TWI881392B - Substrate cleaning device and substrate cleaning method - Google Patents

Abstract

The substrate cleaning device of the present invention comprises: a substrate rotation holding part, which holds the substrate and rotates it; a first cleaning brush, which has a first cleaning surface inclined so as to contact with a first oblique angle region of the substrate held on the substrate rotation holding part; a first driving part, which is configured to change the first cleaning brush into a first contact state and a first separation state, wherein the first contact state is the first cleaning surface. The first cleaning surface is in contact with the first angled area of the substrate rotated by the substrate rotation holding portion, and the first separation state is that the first cleaning surface is separated from the first angled area of the substrate rotated by the substrate rotation holding portion; and the control portion controls the first driving portion by changing the contact position of the first cleaning surface in the first contact state with respect to the first angled area when a preset first condition is met.

Description

Substrate cleaning device and substrate cleaning method

The present invention relates to a substrate cleaning device and a substrate cleaning method.

In a substrate processing device, a substrate having an oblique angle portion around the upper and lower surfaces is sometimes the object of processing. For example, if the exposure processing of the substrate is performed when the oblique angle portion of the substrate is contaminated, the exposure stage is contaminated. In addition, in a liquid immersion exposure device that uses immersion liquid for exposure, if the exposure is performed when the oblique angle portion of the substrate is contaminated, the lens of the exposure device is contaminated, which may cause the size and shape of the exposure pattern to be defective. For this purpose, for example, as described in Patent Document 1, a substrate cleaning device having a cleaning brush for cleaning the oblique angle portion is used. In addition, when various film forming processes are performed on the substrate, the oblique angle portion of the substrate is sometimes contaminated during the film forming process.

The cleaning brush described in Patent Document 1 has a rotationally symmetrical shape with respect to a straight axis and includes a lower bevel cleaning surface and an upper bevel cleaning surface. When cleaning the bevel portion of a substrate, the lower bevel cleaning surface of the cleaning brush contacts the bevel portion of the lower surface of the substrate held and rotated by a rotating chuck. Similarly, the upper bevel cleaning surface of the cleaning brush contacts the bevel portion of the upper surface of the rotating substrate.

[Patent Document 1] Japanese Patent Publication No. 2009-032889

However, if the cleaning brush is used continuously, the friction between the bevel of the substrate and the bevel cleaning surface of the cleaning brush may cause grooves to form on the bevel cleaning surface due to wear. In addition, the bevel cleaning surface of the cleaning brush is contaminated. Therefore, the cleaning brush must be replaced regularly. In the replacement of the cleaning brush, it is necessary to remove the cleaning brush, replace the cleaning brush, teach the replaced cleaning brush, start the cleaning brush, and monitor the movement of the replaced cleaning brush. Therefore, a large amount of downtime is generated in the use of substrate processing equipment. In recent years, with the expansion of device production, it is sought to reduce the downtime in substrate processing.

The purpose of the present invention is to provide a substrate cleaning device and a substrate cleaning method that can reduce the downtime caused by the replacement of the cleaning brush.

(1) A substrate cleaning device according to one aspect of the present invention is for cleaning a substrate, wherein the substrate has a first main surface and a first oblique angle region at a peripheral portion of the first main surface, and the substrate cleaning device comprises: a substrate rotation holding portion, which holds the substrate and rotates it; a first cleaning brush, which has a first cleaning surface inclined so as to contact the first oblique angle region of the substrate held by the substrate rotation holding portion; and a first driving portion, which is configured to transform the first cleaning brush into a first contacting brush. The first contact state and the first separation state are that the first cleaning surface is in contact with the first oblique angle area of the substrate rotated by the substrate rotation holding part, and the first separation state is that the first cleaning surface is separated from the first oblique angle area of the substrate rotated by the substrate rotation holding part; and a control part, which controls the first driving part in a manner that changes the contact position of the first cleaning surface in the first contact state with respect to the first oblique angle area when the preset first condition is met.

(2) Another aspect of the present invention is a substrate cleaning method for cleaning a substrate having a main surface and an oblique angle region at the periphery of the main surface, and the substrate cleaning method comprises the following steps: performing the steps sequentially for a plurality of substrates: holding and rotating one of the plurality of substrates by a substrate rotation holding portion, and making the inclined cleaning surface of the cleaning brush contact the oblique angle region of one substrate by a driving portion; and controlling the driving portion in a manner that changes the contact position of the cleaning surface with respect to the oblique angle region when a preset condition is met;

According to the present invention, the downtime caused by the replacement of the cleaning brush can be reduced.

10: Rotating chuck

11: Maintaining part

12: Chuck rotation drive unit

13,14: Bottom surface cleaning nozzle

15: Top surface cleaning nozzle

20,20a: Cleaning brush

21,21a,22,22a: Wash face

23: Connection surface

30,30a: Arm

40,40a: Arm drive unit

50,50a: Brush rotation drive unit

60: Control Department

70: Display unit

100,100a: Substrate cleaning device

A: Bevel area

B: Bevel area/Second bevel area

k: Number of contact positions

LA1: Length of the bevel area in width direction/length of the bevel area

la1,la2,la3: contact position

LB1: Length of the bevel area in width direction/length of substrate/length of bevel area

lb1,lb2,lb3,lan,lbn: contact position

n: variable

R: Beveled part

W: Substrate

WD: Lower surface

WU: Upper surface

θ1,θ2,θ3,θ4: tilt angle

FIG1 is a schematic side view of a substrate cleaning device in one embodiment of the present invention.

FIG2 is a schematic cross-sectional view for illustrating the shape of the peripheral portion of the substrate.

Figure 3 shows the state of the substrate and the cleaning brush when the peripheral portion of the substrate is cleaned.

FIG4 is a diagram showing the state of the substrate and the cleaning brush when the peripheral portion of the substrate is cleaned.

Figure 5 shows an example of changing the contact position of the cleaning brush during cleaning.

FIG6 is a flow chart showing an example of the operation of the substrate cleaning device 100.

FIG7 is a schematic side view of another embodiment of a substrate cleaning device.

FIG8 is a diagram showing an example of cleaning a substrate using multiple cleaning brushes.

Hereinafter, a substrate cleaning device and a substrate cleaning method of one embodiment of the present invention will be described in detail with reference to the drawings. In the following description, the substrate refers to a semiconductor substrate (semiconductor wafer), a FPD (Flat Panel Display) substrate used in a liquid crystal display device or an organic EL (Electro Luminescence) display device, an optical disk substrate, a magnetic disk substrate, an optical magnetic disk substrate, a mask substrate, a ceramic substrate, or a solar cell substrate. In addition, the substrate described below has a circular shape when viewed from above, excluding the portion where the notch is formed.

(1) Substrate cleaning device

FIG1 is a schematic side view of a substrate cleaning device 100 of one embodiment of the present invention. As shown in FIG1 , the substrate cleaning device 100 includes: a rotary chuck 10, a cleaning brush 20, an arm 30, an arm driving unit 40, a brush rotation driving unit 50, a control unit 60, and a display unit 70.

In the substrate cleaning device 100, a substrate W is moved in and out of the substrate cleaning device 100 by a transport robot not shown in the figure. The rotary chuck 10 includes a holding portion 11 and a chuck rotation drive portion 12. The substrate W moved in by the transport robot is placed on the holding portion 11. A plurality of suction paths not shown in the figure are formed in the holding portion 11, and the lower surface of the substrate W is vacuum-adsorbed on the holding portion 11 by exhausting the suction paths. Thus, the holding portion 11 holds the substrate W in a horizontal position. The chuck rotation drive portion 12 is connected to the holding portion 11 via a connecting member. The chuck rotation drive portion 12 includes, for example, an electric motor, and is configured to be able to rotate the holding portion 11. Thus, the substrate W held in a horizontal position by the holding portion 11 is rotated.

Lower surface cleaning nozzles 13 and 14 are respectively arranged near the holding portion 11 to supply cleaning liquid to the lower surface of the substrate W held in a horizontal position. Upper surface cleaning nozzle 15 is arranged above the holding portion 11 to supply cleaning liquid to the upper surface of the substrate W held in a horizontal position. The cleaning liquid sprayed from the lower surface cleaning nozzles 13 and 14 and the upper surface cleaning nozzle 15 is expanded outward by the centrifugal force formed by the rotation of the substrate W.

A cleaning brush 20 supported by an arm 30 is disposed outside the rotary chuck 10. Details of the cleaning brush 20 will be described later. The arm driving unit 40 includes, for example, an actuator, configured to move the cleaning brush 20 supported by the arm 30 in three dimensions. The brush rotation driving unit 50 includes, for example, an electric motor, configured to rotate the cleaning brush 20 supported by the arm 30 around an axis in a lead-vertical direction. In the present embodiment, the brush rotation driving unit 50 rotates the cleaning brush 20 in a direction opposite to the direction in which the substrate W held by the holding unit 11 rotates. In this state, the cleaning brush 20 is moved in a horizontal direction by the arm driving unit 40. In this way, the cleaning brush 20 comes into contact with the peripheral portion of the rotating substrate W, thereby cleaning the peripheral portion of the substrate W.

The control unit 60 includes: CPU (central processing unit), RAM (random access memory), ROM (read-only memory) and storage device. The control unit 60 controls the operation of the rotary chuck 10 and the arm drive unit 40. The details of the control unit 60 are described later. Various information related to the cleaning of the substrate W is displayed in the display unit 70.

FIG2 is a schematic cross-sectional view for explaining the shape of the peripheral portion of the substrate W. The peripheral portion of the substrate W carried into the substrate cleaning apparatus 100 of the present embodiment includes an annular bevel portion R. The bevel portion R includes an annular bevel region A tilted in a manner continuously connected to the upper surface WU of the substrate W and an annular bevel region B tilted in a manner continuously connected to the lower surface WD of the substrate W. The tilt angle θ1 of the bevel region A with respect to the axis in the lead vertical direction is substantially equal to the tilt angle θ2 of the bevel region B with respect to the axis in the lead vertical direction. The length of the bevel area A in the width direction (the length of the section in the lead vertical direction) is set to LA1, and the length of the bevel area B in the width direction (the length of the section in the lead vertical direction) is set to LB1.

FIG. 3 and FIG. 4 are diagrams showing the state of the substrate W and the cleaning brush 20 when the peripheral portion of the substrate W is cleaned. The cleaning brush 20 includes a cleaning surface 21, a cleaning surface 22, and a connecting surface 23. The connecting surface 23 is a cylindrical surface having an axis in the vertical direction. The cleaning brush 20 is formed of polyvinyl alcohol (PVA), for example, but the material of the cleaning brush 20 is not limited thereto, and other resin materials or ceramic materials, etc., can be used.

As shown in FIG3 , the cleaning surface 21 has a conical shape extending outward and obliquely upward from the upper end of the connecting surface 23. The inclination angle θ3 of the cleaning surface 21 of the cleaning brush 20 with respect to the axis in the vertical direction is set to be substantially equal to the inclination angle θ1 of the bevel area A of the substrate W. Thereby, the bevel area A of the length LA1 of the substrate W can be brought into contact with the cleaning surface 21 of the cleaning brush 20. When cleaning the bevel area A in the bevel portion R of the substrate W, the height of the cleaning brush 20 is adjusted by the arm driving part 40 to a height at which the cleaning surface 21 of the cleaning brush 20 can contact the bevel area A of the substrate W. Afterwards, the cleaning brush 20 is moved horizontally from the outside of the substrate W, and the cleaning surface 21 of the cleaning brush 20 contacts the bevel area A of the substrate W. In this way, the bevel area A of the substrate W is cleaned.

As shown in FIG4 , the cleaning surface 22 has a conical shape extending outward and obliquely downward from the lower end of the connecting surface 23. The inclination angle θ4 of the cleaning surface 22 of the cleaning brush 20 with respect to the axis in the vertical direction is set to be substantially equal to the inclination angle θ2 of the bevel area B of the substrate W. Thereby, the bevel area B of the length LB1 of the substrate W can be brought into contact with the cleaning surface 22 of the cleaning brush 20. When cleaning the bevel area B in the bevel portion R of the substrate W, the height of the cleaning brush 20 is adjusted by the arm driving portion 40 to a height at which the cleaning surface 22 of the cleaning brush 20 can contact the bevel area B of the substrate W. Afterwards, the cleaning brush 20 is moved horizontally from the outside of the substrate W, and the cleaning surface 22 of the cleaning brush 20 contacts the bevel area B of the substrate W. In this way, the bevel area B of the substrate W is cleaned.

Here, if the cleaning surface 21 of the cleaning brush 20 repeatedly cleans the bevel region A of the substrate W, the contact position of the cleaning surface 21 with the bevel region A is contaminated or worn. Also, if the cleaning surface 22 of the cleaning brush 20 repeatedly cleans the bevel region B of the substrate W, the contact position of the cleaning surface 22 with the bevel region B is contaminated or worn. In the case where the contamination of the cleaning surface 21 or the cleaning surface 22 is not removed by cleaning or in the case where grooves due to wear are formed on the cleaning surface 21 or the cleaning surface 22, it is determined that the life of the cleaning brush 20 has expired and the cleaning brush 20 must be replaced. In the following example, the life of the cleaning brush 20 can be extended.

(2) Operation of substrate cleaning device 100

As described above, the control unit 60 controls the movement of the arm driving unit 40. Specifically, when cleaning the bevel region A of the bevel portion R of the substrate W, the control unit 60 controls the arm driving unit 40 by changing the contact position of the cleaning surface 21 of the cleaning brush 20 with respect to the bevel region A of the substrate W when the preset first condition is met. Similarly, when cleaning the bevel region B of the bevel portion R of the substrate W, the control unit 60 controls the arm driving unit 40 by changing the contact position of the cleaning surface 22 of the cleaning brush 20 with respect to the bevel region B of the substrate W when the preset second condition is met.

The first and second conditions mentioned above mean that the first and second factors associated with the contamination or wear of the cleaning surfaces 21 and 22 that may be generated due to the contact of the cleaning surfaces 21 and 22 with the bevel areas A and B reach a preset determination value. The first and second factors may include the number of substrates W cleaned by the cleaning surfaces 21 and 22, the cleaning force of the cleaning surfaces 21 and 22 with respect to the bevel areas A and B (for example, the pressure of the cleaning surfaces 21 and 22 with respect to the bevel areas A and B of the substrate W, etc.), and the cleaning time of the cleaning surfaces 21 and 22 with respect to the bevel areas A and B. Alternatively, the first and second factors may include a plurality of such factors. For example, the first and second factors may be the number of substrates W cleaned by the cleaning surfaces 21 and 22. In this case, the judgment value may be determined based on the cleaning power of the cleaning surfaces 21 and 22. Specifically, when the cleaning power is large, the judgment value is set to be small, and when the cleaning power is small, the judgment value is set to be large.

In this embodiment, the first and second factors are the number of substrates W cleaned by the cleaning surfaces 21 and 22. In other words, the first and second conditions are whether the number of substrates W cleaned by the cleaning surfaces 21 and 22 reaches the judgment value. The judgment value is, for example, 1000 pieces, but is not limited thereto.

FIG. 5 is a diagram showing an example of a change in the contact position of the cleaning brush 20 during cleaning. FIG. 6 is a flow chart showing an example of the operation of the substrate cleaning device 100. As shown in FIG. 5, a plurality of positions corresponding to the length LA1 of the bevel area A are set on the cleaning surface 21, and a plurality of positions corresponding to the length LB1 of the bevel area B are set on the cleaning surface 22. In the example of FIG. 5, contact positions la1, la2, and la3 are set in order from the bottom on the cleaning surface 21, and contact positions lb1, lb2, and lb3 are set in order from the bottom on the cleaning surface 22. Each of the contact positions la1, la2, and la3 is a position of an area having a length greater than the length LA1 of the bevel area A. Each of the contact positions lb1, lb2, and lb3 is a position of an area having a length greater than the length LB1 of the oblique angle area B.

In this embodiment, the contact position of the cleaning surface 21 of the cleaning brush 20 with respect to the bevel area A of the substrate W changes from bottom to top in the order of contact positions la1, la2, la3. In addition, the contact position of the cleaning surface 22 of the cleaning brush 20 with respect to the bevel area B of the substrate W changes from bottom to top in the order of contact positions lb1, lb2, lb3. The number of contact positions of the cleaning surfaces 21 and 22 is determined according to the type of the cleaning brush 20. In this embodiment, the number of contact positions of the cleaning surfaces 21 and 22 determined according to the type of the cleaning brush 20 is pre-stored in the control unit 60.

First, the control unit 60 obtains the number k (k is an integer greater than or equal to 2) of the contact positions of each of the cleaning surfaces 21 and 22 that are pre-stored (step S1 in FIG. 6 ). Next, the control unit 60 sets the variable n to 1 (step S2). The rotary chuck 10 in FIG. 1 holds the substrate W that has been moved in. Next, the arm drive unit 40 adjusts the height of the cleaning brush 20 in such a manner that the angled area B of the substrate W can contact the contact position lbn set on the cleaning surface 22 (step S3). Here, the cleaning liquid is supplied to the lower surface of the substrate W by the lower surface cleaning nozzles 13 and 14. In this state, the arm driving unit 40 moves the cleaning brush 20 in a horizontal plane in such a manner that the contact position lbn of the cleaning surface 22 contacts the bevel area B of the substrate W. Thus, the cleaning brush 20 cleans the bevel area B of the substrate W at the contact position lbn of the cleaning surface 22 (step S4).

Next, the arm-driving unit 40 adjusts the height of the cleaning brush 20 in such a manner that the oblique angle region A of the substrate W can contact the contact position lan set on the cleaning surface 21 (step S5). Here, the cleaning liquid is supplied to the upper surface of the substrate W by the upper surface cleaning nozzle 15. In this state, the arm-driving unit 40 moves the cleaning brush 20 in the horizontal plane in such a manner that the contact position lan of the cleaning surface 21 contacts the oblique angle region A of the substrate W. Thereby, the cleaning brush 20 cleans the oblique angle region A of the substrate W at the contact position lan of the cleaning surface 21 (step S6).

Afterwards, the substrate W held by the rotary chuck 10 is released through various steps, and the substrate W is carried out by the transport robot. The control unit 60 determines whether the number of substrates W cleaned at the contact positions lbn and lan of the cleaning surfaces 21 and 22 has reached the preset number (step S8). When the number of substrates W cleaned at the contact positions lbn and lan has not reached the preset number, the control unit 60 returns to step S3. In this way, the cleaning of other substrates W is carried out.

When the number of substrates W cleaned at the contact positions lbn and lan reaches a preset number, the control unit 60 adds 1 to the variable n (step S9). Here, the control unit 60 determines whether the variable n is greater than the number k of contact positions of each of the cleaning surfaces 21 and 22 (step S10). When the variable n is less than the number k of contact positions, the control unit 60 returns to step S3. In this way, the bevel areas A and B of the substrate W are cleaned at the subsequent contact positions lbn and lan (the upper contact positions before the change in this embodiment) of the cleaning surfaces 21 and 22 of the cleaning brush 20. When the variable n is greater than the number of contact positions k, the control unit 60 causes the display unit 70 to display the replacement period of the cleaning brush 20 (step S11).

(3) Effects of implementation form

According to the substrate cleaning device 100 of the above-mentioned embodiment, when the number of substrates W cleaned at each contact position of the cleaning surfaces 21 and 22 reaches a preset judgment value, the contact position of the cleaning surfaces 21 and 22 with respect to the bevel areas A and B is changed. In this case, the bevel areas A and B can be cleaned in the uncontaminated and unworn areas of the cleaning surfaces 21 and 22. In this way, the life of the cleaning brush 20 can be increased. As a result, in the substrate cleaning device 100, the replacement frequency of the cleaning brush 20 can be reduced.

In addition, the contact position of the cleaning surfaces 21 and 22 of the cleaning brush 20 with respect to the bevel areas A and B of the substrate W is changed from bottom to top. Thus, even if the contact position before the change is attached with contaminants or particles generated by wear, the contaminants or particles are prevented from falling onto the substrate W that contacts the contact position after the change. Therefore, the bevel areas A and B can be cleaned cleanly.

The change of the contact position of the cleaning surfaces 21 and 22 of the cleaning brush 20 with respect to the bevel areas A and B of the substrate W is set by whether the number of substrates W cleaned in the cleaning surfaces 21 and 22 reaches a preset judgment value. In this way, the contact area of the cleaning surfaces 21 and 22 can be changed before the cleaning of the bevel areas A and B becomes insufficient according to the degree of contamination or wear of the cleaning surfaces 21 and 22. As a result, the cleaning ability of the cleaning surfaces 21 and 22 with respect to the bevel areas A and B can be maintained constant for a long period of time.

(4) Other implementation forms

(4-1) In the above-mentioned embodiment, the beveled areas A and B of the substrate W are cleaned by a single cleaning brush 20, but the present invention is not limited to this. Figure 7 is a schematic side view of a substrate cleaning device 100a of another embodiment. As shown in Figure 7, the substrate cleaning device 100a further includes a cleaning brush 20a, an arm 30a, an arm driving part 40a and a brush rotation driving part 50a. In the example of Figure 7, the cleaning brush 20a is arranged to be opposite to the cleaning brush 20 across the substrate W. The structure of the cleaning brush 20a is the same as that of the cleaning brush 20. The cleaning brush 20a is the same as the cleaning brush 20, and includes cleaning surfaces 21a and 22a corresponding to the inclination of the bevel areas A and B of the substrate W. In addition, the actions of the cleaning brush 20a, the arm 30a, the arm driving unit 40a and the brush rotating driving unit 50a are the same as the actions of the cleaning brush 20, the arm 30, the arm driving unit 40 and the brush rotating driving unit 50 of the substrate cleaning device 100 of FIG. 1.

FIG8 is a diagram showing an example of cleaning a substrate W by a plurality of cleaning brushes 20 and 20a. When the preset third condition is satisfied, the contact position of the cleaning surface 21a of the cleaning brush 20a with respect to the bevel region A of the substrate W is changed from the lower direction to the upper direction, and when the preset fourth condition is satisfied, the contact position of the cleaning surface 22a of the cleaning brush 20a with respect to the second bevel region B of the substrate W is changed from the lower direction to the upper direction. The third and fourth conditions are set in the same manner as the first and second conditions. In this example, the third and fourth conditions are that the number of substrates W cleaned at each contact position of the cleaning surfaces 21a and 22a reaches a preset judgment value. The third and fourth conditions may be that the cleaning time at each contact position of the cleaning surfaces 21a and 22a reaches the judgment value. In addition, the judgment value corresponding to the third and fourth conditions may be set based on the cleaning power of the cleaning surfaces 21 and 22 for the oblique angle areas A and B.

As shown in FIG8 , in this example, when the bevel area B is cleaned by the cleaning surface 22 of the cleaning brush 20, the bevel area A is cleaned by the cleaning surface 21a of the cleaning brush 20a. Also, when the bevel area A is cleaned by the cleaning surface 21 of the cleaning brush 20, the bevel area B is cleaned by the cleaning surface 22a of the cleaning brush 20a. In this way, the bevel areas A and B of the substrate W can be cleaned in a short time.

In addition, in the substrate cleaning device 100a of FIG. 7, when the bevel area B is cleaned by the cleaning surface 22 of the cleaning brush 20, the bevel area B can be cleaned assisted by the cleaning surface 22a of the cleaning brush 20a, and when the bevel area A is cleaned by the cleaning surface 21 of the cleaning brush 20, the bevel area A can be cleaned assisted by the cleaning surface 21a of the cleaning brush 20a. In this way, the cleanliness of the bevel areas A and B of the substrate W can be improved in a short time.

In addition, for cleaning the beveled areas A and B of the substrate W, either of the cleaning brushes 20 and 20a can be used, and when the replacement period of either of the cleaning brushes 20 and 20a has arrived, the other of the cleaning brushes 20 and 20a can be used. In this way, the downtime caused by the replacement of the cleaning brushes 20 and 20a can be fully reduced.

(4-2) In the above-mentioned embodiment, the cleaning brushes 20 and 20a include cleaning surfaces 21 and 22 corresponding to the bevel areas A and B of the substrate W, but the present invention is not limited thereto. The cleaning brush 20 may have only a cleaning surface corresponding to either the bevel areas A and B of the substrate W. Similarly, the cleaning brush 20a may have only a cleaning surface corresponding to either the bevel areas A and B of the substrate W.

(4-3) In the above-mentioned implementation form, the first and second conditions are set as the same condition, but the present invention is not limited to this. The first and second conditions can be set as different conditions. Similarly, the third and fourth conditions can be set as different conditions. Furthermore, the first to fourth conditions can be set as different conditions.

(5) The correspondence between the various constituent elements of the patent application and the various parts of the implementation form

Hereinafter, an example of the correspondence between each component of the patent application scope and each component of the implementation form is described. In the above-mentioned implementation form, one of the upper surface WU and the lower surface WD of the substrate W is an example of the first main surface, the other of the upper surface WU and the lower surface WD of the substrate W is an example of the second main surface, the rotary chuck 10 is an example of the substrate rotation holding part, the cleaning brush 20 is an example of the first cleaning brush, and the arm driving part 40 is an example of the first driving part. In addition, one of the cleaning surfaces 21 and 22 is an example of the first cleaning surface, the other of the cleaning surfaces 21 and 22 is an example of the second cleaning surface, one of the cleaning surfaces 21a and 22a is an example of the third cleaning surface, and the other of the cleaning surfaces 21a and 22a is an example of the fourth cleaning surface. In addition, the cleaning brush 20a is an example of the second cleaning brush, and the arm driving part 40a is an example of the second driving part.

(6) Summary of implementation forms

(Item 1) A substrate cleaning device in one aspect is for cleaning a substrate, wherein the substrate has a first main surface and a first angled region at the periphery of the first main surface, and the substrate cleaning device comprises: a substrate rotation holding portion, which holds the substrate and rotates it; a first cleaning brush, which has a first cleaning surface inclined so as to contact the first angled region of the substrate held by the substrate rotation holding portion; and a first driving portion, which is configured to change the first cleaning brush into a first contact state with the first isolation state. The first contact state is that the first cleaning surface is in contact with the first oblique angle region of the substrate rotated by the substrate rotation holding portion, and the first separation state is that the first cleaning surface is separated from the first oblique angle region of the substrate rotated by the substrate rotation holding portion; and a control portion, which controls the first driving portion by changing the contact position of the first cleaning surface with respect to the first oblique angle region in the first contact state when a preset first condition is met.

According to the substrate cleaning device described in item 1, the first cleaning brush is transformed into the first contact state and the first separation state by the first driving unit. In the first contact state, the first cleaning surface of the first cleaning brush contacts the first bevel area of the rotating substrate. In this way, the first bevel area of the substrate is cleaned. If the first cleaning surface repeatedly cleans the first bevel area, the contact position of the first cleaning surface with the first bevel area is contaminated or worn.

According to the above-mentioned structure, when the preset first condition is met, the contact position of the first cleaning surface in the first contact state with respect to the first bevel area is changed. In this case, the first bevel area can be cleaned in an uncontaminated and unworn area of the cleaning surface. In this way, the life of the first cleaning brush can be increased, and thus the replacement frequency of the first cleaning brush can be reduced. As a result, the downtime caused by the replacement of the first cleaning brush can be reduced.

(Item 2) A substrate cleaning device as in Item 1, wherein the control unit can control the first driving unit in such a manner that the contact position of the first cleaning surface with respect to the first bevel area after the change becomes a position higher than the contact position of the first cleaning surface with respect to the first bevel area before the change when the first condition is satisfied.

According to the substrate cleaning device described in item 2, even if contaminants or particles generated by wear are attached to the contact position before the first cleaning surface is changed, the contaminants or particles are prevented from falling onto the substrate that contacts the changed contact position of the first cleaning surface after the change. Thus, after the contact position of the first cleaning surface is changed, the changed contact position can be kept clean. Therefore, the first bevel area of the substrate can be cleaned.

(Item 3) A substrate cleaning device as described in Item 1 or Item 2, wherein the first condition may include the first factor associated with the contamination or wear of the first cleaning surface that may be caused by the contact of the first cleaning surface with the first bevel area reaching a preset value.

According to the substrate cleaning device described in item 3, the contact position of the first cleaning surface is changed based on the first factor associated with the contamination or wear of the first cleaning surface. Thus, the contact area of the first cleaning surface can be changed before the cleaning of the first bevel area becomes insufficient due to the contamination or wear of the contact position of the first cleaning surface. Thus, the cleaning ability of the first cleaning surface for the first bevel area can be maintained.

(Item 4) A substrate cleaning device as described in Item 3, wherein the first factor may include at least one of the number of substrates cleaned by the first cleaning surface, the cleaning power of the first cleaning surface with respect to the first oblique angle area, and the cleaning time of the first cleaning surface with respect to the first oblique angle area.

According to the substrate cleaning device described in item 4, the contact position of the first cleaning surface is changed based on the number of substrates cleaned by the first cleaning surface, the cleaning power of the first cleaning surface with respect to the first bevel area, or the cleaning time of the first cleaning surface with respect to the first bevel area. In this way, the contact area of the first cleaning surface can be changed before the cleaning of the first bevel area becomes insufficient according to the degree of contamination or wear of the first cleaning surface. As a result, the cleaning ability of the first cleaning surface with respect to the first bevel area can be maintained constant for a long period of time.

(Item 5) The substrate cleaning device as described in Item 4, wherein the cleaning force of the first cleaning surface on the first bevel area may include the pressing force of the first cleaning surface on the first bevel area.

According to the substrate cleaning device described in item 5, the contact position of the cleaning surface with respect to the first bevel area can be changed based on the pressure of the first cleaning surface with respect to the first bevel area. In this way, the contact position of the first cleaning surface can be changed before the grooves generated by the wear of the first cleaning surface reduce the cleaning ability. As a result, the cleaning ability of the first cleaning surface with respect to the first bevel area can be maintained constant for a longer period of time.

(Item 6) In the substrate cleaning device as described in Items 1 to 5, it is feasible that the substrate has a second main surface opposite to the first main surface, and has a second oblique angle region at the periphery of the second main surface; and the first cleaning brush has a second cleaning surface inclined so as to contact the second oblique angle region of the substrate held by the substrate rotation holding portion; and the first driving portion is configured to change the first cleaning brush into a second contact state and a second separation state, The second contact state is that the second cleaning surface is in contact with the second oblique angle region of the substrate rotated by the substrate rotation holding portion, and the second separation state is that the second cleaning surface is separated from the second oblique angle region of the substrate rotated by the substrate rotation holding portion; when the preset second condition is met, the control portion controls the first driving portion by changing the contact position of the second cleaning surface with respect to the second oblique angle region in the second contact state.

According to the substrate cleaning device described in item 6, the first cleaning brush is transformed into a second contact state and a second separation state by the second driving unit. In the second contact state, the second cleaning surface of the first cleaning brush contacts the second bevel area of the rotating substrate. In this way, the second bevel area of the substrate is cleaned. If the second cleaning surface repeatedly cleans the second bevel area, the contact position of the second cleaning surface with the second bevel area is contaminated or worn.

According to the above-mentioned structure, when the preset second condition is met, the contact position of the second cleaning surface in the second contact state with respect to the second bevel area is changed. In this case, the second bevel area can be cleaned in the uncontaminated and unworn area of the cleaning surface. In this case, since the first and second bevel areas of the substrate can be cleaned and the life of the first cleaning brush is increased, the replacement frequency of the first cleaning brush can be reduced. As a result, the downtime caused by the replacement of the first cleaning brush can be reduced.

(Item 7) A substrate cleaning device as in Item 6, wherein the control unit is capable of controlling the first driving unit in such a manner that the contact position of the second cleaning surface with respect to the second bevel area after the change becomes a higher position than the contact position of the second cleaning surface with respect to the second bevel area before the change when the second condition is satisfied.

According to the substrate cleaning device described in item 7, even if contaminants or particles generated by wear are attached to the contact position before the second cleaning surface is changed, the contaminants or particles are prevented from falling to the contact position after the change of the second cleaning surface. Thus, after the contact position of the second cleaning surface is changed, the contact position after the change can be kept clean. Therefore, the second bevel area of the substrate can be cleaned.

(Item 8) A substrate cleaning device as described in Item 6 or Item 7, wherein the aforementioned second condition may include that the second factor associated with the contamination or wear of the aforementioned second cleaning surface that may be caused by the contact of the aforementioned second cleaning surface with the aforementioned second bevel area reaches a preset value.

According to the substrate cleaning device described in item 8, the contact position of the second cleaning surface is changed based on the second factor associated with the contamination or wear of the second cleaning surface. Thus, the contact area of the second cleaning surface can be changed before the cleaning of the second bevel area becomes insufficient due to the contamination or wear of the contact position of the second cleaning surface. Thus, the cleaning ability of the second cleaning surface for the second bevel area can be maintained.

(Item 9) The substrate cleaning device of any one of Items 6 to 8 may further include: a second cleaning brush, which has: a third cleaning surface that is inclined so as to contact with the aforementioned first angled area of the substrate held on the aforementioned substrate rotation holding portion, and a fourth cleaning surface that is inclined so as to contact with the aforementioned second angled area of the substrate held on the aforementioned substrate rotation holding portion; and a second driving portion, which causes the aforementioned second cleaning brush to change into a third contact state and a third separation state, and the third contact state is that the aforementioned third cleaning surface is in contact with the aforementioned first angled area of the substrate rotated by the aforementioned substrate rotation holding portion, and the third separation state is that the aforementioned third cleaning surface is in contact with the aforementioned first angled area of the substrate rotated by the aforementioned substrate rotation holding portion. The control unit controls the second driving unit in the following manner: when the preset third condition is met, the contact position of the third cleaning surface with respect to the first oblique angle area in the third contact state is changed; when the preset fourth condition is met, the contact position of the fourth cleaning surface with respect to the second oblique angle area in the fourth contact state is changed.

According to the substrate cleaning device described in item 9, the first bevel area of the substrate is cleaned by the first cleaning surface of the first cleaning brush, and the second bevel area of the substrate is cleaned by the second cleaning surface of the first cleaning brush. Furthermore, the first bevel area of the substrate is cleaned by the third cleaning surface of the second cleaning brush, and the second bevel area of the substrate is cleaned by the fourth cleaning surface of the second cleaning brush.

Regarding the second cleaning brush, when the preset third condition is met, the contact position of the third cleaning surface in the third contact state with respect to the first bevel area is changed. Furthermore, when the preset fourth condition is met, the contact position of the fourth cleaning surface in the fourth contact state with respect to the first bevel area is changed. In this case, the first bevel area and the second bevel area can be cleaned in the uncontaminated and unworn areas of the third cleaning surface and the fourth cleaning surface. In this way, the life of the second cleaning brush can be increased, and the replacement frequency of the second cleaning brush can be reduced.

In addition, when the replacement period of one of the first and second cleaning brushes comes, the other one can be used. As a result, the downtime caused by the replacement of the first and second cleaning brushes can be greatly reduced.

(Item 10) The substrate cleaning device as described in Item 9, wherein the control unit can control the first and second driving units in the following manner: when the first cleaning surface of the first cleaning brush contacts the first angled area, the fourth cleaning surface of the second cleaning brush contacts the second angled area, and when the second cleaning surface of the first cleaning brush contacts the second angled area, the third cleaning surface of the second cleaning brush contacts the second angled area.

According to the substrate cleaning device described in item 10, the first bevel area is cleaned by one of the first and second cleaning brushes, and the second bevel area is cleaned by the other of the first and second cleaning brushes. Thus, the first bevel area and the second bevel area of the substrate are cleaned in a short time. In this case, the downtime caused by the replacement of the first and second cleaning brushes can also be fully reduced. As a result, the cleaning efficiency of multiple substrates is improved.

(Item 11) A substrate cleaning device as described in Item 9 or Item 10, wherein the control unit can control the first and second driving units as follows: when the first condition is met, the contact position of the first cleaning surface with respect to the first angled area after the change becomes a position higher than the contact position of the first cleaning surface with respect to the first angled area before the change; and when the second condition is met, the contact position of the second cleaning surface with respect to the second angled area after the change becomes a position higher than the contact position of the second cleaning surface with respect to the second angled area after the change. For the contact position of the aforementioned second angled area before the change is a higher position, when the aforementioned third condition is met, the contact position of the aforementioned third cleaning surface with respect to the aforementioned first angled area after the change becomes a position higher than the contact position of the aforementioned third cleaning surface with respect to the aforementioned first angled area before the change, and when the aforementioned fourth condition is met, the contact position of the aforementioned fourth cleaning surface with respect to the aforementioned second angled area after the change becomes a position higher than the contact position of the aforementioned fourth cleaning surface with respect to the aforementioned second angled area before the change.

In the substrate cleaning device described in item 11, even if contaminants or particles generated by wear are attached to the contact positions before the change of the first to fourth cleaning surfaces, the contaminants or particles are prevented from falling to the contact positions after the change of the first to fourth cleaning surfaces. Thus, after the contact positions of the first to fourth cleaning surfaces are changed, the contact positions after the change can be kept clean. Therefore, the first and second bevel areas of the substrate can be cleaned.

(Item 12) Another aspect of a substrate cleaning method is to clean a substrate having a main surface and an oblique angle region at the periphery of the main surface, and the substrate cleaning method includes the following steps: sequentially performing the steps of: holding and rotating one of the plurality of substrates by a substrate rotation holding portion, and bringing the inclined cleaning surface of the cleaning brush into contact with the aforementioned oblique angle region of the aforementioned one substrate by a driving portion; and controlling the aforementioned driving portion in a manner of changing the contact position of the aforementioned cleaning surface with respect to the aforementioned oblique angle region when a preset condition is met.

According to the substrate cleaning method described in Item 12, when the preset conditions are met, the contact position of the cleaning surface in contact state with respect to the bevel area is changed. In this case, the bevel area can be cleaned in an uncontaminated and unworn area of the cleaning surface. In this way, the life of the cleaning brush can be increased, thereby reducing the replacement frequency of the cleaning brush. As a result, the downtime caused by the replacement of the cleaning brush can be reduced.

10: Rotating chuck

11: Maintaining part

12: Chuck rotation drive unit

13,14: Bottom surface cleaning nozzle

15: Top surface cleaning nozzle

20: Cleaning brush

21,22: Wash your face

23: Connection surface

30: Arm

40: Arm drive unit

50: Brush rotation drive unit

60: Control Department

70: Display unit

100: Substrate cleaning device

R: Beveled part

W: Substrate

Claims (12)

A substrate cleaning device is used to clean a substrate, wherein the substrate has a first main surface and a first oblique angle region at the periphery of the first main surface, and the substrate cleaning device comprises: a substrate rotation holding portion, which holds the substrate and rotates it; a first cleaning brush, which has an inclined first cleaning surface capable of contacting the first oblique angle region of the substrate held by the substrate rotation holding portion; and a first driving portion, which is configured to change the first cleaning brush into a first contact state and a first separation state, wherein the first contact state is a state in which the first cleaning surface is in contact with the substrate held by the substrate rotation holding portion. The first separation state is that the first cleaning surface is separated from the first oblique angle area of the substrate rotated by the substrate rotation holding part; and the control part controls the first driving part by changing the contact position of the first cleaning surface with respect to the first oblique angle area in the first contact state when the preset first condition is met, and when the value of the change number of the contact position of the first cleaning surface plus 1 reaches the preset number of contact positions, it is displayed that it is the replacement period of the first cleaning brush. The substrate cleaning device of claim 1, wherein the control unit controls the first driving unit in such a manner that the contact position of the first cleaning surface with respect to the first bevel area after the change becomes a higher position than the contact position of the first cleaning surface with respect to the first bevel area before the change when the first condition is satisfied. A substrate cleaning device as claimed in claim 1 or 2, wherein the first condition includes the first factor associated with the contamination or wear of the first cleaning surface that may be caused by the contact of the first cleaning surface with the first bevel area reaching a preset value. The substrate cleaning device of claim 3, wherein the first factor includes at least one of the number of substrates cleaned by the first cleaning surface, the cleaning power of the first cleaning surface with respect to the first oblique angle area, and the cleaning time of the first cleaning surface with respect to the first oblique angle area. A substrate cleaning device as claimed in claim 4, wherein the cleaning force of the first cleaning surface on the first bevel area includes the pressing force of the first cleaning surface on the first bevel area. A substrate cleaning device as claimed in claim 1 or 2, wherein the substrate has a second main surface on the opposite side of the first main surface, and has a second bevel area at the periphery of the second main surface; and the first cleaning brush has an inclined second cleaning surface capable of contacting the second bevel area of the substrate held on the substrate rotation holding portion; the first driving portion is configured to transform the first cleaning brush into a second contact state and a second separation state, the second contact state The second cleaning surface contacts the second angled area of the substrate rotated by the substrate rotation holding part, and the second separation state is that the second cleaning surface is separated from the second angled area of the substrate rotated by the substrate rotation holding part; when the preset second condition is met, the control part controls the first driving part by changing the contact position of the second cleaning surface with respect to the second angled area in the second contact state. The substrate cleaning device of claim 6, wherein the control unit controls the first driving unit in such a manner that the contact position of the second cleaning surface with respect to the second bevel area after the change becomes a higher position than the contact position of the second cleaning surface with respect to the second bevel area before the change when the second condition is satisfied. As in claim 6, the substrate cleaning device, wherein the aforementioned second condition includes that the second factor associated with the contamination or wear of the aforementioned second cleaning surface that may be caused by the contact of the aforementioned second cleaning surface with the aforementioned second bevel area reaches a preset value. The substrate cleaning device of claim 6 further comprises: a second cleaning brush having: a third inclined cleaning surface capable of contacting the first oblique angle region of the substrate held by the substrate rotation holding portion, and a fourth inclined cleaning surface capable of contacting the second oblique angle region of the substrate held by the substrate rotation holding portion; and a second driving portion, which causes the second cleaning brush to change into a third contact state and a third separation state, wherein the third contact state is that the third cleaning surface is in contact with the first oblique angle region of the substrate rotated by the substrate rotation holding portion, and the third separation state is that the third cleaning surface is separated from the first oblique angle region of the substrate rotated by the substrate rotation holding portion; The second cleaning brush is changed into the fourth contact state and the fourth separation state, wherein the fourth contact state is that the fourth cleaning surface is in contact with the second oblique angle region of the substrate rotated by the substrate rotation holding part, and the fourth separation state is that the fourth cleaning surface is separated from the second oblique angle region of the substrate rotated by the substrate rotation holding part; and the control part controls the second driving part in the following manner: when the preset third condition is met, the contact position of the third cleaning surface with respect to the first oblique angle region in the third contact state is changed, and when the preset fourth condition is met, the contact position of the fourth cleaning surface with respect to the second oblique angle region in the fourth contact state is changed. The substrate cleaning device of claim 9, wherein the control unit controls the first and second driving units in the following manner: when the first cleaning surface of the first cleaning brush contacts the first beveled area, the fourth cleaning surface of the second cleaning brush contacts the second beveled area; when the second cleaning surface of the first cleaning brush contacts the second beveled area, the third cleaning surface of the second cleaning brush contacts the second beveled area. A substrate cleaning device as claimed in claim 9, wherein the control unit controls the first and second driving units in the following manner: when the first condition is met, the contact position of the first cleaning surface with respect to the first angled area after the change becomes a position higher than the contact position of the first cleaning surface with respect to the first angled area before the change; when the second condition is met, the contact position of the second cleaning surface with respect to the second angled area after the change becomes a position lower than the contact position of the second cleaning surface with respect to the second angled area. The contact position of the bevel area before the change is higher than the contact position of the bevel area before the change; when the aforementioned third condition is met, the contact position of the aforementioned third cleaning surface with respect to the aforementioned first bevel area after the change becomes a higher position than the contact position of the aforementioned third cleaning surface with respect to the aforementioned first bevel area before the change; when the aforementioned fourth condition is met, the contact position of the aforementioned fourth cleaning surface with respect to the aforementioned second bevel area after the change becomes a higher position than the contact position of the aforementioned fourth cleaning surface with respect to the aforementioned second bevel area before the change. A substrate cleaning method is for cleaning a substrate having a main surface and an oblique angle region at the periphery of the main surface, and the substrate cleaning method comprises the following steps: for a plurality of substrates, one of the plurality of substrates is held and rotated by a substrate rotation holding unit, and the inclined cleaning surface of a cleaning brush is brought into contact with the aforementioned oblique angle region of the aforementioned substrate by a driving unit; when a preset condition is met, the aforementioned driving unit is controlled in a manner of changing the contact position of the aforementioned cleaning surface with respect to the aforementioned oblique angle region; and when the value of the change times of the contact position of the aforementioned cleaning surface plus 1 reaches the number of preset contact positions, it is displayed that it is time to replace the aforementioned cleaning brush.