TWM398193U - LED package structure - Google Patents
LED package structure Download PDFInfo
- Publication number
- TWM398193U TWM398193U TW099218244U TW99218244U TWM398193U TW M398193 U TWM398193 U TW M398193U TW 099218244 U TW099218244 U TW 099218244U TW 99218244 U TW99218244 U TW 99218244U TW M398193 U TWM398193 U TW M398193U
- Authority
- TW
- Taiwan
- Prior art keywords
- light
- emitting diode
- substrate
- package structure
- disposed
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/853—Encapsulations characterised by their shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/0077—Moulds or cores; Details thereof or accessories therefor characterised by the configuration of the mould filling gate ; accessories for connecting the mould filling gate with the filling spout
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0025—Preventing defects on the moulded article, e.g. weld lines, shrinkage marks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0362—Manufacture or treatment of packages of encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Led Device Packages (AREA)
Description
M398193 五、新型說明: 【新型所屬之技術領域】 .極 本創作係關於一種封裝結構,尤指一種發光 體封裝結構。 x 【先前技術】 習知技術當中,發光二極體的封裝結構包含了美 板、發光二極體與封膠體,於製作時,先將發光二二 體設置於基板之上,其後再以模具覆蓋發光二極^ 並將封膠體灌入模具中以包覆發光二極體,於灌膠步 驟結束後再將模具移除及完成整個封裝動作。〜 然而,模具與基板間常會因縫隙而造成於罐 發生溢料形發生,當模具移除之後,封膠體邊緣就 會留有預期之外溢膠,如此—來就會造成發光二極體 封裝結構的瑕疵。 【新型内容】 緣此’本創作之主要目的係提供—種發光二極體 u結構m二極體封裝結構係具有光學修正元 < ’且料修正元件係由透光殼體 成’藉以_光學修正元件㈣好完紐。體/、门構 -種發光二極體封I结構係、包含基板、至少—路 光二極體以及光學修正元件;Κ " 士 \九一極1係設置於基 板上,並用以投射出一光束;光學修正元件係設置於 3 M398193 該光束之一行進路徑,用以修正該光束,並
光殼體與透光膠體;透光殼體係開設有至少;J 孔,倾置於該基板,該填充孔與該基板係形成= 置空間,透光膠體係經由該填充孔而填充至該 間内以封裝該發光二極體。 二 於本創作之-較佳實施例中,該透光殼體係 至少-修正部,該修正部係設置於該光束之該行進路
從,更進-步,該修正部係可由—凸透鏡、—凹透鏡、 -平凸透鏡、平凹透鏡與—凸凹透鏡中之至少―者所扭 成。 、 本創作藉由設置-個由透光殼體與透光勝體 學修Μ件’以維持發光二極體封裝結構的 hn此-封裝結構於製造過財並不需要移除 杈具,更能夠簡化發光二極體封裝結構的製造流程。 本創作所採用的具體實施例,將藉由以下之每 例及圖式作進一步之說明。 H也 【實施方式】 雕本創作係關於一種封裝結構,尤指一種發光二極 耻封裝結構。以下茲列舉較佳實施例以說明本創作, T熟習此項技藝者皆知此僅為舉例,而並非用以限定 遣I作本身。有關此較佳實施例之内容詳述如下。 一請同時參閱第一圖與第二圖’第一圖係為本創作發 光二極體封裝結構之外觀圖,第二圖係為沿第—圖中^ 4 M398193 AA切線之剖面圖。本創作之發光二極體封裝結構】〇〇 係包3基板11、至少一發光二極體12以及光學修正 元件13。 發光二極體12係設置於基板1〗上,並用以投射 出一光束L1。 - 光學修正元件]3係設置於該光束L]之一行進路 • 徑上,用以修正該光束L1,並且包含透光殼體】31與 • &光膠體132 ;透光殼體131係開設有至少—填充孔 〇卜亚设置於該基板n,該填充孔01與該基板11 係形成一容置空間H1;透光膠體132係經由該填充孔 01而填充至该容置空間H】内以封裝該發光二極體 12 ° 可以清楚觀察到,發光二極體]2所投射之光束 LI至少會經過透光膠體132,於製作時可以於透光膠 體132内添加燐光粉或其他可受光激發之材料,藉以 .調整光束L1通過透光膠體132後之顏色。 曰 除此之外,請參閱第三圖,第三圖係為具有修正 部之發光二極體封裝結構之剖面示意圖。與第二圖之發 光二極體封裝結構不同之處在於發光二極體封裝結構 100’的透光殼體⑶t可以具有至少一修正部】311,該 修正部⑶!係設置於該光束L2之該行進路徑上,當 然’填充孔G2之大小可以與填充孔〇1之大小不同田 而位置亦不一定要設置於發光二極體12之1上方 可設置於靠側邊處;更進—步,該修正部13]]係可設 5 計成由-凸透鏡、-凹透鏡、—平凸透鏡、平凹透鏡與 一凸凹透鏡中之至少一者所組成,而容置空間H2之形 狀也會因此改變,藉由變更修正部]311之形狀設計即 可改變光束L2之行進方向,亦即改變光束以通過光學 修正元件13後之照射態樣。 清爹閱第四圖’第四®係為本創作之發光二極體封 裝結購之一產品實施例。發光二極體封裝結構1〇〇可以 卡固於背框2QQ,並且藉由電源線細串連多個發光二 極體封裝結構1GO與背框,如此—來即可㈣的應 用於廣告看板等需要照明之用途中。 综合以上所述,由於料修正元件13是由透光殼 體⑶與透光膠體132#同構成,因此不需擔心透光 膠體132經由該填充孔01而填充至該容置空間出内 時’可能造成的溢勝狀況,且於製作時 後進行移除模具之動作,不僅能維持料二極體封裝 結構的光學品質’更能夠簡化發光二極體封裝結構的製 造流程。 籍由上述之本創作實施例可知,本創作確具產業上 =利用價值。惟以上之實施例說明’僅為本創作之較佳 =例說明,舉凡所屬技術領域中具有通常知識者當可 =據本創作之上述實_說明而作其它難之改良及 ^化。然而這些依據本創作實施例所作的_改良及變 化’當仍屬於本創作之創作精神及界定之專利範圍内。 【圖式簡單說明】 第圖係為本創作發光二極體封M Μ - .)L - a釘裒、、,口構之外觀圖; 奸-圖in “⑦-圖中之AA切線之剖面圖,· 乐二圖係為具有修正部之發光二極體封裝結構之剖 面示意圖;以及 第四圖係為本創作之發光二極體封裝結購之一產口 實施例。 % 【主要元件符號說明】 發光二極體封裝結構100、100, 基板11 發光二極體12 光學修正元件13 透光殼體131 修正部1311 透光膠體132 背框200 電源線300 光束LI、L2 容置空間HI、Η2 填充孔0卜〇2
Claims (1)
- M398193 六、申請專利範圍: 1. 一種發光二極體封裝結構,係包含: 一基板; 至少一發光二極體,係設置於該基板上,並用以投射 出一光束;以及 一光學修正元件,係設置於該光束之一行進路徑,用 以修正該光束,並且包含: 一透光殼體,係開設有至少一填充孔,並設置於該 基板,該填充孔與該基板係形成一容置空間;以 及 一透光膠體,係經由該填充孔而填充至該容置空間 内以封裝該發光二極體。 2. 如申請專利範圍第1項所述之發光二極體封裝結構, 其中該透光殼體係具有至少一修正部,該修正部係設 置於該光束之該行進路徑。 3. 如申請專利範圍第2項所述之發光二極體封裝結構, 其中該修正部係由一凸透鏡、一凹透鏡、一平凸透 鏡、平凹透鏡與一凸凹透鏡中之至少一者所組成。 8
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW099218244U TWM398193U (en) | 2010-09-21 | 2010-09-21 | LED package structure |
| US13/018,647 US20120068211A1 (en) | 2010-09-21 | 2011-02-01 | Led package structure |
| JP2011005495U JP3172956U (ja) | 2010-09-21 | 2011-09-20 | 発光ダイオード用パッケージ構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW099218244U TWM398193U (en) | 2010-09-21 | 2010-09-21 | LED package structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM398193U true TWM398193U (en) | 2011-02-11 |
Family
ID=45089012
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW099218244U TWM398193U (en) | 2010-09-21 | 2010-09-21 | LED package structure |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20120068211A1 (zh) |
| JP (1) | JP3172956U (zh) |
| TW (1) | TWM398193U (zh) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI562405B (en) | 2013-09-23 | 2016-12-11 | Brightek Optoelectronic Shenzhen Co Ltd | Method of manufacturing led package structure for preventing lateral light leakage |
| US11018284B2 (en) * | 2018-04-19 | 2021-05-25 | Innolux Corporation | Light emitting element and electronic device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1693614B1 (en) * | 2003-12-10 | 2009-12-16 | Okaya Electric Industries Co., Ltd. | Indicator lamp |
| EP1872053A2 (en) * | 2005-04-06 | 2008-01-02 | Tir Systems Ltd. | Lighting module with compact colour mixing and collimating optics |
-
2010
- 2010-09-21 TW TW099218244U patent/TWM398193U/zh not_active IP Right Cessation
-
2011
- 2011-02-01 US US13/018,647 patent/US20120068211A1/en not_active Abandoned
- 2011-09-20 JP JP2011005495U patent/JP3172956U/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP3172956U (ja) | 2012-01-19 |
| US20120068211A1 (en) | 2012-03-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK4K | Expiration of patent term of a granted utility model |