TWI731449B - Die transfer module and die bonding apparatus having the same - Google Patents

Abstract

A bonding device including a chip transfer module chip. The wafer transfer module includes: a stage unit for supporting a dicing tape on which a wafer is attached; a swing arm which is arranged above the stage unit and is configured to surround the The rotating shaft rotates; a pick-up unit, which is mounted on the lower part of the swing arm and is configured to pick up the first wafer from the dicing tape; an arm drive unit, which is used to pick up the first wafer by the pick-up unit The swing arm is then rotated by a first angle in a first direction; and a wafer stage is arranged to face the pickup unit rotating in the first direction and is configured to receive the pickup unit The first wafer.

Description

Chip transfer module and chip bonding device with chip transfer module

The invention relates to a chip transfer module and a chip bonding device with the chip transfer module. More specifically, the present invention relates to a wafer transfer module for transferring a wafer in a wafer bonding process for bonding a wafer to a substrate such as a lead frame and a printed circuit board; and a wafer transfer module having the wafer transfer module Wafer bonding device.

Generally, by repeatedly performing a series of manufacturing processes, a semiconductor device can be formed on a silicon wafer used as a semiconductor substrate. The semiconductor device may be a single multiple wafer through a dicing process, and the wafer may then be bonded to a substrate through a wafer bonding process.

The wafer can be supplied to the wafer bonding device in a state where the wafer is attached to the dicing tape. The wafer bonding apparatus may include: a wafer stage for supporting the wafer, a wafer ejector for separating the wafer from the dicing tape, and a wafer transfer for transferring the wafer separated by the wafer ejector to the wafer stage Unit, and a bonding unit for picking up the wafer from the wafer stage and bonding the wafer to the substrate.

The wafer transfer unit may include a picker for picking up the wafer from the dicing tape using vacuum pressure, and a picker driving part for moving the picker in horizontal and vertical directions. The pickup driving part may include a horizontal driving part for moving the pickup in a horizontal direction and a vertical driving part for moving the pickup in a vertical direction. For example, the vertical driving part may be installed on the horizontal driving part and can be moved in the horizontal direction by the horizontal driving part. At this time, since the volume of the vertical driving part is relatively large and its weight is relatively heavy, vibration may occur during the movement of the pickup. Therefore, increasing the moving speed of the picker will be limited, and shortening the time it takes to transfer the wafer to the wafer stage will also be limited.

The present invention provides a wafer transfer module capable of reducing vibration during wafer transfer and shortening the time required for wafer transfer, and a wafer bonding device including the wafer transfer module.

According to an aspect of the present invention, a wafer transfer module may include: a stage unit for supporting a dicing tape on which a wafer is attached; and a swing arm which is arranged above the stage unit and is configured to be arranged around The rotating shaft in the horizontal direction rotates; the pick-up unit, which is mounted on the lower part of the swing arm and is configured to pick up the first wafer from the dicing tape; the arm drive unit, which is used for the first wafer after being picked up by the pick-up unit Rotating the swing arm by a first angle in one direction; and a wafer stage provided to face the pick-up unit rotating in the first direction and configured to receive the first wafer from the pick-up unit.

According to some embodiments of the present invention, the picking unit may include: a vacuum picker for vacuuming the first wafer using vacuum pressure; and a picker driving unit for moving the vacuum picker in the longitudinal direction of the swing arm to Pick up the first wafer from the dicing tape and place the first wafer on the wafer stage.

According to some embodiments of the present invention, the wafer transfer module may further include a rotation driving unit for rotating the wafer stage so that the first wafer faces upward after the first wafer is transferred to the wafer stage.

According to some embodiments of the present invention, the wafer transfer module may further include a buffer stage disposed adjacent to the wafer stage, configured to be rotatable by the rotation driving unit and used for temporarily storing any of the wafers.

According to some embodiments of the present invention, the wafer transfer module may further include a horizontal drive unit connected to the rotation drive unit and used to move the rotation drive unit in a direction parallel to the horizontal direction, so that the wafer stage and the buffer stage The one corresponds to the pickup unit.

According to some embodiments of the present invention, the wafer stage may include a vacuum chuck for vacuum suction of the first wafer.

According to some embodiments of the present invention, the wafer transfer module may further include a camera unit for detecting the first wafer attached to the dicing tape.

According to some embodiments of the present invention, the camera unit may be disposed above the first wafer, the pickup unit may be installed on the side surface of the lower part of the swing arm, and the arm driving unit may rotate the swing arm so that the pickup unit is disposed on the first wafer And the camera unit to pick up the first wafer after the camera unit detects the first wafer.

According to some embodiments of the present invention, the wafer transfer module may further include a wafer ejector, which is disposed under the dicing tape supported by the stage unit and used to push the first wafer upward to separate the first wafer from the dicing tape .

According to some embodiments of the present invention, the wafer transfer module may further include a stage drive unit for moving the stage unit in a horizontal direction so that the first wafer is positioned on the wafer ejector.

According to some embodiments of the present invention, the wafer transfer module may further include: a second swing arm which is arranged above the stage unit and is configured to be rotatable about a second rotation axis arranged coaxially with the rotation axis; and a second pickup Unit, which is installed on the lower part of the second swing arm and is configured to pick up the second wafer from the dicing tape; the second arm drive unit, which is used to move the second wafer in a direction different from the first direction after being picked up by the second picking unit Rotate the second swing arm by a second angle in the second direction; and a second wafer stage arranged to face the second pick-up unit rotating in the second direction and configured to receive the second wafer from the second pick-up unit .

According to some embodiments of the present invention, the wafer transfer module may further include a second rotation driving unit for rotating the second wafer stage so that after the second wafer is transferred to the second wafer stage, the second wafer faces on.

According to some embodiments of the present invention, the wafer transfer module may further include: a wafer ejector, which is provided under the dicing tape supported by the stage unit and used to push any one of the wafers upward to make one of the wafers Separate from the dicing tape; and a stage drive unit, which is used to move the stage unit in a horizontal direction so that any one of the wafers is positioned on the wafer ejector. At this time, the second arm driving unit may rotate the second swing arm so that the second pickup unit is positioned above the wafer ejector to pick up the second wafer when the first wafer is transferred to the wafer stage.

According to some embodiments of the present invention, the wafer transfer module may further include a camera unit, which is disposed above the wafer ejector and used for inspecting the first wafer and the second wafer.

According to another aspect of the present invention, a wafer bonding apparatus may include: a stage unit for supporting a dicing tape on which a wafer is attached; and a swing arm provided above the stage unit and configured to be arranged around The rotating shaft in the horizontal direction rotates; the pick-up unit, which is mounted on the lower part of the swing arm and is configured to pick up the first wafer from the dicing tape; the arm drive unit, which is used for the first wafer after being picked up by the pick-up unit Rotate the swing arm by a first angle in one direction; a wafer stage, which is arranged to face the pick-up unit rotating in the first direction and is configured to receive the first wafer from the pick-up unit; a rotation drive unit, which is used to rotate the wafer stage A rack so that the first wafer faces upward after the first wafer is transferred to the wafer stage; and a bonding module for picking up the first wafer from the wafer stage and bonding the first wafer on the substrate.

According to some embodiments of the present invention, the wafer bonding apparatus may further include a camera unit, which is disposed above the wafer stage and used to detect the first wafer transferred to the wafer stage.

According to some embodiments of the present invention, the bonding module may include: a substrate stage for supporting the substrate; a bonding head for vacuuming the first wafer using vacuum pressure; and a head driving unit for horizontal and The bonding head is moved in the vertical direction to pick up the first wafer from the wafer stage and bond the first wafer to the substrate.

According to some embodiments of the present invention, the wafer bonding apparatus may further include: a second swing arm that is provided above the stage unit and configured to be rotatable about a second rotation axis that is coaxially disposed with the rotation axis; and a second pickup unit , Which is installed on the lower part of the second swing arm and is configured to pick up the second wafer from the dicing tape; the second arm drive unit is used to move the second wafer in a different direction after being picked up by the second picking unit Rotate the second swing arm by a second angle in the second direction; a second wafer stage, which is arranged to face the second pick-up unit rotating in the second direction and is configured to receive the second wafer from the second pick-up unit; Two rotation driving units for rotating the second wafer stage so that the second wafer faces upward after the second wafer is transferred to the second wafer stage; and a second bonding module for transferring the second wafer The stage picks up the second wafer and bonds the second wafer on the second substrate.

According to some embodiments of the present invention, the wafer bonding apparatus may further include: a wafer ejector, which is provided under the dicing tape supported by the stage unit and used to push any one of the wafers upward to make one of the wafers and Dicing tape separation; a stage drive unit, which is used to move the stage unit in a horizontal direction, so that any one of the wafers is positioned on the wafer ejector; and a camera unit, which is used to detect the positioning on the wafer ejector Of wafers. At this time, the stage drive unit can move the stage unit so that the second wafer is positioned on the wafer ejector when the first wafer is transferred to the wafer stage, the camera unit can detect the second wafer, and the second arm drive unit The second swing arm may be rotated so that the second pickup unit is positioned above the second wafer to pick up the second wafer.

The above summary of the present invention is not intended to describe each illustrated embodiment or every implementation of the present invention. The following specific embodiments and the scope of patent application more particularly exemplify these examples.

Hereinafter, embodiments of the present invention are described in more detail with reference to the drawings. However, the present invention is not limited to the embodiments described below and can be implemented in various other forms. The following embodiments are not completely used to complete the present invention, but are used to fully convey the scope of the present invention to those skilled in the art.

In the specification, when an element is referred to as being on or connected to another element or layer, it can be directly on or directly connected to the other element or layer, or intervening elements may also be present Or layer. The difference is that when an element is referred to as being directly on or directly connected to another element or layer, it is understood to mean that there is no intervening element. In addition, although terms like first, second, and third are used to describe various regions and layers in various embodiments of the present invention, the regions and layers are not limited to these terms.

The terms used below are only used to describe specific embodiments, not to limit the present invention. Additionally, unless otherwise defined herein, all terms including technical or scientific terms may have the same meaning as commonly understood by those skilled in the art.

The embodiments of the present invention are described with reference to schematic diagrams of ideal embodiments. Correspondingly, changes in the manufacturing method and/or allowable errors can be anticipated according to the form of the diagram. Correspondingly, the embodiments of the present invention are not described as being limited to specific forms or regions in the drawings and include deviations of forms. This area may be completely schematic, and its form may not describe or depict the exact form or structure in any given area, and is not intended to limit the scope of the present invention.

FIG. 1 is a schematic plan view showing a wafer bonding apparatus according to an embodiment of the present invention. FIG. 2 is a schematic front view showing the wafer transfer module as shown in FIG. 1, and FIG. 3 is a schematic side view showing the wafer transfer module as shown in FIG. 2.

1 to 3, a wafer bonding apparatus 100 according to an embodiment of the present invention can be used to bond a wafer 20 to a substrate 30, such as a lead frame and a printed circuit board, for manufacturing a semiconductor device in a wafer bonding process . The wafer bonding apparatus 100 can pick up the wafer 20 from the wafer 10 and bond the wafer 20 to the substrate 30. The wafer 10 may include a plurality of wafers 20 that are made into a single through a dicing process. The wafer 10 may be provided in a state where the wafer 20 is attached to the dicing tape 12, and the dicing tape 12 may be mounted to the mounting frame 14 having a circular ring shape.

The wafer bonding apparatus 100 may include a wafer transfer module 200 and a bonding module 300. The wafer transfer module 200 may pick up the wafer 20 to be bonded from the dicing tape 12 and transfer to the bonding module 300, and the bonding module 300 may bond the wafer 20 to the substrate 30. In addition, the wafer bonding apparatus 100 may include: a loading port 110 for supporting a cassette 50 in which a plurality of wafers 10 are stored; a wafer transfer unit 120 for taking out the wafer 10 from the cassette 50 and transferring the wafers 10 The circle 10 is loaded on the stage unit 202 which will be described later; and a guide rail 130 for guiding the wafer 10 between the cassette 50 and the stage unit 202.

The wafer transfer module 200 may include a stage unit 202 for supporting the wafer 10. For example, the stage unit 202 may include: a wafer stage 204; a support ring 206, which is provided on the wafer stage 204 and used to support the edge portion of the dicing tape 12; and an expansion ring 208, which is used to reduce The frame 14 is installed to expand the cutting tape 12.

The wafer ejector 210 for selectively separating the wafer 20 and the dicing tape 12 may be provided under the dicing tape 12 supported by the stage unit 202. Although not shown in the figure, the wafer ejector 210 may include: a cover provided to contact the lower surface of the dicing tape 12 and used for vacuum suction of the dicing tape 12; and ejector pins for pushing the wafer upward The wafer 20 to be picked up in 20 separates the wafer 20 from the dicing tape 12.

In addition, although not shown in the figure, the stage unit 202 may be moved in a horizontal direction, for example, in the X-axis direction and the Y-axis direction by a stage driving unit (not shown). For example, the stage driving unit may move the stage unit 202 to the wafer loading/unloading area adjacent to the end of the guide rail 130 for loading and unloading the wafer 10. In addition, the stage driving unit can move the stage unit 202 to selectively pick up the wafer 20. That is, the stage driving unit can adjust the position of the stage unit 202 so that the wafer 20 to be picked up is positioned on the wafer ejector 210.

The wafer transfer module 200 may include a swing arm 220 provided above the stage unit 202 and configured to be rotatable about a rotation axis 222 provided in a horizontal direction, for example, in the Y-axis direction; and a pickup unit 224 installed It is on the lower part of the swing arm 220 and is configured to pick up one of the wafers 20 from the dicing tape 12. For example, the stage driving unit may move the stage unit 202 so that the first wafer 22 is positioned on the wafer ejector 210, and the wafer ejector 210 may then separate the first wafer 22 from the dicing tape 12. The pickup unit 224 may include: a vacuum pickup 226 for vacuum suction of the first wafer 22 using vacuum pressure; and a pickup driving unit 228 for moving the vacuum pickup 226 in the longitudinal direction of the swing arm 220 to remove the dicing tape 12 Pick up the first wafer 22.

In addition, the wafer transfer module 200 may include: an arm driving unit 230 for swinging the first wafer 22 in a first direction after being picked up by the picking unit 224, for example, in a clockwise direction as shown in FIG. The arm 220 rotates by a first angle; and the wafer stage 232 is provided to face the pickup unit 224 rotating in the first direction and is configured to receive the first wafer 22 from the pickup unit 224. After rotating the swing arm 220 in the first direction, the pickup driving unit 228 may move the vacuum picker 226 along the longitudinal direction of the swing arm 220 to place the first wafer 22 on the wafer stage 232.

The wafer stage 232 may include a vacuum chuck 234 for vacuum suction of the first wafer 22. Although not shown in the figure, the vacuum chuck 234 may have a plurality of vacuum holes for vacuum suction of the first wafer 22.

After transferring the first wafer 22 to the wafer stage 232, the arm driving unit 230 may rotate the swing arm 220 in a second direction, for example, a counterclockwise direction, so that the pickup unit 224 is positioned above the wafer ejector 210. In addition, after the first wafer 22 is transferred to the wafer stage 232, the wafer stage 232 may be rotated by the rotation driving unit 236 so that the first wafer 22 faces upward.

The wafer transfer module 200 may include a camera unit 212 for inspecting the first wafer 22 before the first wafer 22 is picked up. The camera unit 212 may be disposed above the wafer ejector 210 and may inspect the first wafer 22 after the first wafer 22 is positioned on the wafer ejector 210. The stage driving unit can adjust the position of the stage unit 202 so that the first wafer 22 is accurately positioned on the wafer ejector 210 and under the pickup unit 224 according to the detection result of the camera unit 212 on the first wafer 22.

For example, after the swing arm 220 is rotated in the first direction by the arm drive unit 230, the camera unit 212 can detect the first wafer 22 and the stage drive unit can adjust the position of the first wafer 22. Subsequently, the arm driving unit 230 may rotate the swing arm 220 so that the pickup unit 224 is positioned between the first wafer 22 and the camera unit 212. That is, the arm driving unit 230 may rotate the swing arm 220 so that the pickup unit 224 is positioned above the first wafer 22. At this time, the pickup unit 224 may be installed on the side surface of the lower portion of the swing arm 220 in order to prevent interference between the swing arm 220 and the camera unit 212.

The first wafer 22 placed on the wafer stage 232 may be bonded to the substrate 30 by the bonding module 300. The bonding module 300 may include: a substrate stage 310 for supporting the substrate 30 and heating the substrate 30 to a predetermined temperature; a bonding head 312 for vacuuming the first wafer 22 using vacuum pressure; and a head driving unit 314, It is used to move the bonding head 312 in the horizontal and vertical directions to pick up the first wafer 22 from the wafer stage 232 and bond the first wafer 22 to the substrate 30. In addition, the second camera unit 302 may be disposed above the wafer stage 232 to detect the first wafer 22 on the wafer stage 232. After the first wafer 22 is detected by the second camera unit 302, the head driving unit 314 may move the bonding head 312 in the vertical direction to pick up the first wafer 22.

The substrate 30 may be supplied from the first cassette 40 and may be transferred to the substrate stage 310 by the substrate transfer unit 140. After the wafer bonding process is performed, the substrate 30 can be contained in the second box 42 by the substrate transfer unit 140.

FIG. 4 is a schematic front view showing another example of the wafer transfer module as shown in FIG. 2.

Referring to FIG. 4, the wafer transfer module 200 may include a buffer stage 238 disposed adjacent to the wafer stage 232. For example, the buffer stage 238 may be connected to the rotation driving unit 236 so as to be rotatable by the rotation driving unit 236, and may be set to have a predetermined angle relative to the wafer stage 232. In particular, the buffer stage may be used to temporarily store one of the wafers 20 and may be configured to be the same as the wafer stage 232.

FIG. 5 is a schematic plan view showing another example of the buffer stage as shown in FIG. 4.

Referring to FIG. 5, the buffer stage 240 may be disposed in a horizontal direction, for example, a predetermined distance apart from the wafer stage 232 in the Y-axis direction, and may be configured to be rotatable by the rotation driving unit 236. At this time, the wafer stage 232 and the buffer stage 240 can be moved in the horizontal direction, for example, in the Y-axis direction by the horizontal driving unit 242. For example, the horizontal driving unit 242 may be connected with the rotation driving unit 236 and may move the rotation driving unit 236 in the horizontal direction so that one of the wafer stage 232 and the buffer stage 240 corresponds to the pickup unit 224 rotating in the first direction .

FIG. 6 is a schematic plan view showing a wafer bonding apparatus according to another embodiment of the present invention. FIG. 7 is a schematic front view showing the wafer transfer module as shown in FIG. 6, and FIG. 8 is a schematic side view showing the wafer transfer module as shown in FIG. 7.

6 to 8, a wafer bonding apparatus 100 according to another embodiment of the present invention may include: a stage unit 202 for supporting the dicing tape 12 on which the wafer 20 is attached; and a swing arm 220 that is provided Above the stage unit 202 and configured to be rotatable around a rotating shaft 222 provided in the horizontal direction; a pickup unit 224, which is installed on the lower portion of the swing arm 220 and configured to pick up the first wafer 22 from the dicing tape 12 The arm drive unit 230, which is used to rotate the swing arm 220 by a first angle in the first direction after the first wafer 22 is picked up by the picking unit 224; the wafer stage 232, which is arranged to face the rotating in the first direction The pick-up unit 224 is configured to receive the first wafer 22 from the pick-up unit 224; the rotation drive unit 236 is used to rotate the wafer stage 232 so that the first wafer 22 is transferred to the wafer stage 232 Face upward; and a bonding module 300 for picking up the first wafer 22 from the wafer stage 232 and bonding the first wafer 22 on the substrate 30.

The wafer ejector 210 may be provided below the dicing tape 12 to separate the first wafer 22 from the dicing tape 12, and the camera unit 212 may be provided above the wafer ejector 210 to inspect the first wafer 22. The second camera unit 302 may be disposed above the wafer stage 232 to detect the first wafer 22 transferred to the wafer stage 232. The bonding module 300 may include: a substrate stage 310; a bonding head 312 for picking up the first wafer 22 from the wafer stage 232; and a head driving unit 314 for moving the bonding head 312 in horizontal and vertical directions to The first wafer 22 is bonded to the substrate 30.

The wafer transfer module 200 may further include a second swing arm 250, which is disposed above the stage unit 202 and configured to be rotatable about a second rotation shaft 252 that is coaxially disposed with the rotation shaft 222; and a second picking unit 254, which Mounted on the lower part of the second swing arm 250 and configured to pick up the second wafer 24 from the dicing tape 12; the second arm driving unit 260, which is used to pick up the second wafer 24 differently from the second wafer 24 after being picked up by the second picking unit 254 The second swing arm 250 is rotated by a second angle in the second direction of the first direction; the second wafer stage 262 is arranged to face the second picking unit 254 rotating in the second direction and is configured to pick up from the second The unit 254 receives the second wafer 24; the second rotation driving unit 266 for rotating the second wafer stage 262 so that the second wafer 24 faces upward after the second wafer is transferred to the second wafer stage 262; and The second bonding module 350 is used for picking up the second wafer 24 from the second wafer stage 262 and bonding the second wafer 24 on the second substrate 32.

The second picking unit 254 may be installed on the side surface of the lower part of the second swing arm 250 adjacent to the swing arm 220, and may include: a second vacuum picker 256 for picking up the second wafer 24; and a second picking The drive unit 258 is used to move the second vacuum pickup 256 in the longitudinal direction of the second swing arm 250. The second wafer stage 262 may include a second vacuum chuck 264.

The stage driving unit (not shown) can move the stage unit 202 in the horizontal direction so that the second wafer 24 is positioned on the wafer ejector 210 when the first wafer 22 is transferred to the wafer stage 232, and the camera unit 212 The second wafer 24 can be detected. The second arm driving unit 260 may rotate the second swing arm 250 so that the second picking unit 254 is positioned above the second wafer 24 to pick up the second wafer 24 when the first wafer 22 is transferred onto the wafer stage 232.

After the second pickup unit 254 is positioned above the second wafer 24, the second pickup driving unit 258 may move the second pickup 256 in the vertical direction to pick up the second wafer 24. Subsequently, the second arm driving unit 260 may rotate the second swing arm 250 by a second angle in a second direction, for example, in a counterclockwise direction, and the second pickup driving unit 258 may be positioned in the longitudinal direction of the second swing arm 250. The second picker 256 is moved to place the second wafer 24 on the second wafer stage 262. Meanwhile, while transferring the second wafer 24 to the second wafer stage 262, the pickup unit 224 may pick up the third wafer (not shown) from the dicing tape 12.

The second wafer 24 transferred to the second wafer stage 262 may be bonded to the second substrate 32 by the second bonding module 350. The second bonding module 350 may include: a second substrate stage 360 for supporting the second substrate 32 and heating the second substrate 32 to a predetermined temperature; and a second bonding head 362 for vacuuming the second substrate using vacuum pressure Two wafers 24; and a second head driving unit 364 for moving the second bonding head 362 in the horizontal and vertical directions to pick up the second wafer 24 from the second wafer stage 262 and bond the second wafer 24 to the second On the substrate 32. In addition, the third camera unit 352 may be disposed above the second wafer stage 262 to detect the second wafer 24 on the second wafer stage 262. After the second wafer 24 is detected by the third camera unit 352, the second head driving unit 364 may move the second bonding head 362 in the vertical direction to pick up the second wafer 24.

The second substrate 32 may be supplied from the third box 44 and may be transferred to the second substrate stage 360 by the second substrate transfer unit 142. After the wafer bonding process is performed, the second substrate 32 can be contained in the fourth box 46 by the second substrate transfer unit 142.

According to the embodiment of the present invention as described above, the wafer 20 can be transferred from the dicing tape 12 to the wafer stage 232 by the swing arm 220 and the picking unit 224, and therefore, compared with the prior art, it is possible to greatly reduce the time when transferring the wafer 20. vibration. In addition, since the moving distance of the wafer 20 is relatively short compared with the prior art, the time required for transferring the wafer 20 can be greatly reduced.

Although the wafer bonding apparatus 100 including the wafer transfer module 200 has been described with reference to specific embodiments, it is not limited thereto. Therefore, it will be easily understood by those skilled in the art that various modifications and changes can be made to it without departing from the spirit and scope of the present invention defined by the scope of the appended patent application.

10: Wafer 12: Cutting tape 14: Install the frame 20: chip 22: The first chip 24: second chip 30: substrate 32: second substrate 40: The first box 42: second box 44: third box 46: The fourth box 50: box 100: Wafer bonding device 110: load port 120: Wafer transfer unit 130: Rail 140: Substrate transfer unit 142: Second substrate transfer unit 200: Chip transfer module 202: Bench unit 204: Wafer Stage 206: Support ring 208: Expansion Ring 210: Wafer ejector 212: camera unit 220: swing arm 222: Rotation axis 224: Pickup Unit 226: Vacuum Pickup 228: Pickup drive unit 230: Arm drive unit 232: wafer stage 234: Vacuum Suction Cup 236: Rotary drive unit 238: buffer stand 240: buffer stand 242: Horizontal drive unit 250: second swing arm 252: second rotation axis 254: Second Pickup Unit 256: Second Vacuum Pickup 258: second pickup drive unit 260: Second arm drive unit 262: second wafer stage 264: The second vacuum suction cup 266: second rotary drive unit 300: Joint module 302: second camera unit 310: substrate stage 312: Joint Head 314: head drive unit 350: The second joint module 352: The third camera unit 360: The second substrate stage 362: second joint head 364: second head drive unit

According to the following description in conjunction with the drawings, the embodiments of the present invention can be understood in more detail, in which:

FIG. 1 is a schematic plan view showing a wafer bonding apparatus according to an embodiment of the present invention.

FIG. 2 is a schematic front view showing the wafer transfer module as shown in FIG. 1. FIG.

FIG. 3 is a schematic side view showing the wafer transfer module as shown in FIG. 2.

FIG. 4 is a schematic front view showing another example of the wafer transfer module as shown in FIG. 2.

FIG. 5 is a schematic plan view showing another example of the buffer stage as shown in FIG. 4.

FIG. 6 is a schematic plan view showing a wafer bonding apparatus according to another embodiment of the present invention.

FIG. 7 is a schematic front view showing the wafer transfer module as shown in FIG. 6.

FIG. 8 is a schematic side view showing the wafer transfer module as shown in FIG. 7.

Although the various embodiments are suitable for various modifications and alternative forms, the specific details thereof have been shown in the drawings by way of example and will be described in more detail. However, it should be understood that the intention is not to limit the claimed invention to the specific embodiments described. On the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the subject matter defined by the scope of the patent application.

10: Wafer

12: Cutting tape

14: Install the frame

22: The first chip

202: Bench unit

204: Wafer Stage

206: Support ring

208: Expansion Ring

210: Wafer ejector

212: camera unit

220: swing arm

222: Rotation axis

224: Pickup Unit

226: Vacuum Pickup

228: Pickup drive unit

232: wafer stage

234: Vacuum Suction Cup

236: Rotary drive unit

302: second camera unit

Claims (16)

A wafer transfer module is characterized by comprising: a stage unit for supporting a dicing tape on which a wafer is attached; a swing arm, the swing arm being arranged above the stage unit and configured to Can be rotated around a rotation axis set in the horizontal direction; a pickup unit installed on the side surface of the lower part of the swing arm and configured to pick up the first wafer from the dicing tape; a camera unit provided on the Above the first wafer to inspect the first wafer; an arm drive unit for rotating the swing arm by a first angle in a first direction after the first wafer is picked up by the pickup unit; and a wafer stage The wafer stage is arranged to face the pick-up unit rotating in the first direction and is configured to receive the first wafer from the pick-up unit, wherein when the camera unit detects the first wafer, the arm drive unit Rotate the swing arm in the first direction, and after the camera unit detects the first wafer, the arm drive unit rotates the swing arm in a second direction opposite to the first direction, so that the pickup unit is set Between the first wafer and the camera unit for picking up the first wafer. The wafer transfer module according to claim 1, wherein the pick-up unit includes: a vacuum picker for vacuum suction of the first wafer using vacuum pressure; and a picker drive unit for moving the swing arm in the longitudinal direction The vacuum picker is moved upward to pick up the first wafer from the dicing tape and place the first wafer on the wafer stage. The wafer transfer module according to claim 1, which further includes a rotation driving unit for rotating the wafer stage so that the first wafer is transferred to the wafer stage Face up. The wafer transfer module according to claim 3, which further includes a buffer stage arranged adjacent to the wafer stage, configured to be rotated by the rotation driving unit and used for temporarily storing the wafer in the wafer Either. The wafer transfer module according to claim 4, further comprising a horizontal drive unit connected to the rotation drive unit and configured to move the rotation drive unit in a direction parallel to the horizontal direction, so that the wafer One of the stage and the buffer stage corresponds to the pickup unit. The wafer transfer module according to claim 1, wherein the wafer stage includes a vacuum chuck for vacuum suction of the first wafer. The wafer transfer module according to claim 1, which further includes a wafer ejector, the wafer ejector is arranged under the dicing tape supported by the stage unit and is used to push the first wafer upward to make The first wafer is separated from the dicing tape. The wafer transfer module according to claim 7, which further includes a stage drive unit for moving the stage unit in a horizontal direction so that the first wafer is positioned on the wafer ejector . The wafer transfer module according to claim 1, further comprising: a second swing arm, the second swing arm is arranged above the stage unit and is configured to be rotatable about a second rotation coaxially arranged with the rotation axis Shaft rotation A second pick-up unit, the second pick-up unit is installed on the lower part of the second swing arm and is configured to pick up a second wafer from the dicing tape; a second arm drive unit, the second arm drive unit is used to After the second pick-up unit picks up the second wafer, rotates the second swing arm by a second angle in the second direction; and a second wafer stage arranged to face to rotate in the second direction The second pick-up unit is configured to receive the second wafer from the second pick-up unit. The wafer transfer module according to claim 9, which further includes a second rotation driving unit for rotating the second wafer stage, so that the second wafer is transferred to the second wafer After being placed on the stage, the second wafer faces upward. The wafer transfer module according to claim 9, further comprising: a wafer ejector, the wafer ejector is arranged below the dicing tape supported by the stage unit and used to push any of the wafers upward One to separate the one of the wafers from the dicing tape; and a stage drive unit for moving the stage unit in a horizontal direction so that any one of the wafers is positioned on top of the wafer When the first wafer is transferred to the wafer stage, the stage driving unit moves the stage unit so that the second wafer is positioned on the wafer ejector, and the camera unit detects the Second wafer, and then the second arm driving unit rotates the second swing arm in the first direction, so that the second picking unit is positioned between the second wafer and the camera unit to pick up the second wafer. A wafer bonding device, characterized by comprising: a stage unit for supporting a dicing tape on which a wafer is attached; A swing arm, the swing arm is provided above the stage unit and is configured to be rotatable about a rotation axis provided in a horizontal direction; a pickup unit, the pickup unit is installed on the side surface of the lower part of the swing arm and is configured to Pick up the first wafer from the dicing tape; a camera unit arranged above the first wafer to inspect the first wafer; an arm drive unit for picking up the first wafer by the picking unit The swing arm is then rotated by a first angle in a first direction; a wafer stage, the wafer stage is arranged to face the pick-up unit rotating in the first direction and is configured to receive the first wafer from the pick-up unit A rotation drive unit for rotating the wafer stage so that the first wafer faces upward after the first wafer is transferred to the wafer stage; and a bonding module, the bonding module for Pick up the first wafer from the wafer stage and bond the first wafer on the substrate, wherein when the camera unit detects the first wafer, the arm driving unit rotates the swing arm in the first direction, and After the camera unit detects the first wafer, the arm drive unit rotates the swing arm in a second direction opposite to the first direction, so that the pickup unit is disposed between the first wafer and the camera unit for picking The first wafer. The wafer bonding device according to claim 12, further comprising a second camera unit, the second camera unit being arranged above the wafer stage and used for detecting the first wafer transferred to the wafer stage. The wafer bonding device according to claim 12, wherein the bonding module includes: a substrate stage for supporting the substrate; A bonding head for vacuum suction of the first wafer using vacuum pressure; and a head driving unit for moving the bonding head in horizontal and vertical directions to pick up the first wafer from the wafer stage and the first wafer The wafer is bonded to the substrate. The wafer bonding device according to claim 12, further comprising: a second swing arm, the second swing arm being arranged above the stage unit and configured to be able to surround a second rotation axis coaxially arranged with the rotation axis Rotating; a second picking unit, the second picking unit is installed on the lower part of the second swing arm and configured to pick up a second wafer from the dicing tape; a second arm drive unit, the second arm drive unit is used to After the second wafer is picked up by the second pickup unit, the second swing arm is rotated by a second angle in the second direction; a second wafer stage, the second wafer stage is set to face in the second direction The rotating second pick-up unit is configured to receive the second wafer from the second pick-up unit; a second rotation drive unit, the second rotation drive unit is used to rotate the second wafer stage, so that the second wafer stage After the two wafers are transferred to the second wafer stage, the second wafer faces upward; and a second bonding module for picking up the second wafer from the second wafer stage and the first The two wafers are bonded on the second substrate. The wafer bonding device according to claim 15, further comprising: a wafer ejector, the wafer ejector is arranged below the dicing tape supported by the stage unit and used to push any one of the wafers upward So as to separate the one of the wafers from the dicing tape; and a stage drive unit for moving the stage unit in a horizontal direction so that any one of the wafers is positioned at the top of the wafer On the device, When the first wafer is transferred to the wafer stage, the stage driving unit moves the stage unit so that the second wafer is positioned on the wafer ejector, the camera unit detects the second wafer, and then The second arm driving unit rotates the second swing arm in the first direction so that the second pick-up unit is positioned between the second wafer and the camera unit to pick up the second wafer.

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