TWI870949B - Circuit testing device and method of using the same - Google Patents
Circuit testing device and method of using the same Download PDFInfo
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本發明涉及一種電路檢測裝置及其使用方法,尤其是用於串聯或並聯大量電路單元的電路檢測裝置及其使用方法。 The present invention relates to a circuit detection device and a method for using the same, in particular to a circuit detection device and a method for using the same for connecting a large number of circuit units in series or in parallel.
先前技術中,檢測電路是否具有開路(open circuit)或短路(short circuit)的方法有兩種:引腳至引腳(pin to pin)檢測方法和引腳至感測器(pin to sensor)檢測方法,其中引腳透過接觸的方式與待測電路聯繫,而感測器反之透過非接觸的方式與待測電路聯繫。若引腳接觸待測電路內部用以嵌入元件的區域,則有損害該元件區的可能性以至於降低該待測電路所製成之產品的可靠度(Reliability),因此,引腳至引腳檢測方法不適用於檢測電路內部是否具有開路之缺陷(短路係由於電源的兩端以極小電阻的元件或導線連接而造成,故短路必然可以透過放置兩引腳於兩端點的引腳至引腳測式方式來檢測);感測器須放置於待測電路所在平面的上方或下方使用,感測器的偵測點無法像引腳一樣空間上精準對應一電路端點,因此,引腳至感測器檢測方法不適用於檢測端點間電路是否具有開路或短路之缺陷。 In the prior art, there are two methods for detecting whether a circuit has an open circuit or a short circuit: a pin to pin detection method and a pin to sensor detection method, wherein the pin is connected to the circuit to be tested by contact, and the sensor is connected to the circuit to be tested by non-contact. If the pin contacts the area inside the circuit to be tested where the component is embedded, there is a possibility of damaging the component area and thus reducing the reliability of the product made from the circuit to be tested. Therefore, the pin-to-pin detection method is not applicable to detecting whether there is an open circuit defect inside the circuit (a short circuit is caused by connecting the two ends of the power supply with a component or wire with very small resistance, so the short circuit can definitely be detected by placing two pins at two ends through the pin-to-pin detection method); the sensor must be placed above or below the plane where the circuit to be tested is located. The detection point of the sensor cannot accurately correspond to a circuit end point in space like a pin. Therefore, the pin-to-sensor detection method is not applicable to detecting whether the circuit between the ends has an open circuit or short circuit defect.
近年,玻璃電路板(GCB)由於具有高導熱性、耐高溫、高平坦度以及高光傳輸率等優勢,在背光模組應用上,具有極 高價值,因此,吸引了許多企業的產能投入。檢測GCB上的電路是否無缺陷也因此成為背光模組產業發展的必需課題。 In recent years, glass circuit boards (GCBs) have high thermal conductivity, high temperature resistance, high flatness, and high light transmittance, and have extremely high value in backlight module applications. Therefore, they have attracted many companies to invest in production capacity. Therefore, testing whether the circuits on GCBs are defect-free has become a necessary issue for the development of the backlight module industry.
然而,相對於現有技術中之典型的電路板:印刷電路板(PCB)和柔性電路板(FCB),GCB的尺寸較大,用於製作背光模組時,GCB被串聯或並聯多個電路單元於其上以及每一電路單元用以嵌入至少一發光二極體(LED),其中電路單元意指電路的基本組成單位,一電路可能具有一種以上的電路單元,同一種電路單元的電路構造完全相同。以典型的GCB而言,其尺寸約750mm×620mm,電路單元的數目可高達百個以上。習知用於PCB和FCB的引腳至感測器檢測方法一次只能檢測一個電路單元,若使用習知引腳至感測器檢測方法檢測GCB的內部開路,會相當地費時跟費力。因此,開發適用於GCB的電路檢測裝置及其使用方法具有必要性。 However, compared to the typical circuit boards in the prior art: printed circuit boards (PCBs) and flexible circuit boards (FCBs), GCBs are larger in size. When used to make backlight modules, GCBs are connected in series or in parallel with multiple circuit units, and each circuit unit is used to embed at least one light-emitting diode (LED), where a circuit unit refers to the basic component unit of a circuit. A circuit may have more than one type of circuit unit, and the circuit structure of the same type of circuit unit is exactly the same. For a typical GCB, its size is about 750mm×620mm, and the number of circuit units can be as high as more than one hundred. The pin-to-sensor detection method used for PCBs and FCBs can only detect one circuit unit at a time. If the known pin-to-sensor detection method is used to detect an internal open circuit of a GCB, it will be quite time-consuming and labor-intensive. Therefore, it is necessary to develop a circuit detection device suitable for GCB and its use method.
本發明申請人鑑於習知技術中的不足,經過悉心試驗與研究,並一本鍥而不捨之精神,終構思出本發明,藉由混合兩種電路檢測方法、設置引腳與感測器於適當位置及依待測電路類型製作並使用合適的感測器種類及數目以克服先前技術的不足,以下為本發明之簡要說明。 In view of the deficiencies in the prior art, the applicant of the present invention has finally conceived the present invention after careful experiments and research, and with a spirit of perseverance. The present invention overcomes the deficiencies of the prior art by mixing two circuit detection methods, setting pins and sensors at appropriate positions, and making and using appropriate types and numbers of sensors according to the type of circuit to be tested. The following is a brief description of the present invention.
本發明的主要目的之一在於提供一種電路檢測裝置及其使用方法,以不損害元件區的前提下,檢測出全型態的電路缺陷,包括:端點間開路、端點間短路、以及內部開路,以確保使用該電路所製成之產品的品質。 One of the main purposes of the present invention is to provide a circuit detection device and its use method, so as to detect all types of circuit defects without damaging the component area, including: open circuit between terminals, short circuit between terminals, and internal open circuit, so as to ensure the quality of the product made using the circuit.
本發明的另一主要目的在於提供一種電路檢測裝置 及其使用方法,以方便檢測由串聯或並聯大量電路單元所組成的待測電路(例如:GCB上的電路)之缺陷。 Another main purpose of the present invention is to provide a circuit detection device and a method of using the same to facilitate the detection of defects in a circuit to be tested (e.g., a circuit on a GCB) composed of a large number of circuit units connected in series or in parallel.
依據上述構想,本發明提供一種電路檢測裝置,用於檢測一待測電路,其中該待測電路包括N個電路單元及M個端點,且各該N個電路單元中的一內部具有用於設置元件的一元件區,N和M分別為大於0和1的正整數。該電路檢測裝置包括:M個引腳,一對一電連接於待測電路的該M個端點上;一感測器,一對一設置於該N個電路單元的該元件區的正上方/正下方,其中各該感測器具有至少一偵測端以及各該N個電路單元的該元件區對應地具有至少一測試點且該至少一偵測點一對一與其正下方/正上方的該至少一測試點形成至少一電容;以及一電壓電阻測量儀,具有複數個開關元件並藉由切換該複數個開關元件選擇性地電連接於該M個引腳的其中之二或該M個引腳的其中之一與該N個感測器的其中之一,因而用以量測該待測電路的端點間的一電阻或跨越各該感測器與其對應的該N個電路單元所的其中之一所形成的該至少一電容的至少一電壓,以判斷該待測電路是否具有端點間開路/短路或該N個電路單元內的內部開路。 According to the above concept, the present invention provides a circuit detection device for detecting a circuit to be tested, wherein the circuit to be tested includes N circuit units and M terminals, and each of the N circuit units has a component area for setting components, and N and M are positive integers greater than 0 and 1 respectively. The circuit detection device includes: M pins, which are electrically connected to the M terminals of the circuit to be tested one by one; a sensor, which is set one by one just above/just below the component area of the N circuit units, wherein each of the sensors has at least one detection terminal and the component area of each of the N circuit units has at least one test point correspondingly, and the at least one detection point forms at least one capacitor one by one with the at least one test point just below/just above it; and a voltage resistance meter, which has a complex A plurality of switch elements are selectively electrically connected to two of the M pins or one of the M pins and one of the N sensors by switching the plurality of switch elements, so as to measure a resistance between the terminals of the circuit to be tested or at least a voltage across the at least one capacitor formed by each sensor and one of the N circuit units corresponding thereto, so as to determine whether the circuit to be tested has an open circuit/short circuit between the terminals or an internal open circuit within the N circuit units.
又依據上述構想,本發明提供一種使用上述的電路檢測裝置的方法,包括下列步驟:(a)執行至少一量測(i)及至少一量測(ii),其中該量測(i)為藉由該M個引腳的其中之二量測其對應的該端點間的該電阻,以及該量測(ii)為藉由該M個引腳的其中之一及該N個感測器的其中之一量測跨越該N個感測器的其中之一與其對應的該N個電路單元所形成的該至少一電容的該至少一電壓;(b)輸出所量測的至少一電阻值及至少一電壓值;以及(c)根據所量 測的該至少一電阻值及該至少一電壓值,判斷該M個端點間是否有端點間開路或短路,以及判斷該N個電路單元內是否有內部開路,其中:在該M個引腳的其中之二對應的該端點根據電路佈局本應相連的情況下,當其對應的該至少一電阻值中的一第一電阻值大於一第一電阻閥值時,判斷其對應的該端點間具有端點間開路;在該M個引腳的其中之二對應的該端點根據電路佈局本應斷開的情況下,當其對應的該至少一電阻值中的一第二電阻值小於一第二電阻閥值,判斷其對應的該端點間具有短路;以及當該至少一電壓值的其中之一小於一電壓閥值時,判斷其對應的該N個電路單元的其中之一內具有內部開路。 According to the above concept, the present invention provides a method for using the above circuit detection device, comprising the following steps: (a) performing at least one measurement (i) and at least one measurement (ii), wherein the measurement (i) is to measure the resistance between the corresponding terminals by two of the M pins, and the measurement (ii) is to measure the at least one voltage across the at least one capacitor formed by one of the N sensors and the corresponding N circuit units by one of the M pins and one of the N sensors; (b) outputting the measured at least one resistance value and at least one voltage value; and (c) judging whether there is a terminal between the M terminals according to the measured at least one resistance value and the measured at least one voltage value. The method comprises the steps of: determining whether the terminals of two of the M pins are open or short-circuited, and determining whether there is an internal open circuit in the N circuit units, wherein: when the terminals corresponding to two of the M pins should be connected according to the circuit layout, when a first resistance value among the at least one resistance value corresponding to the two pins is greater than a first resistance threshold value, determining that there is an open circuit between the terminals corresponding to the two pins; and determining whether there is an internal open circuit in the N circuit units. When two of the corresponding endpoints should be disconnected according to the circuit layout, when a second resistance value among the corresponding at least one resistance value is less than a second resistance threshold value, it is determined that there is a short circuit between the corresponding endpoints; and when one of the at least one voltage value is less than a voltage threshold value, it is determined that there is an internal open circuit in one of the corresponding N circuit units.
又依據上述構想,本發明提供一種電路檢測裝置,用於檢測一待測電路,其中該待測電路包括複數個電路單元及M個端點,且各該複數個電路單元中的一內部具有用於設置元件的一元件區,M為大於1的正整數。該電路檢測裝置包括:M個引腳,一對一電連接於該待測電路的該M個端點;一感測器,可移動地設置於該複數個電路單元的其中之一的該元件區的正上方或正下方,其中該感測器具有至少一偵測點以及各該N個電路單元的該元件區對應地具有至少一測試點且該至少一偵測點一對一與其正下方或正上方的該至少一測試點形成至少一電容;以及一電壓電阻測量儀,選擇性地電連接於該M個引腳的其中之二或該M個引腳的其中之一及該感測器,因而用以量測該待測電路的端點間的一電阻,或跨越該感測器與其對應的該複數個電路單元的其中之一所形成的該至少一電容的至少一電壓,以判斷該待測電路是否具有端點間開路/短路或該複數個電路單元的 其中之一內的內部開路。 According to the above concept, the present invention provides a circuit detection device for detecting a circuit to be tested, wherein the circuit to be tested includes a plurality of circuit units and M terminals, and each of the plurality of circuit units has a component area for setting components, and M is a positive integer greater than 1. The circuit detection device includes: M pins, one-to-one electrically connected to the M terminals of the circuit to be tested; a sensor, movably arranged directly above or below the component area of one of the plurality of circuit units, wherein the sensor has at least one detection point and the component area of each of the N circuit units has at least one test point correspondingly, and the at least one detection point forms at least one capacitor with the at least one test point directly below or directly above it in a one-to-one manner; and a voltage resistance meter, selectively electrically connected to two of the M pins or one of the M pins and the sensor, so as to measure a resistance between the terminals of the circuit to be tested, or at least a voltage across the at least one capacitor formed by the sensor and one of the corresponding circuit units, so as to determine whether the circuit to be tested has an open circuit/short circuit between the terminals or an internal open circuit in one of the circuit units.
又依據上述構想,本發明提供一種使用上述的電路檢測裝置的方法,包括下列步驟:(a)執行至少一量測(i)及至少一量測(ii),其中該量測(i)為藉由該M個引腳的其中之二量測其對應的該端點間的該電阻,該量測(ii)為藉由該M個引腳的其中之一及該感測器量測跨越該感測器與其對應的該複數個電路單元的其中之一所形成的該至少一電容的該至少一電壓,以及在執行該至少一量測(ii)的其中之一後,移動該感測器至該複數個電路單元中的至少一未量測電路單元的其中之一正上方或正下方以執行該至少一量測(ii)的另一者直至所有該至少一量測(ii)皆執行完;以及(b)輸出所量測的至少一電阻值及至少一電壓值;以及(c)根據所量測的該至少一電阻值及該至少一電壓值,判斷該M個端點間是否有端點間開路或短路,以及判斷該複數個電路單元內是否有內部開路,其中:在該M個引腳的其中之二對應的該端點根據電路佈局本應相連的情況下,當其對應的該至少一電阻值中的一第一電阻值大於一第一電阻閥值時,判斷其對應的該端點間具有端點間開路;在該M個引腳中的其中之二對應的該端點根據電路佈局本應斷開的情況下,當其對應的該至少一電阻值中的一第二電阻值小於一第二電阻閥值時,判斷其對應的該端點間具有短路;以及當該至少一電壓值的其中之一小於一電壓閥值時,判斷其對應的該複數個電路單元的其中之一內具有內部開路。 According to the above concept, the present invention provides a method for using the above circuit detection device, comprising the following steps: (a) performing at least one measurement (i) and at least one measurement (ii), wherein the measurement (i) is to measure the resistance between the corresponding terminals by two of the M pins, and the measurement (ii) is to measure the resistance between the sensor and the corresponding circuit single points by one of the M pins and the sensor. (a) measuring the at least one voltage of the at least one capacitor formed by one of the plurality of circuit units, and after performing one of the at least one measurement (ii), moving the sensor to directly above or directly below at least one of the plurality of circuit units that is not measured to perform another of the at least one measurement (ii) until all of the at least one measurement (ii) are completed; and (b) outputting the measured at least one resistance value and at least one voltage. voltage value; and (c) judging whether there is an open circuit or a short circuit between the M terminals and judging whether there is an internal open circuit in the plurality of circuit units according to the measured at least one resistance value and the at least one voltage value, wherein: when the terminals corresponding to two of the M pins should be connected according to the circuit layout, when a first resistance value of the at least one resistance value corresponding to the two of the M pins is greater than a first resistance threshold value, judging whether the terminals corresponding to the two of the M pins are open circuit or a short circuit between the M terminals and the plurality of circuit units. There is an open circuit between the terminals; when the terminals corresponding to two of the M pins should be disconnected according to the circuit layout, when a second resistance value of the at least one resistance value corresponding to it is less than a second resistance threshold value, it is judged that there is a short circuit between the corresponding terminals; and when one of the at least one voltage value is less than a voltage threshold value, it is judged that there is an internal open circuit in one of the corresponding plurality of circuit units.
又依據上述構想,本發明提供一種電路檢測裝置,用於檢測一待測電路,其中該待測電路包括複數個端點及用於設置元件的一元件區。該電路檢測裝置包括:一引腳式檢測單元, 用以檢測該複數個端點中兩點間之一第一導電狀態;以及一感應式檢測單元,用以檢測該複數個端點其中之一及該元件區之一測試點兩點間之一第二導電狀態。 According to the above concept, the present invention provides a circuit detection device for detecting a circuit to be tested, wherein the circuit to be tested includes a plurality of terminals and a component area for setting components. The circuit detection device includes: a pin-type detection unit, used to detect a first conductive state between two points of the plurality of terminals; and an inductive detection unit, used to detect a second conductive state between one of the plurality of terminals and a test point of the component area.
因此,本發明提供一種電路檢測裝置及其使用方法,解決了習知技術中的引腳至引腳檢測方法和引腳至感測器檢測方法無法檢測全型態電路缺陷以及不適用於GCB之問題。 Therefore, the present invention provides a circuit detection device and a method of using the same, which solves the problem that the pin-to-pin detection method and the pin-to-sensor detection method in the prior art cannot detect all types of circuit defects and are not applicable to GCB.
100:電路檢測裝置 100: Circuit testing device
10、11:引腳 10, 11: Pins
12:感測器 12: Sensor
13:電壓電阻測量儀 13: Voltage resistance meter
2:待測電路 2: Circuit to be tested
2’:電路佈局 2’: Circuit layout
20:端點間開路 20: Open circuit between terminals
21:內部開路 21: Internal open circuit
22:短路 22: Short circuit
23:端點 23: Endpoint
24:端點 24: Endpoint
25:端點 25: Endpoint
26:端點 26: Endpoint
27:端點 27: Endpoint
28:端點 28: Endpoint
29:端點 29: Endpoint
3A、3B、3C:連接線 3A, 3B, 3C: connecting wires
200:電路檢測裝置 200: Circuit testing device
10S、11S:引腳 10S, 11S: Pins
10S1:引腳 10S1: Pins
10S2:引腳 10S2: Pins
11S1:引腳 11S1: Pins
300:電路檢測裝置 300: Circuit testing device
10F、11F:引腳 10F, 11F: Pins
2F:待測電路 2F: Circuit to be tested
2F1:電路單元 2F1: Circuit unit
2F2:電路單元 2F2: Circuit unit
2F3:電路單元 2F3: Circuit unit
2F4:電路單元 2F4: Circuit unit
2F5:邊緣 2F5: Edge
2F6:邊緣 2F6: Edge
400:電路檢測裝置 400: Circuit testing device
10L、11L:引腳 10L, 11L: Pins
12A:偵測點 12A: Detection point
12L:感測器 12L:Sensor
12L1:第一感測器 12L1: First sensor
12L2:第二感測器 12L2: Second sensor
2L:待測電路 2L: Circuit to be tested
2L1:電路單元 2L1: Circuit unit
2L2:電路單元 2L2: Circuit unit
500:電路檢測裝置 500: Circuit testing device
500A:組合體 500A: Combination
600:電路檢測裝置 600: Circuit testing device
600A:組合體 600A: Combination
10G、11G:引腳 10G, 11G: Pins
12G:感測器 12G:Sensor
2G:待測電路 2G: Circuit under test
4A:組合體 4A: Combination
4:結構件 4: Structural parts
41:頂面 41: Top
42:背面 42: Back
43:連接器 43: Connector
5:電路板 5: Circuit board
6:置放平台 6: Placement platform
61:凹槽 61: Groove
本發明的上述目的及優點在參閱以下詳細說明及附隨圖式之後對那些所屬技術領域中具有通常知識者將變得更立即地顯而易見。 The above-mentioned objects and advantages of the present invention will become more immediately apparent to those having ordinary knowledge in the relevant technical field after referring to the following detailed description and the accompanying drawings.
圖1A:是本發明構想的第一較佳實施例之電路檢測裝置第一使用狀態的示意圖; Figure 1A: is a schematic diagram of the first use state of the circuit detection device of the first preferred embodiment of the present invention;
圖1B:是本發明構想的第一較佳實施例之電路檢測裝置第二使用狀態的示意圖; Figure 1B: is a schematic diagram of the second use state of the circuit detection device of the first preferred embodiment of the present invention;
圖2:是圖1A或圖1B中的待測電路之相應電路佈局的示意圖; Figure 2: is a schematic diagram of the corresponding circuit layout of the circuit to be tested in Figure 1A or Figure 1B;
圖3:是本發明構想的第二較佳實施例之電路檢測裝置的示意圖; Figure 3: is a schematic diagram of the circuit detection device of the second preferred embodiment of the present invention;
圖4A:是本發明構想的第三較佳實施例之電路檢測裝置第一使用狀態的示意圖; Figure 4A: is a schematic diagram of the first use state of the circuit detection device of the third preferred embodiment of the present invention;
圖4B:是本發明構想的第三較佳實施例之電路檢測裝置第二使用狀態的示意圖; Figure 4B: is a schematic diagram of the second use state of the circuit detection device of the third preferred embodiment of the present invention;
圖5:是本發明構想的第四較佳實施例之電路檢測裝置的示意圖; Figure 5: is a schematic diagram of the circuit detection device of the fourth preferred embodiment of the present invention;
圖6:是本發明構想的第五及六較佳實施例之電路檢測裝置的立體分解圖; Figure 6: is a three-dimensional exploded view of the circuit detection device of the fifth and sixth preferred embodiments of the present invention;
圖7:是本發明構想的第五及六較佳實施例之電路檢測裝置的結構件的立體圖; Figure 7: is a three-dimensional diagram of the structural components of the circuit detection device of the fifth and sixth preferred embodiments of the present invention;
圖8:是本發明構想的第五較佳實施例之電路檢測裝置的感測器組裝方式示意圖; Figure 8: is a schematic diagram of the sensor assembly method of the circuit detection device of the fifth preferred embodiment of the present invention;
圖9:是本發明構想的第五較佳實施例之電路檢測裝置的立體圖; Figure 9: is a three-dimensional diagram of the circuit detection device of the fifth preferred embodiment of the present invention;
圖10:是本發明構想的第五較佳實施例之電路檢測裝置的前視圖; Figure 10: is a front view of the circuit detection device of the fifth preferred embodiment of the present invention;
圖11:是本發明構想的第六較佳實施例之電路檢測裝置的感測器組裝方式的示意圖; Figure 11: is a schematic diagram of the sensor assembly method of the circuit detection device of the sixth preferred embodiment of the present invention;
圖12:是本發明構想的第六較佳實施例之電路檢測裝置的立體圖; Figure 12: is a three-dimensional diagram of the circuit detection device of the sixth preferred embodiment of the present invention;
圖13:是本發明構想的第六較佳實施例之電路檢測裝置的前視圖; Figure 13: is a front view of the circuit detection device of the sixth preferred embodiment of the present invention;
本案所提出的發明將可由以下的實施例說明而得到充分瞭解,使得所屬技術領域中具有通常知識者可以據以完成,然而本案的實施並非可由下列實施例而被限制其實施型態,所屬技術領域中具有通常知識者仍可依據除既揭露的實施例的精神推演出其他實施例,該等實施例皆當屬於本發明的範圍。 The invention proposed in this case can be fully understood by the following embodiments, so that those with ordinary knowledge in the relevant technical field can complete it accordingly. However, the implementation of this case is not limited by the following embodiments. Those with ordinary knowledge in the relevant technical field can still deduce other embodiments based on the spirit of the disclosed embodiments, and these embodiments should all belong to the scope of this invention.
請參閱圖1A及圖1B,其是本發明構想的第一較佳實施例之電路檢測裝置100的第一及第二使用狀態的示意圖。如圖1A
及圖1B所示,本發明的電路檢測裝置100包括:二引腳10、11、感測器12以及電壓電阻測量儀13,其中感測器12具有至少一偵測點(圖未示出)以及電壓電阻測量儀13包括一電壓計及一電阻計(圖未示出)。進一步地,二引腳10、11及電阻計組合成一引腳式檢測單元;以及引腳10或引腳11、感測器12及電壓計組合成一感應式檢測單元,該引腳式檢測單元及該感應式檢測單元共用一引腳。電路缺陷的界定係根據製造商的電路佈局(circuit layout)。於電路佈局中,不應存在的電路斷開之不導電狀態即為開路,及不應存在的電路連接之導電狀態即為短路。因此,對於一待測電路,其包括複數個端點及用於設置元件的一元件區,當使用電路檢測裝置100檢測該待測電路時候,引腳式檢測單元用以檢測該複數個端點中兩點間之一第一導電狀態;以及感應式檢測單元用以檢測該複數個端點其中之一及該元件區之一測試點兩點間之一第二導電狀態以判斷該待測電路的開短路。實施本發明的電路檢測裝置100的方式詳述如下。舉例而言,使用電路檢測裝置100檢測待測電路2,其中如圖1A所示,待測電路2包括一單一電路單元及七個端點:端點23、端點24、端點25、端點26、端點27、端點28及端點29(用於輸入或輸出訊號的兩平行邊緣上的電路末端)和三個缺陷:端點間開路20、內部開路21及短路22。將端點間開路20、內部開路21及短路22移除,可獲得待測電路2的相應電路佈局,即圖2所示的電路佈局2’。
Please refer to FIG. 1A and FIG. 1B, which are schematic diagrams of the first and second use states of the circuit detection device 100 of the first preferred embodiment of the present invention. As shown in FIG. 1A
and FIG. 1B, the circuit detection device 100 of the present invention includes: two pins 10, 11, a
在圖1A中,使用引腳10及引腳11分別接觸端點23及端點24以檢測端點間開路20。圖1A所示設置會在引腳10與端點23之間以及引腳11與端點24之間形成電連接。此外,引腳10、引腳11和感測器12分別透過線材3A、3B、3C或打開電相通可能性的任
何方式與電壓電阻測量儀13連接。進一步地,電壓電阻測量儀13具有複數個開關元件選擇性地電連接於引腳10及引腳11或引腳10及感測器12。當電壓電阻測量儀13切換複數個開關元件以電連接引腳10與引腳11的時候,電壓電阻測量儀13以其電阻計量測端點23與端點24間的電阻並根據電阻值判斷端點23與端點24間是否開路(於圖2所示電路佈局2’中,端點23跟端點24本應相連,故判斷其間開路):若所量測電阻值高達10MΩ(單位MΩ:兆歐姆)則判斷為開路。就此實施例而言,待測電路2在端點23與端點24間具有端點間開路20,故在如圖1A所示的第一使用狀態下可量測到高達10MΩ的電阻值。
In FIG. 1A , pins 10 and 11 are used to contact terminals 23 and 24, respectively, to detect an open circuit 20 between the terminals. The arrangement shown in FIG. 1A forms an electrical connection between pins 10 and terminals 23 and between pins 11 and terminals 24. In addition, pins 10, 11, and
圖1B所示第二使用狀態與圖1A所示第一使用狀態的差異在於:圖1B使用引腳10及引腳11分別接觸端點23及端點26以檢測短路22。圖1B所示設置會在引腳10與端點23之間以及引腳11與端點26之間形成電連接。當電壓電阻測量儀13切換複數個開關元件以電連接於引腳10及引腳11的時候,電壓電阻測量儀13以其電阻計量測端點23與端點26間的電阻並根據電阻值判斷端點23與端點26間是否短路(於圖2所示電路佈局2’中,端點23跟端點26本應斷開,故判斷其間短路):若所量測電阻值低至100Ω(單位Ω:歐姆)則判斷為短路。就此實施例而言,待測電路2在端點23與端點26間具有短路22,故在如圖1B所示的第二使用狀態下可量測到低至100Ω的電阻值。
The difference between the second use state shown in FIG1B and the first use state shown in FIG1A is that FIG1B uses pins 10 and 11 to contact terminals 23 and 26 respectively to detect short circuit 22. The arrangement shown in FIG1B forms electrical connections between pins 10 and terminals 23 and between pins 11 and terminals 26. When the
進一步地,可將二引腳接觸其他端點:端點24、端點25、端點27、端點28及端點29的其中之二以檢測所接觸端點間的電路是否處於正常狀態(即沒有端點間電路缺陷):若根據圖2所 示電路佈局2’,所接觸端點本應相連,則檢測端點間開路;以及若根據圖2所示電路佈局2’,所接觸端點本應斷開,則檢測短路。舉例而言,根據圖2所示電路佈局2’,端點24與端點25本應斷開,故檢測短路,若電阻值數量級為10MΩ,其間電路為正常狀態;以及若電阻值低至100Ω,其間電路具有短路。待測電路2在端點24與端點25間為正常狀態,故可量測到數量級為10MΩ的電阻值。舉例而言,根據圖2所示電路佈局2’,端點28與端點29本應相連,故檢測端點間開路,若電阻值數量級為100Ω,其間電路為正常狀態;以及若電阻值高達10MΩ,其間電路具有端點間開路。待測電路2在端點28與端點29間為正常狀態,故可量測到數量級為100Ω的電阻值。 Furthermore, the two pins can be contacted to other terminals: two of the terminals 24, 25, 27, 28 and 29 to detect whether the circuit between the contacted terminals is in a normal state (i.e., there is no circuit defect between the terminals): if the contacted terminals should be connected according to the circuit layout 2' shown in FIG2, an open circuit between the terminals is detected; and if the contacted terminals should be disconnected according to the circuit layout 2' shown in FIG2, a short circuit is detected. For example, according to the circuit layout 2' shown in FIG2, the terminals 24 and 25 should be disconnected, so a short circuit is detected. If the resistance value is in the order of 10MΩ, the circuit between them is in a normal state; and if the resistance value is as low as 100Ω, the circuit between them has a short circuit. The circuit 2 to be tested is in a normal state between terminal 24 and terminal 25, so a resistance value of the order of 10MΩ can be measured. For example, according to the circuit layout 2' shown in Figure 2, terminal 28 and terminal 29 should be connected, so the open circuit between the terminals is detected. If the resistance value is in the order of 100Ω, the circuit is in a normal state; and if the resistance value is as high as 10MΩ, the circuit has an open circuit between the terminals. The circuit 2 to be tested is in a normal state between terminal 28 and terminal 29, so a resistance value of the order of 100Ω can be measured.
另一方面,無論在二引腳接觸哪二端點的狀態下,皆以非接觸方式配置感測器12於待測電路2內部用以設置元件的元件區正上方/下方以檢測內部開路21。因感測器12非直接接觸待測電路2,故以虛線表示。如圖1A或圖1B所示,感測器12投影至正下方/正上方待測電路2的區域(也就是虛線框起來的區域)為元件區。檢測員可以根據製造商的電路佈局及基於維護電路所製成之產品的品質,就其知識判斷有必要檢測的電路內部區域範圍來界定元件區。當無法簡單判斷必要檢測的電路內部區域範圍的時候,亦可直接使用一電路單元的完整面積作為一元件區。相應於感測器12的至少一偵測點,元件區具有至少一測試點,該至少一測試點一對一位於該至少一偵測點正下方或正上方。該至少一偵測點一對一與其正下方或正下方的該至少一測試點形成至少一電容。無論是在二引腳接觸哪二端點的狀態下,當電壓電阻測量儀13切換複數個開
關元件以電連接於引腳10或引腳11與感測器12的時候,電壓電阻測量儀13以其電壓計量測跨越上述至少一電容的至少一電壓並根據至少一電壓值判斷單一電路單元內是否開路:若所量測至少一電壓值其中之一小於一電壓閥值(例如:常規使用0.2V,其中單位V為伏特)則判斷為開路,反之,則判斷為正常狀態。就此實施例而言,待測電路2在其單一電路單元內具有內部開路21,故可量測到小於0.2V的電壓值。
On the other hand, regardless of which two terminals the two pins are in contact with, the
此外,對於具有複數個電路單元的待測電路,本發明的電路檢測裝置100可藉著移動二引腳10、11跟感測器12的位置至欲檢測的電路單元並使用上述單一電路單元之檢測方式檢測欲檢測的電路單元,如此檢測完待測電路的每一個電路單元以判斷待測電路的開短路。
In addition, for a circuit to be tested having multiple circuit units, the circuit testing device 100 of the present invention can detect the circuit unit to be tested by moving the two pins 10, 11 and the
請參閱圖3,其是本發明構想的第二較佳實施例之電路檢測裝置200的示意圖。此實施例與上述第一較佳實施例的差異在於:此實施例使用M個引腳10S、11S固定於待測電路2的M個端點上。如圖3所示,本發明的電路檢測裝置200包括:M個引腳10S、11S、感測器12以及電壓電阻測量儀13。相似於第一較佳實施例中的電路檢測裝置100,就功用定義,電路檢測裝置200可視為包括一引腳式檢測單元以及一感應式檢測單元,其中引腳式檢測單元用以檢測待測電路端點間之一第一導電狀態;以及感應式檢測單元用以檢測待測電路一端點及該元件區之一測試點間之一第二導電狀態(本文通篇的引腳式檢測單元、感應式檢測單元皆以此相同方式定義)。故對於電路檢測裝置200,相應的引腳式檢測單元包括M個引腳10S、11S及電壓電阻測量儀13中的電阻計;以及相應的
感應式檢測單元包括M個引腳10S、11S其中之一、感測器12及電壓電阻測量儀13中的電壓計,其中引腳式檢測單元及感應式檢測單元共用一引腳。
Please refer to FIG. 3, which is a schematic diagram of a circuit testing device 200 of the second preferred embodiment of the present invention. The difference between this embodiment and the first preferred embodiment is that this embodiment uses M pins 10S, 11S to be fixed on M terminals of the circuit 2 to be tested. As shown in FIG. 3, the circuit testing device 200 of the present invention includes: M pins 10S, 11S, a
在圖3中,M個引腳10S、11S一對一電連接於待測電路2的M個端點以及感測器12以非接觸方式設置於待測電路2的元件區的正上方或正下方(虛線所框起來的區域為元件區),且各M個引腳10S、11S和感測器12透過線材(圖未示出)或打開電相通可能性的任何方式與電壓電阻測量儀13連接。電壓電阻測量儀13可藉著切換其複數個開關元件電連接於M個引腳10S、11S的其中之二以使用與前述實施例之相同方法判斷待測電路2是否具有端點間開路或短路。舉例而言,電壓電阻測量儀13切換複數個開關元件以電連接於引腳10S1及引腳11S1並量測端點23與端點24間的電阻且進一步根據電阻值判斷端點23與端點24間是否開路:若所量測電阻值高達10MΩ則判斷為開路。舉例而言,電壓電阻測量儀13切換複數個開關元件以電連接於引腳10S1及引腳10S2並量測端點23與端點26間的電阻且進一步根據電阻值判斷端點23與端點26間是否短路:若所量測電阻值低至100Ω則判斷為短路。電壓電阻測量儀13可藉著切換其複數個開關元件電連接於M個引腳10S、11S的其中之一及感測器12以使用與前述實施例之相同方法判斷待測電路2是否具有內部開路。舉例而言,電壓電阻測量儀13切換複數個開關元件以電連接於第一引腳10S1及感測器12並量測跨越感測器12的偵測點12A及其正下方/正上方相應測試點的電壓且進一步根據電壓值判斷單一電路單元內是否開路:若所量測電壓值小於0.2V則判斷為開路。若感測器具有其他偵測點,相應於其它偵測
點的電壓亦須被量測,在此,為簡潔起見,僅以偵測點12A為例做說明(同於前述實施例,若感測器12具有至少一偵測點,則單一電路單元的元件區對應地具有至少一測試點)。偵測點12A正下方的測試點與端點23間具有內部開路21,故可量測到小於0.2V的電壓。電路檢測裝置200與電路檢測裝置100使用方法的差異在於:電路檢測裝置200完全由電壓電阻測量儀13切換複數個開關元件來變動所欲檢測端點,省略掉移動引腳之步驟。
In FIG3 , M pins 10S, 11S are electrically connected to M terminals of the circuit 2 to be tested one by one, and the
請參閱圖4A及圖4B,其是本發明構想的第三較佳實施例之電路檢測裝置300第一及第二使用狀態的示意圖。此實施例與上述第二較佳實施例的主要差異在於:電路檢測裝置300被用於檢測具有複數個電路單元的待測電路2F,該複數個電路單元包括電路單元2F1、電路單元2F2、電路單元2F3及電路單元2F4。圖4A及圖4B中的待測電路2F用於輸入或輸出訊號的兩邊平行緣:邊緣2F5及邊緣2F6總共具有M個端點(圖未示出),也就是,電路單元2F1、電路單元2F2、電路單元2F3及電路單元2F4在邊緣2F5及邊緣2F6的端點數目加起來為M。而用於檢測待測電路2F的電路檢測裝置300包括:M個引腳10F、11F、感測器12以及電壓電阻測量儀(圖未示出)。M個引腳10F、11F一對一電連接於待測電路2F的M個端點。感測器12可移動地設置於複數個電路單元的其中之一的元件區正上方或正下方。在此,為簡潔起見,僅以正上方為例說明,然而,只要將圖2A及圖2B所示設置轉動180度即為正下方之實施方式,故方位不能理解為對本發明的電路檢測裝置300之限制。此外,同於第二實施例,於此實施例中,電壓電阻量測儀13透過線材或打開電相通可能性的任何方式與M個引腳10F、11F及
感測器12連接。電壓電阻測量儀13可藉著切換複數個開關元件電連接於M個引腳10F、11F的其中之二以使用與前述實施例之相同方法判斷待測電路2F是否具有端點間開路或短路。電壓電阻測量儀13可藉著切換其複數個開關元件電連接於M個引腳10F、11F的其中之一及感測器12以使用與前述實施例之相同方法判斷感測器12正下方的電路單元是否具有內部開路。舉例而言,如圖2A所示,感測器12配置於電路單元2F1正上方,電壓電阻測量13切換複數個開關元件以電連接於M個引腳10F、11F的其中之一及感測器12並量測跨越感測器12的至少一偵測點與電路單元2F1的元件區的至少一測試點所形成的至少一電容之至少一電壓且進一步根據至少一電壓值判斷電路單元2F1內是否開路:若所量測的至少一電壓值的其中之一小於0.2V則判斷電路單元2F1內具有內部開路。舉例而言,如圖2B所示,感測器12配置於電路單元2F2正上方,電壓電阻測量儀13切換複數個開關元件以電連接於M個引腳10F、11F的其中之一及感測器12並量測跨越感測器12的至少一偵測點與電路單元2F2的元件區的至少一測試點所形成的至少一電容之至少一電壓且進一步根據至少一電壓值判斷電路單元2F2內是否開路:若所量測的至少一電壓值的其中之一小於0.2V則判斷電路單元2F2內具有內部開路。接著,再將感測器移至電路單元2F3及電路單元2F4上方,以與電路單元2F1及電路單元2F2相同方式檢測電路單元2F3及電路單元2F4以判斷電路單元2F3及電路單元2F4是否具有內部開路,如此檢測完所有電路單元。若需要詳細分析待測電路的導電情況,可於所有量測執行完後,輸出所量測的電阻值及電壓值,再根據這些值判斷是否具有開短路及其他導電狀態,例如:開短路空
間分布。
Please refer to FIG. 4A and FIG. 4B, which are schematic diagrams of the first and second use states of the
根據上述第二實施例及第三實施例,一種使用電路檢測裝置的方法,包括下列步驟:(a)執行至少一量測(i)及至少一量測(ii),其中:該量測(i)為藉由該M個引腳的其中之二量測其對應的該端點間的該電阻;該量測(ii)為藉由該M個引腳的其中之一及該感測器量測跨越該感測器與其對應的該複數個電路單元的其中之一所形成的該至少一電容的該至少一電壓;以及在執行該至少一量測(ii)的其中之一後,移動該感測器至該複數個電路單元中的至少一未量測電路單元的其中之一正上方或正下方以執行該至少一量測(ii)的另一者直至所有該至少一量測(ii)皆執行完;以及(b)輸出所量測的至少一電阻值及至少一電壓值;以及(c)根據所量測的該至少一電阻值及該至少一電壓值,判斷該M個端點間是否有端點間開路或短路,以及判斷該複數個電路單元內是否有內部開路,其中:在該M個引腳的其中之二對應的該端點根據電路佈局本應相連的情況下,當其對應的該至少一電阻值中的一第一電阻值大於一第一電阻閥值時,判斷其對應的該端點間具有端點間開路;在該M個引腳中的其中之二對應的該端點根據電路佈局本應斷開的情況下,當其對應的該至少一電阻值中的一第二電阻值小於一第二電阻閥值時,判斷其對應的該端點間具有短路;以及當該至少一電壓值的其中之一小於一電壓閥值時,判斷其對應的該複數個電路單元的其中之一內具有內部開路。 According to the second and third embodiments, a method for using a circuit detection device comprises the following steps: (a) performing at least one measurement (i) and at least one measurement (ii), wherein: the measurement (i) is to measure the resistance between the corresponding terminals by two of the M pins; the measurement (ii) is to measure the resistance between the sensor and the corresponding circuits by one of the M pins and the sensor. (a) measuring the at least one voltage of the at least one capacitor formed by one of the at least one measurement unit; and after performing one of the at least one measurement (ii), moving the sensor to directly above or directly below at least one of the unmeasured circuit units in the plurality of circuit units to perform another of the at least one measurement (ii) until all of the at least one measurement (ii) are completed; and (b) outputting the measured at least one resistance value and at least one voltage value; and (c) judging whether there is an open circuit or a short circuit between the M terminals and judging whether there is an internal open circuit in the plurality of circuit units according to the measured at least one resistance value and the at least one voltage value, wherein: when the terminals corresponding to two of the M pins should be connected according to the circuit layout, when a first resistance value of the at least one resistance value corresponding to the two of the M pins is greater than a first resistance threshold value, judging whether the terminals corresponding to the two of the M pins are open circuit or short circuit. There is an open circuit between the terminals; when the terminals corresponding to two of the M pins should be disconnected according to the circuit layout, when a second resistance value of the at least one resistance value corresponding to it is less than a second resistance threshold value, it is judged that there is a short circuit between the corresponding terminals; and when one of the at least one voltage value is less than a voltage threshold value, it is judged that there is an internal open circuit in one of the corresponding plurality of circuit units.
請參閱第5圖,其是本發明構想的第四較佳實施例之電路檢測裝置400的示意圖。此實施例與上述第三較佳實施例的主要差異在於:此實施例使用N個感測器12L固定於具有N個電路單
元的待測電路2L正上方或正下方(此後,僅以正上方為例說明,然而,同第三實施例,方位不能理解為對本發明的電路檢測裝置400之限制)。如圖5所示,本發明的電路檢測裝置400包括:M個引腳10L、11L、N個感測器12L以及電壓電阻測量儀(圖未示出)。相應地,對於電路檢測裝置400,引腳式檢測單元包括M個引腳10L、11L及電壓電阻測量儀13中的電阻計;以及感應式檢測單元包括M個引腳10L、11L其中之一、N個感測器12L及電壓電阻測量儀13中的電壓計,其中引腳式檢測單元及感應式檢測單元共用一引腳。此外,若待測電路2L具有複數種電路單元,則所使用的N個感測器12L對應地也須具有複數種感測器。如圖5所示,待測電路2L具有兩種電路單元:其N個電路單元可分成N-1個第一電路單元2L1及一第二電路單元2L2;N個感測器12L對應地分成N-1個第一感測器12L1及一第二感測器12L2;以及N-1個第一感測器12L1一對一設置於N-1個第一電路單元2L1的元件區正上方及第二感測器12L2設置於第二電路單元2L2的元件區正上方。
Please refer to FIG. 5, which is a schematic diagram of a
在圖5中,M個引腳10L、11L一對一電連接於待測電路2L的M個端點;N個感測器12L,一對一設置於複數個電路單元的元件區正上方;以及電壓電阻量測儀透過線材或打開電相通可能性的任何方式與M個引腳10L、11L及N個感測器12L連接。電壓電阻測量儀13可藉著切換複數個開關元件電連接於M個引腳10L、11L的其中之二以使用與前述實施例之相同方法判斷待測電路2L是否具有端點間開路或短路。電壓電阻測量儀可藉著切換其複數個開關元件電連接於M個引腳10L、11L的其中之一及N個感測器12L其中之一以使用與前述實施例之相同方法判斷N個電路單元內是否具
有內部開路。舉例而言,電壓電阻測量13切換複數個開關元件以電連接於M個引腳10L、11L的其中之一及第二感測器12L2並量測跨越第二感測器12L2的至少一偵測點與第二電路單元2L2的元件區的至少一測試點所形成的至少一電容之至少一電壓且進一步根據至少一電壓值判斷第二電路單元2L2內是否開路:若所量測的至少一電壓值的其中之一小於0.2V則判斷第二電路單元2L2內具有內部開路。接著,電壓電阻測量儀切換複數個開關元件以逐一電連接於N-1個第一感測器並以與第二電路單元2L2相同方式逐一判斷N-1個第一電路單元2L1是否具有內部開路。電路檢測裝置400與電路檢測裝置300使用方法的差異在於:電路檢測裝置400完全由電壓電阻測量儀切換複數個開關元件來變動所欲檢測電路單元,省略掉移動感測器之步驟。若需要詳細分析待測電路的導電情況,可於所有量測執行完後,輸出所量測的電阻值及電壓值,再根據這些值判斷是否具有開短路及其他導電狀態,例如:開短路空間分布。
In FIG5 , M pins 10L and 11L are electrically connected to M terminals of the
根據上述第四實施例,一種使用電路檢測裝置的方法,包括下列步驟:(a)執行至少一量測(i)及至少一量測(ii),其中:該量測儀(i)為藉由該M個引腳的其中之二量測其對應的該端點間的該電阻;以及該量測(ii)為藉由該M個引腳的其中之一及該N個感測器的其中之一量測跨越該N個感測器的其中之一與其對應的該N個電路單元所形成的該至少一電容的該至少一電壓;(b)輸出所量測的至少一電阻值及至少一電壓值;以及(c)根據所量測的該至少一電阻值及該至少一電壓值,判斷該M個端點間是否有端點間開路或短路,以及判斷該N個電路單元內是否有內部開路,其中:在該M個引腳的其中之二對應的該端點根據電路佈局本應相連的情 況下,當其對應的該至少一電阻值中的一第一電阻值大於一第一電阻閥值時,判斷其對應的該端點間具有端點間開路;在該M個引腳的其中之二對應的該端點根據電路佈局本應斷開的情況下,當其對應的該至少一電阻值中的一第二電阻值小於一第二電阻閥值,判斷其對應的該端點間具有短路;以及當該至少一電壓值的其中之一小於一電壓閥值時,判斷其對應的該N個電路單元的其中之一內具有內部開路。 According to the fourth embodiment, a method for using a circuit detection device includes the following steps: (a) performing at least one measurement (i) and at least one measurement (ii), wherein: the measuring device (i) measures the resistance between the corresponding terminals through two of the M pins; and the measurement (ii) measures the at least one voltage across the at least one capacitor formed by one of the N sensors and the corresponding N circuit units through one of the M pins and one of the N sensors; (b) outputting the measured at least one resistance value and at least one voltage value; and (c) judging whether there is an open circuit between the M terminals based on the measured at least one resistance value and the measured at least one voltage value. The method comprises the steps of: determining whether the terminals corresponding to two of the M pins are connected according to the circuit layout, and determining whether there is an internal open circuit between the terminals; determining whether there is an open circuit between the terminals when a first resistance value among the at least one resistance value corresponding to the two of the M pins is greater than a first resistance threshold value; and determining whether there is an internal open circuit between the terminals when a first resistance value among the at least one resistance value corresponding to the two of the M pins is greater than a first resistance threshold value. When the two corresponding endpoints should be disconnected according to the circuit layout, when a second resistance value among the corresponding at least one resistance value is less than a second resistance threshold value, it is determined that there is a short circuit between the corresponding endpoints; and when one of the at least one voltage value is less than a voltage threshold value, it is determined that there is an internal open circuit in one of the corresponding N circuit units.
根據上述所有實施例,當待測電路的端點及電路單元數目皆不多的時候,使用電路檢測裝置100以節省裝置製作成本;當待測電路的端點數目多至一定量(約幾十個以上)的時候,使用電路裝置200或電路裝置300以節省檢測時間及勞力;當待測電路的電路單元也多至一定量(約幾十個以上)的時候,使用電路裝置400以節省檢測時間及勞力具有必要性。典型的GCB具有百個以上的電路單元,本發明電路裝置400可解決先前技術檢測GCB的困難性。
According to all the above embodiments, when the number of terminals and circuit units of the circuit to be tested is small, the circuit detection device 100 is used to save the device manufacturing cost; when the number of terminals of the circuit to be tested reaches a certain amount (about dozens or more), the circuit device 200 or the
請參閱圖6,其是本發明構想的第五及六較佳實施例之電路檢測裝置的立體分解圖。此兩實施例與上述第二較佳實施例的主要差異在於:第五及六較佳實施例之電路檢測裝置更包括一結構件4及一置放平台6。如圖6所示,本發明的第五及六較佳實施例之電路檢測裝置包括:M個引腳10G、11G、一結構件4、N個感測器12G、電壓電阻測量儀13以及一置放平台6,其中M個引腳10G、11G被固定於結構件4的頂面41上而形成組合體4A、置放平台6包括一凹槽61以及N個感測器12G可以被製作於同一塊電路板5上。此外,結構件4的背面42可以具有連接器43(如圖7所示),用
以插上線材以跟電壓電阻測量儀13連接。第五較佳實施例與第六實施例的主要差異所在是組裝方式不同以至於N個感測器12G與待測電路相對位置不同,詳情如下。
Please refer to FIG. 6, which is a three-dimensional exploded view of the circuit detection device of the fifth and sixth preferred embodiments of the present invention. The main difference between these two embodiments and the second preferred embodiment is that the circuit detection device of the fifth and sixth preferred embodiments further includes a
請參閱圖8、圖9以及圖10,其分別是本發明構想的第五較佳實施例之電路檢測裝置的感測器組裝方式示意圖、立體圖以及前視圖。如圖8所示,N個感測器12G被固定於結構件4的頂面41上未被M個引腳10G、11G佔據的區域而形成組合體500A。如圖9所示,電路檢測裝置500包括一組合體500A以及一置放平台6。於電路檢測裝置500中,組合體500A以使結構件4的頂面41朝下的方式放置於置放平台6上方而組合體500A與置放平台6間的空間用以放置待測電路2G。於此設置下,如圖10所示,待測電路2G放置於置放平台6上,結構件4上的N個感測器12G位於待測電路2G上方以及結構件4上的引腳10G、11G接觸待測電路2G端點。
Please refer to FIG8, FIG9 and FIG10, which are respectively a schematic diagram, a three-dimensional diagram and a front view of the sensor assembly method of the circuit detection device of the fifth preferred embodiment of the present invention. As shown in FIG8,
請參閱圖11、圖12以及圖13,其分別是本發明構想的第六較佳實施例之電路檢測裝置的感測器組裝方式示意圖、立體圖以及前視圖。如圖11所示,N個感測器12G被放置於置放平台6的凹槽61內而形成組合體600A。如圖12所示,電路檢測裝置600包括一組合體600A以及具有結構件4及M個引腳10G、11G(圖未示出)的一組合體4A。於電路檢測裝置600中,組合體4A放置於組合體600A上方,其中組合體4A的結構件4的背面42朝上以及組合體600A的N個感測器朝上,而組合體4A與組合體600A間的空間用以放置待測電路2G。於此設置下,如圖13所示,待測電路2G放置於置放平台6上,凹槽61內的N個感測器12G位於待測電路2G下方以及結構件4上的M個引腳10G、11G接觸待測電路2G端點。
Please refer to Figures 11, 12 and 13, which are respectively a schematic diagram, a three-dimensional diagram and a front view of the sensor assembly method of the circuit detection device of the sixth preferred embodiment of the present invention. As shown in Figure 11,
上述的電路檢測裝置500及電路檢測裝置600,可以更包括一光學定位系統,用以定位N個感測器跟待測電路相對位置。當N個感測器製作於透明電路板(例如:GCB)的時候,可使用電路檢測裝置500。然而,當N個感測器製作於非透明電路板的時候,需使用裝置600才能正確定位。
The above-mentioned
此外,應當強調,本發明電路檢測裝置可應用於各種類型的待測電路,無關於缺陷數目、缺陷分布及電路單元數目。上述所有實施例中的待測電路,僅是舉例說明以方便描述本發明電路檢測裝置的實施方式,不能理解為對本發明的電路檢測裝置之限制。 In addition, it should be emphasized that the circuit detection device of the present invention can be applied to various types of circuits to be tested, regardless of the number of defects, defect distribution and number of circuit units. The circuits to be tested in all the above embodiments are only examples to facilitate the description of the implementation of the circuit detection device of the present invention, and cannot be understood as a limitation on the circuit detection device of the present invention.
綜上所述,本發明確實能藉由設置引腳及感測器於合適位置及使用引腳至引腳及引腳至感測器混合方法可信地檢測出全型態的電路缺陷,以解決習知的引腳至引腳方法及引腳至感測器方法具有各自缺點的問題且進一步使用多種多個感測器,以能夠快速有效率地檢測GCB電路而改進習知技術應用於GCB電路的不方便。 In summary, the present invention can indeed reliably detect all types of circuit defects by setting pins and sensors at appropriate positions and using a pin-to-pin and pin-to-sensor hybrid method to solve the problem that the known pin-to-pin method and pin-to-sensor method have their own shortcomings and further use multiple types of sensors to quickly and efficiently detect GCB circuits and improve the inconvenience of applying known technology to GCB circuits.
本發明實屬難能的創新發明,深具產業價值,援依法提出申請。此外,本發明可以由所屬技術領域中具有通常知識者做任何修改,但不脫離如所附申請專利範圍所要保護的範圍。 This invention is a rare innovative invention with great industrial value, and is applied for in accordance with the law. In addition, this invention can be modified by a person with ordinary knowledge in the relevant technical field, but it does not deviate from the scope of protection as specified in the attached patent application.
100:電路檢測裝置 100: Circuit testing device
10、11:引腳 10, 11: Pins
12:感測器 12: Sensor
13:電壓電阻測量儀 13: Voltage resistance meter
2:待測電路 2: Circuit to be tested
20:端點間開路 20: Open circuit between terminals
21:內部開路 21: Internal open circuit
22:短路 22: Short circuit
23、24、25、26、27、28、29:端點 23, 24, 25, 26, 27, 28, 29: Endpoints
3A、3B、3C:連接線 3A, 3B, 3C: connecting wires
Claims (11)
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Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101208607A (en) * | 2005-04-27 | 2008-06-25 | 雅赫测试系统公司 | Equipment for testing electronic devices |
| CN101398441A (en) * | 2007-09-28 | 2009-04-01 | 国立大学法人东京大学 | Probe plate and inspection device of semiconductor wafer using the same |
| JP5953135B2 (en) * | 2012-06-14 | 2016-07-20 | 日置電機株式会社 | Resistance measuring device and circuit board inspection device |
| US20190250216A1 (en) * | 2018-02-09 | 2019-08-15 | Toyota Jidosha Kabushiki Kaisha | Inspection apparatus of electrical storage device |
| US20200225272A1 (en) * | 2019-01-16 | 2020-07-16 | Samsung Electro-Mechanics Co., Ltd. | Apparatus and method for detecting wiring short in substrate |
| CN112014725A (en) * | 2020-09-02 | 2020-12-01 | 韩熔 | Multi-node waveform pre-storage fault detection method for electronic circuit board |
| TWI730591B (en) * | 2020-01-15 | 2021-06-11 | 興城科技股份有限公司 | Inspection equipment for glass substrate and method thereof |
| CN113711064A (en) * | 2019-04-10 | 2021-11-26 | Iee国际电子工程股份公司 | Multi-channel capacitance sensing measurement circuit |
| TWI759724B (en) * | 2020-04-23 | 2022-04-01 | 興城科技股份有限公司 | Inspection method for glass substrate |
-
2023
- 2023-07-31 TW TW112128700A patent/TWI870949B/en active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101208607A (en) * | 2005-04-27 | 2008-06-25 | 雅赫测试系统公司 | Equipment for testing electronic devices |
| CN101398441A (en) * | 2007-09-28 | 2009-04-01 | 国立大学法人东京大学 | Probe plate and inspection device of semiconductor wafer using the same |
| JP5953135B2 (en) * | 2012-06-14 | 2016-07-20 | 日置電機株式会社 | Resistance measuring device and circuit board inspection device |
| US20190250216A1 (en) * | 2018-02-09 | 2019-08-15 | Toyota Jidosha Kabushiki Kaisha | Inspection apparatus of electrical storage device |
| US20200225272A1 (en) * | 2019-01-16 | 2020-07-16 | Samsung Electro-Mechanics Co., Ltd. | Apparatus and method for detecting wiring short in substrate |
| CN113711064A (en) * | 2019-04-10 | 2021-11-26 | Iee国际电子工程股份公司 | Multi-channel capacitance sensing measurement circuit |
| TWI730591B (en) * | 2020-01-15 | 2021-06-11 | 興城科技股份有限公司 | Inspection equipment for glass substrate and method thereof |
| TWI759724B (en) * | 2020-04-23 | 2022-04-01 | 興城科技股份有限公司 | Inspection method for glass substrate |
| CN112014725A (en) * | 2020-09-02 | 2020-12-01 | 韩熔 | Multi-node waveform pre-storage fault detection method for electronic circuit board |
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