form of a rectangular frame, and the light-emitting crystals 22a, 22b, and 22c are located below one of the frame portions 166a of the rectangular frame. The projection of the frame portion 166a in the vertical direction D1 has a length direction (as shown in the perspective of FIG. 11A, the length direction is equivalent to the arrangement direction D2") of the light-emitting crystals 22a, 22b, and 22c, and the length direction is parallel to the arrangement direction D2" of the light-emitting crystals 22a, 22b, and 22c. In actual operation, the light-emitting crystals 22a, 22b, and 22c may also be located below one of the frame portions 166b of the rectangular frame, and the light-emitting crystals 22a, 22b, and 22c are arranged parallel to the length direction (or extension direction) of the frame portion 166b. Furthermore, the first bracket 16 can also be actually made of a frame configured in other geometric shapes, such as a U-shaped (or n-shaped) frame.

In summary, the above-mentioned technical solutions of this embodiment are to arrange the light-emitting crystal grains 22a, 22b, 22c and 22a', 22b' or 22c' on the same side of the heterochromatic sensitive area, i.e., the gap projection G. At the same time, the distances of the light-emitting crystal grains 22a, 22b, 22c to the same heterochromatic sensitive area (gap projection G) are close to each other; the distances of the light-emitting crystal grains 22a', 22b' or 22c' to the same heterochromatic sensitive area (gap projection G) are also close to each other. For example, the size of the keycap is in the order of cm, and the distance between multiple light-emitting crystals is less than 1mm. The distances to the same heterochromatic sensitive area are close to each other, which means that the distance difference between each light-emitting crystal to the same heterochromatic sensitive area (gap projection G) can be almost ignored (for example, the distance difference between each light-emitting crystal to the same heterochromatic sensitive area is less than 1mm). However, the heterochromatic phenomenon caused by such micro-distance difference is not discernible by the human eye.

In this invention, the key cap 12 has a heterochromatic sensitive area in the vertical direction D1. The heterochromatic sensitive area is, for example, the gap projection G between the first bracket 16 and the second bracket 18 of the key cap 12. The entirety of the multiple light-emitting crystals 22a, 22b, and 22c does not overlap with the gap projection G. Since the different colored lights emitted by the multiple light-emitting crystals 22a, 22b, and 22c can travel at a similar distance, the effect of the gap projection G on uneven light mixing and color deviation can be suppressed.

In addition, please also refer to Figure 10 and Figure 12. In this embodiment, the bottom plate 14 has an outer plate edge 146 closest to the light-emitting chips 22a, 22b, 22c in the horizontal direction D3", and the light-emitting chips 22a, 22b, 22c and the outer plate edge 146 have a light-emitting distance d3 in the horizontal direction D3". In principle, the farther the light-emitting crystals 22a, 22b, and 22c are from the outer edge 146, the more the bottom plate 14 can suppress the light emitted by the light-emitting crystals 22a, 22b, and 22c from escaping from the outer edge 146; in actual operation, the appropriate light-emitting distance d3 of multiple models is 4.8mm, 5.3mm, 6.2mm, 7.1mm, and 7.7mm, and this light-emitting distance d3 is preferably between 4.8 and 7.7mm. In addition, in this embodiment, the arrangement direction D2" of the light-emitting crystals 22a, 22b, and 22c is parallel to the outer edge 146, but this is not limited to this in actual operation.

In addition, please also refer to FIG13A, which is a top view of the luminous key structure in FIG10, wherein the hidden outlines of the luminous grains 22a, 22b, 22c are shown with thin solid lines. Generally speaking, the arrangement direction of the monochromatic light source does not need to consider the length direction 12b' of the light-transmissive indication area 12a' of the key cap 12. However, in the case of a multi-color light source, for example, when the three colors of the light-emitting crystals 22a, 22b, and 22c are mixed to form various colors that need to be presented, if the arrangement direction D2" of the light-emitting crystals 22a, 22b, and 22c is perpendicular to the length direction 12b' of the light-transmitting indication area 12a' of the key cap 12, the two light-emitting crystals 22a and 22c on the outside provide the most sufficient light in the adjacent character segments, but the character segments far from the light-emitting crystals 22a and 22c have insufficient light, resulting in color deviation problems in the two end segments of the light-transmitting indication area 12a' in the length direction 12b'. Furthermore, FIG13B is a top view of another embodiment extending FIG13A, wherein the light-emitting grains 22a", 22b", and 22c" are arranged in a triangle (in terms of the line connecting their centers), that is, the long sides of the light-emitting grain 22b" and the long sides of the light-emitting grain 22c" are arranged in a straight line perpendicular to the arrangement direction D2", and the light-emitting grain 22a" is not located within the union range of the light-emitting grains 22b" and 22c"; if necessary, the long side of the light-emitting grain 22a" is parallel to the short sides of the light-emitting grains 22b" and 22c", but the long side of the light-emitting grain 22a" is perpendicular to the long sides of the light-emitting grains 22b" and 22c". The arrangement direction D2" of at least two luminescent crystal grains 22b", 22c" is perpendicular to the length direction 12b'/long axis direction 12c' of the light-transmissive indication region 12a', and is also perpendicular to the horizontal direction D3", and is parallel to the short axis direction 12d'. Since the luminescent crystal grains 22b", 22c" are located on the same side of the same heterochromatic sensitive region, i.e., the same side of the first transmissive character "L" or the second transmissive character "d" of the last character, and the distances to the same heterochromatic sensitive region, i.e., the last character "L" or "d", are close to each other, the heterochromatic problem can be eliminated. As for the third luminescent crystal grain 22a', it is preferably located close to the midline of the short axis 12d' of the light-transmissive indication region 12a'. At this time, there is no other luminous body except the luminescent crystals 22a", 22b", 22c" below the light-transmitting indication area 12a'. If necessary, the line connecting the first light-transmitting character "L" and the second light-transmitting character "d" passes through the union range of the luminescent crystals 22a", 22b", 22c"; or the line connecting the first light-transmitting character "L" and the second light-transmitting character "d" can pass through the luminescent crystal 22a"; or the center of the union range of the luminescent crystals 22a", 22b", 22c" is located at the center point of the long axis of the light-transmitting indication area 12a'. In general, the luminescent crystals 22a", 22b", 22c" are preferably located near the geometric center of the light-transmitting indication area 12a'.

In this embodiment, the length direction 12b' of the light-transmitting indication area 12a' of the key cap 12 located above the light-emitting crystals 22a, 22b, 22c is perpendicular to the arrangement direction D2", so that the effect of uneven light mixing caused by the staggered arrangement of the light-emitting crystals 22a, 22b, 22c on the light-transmitting indication area 12a' can be reduced or eliminated. In addition, for other descriptions of the relative position relationship between the light-emitting crystals 22a, 22b, 22c and the light-transmitting indication area 12a', please refer to the previous The description of the relative position relationship between the luminescent grains 22a, 22b, 22c and the light-transmitting indication area 12a and its variations is not repeated here. In addition, in the present embodiment, the through hole 144 is roughly rectangular, and its hole edges 144a, 144b are parallel to the sides of the light-transmitting indication area 12a', and the arrangement direction D2" of the luminescent grains 22a, 22b, 22c is also parallel to the hole edges 144a, 144b of the through hole 144 (also equivalent to the inner plate edge), as shown in Figures 10 and 12. This configuration helps to reduce the impact of the through hole 144 on the light field provided by the luminescent grains 22a, 22b, 22c to the light-transmitting indication area 12a'. This description is also applicable to the arrangement of the light-emitting crystals 22a, 22b, 22c relative to the through hole 142" in Figures 8 and 9 (where the light-emitting crystals 22a, 22b, 22c are also arranged parallel to the hole edge 142a". In addition, the arrangement of the parallel hole edge can also be applied to the arrangement of the light-emitting crystals 22a, 22b, 22c relative to the through hole 142 (for example, modified to a rectangular hole) in the light-emitting key structure 1, which will not be described separately.

In addition, in the luminous key structure, the luminous crystals 22a, 22b, 22c can be modified in actual operation to be disposed above the bottom plate 14, so as to avoid the bottom plate 14 interfering with the light emitted by the luminous crystals 22a, 22b, 22c. In this case, the bottom plate 14 does not need to form through holes corresponding to the luminous crystals 22a, 22b, 22c, which is beneficial to the strength of the bottom plate 14. Furthermore, the light-emitting chips 22a, 22b, and 22c can be integrated into the circuit of the switch circuit board 20. For example, the light-emitting chips 22a, 22b, and 22c are directly arranged on the lower transparent sheet of the switch circuit board 20, and the circuit thereon provides power. The middle and upper transparent sheets form corresponding openings to expose the light-emitting chips 22a, 22b, and 22c. This structural configuration can eliminate the interference of the switch circuit board 20 with the light emitted by the light-emitting chips 22a, 22b, and 22c.

In addition, in the light-emitting key structures 1 and 3, the first bracket 16 and the second bracket 18 are pivoted to each other at the pivot axis A1 (indicated by a dotted line in the figure) at their middle parts to form an X-shaped scissor-leg support frame, but the actual operation is not limited to this. For example, the first bracket 16 and the second bracket 18 can be pivoted to each other at their ends, or directly connected to the bottom plate 14 at their ends to form a V-shaped butterfly-leg support or an inverted V-shaped bat bracket. For another example, the first bracket 16 and the second bracket 18 can be arranged opposite and separately (for example, each can be rotatably connected to the bottom plate 14), and a linkage bracket is used to link the first bracket 16 and the second bracket 18. In addition, the luminous key structures 1 and 3 use the elastic protrusion 26 as the restoring force mechanism, but this is not limited to the actual operation. For example, a spring or magnetic attraction mechanism can be used to realize the restoring force mechanism.

In actual operation, as shown in FIG. 10 , in this embodiment, the key cap 12 has a light-transmitting indication area 12a', and the light-transmitting indication area 12a' has a length direction 12b', and the articulated axis A1 is parallel to the length direction 12b' of the light-transmitting indication area 12a'. When the light-emitting crystal grains 22a, 22b, and 22c are arranged as shown in FIG. 11A , the light of different colors emitted by the light-emitting crystal grains 22a, 22b, and 22c can travel to the end of the light-transmitting indication area 12a' at a similar distance, thereby suppressing the problems of uneven light mixing and color deviation.

In addition, the above text uses the light-emitting key structures 1 and 3 to respectively illustrate the relative positional relationship between the light-emitting chips 22a, 22b, 22c and the circuit of the switch circuit board 20 and the first bracket 16 and the second bracket 18. In other embodiments, the light-emitting key structure may also have both situations. For example, the switch contact 202 is adjacent to or located below the first bracket 16 or the second bracket 18, and the light-emitting chips 22a, 22b, 22c are located below the first bracket 16 or the second bracket 18. For another example, the light-emitting chips 22a, 22b, 22c located below the first bracket 16 or the second bracket 18 are also adjacent to the circuit of the switch circuit board 20. In addition, in actual applications, some structural features in each embodiment may also be applied to other embodiments. For example, when the light-emitting chips 22a, 22b, and 22c located below the base plate 14 are arranged close to the circuit of the switch circuit board 20, the light-emitting chips 22a, 22b, and 22c may also be close to the edge of the base plate 14, and the aforementioned light-emitting key structure 3 is applicable.

Although this invention discloses the above-mentioned preferred practical operating range of the light emitting distances d1, d2, and d3 through actual application data, in actual operation, the preferred practical operating range of the light emitting distances d1, d2, and d3 of this invention is slightly sacrificed in light emitting effect, and a certain level of overall optical design benefit can still be achieved. Therefore, the addition or subtraction of 15% to 20% of the end value of the preferred practical operating range of the light emitting distances d1, d2, and d3 of this invention should still be within the coverage of the light emitting distances d1, d2, and d3 of this invention.

In addition, in the aforementioned embodiments, the light-emitting chips 22a, 22b, 22c (or the light-emitting chips 22a', 22b', 22c', or the light-emitting chips 22a", 22b", 22c") can be packaged together in the same package body in practice, or the chips can be packaged individually. In addition, in the case where a plurality of light-emitting chips are packaged in a single package body, the single package body can package three or more light-emitting chips. For example, please refer to FIG. 14 and FIG. 15. FIG. 14 is a light-emitting chip package body according to a first embodiment. FIG. 15 is a schematic diagram of the light-emitting chip package 42 along the line W-W in FIG. 14. The light-emitting chip package 42 includes a carrier 420, a plurality of light-emitting chips (including three light-emitting chips 422a, 422b, and 422c in this embodiment) placed on the carrier 420, and a light-transmitting packaging material 424 covering the plurality of light-emitting chips 422a, 422b, and 422c (wherein, since the light-transmitting packaging material 424 is light-transmitting, the light-emitting chips 422a, 422b, and 422c are transparent to light). The outline of the carrier 420 is shown in FIG. 14 with thin solid lines. In this embodiment, the carrier 420 has side walls 420a around it to form a receiving space 420b. The light-emitting chips 422a, 422b, and 422c are received in the receiving space 420b, and the light-transmitting packaging material 424 fills the receiving space 420b and covers the light-emitting chips 422a, 422b, and 422c. In practice, the carrier 420 may include a lead frame and a container combined with the lead frame (for example, but not limited to, by injection molding); The simplified diagram shows the carrier 420 in a simple structure. Taking the light-emitting crystal 422a as an example, the light-emitting crystal 422a has a top light-emitting surface and four side light-emitting surfaces. The light-emitting crystal 422a can emit light from the top light-emitting surface and the side light-emitting surface; the light-emitting crystals 422b and 422c are the same and will not be described separately. In addition, the arrangement spacing of each light-emitting crystal 422a, 422b, and 422c depends on the actual manufacturing process and will not be described separately; for example, when mini-LED is used, the arrangement spacing can be hundreds of microns.

In addition, in this embodiment, the carrier 420 may be opaque, the carrier 420 may reflect light (for example, the carrier 420 may be made of white material or a reflective coating may be applied to the inner surface of the accommodating space 420b to increase the light reflection efficiency), or the thickness of the white material may be controlled to make it partially reflective and semi-transparent, which is helpful to improve the light mixing effect (i.e., increase the uniformity of light when it is emitted from the top surface 424a of the transparent packaging material 424 to the light-emitting chip package 42). In addition, in this embodiment, the light is emitted from the top surface 424a of the transparent packaging material 424 to the light-emitting chip package 42 in the vertical direction D1. In practice, the carrier 420 may not include the protruding side wall 420a. For example, in FIG. 16 , the carrier 420 'does not have a protruding side wall, so that light can also be emitted from the light-emitting chip package 42 in the horizontal directions D4a and D4b (indicated by double-headed arrows in the figure); wherein the light-transmitting packaging material 424 'has exposed side surfaces 424b and 424c, the side surface 424b is parallel to the vertical direction D1 and the horizontal direction D4a, and the side surface 424c is parallel to the vertical direction D1 and the horizontal direction D4b. In addition, the horizontal directions D4a and D4b are perpendicular to each other, but this is not limited to the practice.

To simplify the drawing, in FIG. 17 (which is a top view of the configuration of the light-emitting chip package 42 (or 42')), the overall outline of the light-emitting chip package 42 or 42' is drawn with a single thick box, and the light-emitting chips 422a, 422b, and 422c are drawn with thin boxes, and the color of the light emitted by the light-emitting chips 422a, 422b, and 422c is also marked in the figure (for example, red is marked with R, green is marked with G, and blue is marked with B). As shown in FIG. 14 and FIG. 17, in the first embodiment, the light-emitting chips 422a, 422b, and 422c are distributed in a plane and are all single-color light-emitting chips; wherein the light-emitting chip 422a emits red light, the light-emitting chip 422b emits green light, and the light-emitting chip 422c emits blue light. As shown in FIG. 17 , among the light-emitting chips 422a, 422b, and 422c, two adjacent light-emitting chips 422a and 422b arranged in a first arrangement direction (i.e., horizontal direction D4a) perpendicular to the vertical direction D1 (e.g., along the horizontal dotted line in the drawing) emit different colored lights (red light and green light, respectively). In the case of the light-emitting die package 42' (which has exposed side surfaces 424b, 424c; in contrast, in the case of the light-emitting die package 42, the side surface of its light-transmitting packaging material 424 is covered by the protruding side wall 420a), this configuration can make the light emitted by the light-emitting die package 42 in the direction perpendicular to the horizontal direction D4a not have only the same color light (in terms of the direction of Figure 17, the lower side of the light-emitting die package 42 can directly receive red light and green light at the same time), thereby helping to reduce the degree of color deviation in this direction.

Similarly, two adjacent light-emitting chips 422b and 422c arranged in the second arrangement direction (i.e., horizontal direction D4b) perpendicular to the vertical direction D1 (e.g., along the vertical dotted line on the right side of the drawing) emit different colored lights (green light and blue light, respectively). In the case of the light-emitting chip package 42', this configuration can make the light emitted by the light-emitting chip package 42 in the direction perpendicular to the horizontal direction D4b not have only the same color light (in terms of the direction of FIG. 17, the left side of the light-emitting chip package 42 can directly receive green light and blue light at the same time), thereby helping to reduce the degree of color deviation in this direction.

As shown in FIG. 16 , the light-emitting grains 422a and 422b are arranged closer to the side surface 424b of the light-emitting grain package 42' than the other light-emitting grains 422c. The light-emitting grains 422a and 422b respectively have grain edges parallel to the side surface 424b, and the light-emitting grains 422a and 422b are arranged parallel to the side surface 424b. A side light-emitting surface of the light-emitting grain 422a faces the same direction as the side surface 424b; the light-emitting grain 422b is the same and will not be described separately. In addition, the aforementioned description of the light-emitting grain package 42' is also applicable to the light-emitting grain package 42 and will not be described separately.

In addition, as shown in FIG17 , the plurality of light-emitting crystals 422a, 422b, and 422c emit more than three colors of light (red light, green light, and blue light), and the area of the top light-emitting surface corresponding to each color of light is equal (in this embodiment, the area of the top light-emitting surface of the light-emitting crystals 422a, 422b, and 422c is equal). However, in practice, the light-emitting crystal package 42 is not limited to including three light-emitting crystals. Please refer to FIG18 , which is a top view of a configuration diagram of a light-emitting crystal package 43 according to a second embodiment. The light-emitting crystal package 43 includes four light-emitting crystals, which emit green light, blue light, green light, and red light, respectively. The relevant descriptions of the aforementioned light-emitting crystal packages 42 and 42' are applicable here and are also applicable, and will not be elaborated on separately. For another example, as shown in FIG. 19 , a light-emitting chip package 43a according to a third embodiment also includes four light-emitting chips, which respectively emit green light, blue light, green light and red light. Similarly, the above-mentioned descriptions of the light-emitting chip packages 42 and 42' are applicable here and are also applicable, and will not be elaborated on separately.

For another example, as shown in FIG. 20 , a light-emitting chip package 43b according to a fourth embodiment includes five light-emitting chips, which respectively emit green light, blue light, red light, green light and blue light. Similarly, the above-mentioned descriptions of the light-emitting chip packages 42 and 42' are applicable here and are also applicable, and will not be elaborated on separately.

For another example, as shown in FIG. 21 , a light-emitting chip package 43c according to a fifth embodiment includes six light-emitting chips, which emit green light, blue light, red light, green light and blue light respectively. Similarly, the above-mentioned descriptions of the light-emitting chip packages 42 and 42' are applicable here and are also applicable, and will not be elaborated on separately.

For another example, as shown in FIG. 22 , a light-emitting chip package 43d according to a sixth embodiment includes eight light-emitting chips, which respectively emit green light, red light, blue light, green light, red light, green light, blue light and red light. Similarly, the above-mentioned descriptions of the light-emitting chip packages 42 and 42' are applicable here and are also applicable, and are not further described. In addition, in this embodiment, the light-emitting chips of the light-emitting chip package 43d are arranged in a rectangular ring, and any two adjacent light-emitting chips along the rectangular ring emit different colors of light.

In the embodiments of the aforementioned light-emitting chip packages 42, 42', 43a, 43b, 43c, and 43d, at least one side of each light-emitting chip faces outward; for example, in the light-emitting chip package 43d shown in FIG. 22 (in terms of the direction of the drawing of FIG. 22), the right side and the upper side of the blue light-emitting chip on the right side face outward, the right side of the green light-emitting chip on the right side faces outward, the right side and the lower side of the red light-emitting chip on the right side face outward, the upper side of the red light-emitting chip in the middle faces outward, the lower side of the green light-emitting chip in the middle faces outward, and so on. This configuration helps to improve the utilization rate of the light emitted from the side of the light-emitting chip package. However, the implementation is not limited to this. For example, a light-emitting chip is also set at the location of the dashed frame in Figure 22.

In practical applications, the aforementioned light-emitting chip packages 42, 42', 43a, 43b, 43c, 43d can directly replace the aforementioned light-emitting chips 22a, 22b, 22c, light-emitting chips 22a', 22b', 22c', or light-emitting chips 22a", 22b", 22c" and be disposed in the light-emitting key structures 1, 3. For example, the light-emitting chip package 43d (as shown in FIG. 19) replaces the light-emitting chips 22a, 22b, 22c (of the light-emitting key structure 1) in FIG. 4A and is fixed on the light source circuit board 24 (see FIG. 2), and its top view configuration is shown in FIG. 23, and its cross-sectional configuration is shown in FIG. 24 ( Equivalent to the light-emitting chips 22a, 22b, and 22c in FIG. 3 being replaced by the light-emitting chip package 43d). The circuit (including the switch contact 202) of the switch circuit board 20 (see FIG. 2) does not overlap in the vertical direction D1. In the light-emitting chip package 43d, the plurality of light-emitting chips that are closer to the flat edge 202a of the switch contact 202 than other light-emitting chips in the horizontal direction D3 (perpendicular to the vertical direction D1) (i.e., the blue light-emitting chips, green light-emitting chips, and red light-emitting chips on the lower side in terms of the direction of the drawing of FIG. 23) are arranged parallel to the flat edge 202a (i.e., arranged along the direction D2).

In addition, as shown in FIG. 24 , the light-emitting chip package 43d is located in the through hole 142 of the bottom plate 14, and the vertical projections of the switch contact 202 and the light-emitting chip package 43d on the bottom plate 14 both fall within the through hole 142. The light-emitting chip package 43d does not exceed the upper surface 142c of the bottom plate 14 in the vertical direction D1 (i.e., the top surface of the light-emitting chip package 43d (e.g., the top surface 424a of the light-transmitting packaging material 424, see FIG. 14 or FIG. 15 ) is lower than or equal to the upper surface 142c).

In this example, the through hole 142 (as shown in FIG. 2 ) is circular, but the embodiment is not limited thereto. For example, in a variation of the through hole 142, a through hole 142' (its outline projection is shown in FIG. 23 as a dotted line) of the bottom plate 14 has a portion of an arc edge parallel to the arc edge of the switch contact 202, and the other side has three edges perpendicular to each other (i.e., three straight hole edges 142a', 142b', 142c'), forming a bullet-shaped through hole as a whole. In terms of the direction of the drawing of FIG. 23 , the adjacent light-emitting chips on the left side of the light-emitting chip package 43d (i.e., the blue light-emitting chip, the red light-emitting chip, and the green light-emitting chip on the left side) are closer to the hole edge 142b' than other light-emitting chips in the horizontal direction perpendicular to the vertical direction D1 (i.e., equivalent to the direction D2) and are arranged parallel to the straight hole edge 142b' (i.e., arranged along the direction D3) (or arranged perpendicular to the straight hole edge 142a'). Thus, the shielding conditions of the light-emitting chips on the left side of the light-emitting chip package 43d by the hole edge 142b' are similar, which helps to reduce the influence of the hole edge 142b' on the backlight uniformity provided by the light-emitting chip package 43d. For the straight hole edges 142a' and 142c', the light-emitting chip package 43d also has a configuration in which the light-emitting chips corresponding to the straight hole edges 142a' and 142c' are arranged in parallel, which will not be described separately.

For another example, in another variation of the through hole 142, as shown in FIG. 25, the through hole 143 of the bottom plate 14 (whose outline is shown in the figure with a thick solid line) includes a main hole portion 143a and two extension portions 143b extending from both sides of the main hole portion 143a, and the vertical projection of the switch contact 202' on the bottom plate 14 (shown in the figure with a thin solid line) falls within the main hole portion 143a, and the vertical projection of the light-emitting chip package 43d on the bottom plate 14 (shown in the figure with a thin solid line) falls within one of the extension portions 143b. In this embodiment, a light-emitting chip package 43d (shown in the figure with a dotted line) is also provided corresponding to the other extension portion 143b. In this way, the switch contact 202' can also directly avoid covering the light-emitting chip package 43d. In addition, the two extensions 143b are arranged at 180 degrees, but this is not limited to practice; for example, the two extensions 143b can be arranged at 120 degrees (logically, this still belongs to the situation of being arranged on both sides of the main hole 143a).

For another example, in another variation of the through hole 142, as shown in FIG26, the through hole 143' of the base plate 14 (its outline is shown in the figure with a thick solid line). The vertical projection of the switch contact 202" on the base plate 14 (shown in the figure with a thin solid line) falls outside the through hole 143' and is adjacent to the through hole 143'. The vertical projection of the light-emitting chip package 43d on the base plate 14 (shown in the figure with a thin solid line) falls inside the through hole 143'. In this way, the switch contact 202" can also directly avoid covering the light-emitting chip package 43d. In addition, the through hole 143' is fan-shaped and (from the viewing angle of FIG26) extends closely to the inner edge of the through hole 143'. In addition, in practice, a through hole 143' (shown in dotted lines in the figure) can be provided on the other side of the switch contact 202", and a light-emitting chip package 43d (shown in dotted lines in the figure) is also provided corresponding to the through hole 143'. In addition, in practice, the central angle corresponding to the fan-shaped extension is not limited to the situation shown in the figure that is less than 180 degrees, and the two through holes 143' are not limited to the configuration of the same outline and symmetrical arrangement. In this embodiment, the through hole 143' is provided to avoid the circuit layout, so in practice the through hole 143' may also have a C-shaped outline (for example, modifying the lead of the switch contact 202" in the figure to be located on the same side), but the practice is not limited to this. In addition, in practice, the outline of the through hole 143' is not limited to a fan-shaped.

In the foregoing, as shown in FIG8 , the light-emitting chips 22a, 22b, 22c and the wire segment 204 are staggered (i.e., they do not overlap in the vertical direction D1). Similarly, in actual applications, the light-emitting chips 22a, 22b, 22c can also be replaced by a light-emitting chip package 43d, as shown in FIG27 . The wire segment 204 extends in a straight line. In the light-emitting chip package 43d, a plurality of light-emitting chips among the plurality of light-emitting chips that are closer to the wire segment 204 than other light-emitting chips in the horizontal direction D3' (perpendicular to the vertical direction D1) (i.e., in terms of the direction of the drawing of FIG27 , the green light-emitting chip, the red light-emitting chip, and the blue light-emitting chip on the left side (e.g., see FIG22 )) are arranged in parallel (i.e., arranged along the direction D2') adjacent to the wire segment 204. The previous explanations about Figures 8 and 9 are also applicable here and will not be elaborated on separately.

In the above text, as shown in FIG11A , the light-emitting chips 22a, 22b, 22c are located under one of the brackets (e.g., the first bracket 16). In actual applications, the light-emitting chips 22a, 22b, 22c can also be replaced by a light-emitting chip package 43d, as shown in FIG28 . In the light-emitting chip package 43d, among the plurality of light-emitting chips, a plurality of light-emitting chips that are closer to the gap projection G (having a length direction, equivalent to the direction D2"; the gap projection G extends roughly along this length direction) in a horizontal direction D3" perpendicular to the vertical direction D1 than other light-emitting chips (i.e., in terms of the direction of the drawing of FIG. 28, the green light-emitting chip, the red light-emitting chip, and the blue light-emitting chip on the left side (for example, see FIG. 22)) are arranged parallel to the length direction and have chip edges parallel to the length direction (for example, the left side edge of the above-mentioned light-emitting chip). Thereby, the shielding conditions of the gap projection G on the left side light-emitting chip in the light-emitting chip package 43d are similar, which helps to reduce the influence of the gap projection G on the backlight uniformity provided by the light-emitting chip package 43d. Furthermore, in this embodiment, the light-emitting chip package 43d is completely located below the first bracket 16, so that the light emitted by each light-emitting chip in the light-emitting chip package 43d can travel along a similar path, thereby reducing the degree of color deviation that may be generated after the light passes through the first bracket 16. The relevant description of Figure 11A above is also applicable here and is not repeated. For example, the light-emitting chip package 43d can be changed to be located below the second bracket 18 (such as the light-emitting chip package 43d shown in dotted lines in the figure).

In the above, as shown in FIG7, FIG13A and FIG13B, the luminescent chips 22a, 22b, 22c are entirely overlapped with the light-transmissive indicating regions 12a, 12a' in the vertical direction D1. In practical applications, the luminescent chips 22a, 22b, 22c can also be replaced by the luminescent chip package 43d. As shown in FIG. 29 , the light-transmitting indication area 12a′ is rectangular, on which a long axis 12c′ and a short axis 12d′ (both indicated by chain lines in the figure) can be defined. The long axis 12c′ is parallel to the long direction 12b′, and the short axis 12d′ is perpendicular to the long direction 12b′ (and also parallel to the direction D2″). The geometric center of the light-transmitting indication area 12a′ (equivalent to the intersection of the long axis 12c′ and the short axis 12d′) overlaps with the light-emitting chip package 43d in the vertical direction D1 (or the geometric center falls on the light-emitting chip package 43d). Further, in this embodiment, the geometric center of the light-transmissive indication area 12a' coincides with the geometric center of the light-emitting chip package 43d; however, this is not limited to the practice. For example, the geometric center of the light-emitting chip package 43d deviates from the geometric center of the light-transmissive indication area 12a', as shown in the light-emitting chip package 43d shown by the dotted line in the figure. At this time, the vertical projection of the entire light-emitting chip package 43d still falls within the range of the light-transmissive indication area 12a') , but the implementation is not limited to this; for example, the vertical projection of the entire luminescent chip package 43d exceeds the range of the light-transmitting indication area 12a' (for example, in Figure 13A, the vertical projections of the luminescent chips 22a and 22c all exceed the range of the light-transmitting indication area 12a', so the vertical projection of the entire luminescent chips 22a, 22b, and 22c exceeds the range of the light-transmitting indication area 12a'). In addition, in this embodiment, the light-transmitting indication area 12a' includes a plurality of light-transmitting characters. Legend (such as the word "Legend" in the figure) is arranged along the length direction 12b'. The grain edges of the light-emitting grains in the light-emitting grain package 43d are parallel or perpendicular to the length direction 12b' (for example, the light-emitting grain in the upper left corner, the green light-emitting grain, has its upper and lower side edges parallel to the length direction 12b' (i.e. parallel to the long axis 12c'), and its left and right side edges are perpendicular to the length direction 12b'). The relevant descriptions of Figures 7, 13A and 13B above are also applicable here and are not elaborated separately.

The above description uses the light-emitting chip package 43d to replace the light-emitting chips 22a, 22b, and 22c as an example. In principle, the light-emitting chip packages 42, 42', 43a, 43b, 43c, and 43d can also replace the light-emitting chips 22a, 22b, and 22c, the light-emitting chips 22a', 22b', and 22c', or the light-emitting chips 22a", 22b", and 22c" and be applied to various embodiments, which will not be described in detail.

In addition, in practice, the aforementioned embodiments can be matched with a light guide sheet to guide and mix the light emitted by the light-emitting chip package 42, 42', 43a, 43b, 43c, 43d, and the light-emitting chips 22a, 22b, 22c, 22a', 22b', 22c', 22a", 22b", 22c". Please refer to FIG. 30, the light-emitting key structure 4 shown therein is similar to the light-emitting key structure 1, so the light-emitting key structure 4 uses the component symbols of the light-emitting key structure 1. For other descriptions of the light key structure 4, please refer to the descriptions of the light key structure 1 and its variations in the previous text, which will not be elaborated on separately. The light key structure 4 is generally different from the light key structure 1 in that the light key structure 4 further includes a light guide plate 28 disposed below the bottom plate 14. The light guide plate 28 has a receiving groove 282 (for example, implemented as a through hole), and the light emitting chip package 43d (or other light emitting chip packages 42, 42', 43a, 43b, 43c) is located in the receiving groove 282. The light emitted by the light-emitting chip package 43d enters the light guide plate 28 from the inner wall surface 282a of the receiving groove 282. The light entering the light guide plate 28 can leave the light guide plate 28 from the upper surface 284 of the light guide plate 28. As shown in FIG. 30, the bottom plate 14 does not shield the light guide plate 28 at its through hole 142, so the light can pass through it to shine upward toward the key cap 12. In terms of structural characteristics, the bottom plate 14 has a light-proof effect in principle, so it can also serve as a mask layer. In addition, in this embodiment, The projection of the switch contact 202 of the switch circuit board 20 on the bottom plate 14 also falls within the through hole 142, but this is not limited to this in practice. For example, the switch contact 202 is moved to another place (away from the through hole 142) or there is a physical structure of the bottom plate 14 below the switch contact 202, so that the light leaving the upper surface 284 of the light guide sheet 28 will not directly irradiate the switch contact 202, which helps to reduce the impact of the light reflected from the switch circuit board 20 (such as the change in the color of the reflected light).

In addition, in practice, a mask layer 30 may be provided on the upper surface 284 of the light guide plate 28 for shielding the light guide plate 28, as shown in FIG31. In practice, the mask layer 30 may be implemented by a light-proof thin sheet, provided just above the light-emitting chip package, covering the receiving groove 282 (together with the light-emitting chip package 43d received therein), and forming a light-transmitting area 302a in a desired area (for example, by hollowing out the thin sheet), for example, corresponding to the through hole 142. The number and outline of the light-transmitting area 302a may be designed according to product requirements, without being disturbed by the structural design of the bottom plate 14 itself (for example, light leakage caused by a hollowed-out structure formed to form a connection structure of a bracket). In this embodiment, the vertical projection of the light-transmitting area 302a on the bottom plate 14 falls within the through hole 142. In addition, in practice, the receiving groove 282 is not limited to the through hole. For example, the receiving groove is implemented as a blind hole or a groove, and the opening of the receiving groove faces downward and is not connected to the upper surface 284. The aforementioned mask layer 30 can be implemented by an opaque coating layer and coated on the upper surface 284 (for example, but not limited to, by printing).

Please refer to FIG. 32 and FIG. 33 ; in FIG. 33 , the outline of the switch contact 203c is shown in thin solid lines, the outline of the light-emitting chip package 43d is shown in thick boxes, and the outlines of the receiving groove 282 of the light guide plate 28' and the light-transmitting area 302b of the mask layer 30' are shown in dotted lines. In this example, the vertical projections of the switch contact 203c, the receiving groove 282 of the light guide plate 28' (together with the light-emitting chip package 43d) and the light-transmitting area 302b of the light guide plate 28' on the bottom plate 14 all fall within the through hole 142. In addition, the light-emitting chip package 43d is located below the switch contact 203c; on the other hand, the switch contact 203c and the light-emitting chip package 43d overlap in the vertical direction D1. The two light-transmitting areas 302b of the mask layer 30' are arranged around the projection of the light-emitting chip package 43d on the mask layer 30'; in this embodiment, the light-transmitting areas 302b are fan-shaped (as shown in FIG. 33), symmetrically arranged and extending around the projection of the light-emitting chip package 43d on the mask layer 30'. In this embodiment, the light-transmitting areas 302b also extend around the projection of the switch contact 203c on the mask layer 30'; and the light-transmitting areas 302b extend substantially adjacent to the projection of the switch contact 203c on the mask layer 30'. In addition, in practice, the central angle corresponding to the fan-shaped extension is not limited to the situation shown in the figure that is less than 180 degrees, and the two light-transmitting areas 302b are not limited to the configuration of the same outline and symmetrical arrangement. In this embodiment, the light-transmitting area 302b is arranged to avoid the circuit layout, so in practice the light-transmitting area 302b may also be in a C-shaped outline (for example, the lead wires of the switch contact 203c in the figure are modified to be located on the same side), but the practice is not limited to this. In addition, in practice, the outline of the light-transmitting area 302b is not limited to a fan shape. On the other hand, the vertical projection of the opaque portion of the mask layer 30 on the bottom plate 14 at least partially falls within the through hole 142. For example, as shown in FIG. 32 , the portion of the mask layer 30 located above the light-emitting chip package 43d (which can be defined as a light-proof area) falls within the through hole 142; for another example, in FIG. 32 , the left side portion of the mask layer 30 (which can be defined as a light-proof area) forms the outline of a portion of the light-transmitting area 302b, and the vertical projection of this portion on the bottom plate 14 partially falls within the through hole 142.

In addition, in this embodiment, there may also be a physical structure of the bottom plate 14 between the switch contact 203c and the mask layer 30', which can provide structural support for the switch contact 203c, as shown in FIG34. In this embodiment, the bottom plate 14 forms a through hole 145 corresponding to the light-transmitting area 302b to expose the corresponding light-transmitting area 302b. In practice, the through hole 145 may also be (but not limited to) fan-shaped and have a similar outline to the light-transmitting area 302b. The vertical projection of the switch contact 203c on the bottom plate 14 falls outside the through hole 145 and is adjacent to the through hole 145.

The above is only the best embodiment of this creation. All equivalent changes and modifications made according to the scope of this new patent application should be covered by this creation.

142': Through hole

142a',142b',142c': Kong Yuan

20: Switch circuit board

202: switch contact

202a: Flat edge

43d: Light-emitting chip package

D1: vertical direction

D2: Arrangement direction

D3: Horizontal direction

Claims (20)

A light-emitting key structure comprises: a base plate; a key cap movably disposed above the base plate in a vertical direction; and a light-emitting crystal package disposed below the key cap and comprising a plurality of light-emitting crystals, wherein the plurality of light-emitting crystals are all single-color light-emitting crystals, wherein three adjacent light-emitting crystals arranged in a first arrangement direction perpendicular to the vertical direction emit three different colors of light, and the first arrangement direction is parallel to the long sides of the three adjacent light-emitting crystals. The light-emitting key structure as described in claim 1, wherein the light-emitting chip package body comprises a light-transmitting packaging material covering the plurality of light-emitting chips, and the light-transmitting packaging material has a side surface parallel to the first arrangement direction and the vertical direction. The light-emitting key structure as described in claim 1, wherein the three adjacent light-emitting chips among the plurality of light-emitting chips are arranged adjacent to a side surface of the light-emitting chip package. The light-emitting key structure as described in claim 1, wherein the light-emitting chip package includes a carrier having side walls to form a receiving space, and the plurality of light-emitting chips are received in the receiving space. The light-emitting key structure as described in claim 1, wherein the plurality of light-emitting crystals are arranged in a rectangular ring, and any two adjacent light-emitting crystals along the rectangular ring emit light of different colors. The light-emitting key structure as described in claim 1 further includes a light-transmissive switch circuit board disposed above the light-emitting chip package, wherein the switch circuit board includes a light-transmissive carrier structure and a circuit carried on the light-transmissive carrier structure, and the circuit and the light-emitting chip package do not overlap in the vertical direction. The light-emitting key structure as described in claim 1 further includes a light-transmissive switch circuit board disposed above the light-emitting chip package, wherein the switch circuit board includes a switch contact, the switch contact has a flat edge, and the three adjacent light-emitting chips among the plurality of light-emitting chips are arranged in parallel adjacent to the flat edge. The light-emitting key structure as described in claim 1 further includes a first bracket and a second bracket pivotally connected to each other, wherein the three adjacent light-emitting chips among the plurality of light-emitting chips do not overlap with the gap projections of the first bracket and the second bracket. The light-emitting key structure as described in claim 1 further includes a light-transmissive switch circuit board, the switch circuit board and the base plate are stacked on each other, the switch circuit board is arranged above the light-emitting chip package, the base plate has a through hole, the switch circuit board includes a switch contact, and the vertical projections of the switch contact and the light-emitting chip package on the base plate both fall within the through hole. The light-emitting key structure as described in claim 9, wherein the through hole includes a main hole portion and an extension portion extending from one side of the main hole portion, the vertical projection of the switch contact on the bottom plate falls within the main hole portion, and the vertical projection of the light-emitting chip package on the bottom plate falls within the extension portion. The light-emitting key structure as described in claim 1 further includes a light-transmissive switch circuit board stacked on the base plate, the switch circuit board is arranged above the light-emitting chip package, the base plate has a through hole, the switch circuit board includes a switch contact, the vertical projection of the light-emitting chip package on the base plate falls within the through hole, and the vertical projection of the switch contact on the base plate falls outside the through hole. The light-emitting key structure as described in claim 1 further includes a light-transmissive switch circuit board, which is stacked with the base plate and is disposed above the light-emitting chip package, wherein the switch circuit board includes a wire segment extending in a straight line, and the three adjacent light-emitting chips among the plurality of light-emitting chips are arranged in parallel adjacent to the wire segment. The luminous key structure as described in claim 1, wherein the key cap has a light-transmitting indication area, the light-transmitting indication area has a length direction, the light-transmitting indication area includes a plurality of light-transmitting characters arranged along the length direction, and the light-transmitting indication area and the light-emitting chip package at least partially overlap in the vertical direction. The luminous key structure as described in claim 1, wherein the key cap has a light-transmissive indication area, the light-transmissive indication area has a length direction, and the grain edges of the three adjacent luminous grains among the plurality of luminous grains are perpendicular to the length direction. The light-emitting key structure as described in claim 1 further includes a light guide plate disposed below the base plate, wherein the light guide plate has a receiving groove, the light-emitting chip package is located in the receiving groove, and the light emitted by the light-emitting chip package enters the light guide plate from the inner wall surface of the receiving groove. The light-emitting key structure as described in claim 1 further includes a mask layer, which is disposed directly above the light-emitting chip package and covers the light-emitting chip package. The light-emitting key structure as described in claim 1 further includes a mask layer covering the light-emitting chip package, wherein the mask layer has at least one light-transmitting area arranged around the projection of the light-emitting chip package on the mask layer. The luminous key structure as described in claim 17, wherein the base plate has a through hole, and the vertical projection of the light-transmitting area on the base plate falls within the through hole. The luminous key structure as described in claim 17, wherein the base plate has a through hole, and a vertical projection of an opaque area of the mask layer on the base plate at least partially falls within the through hole. The light-emitting key structure as described in claim 1, wherein the bottom plate has a through hole, the through hole has a straight hole edge, at least two adjacent light-emitting crystals of the plurality of light-emitting crystals are parallel to the straight hole edge, and the three adjacent light-emitting crystals of the plurality of light-emitting crystals are arranged perpendicular to the straight hole edge.

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