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TWI893145B - Injectors, processing equipment and cleaning equipment - Google Patents

Injectors, processing equipment and cleaning equipment

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Publication number
TWI893145B
TWI893145B TW110122775A TW110122775A TWI893145B TW I893145 B TWI893145 B TW I893145B TW 110122775 A TW110122775 A TW 110122775A TW 110122775 A TW110122775 A TW 110122775A TW I893145 B TWI893145 B TW I893145B
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TW
Taiwan
Prior art keywords
ejector
cleaning
driving fluid
inlet pipe
workpiece
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Application number
TW110122775A
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Chinese (zh)
Other versions
TW202210181A (en
Inventor
福岡武臣
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日商迪思科股份有限公司
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Publication of TW202210181A publication Critical patent/TW202210181A/en
Application granted granted Critical
Publication of TWI893145B publication Critical patent/TWI893145B/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • H10P72/0428
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02Cleaning by the force of jets or sprays
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • H10P72/0414

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Jigs For Machine Tools (AREA)
  • Pipe Accessories (AREA)
  • Fluid Mechanics (AREA)
  • General Engineering & Computer Science (AREA)

Abstract

[課題]提供一種噴射器,其可抑制液體已侵入噴射器的內部的情況下之吸引力的降低,並且以低價方式進行被處理物之加工或洗淨。 [解決手段]提供一種噴射器,為產生吸引力之噴射器,前述噴射器具備:流入管,於前端形成複數個開口,且從該開口噴射該驅動流體;流出管,在與該流入管的前端相向之位置具有可接收從該開口所噴射出之驅動流體的承接口;及本體部,包圍該開口與該承接口的周圍,且具有將外部流體吸引至內部之吸引路。 [Question] An ejector is provided that suppresses the reduction in suction force when liquid has intruded into the interior of the ejector, and that can process or clean a processed object at a low cost. [Solution] An ejector is provided that generates suction force, the ejector comprising: an inlet pipe having a plurality of openings formed at a front end, from which a driving fluid is ejected; an outlet pipe having a receiving opening at a position facing the front end of the inlet pipe for receiving the driving fluid ejected from the openings; and a main body that surrounds the openings and the receiving opening and has a suction path for drawing external fluid into the interior.

Description

噴射器、加工裝置及洗淨裝置Injectors, processing equipment and cleaning equipment

本發明是有關於一種產生吸引力之噴射器以及具備該噴射器之加工裝置以及洗淨裝置。The present invention relates to a sprayer for generating attraction, and a processing device and a cleaning device equipped with the sprayer.

個人電腦及智慧型手機等之電子機器具有IC(積體電路,Integrated Circuit)及LSI(大型積體電路,Large Scale Integration)等之半導體器件的晶片。該晶片是藉由分割在矽及碳化矽等之半導體基板的正面形成有功能層之晶圓來製造。Electronic devices such as personal computers and smartphones contain chips containing semiconductor devices such as ICs (Integrated Circuits) and LSIs (Large Scale Integration). These chips are manufactured by slicing wafers with functional layers formed on the front surface of a semiconductor substrate made of silicon or silicon carbide.

該晶圓藉由例如磨削背面而加工成所期望的厚度後,沿著分割預定線來切削而被分割。此外,因為加工時所產生之加工屑會附著在該晶圓及由該晶圓所製造出的一個個的晶片的正面,所以經常會在適當的時間點洗淨該晶圓及該晶片。After the wafer is processed to the desired thickness by, for example, grinding the back side, it is then cut along the predetermined separation lines to be separated. Furthermore, since the processing debris generated during the process adheres to the front side of the wafer and the individual chips manufactured from it, the wafer and the chips are often cleaned at appropriate times.

磨削或切削晶圓之加工裝置、與對該晶圓及由該晶圓所製造出的一個個晶片進行洗淨之洗淨裝置的每一種裝置包含工作夾台,前述工作夾台具有用於保持晶圓之保持面。Each of a processing device for grinding or cutting a wafer and a cleaning device for cleaning the wafer and individual chips manufactured from the wafer includes a work clamp having a holding surface for holding the wafer.

當對該晶圓及該晶片等進行加工及洗淨等的處理時,會對該晶圓及該晶片等的被處理物施加外力。一般而言,即使在這種情況下該工作夾台仍然將被處理物吸引並保持成不讓該被處理物移動(參照例如專利文獻1及2)。 先前技術文獻 專利文獻 When wafers and chips are processed, cleaned, or otherwise handled, external forces are applied to the workpieces. Generally, even in such situations, the worktable still attracts and holds the workpieces, preventing them from moving (see, for example, Patents 1 and 2). Prior Art Patent

專利文獻1:日本特開2009-246098號公報 專利文獻2:日本特開2010-36275號公報 Patent Document 1: Japanese Patent Application Publication No. 2009-246098 Patent Document 2: Japanese Patent Application Publication No. 2010-36275

發明欲解決之課題Invention problem to be solved

在工作夾台的正面側設置有在吸引被處理物時維持負壓之多孔部,且該多孔部的正面會成為吸引、保持該被處理物的保持面。並且,該多孔部會與噴射器連通,而藉由在該噴射器所產生之吸引力來將該多孔部維持為負壓。A porous section is located on the front of the worktable to maintain negative pressure when sucking in the workpiece. The front of this porous section serves as the holding surface for the workpiece. Furthermore, this porous section is connected to the ejector, and the suction force generated by the ejector maintains a negative pressure within the porous section.

噴射器大致區分成用於產生吸引力而使用之驅動流體為氣體之噴射器、與為液體之噴射器。前者之噴射器是主要利用所謂的可保持非黏性流體具有的能量(動量)之白努利定理之噴射器。又,後者之噴射器是主要利用所謂的產生和黏性流體與其周圍的流體之間的速度梯度相應之摩擦力的牛頓黏滯定律之噴射器。Ejectors are broadly divided into those using gas as the driving fluid to generate attractive forces, and those using liquid as the driving fluid. The former primarily utilizes Bernoulli's law, which states that the energy (momentum) of a non-viscous fluid can be retained. The latter primarily utilizes Newton's law of viscosity, which states that the frictional force generated by a viscous fluid corresponds to the velocity gradient between the fluid and the surrounding fluid.

不過,雖然氣體的黏性相較於液體會較低,但實際上並不存在不具有黏性之氣體。因此,即使驅動流體為氣體之噴射器,仍然會隨著該氣體之移動而在與其周圍的流體之間產生摩擦。從而,驅動流體為氣體之噴射器,是利用白努利定理並且利用牛頓黏滯定律來產生吸引力。However, while gases have lower viscosity than liquids, there are no non-viscous gases. Therefore, even if the driving fluid is a gas jet, friction will still occur between the gas and the surrounding fluid as it moves. Therefore, the driving fluid of a gas jet utilizes Bernoulli's theorem and Newton's law of viscosity to generate attractive forces.

順道一提,上述之被處理物之加工及洗淨,一般而言是一邊供給液體一邊進行。又,為了確實地保持該被處理物,保持該被處理物之保持面中的多孔部的尺寸大多會設計成比該被處理物的尺寸稍微大。Incidentally, the processing and cleaning of the above-mentioned object is generally carried out while supplying liquid. In order to securely hold the object, the size of the porous portion of the holding surface holding the object is often designed to be slightly larger than the size of the object.

因此,多孔部的保持面當中外緣附近的區域,會有在對被處理物進行加工或洗淨時未被該被處理物所被覆,而暴露於該液體之情形。其結果,會有以下情形:供給至該被處理物之液體由於在該噴射器所產生之吸引力的作用而透過該區域被吸引至該多孔部的內部。Therefore, during processing or cleaning of the workpiece, an area near the outer edge of the porous portion's retaining surface may not be covered by the workpiece and may be exposed to the liquid. As a result, the liquid supplied to the workpiece may be drawn into the porous portion through this area due to the suction force generated by the ejector.

此外,被該多孔部所吸引之液體有時會透過連通路到達噴射器的內部。在此情況下,會有以下疑慮:在驅動流體、與侵入噴射器的內部的液體之間產生摩擦,而阻礙該驅動流體的流動。其結果,會有以下疑慮:噴射器的吸引力降低,而在被處理物之加工或洗淨上產生不良狀況。Furthermore, liquid attracted by the porous portion may sometimes pass through the communication passages and enter the interior of the ejector. In this case, there is a concern that friction will occur between the driving fluid and the liquid that has intruded into the ejector, hindering the flow of the driving fluid. Consequently, there is a concern that the ejector's suction force will be reduced, causing problems in processing or cleaning the substrate.

雖然也存在有將已侵入到內部之液體所造成之不良影響降低之形式的噴射器,但那樣的噴射器是具備複雜之機構的大型裝置,又,會需要大量的驅動流體。因此,在利用這種噴射器來製造晶片的情況下,有產生以下問題之疑慮:該晶片的製造成本會增加。While there are some types of ejectors that minimize the negative impact of liquid intrusion, such ejectors are large devices with complex mechanisms and require large amounts of drive fluid. Therefore, using such ejectors in wafer manufacturing raises concerns about increased wafer manufacturing costs.

有鑒於上述之點,本發明的一個目的是提供一種噴射器,前述噴射器可抑制液體已侵入噴射器的內部的情況下之吸引力的降低,並且以低價方式進行被處理物之加工或洗淨。 本發明的其他目的是提供一種具備這種噴射器之加工裝置及洗淨裝置。 用以解決課題之手段 In view of the above, one object of the present invention is to provide an ejector that suppresses the reduction in suction force when liquid has intruded into the ejector, and that can process or clean a workpiece inexpensively. Another object of the present invention is to provide a processing device and a cleaning device equipped with such an ejector. Means for Solving the Problem

根據本發明的一個層面,可提供一種噴射器,前述噴射器具備:流入管,於前端形成複數個開口,且從該流入管的該開口噴射驅動流體;流出管,在與該流入管的前端相向之位置具有可接收從該開口所噴射出之驅動流體的承接口;及本體部,包圍該開口與該承接口的周圍,且具有吸引外部流體之吸引路。According to one aspect of the present invention, an ejector is provided, comprising: an inlet pipe having a plurality of openings formed at a front end, from which a driving fluid is ejected; an outlet pipe having a receiving port at a position opposite the front end of the inlet pipe for receiving the driving fluid ejected from the openings; and a main body surrounding the openings and the receiving port and having a suction path for drawing in external fluid.

較佳的是,該驅動流體為液體。Preferably, the driving fluid is a liquid.

根據本發明的其他層面,可提供一種加工裝置,前述加工裝置是對在正面形成有器件之被加工物進行加工之加工裝置,並具備:工作夾台,具有保持該被加工物之保持面;加工單元,以裝設於主軸的前端之加工磨石來對已保持於該工作夾台之該被加工物進行加工;上述之噴射器;及連通路,連通該噴射器的該吸引路與該保持面。According to another aspect of the present invention, a processing device can be provided, which is a processing device for processing a workpiece having a device formed on the front surface, and comprises: a work clamp having a holding surface for holding the workpiece; a processing unit that processes the workpiece held on the work clamp using a processing grindstone installed on the front end of the main spindle; the above-mentioned ejector; and a connecting path connecting the suction path of the ejector and the holding surface.

根據本發明的又一個其他層面,可提供一種洗淨裝置,前述洗淨裝置是對在正面形成有器件之被洗淨物進行洗淨之洗淨裝置,並具備:工作夾台,具有保持該被洗淨物之保持面;洗淨單元,對已保持於該工作夾台之該被洗淨物進行洗淨;上述之噴射器;及連通路,連通該噴射器的該吸引路和該保持面。 發明效果 According to yet another aspect of the present invention, a cleaning device is provided for cleaning an object having a device formed on its front surface. The cleaning device comprises: a worktable having a holding surface for holding the object; a cleaning unit for cleaning the object held on the worktable; the aforementioned ejector; and a connecting passage connecting the ejector's suction passage and the holding surface. Effects of the Invention

根據本發明的一個層面,可提供一種從流入管的複數個開口朝本體部的內部噴射驅動流體之噴射器。和從1個開口噴射驅動流體之噴射器相比較,在該噴射器中,可設想驅動流體在本體部的內部通過之情形的流路的表面積會增加。亦即,在該噴射器中,該驅動流體與其周圍之流體的接觸面積會增加。According to one aspect of the present invention, an ejector is provided that ejects a driving fluid from multiple openings in an inlet pipe into the interior of a body. Compared to ejecting the driving fluid from a single opening, this ejector has a larger surface area of the flow path through which the driving fluid is expected to pass within the body. In other words, this ejector increases the contact area between the driving fluid and the surrounding fluid.

因此,根據本發明的一個層面,可以有效率地增加在該驅動流體與其周圍之流體之間產生的摩擦力。其結果,即使在如液體侵入本體部的內部而阻礙該驅動流體的流動之情況下,仍然可將由已侵入之液體所造成之不良影響降低。亦即,即使是在這種情況下,仍然可抑制該噴射器的吸引力的降低。Therefore, according to one aspect of the present invention, the friction generated between the driving fluid and the surrounding fluid can be effectively increased. As a result, even in the event that liquid intrudes into the interior of the main body and obstructs the flow of the driving fluid, the adverse effects caused by the intruded liquid can be reduced. In other words, even in such a situation, a decrease in the attractive force of the ejector can be suppressed.

又,根據本發明的一個層面,可以在不使裝置複雜化、大型化的情形下,又,在不使成為必要之驅動流體的量大幅地增加的情形下,實現所期望的吸引力。其結果,變得可用低價方式進行被處理物之加工或洗淨。Furthermore, according to one aspect of the present invention, the desired suction force can be achieved without complicating or increasing the size of the apparatus, or significantly increasing the amount of the required driving fluid. As a result, the processed material can be processed or cleaned at a low cost.

此外,根據本發明的另一個層面,可提供具備這種噴射器之加工裝置或洗淨裝置。在這些裝置中,如上述,可抑制該噴射器之吸引力的降低,並且可用低價方式進行該被處理物之加工或洗淨。In addition, according to another aspect of the present invention, a processing device or a cleaning device equipped with such an ejector can be provided. In these devices, as described above, the reduction in the attraction force of the ejector can be suppressed, and the processed object can be processed or cleaned in a low-cost manner.

用以實施發明之形態Form used to implement the invention

參照附圖,針對噴射器之實施形態進行說明。圖1是示意地顯示實施形態之噴射器2的立體圖,圖2是示意地顯示圖1所示之噴射器2的一部分的剖面圖。FIG1 is a perspective view schematically showing an ejector 2 according to an embodiment, and FIG2 is a cross-sectional view schematically showing a portion of the ejector 2 shown in FIG1 .

噴射器2是藉由在與外部隔離之本體部4的內部使驅動流體流動而產生吸引力。該驅動流體可為液體或氣體之任一種。該驅動流體可為例如水等液體、或空氣、或是氬氣及氮氣等惰性氣體等的氣體。The ejector 2 generates a suction force by flowing a driving fluid within a body 4 that is isolated from the outside. The driving fluid can be either a liquid or a gas. Examples of the driving fluid include liquids such as water, air, or inert gases such as argon and nitrogen.

本體部4具有互相相向之壁4a及4b、與設置於壁4a及4b以外之本體部4的壁之吸引路4c。並且,在壁4a設置成供流入管6的一端側插入,又,在壁4b設置成供流出管8的一端側插入。The body 4 has walls 4a and 4b facing each other, and a suction passage 4c provided in the wall of the body 4 outside of the walls 4a and 4b. Furthermore, the wall 4a is provided so that one end of the inlet pipe 6 can be inserted, and the wall 4b is provided so that one end of the outlet pipe 8 can be inserted.

流入管6提供用於使驅動流體流入本體部4的內部之路徑。流出管8提供用於使存在於本體部4的內部之流體流出的路徑。吸引路4c提供用於將外部流體吸引到本體部4的內部之路徑。The inflow tube 6 provides a path for the driving fluid to flow into the interior of the main body 4. The outflow tube 8 provides a path for the fluid inside the main body 4 to flow out. The suction path 4c provides a path for sucking external fluid into the interior of the main body 4.

流入管6的另一端側連結於未圖示之驅動流體供給源,以供給驅動流體。此外,位於本體部4的內部之流入管6的一端部包含其直徑從本體部4的壁4a起隨著朝本體部4的中央接近而減少之後再增加之局部部分(作為文氏管(venturi tube)而發揮功能之局部部分)6a。The other end of the inlet tube 6 is connected to a drive fluid supply source (not shown) for supplying drive fluid. Furthermore, one end of the inlet tube 6, located within the body 4, includes a portion 6a (functioning as a venturi tube) whose diameter decreases from the wall 4a of the body 4 toward the center and then increases.

流入管6的一端部具有設置有複數個開口(孔)6b之壁6c。壁6c從流入管6的一端(前端)朝向局部部分6a具有預定的厚度。流入管6的前端的形狀是大致圓形,其直徑和局部部分6a中的最大直徑大致相等。亦即,壁6c的形狀大致為圓柱。One end of the inlet pipe 6 has a wall 6c with a plurality of openings (holes) 6b. Wall 6c has a predetermined thickness from one end (front end) of the inlet pipe 6 toward the local portion 6a. The front end of the inlet pipe 6 is generally circular, with a diameter approximately equal to the maximum diameter of the local portion 6a. In other words, wall 6c is generally cylindrical.

複數個開口6b之形狀並不限定於特定的形狀。又,流入管6的前端中的複數個開口6b的形狀亦可為全部相同或相似形狀,亦可各自不同。但是,從均勻地噴射驅動流體的觀點來看,流入管6的前端中的複數個開口6b的形狀宜為彼此直徑大致相等之圓形。The shapes of the plurality of openings 6b are not limited to a specific shape. Furthermore, the shapes of the plurality of openings 6b at the front end of the inlet pipe 6 may all be the same or similar, or may differ from one another. However, from the perspective of uniformly spraying the driving fluid, the plurality of openings 6b at the front end of the inlet pipe 6 are preferably circular shapes with substantially equal diameters.

此外,從均勻地噴射驅動流體的觀點來看,複數個開口6b宜原樣維持在流入管6的前端中的形狀而貫通於壁6c。例如,較佳的是,壁6c的厚度比流入管6的前端之直徑更長,且複數個開口6b原樣維持在流入管6的前端中的形狀而貫通於壁6c。Furthermore, from the perspective of uniformly spraying the driving fluid, the plurality of openings 6b preferably maintain the shape of the front end of the inlet pipe 6 and extend through the wall 6c. For example, it is preferable that the thickness of the wall 6c is greater than the diameter of the front end of the inlet pipe 6, and the plurality of openings 6b maintain the shape of the front end of the inlet pipe 6 and extend through the wall 6c.

在和流入管6的前端相向的位置上,設置有流出管8的承接口8a。承接口8a具有底開口之如研缽的形狀。又,和流入管6的前端相向之側的承接口8a的直徑比流入管6的前端的直徑更長。A socket 8a for the outflow pipe 8 is located opposite the front end of the inflow pipe 6. Socket 8a has a mortar-shaped bottom with an open bottom. The diameter of the socket 8a on the side facing the front end of the inflow pipe 6 is longer than the diameter of the front end of the inflow pipe 6.

因此,可設想驅動流體在本體部4的內部通過之情形的流路,會從複數個開口6b的每一個延伸至承接口8a。此外,位於本體部4的內部之流出管8包含其直徑從本體部4的中央起隨著朝本體部4的壁4b接近而增加之局部部分8b。Therefore, it can be imagined that the flow path of the driving fluid passing through the interior of the body 4 extends from each of the plurality of openings 6b to the receiving port 8a. In addition, the outflow pipe 8 located inside the body 4 includes a partial portion 8b whose diameter increases from the center of the body 4 as it approaches the wall 4b of the body 4.

本體部4已包圍流入管6的複數個開口6b與流出管8的承接口8a之周圍,以免流體從吸引路4c、流入管6及流出管8以外出入。亦即,本體部4在吸引路4c、流入管6及流出管8以外是密閉的。The body 4 surrounds the plurality of openings 6b of the inlet pipe 6 and the receiving end 8a of the outlet pipe 8 to prevent fluid from entering or exiting outside the suction passage 4c, the inlet pipe 6, and the outlet pipe 8. In other words, the body 4 is sealed outside the suction passage 4c, the inlet pipe 6, and the outlet pipe 8.

再者,圖1及圖2所示之噴射器2亦可更具有回收單元,前述回收單元使從流出管8的前端8c排出之驅動流體循環至未圖示之驅動流體供給源。具有該回收單元之噴射器2,較佳之點在於可以再利用驅動流體。Furthermore, the ejector 2 shown in Figures 1 and 2 may also include a recovery unit that circulates the driving fluid discharged from the front end 8c of the outflow pipe 8 to a driving fluid supply source (not shown). The ejector 2 having this recovery unit is advantageous in that the driving fluid can be reused.

在圖1及圖2所示之噴射器2中,可從未圖示之驅動流體供給源將驅動流體供給到流入管6。已供給到流入管6之驅動流體會因文土里效應(Venturi effect)而被加速,並從設置於前端之複數個開口6b的每一個朝本體部4的內部噴射。噴射到本體部4的內部之驅動流體會從承接口8a流入流出管8。In the ejector 2 shown in Figures 1 and 2 , driving fluid can be supplied to the inlet pipe 6 from a driving fluid supply source (not shown). The driving fluid supplied to the inlet pipe 6 is accelerated by the Venturi effect and ejected from each of the plurality of openings 6b provided at the front end toward the interior of the body 4. The driving fluid ejected into the interior of the body 4 flows from the receiving port 8a into the outlet pipe 8.

此時,為了抵消因該驅動流體被加速而增加之能量的份量,該驅動流體的壓力會降低(白努利定理),且在該驅動流體與其周圍的流體之間會產生摩擦(牛頓黏滯定律)。藉此,外部流體會透過吸引路4c流入本體部4的內部,且該周圍的流體會與該驅動流體一起流入流出管8。簡而言之,噴射器2會將本體部4的內部設為負壓,並透過吸引路4c產生吸引力。At this point, to offset the increased energy of the driving fluid due to its acceleration, the driving fluid's pressure decreases (Bernoulli's law), and friction occurs between the driving fluid and the surrounding fluid (Newton's law of viscosity). Consequently, the external fluid flows into the interior of the main body 4 through the suction passage 4c, and the surrounding fluid flows into the outflow pipe 8 along with the driving fluid. In short, the ejector 2 creates a negative pressure inside the main body 4 and generates a suction force through the suction passage 4c.

在此,噴射器2是從流入管6的複數個開口6b朝本體部4的內部噴射驅動流體。藉此,和從1個開口噴射驅動流體之噴射器相比較,在噴射器2中,可設想驅動流體在本體部4的內部通過之情形的流路的表面積會增加。亦即,在噴射器2中,該驅動流體與其周圍的流體的接觸面積會增加。Here, the ejector 2 ejects the driving fluid from multiple openings 6b of the inlet pipe 6 into the interior of the body 4. This increases the surface area of the flow path through which the driving fluid can be expected to pass within the body 4, compared to an ejector that ejects the driving fluid from a single opening. In other words, the ejector 2 increases the contact area between the driving fluid and the surrounding fluid.

因此,在噴射器2中,可以使在該驅動流體與其周圍的流體之間產生之摩擦力有效率地增加。其結果,即使在如液體侵入本體部4的內部而阻礙該驅動流體的流動之情況下,仍然可將由已侵入之液體所造成之不良影響降低(關於液體侵入本體部4的內部之具體例,容後敘述)。亦即,即使是在這種情況下也可抑制噴射器2之吸引力的降低。Therefore, in the ejector 2, the friction generated between the driving fluid and the surrounding fluid can be effectively increased. As a result, even in the event that liquid intrudes into the interior of the main body 4 and obstructs the flow of the driving fluid, the adverse effects caused by the intruded liquid can be reduced (specific examples of liquid intrusion into the interior of the main body 4 will be described later). In other words, even in such a situation, a decrease in the attractive force of the ejector 2 can be suppressed.

又,噴射器2可以在不使裝置複雜化、大型化的情形下,又,在不使成為必要之驅動流體的量大幅地增加的情形下,實現所期望的吸引力。其結果,變得可用低價方式進行被處理物之加工或洗淨(關於被處理物之加工或洗淨的具體例,容後敘述)。Furthermore, the ejector 2 can achieve the desired suction force without complicating or increasing the size of the device, or significantly increasing the amount of the required driving fluid. As a result, the material to be processed can be processed or cleaned at a low cost (specific examples of the processing or cleaning of the material to be processed will be described later).

圖3是示意地顯示連結於圖1及圖2所示之噴射器2之工作台基台18及工作夾台20的立體圖,圖4為其剖面圖。再者,工作夾台20是以可以對工作台基台18裝卸的態樣被固定。Fig. 3 is a perspective view schematically showing the workbench base 18 and the work clamp 20 connected to the ejector 2 shown in Fig. 1 and Fig. 2, and Fig. 4 is a cross-sectional view thereof. Furthermore, the work clamp 20 is fixed to the workbench base 18 in a manner that allows it to be attached and detached.

在工作台基台18的上表面18a設置有向上突出之環狀的凸部18b。在上表面18a之比凸部18b更內側的區域,和凸部18b呈同心狀地設置有向上突出且直徑比凸部18b更小之環狀的凸部18c。又,上表面18a之在凸部18b與凸部18c之間的區域設置有向上突出之圓筒狀的定位凸部18d。An upwardly projecting annular protrusion 18b is provided on the top surface 18a of the table base 18. Concentrically with the inner side of protrusion 18b, an upwardly projecting annular protrusion 18c with a smaller diameter than protrusion 18b is provided on the top surface 18a. Furthermore, an upwardly projecting cylindrical positioning protrusion 18d is provided between protrusions 18b and 18c on the top surface 18a.

在上表面18a之比凸部18c更內側的區域,和凸部18c呈同心狀地形成有直徑比凸部18c更小之環狀的溝18e。此外,在上表面18a之比溝18e更內側的區域,已設置於工作台基台18的內部之連通路18f的一端形成有開口。又,連通路18f的另一端連通於圖1及圖2所示之噴射器2的本體部4的吸引路4c。On the upper surface 18a, in an area further inward from the protrusion 18c, a circular groove 18e with a smaller diameter than the protrusion 18c is formed concentrically with the protrusion 18c. Furthermore, in an area further inward from the groove 18e on the upper surface 18a, a connecting passage 18f provided within the workbench base 18 is opened at one end. The other end of the connecting passage 18f is connected to the suction passage 4c of the main body 4 of the ejector 2 shown in Figures 1 and 2.

工作夾台20包含在上表面側具有凹部22a之框體22、及以接著劑固定在框體22的凹部22a之多孔板24。多孔板24作為吸引、保持被處理物之多孔部而發揮功能,且其上表面24a成為吸引、保持被處理物之保持面。例如,框體22可使用金屬等來構成,多孔板24可使用多孔質陶瓷等來構成。The worktable 20 comprises a frame 22 having a recessed portion 22a on its top surface, and a porous plate 24 secured to the recessed portion 22a of the frame 22 with an adhesive. The porous plate 24 functions as a porous portion that attracts and holds the workpiece, and its top surface 24a serves as a holding surface for attracting and holding the workpiece. For example, the frame 22 can be constructed of metal, and the porous plate 24 can be constructed of porous ceramics.

在框體22的下表面22b形成有對應於工作台基台18的凸部18b之環狀的凹部22c。在下表面22b之比凹部22c更內側的區域,形成有對應於工作台基台18的凸部18c之環狀的凹部22d。亦即,凹部22c與凹部22d構成為同心狀。An annular recess 22c is formed on the lower surface 22b of the frame 22, corresponding to the raised portion 18b of the table base 18. An annular recess 22d is formed on the lower surface 22b, further inward of the recess 22c, corresponding to the raised portion 18c of the table base 18. In other words, recesses 22c and 22d are concentric.

在對應於工作台基台18的定位凸部18d的區域(亦即,凹部22c與凹部22d之間的區域)形成有定位凹部22e。又,在對應於環狀的溝18e的區域(亦即,比凹部22d更內側的區域),形成有圓形的凹部22f。在此凹部22f之底,設置在框體22的內部之連通路22g的一端形成有開口。連通路22g的另一端在凹部22a之底形成有開口,且與多孔板24相通。A positioning recess 22e is formed in the area corresponding to the positioning protrusion 18d of the workbench base 18 (i.e., the area between recesses 22c and 22d). Furthermore, a circular recess 22f is formed in the area corresponding to the annular groove 18e (i.e., the area further inward of recess 22d). At the bottom of this recess 22f, one end of a connecting passage 22g, located within the frame 22, opens. The other end of connecting passage 22g opens at the bottom of recess 22a and communicates with the porous plate 24.

對工作台基台18來固定工作夾台20時,是例如對工作台基台18的環狀的溝18e插入對應於此溝18e的形狀之環形構件26。環形構件26是以例如樹脂等所形成,且會變得難以相對於工作台基台18及工作夾台20滑動。又,此環形構件26形成為如下之厚度(高度):在已插入溝18e的狀態下會從上表面18a突出。To secure the work clamp 20 to the table base 18, for example, an annular member 26 having a shape corresponding to the annular groove 18e of the table base 18 is inserted into the annular groove 18e of the table base 18. The annular member 26 is formed of, for example, a resin and is designed to be difficult to slide relative to the table base 18 and the work clamp 20. Furthermore, the annular member 26 is formed to a thickness (height) such that, when inserted into the groove 18e, it protrudes from the upper surface 18a.

對溝18e插入環形構件26後,以使工作台基台18的上表面18a與框體22的下表面22b相面對的方式來將工作夾台20載置於工作台基台18。此時,將工作台基台18與工作夾台20的位置調整成:對凹部22c、凹部22d及定位凹部22e,分別插入凸部18b、凸部18c及定位凸部18d。After the annular member 26 is inserted into the groove 18e, the work clamp 20 is placed on the work clamp 18 so that the upper surface 18a of the work clamp 18 faces the lower surface 22b of the frame 22. At this time, the positions of the work clamp 20 and the work clamp 18 are adjusted so that the protrusion 18b, the protrusion 18c, and the positioning protrusion 18d are inserted into the recess 22c, the recess 22d, and the positioning recess 22e, respectively.

如上述,凹部22f的形狀會對應於插入環形構件26之溝18e的形狀。因此,當將工作夾台20載置於工作台基台18時,從上表面18a突出之環形構件26的一部分會插入凹部22f。藉由讓環形構件26插入溝18e與凹部22f,而可以抑制工作台基台18相對於工作夾台20之位置偏移。As described above, the shape of recess 22f corresponds to the shape of groove 18e, into which annular member 26 is inserted. Therefore, when the worktable 20 is placed on the worktable base 18, a portion of the annular member 26 protruding from the upper surface 18a is inserted into recess 22f. By inserting annular member 26 into groove 18e and recess 22f, positional deviation of the worktable base 18 relative to the worktable 20 can be suppressed.

在已對工作台基台18載置工作夾台20後,連通路18f與連通路22g會被連通。因此,圖1及圖2所示之噴射器2的本體部4的吸引路4c會透過連通路18f及連通路22g,而連通於工作夾台20的保持面(多孔板24的上表面24a)。After the work fixture 20 is placed on the workbench base 18, the communication path 18f and the communication path 22g are connected. Therefore, the suction path 4c of the main body 4 of the ejector 2 shown in Figures 1 and 2 is connected to the holding surface of the work fixture 20 (the upper surface 24a of the porous plate 24) through the communication path 18f and the communication path 22g.

在此狀態下,只要對圖1及圖2所示之噴射器2的流入管6供給驅動流體,噴射器2便會將吸引路4c以及連通路18f及連通路22g的內部設為負壓來對多孔板24進行吸引。藉此,變得可在工作夾台20的保持面(多孔板24的上表面24a)保持被處理物。In this state, if driving fluid is supplied to the inlet pipe 6 of the ejector 2 shown in Figures 1 and 2, the ejector 2 sets the suction passage 4c, the interior of the communication passage 18f, and the communication passage 22g to negative pressure, thereby sucking the porous plate 24. This allows the workpiece to be held on the holding surface of the work table 20 (the upper surface 24a of the porous plate 24).

圖5是示意地顯示在工作夾台20的保持面對已被吸引、保持之被加工物11進行加工之加工裝置的剖面圖。具體而言,圖5所顯示的是以利用切削單元52在被加工物11形成溝(半切)的方式進行切削之切削裝置50。Figure 5 is a cross-sectional view schematically showing a processing device that processes a workpiece 11 that has been sucked and held by the holding surface of the work clamp 20. Specifically, Figure 5 shows a cutting device 50 that cuts the workpiece 11 by forming a groove (half-cutting) in the workpiece 11 using a cutting unit 52.

圖5所示之切削裝置50具有圖3及圖4所示之工作台基台18及工作夾台20,且在工作夾台20的保持面上吸引、保持被加工物11。The cutting device 50 shown in FIG. 5 includes the table base 18 and the work clamp 20 shown in FIG. 3 and FIG. 4 , and sucks and holds the workpiece 11 on the holding surface of the work clamp 20 .

被加工物11為例如以矽等之半導體形成之圓盤狀的晶圓,並將其正面(上表面)側區分為中央的器件區域、和包圍器件區域的外周剩餘區域。器件區域被配置排列成格子狀之分割預定線(切割道)進一步區劃成複數個區域,且在各個區域形成有IC及LSI等的半導體器件。The workpiece 11 is a disk-shaped wafer made of a semiconductor material such as silicon. Its front (top) surface is divided into a central device region and a peripheral residual region surrounding the device region. The device region is further divided into a plurality of regions by predetermined dividing lines (streaks) arranged in a grid pattern, and semiconductor devices such as ICs and LSIs are formed in each region.

圖5所示之切削裝置50更具有未圖示之工作夾台移動機構、與未圖示之切削單元移動機構。該工作夾台移動機構可例如使工作台基台18及工作夾台20在加工進給方向(圖5中的前後方向)上移動。又,該切削單元移動機構可例如使切削單元52在分度進給方向(圖5中的左右方向)上及切入進給方向(圖5中的上下方向)上移動。The cutting device 50 shown in FIG5 further includes a worktable moving mechanism (not shown) and a cutting unit moving mechanism (not shown). The worktable moving mechanism can, for example, move the worktable base 18 and the worktable 20 in the machining feed direction (the front-to-back direction in FIG5 ). Furthermore, the cutting unit moving mechanism can, for example, move the cutting unit 52 in the indexing feed direction (the left-right direction in FIG5 ) and the cutting feed direction (the up-down direction in FIG5 ).

切削單元52具有主軸56,前述主軸56以大致平行於工作夾台20的保持面的平面方向之軸心為中心來旋轉。主軸56的一端側裝設有環狀之切削刀片58,且在另一端側連結有馬達等之旋轉驅動源(未圖示)。因此,切削刀片58會藉由透過主軸56所傳達之該旋轉驅動源的扭矩而旋轉。The cutting unit 52 includes a spindle 56 that rotates about an axis roughly parallel to the plane of the worktable 20. An annular cutting blade 58 is mounted on one end of the spindle 56, and a rotational drive source (not shown), such as a motor, is connected to the other end. The cutting blade 58 is rotated by the torque of the rotational drive source transmitted through the spindle 56.

切削刀片58是藉由加工磨石來切削被加工物11之加工工具。因此,切削單元52也可以表現為以已裝設於主軸56前端之加工磨石來切削被加工物11之單元。The cutting blade 58 is a processing tool that cuts the workpiece 11 by a processing grindstone. Therefore, the cutting unit 52 can also be expressed as a unit that cuts the workpiece 11 by a processing grindstone installed at the front end of the spindle 56.

作為切削刀片58,可使用例如輪轂型的切削刀片,前述輪轂型的切削刀片是將以金屬等所構成之環狀的基台、與沿著基台的外周緣而形成之環狀的切刃形成為一體而構成。輪轂型的切削刀片的切刃可藉由電鑄磨石來構成,前述電鑄磨石是藉由鎳鍍敷等之結合材來固定以鑽石及立方氮化硼(cBN:cubic Boron Nitride)等所構成之磨粒(加工磨石)而製成。The cutting insert 58 may be a hub-type cutting insert, for example. The hub-type cutting insert is constructed by integrating an annular base made of metal or the like with an annular cutting edge formed along the outer periphery of the base. The cutting edge of the hub-type cutting insert may be formed using an electrocast grindstone, which is made by fixing abrasive grains (processing grindstone) composed of diamond and cubic boron nitride (cBN) or the like with a bonding material such as nickel plating.

又,作為切削刀片58,亦可使用藉由環狀的切刃所構成之墊圈型的切削刀片,前述環狀的切刃是以金屬、陶瓷及樹脂等所構成之結合材來固定磨粒(加工磨石)而製成。Furthermore, as the cutting insert 58, a washer-type cutting insert composed of an annular cutting edge made by fixing abrasive grains (working grindstone) with a bonding material composed of metal, ceramics, resin, etc. may be used.

在切削刀片58的附近設置有切削液供給噴嘴60。切削液供給噴嘴60在藉由切削刀片58來切削被加工物11之時,會將切削液17供給至被加工物11及切削刀片58等。切削液17可為例如水。A cutting fluid supply nozzle 60 is provided near the cutting blade 58. The cutting fluid supply nozzle 60 supplies cutting fluid 17 to the workpiece 11 and the cutting blade 58 when the workpiece 11 is cut by the cutting blade 58. The cutting fluid 17 may be water, for example.

在使用切削單元52來切削被加工物11時,首先是使被加工物11接觸於多孔板24的上表面24a。或者,亦可在將被加工物11貼附到具有和被加工物11同等的尺寸之切割膠帶之後,隔著該切割膠帶使被加工物11與多孔板24的上表面接觸。然後,對圖1及圖2所示之噴射器2的流入管6供給驅動流體。When cutting the workpiece 11 using the cutting unit 52, the workpiece 11 is first brought into contact with the upper surface 24a of the porous plate 24. Alternatively, the workpiece 11 can be attached to a dicing tape of the same size as the workpiece 11, and then brought into contact with the upper surface of the porous plate 24 through the dicing tape. Then, the driving fluid is supplied to the inlet pipe 6 of the ejector 2 shown in Figures 1 and 2.

藉此,在噴射器2中產生之負壓,會透過吸引路4c以及連通路18f及連通路22g而作用於工作夾台20的保持面(多孔板24的上表面24a)。其結果,變得可將被加工物11吸引、保持在工作夾台20。The negative pressure generated in the ejector 2 acts on the holding surface (upper surface 24a of the porous plate 24) of the work clamp 20 through the suction passage 4c, the connecting passage 18f, and the connecting passage 22g. As a result, the workpiece 11 can be sucked and held on the work clamp 20.

接著,一邊藉由主軸56旋轉切削刀片58,一邊以使被加工物11和切削刀片58接觸的方式來讓工作台基台18及工作夾台20在加工進給方向(圖5中的前後方向)上移動。藉此,可切削被加工物11而形成溝。Then, while the cutting blade 58 is rotated by the spindle 56, the table base 18 and the work clamp 20 are moved in the machining feed direction (the front-back direction in FIG. 5 ) so that the workpiece 11 contacts the cutting blade 58. Thus, the workpiece 11 is cut to form a groove.

如圖5所示,在對已被工作夾台20所吸引、保持之被加工物11進行切削時,會從切削液供給噴嘴60對被加工物11及切削刀片58等供給切削液17。As shown in FIG. 5 , when cutting the workpiece 11 sucked and held by the work clamp 20 , the cutting fluid 17 is supplied from the cutting fluid supply nozzle 60 to the workpiece 11 and the cutting blade 58 .

在此,如圖5所示,切削液17有時會透過多孔板24等而侵入到連通路18f及連通路22g。並且,因為連通路18f及連通路22g已連結於圖1及圖2所示之噴射器2的本體部4的吸引路4c,所以會有切削液17侵入噴射器2的本體部4的內部之情形。Here, as shown in FIG5 , cutting fluid 17 may sometimes penetrate through the porous plate 24 and enter the communication passage 18f and the communication passage 22g. Furthermore, because the communication passage 18f and the communication passage 22g are connected to the suction passage 4c of the main body 4 of the ejector 2 shown in FIG1 and FIG2 , there is a possibility that the cutting fluid 17 may intrude into the interior of the main body 4 of the ejector 2.

相對於此,噴射器2會從流入管6的複數個開口6b朝本體部4的內部噴射驅動流體。藉此,和從1個開口噴射驅動流體之噴射器相比較,在噴射器2中,可設想該驅動流體在本體部4的內部通過之情形的流路的表面積會增加。因此,在噴射器2中,可以使在該驅動流體與其周圍的流體之間產生之摩擦力有效率地增加。In contrast, the ejector 2 ejects the driving fluid from the plurality of openings 6b of the inlet pipe 6 into the interior of the body 4. This increases the surface area of the flow path through which the driving fluid is assumed to pass within the body 4, compared to ejectors that eject the driving fluid from a single opening. Consequently, the ejector 2 can effectively increase the frictional force generated between the driving fluid and the surrounding fluid.

其結果,具有噴射器2之切削裝置50即使在如液體侵人本體部4的內部而阻礙該驅動流體的流動之情況下,仍然可將由已侵入之液體所造成之不良影響降低。亦即,即使是這種情況下也可抑制噴射器2之吸引力的降低,且可以減少切削裝置50中的切削時產生不良狀況的或然率。As a result, even in the event that liquid intrudes into the interior of the main body 4 and obstructs the flow of the driving fluid, the cutting device 50 including the ejector 2 can still reduce the adverse effects caused by the intruded liquid. In other words, even in such a situation, the reduction in the suction force of the ejector 2 can be suppressed, and the probability of malfunction during cutting in the cutting device 50 can be reduced.

又,噴射器2並非是具有複雜之機構的大型裝置,又,也並非是需要大量的驅動流體之構成。因此,可藉由使用具有噴射器2之切削裝置50,而以低價方式進行被加工物11之切削。Furthermore, the ejector 2 is not a large device with a complicated mechanism, nor does it require a large amount of driving fluid. Therefore, the cutting device 50 having the ejector 2 can be used to cut the workpiece 11 at a low cost.

再者,可搭載噴射器2之具有加工單元的加工裝置,並非限定於如圖5所示地具有進行切削之切削單元的切削裝置。噴射器2亦可搭載於例如具有磨削單元的磨削裝置,前述磨削單元是以已裝設於主軸的前端之加工磨石來對被加工物的表面進行磨削。Furthermore, the processing device having a processing unit that can be equipped with the ejector 2 is not limited to the cutting device having a cutting unit for cutting as shown in Figure 5. The ejector 2 can also be equipped with, for example, a grinding device having a grinding unit that grinds the surface of the workpiece using a grinding stone mounted on the front end of a spindle.

在磨削裝置中,一般而言,是一邊對被加工物的表面供給液體一邊進行磨削。因此,噴射器2也宜作為搭載於這種磨削裝置之噴射器。In a grinding device, generally speaking, the surface of the workpiece is ground while liquid is supplied to the surface. Therefore, the ejector 2 is also suitable as an ejector mounted on such a grinding device.

圖6是示意地顯示對在工作夾台(或旋轉工作台)88的保持面上被吸引、保持之被洗淨物21進行洗淨之洗淨裝置70的立體圖。但是,在圖6中,為了方便而將構成要素的一部分去除,且顯示有該構成要素的截面。Fig. 6 is a perspective view schematically showing a cleaning device 70 for cleaning an object 21 held by suction on a holding surface of a work clamp (or rotary table) 88. However, in Fig. 6, a portion of a component is removed for convenience, and a cross section of the component is shown.

再者,在圖6中,雖然顯示有格子狀地形成有溝之圓盤狀的晶圓來作為被洗淨物21,但是可被洗淨裝置70洗淨之被洗淨物,並非限定於這樣的被洗淨物21。作為可被洗淨裝置70洗淨之被洗淨物,可列舉例如形成這種溝之前的圓盤狀的晶圓或藉由分割該晶圓而被製造的複數個晶片。6 shows a disk-shaped wafer with grooves formed in a grid pattern as the object to be cleaned 21, but the object to be cleaned by the cleaning device 70 is not limited to this object to be cleaned 21. Examples of the object to be cleaned by the cleaning device 70 include a disk-shaped wafer before such grooves are formed or a plurality of chips manufactured by dividing the wafer.

洗淨裝置70具有使工作夾台88旋轉之工作台旋轉單元84。工作台旋轉單元84具有例如以大致平行於鉛直方向之軸心作為中心來旋轉的軸94。在軸94的側面連結有包圍軸94的側面的一部分之罩蓋構件126。The cleaning device 70 includes a table rotating unit 84 that rotates a work table 88. The table rotating unit 84 includes a shaft 94 that rotates about an axis that is substantially parallel to the lead straight line. A cover member 126 that surrounds a portion of the side surface of the shaft 94 is connected to the side surface of the shaft 94.

在軸94的一端連結有工作夾台88。在工作夾台88的正面側設置有多孔板88a。並且,軸94的軸心大致正交於多孔板88a的正面的平面方向。The work clamp 88 is connected to one end of the shaft 94. A perforated plate 88a is provided on the front side of the work clamp 88. The axis of the shaft 94 is substantially perpendicular to the plane direction of the front surface of the perforated plate 88a.

又,在軸94的內部設置有一端通到多孔板88a的背面之連通路(未圖示)。該連通路的另一端連通於圖1及圖2所示之噴射器2的本體部4的吸引路4c。亦即,該連通路會連通吸引路4c與多孔板88a。因此,噴射器2會透過吸引路4c及該連通路,而連通到工作夾台88的保持面(多孔板88a的上表面)。Furthermore, a communication passage (not shown) is provided within the shaft 94, one end of which connects to the back surface of the porous plate 88a. The other end of this communication passage is connected to the suction passage 4c of the main body 4 of the ejector 2 shown in Figures 1 and 2. In other words, this communication passage connects the suction passage 4c with the porous plate 88a. Therefore, the ejector 2 is connected to the holding surface of the work clamp 88 (the upper surface of the porous plate 88a) through the suction passage 4c and this communication passage.

在軸94的另一端連結有馬達等旋轉驅動源(未圖示)及氣缸等的升降驅動源(未圖示)。因此,工作夾台88會藉由透過軸94而傳送之旋轉驅動源的動力來旋轉。又,工作夾台88會藉由升降驅動源的動力,而在將被洗淨物21搬入或搬出之上方的搬入搬出位置、與下方的洗淨位置之間升降。The other end of the shaft 94 is connected to a rotational drive source such as a motor (not shown) and a lift drive source such as an air cylinder (not shown). Therefore, the work clamp 88 rotates using the power of the rotational drive source transmitted through the shaft 94. Furthermore, the work clamp 88 is raised and lowered between an upper loading/unloading position, where the objects 21 are loaded and unloaded, and a lower cleaning position, using the power of the lift drive source.

在包圍軸94的位置配置有洗淨液承接單元86。洗淨液承接單元86具有圓筒狀的外周壁100a、從外周壁100a的下部朝徑方向內側伸出之圓環狀的底壁100b、及從底壁100b的內周側朝上方豎立設置之圓筒狀的內周壁100c。軸94於內周壁100c的內側通過。內周壁100c的外徑形成得比罩蓋構件126的內徑更小,在工作夾台88下降到洗淨位置時,罩蓋構件126會從外周側包圍內周壁100c。A cleaning liquid receiving unit 86 is positioned around shaft 94. This unit comprises a cylindrical outer wall 100a, an annular bottom wall 100b extending radially inward from the lower portion of outer wall 100a, and a cylindrical inner wall 100c extending vertically upward from the inner circumference of bottom wall 100b. Shaft 94 passes inside inner wall 100c. The outer diameter of inner wall 100c is smaller than the inner diameter of cover member 126. When work clamp 88 is lowered to the cleaning position, cover member 126 surrounds inner wall 100c from the outer circumference.

在底壁100b設置有排水口104,排水口104連接於朝下方延伸之排水路(未圖示)。當洗淨液掉落到洗淨液承接單元86時,洗淨液會從排水口104經過該排水路朝外部排出。當工作夾台88下降至洗淨位置時,因為內周壁100c被該罩蓋構件126所包圍,所以可抑制洗淨液之經由軸94所通過的貫通孔之往下方的飛散。A drain port 104 is provided on the bottom wall 100b and is connected to a downwardly extending drain channel (not shown). When cleaning liquid falls onto the cleaning liquid receiving unit 86, it is discharged from the drain port 104 through the drain channel to the outside. When the work clamp 88 is lowered to the cleaning position, the inner peripheral wall 100c is surrounded by the cover member 126, thereby preventing cleaning liquid from scattering downward through the through hole through which the shaft 94 passes.

在外周壁100a的內側配置有乾燥單元108。乾燥單元108具有插入底壁100b之管狀的軸部114。軸部114是在工作夾台88的外側沿著相對於該工作夾台88的正面大致垂直的方向延伸之管狀的構件。軸部114的上端會到達比工作夾台88的正面更高的位置,且連接於臂部112。於軸部114的下端側連接有使軸部114旋轉之馬達等的旋轉驅動源(未圖示)。A drying unit 108 is disposed on the inner side of the outer peripheral wall 100a. The drying unit 108 has a tubular shaft 114 that is inserted into the bottom wall 100b. The shaft 114 is a tubular member that extends on the outer side of the work clamp 88 in a direction generally perpendicular to the front of the work clamp 88. The upper end of the shaft 114 reaches a position higher than the front of the work clamp 88 and is connected to the arm 112. A rotational drive source (not shown), such as a motor, is connected to the lower end of the shaft 114 to rotate the shaft 114.

臂部112是以相當於從軸部114的上端到工作夾台88的中央之距離之長度來延伸之管狀的構件。臂部112的延伸方向大致正交於軸部114的延伸方向。在臂部112的前端(未與軸部114連接之臂部112的末端)設置有朝向下方之乾燥噴嘴110。在軸部114連接有未圖示之空氣供給源,且可經過軸部114及臂部112從乾燥噴嘴110朝工作夾台88的正面側噴出空氣。The arm 112 is a tubular member extending a length equal to the distance from the upper end of the shaft 114 to the center of the work clamp 88. The direction in which the arm 112 extends is generally perpendicular to the direction in which the shaft 114 extends. A downward-facing drying nozzle 110 is provided at the front end of the arm 112 (the end of the arm 112 not connected to the shaft 114). An air supply source (not shown) is connected to the shaft 114, and air is ejected from the drying nozzle 110 toward the front side of the work clamp 88 through the shaft 114 and arm 112.

在外周壁100a的內側,以在與乾燥單元108之間隔著內周壁100c的方式配置有洗淨單元116。洗淨單元116具有插入底壁100b之管狀的軸部122。軸部122是在工作夾台88的外側沿著相對於該工作夾台88的正面大致垂直的方向延伸之管狀的構件。軸部122的上端會到達比工作夾台88的上表面的高度更高的位置,且連接有臂部120。在軸部122的下端側連接有使軸部122旋轉之馬達等的旋轉驅動源。On the inner side of the outer peripheral wall 100a, a cleaning unit 116 is arranged with the inner peripheral wall 100c between it and the drying unit 108. The cleaning unit 116 has a tubular shaft 122 inserted into the bottom wall 100b. The shaft 122 is a tubular member that extends on the outer side of the work clamp 88 in a direction approximately perpendicular to the front surface of the work clamp 88. The upper end of the shaft 122 reaches a position higher than the height of the upper surface of the work clamp 88 and is connected to the arm 120. A rotation drive source such as a motor that rotates the shaft 122 is connected to the lower end of the shaft 122.

臂部120是以相當於從軸部122到工作夾台88的中央之距離的長度來延伸之管狀的構件。臂部120的延伸方向與軸部122的延伸方向大致正交。在臂部120的前端(未與軸部122連接之臂部120的末端)設置有朝向下方之洗淨噴嘴118。在軸部122連接有未圖示之洗淨液供給源,且可經過軸部122及臂部120從洗淨噴嘴118朝工作夾台88的正面側噴出洗淨液。Arm 120 is a tubular member extending a length equal to the distance from shaft 122 to the center of work table 88. The direction in which arm 120 extends is approximately perpendicular to the direction in which shaft 122 extends. A downward-facing cleaning nozzle 118 is provided at the front end of arm 120 (the end of arm 120 not connected to shaft 122). A cleaning liquid supply (not shown) is connected to shaft 122, and cleaning liquid is sprayed from cleaning nozzle 118 toward the front side of work table 88 via shaft 122 and arm 120.

在以洗淨裝置70洗淨被洗淨物21時,會一邊以高速來旋轉工作夾台88一邊從洗淨噴嘴118朝向被洗淨物21噴射洗淨液(代表性的是混合有水與空氣之混合流體)。之後,從乾燥噴嘴110朝被洗淨物21噴射乾燥空氣,來去除該洗淨液。When the cleaning device 70 cleans the object 21, the worktable 88 is rotated at high speed while the cleaning nozzle 118 sprays a cleaning liquid (typically a mixture of water and air) toward the object 21. Subsequently, the drying nozzle 110 sprays dry air toward the object 21 to remove the cleaning liquid.

在此,該洗淨液有時會透過工作夾台88的多孔板88a等,侵入到設置於軸94的內部之連通路。並且,因為該連通路已連結於圖1及圖2所示之噴射器2的本體部4的吸引路4c,所以會有該洗淨液侵入噴射器2的本體部4的內部之情形。Here, the cleaning liquid may sometimes penetrate the porous plate 88a of the work clamp 88 and enter the communication path provided inside the shaft 94. Moreover, because the communication path is connected to the suction path 4c of the main body 4 of the ejector 2 shown in Figures 1 and 2, the cleaning liquid may enter the interior of the main body 4 of the ejector 2.

相對於此,噴射器2會從流入管6的複數個開口6b朝本體部4的內部噴射驅動流體。藉此,和從1個開口噴射驅動流體之噴射器相比較,在噴射器2中,可設想該驅動流體在本體部4的內部通過之情形的流路的表面積會增加。因此,在噴射器2中,可以使在該驅動流體與其周圍的流體之間產生之摩擦力有效率地增加。In contrast, the ejector 2 ejects the driving fluid from the plurality of openings 6b of the inlet pipe 6 into the interior of the body 4. This increases the surface area of the flow path through which the driving fluid is assumed to pass within the body 4, compared to ejectors that eject the driving fluid from a single opening. Consequently, the ejector 2 can effectively increase the frictional force generated between the driving fluid and the surrounding fluid.

其結果,具有噴射器2之洗淨裝置70即使在如液體侵入本體部4的內部而阻礙該驅動流體的流動之情況下,仍然可將由已侵入之液體所造成的不良影響降低。亦即,即便是這種情況下也可抑制噴射器2之吸引力的降低,且可以減少洗淨裝置70中的洗淨時產生不良狀況的或然率。As a result, even in the event that liquid intrudes into the interior of the main body 4 and obstructs the flow of the driving fluid, the cleaning device 70 including the ejector 2 can still reduce the adverse effects caused by the intruded liquid. In other words, even in such a situation, the reduction in the suction force of the ejector 2 can be suppressed, and the probability of a malfunction occurring during cleaning in the cleaning device 70 can be reduced.

又,噴射器2並非是具有複雜之機構的大型裝置,又,也並非是需要大量的驅動流體之構成。因此,可藉由使用具有噴射器2之洗淨裝置70,而以低價方式進行被洗淨物21之洗淨。Furthermore, the ejector 2 is not a large device with a complicated mechanism, nor does it require a large amount of driving fluid. Therefore, the cleaning device 70 having the ejector 2 can be used to clean the object 21 at a low cost.

2:噴射器 4:本體部 4a,4b,6c:壁 4c:吸引路 6:流入管 6a,8b:局部部分 6b:開口(孔) 8:流出管 8a:承接口 8c:前端 11:被加工物 17:切削液 18:工作台基台 18a:上表面 18b,18c,18d:凸部 18e:溝 18f,22g:連通路 20:工作夾台 21:被洗淨物 22:框體 22a,22c,22d,22f:凹部 22b:下表面 22e:定位凹部 24,88a:多孔板 24a:上表面(保持面) 26:環形構件 50:切削裝置 52:切削單元 56:主軸 58:切削刀片 60:切削液供給噴嘴 70:洗淨裝置 84:工作台旋轉單元 86:洗淨液承接單元 88:工作夾台(或旋轉工作台) 94:軸 100a:外周壁 100b:底壁 100c:內周壁 104:排水口 108:乾燥單元 110:乾燥噴嘴 112,120:臂部 114,122:軸部 116:洗淨單元 118:洗淨噴嘴 126:罩蓋構件 2: Injector 4: Main body 4a, 4b, 6c: Wall 4c: Suction path 6: Inlet pipe 6a, 8b: Partial portion 6b: Opening (hole) 8: Outlet pipe 8a: Socket 8c: Front end 11: Workpiece 17: Cutting fluid 18: Worktable base 18a: Top surface 18b, 18c, 18d: Protrusion 18e: Groove 18f, 22g: Connecting channel 20: Worktable 21: Workpiece 22: Frame 22a, 22c, 22d, 22f: Recess 22b: Bottom surface 22e: Positioning recess 24, 88a: Perforated plate 24a: Top surface (holding surface) 26: Ring member 50: Cutting device 52: Cutting unit 56: Spindle 58: Cutting blade 60: Cutting fluid supply nozzle 70: Cleaning device 84: Worktable rotation unit 86: Cleaning fluid receiving unit 88: Work clamp (or rotary table) 94: Shaft 100a: Outer wall 100b: Bottom wall 100c: Inner wall 104: Drain outlet 108: Drying unit 110: Drying nozzle 112, 120: Arm 114, 122: Shaft 116: Cleaning unit 118: Cleaning nozzle 126: Cover member

圖1是示意地顯示實施形態之噴射器的立體圖。 圖2是示意地顯示圖1所示之噴射器的一部分的剖面圖。 圖3是示意地顯示連結於圖1及圖2所示之噴射器的工作台基台及工作夾台的立體圖。 圖4是示意地顯示連結於圖1及圖2所示之噴射器之工作台基台及工作夾台的剖面圖。 圖5是示意地顯示對已在工作夾台的保持面上被吸引、保持之被加工物進行加工之加工裝置的剖面圖。 圖6是示意地顯示對在工作夾台(或旋轉工作台)的保持面上被吸引、保持之被洗淨物進行洗淨之洗淨裝置的立體圖。 Figure 1 is a perspective view schematically showing an ejector according to an embodiment. Figure 2 is a cross-sectional view schematically showing a portion of the ejector shown in Figure 1. Figure 3 is a perspective view schematically showing a table base and a work clamp connected to the ejectors shown in Figures 1 and 2. Figure 4 is a cross-sectional view schematically showing a table base and a work clamp connected to the ejectors shown in Figures 1 and 2. Figure 5 is a cross-sectional view schematically showing a processing device for processing a workpiece held by suction and on a holding surface of a work clamp. Figure 6 is a perspective view schematically showing a cleaning device for cleaning a workpiece held by suction and on a holding surface of a work clamp (or rotary table).

2:噴射器 2: Jet

4:本體部 4: Main body

4a,4b,6c:壁 4a, 4b, 6c: Wall

4c:吸引路 4c: Attraction Path

6:流入管 6: Inflow pipe

6a,8b:局部部分 6a, 8b: Partial section

6b:開口(孔) 6b: Opening (hole)

8:流出管 8: Outflow pipe

8a:承接口 8a: Socket

8c:前端 8c: Front-end

Claims (4)

一種噴射器,為產生吸引力之噴射器,其特徵在於具備: 流入管,於前端形成複數個開口,且從該開口噴射驅動流體; 流出管,在與該流入管的前端相向之位置具有可接收從該流入管的該開口所噴射出之該驅動流體的承接口;及 本體部,包圍該開口與該承接口的周圍,且具有吸引外部流體之吸引路, 該承接口被定位於比該本體部的壁還要內側, 該流入管包含其直徑隨著朝該流入管的前端接近而減少之後再增加之部分。 An ejector generating a suction force is characterized by comprising: an inlet pipe having a plurality of openings formed at a front end, from which a driving fluid is ejected; an outlet pipe having a receiving opening at a position opposite the front end of the inlet pipe for receiving the driving fluid ejected from the openings of the inlet pipe; and a body surrounding the openings and the receiving opening and having a suction path for drawing in external fluid. The receiving opening is positioned further inward than a wall of the body. The inlet pipe includes a portion whose diameter decreases and then increases as it approaches the front end of the inlet pipe. 如請求項1之噴射器,其中該驅動流體為液體。The ejector of claim 1, wherein the driving fluid is a liquid. 一種加工裝置,對在正面形成有器件之被加工物進行加工,前述加工裝置之特徵在於具備: 工作夾台,具有保持該被加工物之保持面; 加工單元,以裝設於主軸的前端之加工磨石來對已保持於該工作夾台之該被加工物進行加工; 如請求項1或2之噴射器;及 連通路,連通該噴射器的該吸引路與該保持面。 A machining device for machining a workpiece having a device formed on its front surface. The machining device is characterized by comprising: a worktable having a holding surface for holding the workpiece; a machining unit for machining the workpiece held on the worktable using a grinding stone mounted on the front end of a spindle; an ejector according to claim 1 or 2; and a connecting passage connecting the suction passage of the ejector to the holding surface. 一種洗淨裝置,對在正面形成有器件之被洗淨物進行洗淨,前述洗淨裝置之特徵在於具備: 工作夾台,具有保持該被洗淨物之保持面; 洗淨單元,對已保持於該工作夾台之該被洗淨物進行洗淨; 如請求項1或2之噴射器;及 連通路,連通該噴射器的該吸引路與該保持面。 A cleaning device for cleaning an object having a device formed on its front surface. The cleaning device is characterized by comprising: a worktable having a holding surface for holding the object; a cleaning unit for cleaning the object held on the worktable; an ejector according to claim 1 or 2; and a connecting passage connecting the suction passage of the ejector to the holding surface.
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