[go: up one dir, main page]

TWI799605B - Grinding stone sharpening method and sharpening wafer - Google Patents

Grinding stone sharpening method and sharpening wafer Download PDF

Info

Publication number
TWI799605B
TWI799605B TW108121290A TW108121290A TWI799605B TW I799605 B TWI799605 B TW I799605B TW 108121290 A TW108121290 A TW 108121290A TW 108121290 A TW108121290 A TW 108121290A TW I799605 B TWI799605 B TW I799605B
Authority
TW
Taiwan
Prior art keywords
sharpening
wafer
grinding stone
sharpening method
grinding
Prior art date
Application number
TW108121290A
Other languages
Chinese (zh)
Other versions
TW202000372A (en
Inventor
廣沢俊一郎
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW202000372A publication Critical patent/TW202000372A/en
Application granted granted Critical
Publication of TWI799605B publication Critical patent/TWI799605B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • H10P52/00—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools
    • H10P72/00—
    • H10P72/0428—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW108121290A 2018-06-22 2019-06-19 Grinding stone sharpening method and sharpening wafer TWI799605B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-118723 2018-06-22
JP2018118723A JP7154690B2 (en) 2018-06-22 2018-06-22 Grinding wheel dressing method

Publications (2)

Publication Number Publication Date
TW202000372A TW202000372A (en) 2020-01-01
TWI799605B true TWI799605B (en) 2023-04-21

Family

ID=68968917

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108121290A TWI799605B (en) 2018-06-22 2019-06-19 Grinding stone sharpening method and sharpening wafer

Country Status (4)

Country Link
JP (1) JP7154690B2 (en)
KR (1) KR102708811B1 (en)
CN (1) CN110634737B (en)
TW (1) TWI799605B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7547019B2 (en) * 2021-01-25 2024-09-09 株式会社ディスコ Method for grinding a workpiece
JP7613942B2 (en) * 2021-02-22 2025-01-15 株式会社ディスコ Method for grinding plate-shaped workpieces
JP2024106670A (en) * 2023-01-27 2024-08-08 株式会社Ｓｃｒｅｅｎホールディングス Polishing tool conditioning method, substrate processing method, and substrate processing apparatus

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0796460A (en) * 1993-09-27 1995-04-11 Toyo A Tec Kk Method and device for dressing grinding wheel of grinding machine
JP2005340431A (en) * 2004-05-26 2005-12-08 Renesas Technology Corp Method for manufacturing semiconductor device
JP2006015423A (en) * 2004-06-30 2006-01-19 Disco Abrasive Syst Ltd Vitrified bond grinding wheel sharpening method and sharpening board
US20060111021A1 (en) * 2004-02-05 2006-05-25 Robert Gerber Semiconductor wafer grinder
TW201600240A (en) * 2014-04-16 2016-01-01 Disco Corp Grinding apparatus
JP2017154238A (en) * 2016-03-04 2017-09-07 株式会社ディスコ Grinding equipment
TW201808535A (en) * 2016-06-28 2018-03-16 日商利德股份有限公司 Blade dressing mechanism, cutting apparatus provided with the same, and blade dressing method using blade dressing mechanism
JP2018065236A (en) * 2016-10-21 2018-04-26 株式会社ディスコ Dressing board and method of application thereof

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4760668A (en) * 1986-07-02 1988-08-02 Alfred Schlaefli Surface grinding machine and method
JPH0929628A (en) * 1995-07-18 1997-02-04 Amada Washino Co Ltd Measuring method and device for shape of grinding wheel of grinding device, and machining method using the method
JP4488581B2 (en) * 2000-04-07 2010-06-23 株式会社ディスコ Grinding equipment
JP2002164312A (en) * 2000-11-27 2002-06-07 Sony Corp Back grinding method and back grinding machine
JP4977493B2 (en) * 2007-02-28 2012-07-18 株式会社ディスコ Dressing method and dressing tool for grinding wheel
JP5127270B2 (en) * 2007-03-09 2013-01-23 株式会社ディスコ Dressing method and dresser board
JP2016047561A (en) * 2014-08-27 2016-04-07 株式会社ディスコ Grinding device
JP6424081B2 (en) * 2014-12-12 2018-11-14 株式会社ディスコ Grinding method
JP6803187B2 (en) * 2016-10-05 2020-12-23 株式会社ディスコ Grinding wheel dressing method

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0796460A (en) * 1993-09-27 1995-04-11 Toyo A Tec Kk Method and device for dressing grinding wheel of grinding machine
US20060111021A1 (en) * 2004-02-05 2006-05-25 Robert Gerber Semiconductor wafer grinder
JP2005340431A (en) * 2004-05-26 2005-12-08 Renesas Technology Corp Method for manufacturing semiconductor device
JP2006015423A (en) * 2004-06-30 2006-01-19 Disco Abrasive Syst Ltd Vitrified bond grinding wheel sharpening method and sharpening board
TW201600240A (en) * 2014-04-16 2016-01-01 Disco Corp Grinding apparatus
JP2017154238A (en) * 2016-03-04 2017-09-07 株式会社ディスコ Grinding equipment
TW201808535A (en) * 2016-06-28 2018-03-16 日商利德股份有限公司 Blade dressing mechanism, cutting apparatus provided with the same, and blade dressing method using blade dressing mechanism
JP2018065236A (en) * 2016-10-21 2018-04-26 株式会社ディスコ Dressing board and method of application thereof

Also Published As

Publication number Publication date
TW202000372A (en) 2020-01-01
JP7154690B2 (en) 2022-10-18
KR102708811B1 (en) 2024-09-23
CN110634737B (en) 2024-03-19
JP2019217611A (en) 2019-12-26
KR20200000338A (en) 2020-01-02
CN110634737A (en) 2019-12-31

Similar Documents

Publication Publication Date Title
KR102462248B9 (en) Automatic grinder and grinding method thereof
PL3692109T3 (en) METHOD OF MANUFACTURING ELONGATED ABRASIVE PARTICLES
IL263480B (en) The polishing pad and the polishing method using it
FI3278928T4 (en) Device for grinding and/or polishing cutting tools
EP3532250A4 (en) AGGLOMERATED ABRASIVE GRINDER AND MANUFACTURING METHOD THEREOF
EP3120379A4 (en) Abrasive pad and glass substrate abrading method
SG11202008680WA (en) Slurry, slurry set and polishing method
EP3261114A4 (en) Composition for silicon wafer polishing and polishing method
EP3258483A4 (en) Method for polishing silicon wafer and surface treatment composition
SG11202100589TA (en) Slurry and polishing method
SG10201912536RA (en) Polishing apparatus and polishing member dressing method
HUE052740T2 (en) A method of partially grinding a surface and a grinding apparatus for carrying out the method
EP3991915A4 (en) SYNTHETIC GRINDING STONE
IL249930B (en) Method for smoothing and/or polishing slabs of stone or stone-like material
EP3095556A4 (en) Double-head surface-grinding apparatus and grinding method
EP3297789A4 (en) GRINDER / POLISHING APPARATUS AND GRINDING ELEMENT
TWI799605B (en) Grinding stone sharpening method and sharpening wafer
SG10202008559QA (en) Wafer grinding method
SG11201810647WA (en) Spherical lens surface processing method and spherical lens surface processing apparatus with cup-shaped grinding stone
EP3565862A4 (en) COMPOSITION AND METHOD FOR POLISHING SILICON CARBIDE
PL3826807T3 (en) Separating, grinding and polishing disc, separating device and method of processing workpieces
EP4039766A4 (en) DIAMOND ABRASIVE GRAINS WHICH CAN BE EASILY CRUSHED AND ASSOCIATED MANUFACTURING METHOD
TWI800687B (en) Manufacturing method of grinding wheel
SG11202001700XA (en) Slurry and polishing method
EP3750969A4 (en) SUPER ABRASIVE AND SUPER ABRASIVE DISC