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TWI853016B - Metrology apparatus and method using mechanical filter - Google Patents

Metrology apparatus and method using mechanical filter Download PDF

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Publication number
TWI853016B
TWI853016B TW109112935A TW109112935A TWI853016B TW I853016 B TWI853016 B TW I853016B TW 109112935 A TW109112935 A TW 109112935A TW 109112935 A TW109112935 A TW 109112935A TW I853016 B TWI853016 B TW I853016B
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diagnostic
light
target
diagnostic light
current target
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TW202107210A (en
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保羅 亞歷山大 麥肯茲
傑西 昆恩 歐鐸
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荷蘭商Asml荷蘭公司
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05GX-RAY TECHNIQUE
    • H05G2/00Apparatus or processes specially adapted for producing X-rays, not involving X-ray tubes, e.g. involving generation of a plasma
    • H05G2/001Production of X-ray radiation generated from plasma
    • H05G2/002Supply of the plasma generating material
    • H05G2/0027Arrangements for controlling the supply; Arrangements for measurements
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008Production of exposure light, i.e. light sources
    • G03F7/70033Production of exposure light, i.e. light sources by plasma extreme ultraviolet [EUV] sources

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)

Abstract

A metrology apparatus includes: a diagnostic apparatus configured to interact a diagnostic probe with a current target at a diagnostic region before the current target enters a target space; a detection apparatus; and a control system in communication with the detection apparatus. The detection apparatus includes: a light sensor having a field of view overlapping with the diagnostic region and configured to sense light produced from the interaction between the diagnostic probe and the current target at the diagnostic region; and a mechanical filter between the diagnostic region and the light sensor. The mechanical filter includes an optical beam reducer and an optical mask defining an aperture positioned between the optical beam reducer and the light sensor. The control system is configured to estimate a property of the current target based on the output from the light sensor.

Description

使用機械濾光器之度量衡裝置及方法Metrology device and method using mechanical filter

所揭示之主題係關於度量衡裝置及使用機械濾光器來在極紫外光源中之兩種類型之光之間進行區分的方法。 The disclosed subject matter relates to metrology apparatus and methods for using mechanical filters to distinguish between two types of light in an extreme ultraviolet light source.

在半導體微影(或光微影)中,製造積體電路(integrated circuit;IC)包括對半導體(例如,矽)基板(其亦稱作晶圓)執行多種物理及化學製程。光微影曝光裝置或掃描器為將所要圖案施加至基板之目標部分上的機器。晶圓係由沿軸向方向延伸之光束輻照,且晶圓經固定至載物台使得晶圓大體上沿實質上與軸向方向正交之橫向平面延伸。光束可具有在例如自約10奈米(nm)至約400nm之紫外(ultraviolet;UV)範圍(range)內之波長,且具體言之在自約100nm至約400nm之深UV(deep UV;DUV)範圍內或在小於約100nm(或大約50nm或更小,及包括13nm)之極紫外(extreme ultraviolet;EUV)範圍內之波長。光束沿軸向方向(其與晶圓沿其延伸之橫向平面正交)行進。 In semiconductor lithography (or photolithography), the manufacture of integrated circuits (ICs) involves performing a variety of physical and chemical processes on a semiconductor (e.g., silicon) substrate, also called a wafer. A photolithography exposure apparatus or scanner is a machine that applies the desired pattern to a target portion of the substrate. The wafer is irradiated with a beam extending in an axial direction, and the wafer is secured to a stage so that the wafer extends generally along a transverse plane that is substantially orthogonal to the axial direction. The light beam may have a wavelength in the ultraviolet (UV) range, for example, from about 10 nanometers (nm) to about 400 nm, and specifically in the deep UV (DUV) range from about 100 nm to about 400 nm or in the extreme ultraviolet (EUV) range of less than about 100 nm (or about 50 nm or less, and including 13 nm). The light beam travels in an axial direction (which is orthogonal to the lateral plane along which the wafer extends).

用以產生EUV光之方法包括但未必限於利用在EUV範圍內之發射譜線來將具有一元素(例如,氙、鋰或錫)之材料轉換成電漿狀態。在常常稱為雷射產生電漿(laser produced plasma;「LPP」)之一種此類方 法中,可藉由利用可稱作驅動雷射之經放大光束輻照目標材料(例如,呈材料之小滴、板、帶、串流或叢集之形式)來產生所需電漿。對於此製程,通常在例如真空腔室之密封容器中產生電漿,且使用各種類型之度量衡設備來監視電漿。 Methods for generating EUV light include, but are not necessarily limited to, utilizing emission lines in the EUV range to convert a material having an element (e.g., xenon, lithium, or tin) into a plasma state. In one such method, often referred to as laser produced plasma ("LPP"), the desired plasma may be generated by irradiating a target material (e.g., in the form of a droplet, slab, ribbon, stream, or cluster of material) with an amplified beam of light, which may be referred to as a drive laser. For this process, the plasma is typically generated in a sealed container, such as a vacuum chamber, and various types of metrology equipment are used to monitor the plasma.

在一些通用態樣中,度量衡裝置包括:診斷裝置,其經組態以在該當前目標進入目標空間之前在診斷區處使診斷探針與當前目標相互作用;偵測裝置;以及控制系統,其與偵測裝置通信。偵測裝置包括:光感測器,其具有與診斷區重疊之視場且經組態以感測由在診斷區處診斷探針與當前目標之間的相互作用產生之光;以及機械濾光器,其在診斷區與光感測器之間。機械濾光器包括光束縮減器及光學遮罩,該光學遮罩界定定位於光束縮減器與光感測器之間的孔口。控制系統經組態以基於來自光感測器之輸出而估計當前目標之屬性。 In some general aspects, a metrology device includes: a diagnostic device configured to cause a diagnostic probe to interact with a current target at a diagnostic region before the current target enters a target space; a detection device; and a control system in communication with the detection device. The detection device includes: a light sensor having a field of view overlapping the diagnostic region and configured to sense light generated by an interaction between the diagnostic probe and the current target at the diagnostic region; and a mechanical filter between the diagnostic region and the light sensor. The mechanical filter includes a beam reducer and an optical mask defining an aperture positioned between the beam reducer and the light sensor. The control system is configured to estimate the properties of the current target based on the output from the light sensor.

實施方案可包括以下特徵中之一或多者。舉例而言,機械濾光器可經組態以在角度上分離自診斷區發射之診斷光與自目標空間發射之非診斷光。診斷光可由在診斷區處當前目標與診斷探針之間的相互作用產生。非診斷光可包括自藉由目標空間中之先前目標產生之電漿發射的光。孔口之橫向範圍(extent)可約與光學遮罩之平面中之診斷光的橫向範圍相同或大於光學遮罩之平面中之診斷光的橫向範圍,且光學遮罩之橫向範圍可大於光學遮罩之平面中之非診斷光的橫向範圍或約與光學遮罩之平面中之非診斷光的橫向範圍相同。光學遮罩可經定位以使得自目標空間發射之非診斷光實質上由光學遮罩阻擋,而診斷光實質上穿過孔口。 Implementations may include one or more of the following features. For example, a mechanical filter may be configured to angularly separate diagnostic light emitted from a diagnostic region from non-diagnostic light emitted from a target space. Diagnostic light may be generated by the interaction between a current target at the diagnostic region and a diagnostic probe. Non-diagnostic light may include light emitted from plasma generated by a previous target in the target space. The lateral extent of the aperture may be approximately the same as or greater than the lateral extent of the diagnostic light in the plane of the optical mask, and the lateral extent of the optical mask may be greater than or approximately the same as the lateral extent of the non-diagnostic light in the plane of the optical mask. The optical mask may be positioned so that the non-diagnostic light emitted from the target space is substantially blocked by the optical mask, while the diagnostic light substantially passes through the aperture.

機械濾光器可包括診斷區與光束縮減器之間的光學準直 器。光束縮減器可為無焦光束縮減器且可經組態為與光學準直器結合以將有限物件投影至無限。光學準直器及最接近光學準直器之具有正焦距的光束縮減器之組件可整合至單個折射元件中。光束縮減器可經組態以維持光之準直狀態。 The mechanical filter may include an optical collimator between the diagnostic region and the beam reducer. The beam reducer may be an afocal beam reducer and may be configured to be combined with the optical collimator to project a finite object to infinity. The assembly of the optical collimator and the beam reducer with a positive focal length proximal to the optical collimator may be integrated into a single refractive element. The beam reducer may be configured to maintain the collimated state of the light.

光感測器可包括以下一或多者:光電二極體、光電晶體、光相依電阻器、光電倍增管、多單元光接收器、四單元光接收器及相機。 The photo sensor may include one or more of the following: a photodiode, a phototransistor, a photodependent resistor, a photomultiplier tube, a multi-cell photoreceiver, a quad-cell photoreceiver, and a camera.

診斷探針可包括至少一個診斷光束,且光感測器經組態以感測由當前目標與至少一個診斷光束之間的相互作用產生之診斷光。診斷光可包括自當前目標反射、自當前目標散射或由當前目標阻擋之診斷光束。 The diagnostic probe may include at least one diagnostic beam, and the light sensor is configured to sense the diagnostic light generated by the interaction between the current target and the at least one diagnostic beam. The diagnostic light may include the diagnostic beam reflected from the current target, scattered from the current target, or blocked by the current target.

偵測裝置可包括光譜濾光器及偏振濾光器中之一或多者。 The detection device may include one or more of a spectral filter and a polarization filter.

診斷探針可包括第一診斷光束及第二診斷光束,該第一診斷光束及第二診斷光束各自經組態以在其進入目標空間之前與當前目標相互作用,每一相互作用發生於相異區及相異時間處。 The diagnostic probe may include a first diagnostic beam and a second diagnostic beam, each of which is configured to interact with a current target before it enters the target space, each interaction occurring at a different region and at a different time.

光束縮減器可包括折射望遠鏡、反射望遠鏡或反射折射望遠鏡。折射望遠鏡可包括:正焦距透鏡配置及負焦距透鏡配置,其由其焦距之總和分離;或一對正焦距透鏡配置,其由其焦距之總和分離。 The beam reducer may include a refractive telescope, a reflective telescope, or a reflective-refractive telescope. The refractive telescope may include: a positive focal length lens configuration and a negative focal length lens configuration, which are separated by the sum of their focal lengths; or a pair of positive focal length lens configurations, which are separated by the sum of their focal lengths.

光束縮減器可經組態以將照射光之橫向大小縮減至少五倍、至少十倍、至少二十倍或約十倍。 The beam reducer can be configured to reduce the lateral size of the impinging light by at least five times, at least ten times, at least twenty times, or approximately ten times.

孔口可包括圓形開口、橢圓開口、多邊形開口或細長狹縫開口。 The opening may include a circular opening, an elliptical opening, a polygonal opening, or a slit opening.

偵測裝置可定位於極紫外(EUV)光源之腔室外部,診斷區可在腔室內部,且偵測裝置可經由腔室之壁中之光學窗自腔室接收光。診 斷區與光學窗之間的距離可為診斷區與目標空間之間的距離之大小之約200至500倍。 The detection device may be positioned outside a chamber of an extreme ultraviolet (EUV) light source, the diagnostic region may be inside the chamber, and the detection device may receive light from the chamber through an optical window in a wall of the chamber. The distance between the diagnostic region and the optical window may be about 200 to 500 times the size of the distance between the diagnostic region and the target space.

偵測裝置可包括孔口之輸出端處之聚焦透鏡,聚焦透鏡經組態以將所感測光聚焦至光感測器上。 The detection device may include a focusing lens at the output end of the aperture, the focusing lens being configured to focus the sensed light onto the light sensor.

孔口可具有至少2毫米(mm)之範圍。孔口可經定位以在診斷光在其處為準直或為非收斂及非發散之方位處接收診斷光。 The aperture may have a range of at least 2 millimeters (mm). The aperture may be positioned to receive diagnostic light at an orientation where the diagnostic light is collimated or non-convergent and non-divergent.

在另一通用態樣中,度量衡方法包括:在當前目標進入目標空間之前在診斷區處使診斷探針與當前目標相互作用;收集由在診斷區處診斷探針與當前目標之間的相互作用產生之診斷光,該收集亦包括收集由目標空間產生之非診斷光;使診斷光及非診斷光準直;使診斷光與非診斷光彼此在角度上分離包括縮減診斷光及非診斷光之橫向範圍;在診斷光及非診斷光已在角度上分離之後在自由非診斷光穿過之非感測區橫向移位之感測區處感測診斷光;以及基於所感測診斷光而估計當前目標之屬性。 In another general aspect, the metrology method includes: causing a diagnostic probe to interact with a current target at a diagnostic region before the current target enters a target space; collecting diagnostic light generated by the interaction between the diagnostic probe and the current target at the diagnostic region, the collection also including collecting non-diagnostic light generated by the target space; causing the diagnostic light and non-diagnostic light to interact with each other at a diagnostic region; Collimating the diagnostic light; angularly separating the diagnostic light and the non-diagnostic light from each other including reducing the lateral range of the diagnostic light and the non-diagnostic light; sensing the diagnostic light at a sensing area laterally displaced from the non-sensing area through which the free non-diagnostic light passes after the diagnostic light and the non-diagnostic light have been angularly separated; and estimating the properties of the current target based on the sensed diagnostic light.

實施方案可包括以下特徵中之一或多者。舉例而言,診斷探針可藉由在診斷區處使一或多個診斷光束與當前目標相互作用來在診斷區處與當前目標相互作用;且診斷光可藉由在診斷區處收集已自當前目標反射、自當前目標散射或由當前目標阻擋之一或多個診斷光束來收集。 Implementations may include one or more of the following features. For example, the diagnostic probe may interact with a current target at a diagnostic region by causing one or more diagnostic beams to interact with the current target at the diagnostic region; and the diagnostic light may be collected by collecting one or more diagnostic beams at the diagnostic region that have been reflected from, scattered from, or blocked by the current target.

度量衡方法可進一步包括基於其光譜屬性及其偏振狀態中之一或多者而過濾診斷光。 The metrology method may further include filtering the diagnostic light based on one or more of its spectral properties and its polarization state.

診斷區可在極紫外(EUV)光源之氣密密封腔室內部,且亦包括收集非診斷光之收集診斷光可包括接收包括經由腔室之壁中之光學窗傳輸之非診斷光的診斷光。 The diagnostic area may be inside a hermetically sealed chamber of an extreme ultraviolet (EUV) light source and also include collecting non-diagnostic light. The collecting diagnostic light may include receiving diagnostic light including non-diagnostic light transmitted through an optical window in a wall of the chamber.

診斷光及非診斷光之橫向範圍可藉由將診斷光及非診斷光 之橫向範圍縮減五倍、至少十倍、至少二十倍或約十倍來縮減。 The lateral range of diagnostic and non-diagnostic light can be reduced by reducing the lateral range of diagnostic and non-diagnostic light by five times, at least ten times, at least twenty times, or approximately ten times.

度量衡方法亦可包括阻擋非感測區處之非診斷光或重新引導該非診斷光。診斷光及非診斷光之橫向範圍可藉由以下中之一或多者縮減:折射該光及反射該光。 The metrology method may also include blocking non-diagnostic light at the non-sensing area or redirecting the non-diagnostic light. The lateral range of the diagnostic light and the non-diagnostic light may be reduced by one or more of the following: refracting the light and reflecting the light.

度量衡方法亦可包括將診斷光聚焦在感測區處。 Metrology methods may also include focusing the diagnostic light at the sensing area.

診斷光及非診斷光之橫向範圍可藉由維持診斷光及非診斷光之準直狀態來縮減。 The lateral range of diagnostic and non-diagnostic light can be reduced by maintaining the collimation of diagnostic and non-diagnostic light.

度量衡方法亦可包括在診斷光及非診斷光在角度上彼此分離之後及在診斷光經感測之前,使診斷光穿過光學遮罩之孔口,該孔口具有大於診斷光之範圍的範圍。 The metrology method may also include passing the diagnostic light through an aperture of an optical mask having a range greater than the range of the diagnostic light after the diagnostic light and the non-diagnostic light are angularly separated from each other and before the diagnostic light is sensed.

10:殼體 10: Shell

20:部分 20: Part

30:微影控制系統 30: Micro-image control system

100:度量衡裝置 100:Weight and measurement equipment

105:目標 105: Target

105':現有目標 105': Current goal

105c:當前目標 105c: Current goal

105p:先前目標 105p: Previous target

106:連續流 106: Continuous Flow

110:目標空間 110: Target space

115:環境 115: Environment

120:診斷光 120: Diagnostic light

121:準直光束 121: Collimated beam

122:非診斷光 122: Non-diagnostic radiography

123:準直光束 123: Collimated beam

125:診斷探針 125: Diagnostic probe

130:光感測器 130: Light sensor

135:偵測裝置 135: Detection device

140:機械濾光器 140: Mechanical filter

142:光學準直器 142:Optical collimator

145:診斷區 145: Diagnosis area

150:光束縮減器 150: Beam reducer

152:光學路徑 152:Optical path

155:光學遮罩 155:Optical mask

160:孔口 160: Orifice

165:診斷裝置 165: Diagnostic device

170:控制系統 170: Control system

175:目標供應裝置 175: Target supply device

255A:遮罩 255A: Mask

255B:遮罩 255B: Mask

256A:範圍 256A: Range

256B:範圍 256B: Range

260A:孔口 260A: Orifice

260B:孔口 260B: Orifice

261A:範圍 261A: Range

261B:範圍 261B: Range

330:感測器 330:Sensor

335:偵測裝置 335: Detection device

342:光學準直器 342:Optical collimator

342a:透鏡 342a: Lens

342b:透鏡 342b: Lens

350:光束縮減器 350: Beam reducer

351:正焦距透鏡配置 351: Positive focal length lens configuration

351a:凸透鏡 351a: Convex lens

351b:凹透鏡 351b: Concave lens

352:光學路徑 352:Optical path

353:負焦距透鏡配置 353: Negative focal length lens configuration

354:輔助透鏡 354: Auxiliary lens

355:遮罩 355: Mask

357:收斂透鏡 357: Converging lens

360:孔口 360: Orifice

430:感測器 430:Sensor

435:偵測裝置 435: Detection device

442:光學準直器 442:Optical collimator

442a:透鏡 442a: Lens

442b:透鏡 442b: Lens

450:光束縮減器 450: Beam reducer

451:輸入正焦距透鏡配置 451: Input positive focal length lens configuration

451a:凸透鏡 451a: Convex lens

451b:凹透鏡 451b: Concave lens

452:光學路徑 452:Optical path

453:輸出正焦距透鏡配置 453: Output positive focal length lens configuration

455:遮罩 455: Mask

457:收斂透鏡 457: Converging lens

460:孔口 460: Orifice

535:偵測裝置 535: Detection device

543:光譜濾光器 543: Spectral filter

544:偏振濾光器 544: Polarization filter

611A:光束 611A: Beam

611B:光束 611B: Beam

611C_1:光束 611C_1: Beam

611C_2:光束 611C_2: Beam

620A:診斷光 620A: Diagnostic light

620B_1:診斷光 620B_1: Diagnostic light

620B_2:光 620B_2: Light

625A:探針光束 625A: Probe beam

625B_1:探針光束 625B_1: Probe beam

625B_2:探針光束 625B_2: Probe beam

625C_1:探針光束 625C_1: Probe beam

625C_2:探針光束 625C_2: Probe beam

626A:光源 626A: Light source

626B:光源 626B: Light source

626C_1:光源 626C_1: Light source

626C_2:光源 626C_2: Light source

627A:光學元件 627A:Optical components

627B:光學元件 627B:Optical components

627C_1:光學元件 627C_1: Optical components

627C_2:光學元件 627C_2: Optical components

665A:診斷裝置 665A: Diagnostic equipment

665B:診斷裝置 665B: Diagnostic equipment

665C:診斷裝置 665C: Diagnostic equipment

700:度量衡裝置 700:Weight and measurement equipment

706:連續流 706: Continuous Flow

710:目標空間 710: Target space

715:真空環境 715: Vacuum environment

716:腔室 716: Chamber

725:診斷探針 725: Diagnostic probe

735:偵測裝置 735: Detection device

736:光學窗 736:Optical window

745:診斷區 745: Diagnostic area

765:診斷裝置 765: Diagnostic device

775:目標供應裝置 775: Target supply device

776:EUV光源 776:EUV light source

777:EUV光 777:EUV light

778:輻射脈衝 778: Radiation Pulse

779:輸出裝置 779: Output device

780:EUV集光器 780:EUV light collector

781:光學源 781: Optical source

782:致動系統 782: Actuation system

783:控制裝置 783: Control device

784:EUV光 784:EUV light

785:電漿 785: Plasma

870:控制系統 870:Control system

871:信號處理模組 871:Signal processing module

872:診斷控制模組 872: Diagnosis control module

873:記憶體 873:Memory

874i:輸入裝置 874i: Input device

874o:輸出裝置 874o: Output device

883:控制裝置 883: Control device

884:光學源致動模組 884: Optical source actuation module

885:目標遞送模組 885: Target delivery module

979:微影裝置 979: Lithography device

1090:過程 1090: Process

1091,1092,1093,1094,1095,1096:步驟 1091,1092,1093,1094,1095,1096: Steps

1142:折射元件 1142: Refractive element

1151:折射元件 1151: Refractive element

1200:度量衡裝置 1200:Weight and measurement equipment

1220:診斷光 1220: Diagnostic light

1222:非診斷光 1222: Non-diagnostic radiography

1225:診斷探針光束 1225: Diagnostic probe beam

1230:二維感測器 1230: Two-dimensional sensor

1265:診斷裝置 1265: Diagnostic device

1350:反射光束縮減器 1350:Reflected beam reducer

1351:凹形反射性元件 1351: Concave reflective element

1352:光學路徑 1352:Optical path

1353:凸形反射性元件 1353: Convex reflective element

1450:反射折射光束縮減器 1450: Reflective-refractive beam reducer

1451a:平坦反射性元件 1451a: Flat reflective element

1451b:曲形反射性元件 1451b: Curved reflective element

1453:凸形/收斂折射元件 1453: Convex/convergent refractive element

1555:遮罩 1555:Mask

1560:孔口 1560: Orifice

B:曝光光束 B: Exposure beam

d:距離 d: distance

f1:焦距 f1: focal length

f2:焦距 f2: focal length

IF:中間焦點 IF:Intermediate focus

M:遮罩 M:Mask

R1:反射光學元件 R1: Reflective optical element

R2:反射光學元件 R2: Reflective optical element

R3:反射光學元件 R3: Reflective optical element

S:狹縫 S: narrow seam

t:時間 t: time

t1:時間 t1: time

t2:時間 t2: time

TR:軌跡 TR: Track

V:速率 V: rate

W:基板 W: Substrate

x:位置 x: position

x1:方位 x1: Direction

x2:方位 x2: Direction

△d:距離/分離度 △d: distance/separation

圖1為包括具有用於收集在環境內產生之診斷光及非診斷光之機械濾光器之偵測裝置的度量衡裝置之示意性圖解,該診斷光由診斷區中之目標產生且該非診斷光由不同於診斷區之目標空間中之目標產生;圖2A為可在圖1之機械濾光器中使用之遮罩之實施方案的示意性圖解;圖2B為可在圖1之機械濾光器中使用之遮罩之實施方案的示意性圖解;圖3為包括設計為折射Galilean望遠鏡之光束縮減器的圖1之偵測裝置之實施方案的示意性圖解;圖4為包括設計為折射Keplerian望遠鏡之光束縮減器的圖1之偵測裝置之實施方案的示意性圖解;圖5為圖1之度量衡裝置之實施方案的示意性圖解,其中偵 測裝置包括一或多個光譜濾光器及偏振濾光器;圖6A為產生單個診斷光束之診斷裝置之實施方案的示意性圖解及方塊圖;圖6B為由單個光源產生兩個診斷光束之診斷裝置之實施方案的示意性圖解及方塊圖;圖6C為由相應光源產生兩個診斷光束之診斷裝置之實施方案的示意性圖解及方塊圖;圖7為在極紫外(EUV)光源中實施之圖1之度量衡裝置之實施方案的示意性圖解;圖8為圖1之度量衡裝置之控制裝置之實施方案的方塊圖;圖9為接收自圖7之EUV光源輸出之EUV光的微影裝置之實施方案的示意性圖解;圖10為由圖1之度量衡裝置執行以估計當前目標之一或多個屬性的過程之流程圖;圖11為包括設計為折射Galilean望遠鏡之光束縮減器且其中光學準直器及光束縮減器之正焦距透鏡經整合至單個折射元件中的圖1之偵測裝置之實施方案的示意性圖解;圖12為圖1之度量衡裝置之實施方案的示意性圖解,其中診斷探針為目標提供背部照明以使得目標之陰影由遮掩診斷探針之至少一部分的目標形成;圖13為包括設計為反射離軸望遠鏡之光束縮減器的圖1之偵測裝置之實施方案的示意性圖解;圖14為包括設計為反射折射離軸望遠鏡之光束縮減器的圖 1之偵測裝置之實施方案的示意性圖解;以及圖15為圖1之度量衡裝置之實施方案的示意性圖解,其中機械濾光器包括阻擋診斷光同時容許非診斷光穿過至感測器的遮罩。 FIG. 1 is a schematic diagram of a metrology device including a detection device having a mechanical filter for collecting diagnostic light and non-diagnostic light generated in an environment, wherein the diagnostic light is generated by a target in a diagnostic region and the non-diagnostic light is generated by a target in a target space different from the diagnostic region; FIG. 2A is a schematic diagram of an embodiment of a mask that can be used in the mechanical filter of FIG. 1; FIG. 2B is a schematic diagram of an embodiment of a mask that can be used in the mechanical filter of FIG. 1; FIG. 3 is a schematic diagram of an embodiment of the detection device of FIG. 1 including a beam reducer designed as a refractive Galilean telescope; FIG. 4 is a schematic diagram of an embodiment of the detection device of FIG. 1 including a beam reducer designed as a refractive Galilean telescope; FIG. 5 is a schematic diagram of an embodiment of the metrology device of FIG. 1 , wherein the detector device includes one or more spectral filters and polarization filters; FIG. 6A is a schematic diagram and block diagram of an embodiment of a diagnostic device that generates a single diagnostic beam; FIG. 6B is a schematic diagram and block diagram of an embodiment of a diagnostic device that generates two diagnostic beams from a single light source; FIG. 6C is a schematic diagram and block diagram of an embodiment of a diagnostic device that generates two diagnostic beams from corresponding light sources; FIG. 7 is a schematic diagram and block diagram of an embodiment of a diagnostic device that generates two diagnostic beams from corresponding light sources; and FIG. 8 is a schematic diagram of an embodiment of a diagnostic device that generates two diagnostic beams from corresponding light sources. FIG. 8 is a block diagram of an embodiment of a control device for the metrology device of FIG. 1 ; FIG. 9 is a schematic diagram of an embodiment of a lithography device that receives EUV light output from the EUV light source of FIG. 7 ; FIG. 10 is a flow chart of a process performed by the metrology device of FIG. 1 to estimate one or more properties of a current target; FIG. 11 is a schematic diagram of an embodiment of a detection device of FIG. 1 including a beam reducer designed as a refractive Galilean telescope and in which the positive focal length lens of the optical collimator and the beam reducer are integrated into a single refractive element; FIG. is a schematic illustration of an embodiment of the metrology device of FIG. 1 , wherein the diagnostic probe provides back illumination to the target such that a shadow of the target is formed by the target obscuring at least a portion of the diagnostic probe; FIG. 13 is a schematic illustration of an embodiment of the detection device of FIG. 1 including a beam reducer designed as a reflective off-axis telescope; FIG. 14 is a schematic illustration of an embodiment of the detection device of FIG. 1 including a beam reducer designed as a catadioptric off-axis telescope; and FIG. 15 is a schematic illustration of an embodiment of the metrology device of FIG. 1 , wherein the mechanical filter includes a mask that blocks diagnostic light while allowing non-diagnostic light to pass to the sensor.

申請人應注意圖式可能並非按比例的。舉例而言,示意性圖解中之光學元件之間的距離可大於或小於所展示的。 Applicants should note that the drawings may not be to scale. For example, the distances between optical elements in the schematic illustrations may be greater or less than shown.

參看圖1,度量衡裝置100經組態以用於估計在環境115內沿軌跡TR朝向目標空間110行進之當前目標105c之一或多個屬性。度量衡裝置100經組態以藉由分析在當前目標105c進入目標空間110之前由於一或多個診斷探針125與當前目標105c之間的相互作用產生之光(稱為診斷光120)來估計當前目標105c之至少一個屬性(諸如速度、方位、速率、方向)。然而,非診斷光122與診斷光120同時及相近似地產生。此非診斷光122可使度量衡裝置100內之光感測器130飽和或可干涉度量衡裝置100中之光感測器130之操作。因為此,非診斷光122可縮減由度量衡裝置100執行之分析之準確度且因此引起當前目標105c之所估計屬性的誤差。 1 , a metrology device 100 is configured to estimate one or more properties of a current target 105c traveling along a trajectory TR toward a target space 110 within an environment 115. The metrology device 100 is configured to estimate at least one property (e.g., speed, position, velocity, direction) of the current target 105c by analyzing light (referred to as diagnostic light 120) generated by the interaction between one or more diagnostic probes 125 and the current target 105c before the current target 105c enters the target space 110. However, non-diagnostic light 122 is generated simultaneously and similarly to the diagnostic light 120. This non-diagnostic light 122 may saturate the photodetector 130 within the metrology device 100 or may interfere with the operation of the photodetector 130 within the metrology device 100. As such, the non-diagnostic light 122 may reduce the accuracy of the analysis performed by the metrology device 100 and thereby cause errors in the estimated properties of the current target 105c.

度量衡裝置100能夠更有效地及準確地估計當前目標105c之屬性,因為其能夠更有效地在診斷光120與非診斷光122之間進行區分。為此目的,度量衡裝置100包括偵測裝置135,該偵測裝置135包括光感測器130及在診斷區145(當前目標105c在其處與診斷探針125相互作用)與光感測器130之間的機械濾光器140。機械濾光器140包括光束縮減器150及界定透光孔口160之不透光光學遮罩155。孔口160定位於光束縮減器150與光感測器130之間。為了恰當地感測診斷光120,光感測器130經定位以使得其視場與診斷區145重疊。度量衡裝置100亦包括產生診斷探 針125之診斷裝置165及與偵測裝置135通信之控制系統170。控制系統170自感測器130接收輸出且對此輸出執行分析以估計當前目標105c之一或多個屬性。 The metrology device 100 is able to more efficiently and accurately estimate the properties of the current target 105c because it is able to more effectively distinguish between diagnostic light 120 and non-diagnostic light 122. To this end, the metrology device 100 includes a detection device 135, which includes a photo sensor 130 and a mechanical filter 140 between a diagnostic region 145 (where the current target 105c interacts with the diagnostic probe 125) and the photo sensor 130. The mechanical filter 140 includes a beam reducer 150 and a light-impermeable optical mask 155 that defines a light-transmitting aperture 160. The aperture 160 is positioned between the beam reducer 150 and the photo sensor 130. In order to properly sense the diagnostic light 120, the light sensor 130 is positioned so that its field of view overlaps the diagnostic region 145. The metrology device 100 also includes a diagnostic device 165 that generates the diagnostic probe 125 and a control system 170 that communicates with the detection device 135. The control system 170 receives output from the sensor 130 and performs analysis on the output to estimate one or more properties of the current target 105c.

機械濾光器140包括自診斷光120及非診斷光122形成相應準直光束之光學準直器142,且隨後光束縮減器150光學地縮減此等準直光束之大小以分別形成大小縮減的準直光束121、123。光束縮減器150增大藉由準直診斷光束121與準直非診斷光束123產生之影像之間的角分離度。非診斷光122來源於當前目標105c之方位(其產生診斷光120)外部之方位。舉例而言,診斷光120來源於診斷區145,而非診斷光122來源於診斷區145外部,諸如來自目標空間110。因為此,非診斷光122以與診斷光120以其進入機械濾光器140之角度略微不同之角度進入機械濾光器140。此事實可用於機械濾光器140之設計,該機械濾光器140可藉由增大相應準直光束121、123之間的角分離度來進一步分離由診斷光120及非診斷光122產生之影像。在光束已前進光束縮減器150與遮罩155之間的光學路徑152之長度之後,角分離度之增大容許孔口160處之兩種影像之間的較大區分。因此,在此實施方案中,遮罩155經置放以使得孔口160容許診斷光束121(由診斷光120形成)傳遞至感測器130,而遮罩155阻擋非診斷光束123(由非診斷光122形成)傳遞至感測器130。 The mechanical filter 140 includes an optical collimator 142 that forms respective collimated beams from the diagnostic light 120 and the non-diagnostic light 122, and then the beam reducer 150 optically reduces the size of these collimated beams to form reduced-size collimated beams 121, 123, respectively. The beam reducer 150 increases the angular separation between the images produced by the collimated diagnostic beam 121 and the collimated non-diagnostic beam 123. The non-diagnostic light 122 originates from a location outside the location of the current target 105c (which produces the diagnostic light 120). For example, the diagnostic light 120 originates from the diagnostic region 145, while the non-diagnostic light 122 originates from outside the diagnostic region 145, such as from the target space 110. As a result, the non-diagnostic light 122 enters the mechanical filter 140 at a slightly different angle than the diagnostic light 120 enters the mechanical filter 140. This fact can be used in the design of the mechanical filter 140, which can further separate the images generated by the diagnostic light 120 and the non-diagnostic light 122 by increasing the angular separation between the corresponding collimated light beams 121, 123. The increase in angular separation allows for greater differentiation between the two images at aperture 160 after the beam has traveled the length of optical path 152 between beam reducer 150 and mask 155. Thus, in this embodiment, mask 155 is positioned so that aperture 160 allows diagnostic beam 121 (formed by diagnostic light 120) to pass to sensor 130, while mask 155 blocks non-diagnostic beam 123 (formed by non-diagnostic light 122) from passing to sensor 130.

光學準直器142形成相應準直光束以用於輸入至光束縮減器150。準直光束為具有足夠低以使得光束半徑在中等傳播距離內並不經歷大量改變之光束發散度之光束。在此情況下,在不存在任何額外光束塑形的情況下(因此,在不存在光束縮減器150的情況下),自光學準直器142輸出之每一準直光束之光束半徑在延伸至感測器130之距離內將不經歷大 量改變。舉例而言,自光學準直器142輸出之準直光束之光束半徑在沿Z方向至感測器130之距離內改變小於1%、小於5%或小於10%(在不存在任何中間光學元件的情況下)。在一些實例中,光學準直器142與感測器130之間的沿Z方向之距離為約一米,但其可取決於光束縮減器150之設計而更短或更長。 The optical collimator 142 forms a corresponding collimated beam for input to the beam reducer 150. A collimated beam is a beam having a beam divergence low enough that the beam radius does not undergo a substantial change over a moderate propagation distance. In this case, in the absence of any additional beam shaping (and therefore, in the absence of the beam reducer 150), the beam radius of each collimated beam output from the optical collimator 142 will not undergo a substantial change over the distance extending to the sensor 130. For example, the beam radius of the collimated beam output from the optical collimator 142 changes by less than 1%, less than 5%, or less than 10% over the distance along the Z direction to the sensor 130 (in the absence of any intermediate optical elements). In some examples, the distance between the optical collimator 142 and the sensor 130 along the Z direction is about one meter, but it can be shorter or longer depending on the design of the beam reducer 150.

光束縮減器150為無焦系統(亦即,不具有焦點之系統),此意謂光束縮減器150不產生輸入至光束縮減器150之準直光束之網狀收斂(net convergence)或發散度。亦即,光束縮減器150可視為具有保持或維持自光學準直器142輸出之光束之準直狀態之無限有效焦距。此類型之系統可經形成以具有一對光學元件,其中元件之間的距離d等於每一元件之焦距f1、f2之總和(亦即,d=f1+f2)。雖然無焦系統並不更改準直光束之發散度,但其的確更改光束之寬度,從而增大或縮減其放大率。總體而言,光束縮減器150可將自光學準直器142輸出之準直光束之橫向大小(亦即,XsYs平面中之大小)縮減至少五倍、至少十倍或至少二十倍。在一些實施方案中,光束縮減器150將準直光束之橫向大小縮減約10或約20倍。 The beam reducer 150 is an afocal system (i.e., a system without a focus), meaning that the beam reducer 150 does not produce a net convergence or divergence of a collimated beam input to the beam reducer 150. That is, the beam reducer 150 can be considered to have an infinite effective focal length that preserves or maintains the collimated state of the beam output from the optical collimator 142. This type of system can be formed to have a pair of optical elements where the distance d between the elements is equal to the sum of the focal lengths f1, f2 of each element (i.e., d=f1+f2). Although an afocal system does not change the divergence of a collimated beam, it does change the width of the beam, thereby increasing or decreasing its magnification. In general, the beam reducer 150 can reduce the lateral size (i.e., the size in the XsYs plane) of the collimated beam output from the optical collimator 142 by at least five times, at least ten times, or at least twenty times. In some embodiments, the beam reducer 150 reduces the lateral size of the collimated beam by about 10 or about 20 times.

光束縮減器150可為例如折射望遠鏡、反射望遠鏡或反射折射望遠鏡。 The beam reducer 150 may be, for example, a refractive telescope, a reflective telescope, or a reflective-refractive telescope.

折射望遠鏡使用折射光學器件,諸如透鏡或稜鏡,以在遮罩155之平面處形成相應準直光束之影像。在一些實施方案中,折射望遠鏡為包括由其焦距之總和分離之正焦距透鏡配置及負焦距透鏡配置之Galilean望遠鏡。在其他實施方案中,折射望遠鏡為包括由其焦距之總和分離之一對正焦距透鏡配置之Keplerian望遠鏡。在下文中參考圖3及4論述用作光束縮減器150之折射望遠鏡之實例。 A refractive telescope uses refractive optics, such as lenses or prisms, to form an image of a corresponding collimated beam at the plane of mask 155. In some embodiments, the refractive telescope is a Galilean telescope including a positive focal length lens configuration and a negative focal length lens configuration separated by the sum of their focal lengths. In other embodiments, the refractive telescope is a Keplerian telescope including a positive focal length lens configuration separated by the sum of their focal lengths. An example of a refractive telescope used as a beam reducer 150 is discussed below with reference to FIGS. 3 and 4.

反射望遠鏡包括單個件或曲形鏡面之組合,該等曲形鏡面反射自光學準直器142輸出之準直光束且在遮罩155之平面處形成相應影像。舉例而言,在一些實施方案中,反射望遠鏡為Gregorian望遠鏡、Newtonian望遠鏡或Cassegrain(及其變型)望遠鏡。在其他實施方案中,反射望遠鏡為離軸設計,諸如Herschelian或Schiefspiegler(其為Cassegrain之變型)。關於圖13展示及描述反射望遠鏡之實例。 The reflecting telescope includes a single piece or a combination of curved mirror surfaces that reflect the collimated light beam output from the optical collimator 142 and form a corresponding image at the plane of the mask 155. For example, in some embodiments, the reflecting telescope is a Gregorian telescope, a Newtonian telescope, or a Cassegrain (and its variations) telescope. In other embodiments, the reflecting telescope is an off-axis design, such as a Herschelian or Schiefspiegler (which is a variation of Cassegrain). An example of a reflecting telescope is shown and described with respect to FIG. 13.

反射折射望遠鏡為其中將折射及反射併入至通常實施透鏡(亦即,屈光學)及曲形鏡面(亦即,反射光學)之光學系統中之一種望遠鏡。舉例而言,在一些實施方案中,反射折射望遠鏡包括Schmidt-Cassegrain望遠鏡及Maksutov-Cassegrain望遠鏡。在其他實施方案中,反射折射望遠鏡為Herschelian望遠鏡之反射折射變型(其使用透鏡及鏡面兩者)或Stevick-Paul望遠鏡之離軸變型。關於圖14展示及描述反射折射望遠鏡之實例。 A catadioptric telescope is a type of telescope in which refraction and reflection are incorporated into an optical system that typically implements lenses (i.e., refractive optics) and curved mirrors (i.e., catadioptric optics). For example, in some embodiments, catadioptric telescopes include Schmidt-Cassegrain telescopes and Maksutov-Cassegrain telescopes. In other embodiments, a catadioptric telescope is a catadioptric variation of a Herschelian telescope (which uses both lenses and mirrors) or an off-axis variation of a Stevick-Paul telescope. An example of a catadioptric telescope is shown and described with respect to FIG. 14.

環境115可為極紫外(EUV)光源(諸如在下文中參考圖7論述之EUV光源)之腔室內之真空環境。在一些實施方案中,偵測裝置135置放於EUV光源之腔室外部,而診斷區145在腔室內,且偵測裝置135經由腔室之壁中之光學窗來接收診斷光120及非診斷光122。光學窗對診斷光120之波長為可穿透的。下文參考圖7論述此情況。 The environment 115 may be a vacuum environment in a chamber of an extreme ultraviolet (EUV) light source (such as the EUV light source discussed below with reference to FIG. 7 ). In some embodiments, the detection device 135 is placed outside the chamber of the EUV light source, while the diagnostic region 145 is in the chamber, and the detection device 135 receives the diagnostic light 120 and the non-diagnostic light 122 through an optical window in the wall of the chamber. The optical window is transparent to the wavelength of the diagnostic light 120. This situation is discussed below with reference to FIG. 7 .

如參考圖7所論述,EUV光源將EUV光供應至可為微影裝置之輸出裝置。EUV光藉由在目標105達到目標空間110時將目標105轉換為發射EUV光之電漿來形成於環境115中,且此EUV光經收集且傳輸至微影裝置。達到目標空間110之目標105藉由目標105與目標空間110中之輻射脈衝相互作用進行轉換,輻射脈衝將足夠能量提供至目標105以將其轉 換為電漿。目標(各自通常指定為105)之連續流106自目標供應裝置175沿軌跡TR朝向目標空間110引導。 As discussed with reference to FIG. 7 , the EUV light source supplies EUV light to an output device, which may be a lithography device. EUV light is formed in an environment 115 by converting the target 105 into a plasma that emits EUV light when the target 105 reaches the target space 110, and this EUV light is collected and transmitted to the lithography device. The target 105 that reaches the target space 110 is converted by the target 105 interacting with a radiation pulse in the target space 110, which provides sufficient energy to the target 105 to convert it into plasma. A continuous stream 106 of targets (each typically designated as 105) is guided from the target supply device 175 along a trajectory TR toward the target space 110.

軌跡TR沿可視為目標(或軸向)方向之方向延伸,該方向位於由環境115之實體態樣界定之三維X、Y、Z座標系統中。因此,X、Y、Z座標系統可由界定環境115之腔室之壁或斑點界定。每一目標105之軸向方向大體上具有平行於環境115之座標系統之-X方向的分量。每一目標105之軸向方向亦可具有沿垂直於-X方向之方向Y及Z中之一或多者之分量。另外,由目標供應裝置175釋放之每一目標105可具有略微不同之實際軌跡且軌跡至少部分地取決於在釋放目標105時之目標供應裝置175之物理屬性以及環境115。 The trajectory TR extends along a direction that can be considered as a target (or axial) direction, which is located in a three-dimensional X, Y, Z coordinate system defined by the physical state of the environment 115. Therefore, the X, Y, Z coordinate system can be defined by the walls or spots of the chamber that define the environment 115. The axial direction of each target 105 generally has a component parallel to the -X direction of the coordinate system of the environment 115. The axial direction of each target 105 can also have a component along one or more of the directions Y and Z that are perpendicular to the -X direction. In addition, each target 105 released by the target supply device 175 can have a slightly different actual trajectory and the trajectory depends at least in part on the physical properties of the target supply device 175 and the environment 115 when the target 105 is released.

另一方面,偵測裝置135界定局部三維Xs、Ys、Zs座標系統且此局部座標系統可由感測器130之影像平面界定。 On the other hand, the detection device 135 defines a local three-dimensional Xs, Ys, Zs coordinate system and this local coordinate system can be defined by the image plane of the sensor 130.

每一目標105包括當轉換為電漿時發射EUV光之組分。此等目標105自產生區(諸如自目標供應裝置175)朝向目標空間110(例如,彈道學地)行進。當前目標105c之屬性(諸如速度、方位、速率、方向、到達或運動)由度量衡裝置100藉由在當前目標105c沿軌跡TR行進時用藉由診斷系統165產生之診斷探針125探測當前目標105c、偵測或感測由診斷探針125與當前目標105c之間的相互作用產生之診斷光120以及分析偵測到之診斷光120來估計。 Each target 105 includes a component that emits EUV light when converted to plasma. The targets 105 travel from a generation region (e.g., from a target supply device 175) toward a target space 110 (e.g., ballistically). Properties of a current target 105c (e.g., speed, position, velocity, direction, arrival, or motion) are estimated by the metrology device 100 by probing the current target 105c with a diagnostic probe 125 generated by a diagnostic system 165 as the current target 105c travels along a trajectory TR, detecting or sensing diagnostic light 120 generated by an interaction between the diagnostic probe 125 and the current target 105c, and analyzing the detected diagnostic light 120.

如上文所提及,非診斷光122亦可存在,且此非診斷光122可干涉當前目標105c之屬性之準確估計。此非診斷光122可包括在當前目標105c與診斷探針125相互作用之前或之時由電漿發射之寬頻帶光輻射,該電漿藉由進入目標空間110之一或多個先前目標105p產生。另外,非診 斷光122之強度可比診斷光120之強度大得多。 As mentioned above, non-diagnostic light 122 may also be present, and this non-diagnostic light 122 may interfere with the accurate estimation of the properties of the current target 105c. This non-diagnostic light 122 may include broadband light radiation emitted by plasma generated by one or more previous targets 105p entering the target space 110 before or when the current target 105c interacts with the diagnostic probe 125. In addition, the intensity of the non-diagnostic light 122 may be much greater than the intensity of the diagnostic light 120.

非診斷光122可包括例如自先前目標105p之電漿發射之EUV光、具有與診斷光120之波長重疊之波長範圍的光,及/或存在之任何光及具有包括可由感測器130偵測之波長範圍之波長範圍的任何光。 Non-diagnostic light 122 may include, for example, EUV light emitted from plasma of previous target 105p, light having a wavelength range that overlaps with the wavelength of diagnostic light 120, and/or any light that exists and has a wavelength range that includes a wavelength range detectable by sensor 130.

另一方面,診斷光120由診斷探針125與當前目標105c之間的相互作用產生且診斷光120具有實質上比非診斷光122之光譜帶寬更窄之光譜帶寬。舉例而言,診斷光120之光譜帶寬可比非診斷光122之總體光譜帶寬低數百倍。在一些實施方案中,諸如圖6A至6C中所展示,診斷光120自由當前目標105c反射或自當前目標105c散射之診斷探針125的一部分產生。 On the other hand, the diagnostic light 120 is generated by the interaction between the diagnostic probe 125 and the current target 105c and has a spectral bandwidth that is substantially narrower than the spectral bandwidth of the non-diagnostic light 122. For example, the spectral bandwidth of the diagnostic light 120 may be hundreds of times lower than the overall spectral bandwidth of the non-diagnostic light 122. In some embodiments, as shown in FIGS. 6A to 6C, the diagnostic light 120 is generated by a portion of the diagnostic probe 125 that is reflected from or scattered from the current target 105c.

大體而言,感測器130可包括光電二極體、光電晶體、光相依電阻器及光電倍增管中之一或多者。在其他實施方案中,感測器130包括一或多個熱偵測器,諸如熱電偵測器、輻射熱計或校準電荷耦合器件(charged coupled device;CCD)或CMOS。在其他實施方案中,感測器130包括多單元光接收器、四單元光接收器或相機。 Generally, the sensor 130 may include one or more of a photodiode, a phototransistor, a photodependent resistor, and a photomultiplier tube. In other embodiments, the sensor 130 includes one or more thermal detectors, such as a pyroelectric detector, a radiothermometer, or a calibrated charge coupled device (CCD) or CMOS. In other embodiments, the sensor 130 includes a multi-unit photoreceiver, a four-unit photoreceiver, or a camera.

如圖1之實施方案中所展示,光學遮罩155經定位以使得準直非診斷光束123(由非診斷光122產生)實質上或大多經阻擋,而準直診斷光束121實質上穿過孔口160。關於圖15展示及論述另一實施方案,其中準直非診斷光束123實質上穿過孔口,而準直診斷光束121實質上由孔口阻擋。 As shown in the embodiment of FIG. 1 , the optical mask 155 is positioned so that the collimated non-diagnostic beam 123 (generated from the non-diagnostic light 122) is substantially or mostly blocked, while the collimated diagnostic beam 121 substantially passes through the aperture 160. Another embodiment is shown and discussed with respect to FIG. 15 , in which the collimated non-diagnostic beam 123 substantially passes through the aperture, while the collimated diagnostic beam 121 is substantially blocked by the aperture.

參考圖2A,在一些實施方案中,遮罩155為界定在XsYs平面中具有圓形形狀之孔口260A之遮罩255A。在其他實施方案中,諸如圖2B中所展示,遮罩155為界定具有狹縫形狀之孔口260B之遮罩255B,該 孔口260B不為旋轉對稱的且具有大於沿Xs方向之範圍的沿Ys方向之範圍。圖2B之設計可對其中準直診斷光束121正移動、振盪或擾動以使得其影像平面沿Ys方向移動之情況有用。沿Ys方向之範圍適應準直診斷光束121之影像平面中之此波動。遮罩155可經組態以界定影像平面(XsYs平面)中之諸如橢圓孔口及多邊形開口之孔口160之其他形狀。 Referring to FIG. 2A , in some embodiments, the mask 155 is a mask 255A defining an aperture 260A having a circular shape in the XsYs plane. In other embodiments, as shown in FIG. 2B , the mask 155 is a mask 255B defining an aperture 260B having a slit shape that is not rotationally symmetric and has a range in the Ys direction that is greater than the range in the Xs direction. The design of FIG. 2B may be useful for situations where the collimated diagnostic beam 121 is moving, oscillating, or perturbed so that its image plane moves in the Ys direction. The range in the Ys direction accommodates this fluctuation in the image plane of the collimated diagnostic beam 121. The mask 155 may be configured to define other shapes of the aperture 160 in the image plane (XsYs plane), such as an elliptical aperture and a polygonal opening.

為了恰當地容許準直診斷光束121傳遞至感測器130,沿XsYs平面之孔口160至少與XsYs平面中之準直診斷光束121之橫向範圍一樣大。另外,為了恰當地阻擋準直非診斷光束123,光學遮罩155應具有至少與XsYs平面中之準直非診斷光束123之橫向範圍一樣大的沿XsYs平面之範圍。此意謂,參考圖2A,XsYs平面中之孔口260A之範圍261A與XsYs平面中之準直診斷光束121之橫向範圍一樣大且遮罩255A之範圍256A足夠大以阻擋平面XsYs中之準直非診斷光束123之全部範圍。作為另一實例,參考圖2B,XsYs平面中之孔口260B之最短範圍261B與XsYs平面中之準直診斷光束121之橫向範圍一樣大且遮罩255B之範圍256B足夠大以阻擋平面XsYs中之準直非診斷光束123之全部範圍。 To properly allow the collimated diagnostic beam 121 to pass to the sensor 130, the aperture 160 along the XsYs plane is at least as large as the lateral extent of the collimated diagnostic beam 121 in the XsYs plane. Additionally, to properly block the collimated non-diagnostic beam 123, the optical mask 155 should have an extent along the XsYs plane that is at least as large as the lateral extent of the collimated non-diagnostic beam 123 in the XsYs plane. This means that, referring to FIG. 2A , the range 261A of the aperture 260A in the XsYs plane is as large as the lateral range of the collimated diagnostic beam 121 in the XsYs plane and the range 256A of the mask 255A is large enough to block the entire range of the collimated non-diagnostic beam 123 in the plane XsYs. As another example, referring to FIG. 2B , the shortest range 261B of the aperture 260B in the XsYs plane is as large as the lateral range of the collimated diagnostic beam 121 in the XsYs plane and the range 256B of the mask 255B is large enough to block the entire range of the collimated non-diagnostic beam 123 in the plane XsYs.

在一些實施方案中,XsYs平面中之相應孔口260A、260B之範圍261A、261B為至少2毫米(mm)或約4mm。在孔口260A或260B處XsYs平面中之準直診斷光束121之範圍為約3mm。在一些實施方案中,相應遮罩255A、255B之範圍256A、256B大於3mm。 In some embodiments, the range 261A, 261B of the corresponding aperture 260A, 260B in the XsYs plane is at least 2 millimeters (mm) or about 4 mm. The range of the collimated diagnostic beam 121 in the XsYs plane at the aperture 260A or 260B is about 3 mm. In some embodiments, the range 256A, 256B of the corresponding mask 255A, 255B is greater than 3 mm.

不同於空間濾光器,其中光聚焦於遮罩之孔口處,在機械濾光器140中,穿過孔口160(諸如孔口260A或260B)之光(診斷光束121)為準直的且因此具有比在空間濾光器之孔口處聚焦之光更大的橫向範圍。因此,XsYs平面中之孔口160(諸如孔口260A或260B)之大小可比在空間 濾光器中使用之孔口大得多以阻擋經聚焦非診斷光且傳遞經聚焦診斷光。因為此,非想要顆粒(諸如環境115中之污垢)對孔口160(諸如孔口260A或260B)之效能比此類顆粒對空間濾光器之孔口的影響少得多。舉例而言,XsYs平面中之孔口160之大小為約數毫米,且比非想要顆粒之大小大得多。另一方面,空間濾光器之孔口之典型大小可為毫米之幾分之一(例如,在範圍上100μm)且非想要顆粒可具有相當大小。因為此,當與空間濾光器進行比較時,非想要顆粒與機械濾光器140中之準直光束121之間的干涉縮減。 Unlike a spatial filter, where light is focused at the aperture of a mask, in a mechanical filter 140, light (diagnostic beam 121) passing through aperture 160 (such as aperture 260A or 260B) is collimated and therefore has a greater lateral extent than light focused at the aperture of a spatial filter. Therefore, the size of aperture 160 (such as aperture 260A or 260B) in the XsYs plane can be much larger than the aperture used in a spatial filter to block focused non-diagnostic light and pass focused diagnostic light. Because of this, unwanted particles (such as dirt in the environment 115) have much less effect on the performance of the aperture 160 (such as aperture 260A or 260B) than such particles have on the aperture of a spatial filter. For example, the size of the aperture 160 in the XsYs plane is on the order of a few millimeters, which is much larger than the size of the unwanted particles. On the other hand, the typical size of the aperture of a spatial filter can be a fraction of a millimeter (e.g., in the range of 100 μm) and the unwanted particles can be of comparable size. Because of this, the interference between the unwanted particles and the collimated beam 121 in the mechanical filter 140 is reduced when compared to the spatial filter.

另外,更易於引導準直診斷光束121穿過孔口160(260A,260B),此係因為準直診斷光束121與4mm孔口160(或260A,260B)之間的相對定位中之容限為約0.2至0.4mm。另一方面,準直診斷光束121與空間濾光器之100μm孔口之間的相對定位中之容限為約5至10μm。 Additionally, it is easier to guide the collimated diagnostic beam 121 through the aperture 160 (260A, 260B) because the tolerance in the relative positioning between the collimated diagnostic beam 121 and the 4 mm aperture 160 (or 260A, 260B) is about 0.2 to 0.4 mm. On the other hand, the tolerance in the relative positioning between the collimated diagnostic beam 121 and the 100 μm aperture of the spatial filter is about 5 to 10 μm.

參考圖3,展示偵測裝置135之實施方案335。在此圖解中,偵測裝置335之座標系統XsYsZs使得Ys為頁面之輸出且Zs垂直於感測器330之成像區延伸。偵測裝置335包括針對診斷光120及非診斷光122中之每一者產生相應準直光束以用於輸入至光束縮減器350之光學準直器342。如上文所論述,在不存在光束縮減器350的情況下,自光學準直器342輸出之每一準直光束之光束半徑在自光學準直器342延伸至感測器330之距離內將不經歷大量改變。光學準直器342在此實例中為雙合透鏡(兩個透鏡342a、342b)。雙合透鏡342之焦距或曲率半徑經選擇以使得診斷光120及非診斷光122之最初曲形波前變得至少對於延伸一定長度至感測器330之距離而言平坦或實質上平坦。 3, an embodiment 335 of the detection device 135 is shown. In this illustration, the coordinate system XsYsZs of the detection device 335 is such that Ys is the output of the page and Zs extends perpendicular to the imaging area of the sensor 330. The detection device 335 includes an optical collimator 342 that produces a corresponding collimated beam for each of the diagnostic light 120 and the non-diagnostic light 122 for input to the beam reducer 350. As discussed above, in the absence of the beam reducer 350, the beam radius of each collimated beam output from the optical collimator 342 will not undergo a substantial change in the distance extending from the optical collimator 342 to the sensor 330. The optical collimator 342 is a doublet lens (two lenses 342a, 342b) in this example. The focal length or radius of curvature of the doublet lens 342 is selected so that the initially curved wavefronts of the diagnostic light 120 and the non-diagnostic light 122 become flat or substantially flat at least for a distance extending a certain length to the sensor 330.

在此實施方案中,光束縮減器350經設計為Galilean型折射 望遠鏡。光束縮減器350光學地縮減自光學準直器342輸出之準直光束之大小以分別形成大小縮減的準直光束121、123。光束縮減器350包括輸入側處之正焦距透鏡配置351(其可為包括正雙凸透鏡、平凸透鏡或凹凸透鏡中之一或多者的收斂透鏡配置)。光束縮減器350包括輸出側處之負焦距透鏡配置353(其可為包括凹透鏡之發散透鏡配置)。正焦距透鏡配置351及負焦距透鏡配置353由其焦距之總和分離。收斂透鏡配置351在此實例中為可幫助校正光束中之失真之複合透鏡(具有凸透鏡351a及凹透鏡351b)。光束縮減器350缺乏中間焦點(在收斂透鏡配置351與發散透鏡配置353之間不存在焦點)。雖然不要求,在此實施方案中,發散透鏡配置353包括在收斂透鏡351與發散透鏡353之間的輔助透鏡354。輔助透鏡354可用於與發散透鏡配置353組合以使來自正焦距透鏡配置351之光束準直。輔助透鏡354可為正焦距透鏡,諸如凹凸透鏡(如所展示)、雙凸透鏡或平凸透鏡。總體而言,光束縮減器350可將自光學準直器342輸出之準直光束之橫向大小(亦即,XsYs平面中之大小)縮減至少五倍、至少十倍或至少二十倍。 In this embodiment, the beam reducer 350 is designed as a Galilean-type refractive telescope. The beam reducer 350 optically reduces the size of the collimated beam output from the optical collimator 342 to form the reduced-size collimated beams 121, 123, respectively. The beam reducer 350 includes a positive focal length lens configuration 351 at the input side (which can be a convergent lens configuration including one or more of a positive biconvex lens, a plano-convex lens, or a concave-convex lens). The beam reducer 350 includes a negative focal length lens configuration 353 at the output side (which can be a divergent lens configuration including a concave lens). The positive focal length lens configuration 351 and the negative focal length lens configuration 353 are separated by the sum of their focal lengths. The converging lens configuration 351 in this example is a compound lens (having a convex lens 351a and a concave lens 351b) that can help correct distortion in the beam. The beam reducer 350 lacks an intermediate focus (there is no focus between the converging lens configuration 351 and the diverging lens configuration 353). Although not required, in this embodiment, the diverging lens configuration 353 includes an auxiliary lens 354 between the converging lens 351 and the diverging lens 353. Auxiliary lens 354 can be used in combination with diverging lens configuration 353 to collimate the beam from positive focal length lens configuration 351. Auxiliary lens 354 can be a positive focal length lens, such as a concave-convex lens (as shown), a biconvex lens, or a plano-convex lens. In general, beam reducer 350 can reduce the lateral size (i.e., the size in the XsYs plane) of the collimated beam output from optical collimator 342 by at least five times, at least ten times, or at least twenty times.

光束縮減器350輸出經縮減準直診斷光束121及經縮減準直非診斷光束123,其隨後前進至遮罩355之光學路徑352之長度。光學路徑352愈長,遮罩355處之來自此等光束121、123之相應影像之間的分離度愈大。在此實施方案中,遮罩355經置放以使得孔口360容許診斷光束121(由診斷光120形成)傳遞至感測器330,而遮罩355阻擋非診斷光束123(由非診斷光122形成)傳遞至感測器330。已穿過孔口360之準直診斷光束121可藉助於收斂透鏡357聚焦至感測器330之成像區上。 The beam reducer 350 outputs a reduced collimated diagnostic beam 121 and a reduced collimated non-diagnostic beam 123, which then travel the length of the optical path 352 to the mask 355. The longer the optical path 352, the greater the separation between the respective images from these beams 121, 123 at the mask 355. In this embodiment, the mask 355 is positioned so that the aperture 360 allows the diagnostic beam 121 (formed by the diagnostic light 120) to pass to the sensor 330, while the mask 355 blocks the non-diagnostic beam 123 (formed by the non-diagnostic light 122) from passing to the sensor 330. The collimated diagnostic beam 121 that has passed through the aperture 360 can be focused onto the imaging area of the sensor 330 by means of the converging lens 357.

參考圖4,展示偵測裝置135之另一實施方案435。在此圖 解中,偵測裝置435之座標系統XsYsZs與頁面對準。偵測裝置435包括針對診斷光120及非診斷光122中之每一者產生相應準直光束以用於輸入至偵測裝置435之光束縮減器450之光學準直器442。如上文所論述,自光學準直器442輸出之每一準直光束之光束半徑在延伸至感測器430之距離內並不經歷大量改變。光學準直器442在此實例中類似於光學準直器342且包含雙合透鏡(兩個透鏡442a、442b)。雙合透鏡442之焦距或曲率半徑經選擇以使得診斷光120及非診斷光122之最初曲形波前變得至少對於延伸一定長度至感測器430之距離而言平坦或實質上平坦。 Referring to FIG. 4 , another embodiment 435 of the detection device 135 is shown. In this illustration, the coordinate system XsYsZs of the detection device 435 is aligned with the page. The detection device 435 includes an optical collimator 442 that produces a corresponding collimated beam for each of the diagnostic light 120 and the non-diagnostic light 122 for input to the beam reducer 450 of the detection device 435. As discussed above, the beam radius of each collimated beam output from the optical collimator 442 does not undergo a substantial change in the distance extending to the sensor 430. The optical collimator 442 in this example is similar to the optical collimator 342 and includes a doublet lens (two lenses 442a, 442b). The focal length or radius of curvature of the doublet lens 442 is selected so that the initially curved wavefronts of the diagnostic light 120 and the non-diagnostic light 122 become flat or substantially flat at least for a distance extending a certain length to the sensor 430.

在此實施方案中,光束縮減器450經設計為Keplerian型折射望遠鏡。光束縮減器450光學地縮減自光學準直器442輸出之準直光束之大小以分別形成大小縮減的準直光束121、123。光束縮減器450包括輸入側處之輸入正焦距透鏡配置451(其可為包括正雙凸透鏡、平凸透鏡或凹凸透鏡中之一或多者的收斂透鏡配置)。光束縮減器450包括輸出側處之輸出正焦距透鏡配置453(其可為包括正雙凸透鏡、平凸透鏡或凹凸透鏡中之一或多者的收斂透鏡配置)。舉例而言,正焦距透鏡配置453經展示為圖4中之非球面透鏡元件。有可能正焦距透鏡配置453為複合透鏡組。正焦距透鏡配置451、453由其焦距之總和分離。收斂透鏡配置451在此實例中為可幫助校正光束中之失真之複合透鏡(具有凸透鏡451a及凹透鏡451b)。中間焦點IF(或中間焦平面IF)在輸入收斂透鏡配置451與輸出收斂透鏡配置453之間。總體而言,光束縮減器450可將自光學準直器442輸出之準直光束之橫向大小(亦即,XsYs平面中之大小)縮減至少五倍、至少十倍或至少二十倍。沿Zs方向之光束縮減器450之範圍往往會大於沿Zs方向之光束縮減器350之範圍,且因此,空間需求可判定光束縮減器350或450 之設計誰更合適。另外,若診斷光120或非診斷光122之功率過高而不能施加中間焦點IF(諸如存在於光束縮減器450中),則光束縮減器350可為更合適設計。 In this embodiment, the beam reducer 450 is designed as a Keplerian-type refractive telescope. The beam reducer 450 optically reduces the size of the collimated beam output from the optical collimator 442 to form reduced-size collimated beams 121, 123, respectively. The beam reducer 450 includes an input positive focal length lens configuration 451 at the input side (which may be a converging lens configuration including one or more of a positive biconvex lens, a plano-convex lens, or a concave-convex lens). The beam reducer 450 includes an output positive focal length lens arrangement 453 at the output side (which may be a converging lens arrangement including one or more of a positive biconvex lens, a plano-convex lens, or a concave-convex lens). For example, the positive focal length lens arrangement 453 is shown as an aspheric lens element in FIG. 4 . It is possible that the positive focal length lens arrangement 453 is a compound lens set. The positive focal length lens arrangements 451, 453 are separated by the sum of their focal lengths. The converging lens arrangement 451 in this example is a compound lens (having a convex lens 451a and a concave lens 451b) that can help correct distortion in the beam. The intermediate focus IF (or intermediate focal plane IF) is between the input converging lens arrangement 451 and the output converging lens arrangement 453. In general, the beam reducer 450 can reduce the lateral size (i.e., the size in the XsYs plane) of the collimated beam output from the optical collimator 442 by at least five times, at least ten times, or at least twenty times. The range of the beam reducer 450 along the Zs direction is often larger than the range of the beam reducer 350 along the Zs direction, and therefore, the space requirements can determine which design of the beam reducer 350 or 450 is more suitable. In addition, if the power of the diagnostic light 120 or the non-diagnostic light 122 is too high to apply the intermediate focus IF (such as exists in the beam reducer 450), the beam reducer 350 may be a more appropriate design.

光束縮減器450輸出經縮減準直診斷光束121及經縮減準直非診斷光束123,其隨後前進至遮罩455之光學路徑452之長度。光學路徑452愈長,遮罩455處之來自此等光束121、123之相應影像之間的分離度愈大。在此實施方案中,遮罩455經置放以使得孔口460容許診斷光束121(由診斷光120形成)傳遞至感測器430,而遮罩455阻擋非診斷光束123(由非診斷光122形成)傳遞至感測器430。已穿過孔口460之準直診斷光束121可藉助於收斂透鏡457聚焦至感測器430之成像區上。 The beam reducer 450 outputs a reduced collimated diagnostic beam 121 and a reduced collimated non-diagnostic beam 123, which then travel the length of the optical path 452 to the mask 455. The longer the optical path 452, the greater the separation between the respective images from these beams 121, 123 at the mask 455. In this embodiment, the mask 455 is positioned so that the aperture 460 allows the diagnostic beam 121 (formed from the diagnostic light 120) to pass to the sensor 430, while the mask 455 blocks the non-diagnostic beam 123 (formed from the non-diagnostic light 122) from passing to the sensor 430. The collimated diagnostic beam 121 that has passed through the aperture 460 can be focused onto the imaging area of the sensor 430 by means of the converging lens 457.

參看圖5,在其他實施方案中,偵測裝置135為亦包括可與機械濾光器140串聯或並聯配置之一或多個光譜濾光器543及偏振濾光器544之偵測裝置535。光譜濾光器543為傳遞特定波長範圍內之光之濾光器,諸如帶通濾光器。偏振濾光器544為傳遞具有特定偏振之光之濾光器。舉例而言,診斷光120可取決於診斷探針125之偏振而具有相異偏振,而非診斷光122可為非偏振的。因此,偏振濾光器可選擇待傳遞之診斷光120之偏振。 Referring to FIG. 5 , in other embodiments, the detection device 135 is a detection device 535 that also includes one or more spectral filters 543 and polarization filters 544 that can be configured in series or in parallel with the mechanical filter 140. The spectral filter 543 is a filter that transmits light within a specific wavelength range, such as a bandpass filter. The polarization filter 544 is a filter that transmits light with a specific polarization. For example, the diagnostic light 120 may have a different polarization depending on the polarization of the diagnostic probe 125, while the non-diagnostic light 122 may be non-polarized. Therefore, the polarization filter can select the polarization of the diagnostic light 120 to be transmitted.

參考圖6A,在一些實施方案中,診斷裝置165經設計為診斷裝置665A。診斷裝置665A產生來自光源626A之單個探針光束625A作為一或多個診斷探針125。探針光束625A經引導作為光幕以在位置x處與軌跡TR交叉以使得目標105中之每一者以其至目標空間110之方式穿過光幕。光源626A產生經引導穿過修改光束611A以形成單個探針光束625A之一或多個光學元件627A(諸如鏡面、透鏡、孔口及/或濾光器)之單個光束 611A。 Referring to FIG. 6A , in some embodiments, the diagnostic device 165 is designed as a diagnostic device 665A. The diagnostic device 665A generates a single probe beam 625A from a light source 626A as one or more diagnostic probes 125. The probe beam 625A is guided as a light curtain to intersect the trajectory TR at a position x so that each of the targets 105 passes through the light curtain on its way to the target space 110. The light source 626A generates a single beam 611A that is guided through one or more optical elements 627A (such as mirrors, lenses, apertures and/or filters) that modify the light beam 611A to form a single probe beam 625A.

光源626A可為固態雷射器,諸如YAG雷射器,其可為在1070nm下及在50W功率下操作之釹摻雜YAG(Nd:YAG)雷射器。在此實例中,當當前目標105c在時間t處穿過探針光束625A時,探針光束625A中之至少一些自當前目標105c反射或散射以形成由偵測裝置135偵測之診斷光620A。控制系統170使用來自感測器130之資訊來估計當前目標105之移動屬性,其可用於估計目標空間110處之現有目標(其可為當前目標105c或後續目標)之到達時間。此估計可用於調整經引導至目標空間110之輻射脈衝之特性以確保輻射脈衝與目標空間110中之現有目標相互作用。控制系統170亦可依賴於一些關於現有目標之路徑之假設以執行計算從而估計目標空間110處之現有目標之到達時間。 The light source 626A may be a solid-state laser, such as a YAG laser, which may be a neodymium-doped YAG (Nd:YAG) laser operating at 1070 nm and at a power of 50 W. In this example, when the current target 105 c passes through the probe beam 625 A at time t, at least some of the probe beam 625 A is reflected or scattered from the current target 105 c to form diagnostic light 620 A detected by the detection device 135. The control system 170 uses information from the sensor 130 to estimate the motion properties of the current target 105, which can be used to estimate the arrival time of an existing target (which may be the current target 105 c or a subsequent target) at the target space 110. This estimate can be used to adjust the characteristics of the radiation pulse directed to the target space 110 to ensure that the radiation pulse interacts with the existing targets in the target space 110. The control system 170 can also rely on some assumptions about the paths of the existing targets to perform calculations to estimate the arrival time of the existing targets at the target space 110.

探針光束625A可為高斯(Gaussian)光束以使得其光學強度之橫向分佈可經描述為具有高斯函數。探針光束625A之焦點或光束腰可經組態以在軌跡TR或-X方向處重疊。另外,光學元件627A可包括確保探針光束625A之焦點(或光束腰)與軌跡TR交疊之折射光學器件。 The probe beam 625A may be a Gaussian beam so that the transverse distribution of its optical intensity may be described as having a Gaussian function. The focus or beam waist of the probe beam 625A may be configured to overlap at the trajectory TR or -X direction. In addition, the optical element 627A may include a refractive optical device that ensures that the focus (or beam waist) of the probe beam 625A overlaps with the trajectory TR.

參考圖6B,在一些實施方案中,診斷裝置165經設計為診斷裝置665B。診斷裝置665B產生兩個探針光束625B_1及625B_2作為一或多個診斷探針125。探針光束625B_1經引導作為第一光幕以在第一方位(例如,沿X軸之方位x1)處與軌跡TR交叉以使得目標105中之每一者以其至目標空間110之方式穿過第一光幕。探針光束625B_2經引導作為第二光幕以在第二方位(例如,沿X軸之方位x2)處與軌跡TR交叉以使得目標105中之每一者以其至目標空間110之方式及在已穿過第一光幕之後穿過第二光幕。探針光束625B_1、625B_2由軌跡TR處之等於x2-x1之距離△d分 離。此雙幕診斷裝置665B不僅可用於判定目標105之方位及到達資訊且亦可用於判定目標105之速度(speed)或速率(velocity)。 6B , in some embodiments, the diagnostic device 165 is designed as a diagnostic device 665B. The diagnostic device 665B generates two probe beams 625B_1 and 625B_2 as one or more diagnostic probes 125. The probe beam 625B_1 is guided as a first light curtain to intersect the track TR at a first orientation (e.g., orientation x1 along the X-axis) so that each of the targets 105 passes through the first light curtain on its way to the target space 110. The probe beam 625B_2 is guided as a second light curtain to intersect the track TR at a second orientation (e.g., orientation x2 along the X-axis) so that each of the targets 105 passes through the second light curtain on its way to the target space 110 and after having passed through the first light curtain. The probe beams 625B_1 and 625B_2 are separated by a distance △d equal to x2-x1 at the track TR. This dual-screen diagnostic device 665B can be used not only to determine the position and arrival information of the target 105 but also to determine the speed or velocity of the target 105.

在一些實施方案中,診斷裝置665B包括產生單個光束611B之單個光源626B及接收單個光束且將光束611B拆分為兩個探針光束625B_1、625B_2之一或多個光學元件627B。另外,光學元件627B可包括用於將探針光束625B_1、625B_2朝向沿軌跡TR之相應方位x1、x2引導之組件。 In some embodiments, the diagnostic device 665B includes a single light source 626B that generates a single light beam 611B and one or more optical elements 627B that receive the single light beam and split the light beam 611B into two probe beams 625B_1, 625B_2. In addition, the optical element 627B may include a component for guiding the probe beams 625B_1, 625B_2 toward corresponding positions x1, x2 along the trajectory TR.

在一些實施方案中,光學組件627B包括將來自單個光源626B之單個光束拆分為兩個探針光束625B_1、625B_2之光束分光器。舉例而言,光束分光器可為介電鏡面、光束分光器方塊或偏振光束分光器。光學組件627B中之一或多者可為經置放以重新引導探針光束625B_1、625B_2中之任一者或兩者以使得朝向軌跡TR引導探針光束625B_1、625B_2兩者之反射光學器件。 In some embodiments, the optical assembly 627B includes a beam splitter that splits a single light beam from a single light source 626B into two probe beams 625B_1, 625B_2. For example, the beam splitter can be a dielectric mirror, a beam splitter block, or a polarization beam splitter. One or more of the optical assemblies 627B can be reflective optical devices positioned to redirect either or both of the probe beams 625B_1, 625B_2 so that both of the probe beams 625B_1, 625B_2 are directed toward the trajectory TR.

在其他實施方案中,光學組件627B包括拆分光學器件(諸如繞射光學器件或二進位相繞射光柵、雙折射晶體、強度光束分光器、偏振光束分光器或二色性光束分光器)及折射光學器件,諸如聚焦透鏡。光束611B經引導穿過拆分光學器件,該拆分光學器件將光束611B拆分為兩個光束,該兩個光束沿相異方向行進且經引導穿過折射光學器件以產生探針光束625B_1、625B_2。拆分光學器件可拆分光束611B以使得探針光束625B_1、625B_2由軌跡TR處之設定距離(例如,沿X方向之0.65mm)分離。在此實例中,x2-x1=0.65mm。另外,折射光學器件可確保探針光束625B_1、625B_2中之每一者之焦點(或光束腰)與軌跡TR重疊。 In other embodiments, the optical assembly 627B includes a splitting optics (such as a diffraction optics or a binary phase diffraction grating, a birefringent crystal, an intensity beam splitter, a polarization beam splitter, or a dichroic beam splitter) and a refractive optics, such as a focusing lens. The light beam 611B is directed through the splitting optics, which splits the light beam 611B into two beams that travel in opposite directions and are directed through the refractive optics to produce probe beams 625B_1, 625B_2. The splitting optics can split the light beam 611B so that the probe beams 625B_1, 625B_2 are separated by a set distance at the track TR (e.g., 0.65 mm along the X direction). In this example, x2-x1=0.65 mm. In addition, the refractive optical device can ensure that the focus (or beam waist) of each of the probe beams 625B_1, 625B_2 overlaps with the trajectory TR.

如此實例中所展示,探針光束625B_1、625B_2經引導以 使得其在不同方位x1、x2處與軌跡TR相交但大體上以相對於X軸之實質上類似角度相交。舉例而言,以相對於X軸之約90°引導探針光束625B_1、625B_2。在其他實施方案中,可使用拆分光學器件及折射光學器件來調整相對於X軸以其引導探針光束625B_1、625B_2之角度,使得該等探針光束朝向軌跡TR扇出且以不同及相異角度與軌跡TR相交。舉例而言,探針光束625B_1可相對於-X方向以大致90°與軌跡TR相交,而探針光束625B_2可相對於-X方向以小於90°之角度與軌跡TR相交。 As shown in this example, the probe beams 625B_1, 625B_2 are directed so that they intersect the track TR at different orientations x1, x2 but generally at substantially similar angles relative to the X-axis. For example, the probe beams 625B_1, 625B_2 are directed at about 90° relative to the X-axis. In other embodiments, split optics and refractive optics may be used to adjust the angles at which the probe beams 625B_1, 625B_2 are directed relative to the X-axis so that the probe beams fan out toward the track TR and intersect the track TR at different and different angles. For example, the probe beam 625B_1 may intersect the track TR at approximately 90° relative to the -X direction, and the probe beam 625B_2 may intersect the track TR at an angle less than 90° relative to the -X direction.

探針光束625B_1、625B_2中之每一者可為高斯光束,使得可藉由高斯函數描述每一探針光束625B_1、625B_2之光學強度之橫向分佈。每一探針光束625B_1、625B_2之焦點或光束腰可經組態以在軌跡TR或-X方向處重疊。 Each of the probe beams 625B_1, 625B_2 can be a Gaussian beam, so that the transverse distribution of the optical intensity of each probe beam 625B_1, 625B_2 can be described by a Gaussian function. The focus or beam waist of each probe beam 625B_1, 625B_2 can be configured to overlap at the track TR or -X direction.

光源626B可為固態雷射器,諸如YAG雷射器,其可為在1070nm下及在50W功率下操作之釹摻雜YAG(Nd:YAG)雷射器。在此實例中,當前目標105c在時間t1(及方位x1)處穿過第一探針光束625B_1,且探針光束625B_1中之至少一些自當前目標105c反射或散射以形成由偵測裝置135(藉助於機械濾光器140)偵測之診斷光620B_1。另外,當前目標105c在時間t2(及方位x2)處穿過第二探針光束625B_2,探針光束625B_2中之至少一些自當前目標105c反射或散射以形成由偵測裝置135(藉助於機械濾光器140)偵測之光620B_2。 The light source 626B may be a solid-state laser, such as a YAG laser, which may be a neodymium-doped YAG (Nd:YAG) laser operating at 1070 nm and at a power of 50 W. In this example, the current target 105c passes through the first probe beam 625B_1 at time t1 (and position x1), and at least some of the probe beam 625B_1 is reflected or scattered from the current target 105c to form the diagnostic light 620B_1 detected by the detection device 135 (by means of the mechanical filter 140). Additionally, the current target 105c passes through the second probe beam 625B_2 at time t2 (and position x2), and at least some of the probe beam 625B_2 is reflected or scattered from the current target 105c to form light 620B_2 detected by the detection device 135 (with the aid of the mechanical filter 140).

軌跡TR處之探針光束625B_1、625B_2之間的分離度△d可取決於自目標供應裝置175以其釋放目標105之速率(rate)以及目標105之大小及材料而經調整或定製。舉例而言,分離度△d可小於相鄰目標105之間的間距。作為另一實例,可基於相鄰目標105之間的間距而判定或設定 分離度△d以提供基於探針光束625B_1、625B_2與當前目標105c之間的相互作用而執行之量測之較大精確度。在一定程度上且大體而言,分離度△d愈大,執行之量測之精確度愈高。舉例而言,分離度△d可在約250μm與800μm之間。 The separation Δd between the probe beams 625B_1, 625B_2 at the trajectory TR can be adjusted or customized depending on the rate at which the self-target supply device 175 releases the target 105 and the size and material of the target 105. For example, the separation Δd can be less than the spacing between adjacent targets 105. As another example, the separation Δd can be determined or set based on the spacing between adjacent targets 105 to provide greater accuracy of the measurement performed based on the interaction between the probe beams 625B_1, 625B_2 and the current target 105c. To a certain extent and generally speaking, the larger the separation Δd, the higher the accuracy of the measurement performed. For example, the separation Δd may be between approximately 250 μm and 800 μm.

探針光束625B_1、625B_2與當前目標105c之間的相互作用使得控制系統170能夠判定移動屬性,諸如沿-X方向之當前目標105c之速率V。亦有可能判定遍及許多目標105之速率V或改變速率V之趨勢。若進行關於當前目標105c之運動之一些假設,則亦有可能僅使用探針光束625B_1、625B_2來判定沿-X方向之當前目標105c之移動屬性中之改變。 The interaction between the probe beams 625B_1, 625B_2 and the current target 105c enables the control system 170 to determine movement properties, such as the velocity V of the current target 105c in the -X direction. It is also possible to determine the velocity V or the trend of changing velocity V across many targets 105. If some assumptions are made about the motion of the current target 105c, it is also possible to determine changes in the movement properties of the current target 105c in the -X direction using only the probe beams 625B_1, 625B_2.

藉由診斷裝置165產生之診斷探針125(諸如探針光束625A及探針光束625B_1、625B_2)之波長應與經引導至目標空間110(以用於與目標105相互作用)之輻射脈衝之波長足夠相異以有助於在診斷光120與非診斷光122之間進行區分。在一些實施方案中,探針光束125、625A、625B_1及625B_2之波長為532nm或1550nm。 The wavelength of the diagnostic probe 125 (such as probe beam 625A and probe beams 625B_1, 625B_2) generated by the diagnostic device 165 should be sufficiently different from the wavelength of the radiation pulse directed to the target space 110 (for interaction with the target 105) to help distinguish between diagnostic light 120 and non-diagnostic light 122. In some embodiments, the wavelength of the probe beams 125, 625A, 625B_1 and 625B_2 is 532nm or 1550nm.

在諸如圖6C中展示之其他實施方案中,診斷裝置665C包括各自分別產生光束611C_1、611C_2之一對光源626C_1、626C_2(諸如兩個雷射器),而非具有諸如診斷裝置665B中之光源626B之單個光源。光束611C_1、611C_2中之每一者穿過可更改或調整光束611C_1、611C_2之特性之相應一或多個光學元件627C_1、627C_2。一或多個光學元件中之每一者之輸出端為相應探針光束625C_1、625C_2。光學組件627C_1、627C_2可包括用於將相應探針光束625C_1、625C_2朝向沿軌跡TR之相應方位x1、x2引導之組件。上文參考光學組件608B論述光學組件627C_1、627C_1之實例。 In other embodiments such as shown in FIG. 6C , the diagnostic device 665C includes a pair of light sources 626C_1, 626C_2 (such as two lasers) that each generate a light beam 611C_1, 611C_2, respectively, rather than a single light source such as the light source 626B in the diagnostic device 665B. Each of the light beams 611C_1, 611C_2 passes through a corresponding one or more optical elements 627C_1, 627C_2 that can change or adjust the characteristics of the light beams 611C_1, 611C_2. The output of each of the one or more optical elements is a corresponding probe beam 625C_1, 625C_2. Optical components 627C_1, 627C_2 may include components for directing corresponding probe beams 625C_1, 625C_2 toward corresponding positions x1, x2 along trajectory TR. Examples of optical components 627C_1, 627C_1 are discussed above with reference to optical component 608B.

如上文所論述,且參考圖7,在一些實施方案中,度量衡裝置100經實施為EUV光源776中之度量衡裝置700以量測目標105之一或多個屬性。EUV光源776包括目標供應裝置775,該目標供應裝置775產生沿軌跡TR朝向由腔室716界定之真空環境715內部之目標空間710的目標(各自通常指定為105)之連續流706。EUV光源776將已藉由目標105與輻射脈衝778之間的相互作用產生之EUV光777供應至輸出裝置779。如上文所論述,在當前目標105c沿軌跡TR朝向目標空間710行進時,度量衡裝置700量測且分析當前目標105c之一或多個移動屬性(諸如速度、速率及加速度)。軌跡TR沿可視為目標(或軸向)方向之方向延伸,該方向位於由腔室716界定之三維X、Y、Z座標系統中。如上文所論述,目標105之軸向方向大體上具有平行於腔室716之座標系統之-X方向之分量。然而,目標105之軸向方向亦可具有沿垂直於-X方向之方向Y及Z中之一或多者之分量。另外,由目標供應裝置775釋放之每一目標105可具有略微不同之實際軌跡且軌跡取決於在釋放目標105時之目標供應裝置775之物理屬性以及腔室716內之環境715。 7 , in some embodiments, the metrology device 100 is implemented as a metrology device 700 in an EUV light source 776 to measure one or more properties of a target 105. The EUV light source 776 includes a target supply device 775 that generates a continuous stream 706 of targets (each generally designated as 105) along a trajectory TR toward a target space 710 inside a vacuum environment 715 defined by a chamber 716. The EUV light source 776 supplies EUV light 777 that has been generated by the interaction between the target 105 and the radiation pulse 778 to an output device 779. As discussed above, the metrology device 700 measures and analyzes one or more movement properties (such as speed, velocity, and acceleration) of the current target 105c as it travels along the trajectory TR toward the target space 710. The trajectory TR extends along a direction that can be considered as a target (or axial) direction, which is located in the three-dimensional X, Y, Z coordinate system defined by the chamber 716. As discussed above, the axial direction of the target 105 generally has a component parallel to the -X direction of the coordinate system of the chamber 716. However, the axial direction of the target 105 may also have a component along one or more of the directions Y and Z that are perpendicular to the -X direction. Additionally, each target 105 released by the target supply device 775 may have a slightly different actual trajectory and the trajectory depends on the physical properties of the target supply device 775 and the environment 715 within the chamber 716 when the target 105 is released.

EUV光源776大體上包括EUV集光器780、光學源781、與光學源781通信之致動系統782及與度量衡裝置700之控制系統170以及目標供應裝置775、光學源781及致動系統782通信的控制裝置783。 The EUV light source 776 generally includes an EUV collector 780, an optical source 781, an actuation system 782 communicating with the optical source 781, and a control system 170 communicating with the metrology device 700 and a control device 783 communicating with the target supply device 775, the optical source 781, and the actuation system 782.

EUV集光器780儘可能多地收集自電漿785發射之EUV光784且朝向輸出裝置779重新引導作為經收集EUV光777之彼EUV光784。集光器780可為反射光學器件,諸如能夠反射具有EUV波長之光(亦即,EUV光784)以形成所產生EUV光777之曲形鏡面。 The EUV concentrator 780 collects as much EUV light 784 emitted from the plasma 785 as possible and redirects that EUV light 784 toward the output device 779 as collected EUV light 777. The concentrator 780 may be a reflective optical device, such as a curved mirror capable of reflecting light having an EUV wavelength (i.e., EUV light 784) to form the generated EUV light 777.

光學源781產生輻射脈衝778之一或多個光束且大體上沿Z 方向將輻射脈衝778之一或多個光束引導至目標空間710(但輻射脈衝778之光束可處於相對於Z方向之一角度)。在作為示意性表示之圖7中,輻射脈衝778之光束經展示為沿-Y方向經引導。光學源781包括產生輻射脈衝778之一或多個光源、包括改變輻射脈衝778之光束之方向或角度之光學轉向組件的光束遞送系統及將輻射脈衝778之光束聚焦至目標空間710之聚焦總成。例示性光學轉向組件包括視需要藉由折射或反射來使輻射脈衝778之光束轉向或引導該光束的光學元件,諸如透鏡及鏡面。致動系統782可用於控制或移動光束遞送系統之光學組件及聚焦總成之各種特徵,以及調整產生輻射脈衝778之光學源781之態樣。 Optical source 781 generates one or more beams of radiation pulses 778 and directs one or more beams of radiation pulses 778 toward target space 710 generally along the Z direction (although the beams of radiation pulses 778 may be at an angle relative to the Z direction). In FIG. 7 , which is a schematic representation, the beams of radiation pulses 778 are shown as being directed along the −Y direction. Optical source 781 includes one or more light sources that generate radiation pulses 778, a beam delivery system including an optical steering assembly that changes the direction or angle of the beams of radiation pulses 778, and a focusing assembly that focuses the beams of radiation pulses 778 toward target space 710. Exemplary optical steering components include optical elements, such as lenses and mirrors, that steer or direct the beam of radiation pulse 778 by refraction or reflection as needed. Actuation system 782 can be used to control or move various features of the optical components and focusing assembly of the beam delivery system, as well as adjust the state of optical source 781 that generates radiation pulse 778.

光學源781包括至少一個增益介質及激發增益介質以產生輻射脈衝778之能量源。輻射脈衝778構成彼此及時分離之複數個光學脈衝。在其他實施方案中,自光學源781輸出之光束可為連續波(continuous wave;CW)光束。光學源781可為或包括例如固態雷射器(例如,Nd:YAG雷射器,鉺摻雜纖維(Er:玻璃)雷射器或在1070nm下及在50W功率下操作之釹摻雜YAG(Nd:YAG)雷射器。 The optical source 781 includes at least one gain medium and an energy source for exciting the gain medium to generate a radiation pulse 778. The radiation pulse 778 constitutes a plurality of optical pulses separated from each other in time. In other embodiments, the light beam output from the optical source 781 may be a continuous wave (CW) light beam. The optical source 781 may be or include, for example, a solid-state laser (e.g., a Nd:YAG laser, an erbium-doped fiber (Er:glass) laser, or a neon-doped YAG (Nd:YAG) laser operating at 1070 nm and at a power of 50 W.

致動系統782耦合至光學源781之組件且亦與控制裝置783通信且在控制裝置783之控制下。致動系統782能夠修改或控制輻射脈衝778與目標空間710中之目標105之間的相對位置。舉例而言,致動系統782經組態以調整輻射脈衝778之釋放之時序及輻射脈衝778以其行進之方向中的一或多者。 Actuation system 782 is coupled to components of optical source 781 and is also in communication with and under control of control device 783. Actuation system 782 is capable of modifying or controlling the relative position between radiation pulse 778 and target 105 in target space 710. For example, actuation system 782 is configured to adjust one or more of the timing of the release of radiation pulse 778 and the direction in which radiation pulse 778 travels.

目標供應裝置775經組態以在特定速率下釋放目標105之流(或多者706)。當判定對當前目標105c之一或多個移動屬性執行量測及分析所需之時間之總量以及基於該量測及分析而影響對EUV光源776之其他 態樣或組件之改變時,度量衡裝置700考慮此速率。舉例而言,控制系統170可將量測及分析之結果傳送至控制裝置783,其判定如何調整一或多個信號以適應致動系統782,從而調整經引導至目標空間710之輻射脈衝778之一或多個特性。 The target supply device 775 is configured to release a stream (or multiple 706) of targets 105 at a specific rate. The metrology device 700 takes this rate into account when determining the total amount of time required to perform measurement and analysis of one or more motion properties of the current target 105c and changes to other states or components of the EUV light source 776 that are affected based on the measurement and analysis. For example, the control system 170 can transmit the results of the measurement and analysis to the control device 783, which determines how to adjust one or more signals to adapt the actuation system 782 to adjust one or more characteristics of the radiation pulse 778 directed to the target space 710.

對輻射脈衝778之一或多個特性之調整可改進現有目標105'與目標空間710中之輻射脈衝778之間的相對對準。現有目標105'係在輻射脈衝778(其恰好已經調整)到達目標空間710中時已進入目標空間710之目標。對輻射脈衝778之一或多個特性之此類調整改進現有目標105'與輻射脈衝778之間的相互作用且增加藉由此類相互作用產生之EUV光784之量。如圖7中所展示,先前目標105p已與先前輻射脈衝(未展示)相互作用以產生(除了EUV光784之外)發射非診斷光122之電漿785。 Adjustment of one or more characteristics of radiation pulse 778 may improve the relative alignment between existing target 105' and radiation pulse 778 in target space 710. Existing target 105' is a target that has entered target space 710 when radiation pulse 778 (which happens to have been adjusted) arrives in target space 710. Such adjustment of one or more characteristics of radiation pulse 778 improves the interaction between existing target 105' and radiation pulse 778 and increases the amount of EUV light 784 produced by such interaction. As shown in FIG. 7 , a previous target 105p has interacted with a previous radiation pulse (not shown) to produce a plasma 785 that emits non-diagnostic light 122 (in addition to EUV light 784).

在一些實施方案中,現有目標105'為當前目標105c。在此等實施方案中,對輻射脈衝778之一或多個特性之調整發生於相對較短之時間框內。相對較短時間框意謂輻射脈衝778之一或多個特性在對當前目標105c之移動屬性之分析完成之後的時間至當前目標105c進入目標空間710之時間期間經調整。因為輻射脈衝778之一或多個特性能夠在相對較短時間框內經調整,故存在影響當前目標105c(其移動屬性恰好已經分析)與輻射脈衝778之間的相互作用之足夠時間。 In some embodiments, the existing target 105' is the current target 105c. In such embodiments, the adjustment of one or more characteristics of the radiation pulse 778 occurs within a relatively short time frame. The relatively short time frame means that one or more characteristics of the radiation pulse 778 are adjusted during the time after the analysis of the motion properties of the current target 105c is completed to the time when the current target 105c enters the target space 710. Because one or more characteristics of the radiation pulse 778 can be adjusted within a relatively short time frame, there is sufficient time to affect the interaction between the current target 105c (whose motion properties have just been analyzed) and the radiation pulse 778.

在其他實施方案中,現有目標105'為另一目標,亦即,除當前目標105c之外且時間上在當前目標105c之後的目標。在此等實施方案中,對輻射脈衝778之一或多個特性之調整在相對較長時間框內發生,使得影響當前目標105c(其移動屬性恰好已經分析)與輻射脈衝778之間的相互作用係不可行的。另一方面,影響另一(或稍後)目標與輻射脈衝778 之間的相互作用係可行的。相對較長時間框為大於在對當前目標105c之移動屬性之分析完成之後的時間至當前目標105c進入目標空間710之時間的時間框。取決於相對較長時間框,另一目標可鄰近於當前目標105c。或者,另一目標可鄰近於中間目標,該中間目標鄰近於當前目標105c。在此等其他實施方案中,假設另一目標(其不為當前目標105c)正以與偵測到或估計之當前目標105c之移動屬性足夠類似的移動屬性行進。 In other embodiments, the existing target 105' is another target, that is, a target other than the current target 105c and later in time than the current target 105c. In such embodiments, the adjustment of one or more characteristics of the radiation pulse 778 occurs within a relatively long time frame, so that it is not feasible to affect the interaction between the current target 105c (whose motion properties have just been analyzed) and the radiation pulse 778. On the other hand, it is feasible to affect the interaction between another (or later) target and the radiation pulse 778. The relatively long time frame is a time frame greater than the time after the analysis of the motion properties of the current target 105c is completed to the time when the current target 105c enters the target space 710. Depending on the relatively long time frame, the other target may be adjacent to the current target 105c. Alternatively, the other target may be adjacent to an intermediate target that is adjacent to the current target 105c. In these other embodiments, it is assumed that the other target (which is not the current target 105c) is moving with movement properties that are sufficiently similar to the movement properties of the detected or estimated current target 105c.

目標105(包括先前目標105p及當前目標105c,及藉由目標供應裝置775(或175)產生之所有其他目標)中之每一者包括當轉換為電漿時發射EUV光之材料。每一目標105經由在目標空間710內與藉由光學源781產生之輻射脈衝778相互作用來至少部分地或大多轉換成電漿。藉由目標供應裝置775(或175)產生之每一目標105為目標混合物,該目標混合物包括目標材料及視情況選用之雜質,諸如非目標顆粒。目標材料為能夠轉換為電漿狀態之具有在EUV範圍內之發射譜線之物質。目標105可為例如液體或熔融金屬之小滴、液體流之一部分、固體顆粒或叢集、液滴內所含有之固體顆粒、目標材料之發泡體或液體流之一部分內所含有之固體顆粒。目標材料可包括例如水、錫、鋰、氙或在經轉換為電漿狀態時具有在EUV範圍內之發射譜線之任何材料。舉例而言,目標材料可為元素錫,其可用作純錫(Sn);用作錫化合物,諸如SnBr4、SnBr2、SnH4;用作錫合金,諸如錫-鎵合金、錫-銦合金、錫-銦-鎵合金或此等合金之任何組合。在不存在雜質之情形下,則每一目標105僅包括目標材料。本文中所提供之論述為其中每一目標105係由諸如錫之熔融金屬製成之小滴的實例。然而,藉由目標供應裝置775(或175)產生之每一目標105可採取其他形式。 Each of the targets 105 (including the previous target 105p and the current target 105c, and all other targets generated by the target supply device 775 (or 175)) includes a material that emits EUV light when converted into plasma. Each target 105 is at least partially or mostly converted into plasma by interacting with the radiation pulse 778 generated by the optical source 781 in the target space 710. Each target 105 generated by the target supply device 775 (or 175) is a target mixture that includes a target material and, if appropriate, impurities such as non-target particles. The target material is a substance that can be converted into a plasma state and has an emission spectrum in the EUV range. The target 105 may be, for example, a droplet of a liquid or molten metal, a portion of a liquid stream, a solid particle or cluster, a solid particle contained in a droplet, a foam of the target material, or a solid particle contained in a portion of a liquid stream. The target material may include, for example, water, tin, lithium, xenon, or any material having an emission spectrum in the EUV range when converted to a plasma state. For example, the target material may be elemental tin, which may be used as pure tin (Sn); as a tin compound, such as SnBr4 , SnBr2 , SnH4 ; as a tin alloy, such as a tin-gallium alloy, a tin-indium alloy, a tin-indium-gallium alloy, or any combination of such alloys. In the absence of impurities, each target 105 includes only the target material. The discussion provided herein is an example in which each target 105 is a droplet made of a molten metal such as tin. However, each target 105 produced by the target supply device 775 (or 175) can take other forms.

目標105可藉由使熔融目標材料穿過目標供應裝置775(或175)之噴嘴且允許目標105沿軌跡TR漂移至目標空間710中來提供至目標空間710。在一些實施方案中,目標105可藉由力(除了重力之外或不管重力)來引導至目標空間710。如下文所論述,與輻射脈衝778相互作用之現有目標105'(其可為當前目標105c)亦可已與一或多個先前輻射脈衝相互作用。或者,與輻射脈衝778相互作用之現有目標105'可達到目標空間710而沒有與任何其他輻射脈衝相互作用。 The target 105 may be provided to the target space 710 by passing molten target material through a nozzle of a target supply device 775 (or 175) and allowing the target 105 to drift into the target space 710 along a trajectory TR. In some embodiments, the target 105 may be guided to the target space 710 by a force (in addition to or in spite of gravity). As discussed below, an existing target 105' (which may be the current target 105c) interacting with a radiation pulse 778 may also have interacted with one or more previous radiation pulses. Alternatively, an existing target 105' interacting with a radiation pulse 778 may reach the target space 710 without interacting with any other radiation pulses.

在此實施方案中,偵測裝置735經定位於腔室716外部,而診斷區745在腔室716之環境715內部。腔室716之壁經裝配有光學窗736,該光學窗736對診斷光120之波長為可穿透的且能夠承受該壁處之任何壓差。光學窗736可固持於安裝件中且氣密密封於壁中以維持環境715內之壓力。舉例而言,光學窗736可由諸如硼矽酸鹽玻璃(BK7或N-BK7)或熔融矽石之具有相對低折射率及低色散之冕牌玻璃(crown glass)製成。光學窗736具有足夠大以適應診斷光120之範圍之孔口。診斷區745與光學窗之間的距離可為約數百毫米(或約600至700mm),而診斷區745與目標空間710之間的距離可為約幾毫米(或約1至5mm)。因此,診斷區745與光學窗之間的距離可為診斷區745與目標空間710之間的距離之200至500倍。 In this embodiment, the detection device 735 is positioned outside the chamber 716, and the diagnostic area 745 is inside the environment 715 of the chamber 716. The wall of the chamber 716 is equipped with an optical window 736 that is transparent to the wavelength of the diagnostic light 120 and can withstand any pressure differential at the wall. The optical window 736 can be held in a mount and hermetically sealed in the wall to maintain the pressure within the environment 715. For example, the optical window 736 can be made of a crown glass with a relatively low refractive index and low dispersion, such as borosilicate glass (BK7 or N-BK7) or fused silica. The optical window 736 has an aperture large enough to accommodate the range of the diagnostic light 120. The distance between the diagnostic region 745 and the optical window may be about hundreds of millimeters (or about 600 to 700 mm), while the distance between the diagnostic region 745 and the target space 710 may be about several millimeters (or about 1 to 5 mm). Therefore, the distance between the diagnostic region 745 and the optical window may be 200 to 500 times the distance between the diagnostic region 745 and the target space 710.

控制裝置783與控制系統170通信且亦與EUV光源776之其他組件(諸如致動系統782、目標供應裝置775及光學源781)通信。參考圖8,展示控制裝置783之實施方案883且展示控制系統170之實施方案870。控制裝置883包括控制系統870,但控制系統870有可能與控制裝置883實體地分離並仍保持通信。另外,控制裝置883之特徵或組件可與控制系統870共用,包括圖8中未展示之特徵。 The control device 783 communicates with the control system 170 and also communicates with other components of the EUV light source 776, such as the actuation system 782, the target supply device 775, and the optical source 781. Referring to FIG. 8, an embodiment 883 of the control device 783 is shown and an embodiment 870 of the control system 170 is shown. The control device 883 includes the control system 870, but the control system 870 may be physically separated from the control device 883 and still maintain communication. In addition, features or components of the control device 883 may be shared with the control system 870, including features not shown in FIG. 8.

控制系統870包括經組態以自偵測裝置735(或135,335,435)接收輸出之信號處理模組871。控制系統870包括與診斷裝置765(或165)通信之診斷控制模組872。舉例而言,信號處理模組871自偵測裝置735(135,335,435)內之感測器130接收信號,其中信號為與由在感測器130處偵測到之光產生之電流相關的電壓信號。大體而言,信號處理模組871分析來自感測器730之輸出,且基於此分析而判定當前目標105c之一或多個移動屬性。診斷控制模組872控制診斷裝置765之操作。舉例而言,診斷控制模組872可將信號提供至診斷裝置765以用於調整診斷裝置765之一或多個特性以及用於調整一或多個診斷探針725之一或多個特性。 The control system 870 includes a signal processing module 871 configured to receive output from the self-detection device 735 (or 135, 335, 435). The control system 870 includes a diagnostic control module 872 that communicates with the diagnostic device 765 (or 165). For example, the signal processing module 871 receives a signal from the sensor 130 within the self-detection device 735 (135, 335, 435), where the signal is a voltage signal related to the current generated by the light detected at the sensor 130. Generally speaking, the signal processing module 871 analyzes the output from the sensor 730 and determines one or more movement attributes of the current target 105c based on this analysis. The diagnostic control module 872 controls the operation of the diagnostic device 765. For example, the diagnostic control module 872 may provide signals to the diagnostic device 765 for adjusting one or more characteristics of the diagnostic device 765 and for adjusting one or more characteristics of one or more diagnostic probes 725.

信號處理模組871亦判定是否需要基於當前目標105c之一或多個移動屬性之判定而對自光學源781輸出之後續輻射脈衝778做出調整。並且,若需要調整,則信號處理模組871將適當信號發送至與光學源781或致動系統782介接之光學源致動模組884。光學源致動模組884可在控制裝置883內(如圖8中所展示)或其可整合於控制系統870內。 The signal processing module 871 also determines whether adjustments need to be made to the subsequent radiation pulse 778 output from the optical source 781 based on the determination of one or more motion properties of the current target 105c. And, if adjustments are required, the signal processing module 871 sends appropriate signals to the optical source actuation module 884 interfaced with the optical source 781 or the actuation system 782. The optical source actuation module 884 can be within the control device 883 (as shown in FIG. 8) or it can be integrated into the control system 870.

信號處理模組871可包括一或多個場可程式化硬體電路,諸如場可程式化閘陣列(field-programmable gate array;FPGA)。FPGA為經設計為由客戶或設計者在製造之後組態的積體電路。場可程式化硬體電路可為接收時戳之一或多個值、對所接收值執行計算且使用一或多個查找表來估計現有目標105'到達目標空間710之時間的專用硬體。特定而言,場可程式化硬體電路可用於快速地執行計算以在相對較短時間框內實現對輻射脈衝778之一或多個特性之調整,從而實現對與當前目標105c(其移動屬性恰好已由信號處理模組871分析)相互作用之輻射脈衝778之一 或多個特性之調整。 The signal processing module 871 may include one or more field programmable hardware circuits, such as a field-programmable gate array (FPGA). An FPGA is an integrated circuit designed to be configured by a customer or designer after manufacturing. The field programmable hardware circuit may be a dedicated hardware that receives one or more values of a timestamp, performs calculations on the received values, and uses one or more lookup tables to estimate the time for an existing target 105' to arrive at the target space 710. In particular, the field programmable hardware circuit can be used to rapidly perform calculations to implement adjustments to one or more characteristics of the radiation pulse 778 within a relatively short time frame, thereby implementing adjustments to one or more characteristics of the radiation pulse 778 interacting with the current target 105c (whose motion properties have just been analyzed by the signal processing module 871).

控制裝置883包括經組態以與目標供應裝置775介接之目標遞送模組885。另外,控制裝置883及控制系統870可包括具體言之經組態以與未展示之EUV光源776之其他組件介接的其他模組。 The control device 883 includes a target delivery module 885 configured to interface with the target supply device 775. In addition, the control device 883 and the control system 870 may include other modules that are specifically configured to interface with other components of the EUV light source 776 that are not shown.

控制系統870大體上包括或可接入數位電子電路、電腦硬體、韌體及軟體中之一或多者。舉例而言,控制系統870可接入可為唯讀記憶體及/或隨機存取記憶體之記憶體873。適合於有形地體現電腦程式指令及資料之儲存器件包括所有形式之非揮發性記憶體,包括(藉助於實例):半導體記憶體器件,諸如EPROM、EEPROM及快閃記憶體器件;磁碟,諸如內部硬碟及抽取式磁碟;磁光碟;及CD-ROM磁碟。控制系統870亦可包括或一或多個輸入器件874i(諸如鍵盤、觸控螢幕、麥克風、滑鼠、手持式輸入器件等)及一或多個輸出器件874o(諸如揚聲器及監視器)或與該一或多個輸入裝置874i及該一或多個輸出裝置874o介接。 The control system 870 generally includes or has access to one or more of digital electronic circuitry, computer hardware, firmware, and software. For example, the control system 870 has access to memory 873, which may be read-only memory and/or random access memory. Storage devices suitable for tangibly embodying computer program instructions and data include all forms of non-volatile memory, including, by way of example: semiconductor memory devices, such as EPROM, EEPROM, and flash memory devices; disks, such as internal hard disks and removable disks; magneto-optical disks; and CD-ROM disks. The control system 870 may also include or interface with one or more input devices 874i (such as a keyboard, touch screen, microphone, mouse, handheld input device, etc.) and one or more output devices 874o (such as a speaker and a monitor).

控制系統870亦可包括或接入一或多個可程式化處理器,及有形地體現於機器可讀儲存器件中以供可程式化處理器執行之一或多個電腦程式產品。一或多個可程式化處理器可各自執行指令之程式以藉由對輸入資料進行操作及產生適當輸出來執行所要功能。大體而言,處理器自記憶體873接收指令及資料。前述任一者可藉由經專門設計之特殊應用積體電路(application-specific integrated circuit;ASIC)補充或併入於其中。 The control system 870 may also include or access one or more programmable processors, and one or more computer program products tangibly embodied in a machine-readable storage device for execution by the programmable processor. One or more programmable processors may each execute a program of instructions to perform a desired function by operating on input data and generating appropriate output. Generally, the processor receives instructions and data from the memory 873. Any of the foregoing may be supplemented or incorporated therein by a specially designed application-specific integrated circuit (ASIC).

另外,模組中之任一者或多者可包括其自身數位電子電路、電腦硬體、韌體及軟體以及專用記憶體、輸入及輸出器件、可程式化處理器及電腦程式產品。同樣地,模組中之任一者或多者可接入且使用記 憶體873、輸入器件874i、輸出器件874o、可程式化處理器及電腦程式產品。 In addition, any one or more of the modules may include its own digital electronic circuits, computer hardware, firmware and software as well as dedicated memory, input and output devices, programmable processors and computer program products. Similarly, any one or more of the modules may access and use memory 873, input devices 874i, output devices 874o, programmable processors and computer program products.

雖然控制系統870經展示為分離及完整單元,但其組件及模組中之每一者有可能為分離單元。控制裝置883可包括圖8中未展示之其他組件,諸如專用記憶體、輸入/輸出器件、處理器及電腦程式產品。 Although the control system 870 is shown as a separate and complete unit, each of its components and modules may be a separate unit. The control device 883 may include other components not shown in Figure 8, such as dedicated memory, input/output devices, processors, and computer program products.

參考圖9,展示微影裝置779之實施方案979。微影裝置979藉由曝光光束B來曝光基板(其可稱作晶圓)W。微影裝置979包括均在殼體10中之複數個反射光學元件R1、R2、R3、遮罩M及狹縫S。殼體10為能夠支撐反射光學元件R1、R1、R2、遮罩M及狹縫S且亦能夠維持殼體10內之抽空空間的外殼、貯槽或其他結構。 Referring to FIG. 9 , an implementation scheme 979 of the lithography apparatus 779 is shown. The lithography apparatus 979 exposes a substrate (which may be referred to as a wafer) W by an exposure beam B. The lithography apparatus 979 includes a plurality of reflective optical elements R1, R2, R3, a mask M, and a slit S all in a housing 10. The housing 10 is an outer shell, a storage tank, or other structure that can support the reflective optical elements R1, R1, R2, the mask M, and the slit S and can also maintain the evacuated space in the housing 10.

EUV光777進入殼體10且由光學元件R1經由狹縫S朝向遮罩M反射。狹縫S部分地界定用於在微影製程中掃描基板W之分散光之形狀。遞送至基板W之劑量或遞送至基板W之光子數目取決於狹縫S之大小及以其掃描狹縫S之速度。 EUV light 777 enters housing 10 and is reflected by optical element R1 through slit S toward mask M. Slit S partially defines the shape of the scattered light used to scan substrate W during lithography. The amount of light delivered to substrate W or the number of photons delivered to substrate W depends on the size of slit S and the speed at which slit S is scanned.

遮罩M亦可稱作倍縮光罩或圖案化器件。遮罩M包括表示待形成於基板W上之光阻中之特徵的空間圖案。EUV光777與遮罩M相互作用。EUV光777與遮罩M之間的相互作用使得遮罩M之圖案經賦予至EUV光777上以形成曝光光束B。曝光光束B穿過狹縫S且由光學元件R2及R3引導至基板W。基板W與曝光光束B之間的相互作用將遮罩M之圖案曝光至基板W上,且光阻特徵籍此形成於基板W處。基板W包括複數個部分20(例如,晶粒)。每一部分20在Y-Z平面中之面積小於整個基板W在Y-Z平面中之面積。每一部分20可由曝光光束B曝光以包括遮罩M之複本,使得每一部分20包括由遮罩M上之圖案指示之電子特徵。 The mask M may also be referred to as a zoom mask or a patterned device. The mask M includes a spatial pattern representing features to be formed in the photoresist on the substrate W. The EUV light 777 interacts with the mask M. The interaction between the EUV light 777 and the mask M causes the pattern of the mask M to be imparted to the EUV light 777 to form an exposure beam B. The exposure beam B passes through the slit S and is guided to the substrate W by the optical elements R2 and R3. The interaction between the substrate W and the exposure beam B exposes the pattern of the mask M to the substrate W, and the photoresist features are thereby formed at the substrate W. The substrate W includes a plurality of portions 20 (e.g., grains). The area of each portion 20 in the Y-Z plane is smaller than the area of the entire substrate W in the Y-Z plane. Each portion 20 can be exposed by exposure beam B to include a copy of mask M, so that each portion 20 includes electronic features indicated by the pattern on mask M.

微影裝置979可包括與EUV光源776之控制裝置783通信之微影控制系統30。 The lithography apparatus 979 may include a lithography control system 30 that communicates with a control device 783 of the EUV light source 776.

參考圖10,過程1090由度量衡裝置100(或度量衡裝置700)執行。在當前目標105c進入目標空間110之前,診斷探針125在診斷區145中與當前目標105c相互作用(1091)。收集由相互作用(1091)產生之診斷光120,且同時,亦收集由目標空間110產生之一些非想要非診斷光122(1092)。舉例而言,機械濾光器140之入口處之光瞳收集診斷光120及非診斷光122。診斷光120及非診斷光122為準直的(1093)。光學準直器142使已進入機械濾光器140之診斷光120及非診斷光122準直。此準直診斷光及非診斷光在角度上彼此分離(1094)。光束縮減器150縮減準直診斷光束及準直非診斷光束之橫向範圍(沿XsYs平面),且此等縮減之光束121、123分別離開光束縮減器150,且隨著其沿光學路徑152朝向遮罩155行進,其角分離度增大。在與開放影像平面光學通信之感測區(例如,感測器130)處感測準直診斷光束121,該開放影像平面自阻擋準直非診斷光束123之閉合影像平面橫向地移位(在XsYs平面中)(1095)。舉例而言,感測器130感測準直診斷光束121,感測器130與孔口160(開放影像平面)光學通信,且孔口160在XsYs平面中自準直非診斷光束123照射在其上之遮罩155橫向地移位。基於所感測診斷光而估計當前目標105c之屬性(1096)。特定而言,控制系統170分析來自感測器130之輸出以估計當前目標105c之一或多個移動屬性。 10 , process 1090 is performed by the metrology device 100 (or metrology device 700). Before the current target 105c enters the target space 110, the diagnostic probe 125 interacts with the current target 105c in the diagnostic region 145 (1091). The diagnostic light 120 generated by the interaction (1091) is collected, and at the same time, some unwanted non-diagnostic light 122 generated by the target space 110 is also collected (1092). For example, the pupil at the entrance of the mechanical filter 140 collects the diagnostic light 120 and the non-diagnostic light 122. The diagnostic light 120 and the non-diagnostic light 122 are collimated (1093). The optical collimator 142 collimates the diagnostic light 120 and the non-diagnostic light 122 that have entered the mechanical filter 140. The collimated diagnostic light and the non-diagnostic light are angularly separated from each other (1094). The beam reducer 150 reduces the lateral extent (along the XsYs plane) of the collimated diagnostic beam and the collimated non-diagnostic beam, and these reduced beams 121, 123 leave the beam reducer 150, respectively, and their angular separation increases as they travel along the optical path 152 toward the mask 155. The collimated diagnostic beam 121 is sensed at a sensing region (e.g., sensor 130) in optical communication with an open image plane that is laterally displaced (in the XsYs plane) from a closed image plane that blocks the collimated non-diagnostic beam 123 (1095). For example, the collimated diagnostic beam 121 is sensed by sensor 130 that is in optical communication with aperture 160 (open image plane) and aperture 160 is laterally displaced in the XsYs plane from a mask 155 on which the collimated non-diagnostic beam 123 impinges. A property of the current target 105c is estimated based on the sensed diagnostic light (1096). In particular, the control system 170 analyzes the output from the sensor 130 to estimate one or more motion properties of the current target 105c.

如上文參考圖6A至6C所論述,診斷探針125可為經引導以與目標105之軌跡交叉之一或多個探針光束。因此,診斷探針125與當前目標105c之間的相互作用(1091)可在此等探針光束與當前目標105c之間。 在一些實施方案中,經收集(1092)之診斷光120可為自當前目標105c反射或散射之探針光束125之一部分。在其他實施方案中,經收集(1092)之診斷光120為藉由當前目標105c產生之光。在其他實施方案中,經收集(1092)之診斷光120為由當前目標105c阻擋之光(如圖12中所展示)。 As discussed above with reference to FIGS. 6A-6C , the diagnostic probe 125 may be one or more probe beams directed to intersect the trajectory of the target 105. Thus, the interaction (1091) between the diagnostic probe 125 and the current target 105c may be between such probe beams and the current target 105c. In some embodiments, the diagnostic light 120 collected (1092) may be a portion of the probe beam 125 reflected or scattered from the current target 105c. In other embodiments, the diagnostic light 120 collected (1092) is light generated by the current target 105c. In other embodiments, the diagnostic light 120 collected (1092) is light blocked by the current target 105c (as shown in FIG. 12).

藉由用機械濾光器140阻擋或重新引導非診斷光122來縮減非診斷光122對來自感測器130之輸出之分析的影響,且因此防止非診斷光122照射在感測器130上且該非診斷光122實際上由遮罩155阻擋。另外,自準直器142輸出之準直診斷光束及準直非診斷光束之準直狀態一直經維持至遮罩155之平面,而準直診斷光束121在穿過孔口160之後進一步經聚焦至感測器130上。 The influence of the non-diagnostic light 122 on the analysis of the output from the sensor 130 is reduced by blocking or redirecting the non-diagnostic light 122 with the mechanical filter 140, and thus preventing the non-diagnostic light 122 from being irradiated on the sensor 130 and the non-diagnostic light 122 is actually blocked by the mask 155. In addition, the collimated state of the collimated diagnostic beam and the collimated non-diagnostic beam output from the collimator 142 is always maintained to the plane of the mask 155, and the collimated diagnostic beam 121 is further focused onto the sensor 130 after passing through the aperture 160.

參考圖11,在其他實施方案中,光學準直器142及具有正焦距且最接近光學準直器142之光束縮減器150之組件經整合至單個折射元件1142/1151中。此積體單個折射元件1142/1151可應用於Galilean型折射望遠鏡(諸如圖3及展示於圖11中之望遠鏡)或Keplerian型折射望遠鏡(諸如圖4之望遠鏡)。 Referring to FIG. 11 , in other embodiments, the optical collimator 142 and the beam reducer 150 having a positive focal length and closest to the optical collimator 142 are integrated into a single refractive element 1142/1151. This integrated single refractive element 1142/1151 can be applied to a Galilean-type refractive telescope (such as the telescope shown in FIG. 3 and FIG. 11 ) or a Keplerian-type refractive telescope (such as the telescope shown in FIG. 4 ).

參考圖12,在其他實施方案中,診斷光120由藉由當前目標105c阻擋之診斷探針光束1225之一部分產生。在度量衡裝置1200之此實施方案中,診斷探針1225提供當前目標105c之背部照明。感測器130為二維(例如,成像)感測器1230,諸如相機。因此,當當前目標105c與診斷探針1225交叉時,目標105c之陰影由遮掩診斷探針1225之至少一部分之目標105c形成,如圖12之插圖中所展示。此種配置可視為造影(shadowgraph)配置。在此類實施方案中,感測器1230經配置於與診斷裝置1265配置於其上之側相對的目標軌跡TR之一側上。感測器1230為捕獲 診斷光1220之二維表示(其可視為影像)之相機。因此,例如,感測器1230包括數千或數百萬個光位點(或像素)之二維陣列。診斷光1220經引導至每一像素之感光性區域上,其中其經轉換成經收集至電壓信號中之電子且此等信號之陣列形成二維影像。如上文所論述,實質上阻擋非診斷光1222到達感測器1230。 Referring to FIG. 12 , in other embodiments, the diagnostic light 120 is generated by a portion of the diagnostic probe beam 1225 that is blocked by the current target 105 c. In this embodiment of the metrology device 1200, the diagnostic probe 1225 provides back illumination of the current target 105 c. The sensor 130 is a two-dimensional (e.g., imaging) sensor 1230, such as a camera. Therefore, when the current target 105 c intersects the diagnostic probe 1225, a shadow of the target 105 c is formed by the target 105 c obscuring at least a portion of the diagnostic probe 1225, as shown in the inset of FIG. 12 . This configuration can be considered a shadowgraph configuration. In such embodiments, the sensor 1230 is disposed on a side of the target trajectory TR opposite the side on which the diagnostic device 1265 is disposed. The sensor 1230 is a camera that captures a two-dimensional representation of the diagnostic light 1220, which can be viewed as an image. Thus, for example, the sensor 1230 includes a two-dimensional array of thousands or millions of light locations (or pixels). The diagnostic light 1220 is directed onto the photosensitive area of each pixel, where it is converted into electrons that are collected into voltage signals and the array of such signals forms a two-dimensional image. As discussed above, the non-diagnostic light 1222 is substantially blocked from reaching the sensor 1230.

參考圖13,在其他實施方案中,光束縮減器150經設計為自諸如準直器342之光學準直器接收準直光束之反射光束縮減器1350。反射光束縮減器1350包括凹形反射性元件(曲形鏡面)1351,其使光束朝向凸形反射性元件(曲形鏡面)1353收斂,從而使光準直為在相異方向(或角度)上沿光學路徑1352朝向遮罩155行進之準直診斷光束121及準直非診斷光束123。 Referring to FIG. 13 , in other embodiments, the beam reducer 150 is designed as a reflective beam reducer 1350 that receives a collimated beam from an optical collimator such as the collimator 342. The reflective beam reducer 1350 includes a concave reflective element (curved mirror) 1351 that converges the beam toward a convex reflective element (curved mirror) 1353, thereby collimating the light into a collimated diagnostic beam 121 and a collimated non-diagnostic beam 123 that travel in different directions (or angles) along an optical path 1352 toward the mask 155.

參考圖14,在其他實施方案中,光束縮減器150經設計為自諸如準直器342之光學準直器接收準直光束之反射折射(混合式)光束縮減器1450。混合式光束縮減器1450包括將光束引導至曲形反射性元件(曲形鏡面)1451b上之平坦反射性元件(平坦鏡面)1451a,該曲形反射性元件1451b使光束朝向曲形鏡面1451b與凸形或收斂折射元件(透鏡)1453之間的中間焦點IF收斂。透鏡1453使光準直為在相異方向(或角度)上沿光學路徑朝向遮罩155行進之準直診斷光束121及準直非診斷光束123。 14, in other embodiments, the beam reducer 150 is designed as a catadioptric (hybrid) beam reducer 1450 that receives a collimated beam from an optical collimator, such as the collimator 342. The hybrid beam reducer 1450 includes a flat reflective element (flat mirror) 1451a that directs the beam onto a curved reflective element (curved mirror) 1451b, which converges the beam toward an intermediate focus IF between the curved mirror 1451b and a convex or converging refractive element (lens) 1453. Lens 1453 collimates the light into a collimated diagnostic beam 121 and a collimated non-diagnostic beam 123 that travel in different directions (or angles) along the optical path toward mask 155.

參考圖15,在其他實施方案中,遮罩155經設計為遮罩1555,其界定與準直非診斷光束123之途徑對準之孔口1560,而遮罩1555用以停止或防止準直診斷光束121傳遞到達感測器130。若有必要分析與非診斷光122相關之態樣,則此類設計可為有用的。 Referring to FIG. 15 , in other embodiments, the mask 155 is designed as a mask 1555 that defines an aperture 1560 aligned with the path of the collimated non-diagnostic light beam 123, and the mask 1555 is used to stop or prevent the collimated diagnostic light beam 121 from passing to the sensor 130. Such a design may be useful if it is necessary to analyze patterns associated with the non-diagnostic light 122.

在以下編號條項中闡述本發明之其他態樣。 Other aspects of the invention are described in the following numbered clauses.

1.一種度量衡裝置,其包含:診斷裝置,其經組態以在當前目標進入目標空間之前在診斷區處使診斷探針與當前目標相互作用;偵測裝置,其包含:光感測器,其具有與診斷區重疊之視場且經組態以感測由在診斷區處診斷探針與當前目標之間的相互作用產生之光;以及機械濾光器,其在診斷區與光感測器之間,該機械濾光器包括光束縮減器及光學遮罩,該光學遮罩界定定位於光束縮減器與光感測器之間的孔口;以及控制系統,其與偵測裝置通信且經組態以基於來自光感測器之輸出而估計當前目標之屬性。 1. A metrology device, comprising: a diagnostic device configured to cause a diagnostic probe to interact with a current target at a diagnostic region before the current target enters a target space; a detection device, comprising: a light sensor having a field of view overlapping the diagnostic region and configured to sense light produced by the interaction between the diagnostic probe and the current target at the diagnostic region; light generated by the detection device; and a mechanical filter between the diagnostic region and the light sensor, the mechanical filter comprising a beam reducer and an optical mask defining an aperture positioned between the beam reducer and the light sensor; and a control system in communication with the detection device and configured to estimate a property of a current target based on the output from the light sensor.

2.如條項1之度量衡裝置,其中機械濾光器經組態以在角度上分離自診斷區發射之診斷光與自目標空間發射之非診斷光,其中診斷光由在診斷區處當前目標與診斷探針之間的相互作用產生。 2. A metrological device as in clause 1, wherein the mechanical filter is configured to angularly separate diagnostic light emitted from a diagnostic region from non-diagnostic light emitted from a target space, wherein the diagnostic light is generated by the interaction between a target present at the diagnostic region and a diagnostic probe.

3.如條項2之度量衡裝置,其中非診斷光包括自藉由目標空間中之先前目標產生之電漿發射的光。 3. A metrological device as claimed in clause 2, wherein the non-diagnostic light comprises light emitted from plasma generated by a previous target in the target space.

4.如條項2之度量衡裝置,其中孔口之橫向範圍約與光學遮罩之平面中之診斷光的橫向範圍相同或大於光學遮罩之平面中之診斷光的橫向範圍,且光學遮罩之橫向範圍大於光學遮罩之平面中之非診斷光的橫向範圍或約與光學遮罩之平面中之非診斷光的橫向範圍相同。 4. A metrological device as in clause 2, wherein the lateral extent of the aperture is approximately the same as or greater than the lateral extent of the diagnostic light in the plane of the optical mask, and the lateral extent of the optical mask is greater than or approximately the same as the lateral extent of the non-diagnostic light in the plane of the optical mask.

5.如條項2之度量衡裝置,其中光學遮罩經定位以使得自目標空間發射之非診斷光實質上由光學遮罩阻擋,而診斷光實質上穿過孔口。 5. A metrological device as in clause 2, wherein the optical mask is positioned so that non-diagnostic light emitted from the target space is substantially blocked by the optical mask, while diagnostic light substantially passes through the aperture.

6.如條項1之度量衡裝置,其中機械濾光器包含診斷區與光束縮減器 之間的光學準直器。 6. A metrological apparatus as claimed in clause 1, wherein the mechanical filter comprises an optical collimator between the diagnostic region and the beam reducer.

7.如條項6之度量衡裝置,其中光束縮減器為無焦光束縮減器且經組態為與光學準直器結合以將有限物件投影至無限。 7. A metrology apparatus as claimed in claim 6, wherein the beam reducer is an afocal beam reducer and is configured to be combined with an optical collimator to project a finite object to infinity.

8.如條項6之度量衡裝置,其中光學準直器及最接近光學準直器之具有正焦距的光束縮減器之組件經整合至單個折射元件中。 8. A metrological device as claimed in claim 6, wherein the optical collimator and the beam reducer with a positive focal length closest to the optical collimator are integrated into a single refractive element.

9.如條項6之度量衡裝置,其中光束縮減器經組態以維持光之準直狀態。 9. A metrological apparatus as claimed in claim 6, wherein the beam reducer is configured to maintain the collimation of the light.

10.如條項1之度量衡裝置,其中光感測器包含以下一或多者:光電二極體、光電晶體、光相依電阻器、光電倍增管、多單元光接收器、四單元光接收器及相機。 10. A metrology device as in clause 1, wherein the photodetector comprises one or more of the following: a photodiode, a phototransistor, a photodependent resistor, a photomultiplier tube, a multi-unit photoreceiver, a quad-unit photoreceiver, and a camera.

11.如條項1之度量衡裝置,其中診斷探針包含至少一個診斷光束,且光感測器經組態以感測由當前目標與至少一個診斷光束之間的相互作用產生之診斷光。 11. A metrology device as claimed in claim 1, wherein the diagnostic probe comprises at least one diagnostic light beam, and the light sensor is configured to sense the diagnostic light generated by the interaction between the current target and the at least one diagnostic light beam.

12.如條項11之度量衡裝置,其中診斷光包含自當前目標反射、自當前目標散射或由當前目標阻擋之診斷光束。 12. A metrological device as claimed in clause 11, wherein the diagnostic light comprises a diagnostic beam reflected from, scattered from or blocked by a current target.

13.如條項1之度量衡裝置,其中偵測裝置進一步包含光譜濾光器及偏振濾光器中之一或多者。 13. A metrology device as claimed in clause 1, wherein the detection device further comprises one or more of a spectral filter and a polarization filter.

14.如條項1之度量衡裝置,其中診斷探針包含第一診斷光束及第二診斷光束,該第一診斷光束及第二診斷光束各自經組態以在其進入目標空間之前與當前目標相互作用,每一相互作用發生於相異區及相異時間處。 14. A metrology device as in clause 1, wherein the diagnostic probe comprises a first diagnostic beam and a second diagnostic beam, each of the first diagnostic beam and the second diagnostic beam being configured to interact with a current target before it enters the target space, each interaction occurring at a different region and at a different time.

15.如條項1之度量衡裝置,其中光束縮減器包含折射望遠鏡、反射望遠鏡或反射折射望遠鏡。 15. A metrological apparatus as claimed in claim 1, wherein the beam reducer comprises a refracting telescope, a reflecting telescope or a reflecting-refracting telescope.

16.如條項15之度量衡裝置,其中折射望遠鏡包含:正焦距透鏡配置及負焦距透鏡配置,其由其焦距之總和分離;或一對正焦距透鏡配置,其由其焦距之總和分離。 16. A metrological apparatus as claimed in claim 15, wherein the refractive telescope comprises: a positive focal length lens arrangement and a negative focal length lens arrangement, which are separated by the sum of their focal lengths; or a pair of positive focal length lens arrangements, which are separated by the sum of their focal lengths.

17.如條項1之度量衡裝置,其中光束縮減器經組態以將照射光之橫向大小縮減至少五倍、至少十倍、至少二十倍或約十倍。 17. A metrology device as claimed in claim 1, wherein the beam reducer is configured to reduce the lateral size of the incident light by at least five times, at least ten times, at least twenty times or about ten times.

18.如條項1之度量衡裝置,其中孔口包括圓形開口、橢圓開口、多邊形開口或細長狹縫開口。 18. A measuring device as claimed in clause 1, wherein the opening comprises a circular opening, an elliptical opening, a polygonal opening or a slit opening.

19.如條項1之度量衡裝置,其中偵測裝置經定位於極紫外(EUV)光源之腔室外部,診斷區在腔室內部,且偵測裝置經由腔室之壁中之光學窗自腔室接收光。 19. A metrology device as claimed in claim 1, wherein the detection device is positioned outside a chamber of an extreme ultraviolet (EUV) light source, the diagnostic region is inside the chamber, and the detection device receives light from the chamber through an optical window in a wall of the chamber.

20.如條項19之度量衡裝置,其中診斷區與光學窗之間的距離可為診斷區與目標空間之間的距離之大小之約200至500倍。 20. A metrological device as claimed in claim 19, wherein the distance between the diagnostic region and the optical window may be about 200 to 500 times the size of the distance between the diagnostic region and the target space.

21.如條項1之度量衡裝置,其中偵測裝置包含孔口之輸出端處之聚焦透鏡,聚焦透鏡經組態以將所感測光聚焦至光感測器上。 21. A metrological device as claimed in clause 1, wherein the detection device comprises a focusing lens at the output end of the aperture, the focusing lens being configured to focus the sensed light onto the light sensor.

22.如條項1之度量衡裝置,其中孔口具有至少2毫米(mm)之範圍。 22. A metrological device as claimed in clause 1, wherein the orifice has a range of at least 2 millimetres (mm).

23.如條項1之度量衡裝置,其中孔口經定位以在診斷光在其處為準直或為非收斂及非發散之方位處接收診斷光。 23. A metrological apparatus as claimed in clause 1, wherein the aperture is positioned to receive diagnostic light at an orientation where the diagnostic light is collimated or non-convergent and non-divergent.

24.一種度量衡方法,其包含:在當前目標進入目標空間之前在診斷區處使診斷探針與當前目標相互作用;收集由在診斷區處診斷探針與當前目標之間的相互作用產生之診斷光,收集亦包括收集由目標空間產生之非診斷光; 使診斷光及非診斷光準直;使診斷光與非診斷光彼此在角度上分離包括縮減診斷光及非診斷光之橫向範圍;在診斷光及非診斷光已在角度上分離之後在自由非診斷光穿過之非感測區橫向移位之感測區處感測診斷光;以及基於所感測診斷光而估計當前目標之屬性。 24. A metrology method, comprising: causing a diagnostic probe to interact with a current target at a diagnostic region before the current target enters a target space; collecting diagnostic light generated by the interaction between the diagnostic probe and the current target at the diagnostic region, and collecting also includes collecting non-diagnostic light generated by the target space; Causing diagnostic light and non-diagnostic light to interact with each other at a diagnostic region; Collimating light; angularly separating diagnostic light and non-diagnostic light from each other including reducing the lateral range of the diagnostic light and the non-diagnostic light; sensing the diagnostic light at a sensing region laterally displaced from a non-sensing region through which free non-diagnostic light passes after the diagnostic light and the non-diagnostic light have been angularly separated; and estimating properties of a current target based on the sensed diagnostic light.

25.如條項24之度量衡方法,其中:在診斷區處使診斷探針與當前目標相互作用包含在診斷區處使一或多個診斷光束與當前目標相互作用;以及收集診斷光包含在診斷區處收集已自當前目標反射、自當前目標散射或由當前目標阻擋之一或多個診斷光束。 25. The metrology method of clause 24, wherein: causing the diagnostic probe to interact with the current target at the diagnostic region includes causing one or more diagnostic beams to interact with the current target at the diagnostic region; and collecting diagnostic light includes collecting one or more diagnostic beams at the diagnostic region that have been reflected from the current target, scattered from the current target, or blocked by the current target.

26.如條項24之度量衡方法,其進一步包含基於其光譜屬性及其偏振狀態中之一或多者而過濾診斷光。 26. The metrology method of clause 24, further comprising filtering the diagnostic light based on one or more of its spectral properties and its polarization state.

27.如條項24之度量衡方法,其中診斷區在極紫外(EUV)光源之氣密密封腔室內部,且亦包括收集非診斷光之收集該診斷光包含接收包括經由腔室之壁中之光學窗傳輸之非診斷光的診斷光。 27. A metrology method as in clause 24, wherein the diagnostic region is inside a hermetically sealed chamber of an extreme ultraviolet (EUV) light source and also includes collecting non-diagnostic light, wherein collecting the diagnostic light includes receiving diagnostic light including non-diagnostic light transmitted through an optical window in a wall of the chamber.

28.如條項24之度量衡方法,其中縮減診斷光及非診斷光之橫向範圍包含將診斷光及非診斷光之橫向範圍縮減至少五倍、至少十倍、至少二十倍或約十倍。 28. The method of measurement as in clause 24, wherein reducing the lateral range of diagnostic and non-diagnostic optometry comprises reducing the lateral range of diagnostic and non-diagnostic optometry by at least five times, at least ten times, at least twenty times, or about ten times.

29.如條項24之度量衡方法,其進一步包含阻擋非感測區處之非診斷光或重新引導該非診斷光。 29. The metrology method of clause 24, further comprising blocking non-diagnostic light at the non-sensing area or redirecting the non-diagnostic light.

30.如條項24之度量衡方法,其中縮減診斷光及非診斷光之橫向範圍包含以下中之一或多者:折射該光及反射該光。 30. The method of measurement as in clause 24, wherein the lateral extent of reducing diagnostic light and non-diagnostic light comprises one or more of the following: refracting the light and reflecting the light.

31.如條項24之度量衡方法,其進一步包含聚焦感測區處之診斷光。 31. The metrological method of clause 24, further comprising focusing the diagnostic light at the sensing area.

32.如條項24之度量衡方法,其中縮減診斷光及非診斷光之橫向範圍包含維持診斷光及非診斷光之準直狀態。 32. A method of measurement as in clause 24, wherein reducing the lateral range of diagnostic light and non-diagnostic light includes maintaining the collimation of the diagnostic light and non-diagnostic light.

33.如條項24之度量衡方法,其進一步包含在診斷光及非診斷光在角度上彼此分離之後及在診斷光經感測之前,使診斷光穿過光學遮罩之孔口,孔口具有大於診斷光之範圍的範圍。 33. A metrological method as in clause 24, further comprising passing the diagnostic light through an aperture of an optical mask having a range greater than the range of the diagnostic light after the diagnostic light and the non-diagnostic light are angularly separated from each other and before the diagnostic light is sensed.

其他實施方案在以下申請專利範圍之範疇內。 Other implementations are within the scope of the following patent applications.

100:度量衡裝置 100:Weight and measurement equipment

105:目標 105: Target

105c:當前目標 105c: Current goal

105p:先前目標 105p: Previous target

106:連續流 106: Continuous Flow

110:目標空間 110: Target space

115:環境 115: Environment

120:診斷光 120: Diagnostic light

121:準直光束 121: Collimated beam

122:非診斷光 122: Non-diagnostic radiography

123:準直光束 123: Collimated beam

125:診斷探針 125: Diagnostic probe

130:光感測器 130: Light sensor

135:偵測裝置 135: Detection device

140:機械濾光器 140: Mechanical filter

142:光學準直器 142:Optical collimator

145:診斷區 145: Diagnosis area

150:光束縮減器 150: Beam reducer

152:光學路徑 152:Optical path

155:光學遮罩 155:Optical mask

160:孔口 160: Orifice

165:診斷裝置 165: Diagnostic device

170:控制系統 170: Control system

175:目標供應裝置 175: Target supply device

TR:軌跡 TR: Track

Claims (31)

一種度量衡裝置,其包含:一診斷裝置,其經組態以在一當前目標進入一目標空間之前在一診斷區處使一診斷探針(diagnostic probe)與該當前目標相互作用;一偵測裝置,其包含:一光感測器,其具有與該診斷區重疊之一視場(field of view)且經組態以感測由在該診斷區處該診斷探針與該當前目標之間的該相互作用產生之光;以及一機械濾光器(mechanical filter),其在該診斷區與該光感測器之間,該機械濾光器包含一光束縮減器及一光學遮罩,該光學遮罩界定定位於該光束縮減器與該光感測器之間的一孔口;以及一控制系統,其與該偵測裝置通信且經組態以基於來自該光感測器之輸出而估計該當前目標之一屬性,其中該光束縮減器經組態以維持光之一準直狀態(collimated status)。 A metrology device comprising: a diagnostic device configured to cause a diagnostic probe to interact with a current target at a diagnostic region before the current target enters a target space; a detection device comprising: a light sensor having a field of view overlapping the diagnostic region and configured to sense light generated by the interaction between the diagnostic probe and the current target at the diagnostic region; and a mechanical filter. A mechanical filter is provided between the diagnostic region and the light sensor, the mechanical filter comprising a beam reducer and an optical mask defining an aperture positioned between the beam reducer and the light sensor; and a control system in communication with the detection device and configured to estimate a property of the current target based on output from the light sensor, wherein the beam reducer is configured to maintain a collimated state of the light. 如請求項1之度量衡裝置,其中該機械濾光器經組態以在角度上(angularly)分離自該診斷區發射之診斷光與自該目標空間發射之非診斷光,其中該診斷光由在該診斷區處該當前目標與該診斷探針之間的一相互作用產生。 The metrology device of claim 1, wherein the mechanical filter is configured to angularly separate diagnostic light emitted from the diagnostic region and non-diagnostic light emitted from the target space, wherein the diagnostic light is generated by an interaction between the current target and the diagnostic probe at the diagnostic region. 如請求項2之度量衡裝置,其中非診斷光包括自藉由該目標空間中之 一先前目標產生之一電漿發射的光。 A metrology device as claimed in claim 2, wherein the non-diagnostic light includes light emitted from a plasma generated by a previous target in the target space. 如請求項2之度量衡裝置,其中該孔口之橫向範圍約與該光學遮罩之平面中之該診斷光的橫向範圍相同或大於該光學遮罩之平面中之該診斷光的橫向範圍,且該光學遮罩之橫向範圍大於該光學遮罩之該平面中之該非診斷光的橫向範圍或約與該光學遮罩之該平面中之該非診斷光的橫向範圍相同。 A metrological device as claimed in claim 2, wherein the lateral range of the aperture is approximately the same as or greater than the lateral range of the diagnostic light in the plane of the optical mask, and the lateral range of the optical mask is greater than or approximately the same as the lateral range of the non-diagnostic light in the plane of the optical mask. 如請求項2之度量衡裝置,其中該光學遮罩經定位以使得自該目標空間發射之該非診斷光實質上由該光學遮罩阻擋,而該診斷光實質上穿過該孔口。 A metrology device as claimed in claim 2, wherein the optical mask is positioned so that the non-diagnostic light emitted from the target space is substantially blocked by the optical mask, and the diagnostic light substantially passes through the aperture. 如請求項1之度量衡裝置,其中該機械濾光器包含該診斷區與該光束縮減器之間的一光學準直器。 A metrology device as claimed in claim 1, wherein the mechanical filter comprises an optical collimator between the diagnostic region and the beam reducer. 如請求項6之度量衡裝置,其中該光束縮減器為一無焦光束縮減器且經組態為與該光學準直器結合以將一有限物件投影至無限。 A metrology apparatus as claimed in claim 6, wherein the beam reducer is an afocal beam reducer and is configured to be combined with the optical collimator to project a finite object to infinity. 如請求項6之度量衡裝置,其中該光學準直器及最接近該光學準直器之具有正焦距的該光束縮減器之組件經整合至一單個折射元件中。 A metrology device as claimed in claim 6, wherein the optical collimator and the beam reducer with a positive focal length closest to the optical collimator are integrated into a single refractive element. 如請求項1之度量衡裝置,其中該光感測器包含以下一或多者:光電二極體、光電晶體、光相依電阻器、光電倍增管、多單元光接收器、四單 元光接收器及相機。 A metrology device as claimed in claim 1, wherein the photodetector comprises one or more of the following: a photodiode, a phototransistor, a photodependent resistor, a photomultiplier tube, a multi-unit photoreceiver, a four-unit photoreceiver and a camera. 如請求項1之度量衡裝置,其中該診斷探針包含至少一個診斷光束,且該光感測器經組態以感測由該當前目標與該至少一個診斷光束之間的該相互作用產生之診斷光。 A metrology device as claimed in claim 1, wherein the diagnostic probe comprises at least one diagnostic light beam, and the light sensor is configured to sense the diagnostic light generated by the interaction between the current target and the at least one diagnostic light beam. 如請求項10之度量衡裝置,其中該診斷光包含自該當前目標反射、自該當前目標散射或由該當前目標阻擋之該診斷光束。 A metrology device as claimed in claim 10, wherein the diagnostic light includes the diagnostic light beam reflected from the current target, scattered from the current target or blocked by the current target. 如請求項1之度量衡裝置,其中該偵測裝置進一步包含一光譜濾光器及一偏振濾光器中之一或多者。 A metrology device as claimed in claim 1, wherein the detection device further comprises one or more of a spectral filter and a polarization filter. 如請求項1之度量衡裝置,其中該診斷探針包含第一診斷光束及第二診斷光束,該第一診斷光束及第二診斷光束各自經組態以在其進入該目標空間之前與該當前目標相互作用,每一相互作用發生於一相異區及一相異時間處。 A metrology device as claimed in claim 1, wherein the diagnostic probe comprises a first diagnostic beam and a second diagnostic beam, each of the first diagnostic beam and the second diagnostic beam being configured to interact with the current target before entering the target space, each interaction occurring at a phase difference region and a phase difference time. 如請求項1之度量衡裝置,其中該光束縮減器包含一折射望遠鏡、一反射望遠鏡或一反射折射望遠鏡。 A metrological device as claimed in claim 1, wherein the beam reducer comprises a refracting telescope, a reflecting telescope or a reflecting refracting telescope. 如請求項14之度量衡裝置,其中該折射望遠鏡包含:一正焦距透鏡配置及一負焦距透鏡配置,其由其焦距之總和分離;或 一對正焦距透鏡配置,其由其焦距之總和分離。 A metrological device as claimed in claim 14, wherein the refractive telescope comprises: a positive focal length lens configuration and a negative focal length lens configuration, which are separated by the sum of their focal lengths; or a pair of positive focal length lens configurations, which are separated by the sum of their focal lengths. 如請求項1之度量衡裝置,其中該光束縮減器經組態以將照射光(impinging light)之一橫向大小縮減至少五倍。 A metrology device as claimed in claim 1, wherein the beam reducer is configured to reduce a lateral size of an impinging light by at least five times. 如請求項1之度量衡裝置,其中該孔口包括一圓形開口、一橢圓開口、一多邊形開口或一細長狹縫開口。 A measuring device as claimed in claim 1, wherein the opening comprises a circular opening, an elliptical opening, a polygonal opening or a slit opening. 如請求項1之度量衡裝置,其中該偵測裝置經定位於一極紫外(EUV)光源之一腔室外部,該診斷區在該腔室內部,且該偵測裝置經由該腔室之一壁中之一光學窗自該腔室接收光。 A metrology device as claimed in claim 1, wherein the detection device is positioned outside a chamber of an extreme ultraviolet (EUV) light source, the diagnostic region is inside the chamber, and the detection device receives light from the chamber through an optical window in a wall of the chamber. 如請求項18之度量衡裝置,其中該診斷區與該光學窗之間的一距離為該診斷區與該目標空間之間的一距離之大小的約200至500倍。 A metrological device as claimed in claim 18, wherein a distance between the diagnostic region and the optical window is about 200 to 500 times the size of a distance between the diagnostic region and the target space. 如請求項1之度量衡裝置,其中該偵測裝置包含該孔口之一輸出端處之一聚焦透鏡,該聚焦透鏡經組態以將所感測光聚焦至該光感測器上。 A metrological device as claimed in claim 1, wherein the detection device comprises a focusing lens at an output end of the orifice, the focusing lens being configured to focus the sensed light onto the light sensor. 如請求項1之度量衡裝置,其中該孔口具有至少2毫米(mm)之範圍。 A metrological device as claimed in claim 1, wherein the orifice has a range of at least 2 millimeters (mm). 如請求項1之度量衡裝置,其中該孔口經定位以在診斷光在其處為準直或為非收斂及非發散的一方位處接收該診斷光。 A metrological apparatus as claimed in claim 1, wherein the aperture is positioned to receive the diagnostic light at an orientation where the diagnostic light is collimated or non-convergent and non-divergent. 一種度量衡方法,其包含:在一當前目標進入一目標空間之前在一診斷區處使一診斷探針與該當前目標相互作用;收集由在該診斷區處該診斷探針與該當前目標之間的該相互作用產生之診斷光,該收集亦包括收集由該目標空間產生之非診斷光;使該診斷光及該非診斷光準直;使該診斷光與該非診斷光彼此在角度上分離包括縮減該診斷光及該非診斷光之橫向範圍;在該診斷光及該非診斷光已在角度上分離之後在自由該非診斷光穿過之一非感測區橫向移位之一感測區處感測該診斷光;以及基於所感測之該診斷光而估計該當前目標之一屬性,其中縮減該診斷光及該非診斷光之該橫向範圍包含維持該診斷光及該非診斷光之一準直狀態。 A metrology method, comprising: causing a diagnostic probe to interact with a current target at a diagnostic region before the current target enters a target space; collecting diagnostic light generated by the interaction between the diagnostic probe and the current target at the diagnostic region, the collecting also including collecting non-diagnostic light generated by the target space; collimating the diagnostic light and the non-diagnostic light; angularly separating the diagnostic light and the non-diagnostic light from each other The method comprises reducing the lateral range of the diagnostic light and the non-diagnostic light; sensing the diagnostic light at a sensing area laterally displaced from a non-sensing area through which the non-diagnostic light passes after the diagnostic light and the non-diagnostic light have been separated in angle; and estimating a property of the current target based on the sensed diagnostic light, wherein reducing the lateral range of the diagnostic light and the non-diagnostic light includes maintaining a collimated state of the diagnostic light and the non-diagnostic light. 如請求項23之度量衡方法,其中:在該診斷區處使該診斷探針與該當前目標相互作用包含在該診斷區處使一或多個診斷光束與該當前目標相互作用;以及收集診斷光包含在該診斷區處收集已自該當前目標反射、自該當前目標散射或由該當前目標阻擋之一或多個診斷光束。 The metrology method of claim 23, wherein: causing the diagnostic probe to interact with the current target at the diagnostic region includes causing one or more diagnostic beams to interact with the current target at the diagnostic region; and collecting diagnostic light includes collecting one or more diagnostic beams at the diagnostic region that have been reflected from the current target, scattered from the current target, or blocked by the current target. 如請求項23之度量衡方法,其進一步包含基於其光譜屬性及其偏振狀態中之一或多者而過濾該診斷光。 The metrology method of claim 23, further comprising filtering the diagnostic light based on one or more of its spectral properties and its polarization state. 如請求項23之度量衡方法,其中該診斷區在一極紫外(EUV)光源之一氣密密封腔室內部,且亦包括收集非診斷光之收集該診斷光包含接收包括經由該腔室之一壁中之一光學窗透射之該非診斷光的該診斷光。 The metrology method of claim 23, wherein the diagnostic area is inside a hermetically sealed chamber of an extreme ultraviolet (EUV) light source, and also includes collecting non-diagnostic light, wherein collecting the diagnostic light includes receiving the diagnostic light including the non-diagnostic light transmitted through an optical window in a wall of the chamber. 如請求項23之度量衡方法,其中縮減該診斷光及該非診斷光之該橫向範圍包含將該診斷光及該非診斷光之該橫向範圍縮減至少五倍。 The method of measurement as claimed in claim 23, wherein reducing the lateral range of the diagnostic light and the non-diagnostic light comprises reducing the lateral range of the diagnostic light and the non-diagnostic light by at least five times. 如請求項23之度量衡方法,其進一步包含阻擋該非感測區處之該非診斷光或重新引導該非診斷光。 The metrology method of claim 23 further comprises blocking the non-diagnostic light at the non-sensing area or redirecting the non-diagnostic light. 如請求項23之度量衡方法,其中縮減該診斷光及該非診斷光之該橫向範圍包含以下中之一或多者:折射該光及反射該光。 The metrology method of claim 23, wherein the lateral range of reducing the diagnostic light and the non-diagnostic light includes one or more of the following: refracting the light and reflecting the light. 如請求項23之度量衡方法,其進一步包含聚焦該感測區處之該診斷光。 The metrology method of claim 23 further comprises focusing the diagnostic light at the sensing area. 如請求項23之度量衡方法,其進一步包含在該診斷光及該非診斷光在角度上彼此分離之後及在該診斷光經感測之前,使該診斷光穿過一光學遮罩之一孔口,該孔口具有大於該診斷光之範圍的範圍。 The metrology method of claim 23 further comprises passing the diagnostic light through an aperture of an optical mask having a range greater than the range of the diagnostic light after the diagnostic light and the non-diagnostic light are angularly separated from each other and before the diagnostic light is sensed.
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201311057A (en) * 2011-08-19 2013-03-01 Cymer Inc Energy sensor for beam alignment
TW201515524A (en) * 2013-09-26 2015-04-16 Asml Netherlands Bv System and method for controlling target droplets in an extreme ultraviolet light source
US20180077786A1 (en) * 2016-09-14 2018-03-15 Asml Netherlands B.V. Target trajectory metrology in an extreme ultraviolet light source

Family Cites Families (4)

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US9778022B1 (en) * 2016-09-14 2017-10-03 Asml Netherlands B.V. Determining moving properties of a target in an extreme ultraviolet light source
US10048199B1 (en) * 2017-03-20 2018-08-14 Asml Netherlands B.V. Metrology system for an extreme ultraviolet light source

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201311057A (en) * 2011-08-19 2013-03-01 Cymer Inc Energy sensor for beam alignment
TW201515524A (en) * 2013-09-26 2015-04-16 Asml Netherlands Bv System and method for controlling target droplets in an extreme ultraviolet light source
US20180077786A1 (en) * 2016-09-14 2018-03-15 Asml Netherlands B.V. Target trajectory metrology in an extreme ultraviolet light source

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