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TWM398193U - LED package structure - Google Patents

LED package structure Download PDF

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Publication number
TWM398193U
TWM398193U TW099218244U TW99218244U TWM398193U TW M398193 U TWM398193 U TW M398193U TW 099218244 U TW099218244 U TW 099218244U TW 99218244 U TW99218244 U TW 99218244U TW M398193 U TWM398193 U TW M398193U
Authority
TW
Taiwan
Prior art keywords
light
emitting diode
substrate
package structure
disposed
Prior art date
Application number
TW099218244U
Other languages
English (en)
Inventor
zong-xing Wu
Original Assignee
Lee Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lee Tech Co Ltd filed Critical Lee Tech Co Ltd
Priority to TW099218244U priority Critical patent/TWM398193U/zh
Priority to US13/018,647 priority patent/US20120068211A1/en
Publication of TWM398193U publication Critical patent/TWM398193U/zh
Priority to JP2011005495U priority patent/JP3172956U/ja

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/852Encapsulations
    • H10H20/853Encapsulations characterised by their shape
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00Moulds or cores; Details thereof or accessories therefor
    • B29C33/0077Moulds or cores; Details thereof or accessories therefor characterised by the configuration of the mould filling gate ; accessories for connecting the mould filling gate with the filling spout
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0025Preventing defects on the moulded article, e.g. weld lines, shrinkage marks
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/036Manufacture or treatment of packages
    • H10H20/0362Manufacture or treatment of packages of encapsulations

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Led Device Packages (AREA)

Description

M398193 五、新型說明: 【新型所屬之技術領域】 .極 本創作係關於一種封裝結構,尤指一種發光 體封裝結構。 x 【先前技術】 習知技術當中,發光二極體的封裝結構包含了美 板、發光二極體與封膠體,於製作時,先將發光二二 體設置於基板之上,其後再以模具覆蓋發光二極^ 並將封膠體灌入模具中以包覆發光二極體,於灌膠步 驟結束後再將模具移除及完成整個封裝動作。〜 然而,模具與基板間常會因縫隙而造成於罐 發生溢料形發生,當模具移除之後,封膠體邊緣就 會留有預期之外溢膠,如此—來就會造成發光二極體 封裝結構的瑕疵。 【新型内容】 緣此’本創作之主要目的係提供—種發光二極體 u結構m二極體封裝結構係具有光學修正元 < ’且料修正元件係由透光殼體 成’藉以_光學修正元件㈣好完紐。體/、门構 -種發光二極體封I结構係、包含基板、至少—路 光二極體以及光學修正元件;Κ " 士 \九一極1係設置於基 板上,並用以投射出一光束;光學修正元件係設置於 3 M398193 該光束之一行進路徑,用以修正該光束,並
光殼體與透光膠體;透光殼體係開設有至少;J 孔,倾置於該基板,該填充孔與該基板係形成= 置空間,透光膠體係經由該填充孔而填充至該 間内以封裝該發光二極體。 二 於本創作之-較佳實施例中,該透光殼體係 至少-修正部,該修正部係設置於該光束之該行進路
從,更進-步,該修正部係可由—凸透鏡、—凹透鏡、 -平凸透鏡、平凹透鏡與—凸凹透鏡中之至少―者所扭 成。 、 本創作藉由設置-個由透光殼體與透光勝體 學修Μ件’以維持發光二極體封裝結構的 hn此-封裝結構於製造過財並不需要移除 杈具,更能夠簡化發光二極體封裝結構的製造流程。 本創作所採用的具體實施例,將藉由以下之每 例及圖式作進一步之說明。 H也 【實施方式】 雕本創作係關於一種封裝結構,尤指一種發光二極 耻封裝結構。以下茲列舉較佳實施例以說明本創作, T熟習此項技藝者皆知此僅為舉例,而並非用以限定 遣I作本身。有關此較佳實施例之内容詳述如下。 一請同時參閱第一圖與第二圖’第一圖係為本創作發 光二極體封裝結構之外觀圖,第二圖係為沿第—圖中^ 4 M398193 AA切線之剖面圖。本創作之發光二極體封裝結構】〇〇 係包3基板11、至少一發光二極體12以及光學修正 元件13。 發光二極體12係設置於基板1〗上,並用以投射 出一光束L1。 - 光學修正元件]3係設置於該光束L]之一行進路 • 徑上,用以修正該光束L1,並且包含透光殼體】31與 • &光膠體132 ;透光殼體131係開設有至少—填充孔 〇卜亚设置於該基板n,該填充孔01與該基板11 係形成一容置空間H1;透光膠體132係經由該填充孔 01而填充至该容置空間H】内以封裝該發光二極體 12 ° 可以清楚觀察到,發光二極體]2所投射之光束 LI至少會經過透光膠體132,於製作時可以於透光膠 體132内添加燐光粉或其他可受光激發之材料,藉以 .調整光束L1通過透光膠體132後之顏色。 曰 除此之外,請參閱第三圖,第三圖係為具有修正 部之發光二極體封裝結構之剖面示意圖。與第二圖之發 光二極體封裝結構不同之處在於發光二極體封裝結構 100’的透光殼體⑶t可以具有至少一修正部】311,該 修正部⑶!係設置於該光束L2之該行進路徑上,當 然’填充孔G2之大小可以與填充孔〇1之大小不同田 而位置亦不一定要設置於發光二極體12之1上方 可設置於靠側邊處;更進—步,該修正部13]]係可設 5 計成由-凸透鏡、-凹透鏡、—平凸透鏡、平凹透鏡與 一凸凹透鏡中之至少一者所組成,而容置空間H2之形 狀也會因此改變,藉由變更修正部]311之形狀設計即 可改變光束L2之行進方向,亦即改變光束以通過光學 修正元件13後之照射態樣。 清爹閱第四圖’第四®係為本創作之發光二極體封 裝結購之一產品實施例。發光二極體封裝結構1〇〇可以 卡固於背框2QQ,並且藉由電源線細串連多個發光二 極體封裝結構1GO與背框,如此—來即可㈣的應 用於廣告看板等需要照明之用途中。 综合以上所述,由於料修正元件13是由透光殼 體⑶與透光膠體132#同構成,因此不需擔心透光 膠體132經由該填充孔01而填充至該容置空間出内 時’可能造成的溢勝狀況,且於製作時 後進行移除模具之動作,不僅能維持料二極體封裝 結構的光學品質’更能夠簡化發光二極體封裝結構的製 造流程。 籍由上述之本創作實施例可知,本創作確具產業上 =利用價值。惟以上之實施例說明’僅為本創作之較佳 =例說明,舉凡所屬技術領域中具有通常知識者當可 =據本創作之上述實_說明而作其它難之改良及 ^化。然而這些依據本創作實施例所作的_改良及變 化’當仍屬於本創作之創作精神及界定之專利範圍内。 【圖式簡單說明】 第圖係為本創作發光二極體封M Μ - .)L - a釘裒、、,口構之外觀圖; 奸-圖in “⑦-圖中之AA切線之剖面圖,· 乐二圖係為具有修正部之發光二極體封裝結構之剖 面示意圖;以及 第四圖係為本創作之發光二極體封裝結購之一產口 實施例。 % 【主要元件符號說明】 發光二極體封裝結構100、100, 基板11 發光二極體12 光學修正元件13 透光殼體131 修正部1311 透光膠體132 背框200 電源線300 光束LI、L2 容置空間HI、Η2 填充孔0卜〇2

Claims (1)

  1. M398193 六、申請專利範圍: 1. 一種發光二極體封裝結構,係包含: 一基板; 至少一發光二極體,係設置於該基板上,並用以投射 出一光束;以及 一光學修正元件,係設置於該光束之一行進路徑,用 以修正該光束,並且包含: 一透光殼體,係開設有至少一填充孔,並設置於該 基板,該填充孔與該基板係形成一容置空間;以 及 一透光膠體,係經由該填充孔而填充至該容置空間 内以封裝該發光二極體。 2. 如申請專利範圍第1項所述之發光二極體封裝結構, 其中該透光殼體係具有至少一修正部,該修正部係設 置於該光束之該行進路徑。 3. 如申請專利範圍第2項所述之發光二極體封裝結構, 其中該修正部係由一凸透鏡、一凹透鏡、一平凸透 鏡、平凹透鏡與一凸凹透鏡中之至少一者所組成。 8
TW099218244U 2010-09-21 2010-09-21 LED package structure TWM398193U (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW099218244U TWM398193U (en) 2010-09-21 2010-09-21 LED package structure
US13/018,647 US20120068211A1 (en) 2010-09-21 2011-02-01 Led package structure
JP2011005495U JP3172956U (ja) 2010-09-21 2011-09-20 発光ダイオード用パッケージ構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW099218244U TWM398193U (en) 2010-09-21 2010-09-21 LED package structure

Publications (1)

Publication Number Publication Date
TWM398193U true TWM398193U (en) 2011-02-11

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Application Number Title Priority Date Filing Date
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Country Status (3)

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US (1) US20120068211A1 (zh)
JP (1) JP3172956U (zh)
TW (1) TWM398193U (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI562405B (en) 2013-09-23 2016-12-11 Brightek Optoelectronic Shenzhen Co Ltd Method of manufacturing led package structure for preventing lateral light leakage
US11018284B2 (en) * 2018-04-19 2021-05-25 Innolux Corporation Light emitting element and electronic device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1693614B1 (en) * 2003-12-10 2009-12-16 Okaya Electric Industries Co., Ltd. Indicator lamp
EP1872053A2 (en) * 2005-04-06 2008-01-02 Tir Systems Ltd. Lighting module with compact colour mixing and collimating optics

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Publication number Publication date
JP3172956U (ja) 2012-01-19
US20120068211A1 (en) 2012-03-22

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