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TWI648117B - Machining apparatus - Google Patents

Machining apparatus Download PDF

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TWI648117B
TWI648117B TW106144641A TW106144641A TWI648117B TW I648117 B TWI648117 B TW I648117B TW 106144641 A TW106144641 A TW 106144641A TW 106144641 A TW106144641 A TW 106144641A TW I648117 B TWI648117 B TW I648117B
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Taiwan
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annular shaped
shaped beam
parallel annular
processing device
interference
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TW106144641A
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Chinese (zh)
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TW201927451A (en
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周府隆
黃建融
胡平浩
林于中
李閔凱
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財團法人工業技術研究院
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Abstract

一種加工裝置,包括整型模組以及聚焦元件。整型模組用以將入射光束調控成平行環形整型光束。聚焦元件配置於整型模組旁,聚焦元件用以使平行環形整型光束之光軸軸向上產生干涉行為,以形成具抑制高階項能量的干涉光束。 A processing device includes an integral module and a focusing component. The integral module is used to regulate the incident beam into a parallel circular shaped beam. The focusing component is disposed beside the integer module, and the focusing component is configured to generate an interference behavior in the axial direction of the optical axis of the parallel annular shaped beam to form an interference beam having a high-order energy suppression.

Description

加工裝置 Processing device

本發明是有關於一種加工裝置,且特別是有關於一種能消除貝塞爾(Bessel)光束高階項能量的加工裝置。 This invention relates to a processing apparatus, and more particularly to a processing apparatus that eliminates the high order energy of a Bessel beam.

由於各種電子元件(例如電晶體,二極體,電阻等等)的整合密度不斷的提升,使得半導體工業連續快速地成長。為提升大型積體電路晶片的性能,並維持其低消耗功率,三維積體電路結構(Three-Dimensional Integrated Circuit,3D IC)為一較可靠之解決方案。 The semiconductor industry continues to grow rapidly due to the increasing integration density of various electronic components (such as transistors, diodes, resistors, etc.). In order to improve the performance of large integrated circuit chips and maintain their low power consumption, Three-Dimensional Integrated Circuit (3D IC) is a more reliable solution.

為因應3D IC之需求,玻璃穿孔(Through Glass Via,TGV)製程較習用技術之矽穿孔(Through Silicon Via,TSV)製程有較多優勢。在TGV製程中,先將玻璃經由雷射改質的方式,來提高照射區與未照射區之蝕刻選擇比,藉此有效形成高深寬比之穿孔(Via)孔洞。 In order to meet the needs of 3D ICs, the Through Glass Via (TGV) process has many advantages over the conventional technology of Through Silicon Via (TSV). In the TGV process, the glass is first modified by laser to improve the etching selectivity ratio between the irradiated area and the unirradiated area, thereby effectively forming a Via having a high aspect ratio.

根據貝塞爾(Bessel)光束傳播理論,可在數個釐米傳播距離以內均維持數個微米的光點大小(Spot size),有業者欲利用貝塞爾(Bessel)光束之特性以達成高深寬比之穿孔(Via)孔洞。 According to Bessel's beam propagation theory, it is possible to maintain a spot size of several micrometers within a few centimeters of propagation distance. Some people want to use the characteristics of the Bessel beam to achieve high depth and wide. Compared to the Via hole.

然而,貝塞爾(Bessel)光束普遍於高階項能量有不均勻的問題,造成玻璃表面產生不均勻的改質,導致蝕刻後穿孔的真圓度不高。因此,如何改良並能提供一種『加工裝置』來避免上述所遭遇到的問題,係 業界所亟待解決之課題。 However, the Bessel beam generally has a problem of unevenness in the high-order energy, resulting in uneven modification of the glass surface, resulting in low roundness of the perforation after etching. Therefore, how to improve and provide a "processing device" to avoid the problems encountered above, The problem that the industry needs to solve.

本發明提供一種加工裝置,能抑制貝塞爾(Bessel)光束之高階項能量,以達到高真圓度之製程結構。 The invention provides a processing device capable of suppressing high-order energy of a Bessel beam to achieve a high roundness process structure.

本發明提出一種加工裝置,包括一整型模組以及一聚焦元件。整型模組位於一入射光束的傳遞路徑上,整型模組用以將入射光束調控成一平行環形整型光束。聚焦元件配置於整型模組旁,聚焦元件位於平行環形整型光束的傳遞路徑上,聚焦元件用以使平行環形整型光束之光軸軸向上產生干涉行為,以形成具抑制高階項能量的一干涉光束。 The invention provides a processing apparatus comprising an integral module and a focusing element. The integer module is located on the transmission path of an incident beam, and the integer module is used to regulate the incident beam into a parallel annular shaped beam. The focusing component is disposed beside the integer module, and the focusing component is located on the transmission path of the parallel annular shaped beam, and the focusing component is configured to generate an interference behavior in the axial direction of the optical axis of the parallel annular shaping beam to form a device for suppressing high-order energy. An interference beam.

在一實施例中,上述整型模組用以調整該入射光束的能量分布。 In an embodiment, the integer module is configured to adjust an energy distribution of the incident beam.

在一實施例中,上述整型模組係選自以至少一錐透鏡、至少一球面透鏡、至少一非球面透鏡與至少一繞射元件所組成的群組。 In one embodiment, the integral module is selected from the group consisting of at least one cone lens, at least one spherical lens, at least one aspheric lens, and at least one diffractive element.

在一實施例中,上述平行環形整型光束的內徑之內環形光束與光軸具有一第一夾角,平行環形整型光束的外徑之外環形光束與光軸具有一第二夾角,第一夾角與第二夾角的環形內外光軸夾角比值介於0.42至1之間。 In one embodiment, the annular beam within the inner diameter of the parallel annular shaped beam has a first angle with the optical axis, and the annular beam has a second angle to the optical axis outside the outer diameter of the parallel annular shaped beam. The angle between the angle of the annular inner and outer optical axes of the second angle and the second angle is between 0.42 and 1.

在一實施例中,上述平行環形整型光束的內徑尺寸範圍介於0.5mm至1mm之間。 In one embodiment, the parallel annular shaped beam has an inner diameter dimension ranging from 0.5 mm to 1 mm.

在一實施例中,上述平行環形整型光束的外徑尺寸範圍介於2.5mm至6mm之間。 In one embodiment, the parallel annular shaped beam has an outer diameter dimension ranging from 2.5 mm to 6 mm.

在一實施例中,上述平行環形整型光束的寬度尺寸範圍介於 2mm至5mm之間。 In an embodiment, the parallel annular shaped beam has a width dimension ranging between Between 2mm and 5mm.

在一實施例中,上述平行環形整型光束平行進入聚焦元件。 In one embodiment, the parallel annular shaped beam of light enters the focusing element in parallel.

在一實施例中,上述聚焦元件為一具球差之透鏡。 In one embodiment, the focusing element is a spherical aberration lens.

在一實施例中,上述具球差之透鏡為平凸或雙凸球面鏡。 In an embodiment, the spherical aberration lens is a plano-convex or double convex spherical mirror.

在一實施例中,上述干涉光束中的一階能量峰值小於零階能量峰值的10%。 In an embodiment, the first order energy peak in the interference beam is less than 10% of the zeroth order energy peak.

在一實施例中,上述加工裝置更包括一倍率調整模組,倍率調整模組配置於聚焦元件旁,倍率調整模組位於干涉光束的傳遞路徑上,倍率調整模組用以改變干涉光束之直徑大小或景深長短。 In an embodiment, the processing device further includes a magnification adjustment module, the magnification adjustment module is disposed beside the focusing component, the magnification adjustment module is located on the transmission path of the interference beam, and the magnification adjustment module is configured to change the diameter of the interference beam. Size or depth of field.

在一實施例中,上述加工裝置更包括一光源,光源用以產生入射光束。 In an embodiment, the processing device further includes a light source for generating an incident light beam.

在一實施例中,上述光源為雷射光源或具同調性之光源。 In an embodiment, the light source is a laser light source or a light source having a homology.

基於上述,在本發明提出的加工裝置中,透過整型模組改變入射光束之能量分布狀態所形成的平行環形整型光束,藉此改變平行環形整型光束經過聚焦元件後的干涉狀態,以形成具抑制高階項能量的一干涉光束,干涉光束中的一階能量峰值小於零階能量峰值的10%,以達到抑制貝塞爾(Bessel)光束之高階項能量,進而改善干涉光束的加工真圓度,使得本發明可得到高真圓度佳的加工結果。 Based on the above, in the processing device proposed by the present invention, the parallel annular shaped beam formed by changing the energy distribution state of the incident beam is transmitted through the integer module, thereby changing the interference state of the parallel annular shaped beam after passing through the focusing element, Forming an interference beam with a high-order energy suppression, the first-order energy peak in the interference beam is less than 10% of the zero-order energy peak, so as to suppress the high-order energy of the Bessel beam, thereby improving the processing of the interference beam. The roundness allows the present invention to obtain a processing result with high roundness.

為讓本發明能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。 In order to make the invention more apparent, the following detailed description of the embodiments and the accompanying drawings are set forth below.

100、200‧‧‧加工裝置 100, 200‧‧‧ processing equipment

110‧‧‧光源 110‧‧‧Light source

120、320、420‧‧‧整型模組 120, 320, 420‧‧‧ integral modules

122‧‧‧第一錐透鏡 122‧‧‧First cone lens

124‧‧‧第二錐透鏡 124‧‧‧Second cone lens

130‧‧‧聚焦元件 130‧‧‧ Focusing components

322‧‧‧錐透鏡 322‧‧‧ cone lens

324‧‧‧球面透鏡 324‧‧‧Spherical lens

422‧‧‧繞射元件 422‧‧‧Diffractive components

424‧‧‧球面透鏡 424‧‧‧Spherical lens

240‧‧‧倍率調整模組 240‧‧‧ magnification adjustment module

P1‧‧‧入射光束 P1‧‧‧ incident beam

P2‧‧‧平行環形整型光束 P2‧‧‧ parallel annular shaped beam

P21‧‧‧內環形光束 Ring beam in P21‧‧

P22‧‧‧外環形光束 P22‧‧‧Outer ring beam

P3‧‧‧干涉光束 P3‧‧‧ interference beam

P4‧‧‧加工光束 P4‧‧‧Processing beam

L‧‧‧光軸 L‧‧‧ optical axis

h1‧‧‧平行環形整型光束的內徑 h 1 ‧‧‧Inner diameter of parallel circular shaped beam

h2‧‧‧平行環形整型光束的外徑 h 2 ‧‧‧The outer diameter of the parallel annular shaped beam

W‧‧‧平行環形整型光束的寬度 W‧‧‧The width of the parallel annular shaped beam

X1‧‧‧零階能量峰值 X1‧‧‧ zero-order energy peak

X2‧‧‧一階能量峰值 X2‧‧‧ first-order energy peak

θ‧‧‧第一夾角 θ ‧‧‧first angle

α‧‧‧第二夾角 α ‧‧‧second angle

圖1為本發明的加工裝置一實施例的示意圖。 1 is a schematic view of an embodiment of a processing apparatus of the present invention.

圖2至圖3為本發明的整型模組另一實施例的示意圖。 2 to 3 are schematic views of another embodiment of the integrated module of the present invention.

圖4為圖1中平行環形整型光束與光軸的示意圖。 4 is a schematic view of the parallel annular shaped beam and optical axis of FIG. 1.

圖5A為本發明干涉光束的軸向強度的示意圖。 Figure 5A is a schematic illustration of the axial strength of an interference beam of the present invention.

圖5B為本發明干涉光束的徑向強度的示意圖。 Figure 5B is a schematic illustration of the radial strength of an interference beam of the present invention.

圖6為本發明的加工裝置另一實施例的示意圖。 Figure 6 is a schematic illustration of another embodiment of a processing apparatus of the present invention.

以下結合附圖和實施例,對本發明的具體實施方式作進一步描述。以下實施例僅用於更加清楚地說明本發明的技術方案,而不能以此限制本發明的保護範圍。 The specific embodiments of the present invention are further described below in conjunction with the drawings and embodiments. The following examples are only used to more clearly illustrate the technical solutions of the present invention, and are not intended to limit the scope of the present invention.

圖1為本發明的加工裝置一實施例的示意圖。請先參閱圖1。在本實施例中,加工裝置100包括一光源110、一整型模組120以及一聚焦元件130。光源110為雷射光源或具同調性(coherence)之光源,光源110用以產生一固定強度分布之入射光束P1,入射光束P1可以是雷射脈衝光束或其他非雷射產生器(例如脈衝閃光燈或脈衝發光二極體)所產生的脈衝光束。 1 is a schematic view of an embodiment of a processing apparatus of the present invention. Please refer to Figure 1 first. In the present embodiment, the processing apparatus 100 includes a light source 110, an integral module 120, and a focusing component 130. The light source 110 is a laser light source or a coherence light source. The light source 110 is used to generate a fixed intensity distribution incident beam P1. The incident light beam P1 may be a laser pulse beam or other non-laser generator (for example, a pulse flash). Or a pulsed beam produced by a pulsed LED.

整型模組120位於入射光束P1的傳遞路徑上,整型模組120用以接收入射光束P1,且整型模組120用以調整入射光束P1的能量分布,整型模組120用以將入射光束P1調控成一平行環形整型光束P2。聚焦元件130配置於整型模組120旁,聚焦元件130位於平行環形整型光束P2的傳遞路徑上,平行環形整型光束P2平行進入聚焦元件130,聚焦元件130用以接收平行環形整型光束P2,且聚焦元件130用以使平行環形整型光束P2之光軸軸向上產生干涉行為,以形成具抑制高階項能量的一干涉光束P3。聚焦元件130 為一具球差之透鏡,其中具球差之透鏡為平凸或雙凸球面鏡。 The integer module 120 is located on the transmission path of the incident light beam P1, the integer module 120 is configured to receive the incident light beam P1, and the integer module 120 is used to adjust the energy distribution of the incident light beam P1, and the integer module 120 is used to The incident beam P1 is modulated into a parallel annular shaped beam P2. The focusing element 130 is disposed beside the integer module 120, the focusing element 130 is located on the transmission path of the parallel annular shaped beam P2, the parallel annular shaped beam P2 is parallel to the focusing element 130, and the focusing element 130 is configured to receive the parallel annular shaped beam. P2, and the focusing element 130 is configured to generate an interference behavior in the axial direction of the optical axis of the parallel annular shaped beam P2 to form an interference beam P3 having an energy of suppressing the high order term. Focusing element 130 It is a spherical aberration lens, and the lens with spherical aberration is a plano-convex or double convex spherical mirror.

在本實施例中,整型模組120包括一第一錐透鏡122以及一第二錐透鏡124,換言之,本實施例的整型模組120係以雙錐透鏡組成,入射光束P1分別通過第一錐透鏡122與第二錐透鏡124後,形成平行環形整型光束P2。然本發明不以此為限,整型模組係選自以至少一錐透鏡、至少一球面透鏡、至少一非球面透鏡與至少一繞射元件所組成的群組。舉例而言,如圖2所示,整型模組320係以一錐透鏡322與一球面透鏡324所組成,在另一實施例中,整型模組320可由錐透鏡與非球面透鏡所組成。如圖3所示,整型模組420係以一繞射元件422與一球面透鏡424所組成,在另一實施例中,整型模組420可由繞射元件與非球面透鏡所組成。 In this embodiment, the integer module 120 includes a first cone lens 122 and a second cone lens 124. In other words, the integer module 120 of the embodiment is composed of a double cone lens, and the incident light beam P1 passes through the first After a cone lens 122 and a second cone lens 124, a parallel annular shaped beam P2 is formed. However, the invention is not limited thereto, and the integer module is selected from the group consisting of at least one cone lens, at least one spherical lens, at least one aspheric lens and at least one diffraction element. For example, as shown in FIG. 2, the integer module 320 is composed of a cone lens 322 and a spherical lens 324. In another embodiment, the integer module 320 may be composed of a cone lens and an aspheric lens. . As shown in FIG. 3, the integral module 420 is composed of a diffractive component 422 and a spherical lens 424. In another embodiment, the nematic module 420 can be composed of a diffractive component and an aspherical lens.

詳細而言,如圖4所示,圖4為圖1中平行環形整型光束與光軸的示意圖。平行環形整型光束P2係由內環形光束P21與外環形光束P22所組成。平行環形整型光束P2的內徑之內環形光束P21與光軸L具有一第一夾角θ,平行環形整型光束P2的外徑之外環形光束P22與光軸L具有一第二夾角α,其中環形內外光軸夾角比值如下述數學式(1)、(2)所示: In detail, as shown in FIG. 4, FIG. 4 is a schematic view of the parallel annular shaped beam and the optical axis of FIG. The parallel annular shaped beam P2 is composed of an inner annular beam P21 and an outer annular beam P22. The annular beam P21 and the optical axis L have a first angle θ within the inner diameter of the parallel annular shaped beam P2. The annular beam P22 and the optical axis L have a second angle α outside the outer diameter of the parallel annular shaped beam P2. The ratio of the angle between the inner and outer optical axes of the ring As shown in the following mathematical formulas (1) and (2):

上述數學式(1)、(2)中,f為具球差之透鏡之焦距,R為具球差之透鏡之曲率半徑,h1為平行環形整型光束P2的內徑,h2為平行環形整型 光束P2的外徑。在本實施例中,平行環形整型光束P2的內徑h1尺寸範圍介於0.5mm至1mm之間,平行環形整型光束P2的外徑h2尺寸範圍介於2.5mm至6mm之間,因此,平行環形整型光束P2的寬度W尺寸範圍介於2mm至5mm之間。 In the above mathematical formulas (1) and (2), f is the focal length of the lens with spherical aberration, R is the radius of curvature of the lens with spherical aberration, h 1 is the inner diameter of the parallel annular shaped beam P2, and h 2 is parallel The outer diameter of the annular shaped beam P2. In this embodiment, the inner diameter h 1 of the parallel annular shaped beam P2 ranges from 0.5 mm to 1 mm, and the outer diameter h 2 of the parallel annular shaped beam P2 ranges from 2.5 mm to 6 mm. Therefore, the width W of the parallel annular shaped beam P2 ranges from 2 mm to 5 mm.

圖5A為本發明干涉光束的軸向強度的示意圖,圖5B為本發明干涉光束的徑向強度的示意圖。在本實施例中,可透過上述數學式(1)、(2)算出環形內外光軸夾角比值,本實施例整型模組120可調整入射光束P1的能量分布,使得產生的平行環形整型光束P2之第一夾角θ與第二夾角α的環形內外光軸夾角比值能介於0.42至1之間,藉此改變平行環形整型光束P2經過聚焦元件130後的干涉狀態,干涉光束P1中的一階能量峰值X2小於零階能量峰值X1的10%(如圖5B所示),以達到抑制貝塞爾(Bessel)光束之高階項能量,進而改善干涉光束P3的加工真圓度,使得本發明可得到具高真圓度佳的加工雷射光束(如圖5A所示)。 5A is a schematic view showing the axial strength of the interference beam of the present invention, and FIG. 5B is a schematic view showing the radial intensity of the interference beam of the present invention. In this embodiment, the ratio of the angle between the inner and outer optical axes of the ring can be calculated through the above mathematical formulas (1) and (2). In this embodiment, the integer module 120 can adjust the energy distribution of the incident light beam P1 such that the ratio of the first angle θ of the parallel annular shaped beam P2 to the annular inner and outer optical axes of the second angle α is The energy can be between 0.42 and 1, thereby changing the interference state of the parallel annular shaped beam P2 after passing through the focusing element 130. The first-order energy peak X2 in the interference beam P1 is less than 10% of the zero-order energy peak X1 (Fig. 5B). Shown), in order to achieve the high-order energy of the Bessel beam, thereby improving the processing roundness of the interference beam P3, so that the invention can obtain a processed laser beam with high roundness (Fig. 5A). Shown).

圖6為本發明的加工裝置另一實施例的示意圖。請參閱圖6,圖6的加工裝置200與圖1的加工裝置100相似,其中相同的元件以相同的標號表示且具有相同的功效而不再重複說明,以下僅說明差異處。 Figure 6 is a schematic illustration of another embodiment of a processing apparatus of the present invention. Referring to FIG. 6, the processing apparatus 200 of FIG. 6 is similar to the processing apparatus 100 of FIG. 1, in which the same elements are denoted by the same reference numerals and have the same functions and will not be repeatedly described. Only the differences will be described below.

圖6與圖1的不同之處在於:加工裝置200更包括一倍率調整模組240,倍率調整模組240配置於聚焦元件130旁,倍率調整模組240位於干涉光束P3的傳遞路徑上,倍率調整模組240例如為擴束鏡組,其有兩球面透鏡所組成。倍率調整模組240用以改變干涉光束P3之直徑大小或景深長短,故本實施例可依據不同需求的加工應用範圍來調整干涉光束P3之直徑大小或景深長短,使干涉光束P3大小、干涉光束P3軸向能量分佈會變化以 形成一加工光束P4。 The difference between FIG. 6 and FIG. 1 is that the processing device 200 further includes a magnification adjustment module 240. The magnification adjustment module 240 is disposed beside the focusing component 130, and the magnification adjustment module 240 is located on the transmission path of the interference beam P3. The adjustment module 240 is, for example, a beam expander lens group, which is composed of two spherical lenses. The magnification adjustment module 240 is used to change the diameter of the interference beam P3 or the depth of field. Therefore, the diameter of the interference beam P3 or the depth of field can be adjusted according to the processing application range of different requirements, so that the interference beam P3 size and the interference beam are P3 axial energy distribution will change A processing beam P4 is formed.

綜上所述,在本發明提出的加工裝置中,透過整型模組改變入射光束之能量分布狀態所形成的平行環形整型光束,藉此改變平行環形整型光束經過聚焦元件後的干涉狀態,以形成具抑制高階項能量的一干涉光束,干涉光束中的一階能量峰值小於零階能量峰值的10%,以達到抑制貝塞爾(Bessel)光束之高階項能量,進而改善干涉光束的加工真圓度,使得本發明可得到高真圓度佳的加工結果。 In summary, in the processing device proposed by the present invention, the parallel annular shaped beam formed by the energy distribution state of the incident beam is changed by the integer module, thereby changing the interference state of the parallel annular shaped beam after passing through the focusing element. To form an interference beam with a high-order energy suppression, the first-order energy peak in the interference beam is less than 10% of the zero-order energy peak, so as to suppress the high-order energy of the Bessel beam, thereby improving the interference beam. The roundness is processed so that the present invention can obtain a processing result with high roundness.

再者,本發明之環形整型光係為平行進入聚焦元件,在後續調整光路上較為簡易。 Furthermore, the ring-shaped integral light system of the present invention enters the focusing element in parallel, and is relatively simple to adjust the optical path.

另外,由於本發明可達到抑制貝塞爾(Bessel)光束之高階項能量的結果,故可減少錐透鏡的影響,不受到錐透鏡製程上困難即可產生所需平行環形整型光束,不同規格之加工需求只需更換整型模組中的透鏡,藉此提升整體使用便利性。 In addition, since the present invention can achieve the result of suppressing the high-order energy of the Bessel beam, the influence of the cone lens can be reduced, and the desired parallel annular shaped beam can be produced without the difficulty of the process of the cone lens. The processing needs only need to replace the lens in the integral module, thereby improving the overall usability.

此外,本發明可依據不同需求的加工應用範圍來調整干涉光束之直徑大小或景深長短。 In addition, the present invention can adjust the diameter of the interference beam or the depth of field according to the processing application range of different requirements.

雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,故本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

Claims (13)

一種加工裝置,包括:一整型模組,位於一入射光束的傳遞路徑上,該整型模組用以將該入射光束調控成一平行環形整型光束,其中該平行環形整型光束的內徑之內環形光束與該平行環形整型光束之光軸具有一第一夾角,該平行環形整型光束的外徑之外環形光束與該平行環形整型光束之該光軸具有一第二夾角,該第一夾角與該第二夾角的一環形內外光軸夾角比值介於0.42至1之間;以及一聚焦元件,配置於該整型模組旁,該聚焦元件位於該平行環形整型光束的傳遞路徑上,該聚焦元件用以使該平行環形整型光束之該光軸軸向上產生干涉行為,以形成具抑制高階項能量的一干涉光束。 A processing device includes: an integral module disposed on a transmission path of an incident beam, wherein the integer module is configured to regulate the incident beam into a parallel annular shaped beam, wherein an inner diameter of the parallel annular shaped beam The annular beam has a first angle with the optical axis of the parallel annular shaped beam, and the annular beam outside the outer diameter of the parallel annular shaped beam has a second angle with the optical axis of the parallel annular shaped beam. The angle between the first angle and the annular inner and outer optical axes of the second angle is between 0.42 and 1; and a focusing component disposed adjacent to the integer module, the focusing component is located in the parallel annular shaped beam In the transmission path, the focusing element is configured to cause an interference behavior in the axial direction of the optical axis of the parallel annular shaped beam to form an interference beam having a high order term energy. 如申請專利範圍第1項所述之加工裝置,其中該整型模組用以調整該入射光束的能量分布。 The processing device of claim 1, wherein the integer module is configured to adjust an energy distribution of the incident beam. 如申請專利範圍第1項所述之加工裝置,其中該整型模組係選自以至少一錐透鏡、至少一球面透鏡、至少一非球面透鏡與至少一繞射元件所組成的群組。 The processing device of claim 1, wherein the integer module is selected from the group consisting of at least one cone lens, at least one spherical lens, at least one aspheric lens, and at least one diffraction element. 如申請專利範圍第1項所述之加工裝置,其中該平行環形整型光束的該內徑尺寸範圍介於0.5mm至1mm之間。 The processing apparatus of claim 1, wherein the inner diameter of the parallel annular shaped beam has a size ranging from 0.5 mm to 1 mm. 如申請專利範圍第1項所述之加工裝置,其中該平行環形整型光束的該外徑尺寸範圍介於2.5mm至6mm之間。 The processing apparatus of claim 1, wherein the outer diameter of the parallel annular shaped beam has a size ranging from 2.5 mm to 6 mm. 如申請專利範圍第1項所述之加工裝置,其中該平行環形整型光束的寬度尺寸範圍介於2mm至5mm之間。 The processing apparatus of claim 1, wherein the parallel annular shaped beam has a width dimension ranging from 2 mm to 5 mm. 如申請專利範圍第1項所述之加工裝置,其中該平行環形整型光束平行進入該聚焦元件。 The processing apparatus of claim 1, wherein the parallel annular shaped beam enters the focusing element in parallel. 如申請專利範圍第1項所述之加工裝置,其中該聚焦元件為一具球差之透鏡。 The processing device of claim 1, wherein the focusing element is a spherical aberration lens. 如申請專利範圍第8項所述之加工裝置,其中該具球差之透鏡為平凸或雙凸球面鏡。 The processing device of claim 8, wherein the spherical aberration lens is a plano-convex or biconvex spherical mirror. 如申請專利範圍第1項所述之加工裝置,其中該干涉光束中的一階能量峰值小於零階能量峰值的10%。 The processing apparatus of claim 1, wherein the first-order energy peak in the interference beam is less than 10% of the zero-order energy peak. 如申請專利範圍第1項所述之加工裝置,更包括:一倍率調整模組,配置於該聚焦元件旁,該倍率調整模組位於該干涉光束的傳遞路徑上,該倍率調整模組用以改變該干涉光束之直徑大小或景深長短。 The processing device of claim 1, further comprising: a magnification adjustment module disposed adjacent to the focusing component, wherein the magnification adjustment module is located on a transmission path of the interference beam, and the magnification adjustment module is used Change the diameter of the interference beam or the depth of field. 如申請專利範圍第1項所述之加工裝置,更包括:一光源,用以產生該入射光束。 The processing device of claim 1, further comprising: a light source for generating the incident light beam. 如申請專利範圍第12項所述之加工裝置,其中該光源為雷射光源或具同調性之光源。 The processing device of claim 12, wherein the light source is a laser source or a light source having a homology.
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011170052A (en) * 2010-02-17 2011-09-01 Institute Of National Colleges Of Technology Japan Optical device, light source device, laser process device, diffracting optical element, optical pickup, optical disk device, and laser apparatus
CN104816086A (en) * 2015-04-17 2015-08-05 温州大学 Pipe inner wall laser machining head
TW201720565A (en) * 2015-12-11 2017-06-16 財團法人金屬工業研究發展中心 Microstructure processing device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011170052A (en) * 2010-02-17 2011-09-01 Institute Of National Colleges Of Technology Japan Optical device, light source device, laser process device, diffracting optical element, optical pickup, optical disk device, and laser apparatus
CN104816086A (en) * 2015-04-17 2015-08-05 温州大学 Pipe inner wall laser machining head
TW201720565A (en) * 2015-12-11 2017-06-16 財團法人金屬工業研究發展中心 Microstructure processing device

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