TWI849689B - Pressing mechanism, testing device, and processing machine - Google Patents
Pressing mechanism, testing device, and processing machine Download PDFInfo
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- 238000012360 testing method Methods 0.000 title claims description 59
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- 238000003825 pressing Methods 0.000 title abstract description 8
- 238000009423 ventilation Methods 0.000 claims abstract description 31
- 238000002788 crimping Methods 0.000 claims description 124
- 238000012546 transfer Methods 0.000 description 25
- 239000003507 refrigerant Substances 0.000 description 21
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Abstract
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本發明提供一種可於同一氣體流道變換執行取放或溫控電子元件,而有效縮小體積及節省能源成本之壓接機構。The present invention provides a crimping mechanism that can perform pick-up and placement or temperature control of electronic components in the same gas flow channel, thereby effectively reducing the size and saving energy costs.
電子元件日後會應用於高溫環境或低溫環境,於出廠前,需以作業機之測試裝置對電子元件執行熱測作業或冷測作業,以淘汰不良品。以冷測作業為例,測試裝置包含測試器及壓接機構,測試器以供承置及測試電子元件 ,壓接機構位於測試器之上方,並設有壓接具以壓接電子元件,壓接具之抽氣孔供吸附移載電子元件,另於壓接具之上方設有獨立之冷媒座,冷媒座之兩端分別以冷媒輸送管連接冷媒供應設備,使冷媒供應設備將冷媒輸入至冷媒座,以溫控壓接具,壓接具將低溫傳導至電子元件,使電子元件於模擬日後應用低溫環境執行冷測作業,冷媒座再將冷媒輸出至冷媒供應設備。 Electronic components will be used in high-temperature or low-temperature environments in the future. Before they are shipped out of the factory, they need to be subjected to heat or cold testing using a test device on a processing machine to eliminate defective products. Taking the cold test operation as an example, the test device includes a tester and a crimping mechanism. The tester is used to hold and test electronic components. The crimping mechanism is located above the tester and is provided with a crimping tool to crimp the electronic components. The suction hole of the crimping tool is used to absorb and transfer the electronic components. In addition, an independent refrigerant seat is provided above the crimping tool. The two ends of the refrigerant seat are connected to the refrigerant supply equipment with refrigerant delivery pipes, so that the refrigerant supply equipment inputs the refrigerant to the refrigerant seat, and the crimping tool is controlled by temperature. The crimping tool transfers the low temperature to the electronic components, so that the electronic components can perform cold test operations in a low temperature environment in the future. The refrigerant seat then outputs the refrigerant to the refrigerant supply equipment.
此一方式雖可溫控壓接具,但以冷媒作為溫控之能源,不僅增加溫控能源成本,冷媒供應設備之體積大必須獨立配置,更需配置複數個轉接管及較長尺寸之冷媒輸送管等,方可將冷媒輸送至冷媒座,以致相當佔用場所空間,亦增加配置作業上之不便。Although this method can be used to control the temperature of the press fittings, using the refrigerant as the energy source for temperature control not only increases the energy cost of temperature control, but also requires the refrigerant supply equipment to be large and must be configured independently. It also requires multiple transfer tubes and longer refrigerant delivery pipes to transport the refrigerant to the refrigerant seat, which takes up a lot of space and increases the inconvenience of the configuration operation.
又,冷媒供應設備之冷媒輸送管具有一定之剛性以供輸送冷媒,因而不易作較小曲弧之彎折,導致壓接機構必須於壓接具之周側預留較大之配置空間,方可裝配冷媒輸送管,進而不利壓接機構之空間配置。In addition, the refrigerant delivery pipe of the refrigerant supply equipment has a certain rigidity for delivering the refrigerant, and therefore is not easy to bend into a smaller arc, which results in the crimping mechanism having to reserve a larger configuration space around the crimping tool in order to assemble the refrigerant delivery pipe, which is disadvantageous for the spatial configuration of the crimping mechanism.
由於作業機之測試裝置以冷媒作為溫控能源,當工作人員欲將作業機搬移至不同作業場所時,即需分別拆卸、分次搬運及重新組裝校機該作業機與冷媒供應設備,造成搬運作業上之繁瑣與不便。Since the test device of the operating machine uses refrigerant as the temperature control energy source, when the staff wants to move the operating machine to a different operating site, they need to dismantle, transport and reassemble the operating machine and the refrigerant supply equipment separately, which makes the transportation operation cumbersome and inconvenient.
本發明之目的一,提供一種壓接機構,包含架置器、壓接單元及換氣單元,壓接單元裝配於架置器,並於承載具設有至少一具有吸嘴之壓接具 ,以供取放及壓接電子元件,換氣單元於壓接具設有氣體流道,氣體流道之第一端相通吸嘴,第二端連通至少一輸送結構,輸送結構能夠使氣體流道抽氣,以供壓接具之吸嘴取放電子元件,或者變換使同一氣體流道輸送預設溫度之氣體,以供預溫壓接具及電子元件;藉以,換氣單元於同一氣體流道變換執行抽氣或供應預設溫度氣體,而可取放或溫控電子元件,不僅有效節省能源成本,並可簡化機構設計而便於組裝。 The first object of the present invention is to provide a crimping mechanism, comprising a mount, a crimping unit and a ventilation unit. The crimping unit is mounted on the mount, and at least one crimping tool with a suction nozzle is provided on the carrier. , for taking and placing and crimping electronic components, the ventilation unit is provided with a gas flow channel on the crimping tool, the first end of the gas flow channel is connected to the suction nozzle, and the second end is connected to at least one conveying structure, the conveying structure can make the gas flow channel evacuate air for the suction nozzle of the crimping tool to take and place electronic components, or change the same gas flow channel to convey gas of a preset temperature for pre-heating the crimping tool and electronic components; thereby, the ventilation unit can change the same gas flow channel to perform evacuation or supply gas of a preset temperature, and can take and place or temperature control electronic components, which not only effectively saves energy costs, but also simplifies the mechanism design and facilitates assembly.
本發明之目的二,提供一種壓接機構,其換氣單元於氣體流道設有第一、二支流道,至少一輸送結構包含第一、二輸送結構,以分別連接抽氣管及供氣管,於氣體流道的第一支流道相通第一輸送結構及抽氣管而可抽氣,使吸嘴拾取電子元件,或於同一氣體流道的第二支流道相通第二輸送結構及供氣管而可輸入預設溫度氣體,使壓接具及氣體溫控電子元件;藉以換氣單元於同一氣體流道變換執行抽氣或供應預設溫度氣體,而可取放或溫控電子元件,以有效提高壓接機構之使用效能。The second object of the present invention is to provide a crimping mechanism, wherein a ventilation unit is provided with a first and a second branch flow channel in a gas flow channel, and at least one delivery structure includes a first and a second delivery structure to respectively connect an exhaust pipe and an air supply pipe. The first delivery structure and the exhaust pipe are connected in the first branch flow channel of the gas flow channel to exhaust air, so that a suction nozzle can pick up electronic components, or the second delivery structure and the air supply pipe are connected in the second branch flow channel of the same gas flow channel to input a preset temperature gas, so that the crimping tool and the gas temperature control the electronic components; the ventilation unit can switch to perform exhaust or supply preset temperature gas in the same gas flow channel, so as to take in or place or temperature control the electronic components, thereby effectively improving the use efficiency of the crimping mechanism.
本發明之目的三,提供一種測試裝置,包含測試機構及本發明壓接機構,測試機構設有至少一測試器,以供測試電子元件;本發明壓接機構位於測試機構之上方,包含架置器、壓接單元及換氣單元,以供取放及溫控電子元件。The third object of the present invention is to provide a testing device, including a testing mechanism and the crimping mechanism of the present invention, wherein the testing mechanism is provided with at least one tester for testing electronic components; the crimping mechanism of the present invention is located above the testing mechanism, and includes a mount, a crimping unit and a ventilation unit for taking, placing and temperature controlling the electronic components.
本發明之目的四,提供一種作業機,包含機台、供料裝置、收料裝置、測試裝置、輸送裝置及中央控制裝置,供料裝置配置於機台,並設有至少一供料器,以供容置至少一待測電子元件;收料裝置配置於機台,並設有至少一收料器,以供容置至少一已測電子元件;測試裝置配置於機台,包含測試機構及本發明壓接機構,測試機構設有至少一測試器,以供測試電子元件,壓接機構位於測試機構之上方,包含架置器、壓接單元及換氣單元,以供取放及溫控電子元件;輸送裝置配置於機台,並設有至少一輸送器,以供輸送電子元件;中央控制裝置以控制及整合各裝置作動而執行自動化作業。The fourth object of the present invention is to provide an operating machine, including a machine, a feeding device, a receiving device, a testing device, a conveying device and a central control device. The feeding device is arranged on the machine and is provided with at least one feeder for accommodating at least one electronic component to be tested; the receiving device is arranged on the machine and is provided with at least one receiver for accommodating at least one tested electronic component; the testing device is arranged on the machine and includes a testing mechanism and the crimping mechanism of the present invention. The testing mechanism is provided with at least one tester for testing electronic components. The crimping mechanism is located above the testing mechanism and includes a mounter, a crimping unit and a ventilation unit for taking, placing and temperature-controlling electronic components; the conveying device is arranged on the machine and is provided with at least one conveyor for conveying electronic components; the central control device controls and integrates the actions of each device to perform automated operations.
為使 貴審查委員對本發明作更進一步之瞭解,茲舉一較佳實施例並配合圖式,詳述如後:In order to enable you to have a further understanding of the present invention, a preferred embodiment is given below with accompanying drawings:
請參閱圖1,本發明壓接機構之第一實施例包含架置器、壓接單元及換氣單元。Please refer to FIG1 , the first embodiment of the crimping mechanism of the present invention includes a mount, a crimping unit and a ventilation unit.
架置器以供裝配壓接單元;依作業需求,架置器可為固定式或活動式配置,例如架置器可為固定式之機架,例如架置器可為活動式之移載臂。於本實施例,架置器為可作至少一方向位移之移載臂11,移載臂11可由移載驅動源(圖未示出)驅動作Y-Z方向位移,以帶動壓接單元及換氣單元同步位移。The mounting device is used to assemble the crimping unit; according to the operation requirements, the mounting device can be a fixed or movable configuration, for example, the mounting device can be a fixed rack, for example, the mounting device can be a movable transfer arm. In this embodiment, the mounting device is a
壓接單元裝配於架置器,並設有至少一承載具,以供裝配至少一具吸嘴之壓接具,而取放及壓接電子元件。更進一步,壓接具可固設於承載具,或者可於承載具作至少一方向位移。更進一步,壓接具之一端可成型吸嘴或者裝配一獨立之吸嘴。依作業需求,承載具可直接裝配於架置器,或者於承載具與架置器之間配置浮動器。The crimping unit is mounted on the mounter and is provided with at least one carrier for mounting a crimping tool with at least one suction nozzle to pick up and crimp electronic components. Furthermore, the crimping tool can be fixed on the carrier or can be displaced in at least one direction on the carrier. Furthermore, one end of the crimping tool can be formed with a suction nozzle or equipped with an independent suction nozzle. According to the operation requirements, the carrier can be directly mounted on the mounter, or a floater can be configured between the carrier and the mounter.
於本實施例,壓接單元包含承載具12及壓接具13,承載具12之頂面以連接件裝配於移載臂11,而可由移載臂11帶動作Y-Z方向位移,承載具12之內部設有容置部,容置部為一呈Z方向配置的通孔121,以供置入固設壓接具13
,壓接具13於第一端設有管部131,管部131之底面朝頂面凹設有容置空間132,以供裝配吸嘴133,吸嘴133以供取放及壓接電子元件。更進一步,壓接具13之管部131能夠溫控及壓接電子元件。
In this embodiment, the crimping unit includes a
換氣單元於壓接具13設有至少一相通吸嘴133之氣體流道,氣體流道連通至少一輸送結構,至少一輸送結構連通供氣管及抽氣管,以供氣體流道輸送預設溫度氣體,能夠溫控壓接具13及電子元件(圖未示出),或者變換同一氣體流道抽氣,能夠使壓接具13之吸嘴133取放電子元件。The ventilation unit is provided with at least one gas flow channel connected to the
依作業需求,換氣單元之氣體流道可直接連通至少一輸送結構,或者氣體流道設有至少一支流道,以供連通至少一輸送結構。According to the operation requirements, the gas flow channel of the ventilation unit can be directly connected to at least one delivery structure, or the gas flow channel is provided with at least one branch flow channel for connecting to at least one delivery structure.
依作業需求,至少一輸送結構於承載具12設有至少一輸氣道,至少一輸氣道以供連通支流道及至少一輸送管。According to the operation requirements, at least one conveying structure is provided with at least one air delivery channel on the
依作業需求,至少一輸送結構之輸送管連接至少一控制器,至少一控制器連接抽氣管及供氣管,以供控制變換該輸送管抽氣或輸送預設溫度氣體。According to the operation requirements, the delivery pipe of at least one delivery structure is connected to at least one controller, and at least one controller is connected to the exhaust pipe and the air supply pipe to control the change of the delivery pipe to exhaust or deliver the preset temperature gas.
於本實施例,換氣單元於壓接具13之內部設有一呈Z方向配置之氣體流道141,氣體流道141之第一端相通吸嘴133,第二端連通一呈X方向配置之支流道142,支流道142連通至少一輸送結構;輸送結構包含輸氣道143、輸送管144及控制器145,輸氣道143呈X方向配置設於承載具12之內部,並以一端連通該氣體流道141之支流道142,另一端連通輸送管144,由於輸送管144用以輸送氣體,使得輸送管144可作較小曲弧之彎折配置,毋需於承載具12之周側預留較大配置空間,進而利於壓接機構之空間配置。輸送管144連通一控制器145,控制器145可為控制閥,並連通抽氣管146及供氣管147,抽氣管146連接一抽氣設備(圖未示出),以供抽氣,供氣管147連接一供氣設備(圖未示出),以供應預設溫度之氣體(如低溫氣體或高溫氣體),而可利用控制器145控制變換輸送管144連通抽氣管146或供氣管147,以供抽氣或輸送預設溫度氣體。In the present embodiment, the ventilation unit is provided with a
因此,壓接機構之換氣單元以具有預設溫度氣體作為溫控能源,不僅有效節省能源成本,供氣設備之體積小,而可便利配置於作業機,並縮短輸送管144及供氣管147之長度,及利於場所空間配置,以及便利搬移作業機及供氣設備,進而提高配置作業上之便利性。Therefore, the ventilation unit of the crimping mechanism uses gas with a preset temperature as the temperature control energy source, which not only effectively saves energy costs, but also reduces the size of the air supply equipment and can be conveniently configured on the operating machine, shortens the length of the
依作業需求,壓接機構可於承載具12配置至少一加熱件(圖未示出),以供配合調節氣體之預設溫度。另可於壓接具13配置至少一感測器(圖未示出),以感測溫度。According to the operation requirements, the crimping mechanism can be equipped with at least one heating element (not shown) on the
請參閱圖2~4,本發明壓接機構應用於測試裝置10,測試裝置10包含測試機構及壓接機構,測試機構設有至少一測試器,以供測試電子元件,於本實施例,測試器設有電性連接之電路板151及測試座152,測試座152以供承置及測試電子元件。本發明壓接機構配置於測試機構之上方,以供於測試座152取放及壓接電子元件。Please refer to Figures 2 to 4. The crimping mechanism of the present invention is applied to a
壓接機構之移載臂11帶動壓接單元及換氣單元位移至一承載電子元件21之載台(圖未示出),令壓接單元之壓接具13的吸嘴133貼合電子元件21之頂面,換氣單元之控制器145控制輸送管144連通抽氣管146,並關閉供氣管147
,由於抽氣管146連接一抽氣設備,以及輸送管144連通輸氣道143一端,而可使抽氣管146經由輸送管144對承載具12之輸氣道143抽氣,輸氣道143另一端經由相通之支流道142而對壓接具13之氣體流道141抽氣,在氣體流道141連通吸嘴133的要件下,可使吸嘴133具有吸力而吸附電子元件21,並使壓接具13之管部131貼合電子元件21之頂面,於移載臂11帶動承載具12及壓接具13作Z方向向上位移時,即可使吸嘴133於載台取出電子元件21,移載臂11再帶動承載具12、壓接具13及電子元件21位移至測試座152之上方。
The
於移載臂11帶動承載具12、壓接具13及電子元件21作Z方向向下位移,將電子元件21置入測試座152後,換氣單元之控制器145控制變換輸送管144連通供氣管147,並關閉抽氣管146,以解除吸嘴133之吸力,由於供氣管147連接一供氣設備,而可依測試作業需求提供預設溫度之氣體(例如低溫氣體),使得供氣管147將預設低溫氣體輸送至輸送管144,輸送管144將預設低溫氣體輸送至承載具12內之輸氣道143,在輸氣道143連通壓接具13之支流道142的要件下
,而可經由支流道142將預設低溫氣體輸送至壓接具13之同一氣體流道141,使預設低溫氣體直接與壓接具13作熱交換,而提高溫度傳導率,以利迅速溫控壓接具13呈預設低溫狀態,由於壓接具13之管部131貼合電子元件21之頂面,而可將低溫傳導至電子元件21,並搭配氣體流道141將低溫氣體吹送至電子元件21之頂面,而增加低溫氣體與電子元件21之熱交換面積,低溫氣體再排出壓接具13
,在壓接具13及低溫氣體之雙重溫控電子元件21的使用狀態下,即可更加迅速使電子元件21於模擬日後低溫環境之測試座152內執行冷測作業;因此,換氣單元不僅可於同一氣體流道141執行抽氣或供氣動作,並簡化機構設計而易於組裝
,以及有效節省能源成本。
After the
然,低溫氣體排出之方式,例如氣體由壓接具13之管部131底面與電子元件21間之間隙排出,或者例如於壓接具13之管部131開設排氣孔(圖未示出)以供排出,亦或者例如壓接具13之管部31僅具有二壓塊部接觸電子元件21
,氣體可由二壓塊部以外之部位排出,不受限於本實施例。
However, the low-temperature gas discharge method, for example, the gas is discharged from the gap between the bottom surface of the
請參閱圖5,本發明壓接機構之第二實施例的設計大致相同第一實施例,其差異在於換氣單元於氣體流道141設有第一支流道1481及第二支流道1482,第一支流道1481及第二支流道1482之位置高度可相同或具有位差,於本實施例,第一支流道1481及第二支流道1482之位置高度具有位差。至少一輸送結構包含第一輸送結構及第二輸送結構,第一輸送結構能夠連通第一支流道1481,以供抽氣,第二輸送結構能夠連通第二支流道1482,以供輸送預設溫度氣體。第一輸送結構於承載具12設有第一輸氣道,第一輸氣道連接第一輸送管以供抽氣,第二輸送結構於承載具12設有第二輸氣道,第二輸氣道連接第二輸送管以供輸送預設溫度氣體。第一輸送管及第二輸送管連接至少一控制器,控制器連接抽氣管及供氣管,以供控制變換抽氣或輸送預設溫度氣體。Please refer to FIG. 5 . The design of the second embodiment of the crimping mechanism of the present invention is substantially the same as the first embodiment. The difference is that the ventilation unit is provided with a
壓接具13可於承載具12之通孔121作Z方向位移,例如壓接具13可受電子元件之反作用力頂推而作Z方向位移,例如壓接單元以承載驅動源驅動承載具12作Z方向位移,不受限於本實施例。The crimping
於本實施例,移載臂11可帶動壓接單元及換氣單元作Y-Z方向位移。換氣單元之第一輸送結構於承載具12設有呈X方向配置之第一輸氣道1491
,第一輸氣道1491連通第一輸送管1501以供抽氣,第一輸送管1501連接控制器145,由於控制器145連接抽氣管146及供氣管147,而可控制變換抽氣或輸送預設溫度氣體,因此控制器145可控制第一輸送管1501相通或未相通抽氣管146,而可控制氣體流道141抽氣或未抽氣;第二輸送結構於承載具12設有第二輸氣道1492,第二輸氣道1492與第一輸氣道1491之位置高度具有位差,第二輸氣道1492連接第二輸送管1502以供輸送預設溫度氣體,第二輸送管1502連接控制器145,控制器145控制第二輸送管1502相通或未相通供氣管147,以控制氣體流道141輸送或未輸送預設溫度氣體。壓接單元設置承載驅動源(例如壓缸,圖未示出),以供帶動壓接具13於承載具12之通孔121內作Z方向位移於第一位置或第二位置,使換氣單元之氣體流道141的第一支流道1481連通第一輸氣道1491,或者使氣體流道141的第二支流道1482連通第二輸氣道1492。
In this embodiment, the
請參閱圖6~7,壓接機構之移載臂11帶動壓接單元及換氣單元位移至一承載電子元件21之載台(圖未示出),令壓接具13的吸嘴133貼合電子元件21之頂面;壓接單元之承載驅動源(圖未示出)帶動壓接具13於承載具12之通孔121內作Z方向位移至第一位置,使換氣單元之氣體流道141的第一支流道1481連通第一輸氣道1491,並使第二支流道1482與第二輸氣道1492錯位而封閉;控制器145控制第一輸送管1501連通抽氣管146,並關閉供氣管147,由於抽氣管146連接一抽氣設備,以及第一輸送管1501連通第一輸氣道1491一端,而可使抽氣管146經由第一輸送管1501對承載具12之第一輸氣道1491抽氣,第一輸氣道1491之另一端經第一支流道1481而對壓接具13之氣體流道141抽氣,使吸嘴133具有吸力而吸附電子元件21,並使壓接具13之管部131貼合電子元件21之頂面,於移載臂11帶動承載具12及壓接具13作Z方向向上位移時,即可使吸嘴133於載台取出電子元件21,移載臂11再帶動承載具12、壓接具13及電子元件21位移至測試座152之上方。Please refer to Figures 6 and 7. The
於移載臂11帶動承載具12、壓接具13及電子元件21作Z方向向下位移,將電子元件21置入測試座152後,壓接單元之承載驅動源(圖未示出)帶動壓接具13於承載具12之通孔121內作Z方向位移至第二位置,使換氣單元之氣體流道141的第二支流道1482連通第二輸氣道1492,並使第一支流道1481與第一輸氣道1491錯位而封閉;控制器145控制變換第二輸送管1502連通供氣管147,並關閉抽氣管146,以解除吸嘴133之吸力;供氣管147將預設低溫氣體輸送至第二輸送管1502,第二輸送管1502將預設低溫氣體輸送至承載具12內之第二輸氣道1492,第二輸氣道1492經由第二支流道1482將預設低溫氣體輸送至壓接具13之同一氣體流道141,使氣體流道141內之預設低溫氣體直接與壓接具13作熱交換
,而提高溫度傳導率,以利迅速溫控壓接具13呈預設低溫狀態,壓接具13之管部131將低溫傳導至電子元件21,並搭配氣體流道141將低溫氣體吹送至電子元件21之頂面,而增加低溫氣體與電子元件21之熱交換面積,低溫氣體再排出壓接具13,在壓接具13及低溫氣體之雙重溫控電子元件21的使用狀態下,即可更加迅速使電子元件21於模擬日後低溫環境之測試座152內執行冷測作業。
The
請參閱圖1~4及圖8,本發明壓接機構應用於電子元件作業機,作業機包含機台30、供料裝置40、收料裝置50、測試裝置10、輸送裝置60及中央控制裝置(圖未示出);供料裝置40裝配於機台30,並設有至少一供料器,以容納至少一待測之電子元件;收料裝置50裝配於機台30,並設有至少一收料器
,以容納至少一已測之電子元件;測試裝置10配置於機台30,包含測試機構及本發明之壓接機構,測試機構設有至少一測試器,以供測試電子元件,本發明壓接機構以供取放及壓接電子元件,並能夠溫控電子元件執行測試作業;於本實施例,測試器設有電性連接之電路板151及具傳輸件(如探針)之測試座152,測試座152以供承置及測試電子元件;輸送裝置60裝配於機台30,並設有至少一輸送器,以輸送電子元件;於本實施例,輸送裝置60設有第一輸送器61,以於供料裝置40之供料器取出待測電子元件,並將待測電子元件移載至第二輸送器62,第二輸送器62將待測電子元件載送至測試裝置10之側方,測試裝置10之壓接機構以移載臂11將承載具12及壓接具13移載至第二輸送器62之上方,並以壓接具13將第二輸送器62之待測電子元件移載至測試座152而執行測試作業,以及將已測電子元件移載至第三輸送器63而載出,第四輸送器64於第三輸送器63取出已測電子元件,並輸送至收料裝置50之收料器處而分類收置;中央控制裝置(圖未示出)用以控制及整合各裝置作動,以執行自動化作業,達到提升作業效能之實用效益。
Please refer to Figures 1 to 4 and Figure 8. The crimping mechanism of the present invention is applied to an electronic component processing machine, which includes a machine 30, a feeding device 40, a receiving device 50, a testing device 10, a conveying device 60 and a central control device (not shown); the feeding device 40 is mounted on the machine 30 and is provided with at least one feeder to accommodate at least one electronic component to be tested; the receiving device 50 is mounted on the machine 30 and is provided with at least one receiving device
, to accommodate at least one tested electronic component; the testing device 10 is arranged on the machine 30, including a testing mechanism and a crimping mechanism of the present invention, the testing mechanism is provided with at least one tester for testing electronic components, the crimping mechanism of the present invention is used for taking and crimping electronic components, and can temperature-control the electronic components to perform testing operations; in this embodiment, the tester is provided with an electrically connected circuit board 151 and a test seat 152 with a transmission component (such as a probe), and the test seat 152 is used to hold and test electronic components; the conveying device 60 is assembled on the machine 30, and is provided with at least one conveyor for conveying electronic components; in this embodiment, the conveying device 60 is provided with a first conveyor 61, which takes out the electronic component to be tested from the feeder of the feeding device 40, and feeds the electronic component to be tested The sub-components are transferred to the second conveyor 62, and the second conveyor 62 carries the electronic components to be tested to the side of the test device 10. The crimping mechanism of the
測試裝置10
移載臂11
承載具12
通孔121
壓接具13
管部131
容置空間132
吸嘴133
氣體流道141
支流道142
輸氣道143
輸送管144
控制器145
抽氣管146
供氣管147
第一支流道1481
第二支流道1482
第一輸氣道1491
第二輸氣道1492
第一輸送管1501
第二輸送管1502
電路板151
測試座152
電子元件21
機台30
供料裝置40
收料裝置50
輸送裝置60
第一輸送器61
第二輸送器62
第三輸送器63
第四輸送器64
圖1:本發明壓接機構第一實施例之示意圖。 圖2:本發明壓接機構應用於測試裝置之示意圖。 圖3至圖4:本發明壓接機構之使用示意圖。 圖5:本發明壓接機構第二實施例之示意圖。 圖6至圖7:本發明壓接機構之使用示意圖。 圖8:本發明測試裝置應用於作業機之示意圖。 Figure 1: Schematic diagram of the first embodiment of the crimping mechanism of the present invention. Figure 2: Schematic diagram of the crimping mechanism of the present invention applied to a test device. Figures 3 to 4: Schematic diagrams of the use of the crimping mechanism of the present invention. Figure 5: Schematic diagram of the second embodiment of the crimping mechanism of the present invention. Figures 6 to 7: Schematic diagrams of the use of the crimping mechanism of the present invention. Figure 8: Schematic diagram of the test device of the present invention applied to a working machine.
移載臂11
承載具12
通孔121
壓接具13
氣體流道141
控制器145
抽氣管146
供氣管147
第一支流道1481
第二支流道1482
第一輸氣道1491
第二輸氣道1492
第一輸送管1501
第二輸送管1502
Claims (8)
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201447325A (en) * | 2013-04-23 | 2014-12-16 | Seiko Epson Corp | Processor and inspection device |
| CN107884698A (en) * | 2016-09-29 | 2018-04-06 | 精工爱普生株式会社 | Electronic component handling apparatus and electronic component inspection device |
| TWM615381U (en) * | 2021-01-20 | 2021-08-11 | 捷創科技股份有限公司 | Electronic component testing device with heat dissipation and automatic calibration functions |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201447325A (en) * | 2013-04-23 | 2014-12-16 | Seiko Epson Corp | Processor and inspection device |
| CN107884698A (en) * | 2016-09-29 | 2018-04-06 | 精工爱普生株式会社 | Electronic component handling apparatus and electronic component inspection device |
| TWM615381U (en) * | 2021-01-20 | 2021-08-11 | 捷創科技股份有限公司 | Electronic component testing device with heat dissipation and automatic calibration functions |
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