TWI608783B - Extending device - Google Patents
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- TWI608783B TWI608783B TW105127483A TW105127483A TWI608783B TW I608783 B TWI608783 B TW I608783B TW 105127483 A TW105127483 A TW 105127483A TW 105127483 A TW105127483 A TW 105127483A TW I608783 B TWI608783 B TW I608783B
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/185—Mounting of expansion boards
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Description
本發明係關於一種擴充裝置,特別是有關於一種內建有鎖固件而可裝設於其他裝置且內建有間隔部而可避免短路問題之擴充裝置。BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to an expansion device, and more particularly to an expansion device having a built-in fastener and being mountable to other devices and having a spacer therein to avoid short circuit problems.
隨著資訊化的快速發展,各種電子產品的應用需求多樣化,故於電子產品之基礎架構上,常會有增加或置換各種功能之需求。而且,於使用者於購入電子產品後亦具有增加或變換電子產品之功能之企圖。因此,電子產品的設計者會預留空間及連接元件,以供後續之擴充需求。With the rapid development of information technology, the application requirements of various electronic products are diversified. Therefore, in the infrastructure of electronic products, there is often a need to increase or replace various functions. Moreover, after the user purchases the electronic product, the user also has an attempt to increase or change the function of the electronic product. Therefore, designers of electronic products will reserve space and connect components for subsequent expansion of demand.
目前欲擴充電子產品之功能時,會將具有擴充功能之擴充卡裝設於電子產品之預留空間內且與連接元件相連接。具體為另外取得螺栓等元件及螺絲起子等工具,將螺栓對準擴充卡上的孔,再令螺絲起子對準螺栓,以將擴充卡鎖固於電子產品內之電路板。然而,螺栓對準或鎖固的過程中,會增加使用者所耗費的心力,且螺栓可能會有掉落的問題,進而導致使用者的困擾及工時的延宕。而且,還通常需要另外加裝支撐柱等元件,以增加擴充卡與電子產品內之電路板之距離,以避免二者發生非預期的短路問題。若是遺失此些元件則無法順利進行功能擴充,因而往往造成擴充電子產品功能時的不便利。When expanding the functions of electronic products, the expansion card with expansion function is installed in the reserved space of the electronic product and connected to the connecting component. Specifically, another tool such as a bolt or a screwdriver is obtained, and the bolt is aligned with the hole in the expansion card, and the screwdriver is aligned with the bolt to lock the expansion card to the circuit board in the electronic product. However, during the process of aligning or locking the bolt, the user's effort is increased, and the bolt may be dropped, which may cause trouble to the user and delay in working hours. Moreover, it is usually necessary to additionally add components such as support columns to increase the distance between the expansion card and the circuit board in the electronic product to avoid unintended short-circuit problems between the two. If these components are lost, the function expansion cannot be performed smoothly, which often causes inconvenience in expanding the functions of the electronic products.
有鑑於以上的問題,本發明提出一種擴充裝置,藉由內建之鎖固件以便裝設於其他裝置,且藉由內建之間隔部而避免短路問題。In view of the above problems, the present invention provides an expansion device that is installed in other devices by built-in fasteners and avoids short circuit problems by built-in spacers.
本發明之一實施例提出一種擴充裝置,包含一支撐件、一鎖固件及一基板。支撐件包含相連之裝設部及間隔部。鎖固件可活動地貫穿裝設部及間隔部。基板具有表面,基板固設於支撐件之裝設部,且支撐件之間隔部凸出於表面。An embodiment of the present invention provides an expansion device including a support member, a lock, and a substrate. The support member includes a connected mounting portion and a spacer portion. The lock member is movable through the mounting portion and the spacer portion. The substrate has a surface, the substrate is fixed to the mounting portion of the support member, and the spacing portion of the support member protrudes from the surface.
根據本發明之實施例之擴充裝置,藉由內建之鎖固件而便於將擴充裝置裝設於其他電子產品中之如主機板之元件,藉以避免其他鎖固用元件於安裝時需要對準所耗費的心力,以及避免其他鎖固用元件掉落時所造成工時延宕等之不便利。而且,藉由內建之間隔部凸出於表面,而可直接避免基板之電路與如主機板之電路之間發生非預期的短路問題。The expansion device according to the embodiment of the present invention facilitates mounting the expansion device in a component such as a motherboard of another electronic product by means of a built-in locker, so as to avoid alignment of other locking components during installation. The inconvenience of using the effort and avoiding the delays caused by the dropping of other locking components. Moreover, by the built-in spacer protruding from the surface, an unexpected short circuit problem between the circuit of the substrate and the circuit such as the motherboard can be directly avoided.
以上之關於本發明內容之說明及以下之實施方式之說明係用以示範與解釋本發明之精神與原理,並且提供本發明之專利申請範圍更進一步之解釋。The above description of the present invention and the following description of the embodiments of the present invention are intended to illustrate and explain the spirit and principles of the invention.
以下在實施方式中詳細敘述本發明之實施例之詳細特徵以及優點,其內容足以使任何本領域中具通常知識者了解本發明之實施例之技術內容並據以實施,且根據本說明書所揭露之內容、申請專利範圍及圖式,任何本領域中具通常知識者可輕易地理解本發明相關之目的及優點。以下之實施例係進一步詳細說明本發明之觀點,但非以任何觀點限制本發明之範疇。The detailed features and advantages of the embodiments of the present invention are set forth in the Detailed Description of the Detailed Description. The objects and advantages of the present invention can be readily understood by those of ordinary skill in the art in the <RTIgt; The following examples are intended to describe the present invention in further detail, but are not intended to limit the scope of the invention.
於本說明書之所謂的示意圖中,由於用以說明而可有其尺寸、比例及角度等較為誇張的情形,但並非用以限定本發明。於未違背本發明要旨的情況下能夠有各種變更。說明中之描述之「上」可表示「懸置於上方」或「接觸於上表面」。此外,說明書中所描述之「上側」、「下側」、「上方」、「下方」等用語,為便於說明,而非用以限制本發明。說明書中所描述之「實質上」可表示容許製造時之公差所造成的偏離。In the so-called schematic diagrams of the present specification, the dimensions, ratios, angles, and the like may be exaggerated, but are not intended to limit the present invention. Various changes can be made without departing from the gist of the invention. The "upper" in the description may mean "overhanging" or "contacting the upper surface". In addition, the terms "upper side", "lower side", "above", "below" and the like are used in the description for convenience of description and are not intended to limit the invention. "Substantially" as used in the specification may mean a deviation caused by tolerances at the time of manufacture.
請參照圖1、圖2及圖3。圖1繪示依照本發明之一實施例之擴充裝置10及另一實施例之擴充裝置10’裝設於主機板20之立體示意圖。圖2繪示圖1之擴充裝置10及主機板20之立體分解示意圖。圖3繪示圖1之擴充裝置10於尚未鎖固於主機板20時之側視剖面示意圖。於本實施例中,擴充裝置10可包含支撐件11、鎖固件12、基板13及彈性件14。Please refer to FIG. 1 , FIG. 2 and FIG. 3 . 1 is a perspective view of an expansion device 10 and an expansion device 10' of another embodiment mounted on a motherboard 20 in accordance with an embodiment of the present invention. 2 is a perspective exploded view of the expansion device 10 and the motherboard 20 of FIG. 1 . 3 is a side cross-sectional view of the expansion device 10 of FIG. 1 when it has not been locked to the motherboard 20. In the present embodiment, the expansion device 10 can include a support member 11 , a lock member 12 , a base plate 13 , and an elastic member 14 .
支撐件11包含相連之裝設部111、間隔部112及支撐部113。裝設部111具有相連之第一段1111及第二段1112。第一段1111之外徑可大於第二段1112之外徑。間隔部112與第一段1111相連,且間隔部112實質上沿著方向D朝向裝設部111。支撐部113圍繞於間隔部112之周圍,且相鄰於第一段1111。The support member 11 includes a connecting portion 111, a spacer portion 112, and a support portion 113. The mounting portion 111 has a first segment 1111 and a second segment 1112 that are connected. The outer diameter of the first segment 1111 can be greater than the outer diameter of the second segment 1112. The spacer 112 is connected to the first segment 1111, and the spacer 112 faces the mounting portion 111 substantially along the direction D. The support portion 113 surrounds the periphery of the spacer portion 112 and is adjacent to the first segment 1111.
支撐件11具有貫通孔11a。貫通孔11a具有沿著方向D排列之第一空間11a1及第二空間11a2。第一空間11a1之內徑大於第二空間11a2之內徑。第一空間11a1朝向第二空間11a2之方向D實質上與間隔部112朝向裝設部111之方向D相同。The support member 11 has a through hole 11a. The through hole 11a has a first space 11a1 and a second space 11a2 which are arranged along the direction D. The inner diameter of the first space 11a1 is larger than the inner diameter of the second space 11a2. The direction D of the first space 11a1 toward the second space 11a2 is substantially the same as the direction D of the partition portion 112 toward the mounting portion 111.
鎖固件12可活動地貫穿支撐件11之裝設部111及間隔部112。鎖固件12包含相對之螺紋部121及頭部122,且包含連接螺紋部121及頭部122之連接部123。支撐件11之貫通孔11a之第一空間11a1之內徑可大於螺紋部121之外徑。螺紋部121之外徑可大於支撐件11之貫通孔11a之第二空間11a2之內徑。支撐件11之貫通孔11a之第二空間11a2之內徑可大於連接部123之內徑。頭部122之外徑可大於支撐件11之貫通孔11a之第二空間11a2之內徑。The fastener 12 is movably penetrated through the mounting portion 111 of the support member 11 and the spacer portion 112. The locking member 12 includes a threaded portion 121 and a head portion 122, and includes a connecting portion 123 connecting the threaded portion 121 and the head portion 122. The inner diameter of the first space 11a1 of the through hole 11a of the support member 11 may be larger than the outer diameter of the thread portion 121. The outer diameter of the threaded portion 121 may be larger than the inner diameter of the second space 11a2 of the through hole 11a of the support member 11. The inner diameter of the second space 11a2 of the through hole 11a of the support member 11 may be larger than the inner diameter of the connecting portion 123. The outer diameter of the head portion 122 may be larger than the inner diameter of the second space 11a2 of the through hole 11a of the support member 11.
其中,螺紋部121朝向頭部122之方向D實質上與間隔部112朝向裝設部111之方向D相同。螺紋部121之至少部分可活動地位於支撐件11之貫通孔11a之第一空間11a1之內,或者沿相反於方向D之方向凸出於支撐件11之間隔部112。連接部123之至少部分可活動地位於支撐件11之貫通孔11a之第二空間11a2內。頭部122可位於支撐件11之貫通孔11a以外。頭部122之外周可具有防滑紋路,以供使用者藉由握住頭部122而旋轉整個鎖固件12。The direction D of the threaded portion 121 toward the head portion 122 is substantially the same as the direction D of the partition portion 112 toward the mounting portion 111. At least a portion of the threaded portion 121 is movably located within the first space 11a1 of the through hole 11a of the support member 11 or protrudes from the spacing portion 112 of the support member 11 in a direction opposite to the direction D. At least a portion of the connecting portion 123 is movably located in the second space 11a2 of the through hole 11a of the support member 11. The head portion 122 may be located outside the through hole 11a of the support member 11. The outer circumference of the head 122 may have an anti-slip texture for the user to rotate the entire lock 12 by holding the head 122.
基板13具有表面13a。而且,基板13之一側設置有電性插接部131。基板13可藉由支撐件11之裝設部111嵌設於基板13之方式,而設置於支撐件11之裝設部111。支撐件11之裝設部111之第一段1111較第二段1112接近基板13之表面13a。支撐件11之間隔部112則可凸出於基板13之表面13a。支撐件11之支撐部113可接觸於基板13之表面13a,而可對基板13提供更進一步之支撐力。鎖固件12可藉由貫穿支撐件11而貫穿基板13。The substrate 13 has a surface 13a. Further, an electrical insertion portion 131 is provided on one side of the substrate 13. The substrate 13 can be disposed on the mounting portion 111 of the support member 11 by the mounting portion 111 of the support member 11 being embedded in the substrate 13 . The first segment 1111 of the mounting portion 111 of the support member 11 is closer to the surface 13a of the substrate 13 than the second segment 1112. The spacer 112 of the support member 11 can then protrude from the surface 13a of the substrate 13. The support portion 113 of the support member 11 can contact the surface 13a of the substrate 13 to provide a further supporting force to the substrate 13. The fastener 12 can penetrate the substrate 13 by penetrating the support member 11.
於本實施例中,支撐件11之裝設部111因其高度H可大於基板13之厚度T,而可貫穿基板13,但不限於此。於其他實施例中,支撐件11之裝設部111因其高度H可小於基板13之厚度T,而可不貫穿基板13。In the present embodiment, the mounting portion 111 of the support member 11 can penetrate the substrate 13 because its height H can be greater than the thickness T of the substrate 13, but is not limited thereto. In other embodiments, the mounting portion 111 of the support member 11 may be smaller than the thickness T of the substrate 13 because the height H may not penetrate the substrate 13.
於本實施例中,基板13與支撐件11之間可藉由表面貼焊技術(surface mounting technology,SMT)之方式而彼此固定,表面貼焊技術中之焊料可位於基板13與支撐件11之裝設部111之第一段1111之間,亦可位於基板13與支撐件11之間隔部112之間,或亦可位於基板13與支撐件11之支撐部113之間。但不限於此。於其他實施例中,可藉由支撐件11之裝設部111之第一段1111鎖固於基板13之方式,將基板13固定於支撐件11。In this embodiment, the substrate 13 and the support member 11 can be fixed to each other by surface mounting technology (SMT). The solder in the surface soldering technology can be located on the substrate 13 and the support member 11. The first segment 1111 of the mounting portion 111 may be located between the substrate 13 and the spacer 112 of the support member 11 or may be located between the substrate 13 and the support portion 113 of the support member 11. But it is not limited to this. In other embodiments, the substrate 13 can be fixed to the support 11 by the first segment 1111 of the mounting portion 111 of the support member 11 being locked to the substrate 13 .
另外,於本實施例中,彈性件14可為螺旋彈簧。鎖固件12之連接部123可貫穿彈性件14。彈性件14之上端可抵靠於鎖固件12之頭部122。藉由裝設部111之第一段1111之外徑大於第二段1112之外徑,彈性件14之至少部分可環繞裝設部111之第二段1112,且彈性件14之下端可抵靠於裝設部111之第一段1111。彈性件14可常態使鎖固件12之頭部122遠離基板13之表面13a,且使鎖固件12之螺紋部121往支撐件11之貫通孔11a之第一空間11a1內收攏。當鎖固件12之頭部122朝向並接近基板13之表面13a時,鎖固件12之螺紋部121可沿相反於方向D之方向凸出於支撐件11之間隔部112,且彈性件14會受到壓縮。當鎖固件12之頭部122愈接近基板13之表面13a,則彈性件14之壓縮程度愈大。彈性件14之設置可使支撐件11與鎖固件12之間較為穩定而不易於彼此撞擊,但不限於此。於其他實施例中,亦可省略設置彈性件14。In addition, in the embodiment, the elastic member 14 may be a coil spring. The connecting portion 123 of the fastener 12 can penetrate the elastic member 14. The upper end of the resilient member 14 can abut the head 122 of the fastener 12. The outer portion of the first portion 1111 of the mounting portion 111 is larger than the outer diameter of the second portion 1112, and at least a portion of the elastic member 14 can surround the second portion 1112 of the mounting portion 111, and the lower end of the elastic member 14 can abut The first segment 1111 of the mounting portion 111. The elastic member 14 can normally move the head 122 of the lock 12 away from the surface 13a of the substrate 13 and cause the threaded portion 121 of the lock 12 to be gathered into the first space 11a1 of the through hole 11a of the support member 11. When the head 122 of the locking member 12 faces and approaches the surface 13a of the substrate 13, the threaded portion 121 of the locking member 12 can protrude from the spacing portion 112 of the support member 11 in a direction opposite to the direction D, and the elastic member 14 is subjected to compression. When the head 122 of the lock 12 is closer to the surface 13a of the substrate 13, the degree of compression of the elastic member 14 is greater. The arrangement of the elastic members 14 makes it possible to stabilize the support member 11 and the lock member 12 without being easily collided with each other, but is not limited thereto. In other embodiments, the provision of the elastic member 14 may also be omitted.
另如圖1所示,另一實施例之擴充裝置10’與擴充裝置10之差異,在於擴充裝置10’之基板13’之尺寸規格相異於擴充裝置10之基板13之尺寸規格。As shown in Fig. 1, the expansion device 10' of another embodiment differs from the expansion device 10 in that the size of the substrate 13' of the expansion device 10' is different from the size of the substrate 13 of the expansion device 10.
再者,如圖1、圖2及圖3所示,擴充裝置10及擴充裝置10’可裝設於主機板20。主機板20包含電路板21、插槽22、多個第一螺柱231及多個第二螺柱232。插槽22設置且電性連接於電路板21之上表面21a。第一螺柱231及第二螺柱232可自電路板21之上表面21a嵌設於電路板21之開孔210。第一螺柱231及第二螺柱232可對應於不同規格之擴充裝置10及擴充裝置10’。Furthermore, as shown in Figs. 1, 2 and 3, the expansion device 10 and the expansion device 10' can be mounted on the motherboard 20. The motherboard 20 includes a circuit board 21, a slot 22, a plurality of first studs 231, and a plurality of second studs 232. The slot 22 is disposed and electrically connected to the upper surface 21a of the circuit board 21. The first stud 231 and the second stud 232 can be embedded in the opening 210 of the circuit board 21 from the upper surface 21a of the circuit board 21. The first stud 231 and the second stud 232 can correspond to different sizes of the expansion device 10 and the expansion device 10'.
請參照圖2、圖3及圖4,圖4繪示圖1之擴充裝置10於鎖固於主機板20時之側視剖面示意圖。電性插接部131可插設於插槽22以電性連接擴充裝置10及主機板20,再平放至支撐件11之間隔部112接觸於主機板20之第一螺柱231。藉由間隔部112隔開擴充裝置10之基板13及主機板20之電路板21,以避免擴充裝置10之基板13與主機板20之電路板21之間發生非預期之短路之問題。2, FIG. 3 and FIG. 4, FIG. 4 is a side cross-sectional view showing the expansion device 10 of FIG. 1 locked to the motherboard 20. The electrical plug-in portion 131 can be inserted into the slot 22 to electrically connect the expansion device 10 and the motherboard 20 , and then the flat portion 112 of the support member 11 is placed in contact with the first stud 231 of the motherboard 20 . The substrate 13 of the expansion device 10 and the circuit board 21 of the motherboard 20 are separated by the spacer 112 to avoid an unexpected short circuit between the substrate 13 of the expansion device 10 and the circuit board 21 of the motherboard 20.
接下來可如圖3及圖4所示,藉由旋轉鎖固件12之頭部122,而帶動旋轉鎖固件12之螺紋部121與第一螺柱231之螺孔231a螺合,藉以令鎖固件12鎖固於第一螺柱231,進而將擴充裝置10裝設於主機板20。擴充裝置10藉由內建之鎖固件12,而可便於將擴充裝置10裝設於主機板20,藉以避免其他鎖固用元件於安裝時需要對準所耗費的心力,以及避免其他鎖固用元件掉落時所造成工時延宕等之不便利。Next, as shown in FIG. 3 and FIG. 4, the screw portion 121 of the rotary lock 12 is screwed with the screw hole 231a of the first stud 231 by rotating the head 122 of the lock 12, thereby making the lock. 12 is locked to the first stud 231, and the expansion device 10 is mounted on the motherboard 20. The expansion device 10 can be easily mounted on the motherboard 20 by the built-in fastener 12, so as to avoid the need for other locking components to be aligned during installation, and to avoid other locking. It is inconvenient to delay the work caused by the component falling.
另請參照圖5,繪示圖1之擴充裝置10於鎖固於另一主機板20’時之側視剖面示意圖。主機板20’之第一螺柱231亦可自電路板21之下表面21b嵌設於電路板21之開孔210。因此,亦可藉由旋轉鎖固件12而帶動旋轉鎖固件12之螺紋部121與第一螺柱231之螺孔231a螺合,藉以令鎖固件12鎖固於第一螺柱231,進而將擴充裝置10裝設於主機板20’。Referring to FIG. 5, a side cross-sectional view of the expansion device 10 of FIG. 1 locked to another motherboard 20' is shown. The first stud 231 of the motherboard 20' may also be embedded in the opening 210 of the circuit board 21 from the lower surface 21b of the circuit board 21. Therefore, the screw portion 121 of the rotary lock 12 can be screwed with the screw hole 231a of the first stud 231 by rotating the lock 12, so that the lock 12 is locked to the first stud 231, and then the expansion is expanded. The device 10 is mounted on the motherboard 20'.
綜上所述,本發明之實施例之擴充裝置,能夠藉由內建之鎖固件而便於將擴充裝置裝設於其他電子產品中之如主機板之元件,藉以避免其他鎖固用元件於安裝時需要對準所耗費的心力,以及避免其他鎖固用元件掉落時所造成工時延宕等之不便利。而且,藉由內建之間隔部凸出於表面,而可直接避免基板之電路與如主機板之電路之間發生非預期的短路問題。In summary, the expansion device of the embodiment of the present invention can facilitate the installation of the expansion device in other electronic products, such as the components of the motherboard, by using the built-in lock firmware, so as to avoid other locking components from being installed. It is necessary to align the effort and avoid the inconvenience of working delay caused by other locking components falling. Moreover, by the built-in spacer protruding from the surface, an unexpected short circuit problem between the circuit of the substrate and the circuit such as the motherboard can be directly avoided.
雖然本發明以前述之實施例揭露如上,然其並非用以限定本發明。在不脫離本發明之精神和範圍內,所為之更動與潤飾,均屬本發明之專利保護範圍。關於本發明所界定之保護範圍請參考所附之申請專利範圍。Although the present invention has been disclosed above in the foregoing embodiments, it is not intended to limit the invention. It is within the scope of the invention to be modified and modified without departing from the spirit and scope of the invention. Please refer to the attached patent application for the scope of protection defined by the present invention.
10、10’‧‧‧擴充裝置10, 10'‧‧‧ expansion device
11‧‧‧支撐件11‧‧‧Support
11a‧‧‧貫通孔11a‧‧‧through hole
11a1‧‧‧第一空間11a1‧‧‧First space
11a2‧‧‧第二空間11a2‧‧‧Second space
111‧‧‧裝設部111‧‧‧Installation Department
1111‧‧‧第一段1111‧‧‧ first paragraph
1112‧‧‧第二段1112‧‧‧ second paragraph
112‧‧‧間隔部112‧‧‧Interval
113‧‧‧支撐部113‧‧‧Support
12‧‧‧鎖固件12‧‧‧Locker
121‧‧‧螺紋部121‧‧‧Threading Department
122‧‧‧頭部122‧‧‧ head
123‧‧‧連接部123‧‧‧Connecting Department
13、13’‧‧‧基板13, 13'‧‧‧ substrate
13a‧‧‧表面13a‧‧‧Surface
131‧‧‧電性插接部131‧‧‧Electrical plug-in
14‧‧‧彈性件14‧‧‧Flexible parts
20、20’‧‧‧主機板20, 20’‧‧‧ motherboard
21‧‧‧電路板21‧‧‧ boards
21a‧‧‧上表面21a‧‧‧Upper surface
21b‧‧‧下表面21b‧‧‧ lower surface
210‧‧‧開孔210‧‧‧Opening
22‧‧‧插槽22‧‧‧Slots
231‧‧‧第一螺柱231‧‧‧First stud
231a‧‧‧螺孔231a‧‧‧ screw holes
232‧‧‧第二螺柱232‧‧‧Second stud
D‧‧‧方向D‧‧‧ Direction
H‧‧‧高度H‧‧‧ Height
T‧‧‧厚度T‧‧‧ thickness
圖1繪示依照本發明之一實施例之擴充裝置裝設於主機板之立體示意圖。 圖2繪示圖1之擴充裝置及主機板之立體分解示意圖。 圖3繪示圖1之擴充裝置於尚未鎖固於主機板時之側視剖面示意圖。 圖4繪示圖1之擴充裝置於鎖固於主機板時之側視剖面示意圖。 圖5繪示圖1之擴充裝置於鎖固於另一主機板時之側視剖面示意圖。1 is a perspective view of an expansion device mounted on a motherboard according to an embodiment of the invention. 2 is a perspective exploded view of the expansion device and the motherboard of FIG. 1 . 3 is a side cross-sectional view of the expansion device of FIG. 1 when it has not been locked to the motherboard. 4 is a side cross-sectional view showing the expansion device of FIG. 1 locked to a motherboard. FIG. 5 is a side cross-sectional view showing the expansion device of FIG. 1 locked to another motherboard.
10‧‧‧擴充裝置 10‧‧‧Expansion device
11‧‧‧支撐件 11‧‧‧Support
12‧‧‧鎖固件 12‧‧‧Locker
13‧‧‧基板 13‧‧‧Substrate
131‧‧‧電性插接部 131‧‧‧Electrical plug-in
20‧‧‧主機板 20‧‧‧ motherboard
21‧‧‧電路板 21‧‧‧ boards
21a‧‧‧上表面 21a‧‧‧Upper surface
22‧‧‧插槽 22‧‧‧Slots
231‧‧‧第一螺柱 231‧‧‧First stud
232‧‧‧第二螺柱 232‧‧‧Second stud
Claims (8)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ??201610629694.4 | 2016-08-02 | ||
| CN201610629694.4A CN107678505B (en) | 2016-08-02 | 2016-08-02 | Expansion device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI608783B true TWI608783B (en) | 2017-12-11 |
| TW201806463A TW201806463A (en) | 2018-02-16 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105127483A TWI608783B (en) | 2016-08-02 | 2016-08-26 | Extending device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN107678505B (en) |
| TW (1) | TWI608783B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106658950B (en) * | 2017-01-24 | 2019-11-26 | 惠州市德赛西威汽车电子股份有限公司 | With the pcb board of top pillar, its installation method and vehicle-mounted camera between plate |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM381097U (en) * | 2009-11-18 | 2010-05-21 | Inventec Corp | Electronic device |
| TWM456672U (en) * | 2012-12-27 | 2013-07-01 | Giga Byte Tech Co Ltd | Circuit board and fixing device |
| TW201542050A (en) * | 2013-11-22 | 2015-11-01 | Samtec Inc | Two-piece unmate-assist standoff |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2901797Y (en) * | 2006-01-20 | 2007-05-16 | 英业达股份有限公司 | Mount |
| CN201557349U (en) * | 2009-11-27 | 2010-08-18 | 英业达股份有限公司 | Electronic device |
| CN104679166A (en) * | 2013-11-28 | 2015-06-03 | 英业达科技有限公司 | Server |
-
2016
- 2016-08-02 CN CN201610629694.4A patent/CN107678505B/en active Active
- 2016-08-26 TW TW105127483A patent/TWI608783B/en active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM381097U (en) * | 2009-11-18 | 2010-05-21 | Inventec Corp | Electronic device |
| TWM456672U (en) * | 2012-12-27 | 2013-07-01 | Giga Byte Tech Co Ltd | Circuit board and fixing device |
| TW201542050A (en) * | 2013-11-22 | 2015-11-01 | Samtec Inc | Two-piece unmate-assist standoff |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201806463A (en) | 2018-02-16 |
| CN107678505A (en) | 2018-02-09 |
| CN107678505B (en) | 2019-11-01 |
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