TWI860379B - Process liquid discharge nozzle, nozzle arm, substrate processing device, and substrate processing method - Google Patents

Abstract

An object of the invention is to provide technology that can suppress the production of particles. A process liquid discharge nozzle according to an embodiment of the invention discharges a process liquid used in substrate processing. The process liquid discharge nozzle comprises a nozzle main body section and an angle changing mechanism. The nozzle main body section comprises a first body section in which a first flow path that connects to a process liquid supply channel is formed, and a second body section in which a second flow channel that connects to the first flow channel is formed and which is curved with respect to the first body section. The angle change mechanism changes the angle of the nozzle main body section in the horizontal direction relative to a fixed member to which the nozzle main body section is fixed.

Description

Processing liquid spray nozzle, nozzle arm, substrate processing device and substrate processing method

The present invention relates to a processing liquid spray nozzle, a nozzle arm, a substrate processing device and a substrate processing method.

Patent document 1 discloses spraying a processing liquid from a processing liquid nozzle toward a substrate. [Known technical document] [Patent document]

[Patent Document 1]: Japanese Patent Application Publication No. 2019-40958

[Problems to be solved by the present invention]

The present invention provides a technology for suppressing the generation of particles. [Technical means for solving the problem]

A processing liquid spray nozzle of one embodiment of the present invention is a processing liquid spray nozzle for spraying a processing liquid used for substrate processing. The processing liquid spray nozzle has a nozzle body and an angle changing mechanism. The nozzle body has a first body and a second body, the first body forming a first flow path connected to the processing liquid supply path, and the second body forming a second flow path connected to the first flow path, which is bent relative to the first body. The angle changing mechanism changes the angle of the nozzle body in the horizontal direction with respect to the fixing member fixing the nozzle body. [Effects of the present invention]

According to the present invention, the generation of fine particles can be suppressed.

The following is a detailed description of the processing liquid spray nozzle, nozzle arm, substrate processing device, and substrate processing method disclosed in this application with reference to the attached drawings. In addition, the present invention is not limited to the processing liquid spray nozzle, nozzle arm, substrate processing device, and substrate processing method disclosed by the following embodiments.

In order to facilitate the understanding of the description, the drawings referred to below define mutually perpendicular X-axis, Y-axis and Z-axis directions, and show the vertical coordinate system with the positive direction of the Z-axis pointing straight up. The X-axis direction and the Y-axis direction are horizontal directions. In the following, the description is made with the positive direction of the Z-axis pointing upward and the negative direction of the Z-axis pointing downward.

(First embodiment) <Overall structure of substrate processing apparatus> The structure of the substrate processing apparatus 1 of the first embodiment will be described with reference to FIG. 1 . FIG. 1 is a schematic diagram of the structure of the substrate processing apparatus 1 of the first embodiment.

The substrate processing apparatus 1 includes a processing container 2, a holding portion 3, an outer cup 4, an arm 5, and a control device 6. The processing container 2 accommodates the holding portion 3, the outer cup 4, and the arm 5. The processing container 2 accommodates a processing liquid spray nozzle 21 of the arm 5 described later and a moving mechanism 11.

The holding part 3 holds the placed circular substrate W. The holding part 3 holds the substrate W when performing substrate processing. For example, the holding part 3 holds the substrate W by adsorbing the bottom side of the substrate W with a vacuum suction cup. In addition, the holding part 3 (an example of a substrate rotating part) rotates the placed substrate W. Specifically, the holding part 3 rotates around an axis along the Z-axis direction to rotate the held substrate W.

In addition, the holding part 3 is raised and lowered in the Z-axis direction. The holding part 3 is raised and lowered, for example, in a state of holding the substrate W. The holding part 3 allows the substrate W to be raised and lowered between the transfer position and the processing position. The transfer position is set to a position above the outer cup 4, and is a position for transferring the substrate W between the holding part 3 and the substrate transport device (not shown). The processing position is set to a position below the transfer position, inside the outer cup 4, and is a position for performing substrate processing on the substrate W.

The outer cup 4 (an example of a cup portion) is provided to surround the holding portion 3 and the outer side of the substrate W held by the holding portion 3. The outer cup 4 is provided in a ring shape.

The outer cup 4 receives the processing liquid scattered from the substrate W. The outer cup 4 is formed of a material with high chemical resistance. A drain port (not shown) is provided at the bottom of the outer cup 4. The processing liquid received by the outer cup 4 is discharged to the outside of the processing container 2 from the drain port.

The treatment liquid is, for example, a chemical solution or a rinse solution. The chemical solution is, for example, hydrofluoric acid (HF), dilute hydrofluoric acid (DHF), fluoronitric acid, etc. In addition, fluoronitric acid is a mixture of hydrofluoric acid (HF) and nitric acid (HNO ₃ ). In addition, the rinse solution is, for example, DIW (deionized water).

The arm 5 is arranged in a pair along the X-axis direction. Specifically, the arm 5 is arranged on both sides of the substrate W in the X-axis direction. In the following, the arm 5 on the negative side of the X-axis in the pair of arms 5 is described as the left arm 5L, and the arm 5 on the positive side of the X-axis is described as the right arm 5R. The arm 5 has an arm part 10, a moving mechanism 11, and a processing liquid supply part 12. In addition, a single arm 5 may be arranged.

The arm 10 extends from the base end in the Z-axis direction and extends from the upper end in the horizontal direction. The arm 10 is provided in an L-shape.

The moving mechanism 11 (an example of a rotating mechanism) rotates the arm 10. Specifically, the moving mechanism 11 rotates the arm 10 around the axis of the arm 10 extending in the Z-axis direction. In addition, the moving mechanism 11 moves the arm 10 in the X-axis direction and the Z-axis direction. A plurality of moving mechanisms 11 may be provided. For example, as the moving mechanism 11, a moving mechanism that rotates the arm 10 around the axis in the Z-axis direction, a moving mechanism that moves the arm 10 in the X-axis direction, and a moving mechanism that moves the arm 10 in the Z-axis direction may be provided.

The processing liquid supply unit 12 supplies the processing liquid to the top surface of the substrate W. The processing liquid supply unit 12 sprays the processing liquid to the edge of the top surface of the substrate W to perform etching processing on the edge of the substrate W. The processing liquid supply unit 12 is provided at the front end of the arm unit 10. The details of the processing liquid supply unit 12 will be described later.

The edge is a region on the inner side of the circular substrate W in the radial direction, which is measured from the end surface of the circular substrate W and includes a width of about 1 to 5 mm, for example. The edge is a ring-shaped region.

In addition, the substrate processing apparatus 1 may also include: a bottom surface supply unit (not shown) for supplying a processing liquid to the edge of the bottom surface of the substrate W, a heating mechanism (not shown) for supplying a heated fluid toward the bottom surface of the substrate W, and the like.

The control device 6, such as a computer, includes a storage unit 6a and a control unit 6b.

The storage unit 6 a is implemented by, for example, a semiconductor memory element such as a RAM or a flash memory, or a storage device such as a hard disk or an optical disk, and stores programs for controlling various processes performed in the substrate processing apparatus 1 .

The control unit 6b includes a microcomputer and various circuits having a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), an input/output port, etc. The control unit 6b reads and executes the program stored in the storage unit 6a to control the operation of the substrate processing device 1.

In addition, the program is recorded on a computer-readable recording medium and can be installed from the recording medium to the storage unit 6a of the control device 6. Examples of the computer-readable recording medium include a hard disk (HD), a floppy disk (FD), a compact disk (CD), a magneto-optical disk (MO), a memory card, and the like.

<Processing liquid supply unit> Next, the processing liquid supply unit 12 will be described with reference to FIG. 2 and FIG. 3. FIG. 2 is a perspective view of the processing liquid supply unit 12 of the first embodiment. FIG. 3 is a top view of the processing liquid supply unit 12 of the first embodiment. In addition, the processing liquid supply unit 12 of FIG. 2 and FIG. 3 is the processing liquid supply unit 12 provided on the right arm 5R.

The treatment liquid supply portion 12 includes a nozzle block 20 and a treatment liquid spray nozzle 21. The nozzle block 20 is mounted on the front end of the arm 10. That is, the nozzle block 20 (an example of a fixed component) is mounted on the arm 10. The treatment liquid supply pipe 5a provided on the arm 5 is connected to the nozzle block 20. As shown in FIG. 4 , a treatment liquid supply path 20a is formed in the nozzle block 20. The treatment liquid supplied from the treatment liquid supply pipe 5a flows in the treatment liquid supply path 20a. FIG. 4 is a cross-sectional view taken along line IV-IV of FIG. 3 .

The nozzle block 20 is formed with a first recess 20b, a second recess 20c, and a third recess 20d. The first recess 20b is formed to be recessed downward from the top surface of the nozzle block 20. A through hole 20e is formed at the bottom of the first recess 20b. A bolt 22 for fixing the treatment liquid spray nozzle 21 to the nozzle block 20 is inserted into the through hole 20e.

As shown in FIG3 , a plurality of through holes 20e are provided for one processing liquid spray nozzle 21. For example, two through holes 20e are provided for one processing liquid spray nozzle 21. In addition, the number of through holes 20e for one processing liquid spray nozzle 21 is not limited to two. For example, the number of through holes 20e for one processing liquid spray nozzle 21 may be three or more.

As shown in FIG. 4 , the second recess 20c is formed to be recessed upward from the bottom surface of the nozzle block 20. The second recess 20c is formed around the through hole 20e. The second recess 20c is connected to the first recess 20b through the through hole 20e. The mounting portion 32a of the treatment liquid spray nozzle 21 described later is inserted into the second recess 20c.

The second recess 20c and the through hole 20e are provided so as to change the angle of the processing liquid spray nozzle 21 in the horizontal direction with respect to the nozzle block 20. Specifically, a plurality of second recesses 20c are provided so as to allow the mounting portion 32a of the processing liquid spray nozzle 21 to be inserted corresponding to the mounting position of the processing liquid spray nozzle 21. For example, two second recesses 20c are provided for one processing liquid spray nozzle 21. Alternatively, the two second recesses 20c may be provided so as to overlap a portion thereof. That is, the two second recesses 20c may be provided in communication.

Furthermore, the through hole 20e is provided to change the angle of the processing liquid spray nozzle 21. Specifically, two through holes 20e corresponding to one processing liquid spray nozzle 21 are formed by arranging the central axis on the same radius with the central axis of the introduction portion 35b of the processing liquid spray nozzle 21 described later as the center.

The third recess 20d is formed to be recessed upward from the bottom surface of the nozzle block 20. An introduction portion 35b of a treatment liquid spray nozzle 21 described later is inserted into the third recess 20d. The inner wall surface of the third recess 20d is formed in a circular shape.

The processing liquid spray nozzle 21 moves between the standby position and the spray position as the arm 10 is moved by the moving mechanism 11. The standby position is a position where a part of the processing liquid spray nozzle 21 is accommodated in the notch 4a formed in the outer cup 4. The standby position is a position where the substrate W can be raised and lowered between the transfer position and the processing position by the holding portion 3. When the processing liquid spray nozzle 21 is located at the standby position, the substrate W is raised and lowered so that the substrate W is not in contact with the processing liquid spray nozzle 21.

The spraying position is a position that is located inside the standby position in the radial direction of the substrate W. The spraying position is a position where the processing liquid is sprayed to the edge of the substrate W by the processing liquid spraying nozzle 21 .

Next, the treatment liquid spray nozzle 21 will be described with reference to Fig. 5 to Fig. 7. Fig. 5 is a front view of the treatment liquid spray nozzle 21 of the first embodiment. Fig. 6 is a top view of the treatment liquid spray nozzle 21 of the first embodiment. Fig. 7 is a VII-VII cross-sectional view of Fig. 6.

The processing liquid spraying nozzle 21 sprays the processing liquid used for substrate processing. The processing liquid spraying nozzle 21 includes a nozzle body 30, a nozzle spraying part 31, and a connecting part 32.

The nozzle body 30 includes a first body 35 and a second body 36. The first body 35 extends in the Z-axis direction. In the first body 35, as shown in FIG7, a first flow path 35a is formed. The first flow path 35a is formed along the Z-axis direction. The first flow path 35a is connected to the processing liquid supply path 20a (refer to FIG4) of the nozzle block 20. That is, the first flow path 35a connected to the processing liquid supply path 20a is formed in the first body 35. An introduction portion 35b inserted into the third recess 20d (refer to FIG4) of the nozzle block 20 is provided in the upper first body 35. The outer wall surface of the introduction portion 35b is formed in a circular shape.

An O-ring 38 (see FIG. 4 ) is provided between the introduction portion 35 b and the third recess 20 d of the nozzle block 20 . The O-ring 38 prevents the process liquid from leaking from between the first body portion 35 and the nozzle block 20 .

The second body portion 36 is bent relative to the first body portion 35, and extends obliquely downward from the lower end of the first body portion 35. Specifically, the second body portion 36 extends obliquely downward in accordance with the rotation direction of the substrate W.

In addition, in the processing liquid spraying nozzle 21 provided on the left arm 5L and the processing liquid spraying nozzle 21 provided on the right arm 5R, each second body portion 36 extends obliquely downward from the lower end of the first body portion 35 in accordance with the rotation direction of the substrate W. Therefore, in the processing liquid spraying nozzle 21 provided on the left arm 5L and the processing liquid spraying nozzle 21 provided on the right arm 5R, the directions in which each second body portion 36 extends are opposite to each other, for example, in the Y-axis direction.

As shown in FIG. 7 , the second body 36 is formed with a second flow path 36a. The second flow path 36a extends obliquely downward from the lower end of the first flow path 35a. The second flow path 36a is connected to the first flow path 35a. In this way, the second body 36 is formed with the second flow path 36a connected to the first flow path 35a, and is bent relative to the first body 35.

Furthermore, a recessed portion 36b is formed in the second body portion 36. The recessed portion 36b is formed so as to be recessed from the lower end of the second body portion 36 toward the first body portion 35. The nozzle spouting portion 31 is inserted into the recessed portion 36b. A threaded groove is formed in a portion of the inner wall surface of the recessed portion 36b.

The nozzle spraying portion 31 sprays the processing liquid toward the edge of the substrate W. The nozzle spraying portion 31 extends along the direction in which the second body portion 36 extends. That is, the nozzle spraying portion 31 extends along the second body portion 36 toward obliquely downward.

The nozzle spraying part 31 is inserted into the recessed part 36b of the second main body part 36 and mounted on the nozzle main body part 30. The nozzle spraying part 31 can be attached to and detached from the front end of the second main body part 36.

The insertion portion 31a of the nozzle discharge portion 31 inserted into the recess 36b of the second body portion 36 is formed with a thread ridge. The thread ridge is formed corresponding to the thread groove formed on the inner wall surface of the recess 36b. The nozzle discharge portion 31 is screwed with the nozzle body 30.

An O-ring 39 is provided between the insertion portion 31a of the nozzle ejection portion 31 and the second body portion 36. The O-ring 39 prevents the process liquid from leaking from between the nozzle ejection portion 31 and the second body portion 36.

The nozzle ejection portion 31 is formed with an ejection passage 31b connected to the second passage 36a. The diameter of the ejection passage 31b is smaller than the diameter of the second passage 36a. Specifically, the diameter of the inner wall surface 31c of the ejection passage 31b is smaller than the diameter of the inner wall surface 36c of the second passage 36a. In addition, the diameter of the inner wall surface 31c of the ejection passage 31b is smaller than the diameter of the inner wall surface 35c of the first passage 35a.

In addition, a nozzle 31d is formed at the front end of the nozzle ejection portion 31, and the nozzle 31d is connected to the ejection flow path 31b to eject the processing liquid toward the substrate W. The diameter of the nozzle 31d is smaller than the diameter of the ejection flow path 31b. Specifically, the diameter of the inner wall surface 31e of the nozzle 31d is smaller than the diameter of the inner wall surface 31c of the ejection flow path 31b.

The diameter of the spraying passage 31b and the diameter of the spraying port 31d are set in accordance with the type of treatment or the type of treatment liquid sprayed, etc. That is, in the treatment liquid spraying nozzle 21, the nozzle spraying portion 31 mounted on the nozzle body 30 can be replaced in accordance with the type of treatment or the type of treatment liquid sprayed, etc.

In this way, the nozzle ejection portion 31 is formed with the ejection flow path 31 b communicating with the second flow path 36 a to eject the processing liquid to the edge of the substrate W. That is, the processing liquid ejection nozzle 21 ejects the processing liquid toward the edge of the substrate W.

As shown in FIG. 5 and FIG. 6 , the connecting portion 32 extends horizontally with respect to the first main body portion 35. The connecting portion 32 is provided integrally with the first main body portion 35. A mounting portion 32a protruding upward is provided on the connecting portion 32. As shown in FIG. 6 , a bolt hole 32b into which the bolt 22 (see FIG. 4 ) is inserted is formed on the mounting portion 32a. A thread groove corresponding to the thread ridge of the bolt 22 is formed on the inner wall surface of the bolt hole 32b. The bolt 22 is screwed into the connecting portion 32. By screwing the bolt 22, the nozzle main body 30 is fixed to the nozzle block 20.

<Change of the spraying angle of the processing liquid of the processing liquid spray nozzle> The processing liquid spray nozzle 21 can be rotated in the horizontal direction relative to the nozzle block 20 by rotating around the introduction portion 35b inserted into the third recess 20d of the nozzle block 20. In addition, the processing liquid spray nozzle 21 can change the installation position relative to the nozzle block 20 by changing the position of the second recess 20c into which the installation portion 32a of the connecting portion 32 is inserted. That is, the connecting portion 32 (an example of an angle changing mechanism) can change the installation position relative to the nozzle block 20 (an example of a fixing member). In other words, the connection portion 32 changes the angle of the nozzle body 30 in the horizontal direction with respect to the nozzle block 20 (an example of a fixing member) that fixes the nozzle body 30 .

By changing the installation position of the nozzle body 30 relative to the nozzle block 20, the spraying angle of the processing liquid relative to the nozzle block 20 can be changed. That is, the processing liquid spraying nozzle 21 can change the spraying angle of the processing liquid relative to the substrate W. The spraying angle is the horizontal angle relative to the tangent line of the substrate W at the position where the processing liquid sprayed by the processing liquid spraying nozzle 21 is sprayed onto the substrate W.

<Change of rotation angle of the arm> In the arm 5, the arm 10 can be rotated around the axis in the Z-axis direction by the moving mechanism 11. That is, the moving mechanism 11 (an example of a rotating mechanism) can rotate the arm 10 in the horizontal direction. Therefore, for example, by rotating the arm 10 and changing the rotation angle during the spraying of the processing liquid to the substrate W, that is, during the substrate processing, the spraying angle of the processing liquid relative to the substrate W can be changed. In addition, the substrate processing can also be performed in a manner that the arm 10 is not rotated during the substrate processing.

Here, referring to Fig. 8, the spray angle change process of the treatment liquid performed by the arm 5 is described. Fig. 8 is a flow chart for describing the spray angle change process of the first embodiment. The spray angle change process is performed by causing the control unit 6b of the control device 6 to control the treatment liquid spray nozzle 21 and the holding unit 3.

The control unit 6 b sets the initial angle of the arm unit 10 according to the processing of the substrate W ( S100 ). That is, the control unit 6 b sets the rotation angle of the moving mechanism 11 (an example of a rotation mechanism) according to the processing of the substrate.

The control unit 6b rotates the arm 10 according to the set initial angle (S101), and starts spraying the processing liquid from the processing liquid spray nozzle 21 at the initial angle (S102). That is, the control unit 6b sprays the processing liquid toward the substrate W at the set rotation angle.

The control unit 6b determines whether it is the angle change timing (S103). For example, the control unit 6b determines whether a specified first time has passed since the start of the spraying of the treatment liquid. The specified first time is a preset time.

When it is not the angle change timing (S103: No), the control unit 6b continues to eject the processing liquid at the initial angle (S102).

When the angle change sequence is reached (S103: Yes), the control unit 6b sets the angle of the arm 10 to a designated change angle (S104). The designated change angle is a pre-set angle. The control unit 6b rotates the arm 10 in accordance with the set designated change angle (S105). That is, the control unit 6b changes the rotation angle during substrate processing.

The control unit 6b determines whether it is the processing end timing (S106). For example, the control unit 6b determines whether a designated second time has passed after the angle of the arm 10 is changed to a designated change angle. The designated second time is a preset time.

If the processing end timing is not reached (S106: No), the control unit 6b continues the designated angle change processing (S105). If the processing end timing is reached (S106: Yes), the control unit 6b ends the ejection of the processing liquid (S107).

<Effect> The treatment liquid spraying nozzle 21 has a nozzle body 30 and a connecting portion 32 (an example of an angle changing mechanism). The nozzle body 30 has a first body 35 and a second body 36. The first body 35 has a first flow path 35a connected to the treatment liquid supply path 20a. The second body 36 has a second flow path 36a bent relative to the first body. The connecting portion 32 changes the angle of the nozzle body 30 in the horizontal direction with respect to the nozzle block 20 (an example of a fixing member) that fixes the nozzle body 30. Specifically, the connecting portion 32 can change the mounting position relative to the nozzle block 20.

Thus, the processing liquid spraying nozzle 21 can change the spraying angle of the processing liquid according to the processing of the substrate W, such as the type of film on the substrate W and the type of processing liquid sprayed on the substrate W. Therefore, the processing liquid spraying nozzle 21 can suppress the processing liquid used for etching the edge of the substrate W from being sprayed onto the substrate W and scattered. Therefore, the scattered processing liquid can be suppressed from adhering to the non-etched area, and the generation of particles can be suppressed.

The process liquid ejecting nozzle 21 includes a nozzle ejecting unit 31 . The nozzle ejecting unit 31 has an ejection flow path 31 b communicating with the second flow path 36 a and ejects the process liquid onto the substrate W. The nozzle ejecting unit 31 is detachable from the front end of the second body 36 .

Thus, the processing liquid ejecting nozzle 21 can replace the nozzle discharge unit 31 in accordance with the processing of the substrate W. Therefore, the processing liquid ejecting nozzle 21 can, for example, etch the edge of the substrate W with high precision. In addition, for example, in the case where the processing liquid is clogged in the ejection port 31d of the nozzle discharge unit 31, the substrate processing can be easily resumed by replacing the nozzle discharge unit 31.

In addition, the processing liquid spraying nozzle 21 can reduce bubbles generated when the processing liquid flows from the first flow path 35a to the second flow path 36a while the processing liquid flows in the spraying flow path 31b. Therefore, the processing liquid spraying nozzle 21 can suppress the processing liquid sprayed onto the substrate W from containing bubbles, and can stabilize the spraying state of the processing liquid.

In addition, the diameter of the ejection flow path 31b is smaller than the diameter of the second flow path 36a.

Thus, the processing liquid spray nozzle 21 can suppress the generation of bubbles when the processing liquid flows from the second flow path 36a into the spray flow path 31b. Therefore, the processing liquid spray nozzle 21 can suppress the processing liquid sprayed onto the substrate W from containing bubbles, and can stabilize the spraying state of the processing liquid.

In addition, the arm 5 (an example of a nozzle arm) has a treatment liquid spraying nozzle 21, a nozzle block 20 (an example of a fixed component), an arm 10, and a moving mechanism 11 (an example of a rotating mechanism). The arm 10 is mounted with a fixed component. The moving mechanism 11 rotates the arm 10 in a horizontal direction. The substrate processing device 1 sets the rotation angle of the moving mechanism 11 according to the substrate processing, and sprays the treatment liquid toward the substrate W at the set rotation angle.

Thereby, the substrate processing apparatus 1 can spray the processing liquid at a spray angle corresponding to the substrate processing, and can etch the edge of the substrate W with high precision.

Furthermore, the substrate processing apparatus 1 changes the rotation angle during substrate processing.

Thereby, the substrate processing apparatus 1 can uniformly spray the processing liquid to the edge of the substrate W, and can etch the edge of the substrate W with high precision.

(Second embodiment) Next, the substrate processing apparatus 1 of the second embodiment is described. The substrate processing apparatus 1 of the second embodiment has a different processing liquid supply unit 50 from the substrate processing apparatus 1 of the first embodiment. Therefore, the processing liquid supply unit 50 of the second embodiment is described here. In addition, the same symbols are given to the same parts as the processing liquid supply unit 12 of the first embodiment, and detailed descriptions are omitted.

<Processing liquid supply unit> In the nozzle block 51 of the processing liquid supply unit 50, as shown in FIG9, a through hole 20e is provided for a processing liquid spray nozzle 52. FIG9 is a top view of the processing liquid supply unit 50 of the second embodiment. In addition, the processing liquid supply unit 50 of FIG9 is a processing liquid supply unit 50 provided on the right arm 5R.

As shown in Fig. 10 and Fig. 11, the treatment liquid spraying nozzle 52 is provided by separating the nozzle body 53 and the connection part 54. Fig. 10 is a top view of the treatment liquid spraying nozzle 52 of the second embodiment. Fig. 11 is a cross-sectional view taken along line XI-XI of Fig. 10.

As shown in FIG. 11 , the first body portion 55 is formed with an engagement groove 55a. The engagement groove 55a is formed below the introduction portion 35b. The engagement groove 55a is formed to cover the entire circumference of the first body portion 55. By forming the engagement groove 55a, an engagement portion 55b is formed between the introduction portion 35b and the engagement groove 55a in the first body portion 55. The diameter of the outer wall surface of the engagement portion 55b is larger than the diameter of the outer wall surface of the introduction portion 35b.

The connecting portion 54 has a pair of arm portions 54a. The pair of arm portions 54a are inserted into the engaging groove 55a to clamp the first body portion 55. The first body portion 55 can rotate in the horizontal direction while being clamped by the pair of arm portions 54a. That is, the connecting portion 54 (an example of an angle changing mechanism) supports the first body portion 55 in a rotatable manner. In addition, the top surface of the arm portion 54a abuts against the engaging portion 55b of the first body portion 55. That is, the pair of arm portions 54a are engaged with the engaging portion 55b.

Furthermore, the first body portion 55 and the connecting portion 54 are provided with an alignment portion 60 as shown in Fig. 12. Fig. 12 is a perspective view of the treatment liquid ejection nozzle 52 of the second embodiment as viewed from obliquely below. The alignment portion 60 includes a first alignment groove 60a and a second alignment groove 60b.

The first alignment groove 60a is formed in the first body portion 55. The first alignment groove 60a is formed in the first body portion 55 below the engagement groove 55a (see FIG. 11). A plurality of first alignment grooves 60a are formed on the outer wall surface of the first body portion 55. Specifically, a plurality of first alignment grooves 60a are formed along the circumferential direction of the first body portion 55.

The second alignment groove 60b is formed in the connecting portion 54. For example, the second alignment groove 60b may be formed to penetrate the connecting portion 54 in the Z-axis direction.

When the connection part 54 is fixed to the nozzle block 51 by the bolt 22, the nozzle body 53, as shown in FIG13, clamps the engaging part 55b of the first body 55 in the Z-axis direction by the arm part 54a of the connection part 54 and the nozzle block 51. In this way, the nozzle body 53 is fixed to the nozzle block 51. FIG13 is a cross-sectional view taken along the line XIII-XIII of FIG9.

<Change in the spraying angle of the processing liquid by the processing liquid spraying nozzle> When the nozzle body 53 is not fixed to the nozzle block 51 by the bolt 22, the first body 55 can be rotated in the horizontal direction relative to the connecting portion 54. For example, the processing liquid spraying nozzle 52 can change the spraying angle of the processing liquid relative to the nozzle block 51 by changing the position of the first alignment groove 60a of the first body 55 and the second alignment groove 60b of the connecting portion 54. That is, the nozzle body 53 and the connecting portion 54 include an aligning portion 60, and the aligning portion 60 changes the angle of the nozzle body 53 in the horizontal direction with respect to the nozzle block 51 (an example of a fixing member).

<Effect> In the treatment liquid spray nozzle 52, the connecting portion 54 (an example of an angle changing mechanism) supports the first main body portion 55 in a rotatable manner.

Thus, the processing liquid spraying nozzle 52 can change the spraying angle of the processing liquid according to the processing of the substrate W, for example, the type of film on the substrate W and the type of processing liquid sprayed on the substrate W. Therefore, the generation of particles can be suppressed.

Furthermore, the first body portion 55 and the connecting portion 54 include an alignment portion 60. The alignment portion 60 changes the angle of the nozzle body portion 53 in the horizontal direction with respect to the nozzle block 51 (an example of a fixing member).

Thus, the operator can simply adjust the angle of the first body 55 in the horizontal direction with respect to the connecting portion 54 fixed to the nozzle block 51 according to the alignment portion 60. Therefore, the operator can simply set the spraying angle of the processing liquid.

<Variation of the second embodiment> The treatment liquid spray nozzle 52 of the variation may also be provided with an alignment groove as the alignment portion 60 on one of the first body portion 55 and the connecting portion 54, and a protruding piece inserted into the alignment groove on the other of the first body portion 55 and the connecting portion 54.

Thereby, the processing liquid spraying nozzle 52 of the modified example can suppress the first body portion 55 from rotating relative to the connecting portion 54. Therefore, the processing liquid spraying nozzle 52 of the modified example can suppress the spraying angle of the processing liquid from deviating from the set spraying angle.

(Third embodiment) Next, the substrate processing apparatus 1 of the third embodiment is described. The substrate processing apparatus 1 of the third embodiment has a different processing liquid supply unit 70 from the substrate processing apparatus 1 of the second embodiment. Therefore, the processing liquid supply unit 70 of the third embodiment is described here. In addition, the same symbols are given to the same parts as the processing liquid supply unit 12 of the first embodiment and the processing liquid supply unit 50 of the second embodiment, and detailed descriptions are omitted.

<Processing liquid supply unit> The processing liquid supply unit 70, as shown in FIG14, further has a gas spray nozzle 71. FIG14 is a top view of the processing liquid supply unit 70 of the third embodiment. In addition, the processing liquid supply unit 70 of FIG14 is a processing liquid supply unit 70 provided on the left arm 5L.

The gas spray nozzle 71 is installed in the nozzle block 51. The gas spray nozzle 71 is arranged inside the process liquid spray nozzle 52. Specifically, the gas spray nozzle 71 is arranged inside the process liquid spray nozzle 52 in the radial direction of the substrate W.

The gas spray nozzle 71 sprays gas, such as nitrogen, toward the outside. The gas spray nozzle 71 sprays gas that discharges the processing liquid sprayed onto the substrate W and scattered above the substrate W toward the outside of the substrate W.

The gas spray nozzle 71 sprays gas at a spray angle larger than the spray angle of the processing liquid in the horizontal direction. Specifically, as shown in FIG. 15 , the gas spray nozzle 71 sprays gas at a spray angle A2 larger than the spray angle A1 of the processing liquid relative to the tangent line S of the substrate W at the position T where the processing liquid is sprayed from the processing liquid spray nozzle 52 and sprayed onto the substrate W. That is, the gas spray nozzle 71 sprays gas at a spray angle A2 larger than the spray angle A1 of the processing liquid relative to the tangent line S of the substrate in the horizontal direction. FIG. 15 is a schematic diagram for explaining the arrangement of the processing liquid spray nozzle 52 and the gas spray nozzle 71 according to the third embodiment.

In addition, the gas spray nozzle 71 sprays gas toward the upper side of the substrate W. Specifically, the gas spray nozzle 71 sprays gas toward the upper side of the position where the processing liquid sprayed from the processing liquid spray nozzle 52 is sprayed onto the substrate W. Alternatively, the gas spray nozzle 71 may spray gas toward the upper side slightly downstream of the position where the processing liquid sprayed from the processing liquid spray nozzle 52 is sprayed onto the substrate W in the rotation direction of the substrate W.

<Effect> The processing liquid supply unit 70, that is, the arm 5, has a gas spray nozzle 71. The gas spray nozzle 71 sprays the processing liquid sprayed onto the substrate W and scattered above the substrate W, and exhausts the gas to the outside of the substrate W.

Thus, the arm 5 can prevent the scattered processing liquid sprayed onto the substrate W from adhering to the radial inner side of the substrate W. Therefore, the arm 5 can prevent the scattered processing liquid from adhering to the non-etched area, thereby preventing the generation of particles.

In addition, the gas spray nozzle 71 is disposed on the inner side of the process liquid spray nozzle 52.

Thereby, the gas spray nozzle 71 can discharge the processing liquid sprayed onto the substrate W and scattered toward the outside of the substrate W. Therefore, the arm 5 can suppress the scattered processing liquid from adhering to the non-etched portion, and can suppress the generation of particles.

In addition, the gas spray nozzle 71 sprays the gas at a spray angle larger than the spray angle of the processing liquid in the horizontal direction.

Thereby, the arm 5 can discharge the scattered processing liquid just sprayed onto the substrate W toward the outside of the substrate W. Therefore, the arm 5 can suppress the scattered processing liquid from adhering to the place where etching is not performed, and can suppress the generation of particles.

In addition, the gas spray nozzle 71 sprays gas toward the upper side of the substrate W.

Thereby, the arm 5 can, for example, suppress the processing liquid sprayed to the edge of the substrate W and attached to the edge of the substrate W from being discharged to the outside of the substrate W, thereby promoting the etching process of the edge of the substrate W.

(Fourth embodiment) Next, referring to Figs. 16 to 18, the substrate processing apparatus 1 of the fourth embodiment will be described. Here, the description will focus on the differences from the substrate processing apparatus 1 of the first embodiment, and the same symbols are given to the same parts as the substrate processing apparatus 1 of the first embodiment, and detailed descriptions are omitted. Fig. 16 is a three-dimensional diagram showing a part of the substrate processing apparatus 1 of the fourth embodiment. Fig. 17 is a schematic diagram of the substrate processing apparatus 1 of the fourth embodiment, in which the processing liquid spray nozzle 21 is located at the standby position. Fig. 18 is a schematic diagram of the substrate processing apparatus 1 of the fourth embodiment, in which the processing liquid spray nozzle 21 is located at the spraying position. In addition, here, the right arm 5R side is described as an example, but the left arm 5L side also has the same structure.

The substrate processing device 1 further includes a first conductive portion 90 and a second conductive portion 91. The first conductive portion 90 is in contact with the processing liquid spray nozzle 21 and is conductively connected to the processing liquid spray nozzle 21. The first conductive portion 90 is mounted on the processing liquid spray nozzle 21. For example, the first conductive portion 90 is mounted on the first body portion 35 of the processing liquid spray nozzle 21. The first conductive portion 90 is a conductive member, such as a carbon-containing resin. The first conductive portion 90 moves together with the processing liquid spray nozzle 21. The processing liquid spray nozzle 21 and the first conductive portion 90 are moved along the X direction (refer to FIG. 1) by the moving mechanism 11 (refer to FIG. 1).

A hole is formed in the first conductive portion 90 through which the first main body 35 can slide. That is, the substrate processing device 1 can change the spray angle of the processing liquid relative to the nozzle block 20 by rotating the processing liquid spray nozzle 21 with respect to the nozzle block 20 when the processing liquid spray nozzle 21 is in contact with the first conductive portion 90. The first conductive portion 90 forms a hole by combining two or more components. That is, the first conductive portion 90 is formed by combining two or more components. In addition, the first conductive portion 90 may also be formed by one component. For example, the first conductive portion 90 may also be formed with a notch connected to the hole, and the first main body 35 is inserted into the hole through the notch.

The second conductive part 91 is in contact with the first conductive part 90 to be conductive with the process liquid spray nozzle 21 to electrically neutralize the process liquid spray nozzle 21. The second conductive part 91 is a conductive member, such as a carbon-containing film. The second conductive part 91 is provided on the outer cup 4 (an example of a cup part). The second conductive part 91 has a main body 91a and a deformable part 91b.

The body 91a is disposed along the top surface of the outer cup 4. The body 91a is disposed so that one end thereof is adjacent to the notch 4a of the outer cup 4. In addition, the body 91a is connected at the other end thereof to a conductive member (e.g., a metal member) outside the processing container 2 (see FIG. 1 ). In addition, the body 91a may also be connected to a conductive member outside the processing container 2 via an intermediate member. The intermediate member is a conductive member.

The deformable portion 91b is connected to the main body 91a. The deformable portion 91b is arranged to extend obliquely upward from one end of the main body 91a on the side of the notch portion 4a. The deformable portion 91b is arranged to protrude inward from the main body 91a in the radial direction of the substrate W. That is, the deformable portion 91b is supported on the main body 91a in a cantilevered state. The deformable portion 91b can be in contact with the first conductive portion 90. The deformable portion 91b is elastically deformed with respect to the main body 91a. In addition, the deformable portion 91b is not limited to a shape supported on the main body 91a in a cantilevered state, and it is sufficient to be elastically deformed with respect to the main body 91a.

The deformed portion 91b is in contact with the first conductive portion 90 when the first conductive portion 90 is in the contact position. The deformed portion 91b is not in contact with the first conductive portion 90 when the first conductive portion 90 is in the non-contact position.

The contact position includes, for example, a standby position. When the processing liquid spray nozzle 21 is in the standby position, the deformed portion 91b contacts the first conductive portion 90. When the processing liquid spray nozzle 21 is in the standby position, the deformed portion 91b contacts the first conductive portion 90 and the second conductive portion 91 to form a conductive path from the processing liquid spray nozzle 21 to the conductive member outside the processing container 2. By making the processing liquid spray nozzle 21 conductive with the conductive member outside the processing container 2, the processing liquid spray nozzle 21 is electrically neutralized.

The non-contact position includes, for example, the spraying position. When the process liquid spray nozzle 21 is at the spraying position, the deformed portion 91b is not in contact with the first conductive portion 90. That is, when the process liquid spray nozzle 21 is at the spraying position, the first conductive portion 90 and the second conductive portion 91 are not in contact, and a conductive path from the process liquid spray nozzle 21 to the conductive member outside the process container 2 is not formed.

The first conductive portion 90 is moved together with the processing liquid ejection nozzle 21 by the moving mechanism 11 (see FIG. 1 ). That is, the moving mechanism 11 switches the position of the processing liquid ejection nozzle 21 and the first conductive portion 90 between a contact position where the first conductive portion 90 is in contact with the second conductive portion 91 and a non-contact position where the first conductive portion 90 is not in contact with the second conductive portion 91.

When the treatment liquid spray nozzle 21 moves from the non-contact position (spraying position) to the contact position (standby position), the first conductive part 90 contacts the deformable part 91b of the second conductive part 91. The deformable part 91b is pushed by the first conductive part 90, rotates with the side of the main body 91a as a fulcrum, and deforms from a position (hereinafter referred to as the "initial position") where it is not in contact with the first conductive part 90. In this way, the impact when the first conductive part 90 contacts the second conductive part 91 is suppressed. In addition, the deformable part 91b elastically deforms with respect to the main body 91a, so that the contact state between the first conductive part 90 and the second conductive part 91 is maintained.

When the treatment liquid spray nozzle 21 moves from the contact position (standby position) to the non-contact position (spraying position), the first conductive portion 90 is separated from the deformed portion 91b of the second conductive portion 91. The deformed portion 91b of the second conductive portion 91 is not pressed by the first conductive portion 90, so it rotates with the body portion 91a side as a fulcrum and returns to the initial position.

<Effect> Since the processing liquid ejection nozzle 21 is charged, the processing liquid ejected from the processing liquid ejection nozzle 21 may adhere to the processing liquid ejection nozzle 21. There is a concern that the processing liquid attached to the processing liquid ejection nozzle 21 drips onto the substrate W, etc., and particles are generated. In addition, there is a concern that the processing liquid ejected from the processing liquid ejection nozzle 21 is attracted to the side of the processing liquid ejection nozzle 21 and drips onto the substrate W, etc., and particles are generated.

The substrate processing device 1 includes a processing liquid spray nozzle 21, a first conductive portion 90, a second conductive portion 91, and a moving mechanism 11. The first conductive portion 90 contacts the processing liquid spray nozzle 21 and is electrically connected to the processing liquid spray nozzle 21. The second conductive portion 91 contacts the first conductive portion 90 and is electrically connected to the processing liquid spray nozzle 21, thereby electrically neutralizing the processing liquid spray nozzle 21. The moving mechanism 11 switches the positions of the processing liquid spray nozzle 21 and the first conductive portion 90 between a contact position where the first conductive portion 90 contacts the second conductive portion 91 and a non-contact position where the first conductive portion 90 and the second conductive portion 91 do not contact.

Thus, the substrate processing apparatus 1 can suppress the charging of the processing liquid spray nozzle 21 by making the first conductive portion 90 contact the second conductive portion 91 at the contact position. Therefore, the substrate processing apparatus 1 can suppress the adhesion of the processing liquid to the processing liquid spray nozzle 21. In addition, the substrate processing apparatus 1 can suppress the processing liquid sprayed from the processing liquid spray nozzle 21 from being attracted to the processing liquid spray nozzle 21. Therefore, the substrate processing apparatus 1 can suppress the generation of particles.

The second conductive portion 91 includes a deformed portion 91 b. The deformed portion 91 b is deformed when in contact with the first conductive portion 90.

Thus, the substrate processing apparatus 1 can suppress the impact when the first conductive portion 90 and the second conductive portion 91 are in contact. Therefore, the substrate processing apparatus 1 can suppress the degradation of the first conductive portion 90 and the second conductive portion 91. In addition, the substrate processing apparatus 1 can maintain the first conductive portion 90 and the second conductive portion 91 in a contact state at the contact position by deforming the deformable portion 91b.

The substrate processing device 1 includes a holding portion 3 and an outer cup 4 (an example of a cup portion). The holding portion 3 holds a substrate W when performing substrate processing. The outer cup 4 is provided to surround the outer side of the substrate W held by the holding portion 3. The second conductive portion 91 is provided on the outer cup 4.

Thus, in the substrate processing apparatus 1, the arrangement of the second conductive portion 91 is simplified.

<Variation of the fourth embodiment> The substrate processing apparatus 1 of the variation may also include a deformable portion in the first conductive portion 90, or may include a deformable portion in the first conductive portion 90 and the second conductive portion 91. That is, at least one of the first conductive portion 90 and the second conductive portion 91 includes a deformable portion that deforms when in contact with the other conductive portion.

Thus, the substrate processing apparatus 1 of the modified example can suppress the impact when the first conductive portion 90 and the second conductive portion 91 are in contact. Therefore, the substrate processing apparatus 1 of the modified example can suppress the degradation of the first conductive portion 90 and the second conductive portion 91. In addition, the substrate processing apparatus 1 of the modified example can maintain the first conductive portion 90 and the second conductive portion 91 in a contact state at the contact position by deforming the deformable portion.

(Fifth Implementation) Referring to FIG. 19 and FIG. 20, the substrate processing apparatus 1 of the fifth implementation is described. The substrate processing apparatus 1 of the fifth implementation differs from the substrate processing apparatus 1 of the fourth implementation in that the first conductive portion 95 and the second conductive portion 96 are different. Here, the description will be centered on the differences from the substrate processing apparatus 1 of the fourth implementation. FIG. 19 is a schematic diagram of a state in which the first conductive portion 95 of the substrate processing apparatus 1 of the fifth implementation is located at a non-contact position. FIG. 20 is a schematic diagram of a state in which the first conductive portion 95 of the substrate processing apparatus 1 of the fifth implementation is located at a contact position.

The first conductive portion 95 includes a body portion 95a and an arm portion 95b. The body portion 95a is mounted on the processing liquid spray nozzle 21 and contacts the processing liquid spray nozzle 21. For example, the body portion 95a contacts the first body portion 35 of the processing liquid spray nozzle 21. The body portion 95a has a hole through which the first body portion 35 can slide.

The arm portion 95b is extended upward from the body portion 95a. The arm portion 95b is provided so that the upper end of the arm portion 95b is higher than the upper end of the nozzle block 20 and the upper end of the arm portion 10.

The second conductive portion 96 is provided in the processing container 2. Specifically, at least a portion of the second conductive portion 96 is provided on the top plate of the processing container 2. The second conductive portion 96 includes a body portion 96a and a deformable portion 96b. One end of the body portion 96a is provided above the standby position of the processing liquid spray nozzle 21.

The deformable portion 96b is provided to extend obliquely downward from one end of the main body 96a. The deformable portion 96b supports the main body 96a in a cantilevered state. The deformable portion 96b can rotate in the up-down direction relative to the main body 96a.

The deformable portion 96b contacts the first conductive portion 95 when the first conductive portion 95 is located at the contact position. The contact position is a position where the processing liquid ejecting nozzle 21 moves upward from the standby position.

When the first conductive portion 95 is located at the non-contact position, the deformed portion 96b is not in contact with the first conductive portion 95. The non-contact position includes, for example, a spraying position and a standby position.

The moving mechanism 11 (see FIG. 1 ) switches the positions of the processing liquid spraying nozzle 21 and the first conducting portion 95 between the contact position and the non-contact position by raising and lowering the processing liquid spraying nozzle 21 and the first conducting portion 95 .

When the treatment liquid discharge nozzle 21 moves upward from the standby position, the arm 95b of the first conductive portion 95 contacts the deformable portion 96b of the second conductive portion 96. The deformable portion 96b is pushed upward by the arm 95b, and rotates upward from the initial position and deforms with the body 96a side as a fulcrum.

When the treatment liquid ejection nozzle 21 moves downward from the contact position, the arm portion 95b of the first conductive portion 95 is separated from the deformed portion 96b of the second conductive portion 96. The deformed portion 96b of the second conductive portion 96 rotates downward with the body portion 96a as a fulcrum and returns to the initial position.

<Effect> The substrate processing device 1 includes a processing container 2. The processing container 2 accommodates a processing liquid spray nozzle 21 and a moving mechanism 11. The second conductive portion 96 is provided in the processing container 2. The moving mechanism 11 switches the positions of the processing liquid spray nozzle 21 and the first conductive portion 95 between a contact position and a non-contact position by raising and lowering the processing liquid spray nozzle 21 and the first conductive portion 95.

Thus, in the substrate processing apparatus 1 , the connection between the second conductive portion 96 provided in the processing container 2 and the conductive member outside the processing container 2 is simplified.

<Variation of the fifth embodiment> The substrate processing apparatus 1 of the variation can also deform the arm portion 95b of the first conductive portion 95.

(Sixth embodiment) Referring to FIG. 21 , the substrate processing apparatus 1 of the sixth embodiment is described. Here, the description focuses on the differences from the substrate processing apparatus 1 of the first embodiment, and the same symbols are given to the same parts as the substrate processing apparatus 1 of the first embodiment, and detailed descriptions are omitted. FIG. 21 is a three-dimensional view showing a part of the substrate processing apparatus 1 of the sixth embodiment. In addition, here, the right arm 5R is described as an example, but the left arm 5L also has the same structure.

The arm 100 of the substrate processing device 1 is a conductive member, such as a carbon-containing resin. The arm 100 is in contact with the processing liquid spray nozzle 21 and is electrically connected to the processing liquid spray nozzle 21. Specifically, the arm 100 has a contact portion 100a. The contact portion 100a is in contact with the processing liquid spray nozzle 21 and is electrically connected to the processing liquid spray nozzle 21. A hole is formed in the contact portion 100a through which the processing liquid spray nozzle 21 can slide.

The arm 100 is connected to a conductive member (e.g., a metal member) outside the processing container 2 (see FIG. 1 ). The arm 100 forms a conductive path from the processing liquid spray nozzle 21 to the conductive member outside the processing container 2. The conductive path is formed in a manner that is independent of the position of the processing liquid spray nozzle 21. That is, the terminal electrical properties of the processing liquid spray nozzle 21 are neutralized through the conductive path.

<Effect> The substrate processing device 1 includes a processing liquid spray nozzle 21 and an arm 100. The arm 100 is in contact with the processing liquid spray nozzle 21 and is electrically connected to the processing liquid spray nozzle 21.

Thus, the substrate processing apparatus 1 can suppress the charging of the processing liquid ejecting nozzle 21 by neutralizing the electrical properties of the processing liquid ejecting nozzle 21 through the arm 100. Therefore, the substrate processing apparatus 1 can suppress the generation of particles caused by the charging of the processing liquid ejecting nozzle 21.

(Seventh embodiment) Referring to FIG. 22 , the substrate processing apparatus 1 of the seventh embodiment is described. Here, the description is centered on the differences from the substrate processing apparatus 1 of the first embodiment, and the same symbols are given to the same parts as the substrate processing apparatus 1 of the first embodiment, and detailed descriptions are omitted. FIG. 22 is a three-dimensional view showing a part of the substrate processing apparatus 1 of the seventh embodiment. In addition, here, the right arm 5R is described as an example, but the left arm 5L also has the same structure.

The substrate processing device 1 includes an ionizer 101. The ionizer 101 is mounted on the arm 10. The ionizer 101 is disposed above the processing liquid spray nozzle 21. The ionizer 101 electrically neutralizes the processing liquid spray nozzle 21. The ionizer 101 irradiates X-rays toward the processing liquid spray nozzle 21 to generate ions around the processing liquid spray nozzle 21. The processing liquid spray nozzle 21 is electrically neutralized by neutralizing the charge of the charged processing liquid spray nozzle 21 with the ions. For example, a transparent resin plate is disposed on the bottom surface of the ionizer 101, and X-rays are irradiated through the resin plate.

The ionizer 101 irradiates X-rays toward the processing liquid spray nozzle 21 to electrically neutralize the processing liquid spray nozzle 21 when the substrate W is not held by the holding portion 3. That is, the ionizer 101 irradiates X-rays toward the processing liquid spray nozzle 21 to electrically neutralize the processing liquid spray nozzle 21 when the processing container 2 does not have the substrate W.

<Effect> The substrate processing device 1 includes a processing liquid spray nozzle 21 and an ionizer 101. The ionizer 101 neutralizes the electrical properties of the processing liquid spray nozzle 21.

Thereby, the substrate processing apparatus 1 can suppress the charging of the processing liquid ejecting nozzle 21. Therefore, the substrate processing apparatus 1 can suppress the generation of particles caused by the charging of the processing liquid ejecting nozzle 21.

The ionizer 101 electrically neutralizes the processing liquid spray nozzle 21 when the holding portion 3 does not hold the substrate W.

Thereby, the substrate processing apparatus 1 can prevent the processing liquid from being attached to the substrate W when the processing liquid spraying nozzle 21 is electrically neutralized.

<Variation of the seventh embodiment> The ionizer 101 of the substrate processing device 1 of the variation can also generate ions inside and supply the generated ions to the processing liquid spray nozzle 21 to electrically neutralize the processing liquid spray nozzle 21. The ionizer 101 supplies the generated ions toward the processing liquid spray nozzle 21 from a plurality of air supply holes provided on the bottom surface.

(Variation) The substrate processing device 1 of the variation can also dispose a part of the moving mechanism 11 at the nozzle block 20, 51, or the arm 10. For example, the substrate processing device 1 of the variation can rotate the nozzle block 51 (an example of a fixed member) relative to the arm 10 by means of the moving mechanism 11 (an example of a rotating mechanism). In this way, the substrate processing device 1 of the variation can change the spraying angle of the processing liquid during substrate processing. Therefore, the substrate processing device 1 of the variation can spray the processing liquid uniformly to the edge of the substrate W, and can etch the edge of the substrate W with high precision.

In addition, the substrate processing apparatus 1 of the modified example may not provide the processing liquid supply path 20a in the nozzle blocks 20 and 51, and the processing liquid supply pipe 5a may be directly connected to the processing liquid spray nozzle 80 as shown in FIG23. FIG23 is a cross-sectional view showing a part of the arm 5 of the modified example. A resin nut 81 is provided at the front end of the processing liquid supply pipe 5a. In addition, a threaded ridge into which the resin nut 81 can be screwed is formed on the first body portion 82 of the processing liquid spray nozzle 80.

Thus, the nozzle blocks 20 and 51 can be simplified in structure without providing the processing liquid supply path 20a in the nozzle blocks 20 and 51. Therefore, the cost can be reduced.

In addition, in the treatment liquid spraying nozzle 52 of the modified example, the inner wall surfaces 31c and 31e of the nozzle spraying portion 31 may be made more hydrophilic than the inner wall surface 35c of the first flow path 35a and the inner wall surface 36c of the second flow path 36a. For example, in the treatment liquid spraying nozzle 52 of the modified example, a portion of the inner wall surfaces 31c and 31e of the spraying flow path 31b including the inner wall surface 31e of the spray port 31d may be subjected to a hydrophilic treatment. In addition, in the treatment liquid spraying nozzle 52 of the modified example, the nozzle body 30 may be made of a resin having high chemical resistance and high hydrophobicity, and the nozzle spraying portion 31 may be made of a material having higher hydrophilicity than the nozzle body 30.

Thereby, bubbles become less likely to adhere to the ejection port 31d, and when the processing liquid is ejected, bubbles become less likely to be discharged together with the processing liquid. Therefore, the ejection state of the processing liquid can be stabilized.

In addition, the substrate processing device 1 of the modified example may also be provided with a substrate alignment mechanism on the arm 5. The substrate alignment mechanism is provided on the left arm 5L and the right arm 5R, respectively. The substrate alignment mechanism clamps the substrate W in the horizontal direction and aligns the position of the substrate W placed on the holding portion 3. Specifically, the substrate alignment mechanism adjusts the position of the substrate W so that the center of the substrate W is consistent with the rotation axis of the holding portion 3. The substrate processing device 1 of the modified example allows the holding portion 3 to hold the substrate W whose position is adjusted by the substrate alignment mechanism.

Thus, the substrate processing apparatus 1 of the modified example can etch the edge of the substrate W with high precision.

In addition, the substrate processing apparatus 1 of each embodiment may be combined with the substrate processing apparatus 1 of the modification. For example, the gas spray nozzle 71 may be provided in the substrate processing apparatus 1 of the first embodiment. For example, the processing liquid supply unit 50 of the second embodiment may be used in the substrate processing apparatus 1 of the fourth to seventh embodiments. In addition, although an example of using the processing liquid spray nozzles 21, 52, 80 of each embodiment to etch the edge of the substrate W is disclosed, they may also be used as processing liquid spray nozzles for etching or cleaning the entire surface of the substrate W, not just etching the edge of the substrate W.

In addition, it should be understood that all aspects of the embodiments disclosed herein are merely illustrative and are not intended to limit the present invention. In fact, the embodiments described above can be implemented in a variety of forms. In addition, the embodiments described above can also be omitted, replaced, or modified in various forms without departing from the scope and gist of the attached invention application.

1: substrate processing device 2: processing container 3: holding part (an example of substrate rotating part) 4: outer cup (an example of cup part) 4a: notch part 5: arm (an example of nozzle arm) 5a: processing liquid supply pipe 5L: left arm 5R: right arm 6: control device 6a: storage part 6b: control part 10,100: arm part 11: moving mechanism (an example of rotating mechanism) 12,50,70: Treatment liquid supply section 20,51: Nozzle block (an example of a fixed member) 20a: Treatment liquid supply path 20b: First recess 20c: Second recess 20d: Third recess 20e: Through hole 21,52,80: Treatment liquid spray nozzle 22: Bolt 30,53: Nozzle body 31: Nozzle spray section 31a: Insertion section 31b: Spray flow path 31c,31e: Inner wall surface 31d: Spray port 32,54: Connection part (an example of an angle changing mechanism) 32a: Mounting part 32b: Bolt hole 35,55,82: First body part 35a: First flow path 35b: Introducing part 35c: Inner wall surface 36: Second body part 36a: Second flow path 36b: Concave part 36c: Inner wall surface 38,39: O-ring 54a: Wrist part 55a: Engagement groove 55b: snap-fitting part 60: alignment part 60a: first alignment groove 60b: second alignment groove 71: gas spray nozzle 81: resin nut 90,95: first conductive part 91,96: second conductive part 91a,95a,96a: body 91b,96b: deformation part 95b: wrist 100a: contact part 101: ionizer A1,A2: spray angle W: substrate

FIG. 1 is a schematic diagram of the structure of the substrate processing device of the first embodiment. FIG. 2 is a perspective view of the processing liquid supply unit of the first embodiment. FIG. 3 is a top view of the processing liquid supply unit of the first embodiment. FIG. 4 is a cross-sectional view taken along line IV-IV of FIG. 3. FIG. 5 is a front view of the processing liquid spray nozzle of the first embodiment. FIG. 6 is a top view of the processing liquid spray nozzle of the first embodiment. FIG. 7 is a cross-sectional view taken along line VII-VII of FIG. 6. FIG. 8 is a flow chart for explaining the spray angle change process of the first embodiment. FIG. 9 is a top view of the processing liquid supply unit of the second embodiment. FIG. 10 is a top view of the processing liquid spray nozzle of the second embodiment. FIG. 11 is a cross-sectional view taken along line XI-XI of FIG. 10 . FIG. 12 is a perspective view of the treatment liquid spray nozzle of the second embodiment as viewed from an oblique bottom. FIG. 13 is a cross-sectional view taken along line XIII-XIII of FIG. 9 . FIG. 14 is a top view of the treatment liquid supply unit of the third embodiment. FIG. 15 is a schematic diagram illustrating the arrangement of the treatment liquid spray nozzle and the gas spray nozzle of the third embodiment. FIG. 16 is a perspective view showing a portion of the substrate processing apparatus of the fourth embodiment. FIG. 17 is a schematic diagram showing the state in which the treatment liquid spray nozzle is located at a standby position in the substrate processing apparatus of the fourth embodiment. FIG. 18 is a schematic diagram showing a state in which a treatment liquid spray nozzle is located at a spraying position in a substrate processing apparatus of the fourth embodiment. FIG. 19 is a schematic diagram showing a state in which a first conductive portion is located at a non-contact position in a substrate processing apparatus of the fifth embodiment. FIG. 20 is a schematic diagram showing a state in which a first conductive portion is located at a contact position in a substrate processing apparatus of the fifth embodiment. FIG. 21 is a perspective view showing a portion of a substrate processing apparatus of the sixth embodiment. FIG. 22 is a perspective view showing a portion of a substrate processing apparatus of the seventh embodiment. FIG. 23 is a cross-sectional view showing a portion of an arm of a modified example.

5a: Treatment liquid supply pipe

5R: Right arm

10: Arms

12: Treatment fluid supply unit

20: Nozzle block (an example of a fixed component)

20b: 1st concave part

20e: Through hole

21: Treatment liquid spray nozzle

22: Bolts

Claims (22)

A treatment liquid spraying nozzle is used to spray the treatment liquid used for substrate treatment, comprising: a nozzle body, having: a first body, forming a first flow path connected to the treatment liquid supply path; and a second body, forming a second flow path connected to the first flow path and bent relative to the first body; an angle changing mechanism, for a fixing member fixing the nozzle body, changing the angle of the nozzle body in the horizontal direction; and a nozzle spraying part, forming a spraying flow path connected to the second flow path, spraying the treatment liquid onto the substrate; the nozzle spraying part can be loaded and unloaded at the front end of the second body. As in claim 1, the treatment liquid spray nozzle, wherein the angle changing mechanism is a connecting portion that can change the mounting position of the fixed component. As in claim 1, the treatment liquid spray nozzle, wherein the angle changing mechanism is a connecting portion that supports the first main body portion in a rotatable manner. As in claim 3, the treatment liquid spraying nozzle, wherein the nozzle body and the connecting portion include an alignment portion aligned with the angle. For example, in the treatment liquid spray nozzle of claim 1, the diameter of the spray flow path is smaller than the diameter of the second flow path. As in claim 1, the treatment liquid spraying nozzle, wherein the inner wall surface of the spraying portion of the nozzle has a higher hydrophilicity than the inner wall surfaces of the first flow path and the second flow path. A nozzle arm comprises: a treatment liquid spraying nozzle as in any one of claim items 1 to 6; the fixed component; an arm portion on which the fixed component is mounted; and a rotating mechanism for rotating the fixed component or the arm portion in a horizontal direction. A nozzle arm as claimed in claim 7, wherein the rotating mechanism causes the fixed member to rotate relative to the arm. The nozzle arm of claim 7 further comprises a gas spray nozzle, which sprays gas so that the processing liquid sprayed onto the substrate and scattered above the substrate is discharged to the outside of the substrate. The nozzle arm of claim 9, wherein the gas spray nozzle is arranged further inward than the treatment liquid spray nozzle. The nozzle arm of claim 9, wherein the gas spray nozzle sprays the gas at a spray angle greater than the spray angle of the processing liquid relative to the tangent line of the substrate in the horizontal direction. A substrate processing device comprises: a nozzle arm as claimed in claim 7; and a substrate rotating part for rotating a mounted substrate; and a processing liquid spraying nozzle for spraying processing liquid toward the edge of the substrate. A substrate processing device comprises: a nozzle arm as claimed in claim 7; a substrate rotating unit for rotating a mounted substrate; and a control unit for controlling the processing liquid spraying nozzle and the substrate rotating unit; wherein the control unit sets a rotation angle of the rotating mechanism in accordance with substrate processing; and sprays the processing liquid toward the substrate at the set rotation angle. A substrate processing device as claimed in claim 13, wherein the control unit changes the rotation angle during the substrate processing. A substrate processing device comprises: a processing liquid spray nozzle as claimed in any one of claims 1 to 6; a first conductive portion, which contacts the processing liquid spray nozzle and is in electrical communication with the processing liquid spray nozzle; a second conductive portion, which contacts the first conductive portion and is in electrical communication with the processing liquid spray nozzle to neutralize the electrical properties of the processing liquid spray nozzle; and a moving mechanism, which switches the position of the processing liquid spray nozzle and the first conductive portion between a contact position where the first conductive portion contacts the second conductive portion and a non-contact position where the first conductive portion does not contact the second conductive portion. A substrate processing device as claimed in claim 15, wherein at least one of the first conductive portion and the second conductive portion includes a deformable portion that deforms when in contact with the other conductive portion. The substrate processing device of claim 15 further comprises: a holding portion for holding a substrate when the substrate processing is performed; and a cup portion disposed around the outer side of the substrate held by the holding portion; and the second conductive portion is disposed on the cup portion. The substrate processing device of claim 15 further comprises a processing container, which accommodates the processing liquid spray nozzle and the moving mechanism; the second conductive part is arranged in the processing container; the moving mechanism switches the position of the processing liquid spray nozzle and the first conductive part between the contact position and the non-contact position by lifting and lowering the processing liquid spray nozzle and the first conductive part. A substrate processing device, comprising: a processing liquid spray nozzle as in any one of claims 1 to 6; and an arm, which contacts the processing liquid spray nozzle and is in electrical communication with the processing liquid spray nozzle. A substrate processing device, comprising: a processing liquid spray nozzle as in any one of claims 1 to 6; and an ionizer to electrically neutralize the processing liquid spray nozzle. The substrate processing device of claim 20 further comprises a holding portion for holding the substrate when the substrate processing is performed; and the ionizer electrically neutralizes the processing liquid spray nozzle when the substrate is not held in the holding portion. A substrate processing method, using a nozzle arm as in claim 7 to spray a processing liquid onto a substrate, comprises the following steps: a setting step, setting the rotation angle of the rotating mechanism corresponding to the substrate processing; and a spraying step, spraying the processing liquid toward the substrate at the set rotation angle.

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