TWI893000B - Protection element and battery pack - Google Patents
Protection element and battery packInfo
- Publication number
- TWI893000B TWI893000B TW109129580A TW109129580A TWI893000B TW I893000 B TWI893000 B TW I893000B TW 109129580 A TW109129580 A TW 109129580A TW 109129580 A TW109129580 A TW 109129580A TW I893000 B TWI893000 B TW I893000B
- Authority
- TW
- Taiwan
- Prior art keywords
- housing
- protective element
- adhesive
- narrow groove
- fusible conductor
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
- H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
- H01H37/761—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/50—Current conducting connections for cells or batteries
- H01M50/572—Means for preventing undesired use or discharge
- H01M50/574—Devices or arrangements for the interruption of current
- H01M50/583—Devices or arrangements for the interruption of current in response to current, e.g. fuses
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
- H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
- H01H85/046—Fuses formed as printed circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/055—Fusible members
- H01H85/08—Fusible members characterised by the shape or form of the fusible member
- H01H85/11—Fusible members characterised by the shape or form of the fusible member with applied local area of a metal which, on melting, forms a eutectic with the main material of the fusible member, i.e. M-effect devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/165—Casings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/165—Casings
- H01H85/175—Casings characterised by the casing shape or form
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
- H01M10/44—Methods for charging or discharging
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
- H01M10/48—Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/50—Current conducting connections for cells or batteries
- H01M50/572—Means for preventing undesired use or discharge
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
- H02H7/00—Emergency protective circuit arrangements specially adapted for specific types of electric machines or apparatus or for sectionalised protection of cable or line systems, and effecting automatic switching in the event of an undesired change from normal working conditions
- H02H7/18—Emergency protective circuit arrangements specially adapted for specific types of electric machines or apparatus or for sectionalised protection of cable or line systems, and effecting automatic switching in the event of an undesired change from normal working conditions for batteries; for accumulators
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/46—Circuit arrangements not adapted to a particular application of the protective device
- H01H2085/466—Circuit arrangements not adapted to a particular application of the protective device with remote controlled forced fusing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H61/00—Electrothermal relays
- H01H61/02—Electrothermal relays wherein the thermally-sensitive member is heated indirectly, e.g. resistively, inductively
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Combustion & Propulsion (AREA)
- Power Engineering (AREA)
- Fuses (AREA)
- Battery Mounting, Suspending (AREA)
- Protection Of Static Devices (AREA)
- Charge And Discharge Circuits For Batteries Or The Like (AREA)
- Secondary Cells (AREA)
- Connection Of Batteries Or Terminals (AREA)
Abstract
本發明提供一種能夠排除嵌合凸部與嵌合凹部之間的接著劑之多餘部分而確實地確保下側外殼與上側外殼之接著強度之保護元件。 本發明之保護元件具備:可熔導體3;及殼體6,其具有下側外殼4及上側外殼5,藉由將上側外殼5及下側外殼4以接著劑接合而形成;於上側外殼5及下側外殼4之任一者形成有嵌合凹部25,於任另一者形成有嵌合於嵌合凹部25之嵌合凸部26,且形成有狹槽27,該狹槽27與嵌合凹部25連續且延伸於上側外殼5及下側外殼4之對接面,使接著劑19流動。The present invention provides a protective element that can eliminate excess adhesive between the mating protrusion and the mating recess, thereby reliably ensuring the bonding strength between the lower and upper housings. The protective element of the present invention comprises: a fusible conductor 3; and a housing 6 having a lower housing 4 and an upper housing 5, formed by joining the upper housing 5 and the lower housing 4 with an adhesive; an engaging recess 25 is formed in one of the upper housing 5 and the lower housing 4, and an engaging protrusion 26 is formed in the other of the upper housing 5 and the lower housing 4 to engage with the engaging recess 25, and a narrow groove 27 is formed. The narrow groove 27 is continuous with the engaging recess 25 and extends to the abutting surface of the upper housing 5 and the lower housing 4, allowing the adhesive 19 to flow.
Description
本發明係關於一種遮斷電流路徑之保護元件、及使用其之電池組。本發明申請案係以於日本於2019年8月29日申請之日本專利申請案編號日本發明專利申請2019-157431為基礎而主張其優先權者,該發明申請案藉由被參照而援用於本發明申請案。 This invention relates to a protective element for interrupting a current path, and a battery pack using the same. This invention claims priority based on Japanese Patent Application No. 2019-157431, filed in Japan on August 29, 2019, which is incorporated herein by reference.
多數之能夠充電而重複利用之二次電池被加工為電池組而提供給使用者。尤其是在重量能量密度較高之鋰離子二次電池中,為了確保使用者及電子機器之安全,一般而言,將過充電保護、過放電保護等若干個保護電路內置於電池組,具有於特定之情形下遮斷電池組之輸出之功能。 Most rechargeable and reusable secondary batteries are processed into battery packs and provided to users. Lithium-ion secondary batteries, particularly those with a high gravimetric energy density, typically incorporate several protection circuits, such as overcharge protection and over-discharge protection, to ensure the safety of users and electronic devices. These circuits can shut down the battery pack's output under specific circumstances.
於多數之使用鋰離子二次電池之電子裝置中,藉由使用內置於電池組之FET開關進行輸出之導通/關斷,而進行電池組之過充電保護或過放電保護動作。然而,在因某種原因,FET開關發生短路破壞之情形下、在被施加雷電突波等,流通瞬間性大電流之情形下、或在因電池單元之壽命,而輸出電壓異常降低、或相反輸出過大異常電壓之情形下,亦必須保 護電池組及電子機器免受起火等事故之害。因而,為了於此可能設想到之任意之異常狀態下,亦安全地遮斷電池單元之輸出,而使用包含具有藉由來自外部之信號遮斷電流路徑之功能之保險絲元件之保護元件。 Most electronic devices using lithium-ion secondary batteries utilize a FET switch built into the battery pack to turn the output on and off, protecting the battery pack from overcharge or over-discharge. However, if the FET switch short-circuits for some reason, if a lightning surge or other transient current flows, or if the output voltage drops abnormally due to the battery cell's lifespan, or if the output voltage exceeds the normal value, the battery pack and the electronic device must be protected from fire and other hazards. Therefore, in order to safely shut down the battery cell output even in any conceivable abnormal conditions, a protective device including a fuse element that has the function of shutting down the current path in response to an external signal is used.
作為面向此鋰離子二次電池等之保護電路之保護元件,使用在保護元件內部具有發熱體,藉由該發熱體之發熱,將電流路徑上之可熔導體熔斷之構造。 As a protection element for the protection circuit of a lithium-ion secondary battery, etc., a structure is used in which a heating element is internally provided in the protection element, and the heat generated by the heating element melts the fusible conductor in the current path.
專利文獻1:日本特開2015-53260號公報 Patent Document 1: Japanese Patent Application Publication No. 2015-53260
鋰離子二次電池之用途近年來擴大,業界曾探討更大電流之用途,例如採用至電動螺絲刀等電動工具、或混合動力車、電動車、電動輔助自行車等輸送機器,部分採用已開始。於該等用途中,尤其是於啟動時等,有流通如超過數10A~100A之大電流之情形。較理想為實現應對此大電流容量之保護元件。 The use of lithium-ion secondary batteries has expanded in recent years, with the industry exploring applications with higher currents. For example, these batteries can be used in power tools like electric screwdrivers, and in transportation equipment like hybrid vehicles, electric vehicles, and electric power-assisted bicycles. Some adoption has already begun. In these applications, particularly during startup, high currents exceeding 10A to 100A can flow. Ideally, protective components with the capacity to handle these high currents would be desirable.
為了實現應對此大電流之保護元件,曾提案使用使剖面積增大之可熔導體,於該可熔導體之正面,連接形成有發熱體之絕緣基板之保護元件。 In order to implement a protective element capable of handling such high currents, a proposal has been made to use a fusible conductor with an increased cross-sectional area, with an insulating substrate having a heat generating element connected to the front surface of the fusible conductor.
圖26、圖27、圖28、圖29係顯示設想大電流用途之保護元件之一構成例之圖。圖26係外觀立體圖,圖27係俯視圖,圖28係圖27之D-D’剖視圖,圖29係省略上側外殼而顯示之俯視圖。圖26~圖29所示之保護元件100藉由在與電池之充放電電路等外部電路連接之第1、第2外部連接端子101、102間連接可熔導體103,而構成該外部電路之一部分,於過電壓等異常時,藉由可熔導體103熔融,而遮斷第1外部連接端子101與第2外部連接端子102之間之電流路徑。 Figures 26, 27, 28, and 29 illustrate an example configuration of a protective element designed for high-current applications. Figure 26 is a perspective view, Figure 27 is a top view, Figure 28 is a cross-sectional view taken along line D-D' of Figure 27, and Figure 29 is a top view showing the upper housing omitted. The protective element 100 shown in Figures 26-29 comprises a fusible conductor 103 connected between first and second external connection terminals 101 and 102, which are connected to an external circuit such as a battery charge/discharge circuit. This fusible conductor 103 forms part of the external circuit. In the event of an abnormality such as an overvoltage, the fusible conductor 103 melts, blocking the current path between the first and second external connection terminals 101, 102.
保護元件100具備:絕緣基板105;第1、第2外部連接端子101、102,其等與外部電路連接;2個發熱體106,其等排列於絕緣基板105之正面;絕緣層107,其被覆發熱體106;正面電極108,其積層於絕緣層107上,且與發熱體106連接;及可熔導體103,其跨於第1外部連接端子101、正面電極108、及第2外部連接端子102經由銲膏而搭載。 The protective element 100 comprises an insulating substrate 105; first and second external connection terminals 101 and 102, which connect to external circuits; two heating elements 106 arranged on the front surface of the insulating substrate 105; an insulating layer 107 covering the heating elements 106; a front electrode 108 laminated on the insulating layer 107 and connected to the heating elements 106; and a fusible conductor 103, which is mounted via solder paste across the first external connection terminal 101, the front electrode 108, and the second external connection terminal 102.
保護元件100藉由第1、第2外部連接端子101、102跨於元件殼體之內外而配設,且藉由螺固等連接於設置於供保護元件100安裝之外部電路基板之連接電極,而將可熔導體103組裝入形成於外部電路基板上之電流路徑之一部分。 The protective element 100 is configured with first and second external connection terminals 101 and 102 extending across the interior and exterior of the element housing. These terminals are connected to connection electrodes on the external circuit board on which the protective element 100 is mounted, such as by screws. This allows the fusible conductor 103 to be incorporated into a portion of the current path formed on the external circuit board.
發熱體106係具有電阻值較高且當通電時發熱之導電性之構件,包含例如鎳鉻合金、W、Mo、Ru等或包含其等之材料。又,發熱體106與形成於絕緣基板105之正面上之發熱體饋電電極109連接。發熱體饋電電極 109經由銲膏與第3外部連接端子110連接。保護元件100藉由第3外部連接端子110連接於設置於供保護元件100安裝之外部電路基板之連接電極,而將發熱體106與設置於外部電路之外部電源連接。而且,發熱體106係由未圖示之開關元件等常時控制通電及發熱。 The heater 106 is a conductive component with a high electrical resistance that generates heat when current is applied. It is made of, for example, nickel-chromium alloy, W, Mo, Ru, or a material containing these. The heater 106 is connected to a heater feed electrode 109 formed on the front surface of the insulating substrate 105. The heater feed electrode 109 is connected to a third external connection terminal 110 via solder paste. The protective element 100 is connected to a connection electrode on the external circuit board where the protective element 100 is mounted, via the third external connection terminal 110, thereby connecting the heater 106 to an external power source located in the external circuit. Furthermore, the power supply and heating of the heater 106 are constantly controlled by a switching element (not shown).
發熱體106由包含玻璃層等之絕緣層107被覆,且於絕緣層107上形成正面電極108,藉此介隔著絕緣層107重疊正面電極108。又,於正面電極108上,經由銲膏連接跨於第1、第2外部連接端子101、102間連接之可熔導體103。 The heat generator 106 is covered with an insulating layer 107 made of glass or the like, and a front electrode 108 is formed on the insulating layer 107, thereby overlapping the front electrode 108 with the insulating layer 107 interposed therebetween. Furthermore, a fusible conductor 103 is connected to the front electrode 108 via solder paste, spanning between the first and second external connection terminals 101 and 102.
藉此,保護元件100之發熱體106與可熔導體103藉由重疊而熱性連接,若發熱體106藉由通電而發熱,則可將可熔導體103熔斷。 In this way, the heating element 106 of the protection element 100 and the fusible conductor 103 are thermally connected by overlapping. When the heating element 106 is heated by power supply, the fusible conductor 103 can be melted.
可熔導體103係由無Pb焊料等低熔點金屬、或Ag、Cu或以其等為主成分之合金等高熔點金屬形成,或具有低熔點金屬與高熔點金屬之積層構造。而且,可熔導體103藉由自第1外部連接端子101跨於正面電極108直到第2外部連接端子102而連接,而構成組裝有保護元件100之外部電路之電流路徑之一部分。而且,可熔導體103藉由因流通超過額定之電流,自發熱(焦耳熱),而熔斷,或因發熱體106之發熱而熔斷,將第1、第2外部連接端子101、102間予以遮斷。 The fusible conductor 103 is formed from a low-melting-point metal such as lead-free solder, a high-melting-point metal such as Ag, Cu, or an alloy primarily composed of these, or a laminated structure of low-melting-point and high-melting-point metals. The fusible conductor 103 connects from the first external connection terminal 101 across the front electrode 108 to the second external connection terminal 102, forming part of the current path of the external circuit in which the protective element 100 is mounted. The fusible conductor 103 melts due to self-heating (Joule heating) caused by a current exceeding the rated value, or due to heat generated by the heating element 106, thereby isolating the connection between the first and second external connection terminals 101 and 102.
而且,保護元件100當產生遮斷外部電路之電流路徑之需要時,藉由開關元件,向發熱體106通電。藉此,保護元件100之發熱體106發熱至高 溫,將組裝入外部電路之電流路徑上之可熔導體103熔融。可熔導體103之熔融導體藉由朝潤濕性較高之正面電極108及第1、第2外部連接端子101、102拉近,而將可熔導體103熔斷。因而,保護元件100使第1外部連接端子101~正面電極108~第2外部連接端子102之間熔斷,可遮斷外部電路之電流路徑。 When the protective element 100 needs to interrupt the current path of the external circuit, it energizes the heating element 106 via the switching element. This heats the heating element 106 of the protective element 100 to a high temperature, melting the fusible conductor 103 incorporated into the current path of the external circuit. The molten conductor of the fusible conductor 103 is pulled toward the more humid front electrode 108 and the first and second external connection terminals 101 and 102, melting the fusible conductor 103. Thus, the protective element 100 fuses the connection between the first external connection terminal 101, the front electrode 108, and the second external connection terminal 102, interrupting the current path of the external circuit.
保護元件100如圖30所示般,具有下側外殼111、及上側外殼112,該等下側外殼111與上側外殼112藉由被接合,而構成保護元件100之殼體113。此外,圖30係顯示殼體113之圖,(A)係上側外殼112之仰視圖,(B)係下側外殼111及上側外殼112之剖視圖,(C)係下側外殼111之俯視圖。下側外殼111支持絕緣基板105、及第1、第2外部連接端子101、102。上側外殼112具有收容上述之元件內部構成之空間。 As shown in Figure 30 , the protective element 100 includes a lower housing 111 and an upper housing 112. The lower housing 111 and the upper housing 112 are joined together to form a housing 113 of the protective element 100. Figure 30 shows the housing 113, with (A) showing a bottom view of the upper housing 112, (B) a cross-sectional view of the lower housing 111 and the upper housing 112, and (C) a top view of the lower housing 111. The lower housing 111 supports the insulating substrate 105 and the first and second external connection terminals 101 and 102. The upper housing 112 has a space for accommodating the internal components of the aforementioned components.
下側外殼111於各轉角部形成嵌合凸部114。又,上側外殼112於各轉角部形成與嵌合凸部114嵌合之嵌合凹部115。於形成殼體113時,如圖31所示,對下側外殼111之包含嵌合凸部114之側緣部供給接著劑120,且與上側外殼112對接。藉此,將嵌合凸部114與嵌合凹部115經由接著劑120嵌合,將下側外殼111與上側外殼112接合。 The lower housing 111 has mating protrusions 114 formed at each corner. Furthermore, the upper housing 112 has mating recesses 115 formed at each corner that mate with the mating protrusions 114. When forming the housing 113, as shown in Figure 31, adhesive 120 is applied to the side edge of the lower housing 111, including the mating protrusions 114, and then brought into contact with the upper housing 112. This engages the mating protrusions 114 and the mating recesses 115 via the adhesive 120, joining the lower housing 111 to the upper housing 112.
此處,保護元件100為了應對大電流用途,而如上述般謀求可熔導體103之大型化、及發熱體106之發熱量之增加。然而,由於伴隨於此,可熔導體103之熔斷時之熱衝擊亦變大,且外殼內部之空氣急劇膨脹,故對殼體113要求承受該壓力之接合強度。為了提高下側外殼111與上側外殼 112之接合強度,而考量增加接著劑120之量,但若增加接著劑120,則在嵌合時向嵌合凹部115流入之量增加。又,沿嵌合凸部114,接著劑亦進入與嵌合凹部115之間。 To accommodate high-current applications, the protective element 100 requires a larger fusible conductor 103 and increased heat generation by the heating element 106, as described above. However, this also increases the thermal shock when the fusible conductor 103 melts, causing the air inside the housing to expand rapidly. Consequently, the housing 113 must have a bond strength strong enough to withstand this pressure. To enhance the bond strength between the lower housing 111 and the upper housing 112, increasing the amount of adhesive 120 is considered. However, increasing the amount of adhesive 120 increases the amount that flows into the mating recess 115 during mating. Furthermore, adhesive also enters the space between the mating protrusion 114 and the mating recess 115.
因而,如圖32所示,在使下側外殼111與上側外殼112對接時,無流入嵌合凸部114與嵌合凹部115之間之接著劑120之溢出位置,反而阻礙下側外殼111與上側外殼112之密接。因此,成為上側外殼112自下側外殼111浮起之狀態,有產生在未獲得所期望之接著強度下,上側外殼112於可熔導體103之熔斷時脫開、或無法滿足特定之殼體之高度條件等不良情況之虞。 Therefore, as shown in Figure 32, when the lower housing 111 and upper housing 112 are mated, there is no overflow area for the adhesive 120 to flow between the mating protrusion 114 and the mating recess 115. This hinders the close contact between the lower housing 111 and the upper housing 112. As a result, the upper housing 112 floats away from the lower housing 111. Without achieving the desired bond strength, there is a risk that the upper housing 112 may detach when the fusible conductor 103 melts, or that the specified housing height requirements may not be met.
因而,本發明之目的在於提供一種能夠排除嵌合凸部與嵌合凹部之間之接著劑之多餘部分,確實地確保下側外殼與上側外殼之接著強度之保護元件、及使用其之電池組。 Therefore, an object of the present invention is to provide a protective element that can eliminate excess adhesive between the mating protrusion and the mating recess, thereby reliably ensuring the bonding strength between the lower and upper housings, and a battery pack using the same.
為了解決上述之問題,本發明之保護元件具備:可熔導體;及殼體,其具有下側外殼及上側外殼,藉由將上述上側外殼及上述下側外殼以接著劑接合而形成;於上述上側外殼及上述下側外殼之任一者形成有嵌合凹部,於任另一者形成有嵌合於上述嵌合凹部之嵌合凸部,且形成有狹槽,該狹槽與上述嵌合凹部連續且延伸於上述上側外殼及上述下側外殼之對接面,使上述接著劑流動。 To address the aforementioned issues, the protective element of the present invention comprises: a fusible conductor; and a housing comprising a lower housing and an upper housing, formed by bonding the upper and lower housings together with an adhesive. A fitting recess is formed in one of the upper and lower housings, and a fitting protrusion is formed in the other housing to fit into the fitting recess. Furthermore, a narrow groove is formed, continuous with the fitting recess and extending to the mating surfaces of the upper and lower housings, allowing the adhesive to flow.
為了解決上述之問題,本發明之保護元件具備:可熔導體;及殼體,其具有下側外殼及上側外殼,藉由將上述上側外殼及上述下側外殼以接著劑接合而形成;於上述上側外殼及上述下側外殼之任一者形成有嵌合凹部,於任另一者形成有嵌合於上述嵌合凹部之嵌合凸部;上述嵌合凸部於外周面形成有使上述接著劑流動之狹槽。 To address the aforementioned issues, the protective element of the present invention comprises: a fusible conductor; and a housing comprising a lower housing and an upper housing, formed by bonding the upper and lower housings together with an adhesive. A mating recess is formed in one of the upper and lower housings, and a mating protrusion is formed in the other housing to engage with the mating recess. The mating protrusion has a narrow groove formed on its outer circumference for allowing the adhesive to flow.
為了解決上述之問題,本發明之保護元件具備:可熔導體;及殼體,其具有下側外殼及上側外殼,藉由將上述上側外殼及上述下側外殼以接著劑接合而形成;於上述上側外殼及上述下側外殼之任一者形有成嵌合凹部,於任另一者形成有嵌合於上述嵌合凹部之嵌合凸部,且形成有狹槽,該狹槽與上述嵌合凹部連續且延伸於上述上側外殼及上述下側外殼之對接面,使上述接著劑流動;上述嵌合凸部於外周面形成有使上述接著劑流動之狹槽。 To address the aforementioned issues, the protective element of the present invention comprises: a fusible conductor; and a housing comprising a lower housing and an upper housing, formed by bonding the upper and lower housings together with an adhesive. A recessed engagement portion is formed on one of the upper and lower housings, and a protrusion is formed on the other housing to engage with the recessed engagement portion. Furthermore, a narrow groove is formed therein, continuous with the recessed engagement portion and extending to the mating surfaces of the upper and lower housings to allow the adhesive to flow. The protrusion has a narrow groove formed on its outer peripheral surface to allow the adhesive to flow.
又,本發明之電池組具備:1個以上之電池單元;及保護元件,其連接於上述電池單元之充放電路徑上,遮斷該充放電路徑;且上述保護元件具備:可熔導體;及殼體,其具有下側外殼及上側外殼,藉由將上述上側外殼及上述下側外殼以接著劑接合而形成;於上述上側外殼及上述下側外殼之任一者形成有嵌合凹部,於任另一者形成有嵌合於上述嵌合凹部之嵌合凸部,且形成有狹槽,該狹槽與上述嵌合凹部連續且延伸於上述上側外殼及上述下側外殼之對接面,使上述接著劑流動。 The battery pack of the present invention comprises: one or more battery cells; a protective element connected to a charge/discharge circuit of the battery cell to block the charge/discharge circuit; and a housing comprising a lower housing and an upper housing, formed by bonding the upper and lower housings together with an adhesive. A fitting recess is formed in one of the upper and lower housings, and a fitting protrusion is formed in the other housing to fit into the fitting recess. Furthermore, a narrow groove is formed therein, continuous with the fitting recess and extending to the abutting surfaces of the upper and lower housings to allow the adhesive to flow.
又,本發明之電池組具備:1個以上之電池單元;及保護元件,其連 接於上述電池單元之充放電路徑上,遮斷該充放電路徑;且上述保護元件具備:可熔導體;及殼體,其具有下側外殼及上側外殼,藉由將上述上側外殼及上述下側外殼以接著劑接合而形成;於上述上側外殼及上述下側外殼之任一者形成有嵌合凹部,於任另一者形成有嵌合於上述嵌合凹部之嵌合凸部;上述嵌合凸部形成有使上述接著劑沿突出方向流動之狹槽。 The battery pack of the present invention comprises: one or more battery cells; and a protective element connected to a charge/discharge circuit of the battery cell to block the charge/discharge circuit. The protective element comprises: a fusible conductor; and a housing comprising a lower housing and an upper housing, formed by bonding the upper and lower housings together with an adhesive. A fitting recess is formed on one of the upper and lower housings, and a fitting protrusion is formed on the other housing to fit into the fitting recess. The fitting protrusion has a narrow groove formed therein to allow the adhesive to flow in the protruding direction.
又,本發明之電池組具備:1個以上之電池單元;及保護元件,其連接於上述電池單元之充放電路徑上,遮斷該充放電路徑;且上述保護元件具備:可熔導體;及殼體,其具有下側外殼及上側外殼,藉由將上述上側外殼及上述下側外殼以接著劑接合而形成;於上述上側外殼及上述下側外殼之任一者形成有嵌合凹部,於任另一者形成有嵌合於上述嵌合凹部之嵌合凸部,且形成有狹槽,該狹槽與上述嵌合凹部連續且延伸於上述上側外殼及上述下側外殼之對接面,使上述接著劑流動;上述嵌合凸部形成有使上述接著劑沿突出方向流動之狹槽。 Furthermore, the battery pack of the present invention comprises: one or more battery cells; and a protective element connected to the charge and discharge circuit of the battery cells to block the charge and discharge circuit; and the protective element comprises: a fusible conductor; and a housing having a lower outer shell and an upper outer shell, formed by bonding the upper outer shell and the lower outer shell with an adhesive; One of the housing and the lower housing has a recessed engagement portion, and the other has a protruding engagement portion that engages with the recessed engagement portion. A narrow groove is formed therein. The narrow groove is continuous with the recessed engagement portion and extends to the mating surfaces of the upper and lower housings to allow the adhesive to flow. The protruding engagement portion has a narrow groove formed therein to allow the adhesive to flow in the protruding direction.
根據本發明,狹槽藉由在使上側外殼及下側外殼對接時,使填充於嵌合凹部內之接著劑之多餘部分流動至內部,而防止使接著劑之多餘部分滯留於與嵌合凸部嵌合之嵌合凹部內。藉此,可防止由滯留於嵌合凹部內之接著劑之多餘部分,阻礙上側外殼及下側外殼之密接。 According to the present invention, the narrow groove allows excess adhesive filled in the mating recess to flow inward when the upper and lower housings are mated, preventing it from accumulating in the mating recess where it engages with the mating protrusion. This prevents excess adhesive accumulating in the mating recess from obstructing the close contact between the upper and lower housings.
1,50,60,100:保護元件 1,50,60,100: Protective components
2,105:絕緣基板 2,105: Insulating substrate
2a:正面 2a: Front
2b:背面 2b: Back
2c:第1側緣部 2c: 1st side edge
2d:第2側緣部 2d: Second side edge
3,103:可熔導體 3,103: Fusible conductor
3a:熔融導體 3a: Melting conductor
4,52,111:下側外殼 4,52,111: Lower shell
5,51,112:上側外殼 5,51,112: Upper outer shell
5a:側壁下端面 5a: Lower end surface of side wall
6,113:殼體 6,113: Shell
7,101:第1外部連接端子 7,101: 1st external connection terminal
8,102:第2外部連接端子 8,102: Second external connection terminal
9,107:絕緣層 9,107: Insulating layer
10,106:發熱體 10,106: Heat generating body
11,108:正面電極 11,108: Front electrode
12:吸引孔 12: Suction hole
13:導電層 13:Conductive layer
14:背面電極 14: Back electrode
15:發熱體電極 15: Heating electrode
16,109:發熱體饋電電極 16,109: Heating element feeding electrode
17,110:第3外部連接端子 17,110: Third external connection terminal
18:熔斷構件 18: Fusing components
19,120:接著劑 19,120: Follow-up agent
20:接合材料/連接材料 20: Bonding materials/connecting materials
23:凹面部 23: Concave face
25,115:嵌合凹部 25,115: Fitting recess
26,114:嵌合凸部 26,114: Fitting convex part
27:凹部狹槽/狹槽 27: Recessed slot/slot
28:狹槽/凸部狹槽 28: Slot/convex slot
29:充電裝置 29: Charging device
31:低熔點金屬層 31: Low melting point metal layer
32:高熔點金屬層 32: High melting point metal layer
33:電池組 33:Battery pack
33a:正極端子 33a: Positive terminal
33b:負極端子 33b: Negative terminal
34:電池單元 34:Battery cell
34a~34d:電池單元 34a~34d: Battery cells
35:電池堆 35: Battery stack
36:充放電控制電路 36: Charge and discharge control circuit
37:檢測電路 37: Detection circuit
38:電流控制元件 38: Current control element
39,39a,39b:電流控制元件 39,39a,39b: Current control element
40:控制部 40: Control Department
圖1係應用本發明之保護元件之外觀立體圖。 Figure 1 is a perspective view of the protective element to which the present invention is applied.
圖2係應用本發明之保護元件之剖視圖。 Figure 2 is a cross-sectional view of a protective element employing the present invention.
圖3係省略應用本發明之保護元件之上側外殼而顯示之俯視圖 Figure 3 is a top view showing the protective element of the present invention without the upper housing.
圖4係顯示在應用本發明之保護元件中,可熔導體已熔斷之狀態之剖視圖。 Figure 4 is a cross-sectional view showing a state where the fusible conductor in the protection element employing the present invention has melted.
圖5係顯示下側外殼之圖,(A)係俯視圖,(B)係(A)之E-E’剖視圖。 Figure 5 shows the lower side of the outer casing, (A) is a top view, and (B) is an E-E' cross-sectional view of (A).
圖6係顯示上側外殼之圖,(A)係仰視圖,(B)係(A)之C-C’剖視圖。 Figure 6 shows the upper side of the outer casing, (A) is a bottom view, and (B) is a C-C' cross-sectional view of (A).
圖7係顯示下側外殼與上側外殼之接合步驟之圖,(A)係顯示接著劑之流動之下側外殼之俯視圖,(B)係顯示使塗佈有接著劑之下側外殼與上側外殼嵌合之狀態之接著劑之流動的(A)之G-G’剖視圖。 Figure 7 shows the steps of joining the lower shell and the upper shell. (A) is a top view of the lower shell showing the flow of adhesive, and (B) is a cross-sectional view taken along line G-G' of (A) showing the flow of adhesive as the lower shell, coated with adhesive, is engaged with the upper shell.
圖8係顯示凹部狹槽之變化例之圖,(A)係上側外殼之仰視圖,(B)係(A)之H-H’剖視圖。 Figure 8 shows variations of the concave groove. (A) is a bottom view of the upper housing, and (B) is a cross-sectional view taken along line H-H' of (A).
圖9係顯示凹部狹槽之變化例之俯視圖。 Figure 9 is a top view showing a variation of the concave groove.
圖10係顯示凹部狹槽之變化例之俯視圖。 Figure 10 is a top view showing a variation of the concave groove.
圖11係顯示下側外殼與上側外殼之接合步驟之圖,(A)係顯示塗佈有接著劑之下側外殼之俯視圖,(B)係使上側外殼與下側外殼對向配置之(A)之F-F’剖視圖。 Figure 11 shows the steps of joining the lower and upper shells. (A) is a top view of the lower shell coated with adhesive, and (B) is a cross-sectional view taken along line F-F' of (A) with the upper and lower shells facing each other.
圖12係顯示在下側外殼設置有凸部狹槽之殼體之圖,(A)係上側外殼之仰視圖,(B)係使上側外殼與下側外殼對向配置之剖視圖,(C)係下側外殼之俯視圖。 Figure 12 shows a housing with a protruding groove provided on the lower housing. (A) is a bottom view of the upper housing, (B) is a cross-sectional view of the upper and lower housings facing each other, and (C) is a top view of the lower housing.
圖13係顯示形成有凸部狹槽之嵌合凸部之圖,(A)係俯視圖,(B)係(A)之J-J’剖視圖。 Figure 13 shows a mating protrusion with a protrusion groove formed therein. (A) is a top view, and (B) is a J-J' cross-sectional view of (A).
圖14係顯示在下側外殼設置有凸部狹槽之殼體之圖,(A)係上側外殼之仰視圖,(B)係使上側外殼與下側外殼對向配置之剖視圖,(C)係下側外 殼之俯視圖。 Figure 14 shows a housing with a protruding groove provided on the lower housing. (A) is a bottom view of the upper housing, (B) is a cross-sectional view with the upper and lower housings facing each other, and (C) is a top view of the lower housing.
圖15係顯示形成有凸部狹槽之嵌合凸部之圖,(A)係俯視圖,(B)係(A)之J-J’剖視圖。 Figure 15 shows a mating protrusion with a protrusion groove formed therein. (A) is a top view, and (B) is a J-J' cross-sectional view of (A).
圖16係顯示設置有嵌合凸部之上側外殼之圖,(A)係仰視圖,(B)係(A)之L-L’剖視圖。 Figure 16 shows the upper side of the housing with the mating protrusions. (A) is a bottom view, and (B) is a cross-sectional view taken along line L-L' of (A).
圖17係顯示設置有嵌合凹部之下側外殼之圖,(A)係俯視圖,(B)係(A)之M-M’剖視圖。 Figure 17 shows the lower side of the housing with the mating recess. (A) is a top view, and (B) is a cross-sectional view taken along line M-M' of (A).
圖18係顯示下側外殼與上側外殼之接合步驟之圖,(A)係顯示接著劑之流動之下側外殼之俯視圖,(B)係使塗佈有接著劑之下側外殼與上側外殼嵌合之狀態之接著劑之流動之(A)之K-K’剖視圖。 Figure 18 shows the steps of joining the lower shell and the upper shell. (A) is a top view of the lower shell showing the flow of adhesive, and (B) is a cross-sectional view taken along line K-K' of (A) showing the flow of adhesive as the lower shell, coated with adhesive, is engaged with the upper shell.
圖19係顯示下側外殼與上側外殼之接合步驟之圖,(A)係顯示塗佈有接著劑之下側外殼之俯視圖,(B)係使上側外殼與下側外殼對向配置之(A)之N-N’剖視圖。 Figure 19 shows the steps of joining the lower and upper shells. (A) is a top view of the lower shell coated with adhesive, and (B) is a cross-sectional view taken along line N-N' of (A) with the upper and lower shells facing each other.
圖20係可熔導體之外觀立體圖。 Figure 20 is a perspective view of the fusible conductor.
圖21係顯示電池組之構成例之電路圖。 Figure 21 is a circuit diagram showing an example of a battery pack configuration.
圖22係應用本發明之保護元件之電路圖。 Figure 22 is a circuit diagram of a protective element employing the present invention.
圖23係顯示應用本發明之保護元件之變化例之剖視圖。 Figure 23 is a cross-sectional view showing a variation of the protective element to which the present invention is applied.
圖24係變化例之保護元件之電路圖。 Figure 24 is a circuit diagram of a modified protection element.
圖25係顯示在變化例之保護元件中,可熔導體已熔斷之狀態之剖視圖。 Figure 25 is a cross-sectional view showing a state where the fusible conductor in a modified embodiment of the protection element has melted.
圖26係顯示應對大電流之保護元件之外觀立體圖。 Figure 26 shows a three-dimensional diagram of the external appearance of a protective component designed to handle high currents.
圖27係圖26所示之保護元件之俯視圖。 Figure 27 is a top view of the protective element shown in Figure 26.
圖28係圖27之D-D‘剖視圖。 Figure 28 is a cross-sectional view taken along line D-D' of Figure 27.
圖29係將圖26所示之保護元件省略上側外殼而顯示之俯視圖。 Figure 29 is a top view of the protective element shown in Figure 26, omitting the upper housing.
圖30係顯示圖26所示之保護元件之殼體之圖,(A)係上側外殼之仰視圖,(B)係以將下側外殼及上側外殼對向配置之狀態顯示之剖視圖,(C)係下側外殼之俯視圖。 Figure 30 shows the housing of the protective element shown in Figure 26. (A) is a bottom view of the upper housing, (B) is a cross-sectional view showing the lower housing and the upper housing facing each other, and (C) is a top view of the lower housing.
圖31係顯示下側外殼與上側外殼之接合步驟之圖,(A)係以將塗佈有接著劑之下側外殼與上側外殼對向配置之狀態顯示之剖視圖,(B)係塗佈有接著劑之下側外殼之俯視圖。 Figure 31 shows the steps of joining the lower and upper shells. (A) is a cross-sectional view showing the lower and upper shells coated with adhesive facing each other. (B) is a top view of the lower shell coated with adhesive.
圖32係顯示將下側外殼與上側外殼接合之狀態之圖,(A)係顯示在嵌合凹部內填充有接著劑之上側外殼之仰視圖,(B)係顯示將下側外殼與上側外殼接合之狀態之剖視圖。 Figure 32 shows the lower housing and upper housing being joined. (A) is a bottom view of the upper housing with the mating recess filled with adhesive, and (B) is a cross-sectional view showing the lower housing and upper housing being joined.
以下,針對應用本發明之保護元件、電池組,一面參照圖式,一面詳細地說明。此外,本發明並非僅限定於以下之實施形態者,當得在不脫離本發明之要旨之範圍內進行各種變更。又,圖式係示意性圖式,各尺寸之比例等有與實際者不同之情形。具體的尺寸等應該參酌以下之說明而加以判斷。又,在圖式相互間當亦含有彼此之尺寸之關係或比例不同之部分。 The following describes in detail the protection element and battery pack to which the present invention is applied, with reference to the drawings. The present invention is not limited to the following embodiments and may be modified without departing from the spirit of the present invention. The drawings are schematic, and the proportions of dimensions and other aspects may differ from actual dimensions. Specific dimensions and other aspects should be determined in light of the following description. Furthermore, some drawings may have different dimensional relationships or proportions.
於圖1、圖2、圖3中顯示應用本發明之保護元件1。保護元件1具備:絕緣基板2;可熔導體3,其搭載於絕緣基板2之正面;及殼體6,其具有支持絕緣基板2之背面的下側外殼4、及覆蓋絕緣基板2之正面的上側外殼 5,藉由將下側外殼4與上側外殼5以接著劑19接合,而收納絕緣基板2。又,保護元件1具有第1、第2外部連接端子7、8。第1、第2外部連接端子7、8跨於殼體6之內外而配設,藉由螺固等而連接於設置在供保護元件1安裝之外部電路的連接電極。第1、第2外部連接端子7、8由下側外殼4支持,且各一端藉由可熔導體3而連接。而且,保護元件1因經由第1、第2外部連接端子7、8而組入外部電路,從而可熔導體3構成該外部電路之電流路徑之一部分,藉由後述之發熱體10發熱、或超過額定之過電流而熔斷,而可遮斷電流路徑。 Figures 1, 2, and 3 illustrate a protective element 1 to which the present invention is applied. The protective element 1 comprises an insulating substrate 2; a fusible conductor 3 mounted on the front surface of the insulating substrate 2; and a housing 6 comprising a lower housing 4 supporting the back surface of the insulating substrate 2 and an upper housing 5 covering the front surface of the insulating substrate 2. The lower housing 4 and the upper housing 5 are bonded together with an adhesive 19 to house the insulating substrate 2. Furthermore, the protective element 1 has first and second external connection terminals 7 and 8. These terminals 7 and 8 are arranged to span the interior and exterior of the housing 6 and are connected to connection electrodes provided in the external circuit in which the protective element 1 is mounted, for example, by screwing. The first and second external connection terminals 7 and 8 are supported by the lower housing 4 and connected at one end via a fusible conductor 3. Furthermore, since the protective element 1 is incorporated into an external circuit via the first and second external connection terminals 7 and 8, the fusible conductor 3 forms part of the current path of the external circuit. This current path is interrupted by heat generated by the heating element 10 (described later) or by melting due to an overcurrent exceeding the rated value.
絕緣基板2例如由氧化鋁、玻璃陶瓷、莫來石、氧化鋯等具有絕緣性之構件形成。此外,絕緣基板2亦可使用用於玻璃環氧樹脂基板、酚基板等印刷配線基板之材料。於圖3所示之絕緣基板2中,將經由後述之正面電極11而連接之可熔導體3之延伸方向之兩側緣設為第1側緣部2c,將形成後述之發熱體電極15及發熱體饋電電極16之兩側緣設為第2側緣部2d。 The insulating substrate 2 is formed from an insulating material such as aluminum oxide, glass ceramic, mullite, or zirconium oxide. Alternatively, the insulating substrate 2 may be made of materials used for printed wiring boards, such as glass epoxy and phenolic substrates. In the insulating substrate 2 shown in Figure 3 , the two side edges extending along the fusible conductor 3, which are connected via the front electrode 11 (described later), are designated as first side edges 2c. The two side edges forming the heater electrode 15 and heater feed electrode 16 (described later) are designated as second side edges 2d.
將可熔導體3熔斷之發熱體10係具有電阻值較高且當通電時發熱之導電性之構件,包含例如鎳鉻合金、W、Mo、Ru、Cu、Ag、或以其等為主成分之合金等。可藉由將該等合金或組成物、化合物之粉狀體與樹脂黏合劑等混合形成糊狀物,將該糊狀物利用絲網印刷技術於絕緣基板2之正面2a上形成圖案並進行煅燒等而形成。 The heating element 10 that melts the fusible conductor 3 is a conductive component with a high electrical resistance that generates heat when current is applied. It can be made of, for example, nickel-chromium alloy, W, Mo, Ru, Cu, Ag, or alloys containing these as primary components. It can be formed by mixing powders of these alloys, compositions, or compounds with a resin binder to form a paste. This paste is then patterned on the front surface 2a of the insulating substrate 2 using screen printing techniques and then calcined.
發熱體10在絕緣基板2之正面2a上由絕緣層9被覆。於絕緣層9上,積層後述之正面電極11。絕緣層9係為了謀求發熱體10之保護及絕緣,且高效率地向正面電極11及可熔導體3傳遞發熱體10之熱而設置,包含例如玻璃層。 The heating element 10 is covered by an insulating layer 9 on the front surface 2a of the insulating substrate 2. A front electrode 11, described later, is laminated on the insulating layer 9. The insulating layer 9 is provided to protect and insulate the heating element 10 and to efficiently transfer heat from the heating element 10 to the front electrode 11 and the fusible conductor 3. It may be made of, for example, a glass layer.
發熱體10之一端與形成於絕緣基板2之正面2a之發熱體電極15連接。又,發熱體電極15與形成於絕緣層9上之正面電極11連接。藉此,發熱體10與搭載於正面電極11上之可熔導體3電性連接。又,發熱體10之另一端與發熱體饋電電極16連接。發熱體饋電電極16形成於絕緣基板2之正面2a,且經由銲膏等連接材料20與第3外部連接端子17連接,經由該第3外部連接端子17與外部電路連接。而且,保護元件1藉由與外部電路連接,而經由第3外部連接端子17將發熱體10組裝入形成於外部電路之向發熱體10之饋電路徑。 One end of the heater 10 is connected to a heater electrode 15 formed on the front surface 2a of the insulating substrate 2. Furthermore, the heater electrode 15 is connected to a front electrode 11 formed on the insulating layer 9. This electrically connects the heater 10 to the fusible conductor 3 mounted on the front electrode 11. Furthermore, the other end of the heater 10 is connected to a heater feed electrode 16. The heater feed electrode 16 is formed on the front surface 2a of the insulating substrate 2 and is connected to a third external connection terminal 17 via a connection material 20 such as solder paste. The third external connection terminal 17 is then connected to an external circuit. Furthermore, the protection element 1 is connected to an external circuit, and the heating element 10 is assembled into a power supply path to the heating element 10 formed in the external circuit via the third external connection terminal 17.
又,發熱體10如圖3所示般,以通電方向成為與可熔導體3之通電方向交叉之方向之方式形成,發熱體電極15及發熱體饋電電極16形成於第2側緣部2d此舉,在有效率地使用絕緣基板2之面積上較佳。 Furthermore, as shown in FIG3 , the heating element 10 is formed so that the direction of current flow intersects the direction of current flow of the fusible conductor 3 . The heating element electrode 15 and the heating element feeding electrode 16 are formed on the second side edge portion 2 d . This is preferably done in terms of efficient use of the area of the insulating substrate 2 .
又,發熱體10可於絕緣基板2之正面形成複數個。於圖3所示之保護元件1之例中,形成2個發熱體10。各發熱體10之一端與發熱體電極15連接,另一端與發熱體饋電電極16連接,且電性並聯連接。 Furthermore, a plurality of heating elements 10 may be formed on the front surface of the insulating substrate 2. In the example of the protective element 1 shown in FIG3 , two heating elements 10 are formed. One end of each heating element 10 is connected to the heating element electrode 15 and the other end is connected to the heating element feeding electrode 16 , and the two elements are electrically connected in parallel.
此外,保護元件1亦可將發熱體10形成在積層於絕緣基板2之正面2a 的絕緣層9之內部。又,保護元件1亦可將發熱體10形成於絕緣基板2之內部。又,保護元件1亦可將發熱體10形成於絕緣基板2之背面2b。此外,於將發熱體10形成於絕緣基板2之背面2b之情形下,發熱體10之一端與形成於絕緣基板2之背面2b的背面電極連接,經由貫通背面電極與正面電極11間之導電貫通孔而與搭載於正面電極11上之可熔導體2電性連接。又,發熱體10之另一端經由形成於絕緣基板2之背面2b的發熱體饋電電極而與第3外部連接端子17連接。 Alternatively, the protective element 1 may have the heater 10 formed within the insulating layer 9 laminated on the front surface 2a of the insulating substrate 2. Alternatively, the protective element 1 may have the heater 10 formed within the insulating substrate 2. Alternatively, the protective element 1 may have the heater 10 formed on the back surface 2b of the insulating substrate 2. In the case where the heater 10 is formed on the back surface 2b of the insulating substrate 2, one end of the heater 10 is connected to a back electrode formed on the back surface 2b of the insulating substrate 2, and is electrically connected to the fusible conductor 2 mounted on the front surface 11 via a conductive through-hole extending between the back electrode and the front surface 11. Furthermore, the other end of the heating element 10 is connected to the third external connection terminal 17 via a heating element feeding electrode formed on the back surface 2b of the insulating substrate 2.
於絕緣層9上形成有正面電極11,該正面電極11經由發熱體電極15與發熱體10連接,且與可熔導體3連接。正面電極11經由銲膏等接合材料20而連接於可熔導體3。又,正面電極11當可熔導體3熔融時將熔融導體3a凝聚,藉此可將可熔導體3熔斷。 A front electrode 11 is formed on the insulating layer 9. This front electrode 11 is connected to the heater 10 via the heater electrode 15 and to the fusible conductor 3. The front electrode 11 is connected to the fusible conductor 3 via a bonding material 20 such as solder paste. Furthermore, when the fusible conductor 3 melts, the front electrode 11 agglomerates the molten conductor 3a, thereby fusing the fusible conductor 3.
正面電極11亦可形成吸引孔12。吸引孔12當可熔導體3熔融時,利用毛細管現象吸引該熔融導體3a,減小在正面電極11上保持之熔融導體3a之體積(參照圖4)。保護元件1即便於為了因應大電流用途而增大可熔導體3之剖面積、因而熔融量增大之情形下,亦可藉由使吸引孔12吸引,而減小熔融導體3a之體積。具有此構成之絕緣基板2構成熔斷構件18,該熔斷構件18當發熱體10通電、發熱時,藉由該熱使可熔導體3熔融,將該熔融導體3a朝吸引孔12吸引並加以遮斷。 The front electrode 11 may also be formed with a suction hole 12. When the fusible conductor 3 melts, the suction hole 12 draws the molten conductor 3a through the capillary phenomenon, reducing the volume of the molten conductor 3a held on the front electrode 11 (see Figure 4). Even if the cross-sectional area of the fusible conductor 3 is increased for high-current applications, resulting in an increased amount of melt, the suction hole 12 can be used to reduce the volume of the molten conductor 3a. The insulating substrate 2 with this structure forms a fuse member 18. When the heating element 10 is energized and generates heat, the heat melts the fusible conductor 3, drawing the molten conductor 3a toward the suction hole 12 and blocking it.
藉此,保護元件1可減小在正面電極11上保持之熔融導體3a之體積, 而更確實地謀求第1、第2外部連接端子7、8間之絕緣,再者,減輕因在可熔導體3之熔斷時產生之電弧放電所致之熔融導體3a之飛散,防止絕緣電阻降低,進而,可防止因可熔導體3朝搭載位置之周邊電路附著所致之短路故障。 This allows the protective element 1 to reduce the volume of the fusible conductor 3a held on the front electrode 11, thereby more reliably achieving insulation between the first and second external connection terminals 7 and 8. Furthermore, this reduces the scattering of the fusible conductor 3a caused by arc discharge when the fusible conductor 3 melts, preventing a decrease in insulation resistance. Furthermore, it prevents short-circuit failures caused by the fusible conductor 3 adhering to the peripheral circuitry at the mounting location.
吸引孔12於內面形成導電層13。藉由形成導電層13,而吸引孔12可容易吸引熔融導體3a。導電層13係由例如銅、銀、金、鐵、鎳、鈀、鉛、錫之任一者、或以任一者為主成分之合金形成,可藉由電解鍍覆或導電膏體之印刷等周知之方法形成吸引孔12之內面。又,導電層13可藉由將複數條金屬線、或具有導電性之帶狀物之集合體插入吸引孔12內而形成。 A conductive layer 13 is formed on the inner surface of the suction hole 12. This conductive layer 13 facilitates the suction of the molten conductor 3a. The conductive layer 13 is formed from, for example, copper, silver, gold, iron, nickel, palladium, lead, or tin, or an alloy primarily composed of any of these metals. The inner surface of the suction hole 12 can be formed by known methods such as electrolytic plating or printing a conductive paste. Alternatively, the conductive layer 13 can be formed by inserting a plurality of metal wires or a collection of conductive ribbons into the suction hole 12.
又,吸引孔12較佳為形成為於絕緣基板2之厚度方向貫通之貫通孔。藉此,吸引孔12可將熔融導體3a吸引至絕緣基板2之背面2b側,可吸引更多之熔融導體3a,而減小熔斷部位之熔融導體3a之體積。此外,吸引孔12可形成為非貫通孔。 Furthermore, the suction hole 12 is preferably formed as a through-hole extending through the thickness of the insulating substrate 2. This allows the suction hole 12 to draw the molten conductor 3a toward the back surface 2b of the insulating substrate 2, thereby attracting more molten conductor 3a and reducing the volume of molten conductor 3a at the melted portion. Alternatively, the suction hole 12 may be formed as a non-through-hole.
吸引孔12之導電層13與形成於絕緣基板2之正面2a之正面電極11連續。由於正面電極11支持可熔導體3且供熔融導體3a凝聚,故藉由正面電極11與導電層13連續,而可容易地將熔融導體3a導引至吸引孔12內。 The conductive layer 13 of the suction hole 12 is continuous with the front electrode 11 formed on the front surface 2a of the insulating substrate 2. Because the front electrode 11 supports the fusible conductor 3 and allows the molten conductor 3a to condense, the continuity between the front electrode 11 and the conductive layer 13 facilitates the guidance of the molten conductor 3a into the suction hole 12.
此外,導電層13及正面電極11藉由被發熱體10加熱,而可容易將可熔導體3之熔融導體3a向吸引孔12內吸引,且容易將其在正面電極11上凝聚。因而,保護元件1可促進自正面電極11經由導電層13向吸引孔12吸引 熔融導體3a之作用,確實地將可熔導體3熔斷。 Furthermore, the conductive layer 13 and front electrode 11, heated by the heat element 10, easily draw the molten conductor 3a of the fusible conductor 3 into the suction hole 12 and easily aggregate it on the front electrode 11. Thus, the protective element 1 promotes the attraction of the molten conductor 3a from the front electrode 11 through the conductive layer 13 into the suction hole 12, reliably melting the fusible conductor 3.
又,可於絕緣基板2之背面2b,形成與吸引孔12之導電層13連接之背面電極14。藉由背面電極14與導電層13連續,而當可熔導體3熔融時,經由吸引孔12移動之熔融導體3a凝聚(參照圖4)。藉此,保護元件1可吸引更多之熔融導體3a,而減小熔斷部位之熔融導體3a之體積。 Furthermore, a back electrode 14 can be formed on the back surface 2b of the insulating substrate 2, connected to the conductive layer 13 of the attraction hole 12. Because the back electrode 14 is continuous with the conductive layer 13, when the fusible conductor 3 melts, the molten conductor 3a that moves through the attraction hole 12 coalesces (see Figure 4). This allows the protective element 1 to attract more molten conductor 3a, reducing the volume of molten conductor 3a at the melted portion.
此外,保護元件1可藉由形成複數個吸引孔12,而增加吸引可熔導體3之熔融導體3a之路徑,藉由吸引更多之熔融導體3a,而減小熔斷部位之熔融導體3a之體積。此時,複數個吸引孔12可跨於正面電極11與可熔導體3重疊之可熔導體3之寬度方向而形成。又,吸引孔12亦可形成於供熔融導體3a潤濕擴展之正面電極11與可熔導體3不重疊之區域。 Furthermore, the protective element 1 can form a plurality of suction holes 12 to increase the path for attracting the molten conductor 3a of the fusible conductor 3. This allows for a greater amount of molten conductor 3a to be attracted, thereby reducing the volume of the molten conductor 3a at the melted portion. In this case, the plurality of suction holes 12 can be formed across the width of the fusible conductor 3 where the front electrode 11 and the fusible conductor 3 overlap. Alternatively, the suction holes 12 can be formed in the area where the front electrode 11 and the fusible conductor 3 do not overlap, allowing the molten conductor 3a to wet and expand.
又,在將2個發熱體10排列設置之情形下,於形成於絕緣基板2之正面2a、背面2b或內部之任一情形下均形成於吸引孔12之兩側此舉,在加熱正面電極11及背面電極14,且將更多之熔融導體3a吸引、凝聚上較佳。 Furthermore, when two heating elements 10 are arranged in parallel, whether formed on the front surface 2a, back surface 2b, or interior of the insulating substrate 2, they are formed on both sides of the suction hole 12. This is advantageous in heating the front electrode 11 and back electrode 14, and in attracting and condensing more molten conductor 3a.
其次,針對保護元件1之殼體6,進行說明。殼體6係藉由將下側外殼4與上側外殼5藉由接著劑19接合而形成。殼體6例如可使用各種工程塑膠、熱塑性塑膠、陶瓷等具有絕緣性之構件而形成。又,殼體6於絕緣基板2之正面2a上具有充分之內部空間,以供可熔導體3於熔融時膨脹為球 狀,且供熔融導體3a在正面電極11及第1、第2外部連接端子7、8上凝聚。 Next, we will describe the housing 6 of the protective element 1. Housing 6 is formed by joining the lower housing 4 and the upper housing 5 with an adhesive 19. Housing 6 can be made of insulating materials such as various engineering plastics, thermoplastics, and ceramics. Housing 6 also has sufficient internal space on the front surface 2a of the insulating substrate 2 to allow the fusible conductor 3 to expand into a spherical shape when melted and to condense onto the front electrode 11 and the first and second external connection terminals 7 and 8.
下側外殼4與上側外殼5之接合係利用接著劑19進行。接著劑19藉由朝構成殼體6之側面之下側外殼4之側壁上端面與上側外殼5之側壁下端面5a之間供給並固化,而將下側外殼4與上側外殼5接合。作為接著劑19,無特別限制,可舉出例如熱固性接著劑。又,作為接著劑19之形態,只要係在接合過程中顯示流動性者即可,雖然其相狀態無限制,但基於作業性之觀點,較佳為液狀。 The lower shell 4 and upper shell 5 are joined using adhesive 19. Adhesive 19 is supplied between the upper end surface of the side wall of the lower shell 4, which forms the side surface of the housing 6, and the lower end surface 5a of the side wall of the upper shell 5, where it solidifies, thereby joining the lower shell 4 and upper shell 5. The adhesive 19 is not particularly limited, and thermosetting adhesives are examples. Furthermore, the adhesive 19 can be in any form as long as it exhibits fluidity during the joining process. While its phase is not limited, a liquid state is preferred for ease of workability.
又,在應用本發明之保護元件中,下側外殼4及上側外殼5於任一者形成嵌合凹部25,於任另一者形成嵌合於嵌合凹部25之嵌合凸部26。以下,以於下側外殼4設置嵌合凸部26,於上側外殼5設置嵌合凹部25之情形為例進行說明。 Furthermore, in the protective element employing the present invention, a fitting recess 25 is formed on one of the lower housing 4 and the upper housing 5, and a fitting protrusion 26 that fits into the fitting recess 25 is formed on the other. The following description uses the case where the fitting protrusion 26 is provided on the lower housing 4 and the fitting recess 25 is provided on the upper housing 5 as an example.
圖5係顯示下側外殼4之圖,(A)係俯視圖,(B)係(A)之E-E’剖視圖。下側外殼4形成為大致方形狀,於各轉角部形成總計4個嵌合凸部26。雖然嵌合凸部26形成為圓柱狀,但嵌合凸部26之形狀只要為與後述之嵌合凹部25嵌合之凸形狀即可,可為例如圓錐狀、角柱狀、稜錐狀等。 Figure 5 shows the lower housing 4, with (A) being a top view and (B) being a cross-sectional view taken along line E-E' of (A). The lower housing 4 is formed into a generally square shape, with four mating projections 26 formed at each corner. While the mating projections 26 are cylindrical, any other shape is acceptable, as long as they mate with the mating recesses 25 described below. For example, the mating projections 26 may be conical, prismatic, or pyramidal.
又,下側外殼4於大致中央部設置將絕緣基板2之中央部保持為中空之凹面部23。下側外殼4沿凹面部23之側緣支持絕緣基板2之外側緣。藉 由設置凹面部23,而可減小下側外殼4與絕緣基板2之接觸面積,抑制發熱體10之熱由下側外殼4吸熱。因而,保護元件1可將發熱體10之熱高效率地傳遞至可熔導體3,可使其更快速地熔斷。尤其是,藉由將凹面部23設置於下側外殼4之大致中央部,而可將發熱體10之正下方設為中空,抑制發熱體10之熱向下側外殼4之散熱。 Furthermore, the lower housing 4 has a recessed portion 23 at its approximate center, which maintains the central portion of the insulating substrate 2 hollow. The lower housing 4 supports the outer edges of the insulating substrate 2 along the sides of the recessed portion 23. The recessed portion 23 reduces the contact area between the lower housing 4 and the insulating substrate 2, preventing heat from being absorbed by the lower housing 4 from the heating element 10. Consequently, the protective element 1 efficiently transfers heat from the heating element 10 to the fusible conductor 3, enabling faster melting. In particular, by providing the concave portion 23 approximately in the center of the lower housing 4, the area directly below the heating element 10 can be made hollow, thereby suppressing the heat dissipation of the heating element 10 to the lower housing 4.
圖6係顯示上側外殼5之圖,(A)係仰視圖,(b)係(A)之C-C’剖視圖。上側外殼5與下側外殼4同樣地形成為大致方形狀,於各轉角部設置供設置於下側外殼4之嵌合凸部26嵌合之總計4個嵌合凹部25。又,上側外殼5覆蓋形成於絕緣基板2之正面2a上之可熔導體3及第1、第2外部連接端子7、8,且具有可供熔斷之可熔導體3a於正面電極11及第1、第2外部連接端子7、8上凝聚之內部空間。 Figure 6 shows the upper housing 5, with (A) being a bottom view and (b) being a cross-sectional view taken along line C-C' of (A). Like the lower housing 4, the upper housing 5 is formed into a generally rectangular shape, with four mating recesses 25 provided at each corner for mating with the mating protrusions 26 provided on the lower housing 4. The upper housing 5 covers the fusible conductor 3 and the first and second external connection terminals 7 and 8 formed on the front surface 2a of the insulating substrate 2, and includes an internal space for the fusible conductor 3a to be condensed on the front electrode 11 and the first and second external connection terminals 7 and 8.
又,上側外殼5形成凹部狹槽27,該凹部狹槽27與嵌合凹部25連續且延伸至成為上側外殼5及下側外殼4之對接面之上側外殼5之側壁下端面5a,使接著劑19流動。如圖7所示,凹部狹槽27藉由在使上側外殼5及下側外殼4對接時,使填充於嵌合凹部25內之接著劑19之多餘部分流動至內部,而防止使接著劑19之多餘部分滯留於與嵌合凸部26嵌合之嵌合凹部25內。藉此,可防止由滯留於嵌合凹部25內之接著劑19之多餘部分,阻礙上側外殼5及下側外殼4之密接。此外,由於在嵌合凹部25內殘留與嵌合凸部26之接合所需之份額之接著劑19,故充分確保嵌合凹部25與嵌合凸部26之接著強度。又,藉由設置凹部狹槽27,而增加與接著劑19之接 著面積,可謀求接著強度提高。 Furthermore, the upper housing 5 is formed with a recessed narrow groove 27. This recessed narrow groove 27 is continuous with the mating recess 25 and extends to the lower end surface 5a of the side wall of the upper housing 5, which serves as the abutting surface between the upper housing 5 and the lower housing 4, to allow the adhesive 19 to flow. As shown in FIG7 , the recessed narrow groove 27 prevents the excess adhesive 19 from being retained in the mating recess 25, which is mated with the mating protrusion 26, by allowing the excess adhesive 19 filled in the mating recess 25 to flow inside when the upper housing 5 and the lower housing 4 are mated. This prevents excess adhesive 19 remaining in the mating recess 25 from obstructing the close contact between the upper and lower housings 5 and 4. Furthermore, since only enough adhesive 19 remains in the mating recess 25 to engage the mating protrusion 26, sufficient bonding strength is ensured between the mating recess 25 and the mating protrusion 26. Furthermore, the provision of the recessed slot 27 increases the bonding area with the adhesive 19, further enhancing bonding strength.
因而,保護元件1不會在成為上側外殼5自下側外殼4浮起之狀態下密接,可獲得所期望之接著強度。藉此,保護元件1可防止產生上側外殼5在可熔導體3之熔斷時脫開、或無法滿足特定之殼體之高度條件等不良情況。 Therefore, the protective element 1 prevents the upper housing 5 from floating from the lower housing 4, maintaining the desired bond strength. This prevents the protective element 1 from causing problems such as the upper housing 5 becoming detached when the fusible conductor 3 melts, or failing to meet the specified housing height requirements.
凹部狹槽27較佳為沿被供給接著劑19之上側外殼5之側壁下端面5a形成。又,凹部狹槽27之長度無特別限制。凹部狹槽27之寬度雖然無特別限制,但較佳為俯視下為嵌合凹部25之直徑以下。又,凹部狹槽27之深度雖然無特別限制,但較佳為與嵌合凹部25之深度相同,或較其為淺。 The recessed narrow groove 27 is preferably formed along the lower end surface 5a of the side wall of the upper housing 5, where the adhesive 19 is supplied. The length of the recessed narrow groove 27 is not particularly limited. The width of the recessed narrow groove 27 is not particularly limited, but is preferably less than the diameter of the mating recess 25 when viewed from above. The depth of the recessed narrow groove 27 is not particularly limited, but is preferably the same as or shallower than the depth of the mating recess 25.
又,如圖6(B)所示,凹部狹槽27較佳為形成為隨著與嵌合凹部25分開,而自嵌合凹部25之底面側直到嵌合凹部25之上正面側逐漸變淺之錐形狀。藉此,將流入凹部狹槽27之接著劑19之多餘部分導引至成為上側外殼5及下側外殼4之對接面之上側外殼5之側壁下端面5a,而可供上側外殼5及下側外殼4之接合用。又,藉由相對地朝向殼體6之轉角部增加接著劑之供給量,而可提高接著強度。 Furthermore, as shown in Figure 6(B), the recessed narrow groove 27 is preferably formed into a tapered shape that gradually becomes shallower from the bottom surface of the engaging recess 25 to the upper front surface of the engaging recess 25 as it separates from the engaging recess 25. This allows the excess adhesive 19 that flows into the recessed narrow groove 27 to be directed to the lower end surface 5a of the side wall of the upper shell 5, which serves as the abutment between the upper shell 5 and the lower shell 4, thereby providing for the joining of the upper shell 5 and the lower shell 4. Furthermore, by increasing the amount of adhesive supplied toward the corners of the housing 6, the bond strength can be enhanced.
又,凹部狹槽27如圖8所示般形成為隨著與嵌合凹部25分開,而逐漸擴寬。藉此,可容易使接著劑19之多餘部分自嵌合凹部25內進一步朝狹槽前端流出。 Furthermore, as shown in FIG8 , the recessed narrow groove 27 is formed so as to gradually widen as it separates from the fitting recess 25. This facilitates the flow of excess adhesive 19 from the fitting recess 25 toward the front end of the narrow groove.
又,可如圖9所示般,自1個嵌合凹部25延伸出複數個凹部狹槽27。藉此,可使更多之接著劑19之多餘部分自嵌合凹部25內流出。此外,複數個凹部狹槽27之形狀(寬度、長度、深度、傾斜等)可相同,亦可藉由使其等不同,而使接著劑19之流動量相應於方向而不同。 Alternatively, as shown in Figure 9, multiple recessed slots 27 may extend from a single engagement recess 25. This allows a greater amount of excess adhesive 19 to flow out of the engagement recess 25. Furthermore, the shapes (width, length, depth, inclination, etc.) of the multiple recessed slots 27 may be identical or different, allowing the amount of adhesive 19 flowing to vary depending on the direction.
又,如圖9所示,凹部狹槽27較佳為自形成於上側外殼5之各轉角部之1個嵌合凹部25沿鄰接之2個側壁分別形成。藉此,可使更多之接著劑19之多餘部分自嵌合凹部25內流出。又,藉此,將接著劑19之多餘部分導引至成為與下側外殼4之對接面之上側外殼5之側壁下端面5a,可供上側外殼5及下側外殼4之接合用。 Furthermore, as shown in Figure 9, recessed narrow grooves 27 are preferably formed along two adjacent side walls from one of the interlocking recesses 25 formed at each corner of the upper housing 5. This allows more of the excess adhesive 19 to flow out of the interlocking recesses 25. Furthermore, this excess adhesive 19 is directed to the lower end surface 5a of the side wall of the upper housing 5, which serves as the interface with the lower housing 4, allowing the upper and lower housings 5 and 4 to be joined.
此外,凹部狹槽27較佳為形成為全嵌合凹部25,但可未必形成於全嵌合凹部25。 Furthermore, the recessed groove 27 is preferably formed in the fully fitting recessed portion 25, but it does not necessarily need to be formed in the fully fitting recessed portion 25.
又,如圖10所示,自相鄰之嵌合凹部25延伸之凹部狹槽27彼此可形成為連續。藉此,可將填充於嵌合凹部25內之接著劑19之多餘部分朝凹部狹槽27導出,且使對上側外殼5及下側外殼4之對接面供給之接著劑19之多餘部分吸收至凹部狹槽27內,防止接著劑19之多餘部分對密接之阻礙。又,藉由設置凹部狹槽27,而增加與接著劑19之接著面積,可謀求接著強度提高。 Furthermore, as shown in Figure 10, the recessed narrow grooves 27 extending from adjacent mating recesses 25 can be formed continuously. This allows excess adhesive 19 filling the mating recesses 25 to be directed toward the recessed narrow grooves 27. Excess adhesive 19 supplied to the mating surfaces of the upper and lower housings 5 and 4 is absorbed within the recessed narrow grooves 27, preventing excess adhesive 19 from obstructing the tight fit. Furthermore, the provision of the recessed narrow grooves 27 increases the contact area with the adhesive 19, thereby enhancing bond strength.
此外,上側外殼5於與下側外殼4對接之側壁之下端面5a形成凹部,該凹部用於將由下側外殼4支持之第1、第2外部連接端子7、8及第3外部 連接端子17跨於殼體6之內外而配設。該凹部形成於與第1、第2外部連接端子7、8及第3外部連接端子17之配設位置對應之位置,且凹部具有與第1、第2外部連接端子7、8及第3外部連接端子17之形狀相應之形狀。因而,殼體6使下側外殼4與上側外殼5無間隙地對接且接合,且可使第1、第2外部連接端子7、8及第3外部連接端子17向殼體外導出。 Furthermore, the upper housing 5 has a recessed portion formed on the lower end surface 5a of the side wall that abuts the lower housing 4. This recess allows the first and second external connection terminals 7, 8, and the third external connection terminal 17, supported by the lower housing 4, to be arranged across the interior and exterior of the housing 6. The recessed portion is formed at a position corresponding to the placement of the first, second, and third external connection terminals 7, 8, and 17, and has a shape that corresponds to the shapes of the first, second, and third external connection terminals 7, 8, and 17. Thus, the housing 6 allows the lower housing 4 and the upper housing 5 to abut and join without a gap, while also allowing the first, second, and third external connection terminals 7, 8, and 17 to be guided outside the housing.
於形成殼體6時,如圖11所示,對下側外殼4之包含嵌合凸部26之側緣部供給接著劑19,且與上側外殼5對接。藉此,將嵌合凸部26與嵌合凹部25經由接著劑19嵌合,將下側外殼4與上側外殼5接合。 When forming the housing 6, as shown in Figure 11, adhesive 19 is applied to the side edge of the lower housing 4, including the mating protrusion 26, and then brought into contact with the upper housing 5. This engages the mating protrusion 26 with the mating recess 25 via the adhesive 19, joining the lower housing 4 to the upper housing 5.
其次,針對應用本發明之保護元件之變化例進行說明。應用本發明之保護元件可取代與嵌合凹部25連續之凹部狹槽27,或者跟與嵌合凹部25連續之凹部狹槽27一起,將凸部狹槽28形成於嵌合凸部26。凸部狹槽28設置於嵌合凸部26之周面,藉由使接著劑19之多餘部分流動,而防止接著劑19之多餘部分對下側外殼4與上側外殼5之密接之阻礙。 Next, a modified example of the protective element incorporating the present invention will be described. The protective element incorporating the present invention can replace the recessed slot 27 continuous with the mating recessed portion 25, or alternatively, form a raised slot 28 in the mating protrusion 26 in addition to the recessed slot 27 continuous with the mating recessed portion 25. The raised slot 28 is provided on the circumference of the mating protrusion 26 to allow excess adhesive 19 to flow, thereby preventing it from obstructing the close contact between the lower housing 4 and the upper housing 5.
凸部狹槽28形成於嵌合凸部26之外周面,例如,可如圖12、圖13所示般,凸部狹槽28沿嵌合凸部26之突出方向形成為直線狀。圖12係顯示在下側外殼4設置有凸部狹槽28之殼體6之圖,(A)係上側外殼5之仰視圖,(B)係使上側外殼5與下側外殼4對向配置之剖視圖,(C)係下側外殼4之俯視圖。圖13係顯示形成有凸部狹槽28之嵌合凸部26之圖,(A)係俯視圖,(B)係(A)之J-J’剖視圖。 The protrusion slot 28 is formed on the outer circumference of the mating protrusion 26. For example, as shown in Figures 12 and 13, the protrusion slot 28 can be formed as a straight line along the protruding direction of the mating protrusion 26. Figure 12 shows the housing 6 with the protrusion slot 28 provided in the lower housing 4. (A) is a bottom view of the upper housing 5, (B) is a cross-sectional view with the upper housing 5 and the lower housing 4 facing each other, and (C) is a top view of the lower housing 4. Figure 13 shows the mating protrusion 26 with the protrusion slot 28 formed. (A) is a top view, and (B) is a J-J' cross-sectional view taken along (A).
此外,凸部狹槽28之形態並不限定於直線狀,可為波形狀、矩形波狀、鋸齒狀等。又,凸部狹槽28除形成於嵌合凸部26之突出方向以外,還可於周繞外周面之方向形成。又,凸部狹槽28可於嵌合凸部26之外周面形成為螺旋狀。又,凸部狹槽28可連續形成,亦可斷續形成。 Furthermore, the shape of the protrusion slit 28 is not limited to a straight line; it can also be a wavy, rectangular, or sawtooth shape. Furthermore, the protrusion slit 28 can be formed not only in the protruding direction of the mating protrusion 26 but also in a direction surrounding the outer circumference. Furthermore, the protrusion slit 28 can be formed in a spiral shape on the outer circumference of the mating protrusion 26. Furthermore, the protrusion slit 28 can be formed continuously or intermittently.
形成凸部狹槽28之朝向雖然無特別限制,但較佳為朝向被供給接著劑19之下側外殼4與上側外殼5之對接面而形成。例如,在圖12所示之構成中,凸部狹槽28較佳為朝沿下側外殼4之側壁之朝向形成。藉此,可使接著劑19之多餘部分流動至被供給接著劑19之下側外殼4與上側外殼5之對接面,可供接著用。又,於設置與上述之嵌合凹部25連續之凹部狹槽27之情形下,較佳為與凹部狹槽27朝相同之朝向形成。 While the orientation of the protruding narrow groove 28 is not particularly limited, it is preferably formed toward the abutting surface between the lower housing 4 and the upper housing 5, where the adhesive 19 is supplied. For example, in the configuration shown in Figure 12 , the protruding narrow groove 28 is preferably formed along the sidewall of the lower housing 4 . This allows excess adhesive 19 to flow to the abutting surface between the lower housing 4 and the upper housing 5, where the adhesive 19 is supplied, for bonding. Furthermore, when providing the recessed narrow groove 27 continuous with the aforementioned engaging recess 25 , it is preferably formed in the same orientation as the recessed narrow groove 27 .
又,凸部狹槽28較佳為自嵌合凸部28之基部形成。嵌合凸部26之基部由於成為下側外殼4與上側外殼5之對接面,故藉由積極地吸收接著劑19之多餘部分,而可促進密接。又,凸部狹槽28較佳為跨於嵌合凸部28之頂部而形成。藉此,可容易將滯留於嵌合凹部25內之接著劑19之多餘部分導入凸部狹槽28,且使接著劑19之吸收量增加。 Furthermore, the convex narrow groove 28 is preferably formed from the base of the mating convex portion 26. Since the base of the mating convex portion 26 serves as the abutment surface between the lower housing 4 and the upper housing 5, it actively absorbs excess adhesive 19, promoting close contact. Furthermore, the convex narrow groove 28 is preferably formed across the top of the mating convex portion 28. This facilitates the introduction of excess adhesive 19 remaining in the mating recess 25 into the convex narrow groove 28, increasing the amount of adhesive 19 absorbed.
又,凸部狹槽28可於一個嵌合凸部26形成複數個。藉此,可使更多之接著劑19之多餘部分吸收至凸部狹槽28內。又,凸部狹槽28較佳為如圖12所示般,朝沿形成於下側外殼4之轉角部之嵌合凸部26之鄰接2個側壁之朝向形成。藉此,可使接著劑19之多餘部分流動至被供給接著劑19 之下側外殼4與上側外殼5之對接面,可供接著用。又,如設置有與上述之嵌合凹部25連續之凹部狹槽27,較佳形成為與凹部狹槽27相同之朝向。 Alternatively, multiple protrusion narrow grooves 28 may be formed on a single mating protrusion 26. This allows a greater amount of excess adhesive 19 to be absorbed within the protrusion narrow grooves 28. Furthermore, as shown in Figure 12, the protrusion narrow grooves 28 are preferably formed along the two adjacent side walls of the mating protrusion 26 formed at the corner of the lower housing 4. This allows excess adhesive 19 to flow to the mating surface between the lower housing 4 and the upper housing 5, where the adhesive 19 is supplied, and to be used for bonding. Furthermore, if a concave narrow groove 27 is provided that continues with the mating recess 25 described above, it is preferably formed in the same orientation as the concave narrow groove 27.
又,如圖14、圖15所示,凸部狹槽28可在俯視下形成為其寬度自嵌合凸部26之周面至中心方向逐漸變小之錐形狀。藉此,可使毛細管現象發生作用,使接著劑19流入凸部狹槽28內,且可增加流入量。 Furthermore, as shown in Figures 14 and 15 , the protrusion groove 28 can be formed into a tapered shape, with its width gradually decreasing from the periphery of the mating protrusion 26 toward the center, when viewed from above. This allows the capillary phenomenon to take effect, allowing the adhesive 19 to flow into the protrusion groove 28 and increasing the amount of inflow.
又,凸部狹槽28可在剖視下形成為自嵌合凸部26之頂部至基部逐漸擴寬之錐形狀。藉此,可使毛細管現象發生作用,使滯留於下側外殼4與上側外殼5之對接面的接著劑19之多餘部分流入凸部狹槽28內,且可增加流入量。 Furthermore, the protrusion groove 28 can be formed into a tapered shape, gradually widening from the top to the base of the mating protrusion 26, as seen in cross-section. This allows the capillary effect to occur, allowing excess adhesive 19 remaining on the mating surface between the lower housing 4 and the upper housing 5 to flow into the protrusion groove 28, thereby increasing the amount of adhesive flowing in.
此外,在圖12、圖14所示之保護元件1中,雖然於形成於下側外殼4之嵌合凸部26設置凸部狹槽28,使其與形成於上側外殼5之嵌合凹部25嵌合,但亦可於上側外殼5形成與嵌合凹部25連續之凹部狹槽27。藉由形成與嵌合凸部26連續之凸部狹槽28,且形成與嵌合凹部25連續之凹部狹槽27,而可吸收更多的接著劑19之多餘部分,防止接著劑19之多餘部分阻礙到下側外殼4與上側外殼5之密接。 Furthermore, in the protective element 1 shown in Figures 12 and 14 , while a convex narrow groove 28 is provided in the mating protrusion 26 formed on the lower housing 4 to engage with the mating recess 25 formed on the upper housing 5 , a concave narrow groove 27 continuous with the mating recess 25 may also be formed in the upper housing 5 . By forming the convex narrow groove 28 continuous with the mating protrusion 26 and the concave narrow groove 27 continuous with the mating recess 25 , more excess adhesive 19 can be absorbed, preventing it from obstructing the close contact between the lower housing 4 and the upper housing 5 .
在上述之實施之形態中,針對於上側外殼5形成有嵌合凹部25及凹部狹槽27之構成、及於下側外殼4形成有嵌合凸部26及凸部狹槽28之構成進行了說明,但應用本發明之保護元件可如圖16、圖17所示般,於上側外 殼51形成上述之嵌合凸部26,於下側外殼52形成上述之嵌合凹部25及凹部狹槽27。此外,在以下之說明中,針對與上述之保護元件1相同之構成賦予同一符號,且省略其細節。 In the above embodiment, the upper housing 5 is described as having a fitting recess 25 and recessed slot 27, and the lower housing 4 as having a fitting protrusion 26 and protrusion slot 28. However, a protective element employing the present invention can also have the fitting protrusion 26 formed on the upper housing 51 and the fitting recess 25 and recessed slot 27 formed on the lower housing 52, as shown in Figures 16 and 17. In the following description, components identical to those of the protective element 1 described above are designated by the same reference numerals, and details are omitted.
於圖18中形成將上側外殼51與下側外殼52接合而形成保護元件50之步驟。圖16係顯示設置有嵌合凸部26之上側外殼51之圖,(A)係仰視圖,(B)係(A)之L-L’剖視圖。圖17係顯示設置有嵌合凹部25之下側外殼52之圖,(A)係俯視圖,(B)係(A)之M-M’剖視圖。保護元件50如圖17所示般,於下側外殼52形成上述之嵌合凹部25及凹部狹槽27。 Figure 18 shows the step of joining the upper housing 51 and the lower housing 52 to form the protective element 50. Figure 16 shows the upper housing 51 provided with the mating protrusion 26, (A) a bottom view, and (B) a cross-sectional view taken along the line L-L' of (A). Figure 17 shows the lower housing 52 provided with the mating recess 25, (A) a top view, and (B) a cross-sectional view taken along the line M-M' of (A). As shown in Figure 17, the protective element 50 has the aforementioned mating recess 25 and recessed slot 27 formed in the lower housing 52.
下側外殼52與上側外殼51之接合步驟與上述之保護元件1同樣。亦即,如圖19(A)(B)所示,沿下側外殼52之與上側外殼51之對接面供給接著劑19。此時,接著劑19被供給至形成於下側外殼52之各轉角部之嵌合凹部25及凹部狹槽27上。而且,如圖18所示,若將形成於上側外殼51之嵌合凸部26插入嵌合凹部25內,將下側外殼52與上側外殼51對接,則填充於嵌合凹部25內之接著劑19之多餘部分流出至凹部狹槽27,防止滯留於嵌合凹部25內。藉此,可防止由滯留於嵌合凹部25內之接著劑19之多餘部分,阻礙上側外殼51及下側外殼52之密接。又,藉由設置凹部狹槽27,而增加與接著劑19之接著面積,可謀求接著強度提高。 The steps for joining the lower housing 52 and the upper housing 51 are the same as those for the aforementioned protective element 1. Specifically, as shown in Figures 19(A) and 19(B), adhesive 19 is applied along the mating surfaces of the lower housing 52 and the upper housing 51. At this point, adhesive 19 is applied to the fitting recesses 25 and recess grooves 27 formed at each corner of the lower housing 52. Furthermore, as shown in Figure 18, when the mating protrusion 26 formed on the upper housing 51 is inserted into the mating recess 25 and the lower housing 52 is brought into contact with the upper housing 51, the excess adhesive 19 filling the mating recess 25 flows out into the recess groove 27, preventing it from being retained in the mating recess 25. This prevents the excess adhesive 19 retained in the mating recess 25 from impeding the close contact between the upper and lower housings 51 and 52. Furthermore, the provision of the recess groove 27 increases the contact area with the adhesive 19, thereby enhancing the bond strength.
又,在保護元件50中亦然,可取代與形成於下側外殼52之嵌合凹部25連續之凹部狹槽27,或者跟與嵌合凹部25連續之凹部狹槽27一起,在 形成於上側外殼51之嵌合凸部26,形成上述之凸部狹槽28。由於針對該等凹部狹槽27及凸部狹槽28之構成,已於保護元件1中詳細敘述,故省略細節。此外,在保護元件50中亦然,毋庸置疑,可與保護元件1同樣地,可將凹部狹槽27及凸部狹槽28之形態進行各種變更。 Similarly, in the protective element 50, the aforementioned convex slit 28 can be formed on the convex fitting portion 26 formed on the upper housing 51, instead of or in addition to the concave slit 27 continuous with the fitting concave portion 25 formed on the lower housing 52. Since the configuration of these concave slit 27 and convex slit 28 has already been described in detail in the protective element 1, the details are omitted here. Furthermore, in the protective element 50, as in the protective element 1, the configuration of the concave slit 27 and convex slit 28 can be modified in various ways.
其次,針對可熔導體3進行說明。可熔導體3跨於第1及第2外部連接端子7、8間而安裝,藉由因發熱體10之通電引起之發熱、或超過額定之電流流通,而自發熱(焦耳熱),藉此熔斷,遮斷第1外部連接端子7與第2外部連接端子8之間之電流路徑。 Next, let's explain the fusible conductor 3. It's installed between the first and second external connection terminals 7 and 8. It melts due to heat generated by the heating element 10 or self-heating (Joule heat) caused by the flow of current exceeding the rated value, thus shutting off the current path between the first and second external connection terminals 7 and 8.
可熔導體3只要為藉由因發熱體10之通電引起之發熱、或過電流狀態而熔融之導電性材料即可,例如除SnAgCu系無Pb焊料以外,還可使用BiPbSn合金、BiPb合金、BiSn合金、SnPb合金、PbIn合金、ZnAl合金、InSn合金、PbAgSn合金等。 The fusible conductor 3 can be any conductive material that melts due to the heat generated by the heating element 10 or due to an overcurrent condition. For example, in addition to SnAgCu-based Pb-free solder, BiPbSn alloy, BiPb alloy, BiSn alloy, SnPb alloy, PbIn alloy, ZnAl alloy, InSn alloy, PbAgSn alloy, etc. can also be used.
又,可熔導體3可為含有高熔點金屬、及低熔點金屬之構造體。例如,如圖20所示,可熔導體3係包含內層與外層之積層構造體,具有低熔點金屬層31來作為內層,具有高熔點金屬層32來作為積層於低熔點金屬層31之外層。可熔導體3經由銲膏等接合材料20連接於第1、第2外部連接端子7、8及正面電極11上。 Alternatively, the fusible conductor 3 may be a structure containing both a high-melting-point metal and a low-melting-point metal. For example, as shown in Figure 20 , the fusible conductor 3 comprises a laminated structure including an inner layer and an outer layer, with a low-melting-point metal layer 31 serving as the inner layer and a high-melting-point metal layer 32 serving as the outer layer laminated on the low-melting-point metal layer 31. The fusible conductor 3 is connected to the first and second external connection terminals 7 and 8 and the front electrode 11 via a bonding material 20 such as solder paste.
低熔點金屬層31較佳為焊料或以Sn為主成分之金屬,係一般被稱為 「無Pb焊料」之材料。低熔點金屬層31之熔點未必必須高於回流爐之溫度,可在200℃左右熔融。高熔點金屬層32係積層於低熔點金屬層31之正面之金屬層,例如為Ag或Cu或以其等中任一者為主成分之金屬,具有即便於藉由回流進行第1、第2外部連接端子7、8及正面電極11與可熔導體3之連接之情形下,亦不熔融之較高之熔點。 The low-melting-point metal layer 31 is preferably solder or a metal primarily composed of Sn, a material commonly referred to as "Pb-free solder." The melting point of the low-melting-point metal layer 31 does not necessarily need to be higher than the reflow furnace temperature and can melt at around 200°C. The high-melting-point metal layer 32 is a metal layer laminated on the front surface of the low-melting-point metal layer 31. For example, it can be made of Ag, Cu, or a metal primarily composed of either of these. It has a relatively high melting point and does not melt even during reflow to connect the first and second external connection terminals 7 and 8 and the front electrode 11 to the fusible conductor 3.
此可熔導體3可藉由使用鍍覆技術將高熔點金屬層成膜於低熔點金屬箔而形成,或亦可使用其他周知之積層技術、膜形成技術而形成。此時,可熔導體3可採用低熔點金屬層31之全面由高熔點金屬層32被覆之構造,亦可採用除相對向之一對側面以外予以被覆之構造。此外,可熔導體3可將高熔點金屬層32設為內層、將低熔點金屬層31設為外層而構成,又可由設為由低熔點金屬層與高熔點金屬層交替地積層而成之3層以上之多層構造之於外層之一部分設置開口部而使內層之一部分露出等各種構成形成。 This fusible conductor 3 can be formed by depositing a high-melting-point metal layer on a low-melting-point metal foil using a plating technique, or it can be formed using other well-known lamination or film-forming techniques. In this case, the fusible conductor 3 can have a structure in which the low-melting-point metal layer 31 is entirely covered by the high-melting-point metal layer 32, or it can have a structure in which all but one pair of opposing side surfaces are covered. Furthermore, the fusible conductor 3 can have a high-melting-point metal layer 32 as the inner layer and the low-melting-point metal layer 31 as the outer layer, or it can have a multi-layer structure consisting of three or more layers alternately laminated with low-melting-point and high-melting-point metal layers, with an opening provided in one portion of the outer layer to expose a portion of the inner layer.
可熔導體3藉由在成為內層之低熔點金屬層31,積層高熔點金屬層32來作為外層,而即便於回流溫度超過低熔點金屬層31之熔融溫度之情形下,作為可熔導體3,亦可維持形狀,不會導致熔斷。因而,保護元件1可藉由回流高效率地進行第1、第2外部連接端子7、8及正面電極11與可熔導體3之連接。又,保護元件1藉由回流,亦可防止因伴隨著可熔導體3之變形而局部地電阻值變高或變低等,而在特定之溫度未熔斷、或在未達特定之溫度下熔斷等熔斷特性之變動。 By laminating a high-melting-point metal layer 32 as the outer layer on a low-melting-point metal layer 31, the fusible conductor 3 maintains its shape and prevents melting even when the reflow temperature exceeds the melting temperature of the low-melting-point metal layer 31. Consequently, the protective element 1 can efficiently connect the first and second external connection terminals 7 and 8 and the front electrode 11 to the fusible conductor 3 during reflow. Furthermore, reflow prevents variations in the protective element 1's melting characteristics, such as failure to melt at a specified temperature or melting below the specified temperature, due to localized increases or decreases in resistance associated with deformation of the fusible conductor 3.
又,可熔導體3在流通特定之額定電流之期間,亦不會因自發熱而熔斷。而且,當流通高於額定之值之電流時,因自發熱而熔融,遮斷第1、第2外部連接端子7、8間之電流路徑。又,可熔導體3藉由發熱體10被通電並發熱而熔融,遮斷第1、第2外部連接端子7、8間之電流路徑。 Furthermore, the fusible conductor 3 will not melt due to self-heating even when a specific rated current is flowing. However, when a current exceeding the rated value is flowing, the fusible conductor 3 melts due to self-heating, blocking the current path between the first and second external connection terminals 7 and 8. Furthermore, the fusible conductor 3 is energized by the heating element 10, generating heat and melting, thereby blocking the current path between the first and second external connection terminals 7 and 8.
此時,可熔導體3藉由熔融之低熔點金屬層31將高熔點金屬層32浸蝕(焊料侵蝕),而高熔點金屬層32以較熔融溫度為低之溫度熔解。因而,可熔導體3可利用由低熔點金屬層31對高熔點金屬層32之浸蝕作用,以短時間熔斷。又,可熔導體3之熔融導體3a由於藉由正面電極11及第1、第2外部連接端子7、8之物理性拉入作用被分斷,故可快速且確實地遮斷第1、第2外部連接端子7、8間之電流路徑(圖4)。 At this point, the fusible conductor 3 erodes the high-melting-point metal layer 32 (solder etching) through the molten low-melting-point metal layer 31, causing the high-melting-point metal layer 32 to melt at a temperature lower than its melting point. Consequently, the fusible conductor 3 is quickly melted by the erosion of the high-melting-point metal layer 32 by the low-melting-point metal layer 31. Furthermore, the molten conductor 3a of the fusible conductor 3 is physically pulled apart by the front electrode 11 and the first and second external connection terminals 7 and 8, quickly and reliably interrupting the current path between the first and second external connection terminals 7 and 8 (Figure 4).
又,可熔導體3較佳為使低熔點金屬層31之體積大於高熔點金屬層32之體積而形成。可熔導體3藉由因過電流所致之自發熱或發熱體10之發熱而被加熱,藉由低熔點金屬熔融而將高熔點金屬熔蝕,藉此可快速地熔融、熔斷。因而,可熔導體3藉由使低熔點金屬層31之體積大於高熔點金屬層32之體積而形成,而促進該熔蝕作用,可快速地將第1、第2外部連接端子7、8間予以遮斷。 Furthermore, the fusible conductor 3 is preferably formed so that the volume of the low-melting-point metal layer 31 is larger than the volume of the high-melting-point metal layer 32. The fusible conductor 3 is heated by self-heating due to overcurrent or by heating of the heating element 10. The low-melting-point metal melts, corroding the high-melting-point metal, thereby rapidly melting and fusing. Therefore, by forming the fusible conductor 3 with the low-melting-point metal layer 31 larger than the high-melting-point metal layer 32, this erosion is accelerated, allowing for rapid isolation between the first and second external connection terminals 7 and 8.
又,可熔導體3由於在成為內層之低熔點金屬層31積層高熔點金屬層32而構成,故可使熔斷溫度較先前之包含高熔點金屬之晶片保險絲等大幅度降低。因而,可熔導體3與同一尺寸之晶片保險絲等比較,可增大剖面積,且可大幅度提高電流額定。又,可謀求較具有相同之電流額定之先前 之晶片保險絲更小型化、薄型化,而快速熔斷性優異。 Furthermore, because the fusible conductor 3 is constructed by laminating a high-melting-point metal layer 32 onto an inner low-melting-point metal layer 31, its melting temperature is significantly lower than that of conventional chip fuses containing high-melting-point metals. Consequently, the fusible conductor 3 can have a larger cross-sectional area and significantly higher current rating than conventional chip fuses of the same size. Furthermore, this allows for a more compact and thinner design than conventional chip fuses with the same current rating, while maintaining superior quick-blow characteristics.
又,可熔導體3可提高對於對組裝有保護元件1之電氣系統瞬間施加異常高之電壓之浪湧之耐性(耐脈衝性)。亦即,可熔導體3甚至在例如100A之電流流通數msec之情形下,亦不會熔斷。關於此點,基於在極短時間流通之大電流在導體之表層流通(表皮效應),而可熔導體3設置電阻值較低之鍍Ag等高熔點金屬層32來作為設置外層,故容易使由浪湧施加之電流流通,可防止因自發熱所致之熔斷。因而,可熔導體3與先前之包含焊料合金之保險絲比較,可大幅度提高對於浪湧之耐性。 Furthermore, the fusible conductor 3 improves its resistance to surges (pulse resistance) caused by the momentary application of abnormally high voltages to the electrical system in which the protective element 1 is installed. That is, the fusible conductor 3 will not melt even when a current of, for example, 100A flows for a few milliseconds. This is due to the skin effect, in which large currents flowing for extremely short periods of time flow through the surface of the conductor. The fusible conductor 3 is coated with a high-melting-point metal layer 32, such as Ag, with a relatively low resistance, as an outer layer. This facilitates the flow of current applied by surges, preventing melting due to self-heating. Consequently, the fusible conductor 3 significantly improves its resistance to surges compared to conventional fuses containing solder alloys.
此外,可熔導體3可為了抗氧化、及熔斷時之潤濕性提高等,而塗佈助熔劑(未圖示)。 In addition, the fusible conductor 3 may be coated with a flux (not shown) to prevent oxidation and improve wettability during melting.
此保護元件1如圖21所示般,例如組裝入鋰離子二次電池之電池組33內之電路而使用。電池組33例如具有電池堆35,該電池堆35包含總計4個鋰離子二次電池之電池單元34a~34d。 As shown in FIG21 , this protection element 1 is used by being incorporated into a circuit within a battery pack 33 of lithium-ion secondary batteries. The battery pack 33 includes, for example, a battery stack 35 containing a total of four lithium-ion secondary battery cells 34a to 34d.
電池組33具備:電池堆35;充放電控制電路36,其控制電池堆35之充放電;應用本發明之保護元件1,其在電池堆35之異常時遮斷充放電路徑;檢測電路37,其檢測各電池單元34a~34d之電壓;及電流控制元件38,其成為相應於檢測電路37之檢測結果而控制保護元件1之動作之開關元件。 The battery pack 33 includes: a battery stack 35; a charge/discharge control circuit 36 that controls the charging and discharging of the battery stack 35; a protective element 1 according to the present invention that interrupts the charge/discharge circuit when an abnormality occurs in the battery stack 35; a detection circuit 37 that detects the voltage of each battery cell 34a-34d; and a current control element 38 that functions as a switch element to control the operation of the protective element 1 in response to the detection result of the detection circuit 37.
電池堆35係將用於保護避免過充電及過放電狀態而進行控制所需的電池單元34a~34d串聯連接而成者,經由電池組33之正極端子33a、負極端子33b可拆裝地連接於充電裝置29,被施加來自充電裝置29之充電電壓。藉由將由充電裝置29充電後之電池組33之正極端子33a、負極端子33b連接於利用電池而動作之電子機器,可使該電子機器動作。 The battery stack 35 is composed of battery cells 34a-34d connected in series to protect against overcharge and over-discharge conditions. The battery pack 33 is removably connected to the charging device 29 via its positive and negative terminals 33a and 33b, applying a charging voltage from the charging device 29. By connecting the positive and negative terminals 33a and 33b of the battery pack 33, after being charged by the charging device 29, to an electronic device that operates using the battery, the device can be operated.
充放電控制電路36具備:2個電流控制元件39a、39b,其等串聯連接於電池堆35與充電裝置29之間之電流路徑;及控制部40,其控制該等電流控制元件39a、39b之動作。電流控制元件39a、39b由例如場效電晶體(以下稱為FET)構成,其藉由控制部40控制閘極電壓,而控制對電池堆35之電流路徑之充電方向及/或放電方向之導通及遮斷。控制部40自充電裝置29接收電力供給而動作,其相應於檢測電路37之檢測結果,當電池堆35過放電或過充電時,以遮斷電流路徑之方式,控制電流控制元件39a、39b之動作。 The charge-discharge control circuit 36 includes two current control elements 39a and 39b connected in series in the current path between the battery stack 35 and the charging device 29, and a control unit 40 that controls the operation of these current control elements 39a and 39b. The current control elements 39a and 39b are composed of, for example, field-effect transistors (FETs). The control unit 40 controls the gate voltage to enable and disable the current path to the battery stack 35 in the charging and/or discharging directions. The control unit 40 operates by receiving power from the charging device 29. In response to the detection results of the detection circuit 37, the control unit 40 controls the operation of the current control elements 39a and 39b by blocking the current path when the battery stack 35 is over-discharged or over-charged.
保護元件1例如連接於電池堆35與充放電控制電路36之間之充放電電流路徑上,其動作由電流控制元件38予以控制。 The protection element 1 is connected to the charge and discharge current path between the battery stack 35 and the charge and discharge control circuit 36, for example, and its operation is controlled by the current control element 38.
檢測電路37與各電池單元34a~34d連接,檢測各電池單元34a~34d之電壓值,且將各電壓值供給至充放電控制電路36之控制部40。又,當電池單元34a~34d之任一者成為過充電電壓或過放電電壓時,檢測電路37輸出控制電流控制元件38之控制信號。 Detection circuit 37 is connected to each battery cell 34a-34d, detects the voltage value of each battery cell 34a-34d, and supplies each voltage value to control unit 40 of charge and discharge control circuit 36. Furthermore, when any battery cell 34a-34d reaches an overcharge voltage or an overdischarge voltage, detection circuit 37 outputs a control signal to control current control element 38.
電流控制元件38係由例如FET構成,根據自檢測電路37輸出之檢測信號,當電池單元34a~34d之電壓值成為超過特定之過放電或過充電狀態之電壓時,使保護元件1動作,不憑藉電流控制元件39a、39b之開關動作而以遮斷電池堆35之充放電電流路徑之方式進行控制。 The current control element 38 is composed of, for example, an FET. Based on the detection signal output from the detection circuit 37, when the voltage of the battery cells 34a-34d exceeds a specific over-discharge or over-charge voltage, the protection element 1 is activated, controlling the battery stack 35 by blocking the charge and discharge current path without relying on the switching operation of the current control elements 39a and 39b.
包含如以上之構成之電池組33所使用之應用本發明之保護元件1具有如圖22所示之電路構成。亦即,保護元件1將第1外部連接端子7與電池堆35側連接,將第2外部連接端子8與正極端子33a側連接,藉此,將可熔導體3串聯連接於電池堆35之充放電路徑上。又,保護元件1將發熱體10經由發熱體饋電電極16及第3外部連接端子17與電流控制元件38連接,且將發熱體10與電池堆35之開放端連接。藉此,發熱體10將一端經由正面電極11與可熔導體3及電池堆35之一者之開放端連接,將另一端經由第3外部連接端子17與電流控制元件38及電池堆35之另一者之開放端連接。藉此,形成向由電流控制元件38控制通電之發熱體10之饋電路徑。 The protective element 1 according to the present invention, used with the battery pack 33 having the above-described configuration, has the circuit configuration shown in FIG22 . Specifically, the protective element 1 connects the first external connection terminal 7 to the battery stack 35 side, and the second external connection terminal 8 to the positive terminal 33a side, thereby connecting the fusible conductor 3 in series with the charge and discharge path of the battery stack 35. Furthermore, the protective element 1 connects the heater 10 to the current control element 38 via the heater feed electrode 16 and the third external connection terminal 17, and also connects the heater 10 to the open end of the battery stack 35. Thus, one end of the heating element 10 is connected to the open end of either the fusible conductor 3 or the battery stack 35 via the front electrode 11, and the other end is connected to the current control element 38 and the other open end of the battery stack 35 via the third external connection terminal 17. This forms a feed path to the heating element 10, whose current flow is controlled by the current control element 38.
若檢測電路37檢測到電池單元34a~34d之任一者之異常電壓,則向電流控制元件38輸出遮斷信號。如是,電流控制元件38以對發熱體10通電之方式,控制電流。保護元件1自電池堆35朝發熱體10流通電流,藉此,發熱體10開始發熱。保護元件1藉由發熱體10之發熱,而將可熔導體3熔斷,遮斷電池堆35之充放電路徑。又,保護元件1藉由使可熔導體3含有高熔點金屬及低熔點金屬而形成,而在高熔點金屬之熔斷前,低熔點金 屬熔融,利用熔融之低熔點金屬對高熔點金屬之熔蝕作用,可以短時間使可熔導體3熔解。 If the detection circuit 37 detects an abnormal voltage in any of the battery cells 34a-34d, it outputs a shutoff signal to the current control element 38. This controls the current flow by energizing the heating element 10. The protective element 1 then flows a current from the battery stack 35 to the heating element 10, causing the heating element 10 to begin heating. The heat generated by the heating element 10 causes the protective element 1 to melt the fusible conductor 3, interrupting the charge and discharge path of the battery stack 35. Furthermore, the protective element 1 is formed by making the fusible conductor 3 contain a high-melting-point metal and a low-melting-point metal. Before the high-melting-point metal melts, the low-melting-point metal melts. The molten low-melting-point metal corrodes the high-melting-point metal, quickly dissolving the fusible conductor 3.
保護元件1由於藉由可熔導體3熔斷,而亦遮斷向發熱體10之饋電路徑,故停止發熱體10之發熱。 Since the protective element 1 melts due to the fusible conductor 3, the power supply path to the heating element 10 is also cut off, thus stopping the heating element 10 from generating heat.
此外,保護元件1於在電池組33流通超過額定之過電流之情形下,亦將可熔導體3藉由自發熱而熔融,可遮斷電池組33之充放電路徑。 Furthermore, when an overcurrent exceeding the rated value flows through the battery pack 33, the protective element 1 will melt the fusible conductor 3 through self-heating, thereby blocking the charge and discharge path of the battery pack 33.
此處,保護元件1將殼體6之下側外殼4與上側外殼5密接,而具備所期望之接著強度。因而,保護元件1可防止上側外殼5在可熔導體3之熔斷時脫開。又,保護元件1由於將殼體6之下側外殼4與上側外殼5密接,而可滿足特定之殼體之高度條件。 Here, the protective element 1 securely bonds the lower shell 4 and upper shell 5 of the housing 6, achieving the desired bond strength. Consequently, the protective element 1 prevents the upper shell 5 from detaching when the fusible conductor 3 melts. Furthermore, by securely bonding the lower shell 4 and upper shell 5 of the housing 6, the protective element 1 can meet specific housing height requirements.
如此,保護元件1藉由因發熱體10之通電引起之發熱、或因過電流引起之可熔導體3之自發熱,而將可熔導體3熔斷。此時,保護元件1即便於可熔導體3曝露於向第1、第2外部連接端子7、8及正面電極11回流安裝等高溫環境下之情形下,由於具有低熔點金屬由高熔點金屬被覆之構造,故亦抑制可熔導體3之變形。因而,防止由因可熔導體3之變形所致之電阻值之變動等引起之熔斷特性之變動,可藉由特定之過電流或發熱體10之發熱,快速地熔斷。 In this manner, the protective element 1 melts the fusible conductor 3 by heating caused by the passage of current to the heater 10 or by self-heating of the fusible conductor 3 due to overcurrent. Even when the fusible conductor 3 is exposed to high-temperature environments, such as during reflow mounting to the first and second external connection terminals 7 and 8 and the front electrode 11, the protective element 1, with its structure of a low-melting-point metal covered by a high-melting-point metal, suppresses deformation of the fusible conductor 3. This prevents changes in the melting characteristics caused by changes in the resistance value due to deformation of the fusible conductor 3, enabling rapid melting by a specific overcurrent or heating of the heater 10.
本發明之保護元件1並不限定於用於鋰離子二次電池之電池組之情 形,毋庸置疑亦可應用於需要由電信號進行之電流路徑之遮斷之各種用途。 The protection element 1 of the present invention is not limited to use in lithium-ion secondary battery packs. It can also be used in various applications requiring interruption of current paths mediated by electrical signals.
其次,針對應用本發明之保護元件之其他之變化例進行說明。此外,在以下之說明中,有針對與上述之保護元件1、50相同之構成,賦予相同之符號,且省略其細節之情形。變化例之保護元件60可如圖23所示般,使複數個熔斷構件18夾持可熔導體3。圖23所示之保護元件60將熔斷構件18分別配設於可熔導體3之一個面及另一面。圖24係保護元件60之電路圖。配設於可熔導體3之正面及背面之各熔斷構件18分別將發熱體10之一端經由形成於各絕緣基板2之發熱體電極15及正面電極11與可熔導體3連接,將發熱體10之另一端經由形成於各絕緣基板2之發熱體饋電電極16及第3外部連接端子17連接於用於使發熱體10發熱之電源。 Next, another variation of the protective element to which the present invention is applied will be described. In the following description, components identical to those of the aforementioned protective elements 1 and 50 are sometimes designated with the same reference numerals, and details are omitted. A variation of the protective element 60, as shown in FIG23 , can have multiple fuse members 18 sandwiching the fusible conductor 3. The protective element 60 shown in FIG23 has the fuse members 18 disposed on one and the other surfaces of the fusible conductor 3. FIG24 is a circuit diagram of the protective element 60. Each fuse member 18 disposed on the front and back surfaces of the fusible conductor 3 connects one end of the heating element 10 to the fusible conductor 3 via the heating element electrode 15 and the front electrode 11 formed on each insulating substrate 2, and connects the other end of the heating element 10 to a power source for generating heat for the heating element 10 via the heating element feeding electrode 16 and the third external connection terminal 17 formed on each insulating substrate 2.
又,如圖25所示,保護元件60在藉由發熱體10之發熱,將可熔導體3熔斷時,連接於可熔導體3之兩面之各熔斷構件18、18之發熱體10發熱,且自可熔導體3之兩面進行加熱。因而,保護元件60在為了應對大電流用途,而使可熔導體3之剖面積增大之情形下,亦可快速地將可熔導體3加熱並熔斷。 Furthermore, as shown in Figure 25 , when the protective element 60 melts the fusible conductor 3 by heating the heating element 10, the heating elements 10 connected to the respective fuse members 18, 18 on both sides of the fusible conductor 3 generate heat, heating the fusible conductor 3 from both sides. Therefore, even when the cross-sectional area of the fusible conductor 3 is increased to accommodate high current applications, the protective element 60 can still quickly heat and melt the fusible conductor 3.
在保護元件60中亦具有與上述之保護元件1、50同樣之殼體6,於下側外殼4或上側外殼5形成嵌合凹部25及凹部狹槽27、或嵌合凸部26及凸部狹槽28。 The protective element 60 also has a housing 6 similar to the protective elements 1 and 50 described above, with a fitting recess 25 and recessed slot 27, or a fitting protrusion 26 and protrusion slot 28 formed on the lower outer shell 4 or upper outer shell 5.
又,保護元件60自可熔導體3之兩面將熔融導體3a吸引至形成於各熔斷構件18之絕緣基板2之各吸引孔12內。因而,保護元件60即便於為了應對大電流用途,使可熔導體3之剖面積增大,熔融導體3a較多量地產生之情形下,亦可藉由複數個熔斷構件18進行吸引,而確實地使可熔導體3熔斷。又,保護元件60藉由利用複數個熔斷構件18吸引熔融導體3a,而可更快速地使可熔導體3熔斷。 Furthermore, the protective element 60 draws the fusible conductor 3a from both sides of the fusible conductor 3 into the respective draw holes 12 formed in the insulating substrate 2 within the respective fuse members 18. Therefore, even if the cross-sectional area of the fusible conductor 3 is increased to accommodate high-current applications and a large amount of fusible conductor 3a is generated, the protective element 60 can reliably melt the fusible conductor 3 by drawing the fusible conductor 3a through the multiple fuse members 18. Furthermore, by utilizing the multiple fuse members 18 to draw the fusible conductor 3a, the protective element 60 can melt the fusible conductor 3 more quickly.
保護元件60於使用以高熔點金屬被覆構成內層之低熔點金屬之被覆構造,作為可熔導體3之情形下,亦可使可熔導體3快速地熔斷。亦即,由高熔點金屬被覆之可熔導體3即便於發熱體10發熱之情形下,加熱至外層之高熔點金屬熔融之溫度亦需要時間。此處,保護元件60藉由具備複數個熔斷構件18,且同時使各發熱體10發熱,而可將外層之高熔點金屬快速地加熱至熔融溫度。因而,根據保護元件60,可增厚構成外層之高熔點金屬層之厚度,可謀求進一步高額定化,且維持快速熔斷特性。 Even when the protective element 60 uses a low-melting-point metal coating as the fusible conductor 3, the fusible conductor 3 can be quickly melted. Specifically, even when the heating element 10 is energized, a fusible conductor 3 coated with a high-melting-point metal takes time to heat to a temperature at which the outer high-melting-point metal melts. By including multiple fuse members 18 and simultaneously energizing each heating element 10, the protective element 60 can quickly heat the outer high-melting-point metal to a melting point. Consequently, the protective element 60 can increase the thickness of the outer high-melting-point metal layer, achieving a higher rating while maintaining fast-blowing characteristics.
又,保護元件60如圖23所示般,較佳為將一對熔斷構件18、18對向地連接於可熔導體3。藉此,保護元件60可以一對熔斷構件18、18自兩面側同時加熱可熔導體3之同一部位,且吸引熔融導體3a,可更快速地將可熔導體3加熱、熔斷。 Furthermore, as shown in Figure 23, the protective element 60 preferably has a pair of fuse members 18, 18 connected to the fusible conductor 3 in opposing directions. This allows the protective element 60 to simultaneously heat the same portion of the fusible conductor 3 from both sides, while also attracting the molten conductor 3a, allowing for faster heating and melting of the fusible conductor 3.
又,保護元件60較佳為形成於一對熔斷構件18、18之各絕緣基板2之正面電極11介隔著可熔導體3相互對向。藉此,藉由一對熔斷構件18、18 對稱地連接,而在回流安裝時等,對可熔導體3之負載之施加方式不會失衡,可提高對於變形之耐性。 Furthermore, the protective element 60 is preferably formed on the front electrodes 11 of the insulating substrate 2 of a pair of fuse members 18, 18, facing each other with the fusible conductor 3 interposed therebetween. This symmetrical connection of the pair of fuse members 18, 18 prevents unbalanced load application to the fusible conductor 3 during reflow assembly, thereby improving resistance to deformation.
此外,發熱體10在形成於絕緣基板2之正面2a、背面2b之任一情形下均形成於吸引孔12之兩側此舉,在加熱正面電極11及背面電極14,且將更多之熔融導體3a凝聚、吸引上較佳。 Furthermore, the heating element 10, whether formed on the front surface 2a or the back surface 2b of the insulating substrate 2, is formed on both sides of the suction hole 12. This is advantageous in heating the front electrode 11 and the back electrode 14, and in converging and sucking more of the molten conductor 3a.
1:保護元件 1: Protective components
4:下側外殼 4: Lower shell
5:上側外殼 5: Upper shell
5a:側壁下端面 5a: Lower end surface of the side wall
19:接著劑 19: Follow-up agent
25:嵌合凹部 25: Fitting recess
26:嵌合凸部 26: Fitting convex part
27:凹部狹槽/狹槽 27: Recessed slot/slot
Claims (18)
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| JP2019157431A JP7280151B2 (en) | 2019-08-29 | 2019-08-29 | protection element, battery pack |
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| KR (1) | KR102707876B1 (en) |
| CN (2) | CN114245929A (en) |
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| JP2015106995A (en) * | 2013-11-29 | 2015-06-08 | マブチモーター株式会社 | Holder and motor |
| US10224166B2 (en) * | 2014-11-14 | 2019-03-05 | Littelfuse, Inc. | High-current fuse with endbell assembly |
| JP6719983B2 (en) * | 2015-06-04 | 2020-07-08 | デクセリアルズ株式会社 | Fuse element, fuse element, protection element, short-circuit element, switching element |
| JP6857322B2 (en) * | 2016-12-14 | 2021-04-14 | 東芝ライテック株式会社 | Vehicle lighting and vehicle lighting |
| US10121518B1 (en) * | 2017-06-21 | 2018-11-06 | Western Digital Technologies, Inc. | Reducing leak rate in adhesive-based hermetically-sealed data storage devices and systems |
| KR20190002141A (en) * | 2017-06-29 | 2019-01-08 | 한국단자공업 주식회사 | Fuse |
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2019
- 2019-08-29 JP JP2019157431A patent/JP7280151B2/en active Active
-
2020
- 2020-08-18 KR KR1020227004903A patent/KR102707876B1/en active Active
- 2020-08-18 CN CN202080057909.4A patent/CN114245929A/en active Pending
- 2020-08-18 WO PCT/JP2020/031182 patent/WO2021039509A1/en not_active Ceased
- 2020-08-18 CN CN202510210349.6A patent/CN120048702A/en active Pending
- 2020-08-28 TW TW109129580A patent/TWI893000B/en active
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| JPH06218492A (en) * | 1993-01-19 | 1994-08-09 | Honda Motor Co Ltd | Shell mold |
| CN101202437A (en) * | 2007-12-21 | 2008-06-18 | 王卫东 | Plastic shell type electromechanical integration three phase ac electric motor protector |
| TW201523679A (en) * | 2013-08-07 | 2015-06-16 | Dexerials Corp | Protective element and battery pack |
| TW201740596A (en) * | 2017-03-20 | 2017-11-16 | Pao-Hsuan Chen | Protection component and battery pack comprising an insulating shell, a plurality of terminal electrodes and a first over-current protection component |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102707876B1 (en) | 2024-09-23 |
| JP7280151B2 (en) | 2023-05-23 |
| KR20220031116A (en) | 2022-03-11 |
| CN120048702A (en) | 2025-05-27 |
| CN114245929A (en) | 2022-03-25 |
| TW202118132A (en) | 2021-05-01 |
| WO2021039509A1 (en) | 2021-03-04 |
| JP2021034363A (en) | 2021-03-01 |
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