TWI591666B - Tin method and device - Google Patents

Description

Dipping tin method and device

The invention relates to a method and a device for immersing tin, in particular to a method and a device for immersing the tin at the end of the wire after the winding is completed.

Press, the general coil production usually consists of two parts, one is the winding process, the other is the dip soldering process; in the winding process, the core part of the two flanges must be wound on a "work" type core material. Winding the wire, completing the wound core material and then performing the dip soldering process, so that the core material is placed in the vibrating feeder and sent to the tin bath to adhere the tin liquid to the second line end portion of the core material flange. Then discharge and collect.

The patent application No. 181713, "Welding Machine for Wirewound Inductors" proposes a soldering process for a coil, which proposes a step of first attaching a loose perfume flux to a coil before soldering, and immersing the coil in tin Prior art for sinking tin in a tank, including a guiding device, a detaching device, a wire straightening device, a finishing device, a conveying device, a transmission device, a rotating device, a control device, an infiltration device, a scraping device, a soldering device, and a belt The device and the like are configured to perform the steering, the transfer, the wetting, and the solder transfer operation of the left and right rotating devices to complete the tin plating of the copper wire at both ends of the wound inductor, and the wire is gradually separated from the solder bath to avoid the solder attached to the end of the wire. The surface is elongated into a needle shape, and then combined by a toothed chain conveyor, a cylinder action, a solenoid valve line control, and a lead screw to form a wire wound inductor soldering machine.

The prior art soldering process uses a left and right set of rotating devices located in the flux immersion The soldering device and the soldering device of the tin liquid are above, and the rotating axial direction is parallel with the wetting device and the soldering device, but the rotating conveying method is perpendicular to the direction of infiltrating the flux and the tin liquid, and the tin coil to be wetted by the flux is wetted. The device and the tin soldering device are transported back and forth between the device and the soldering device. In addition to the complexity and bulk of the mechanism, the tin and the flux can not be simultaneously performed to improve the overall process efficiency; and the left and right rotating devices are reciprocated to the flux infiltration device. Between the soldering device and the tin soldering device, the wetting device cannot be provided with a device for adjusting the degree of wetting, and the device for handling the suspension of tin droplets cannot be disposed above the soldering device, so that it is difficult to effectively improve the quality of the soldering tin.

Accordingly, an object of the present invention is to provide a dipping method suitable for a dipping process in which a coil is transported to a plurality of workstations by a transfer conveyance device in a plurality of workstations.

Another object of the present invention is to provide a dip soldering apparatus suitable for transporting a coil to a plurality of workstations by a transfer apparatus to perform a soldering process.

It is still another object of the present invention to provide an apparatus for performing the soldering method.

The tin-staining method according to the object of the present invention is for diluting a tin component to be tinned, comprising the following steps: an initial step of transferring the tin-doped component to a tin bath; The tin component is transferred to the tin bath surface of the tin bath, and a tin bath is raised from the tin bath, so that the surface of the tin liquid contained on the tin bath is in proper contact with the tin surface to be tinned, and the tin liquid is adhered thereto. a truncation step, the truncated piece is driven to cut the drawn tin droplets, so that the drawn portion is cut, and a proper amount of tin droplets are intercepted and left to be tinned to be tinned a scraping surface step, a scraping member is driven on the upper surface of the tin bath of the tin bath to perform a scraping operation of the surface oxygen layer.

A dip soldering apparatus according to another object of the present invention comprises: a tin furnace having a tin bath for holding a tin liquid heated therein; a tin bath, which is immersed in the tin bath and is subjected to a driving member The driven carrier carries the surface of the tin liquid which can be displaced up and down in the tin bath; a scraping member is disposed on a carrier, the carrier is driven by a scraping driving member, and the scraping member can be displaced to the tin before and after groove The upper surface of the tin liquid serves as a scraping operation for the oxygen layer on the surface of the tin liquid; a cut piece is located in front of the scraping member and is driven by a truncated driving member, and the truncated drop member can be displaced before and after the tin bath surface of the tin bath Above, the cutting piece can be driven to cut the drawn tin droplets so that the drawn portion is cut.

The soldering method and device provided by the embodiments of the present invention, when the soldering method and the device are provided, the conveying device adopts a rotating flow path to carry out, for example, the transfer of the tin component to be tinned by the coil, except that the action flow path of the mechanism is relatively regular. The dilute tin solution and the flux of the different coils can be simultaneously performed to greatly improve the overall process efficiency; in addition, the rotating flow path of the conveying device does not interfere with the working space of each workstation, so each workpiece station can perform, for example, flux infiltration degree. The control, the tin droplets are cut and flattened, the finished product is turned over and conveyed, and the like, for effective fine processing, so that the quality of the coil tin is effectively improved.

1‧‧‧ coil

11‧‧‧ core material

111‧‧‧First flange

112‧‧‧second flange

113‧‧‧core core

114‧‧‧ wire trough

12‧‧‧Wire

121‧‧‧First line end

122‧‧‧second line

13‧‧‧Conductive substances

2‧‧‧Transporting device

21‧‧‧Workstation

22‧‧‧ drive mechanism

23‧‧‧ upper surface

A‧‧‧ pick-and-place mechanism

A1‧‧‧Removable seat

A11‧‧‧rail

A12‧‧‧Flexible components

A13‧‧‧ shaft tube

A2‧‧‧Adsorption mechanism

A21‧‧‧ adsorption seat

A211‧‧‧ frame

A212‧‧‧ bottom cover

A213‧‧‧ air cavity

A214‧‧‧Adsorption surface

A22‧‧‧Magnetic parts

A23‧‧‧Activities

A231‧‧‧ pivot

A232‧‧ ‧ body

A233‧‧‧Flexible components

A3‧‧‧Sensor components

B‧‧‧weld device

B1‧‧‧flux tank

B11‧‧‧Inlet line

B12‧‧‧Drainage line

B13‧‧‧Drainage line

B2‧‧‧ Attachment

B21‧‧‧ Carrier

B211‧‧‧ Body

B212‧‧‧ linkages

B22‧‧‧ Lifting mechanism

B221‧‧‧Motor

B222‧‧‧Land

B223‧‧‧Frame

B3‧‧‧ scraping mechanism

B31‧‧‧Scratch

B32‧‧‧ drive parts

B33‧‧‧ Carrier

C‧‧‧Staining device

C1‧‧‧ Tin furnace

C11‧‧‧ tin bath

C12‧‧‧dew tank

C13‧‧‧dew tank

C2‧‧‧Dip tin bath

C21‧‧‧ carrier

C22‧‧‧carrier drive

C3‧‧‧ scraping parts

C31‧‧‧ Carrier

C32‧‧‧ rails

C33‧‧‧Scrape driver

C34‧‧‧ pressure pad

C35‧‧‧ fixed seat

C4‧‧‧ cut pieces

C41‧‧‧ bracket

C411‧‧‧ hole

C412‧‧‧Slit

C413‧‧‧ slide

C414‧‧‧First screw firmware

C415‧‧‧Second screw firmware

C42‧‧‧Horizontal rail

C43‧‧‧ cut-off drive

C44‧‧‧Slag removal parts

C45‧‧‧Slag removal drive

C46‧‧‧ rail seat

D‧‧‧掣抵装置

D1‧‧‧Rack

D2‧‧‧ drive parts

D3‧‧‧掣掣件

D4‧‧‧ cantilever

D5‧‧‧Cylinder rod

D6‧‧‧ drive parts

E‧‧‧Exhaust device

F‧‧‧Discharge device

F1‧‧‧Accommodating agency

F11‧‧‧Transposition

F12‧‧‧ socket

F121‧‧‧Loading interval

F122‧‧‧ Negative pressure suction hole

F13‧‧‧ Lifting drive

F14‧‧‧Rotary drive

F141‧‧‧Leather belt

F15‧‧‧Displacement drive

F2‧‧‧Transportation agency

F21‧‧‧ conveyor belt

F22‧‧‧Measurement components

F23‧‧‧Image inspection device

G‧‧‧Collection device

H‧‧‧ cleaning device

H1‧‧‧ cleaning tank

H2‧‧‧ cleaning components

H21‧‧‧Mobile seat

H22‧‧‧clean drive parts

H23‧‧‧Blowing mechanism

The first figure is a schematic perspective view of the winding of the core material of the embodiment of the present invention.

The second figure is a perspective view of the finished coil product of the embodiment of the present invention.

The third figure is a schematic perspective view of a conveying device according to an embodiment of the present invention.

The fourth figure is a schematic cross-sectional view of the adsorption mechanism of the pick-and-place mechanism of the embodiment of the present invention.

The fifth figure is a schematic perspective view of a flux device according to an embodiment of the present invention.

Figure 6 is a schematic view showing the initial steps of the flux-welding process of the embodiment of the present invention.

The seventh figure is a schematic diagram of the first rising step of the flux-welding process of the embodiment of the present invention.

The eighth figure is a schematic diagram of the scraping step of the flux-welding process of the embodiment of the present invention.

The ninth drawing is a schematic diagram of the second rising step of the flux-welding process of the embodiment of the present invention.

The tenth figure is a schematic view of a device for immersing tin, smashing, and exhausting according to an embodiment of the present invention.

The eleventh drawing is a schematic view of a dip soldering apparatus according to an embodiment of the present invention.

Twelfth is a schematic view of a dip tank according to an embodiment of the present invention.

Figure 13 is a schematic view of a wiper member according to an embodiment of the present invention.

Figure 14 is a schematic view of a cut piece of the embodiment of the present invention.

The fifteenth drawing is a schematic view of a slag removing member according to an embodiment of the present invention.

Figure 16 is a schematic view showing the securing portion of the cutting piece of the embodiment of the present invention.

Figure 17 is a schematic view showing the initial steps of the dip soldering process of the embodiment of the present invention.

The eighteenth drawing is a schematic diagram of the step of diluting tin in the dip soldering process of the embodiment of the present invention.

The nineteenth drawing is a schematic diagram of the cutting step of the dip tin process of the embodiment of the present invention.

Figure 20 is a schematic view showing the steps of the scraping surface of the dip tin process of the embodiment of the present invention.

The twenty-first drawing is a schematic view of the step of pressing tin in the dip tin process of the embodiment of the present invention.

The twenty-second figure is a schematic view of the discharge device of the embodiment of the present invention.

The twenty-third figure is a partial schematic view of the discharge process receiving socket of the embodiment of the present invention.

The twenty-fourth embodiment is an indication of the flipping of the socket discharging device of the embodiment of the present invention (1).

The twenty-fifth drawing is a schematic diagram of the flipping of the socket discharging device of the embodiment of the present invention (2).

The twenty-sixth drawing is a schematic view of a cleaning device of an embodiment of the present invention.

The twenty-seventh drawing is a schematic view of cleaning of the cleaning device of the embodiment of the present invention.

Referring to FIG. 1 and FIG. 2, the embodiment of the present invention can be used for the tin-filling process of the coil component 1 to be tinned as shown in the figure. The coil 1 includes a core material 11 having a first flange 111 at both ends. a second flange 112, and a core portion 113 located therebetween, wherein the first flange 111 is provided with mutually parallel and recessed wire grooves 114 on opposite sides of the proper spacing; the core portion 113 is wound around the wire 12, which forms a first wire end 121 formed by the wire end of the second flange 112 and a second wire end 122 formed by the wire end of the first flange 111, the first wire end 121 and the first wire end The two ends 122 are bent from the side of the first flange 111 in the same direction, and each of the two flanges 111 is opposite to the first flange 111 and is about half of the length of the recessed groove 114, which is subjected to a dipping process. Subject to A conductive material 13 such as tin liquid is adhered and fixed to the first flange 111 of the wire groove 114 to form a complete coil 1.

In the embodiment of the present invention, the coil 1 has completed the winding of the first figure and the finished product, and the finished product of the coil 1 as shown in the second figure is completed by the manufacturing method and apparatus provided by the embodiment of the present invention.

Referring to the second, third and fourth figures, in the embodiment of the present invention, the coil 1 is transported to the plurality of workstations 21 by means of a transport device 2 by means of a transport device 2, and the workstations 21 perform the following processes. The method includes: a fluxing flux process, located on the workstation 21 of the intermittent rotating flow path, so that the tinned portion of the coil 1 to be conveyed by the conveying device 2 is immersed in the flux; the soldering process is located in the intermittent The station 21 on the rotating flow path is used to make the tinned portion of the coil 1 to be contaminated by the tin liquid; a discharge process is used to complete the coil 1 from the intermittent rotating flow path. The conveying device 2 is removed and collected.

The conveying device 2 is slightly disk-shaped, and each of the workstations 21 is provided with a pick-and-place mechanism A, and is driven by the driving mechanism 22 to carry the same intermittent rotating flow path only in the home position, and rotates the axis around the Z axis in a horizontal manner. Each of the pick-and-place mechanisms A includes: a pick-and-place A1 supported by the plurality of vertical rails A11 and disposed on the transport device 2, the rails A11 on the upper surface 23 of the transport device 2 and the pick-and-place A1 The elastic member A12 is disposed, and the guide rail A11 is partially disposed in the lower shaft A13 of the upper surface 23; an adsorption mechanism A2 is vertically displaced by the linkage A3 and the loading and unloading seat A1, and the frame body A211 and the bottom are provided. The adsorption seat A21 of the cover A212 is formed, a middle air chamber A213 is formed inside the adsorption seat 21, and an adsorption surface A214 is formed at the bottom, and the magnetic member A22 is arranged in the air chamber A213 to be embedded in a movable member A23 in a plurality of arrangement manners. The movable member A23 is sucked by the two pivots A231 Attached to the seat A21, a stopper body A232 is disposed outside, and an elastic member A233 is disposed between the stopper body A232 and the suction seat A21. The displacement member A3 is inserted into the air chamber A213 to displace the movable member A23. The sensing unit A1 is pressed against the coil 1 to be adsorbed and transported downward by the interlocking adsorption mechanism A2, and the positive pressure gas is introduced into the air chamber A213, so that the movable member A23 is pushed down. The magnetic member A22 is pressed against the inner side of the adsorption surface A214, so that the adsorption surface A214 is magnetic and adsorbs the coil 1 to be adsorbed below; when the coil 1 adsorbed by the adsorption surface A214 is released, the positive pressure gas or the air chamber A213 is stopped. The negative pressure gas is introduced into the middle, and the movable member A23 is subjected to the upward suction force to interlock the magnetic member A22 to the adsorption surface A214, so that the adsorption surface A214 loses magnetism and releases the lower coil 1.

Please refer to the fifth and sixth figures. The fluxing process can use the flux device B as shown in the figure, including: a flux tank B1 filled with a flux such as rosin, and a liquid inlet pipe B11 And the liquid discharge pipe B12, so that the flux in the tank is circulated through the state, to reduce the volatility of the flux, causing the concentration to change too much, affecting the adhesion quality of the flux; at the same time, the liquid discharge pipe B13 can be provided. Flush the flux in the tank to the liquid storage tank (not shown) during shutdown or if necessary to avoid flux evaporation; a bonding mechanism B2, including a soft flexible material such as sponge The carrier B21 of the body B211 is formed, and the carrier B21 is moved by a lifting mechanism B22 to move the body B211 out of the flux level in the flux tank B1, or to drop the body B211 into the flux tank B1. The lifting mechanism B22 includes a belt B222 driven by the motor B221 to interlock the frame B223 which is located on both sides of the flux tank B1 and located behind the flux tank B1 for up-and-down displacement, so that the carrier B21 is interlocked. The piece B212 is fixed on the frame B223 and is linked thereto; A scraping mechanism B3 includes a blade-shaped scraping body B31 which is disposed on a carrier B33 which is displaced by a driving member B32 and is reciprocally reciprocated above the body B211. The scraping body B31 can be moved. Apply too much flux to the upper surface of the body B211.

Please refer to the sixth to ninth drawings. The fluxing process of the adhesion mechanism B2 and the scraping mechanism B3 in the flux device B includes the following steps: For an initial step, please refer to the sixth figure, at this time, the carrier B21 The deposited body B211 is immersed in the flux liquid level in the flux tank B1; in the first rising step, please refer to the seventh figure, the carrier B21 is placed on the body B211 and is lifted by the lifting mechanism B22 to make the body B211 The surface is located above the flux level in the flux bath B1; in the scraping step, please refer to the eighth figure, the scraper B31 is driven by the driving member B32 to drive the carrier B33 to scrape the upper surface of the body B211, so that the help is excessive The flux is scraped off; a second rising step, please refer to the ninth figure, the carrier B21 is placed on the body B211 by the lifting mechanism B22 to rise again, and the upper surface of the body B211 is adsorbed under the adsorption surface A214 of the adsorption mechanism A2. After the coil 1 is to be soldered to the tin surface, after the flux is wetted, the carrier B21 is placed on the body B211 to be returned to the original initial step by the lifting mechanism B22.

Please refer to the tenth figure. The dip tin process can use the dip soldering device C as shown in the figure, and cooperate with a smashing device D and an exhaust device E; the smashing device D is located in front of the dipping device C, and borrows a frame D1. The upper abutting driving member D2 drives the yoke resisting member D3 to the lowering member A3 of the absorbing mechanism A2 in the third figure, so that the absorbing mechanism A2 is moved downward to perform the work of dipping the coil 1 adsorbed under the squeegee; the frame D1 is provided There is a cantilever D4, which is provided with a top abutting driving member D6 which can be extended downwardly, and is used for contacting the air pressure switch of the adsorption mechanism A2 in the third figure, so that the adsorption mechanism A2 is released as the coil 1. It is the control of the next discharge process, detailed later; the exhaust device E is placed above the tin furnace C1 of the tin-plating device C to absorb the toxic gas volatilized by the tin liquid.

Referring to FIG. 11 , the soldering device C includes a tin furnace C1 having a tin bath C11 for accommodating tin liquid and a tin bath C1 on the front and rear sides of the tin furnace C1. Tin dross tanks C12, C13; a tin bath C2, please also refer to the twelfth figure, which is smaller than the tin tank C11 and is immersed therein, which is carried by a carrier C21 and subjected to a carrier drive member C22 The drive can be moved up and down on the surface of the tin bath of the tin bath C11 or above; the carrier C21 has a U shape, so that the upper and lower displacement paths driven by the driving member C22 are parallel to the upper displacement path of the tin bath C2, but separated by one. Appropriate spacing; a scraping member C3, please also refer to the thirteenth figure, which is disposed at the front end of a carrier C31, which is located between the carrier C21 and is subjected to a wiper driving member C33 located on the horizontal rail C32 Driven, the scraping member C3 can be moved forward and backward on the upper surface of the tin bath of the tin bath C11 as the oxygen layer scraping operation of the tin liquid surface, and the tin slag is scraped and scraped on the front and rear side slag tanks C12 and C13 of the tin furnace C1; A plurality of pressure pads C34 protruding from the scraping member C3 are arranged above the seat C31, and each pressure pad C34 is fixed on one of the carriers C31. C35, and in the fixed seat C35 by the elastic element (not shown) to have appropriate elasticity; a cut piece C4, please also refer to the fourteenth figure, consisting of a wire body such as a steel wire The two ends are fastened to the two ends of a bracket C41, and the cutting piece C4 is located in front of the scraping member C3, and the bracket C41 is located between the carrier C21 and the carrier C31, and is subjected to A truncated driving member C43 is arranged on a set of horizontal rails C42, and the truncating and dropping device C4 can be moved forward and backward on the surface of the tin bath of the tin bath C11; please also refer to the fifteenth figure, the line of the cut piece C4 A slag removing member C44 is disposed at the body, and the bottom end of the slag removing member C44 is buckled by a buckle groove C441, and is laterally displaced laterally on a rail seat C46 which can be driven up and down by the slag removing driving member C45. Scrape the tin slag adhered to the wire diameter of the cut-off piece C4; please also refer to the sixteenth figure, the cut piece C4, and the two ends of the steel wire body extend through the two ends of the bracket C41. Hole C411, and biased into the hole C411 is positioned in the slit C412 on the inner diameter side, and the end of the steel wire body of the cutting piece C4 is wound around the outer side of the bracket C41. The first screw C414 of the sliding seat C413 is screwed by the screw C413. After the sliding tension adjustment C4 line body is properly tensioned, the second screw C415 is screwed into position.

Please also refer to the seventeenth to twenty-first figures. The soldering process for the scraping device C3 and the cut-off device C4 in the soldering device C includes the following steps: For an initial step, please refer to the seventeenth figure. The mechanism A2 adsorbs the coil 1 and transports it to the top of the tin bath C11. The tin bath C2 is immersed in the tin bath C11 at this time, and the scraping member C3 and the cutting piece C4 are located on the side of the tin tank C11; Step, please refer to the eighteenth figure, the adsorption mechanism A2 adsorbs the coil 1 and descends to the tin bath surface of the tin bath C11, and the tin bath C2 rises from the tin bath C11, so that the surface of the tin liquid contained therein is to be adhered to the coil 1 The tin surface is properly contacted and the tin liquid is attached thereto; in the case of a cut-off step, please refer to the nineteenth figure, when the adsorption mechanism A2 is moved upward and the tin bath C2 is intended to descend into the tin bath C11 The surface of the coil 1 to be tinned and the surface of the tin liquid is in a state in which the droplet is drawn. At this time, the cutting piece C4 is driven to cut the drawn tin droplet, so that the drawn portion is cut and intercepted. The appropriate amount of tin droplets is left in the coil 1 to be tinned; a scraping surface step, please refer to the twentieth figure, the adsorption mechanism A2 adsorption coil 1 After the dip tank C2 is lowered into the tin bath C11, the carrier C31 and the upper scraping member C3 are driven forward, and the scraping member C3 is scraped off on the upper surface of the tin bath of the tin bath C11. The operation, and when the scraping member C3 is moved forward to the positioning, the pressure pad C34 of the carrier C31 is located just below the adsorption coil 1 of the adsorption mechanism A2; for the step of pressing the tin droplet, please refer to the twenty-first figure, adsorption The mechanism A2 adsorbs the tin which has been properly stained with tin droplets and is left on the coil 1 to be tinted. The tin droplets on the tin surface to be pressed are pressed against the pressure pad C34, and the semi-solidified tin droplets are pressed. Squashed to the level as in the second picture line slot 114 After the whole state, the adsorption mechanism A2 moves the coil 1 up, and the scraping member C3 and the cutting piece C4 move back to the initial step state.

Referring to the twenty-second figure, the discharge device can use the discharge device F as shown in the figure, which is used for taking the pick-and-place mechanism A which completes the coiled wire 1 from the intermittent rotary flow path of the transfer device 2 And sent to the collecting device G for collecting, comprising: a receiving mechanism F1, comprising a receiving seat F12 disposed on a rotating seat F11, the receiving seat F12 is driven by a lifting driving member F13 and can be made up and down on the rotating seat F11 Displacement, and the rotary seat F11 is driven by a rotating drive F14 via a belt F141 to rotate at a preset angle to drive the socket F12 on the rotary seat F11 to be turned upwards downward; the receiving seat F12 a plurality of recessed mounting sections F121 are provided, each recessed mounting section F121 is slightly larger than the coil 1 that is intended to be received, and a negative pressure suction hole F122 is provided in each of the recesses; It can be laterally displaced by a shifting driving member F15 disposed on the side thereof; a conveying mechanism F2 is constituted by a conveying belt F21 driven to circulate, and a measuring component F22 is disposed on the conveying path. And the image detecting device F23, wherein the image detecting device F23 detects the tinned wire 1 whether the finished product yield, thereby measuring element F22 is measured whether the available material or a defective product in the first few sort of coil position appears to reflect to the process control system.

The discharge process in the discharge device F includes the following steps: an initial step, the respective coils 1 adsorbed by the pick-and-place mechanism A are corresponding to the receiving mechanism F1, and the mounting portions F121 of the recesses F12 are lowered and lowered (by the first In the ten figure, the cylinder rod D5 driven by the driving member D6 is driven to place the coil 1 therein, and the coil 1 is biased against one side of the mounting section F121 when being placed; and an adsorption step is carried in the section F121. The negative pressure suction hole F122 is sucked into the negative pressure to adsorb the coil in the mounting section F121; For a shifting step, please refer to the twenty-third figure. The receiving seat F12 is driven by the shifting driving member F15 to be laterally displaced. When the coil 1 is biased against the side of the mounting section F121, the displacement is generated. The side edge is formed to act on the coil, so that the coil 1 can be detached from the pick-and-place mechanism A and be placed in the loading section F121 to be adsorbed; a flipping step, please refer to the twenty-fourth, twenty-fifth In the figure, the receiving seat F12 adsorbs the coils 1 and is turned upside down by the rotating seat F11 together with the lifting and lowering drive member F13, and stops the negative pressure adsorption to place the coil on the conveying belt F21 of the conveying mechanism F2 with the tin-plated surface facing up. Collected by transport.

Referring to the twenty-sixth and twenty-seventh drawings, the conveying means used in the tin-staining method of the embodiment of the present invention can be executed at a workstation of the intermittent rotating flow path of the conveying device after the coil is tinned and released for collection. For the cleaning process of the pick-and-place mechanism A, and using the cleaning device H as shown in the figure, comprising: a cleaning tank H1 for accommodating the cleaning liquid inside; a cleaning element H2, which is provided by a plurality of bristles provided on a moving seat H21. The bristles of the cleaning element H2 can be infiltrated by the cleaning liquid inside the cleaning tank H1, and the moving seat H21 can be driven by the cleaning driving member H22 disposed on the side of the cleaning tank H1, and the cleaning element H2 is interlocked for lateral reciprocating displacement. On the other side of the cleaning tank H1, there is a drying mechanism H23 for blowing in the direction corresponding to the cleaning element H2; when the suction mechanism A2 of the pick-and-place mechanism A is indirectly transferred to the cleaning tank H1 of the cleaning device H, the cleaning element The H2 will be driven to displace, and the cleaning step of the adsorption surface of the adsorption mechanism A2 is performed. After completion, the drying mechanism H23 performs the drying step of the adsorption surface of the adsorption mechanism A2.

In view of the above, the soldering method and apparatus provided by the embodiments of the present invention, when the soldering method and apparatus are provided, the transporting apparatus 2 uses a rotating flow path to carry, for example, the coil 1 to be transported by the tin component, except for the action of the mechanism. The flow path is more regular, the tinned liquid of different coils 1 and the welding The agent can be simultaneously performed to greatly improve the overall process efficiency; in addition, the rotating flow path of the conveying device 2 does not interfere with the working space of each workstation, so each workpiece station can control, for example, the degree of flux infiltration, and the tin droplets are cut and The flattening, the finished product is turned over and conveyed, and the like, for effective fine processing, so that the quality of the coil tin is effectively improved.

The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.

C‧‧‧Staining device

C1‧‧‧ Tin furnace

D‧‧‧掣抵装置

D1‧‧‧Rack

D2‧‧‧ drive parts

D3‧‧‧掣掣件

D4‧‧‧ cantilever

D5‧‧‧Cylinder rod

D6‧‧‧ drive parts

E‧‧‧Exhaust device

Claims (9)

A soldering method for diluting a tin component to be tinned comprises the following steps: an initial step of transferring the tin component to a tin bath; and a tinning step, the tin component to be transferred to the tin bath The tin liquid surface is close, and a tin bath is raised from the tin bath, so that the surface of the tin liquid contained thereon is in proper contact with the tin surface to be tinned, and the tin liquid is adhered thereto; The cut piece is driven to cut the drawn tin droplets, so that the drawn portion is cut, and the appropriate amount of tin droplets are intercepted and left on the tin to be tinted component; a scraping surface step A scraping member is driven on the upper surface of the tin bath of the tin bath to perform a scraping operation of the surface oxygen layer. The method for immersing tin according to claim 1, wherein a step of pressing a tin is performed after the step of cutting, so that a tin powder having a proper amount of tin is left to be placed on the tin to be tinned The component is lowered again, and the tin droplets to be tinned are pressed against a pressure pad to flatten the semi-solidified tin droplets to a predetermined flat state. A tin-impregnating device comprising: a tin furnace having a tin bath for heating the tin liquid inside; a tin-dip tank immersed in the tin bath and carried by a carrier driven by a driving member The liquid scraping member can be displaced up and down on the surface of the tin bath of the tin bath; a scraping member is disposed on a carrier, the carrier is driven by a scraping driving member, and the scraping member can be displaced forward and backward on the upper surface of the tin bath of the tin bath. As a scraping operation of the oxygen layer on the surface of the tin liquid; a truncated piece is located in front of the scraping member and is driven by a truncated driving member, and the truncating and descending piece can be displaced before and after the tin bath surface of the tin bath, and the truncating piece is cut The drawn tin droplets can be driven to cut, so that the drawn portion is cut. The dip soldering device according to claim 3, wherein the soldering device comprises a pick-up device and an adsorption mechanism, and the pick-up device is located in front of the soldering device, and drives the pick-up member to the lower portion by the driving member. The mechanism causes the adsorption mechanism to operate to cause the tin-stained component to be adsorbed under the workpiece to be moved down for the tinning operation. For example, the dip soldering device described in claim 3, further comprising an exhaust device disposed above the tin furnace of the dip tin device to suck the toxic gas volatilized by the tin liquid in the tin furnace. For example, the dip soldering device described in claim 3, wherein there is further provided with a slag removing member, which is buckled with the cutting piece and can be driven to be laterally displaced to the left and right to the dross adhered to the cutting piece. Scrape off. The dip soldering device according to claim 3, wherein the carrier carrying the tin bath has a driving member driven by the upper and lower displacement paths parallel to the upper and lower displacement paths of the tin bath, but separated by an appropriate spacing. The dip soldering device according to the third aspect of the patent application, wherein the carrier provided with the scraping member is provided with a pressure pad, and the tin droplets to be adhered to the tin surface of the tin component to be pressed against the pressure pad. The dip soldering device according to claim 3, wherein the truncated drop member is attached to both ends of a bracket by two ends of the wire body, and the bracket is located between the carriers of the tin bath and the scraping The liquid part is outside the carrier.