TWI572211B - Speaker and massager assembly - Google Patents
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- TWI572211B TWI572211B TW103126144A TW103126144A TWI572211B TW I572211 B TWI572211 B TW I572211B TW 103126144 A TW103126144 A TW 103126144A TW 103126144 A TW103126144 A TW 103126144A TW I572211 B TWI572211 B TW I572211B
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Description
本發明係關於一種喇叭與按摩器組合。 The invention relates to a combination of a horn and a massager.
公告號第M258724號中華民國新型專利,揭露一種一體式旋轉揉捏與捶擊按摩結構。該結構裝設於椅上時,即成含有旋轉揉捏,與捶擊的按摩椅。使用按摩椅按摩時,需持續坐在椅子上,非常麻煩而不方便,也消耗很多寶貴的時間。 Announcement No. M258724, a new patent of the Republic of China, discloses an integrated rotary kneading and slamming massage structure. When the structure is installed on a chair, it is a massage chair that has a rotary kneading and a slamming. When using a massage chair to massage, you need to sit on the chair continuously, which is very troublesome and inconvenient, and also consumes a lot of precious time.
公告號第M424935號中華民國新型專利,揭露腳部理療機結構。此種結構僅用於腳部,不能運用到身體其他部位,所以功能也受限。 Bulletin No. M424935, a new patent of the Republic of China, reveals the structure of the foot physiotherapy machine. This structure is only used for the foot and cannot be applied to other parts of the body, so the function is also limited.
公告號第I342208號中華民國發明專利,是以一種空氣槍對穴位,進行按摩設備。而該設備較笨重,所以功能也受限。 Announcement No. I342208, the Republic of China invention patent, is an air gun to the acupuncture points, massage equipment. The device is cumbersome, so the function is limited.
目前尚沒有一種輕薄短小、攜帶方便的一邊可以聽音樂,一邊又可以進行按摩的裝置。 At present, there is no such thing as a light and short, portable one that can listen to music while being able to massage.
根據上述問題,本發明提供多實施例之喇叭與按摩器組合。 In accordance with the above problems, the present invention provides a combination of a horn and a massager of various embodiments.
本發明一實施例之喇叭與按摩器組合,包含一包覆件、至少一模組、一上蓋、複數第一圍籬式壩條、一下蓋及複數第二圍籬式壩條。至少一模組固定在包覆件上。模組包含一可彎曲薄膜、複數第一驅動裝置,及複數第二驅動裝置。複數第一驅動裝置,形成於可彎曲薄膜上。各第一驅動裝置包含兩第一電極,和位在兩第一電極之間之壓電材料。該些第一驅動裝置,用於驅動該薄膜,以產生可聽之聲音。複數第二驅動裝置,形成於可彎曲薄膜上。各第二驅動裝置包含兩第二電極,和位在兩第二電極之間之壓電材料。該些第二驅動裝置用於驅動薄膜,以產生超音波。上蓋 包含複數第一共振腔。該些第一共振腔,對應該些第一驅動裝置,與該些第二驅動裝置設置。複數第一圍籬式壩條對應地圍繞該些第一共振腔,和該上蓋之蓋緣。上蓋藉由該些第一圍籬式壩條,固定於可彎曲薄膜。下蓋包含複數第二共振腔。該些第二共振腔,對應該些第一驅動裝置,與該些第二驅動裝置設置。可彎曲薄膜位在上蓋與下蓋之間。複數第二圍籬式壩條對應地圍繞該些第二共振腔,和下蓋之蓋緣。下蓋藉由該些第二圍籬式壩條固定於可彎曲薄膜。 The horn and the massager according to an embodiment of the invention comprises a covering member, at least one module, an upper cover, a plurality of first fence dam bars, a lower cover and a plurality of second fence dam bars. At least one module is fixed to the cover member. The module includes a flexible film, a plurality of first driving devices, and a plurality of second driving devices. A plurality of first drive means are formed on the flexible film. Each of the first driving devices includes two first electrodes and a piezoelectric material positioned between the two first electrodes. The first driving devices are used to drive the film to produce an audible sound. A plurality of second drive means are formed on the flexible film. Each of the second driving devices includes two second electrodes and a piezoelectric material positioned between the two second electrodes. The second driving means are for driving the film to generate ultrasonic waves. Upper cover A plurality of first resonant cavities are included. The first resonant cavities are disposed corresponding to the first driving devices and the second driving devices. A plurality of first fenced dams correspondingly surround the first resonant cavities and a cover edge of the upper cover. The upper cover is fixed to the flexible film by the first fenced dams. The lower cover includes a plurality of second resonant cavities. The second resonant cavities are disposed corresponding to the first driving devices and the second driving devices. The flexible film is positioned between the upper cover and the lower cover. A plurality of second fence dams correspondingly surround the second resonant cavities and a cover edge of the lower cover. The lower cover is fixed to the flexible film by the second fence dams.
本發明一實施例之喇叭與按摩器組合,包含一包覆件及一第一裝置。第一裝置固定在包覆件上。第一裝置包含一撓性基板、複數第一線圈、至少一第二線圈,及一共振箱。該些第一線圈,用於產生超音波振動。至少一第二線圈,用於產生可聽之聲音。共振箱包含對應該些第一線圈,和至少一第二線圈,而設置之磁性片,其中該些第一線圈,和至少一第二線圈,形成於撓性基板,且撓性基板固定在共振箱。 The horn and the massager according to an embodiment of the invention comprises a covering member and a first device. The first device is fixed to the cover member. The first device comprises a flexible substrate, a plurality of first coils, at least one second coil, and a resonance box. The first coils are used to generate ultrasonic vibrations. At least one second coil for generating an audible sound. The resonance box includes magnetic sheets corresponding to the first coils and at least one second coil, wherein the first coils and the at least one second coil are formed on the flexible substrate, and the flexible substrate is fixed at the resonance box.
本發明至少一實施例之喇叭與按摩器組合,可以一邊聽音樂,一邊進行「肌肉及穴位超音波按摩」,這樣在按摩時,不會覺得無聊。因為不必躺在床上,或是坐在椅子上,而是可隨身攜帶,故不會影響工作,非常輕便而舒適。 In combination with the horn and the massager of at least one embodiment of the present invention, it is possible to perform "muscle and acupoint ultrasonic massage" while listening to music, so that it is not boring when massaged. Because you don't have to lie in bed or sit in a chair, you can carry it with you, so it doesn't affect your work, it's very light and comfortable.
1、1a‧‧‧喇叭與按摩器組合 1, 1a‧‧‧ horn and massager combination
10‧‧‧包覆件 10‧‧‧Cover parts
11‧‧‧第一裝置 11‧‧‧ first device
12‧‧‧第二裝置 12‧‧‧second device
13‧‧‧第三裝置 13‧‧‧ third device
14‧‧‧第四裝置 14‧‧‧ fourth device
15‧‧‧壓電驅動模組 15‧‧‧Piezoelectric drive module
16‧‧‧上蓋 16‧‧‧Upper cover
17‧‧‧圍籬式壩條 17‧‧‧Fence dam
18‧‧‧下蓋 18‧‧‧Under the cover
111、121、131、141‧‧‧撓性基板 111, 121, 131, 141‧‧ ‧ flexible substrate
112、132‧‧‧第一線圈 112, 132‧‧‧ first coil
113、133‧‧‧第二線圈 113, 133‧‧‧ second coil
114、123、134、143‧‧‧共振箱模組 114, 123, 134, 143‧‧ ‧ Resonance box module
115、125、135、145‧‧‧晶片 115, 125, 135, 145‧‧‧ wafers
116、126、136、146‧‧‧電池接墊 116, 126, 136, 146‧‧‧ battery pads
118、128、138、148‧‧‧絕緣層 118, 128, 138, 148‧‧‧ insulation
119、129、139、149‧‧‧導體 119, 129, 139, 149‧‧‧ conductor
122、142‧‧‧線圈(微小型線圈) 122, 142‧‧‧ coils (micro-miniature coils)
117、127、137、147‧‧‧磁性片 117, 127, 137, 147‧‧ magnetic sheets
151‧‧‧薄膜 151‧‧‧film
152‧‧‧第一驅動裝置 152‧‧‧First drive
153‧‧‧第二驅動裝置 153‧‧‧Second drive
161‧‧‧共振腔 161‧‧‧Resonance cavity
162‧‧‧蓋緣 162‧‧‧ Cover
1141、1231、1341、1431‧‧‧微小型凹槽 1141, 1231, 1341, 1431‧‧‧ micro-miniature grooves
1142、1342‧‧‧大型凹槽 1142, 1342‧‧‧ large groove
1143、1343‧‧‧中型凹槽 1143, 1343‧‧‧ medium recess
1144、1344‧‧‧小型凹槽 1144, 1344‧‧‧ small groove
1521、1522‧‧‧電極 1521, 1522‧‧‧ electrodes
1523‧‧‧壓電材料 1523‧‧‧Piezoelectric materials
圖1為本發明一實施例之喇叭與按摩器組合之示意圖。 1 is a schematic view of a combination of a horn and a massager according to an embodiment of the present invention.
圖2為沿圖1割面線1000-1000的剖視圖。 Figure 2 is a cross-sectional view taken along line 1000-1000 of Figure 1.
圖3為沿圖1割面線2000-2000的剖視圖。 Figure 3 is a cross-sectional view taken along line 2000-2000 of Figure 1.
圖4為本發明一實施例之第一裝置之部分電子元件之示意圖。 4 is a schematic diagram of a portion of electronic components of a first device in accordance with an embodiment of the present invention.
圖5為本發明一實施例之第一裝置之另一部分共振箱之示意圖。 FIG. 5 is a schematic diagram of another portion of the resonance box of the first device according to an embodiment of the present invention.
圖6為本發明一實施例之第二裝置之部分電子元件之示意圖。 6 is a schematic diagram of a portion of electronic components of a second device in accordance with an embodiment of the present invention.
圖7為本發明一實施例之第二裝置之另一部分共振箱之示意圖。 FIG. 7 is a schematic diagram of another portion of a resonance box of a second device according to an embodiment of the present invention.
圖8為本發明一實施例之第三裝置之部分電子元件之示意圖。 8 is a schematic diagram of a portion of electronic components of a third device in accordance with an embodiment of the present invention.
圖9為本發明一實施例之第三裝置之另一部份共振箱之示意圖。 9 is a schematic diagram of another portion of a resonance box of a third device according to an embodiment of the present invention.
圖10為本發明一實施例之第四裝置之部分電子元件之示意圖。 10 is a schematic diagram of a portion of electronic components of a fourth device in accordance with an embodiment of the present invention.
圖11為本發明一實施例之第四裝置之另一部分共振箱之示意圖。 Figure 11 is a schematic view of another portion of the resonance box of the fourth device in accordance with an embodiment of the present invention.
圖12為本發明一實施例之喇叭與按摩器組合之示意圖。 Figure 12 is a schematic illustration of a combination of a horn and a massager in accordance with one embodiment of the present invention.
圖13為本發明一實施例之模組之示意圖。 FIG. 13 is a schematic diagram of a module according to an embodiment of the present invention.
圖14為沿圖13割面線3000-3000的剖視圖。 Figure 14 is a cross-sectional view taken along line 3000-3000 of Figure 13.
圖15為本發明一實施例之示意圖,其例示在薄膜上之電極。 Figure 15 is a schematic illustration of an embodiment of the invention illustrating an electrode on a film.
圖16沿圖15割面線4000-4000的剖視圖。 Figure 16 is a cross-sectional view taken along line 4000-4000 of Figure 15.
圖17為本發明一實施例之上蓋之示意圖。 Figure 17 is a schematic view of an upper cover according to an embodiment of the present invention.
圖18沿圖17割面線5000-5000的剖視圖。 Figure 18 is a cross-sectional view taken along line 5000-5000 of Figure 17.
圖19為本發明一實施例之具有圍籬式壩條的上蓋之示意圖。 Figure 19 is a schematic view of an upper cover having a fence type dam according to an embodiment of the present invention.
圖1為本發明一實施例之喇叭與按摩器組合1之示意圖。圖2為沿圖1割面線1000-1000的剖視圖。圖3為沿圖1割面線2000-2000的剖視圖。 1 is a schematic view of a combination of a horn and a massager 1 according to an embodiment of the present invention. Figure 2 is a cross-sectional view taken along line 1000-1000 of Figure 1. Figure 3 is a cross-sectional view taken along line 2000-2000 of Figure 1.
在至少一實施例中,喇叭與按摩器組合1,包含一第一裝置11、一第二裝置12、一第三裝置13與一第四裝置14中至少一者,及一包覆件(wrap component)10,其中第一裝置11、第二裝置12、第三裝置13,及第四裝置14中,至少一者固定在包覆件10上。在一些實施例中,喇叭與按摩器組合1,包含一第一裝置11與一第三裝置13中之一者,及一包覆件10,其中第一裝置11與第三裝置13中之一者,固定在包覆件10上。在一些實施例中,喇叭與按摩器組合1,包含一第二裝置12與一第四裝置14中之一者,及一包覆件10,其中第二裝置12與第四裝置14中之一者,固定在包覆件10。 In at least one embodiment, the horn and massager combination 1 includes a first device 11, a second device 12, at least one of a third device 13 and a fourth device 14, and a wrapper (wrap Component 10, wherein at least one of the first device 11, the second device 12, the third device 13, and the fourth device 14 is fixed to the cover member 10. In some embodiments, the horn and massager combination 1 includes one of a first device 11 and a third device 13, and a cover member 10, wherein one of the first device 11 and the third device 13 It is fixed on the cover member 10. In some embodiments, the horn and massager combination 1 includes one of a second device 12 and a fourth device 14, and a cover member 10, wherein one of the second device 12 and the fourth device 14 It is fixed to the covering member 10.
在一些實施例中,喇叭與按摩器組合1,包含一包覆件(wrap component)10、一第一裝置11、一第二裝置12、一第三裝置13,及一第 四裝置14。第一裝置11可發出超音波。第一裝置11可發出可聽之聲音(audible sound)。第二裝置12可發出超音波。第三裝置13可發出超音波。第三裝置13可發出可聽之聲音。第四裝置14可發出超音波。第一裝置11、第二裝置12、第三裝置13及第四裝置14,可分別製作,然後組裝一起,但本發明不以此為限。在一些實施例中,第一裝置11、第二裝置12、第三裝置13及第四裝置14,可在組裝後再固定在包覆件10。在一些實施例中,第一裝置11、第二裝置12、第三裝置13及第四裝置14,可個別固定在包覆件10上。包覆件10可圍繞在使用者的四肢、頭部或身上,使第一裝置11、第二裝置12、第三裝置13及第四裝置14,發出的超音波,可對肌肉及穴位進行按摩,而且可利用第一裝置11和第三裝置13播放音樂。 In some embodiments, the horn and massager combination 1 includes a wrap component 10, a first device 11, a second device 12, a third device 13, and a first Four devices 14. The first device 11 can emit ultrasonic waves. The first device 11 can emit an audible sound. The second device 12 can emit ultrasonic waves. The third device 13 can emit an ultrasonic wave. The third device 13 can emit an audible sound. The fourth device 14 can emit ultrasonic waves. The first device 11, the second device 12, the third device 13, and the fourth device 14 can be separately fabricated and then assembled together, but the invention is not limited thereto. In some embodiments, the first device 11, the second device 12, the third device 13, and the fourth device 14 can be secured to the cover member 10 after assembly. In some embodiments, the first device 11, the second device 12, the third device 13, and the fourth device 14 can be individually secured to the cover member 10. The covering member 10 can surround the limbs, the head or the body of the user, and the first device 11, the second device 12, the third device 13 and the fourth device 14 emit ultrasonic waves, which can massage the muscles and acupuncture points. And the first device 11 and the third device 13 can be used to play music.
圖4為本發明一實施例之第一裝置11之部分電子元件之示意圖。圖5為本發明一實施例之第一裝置11之另一部分共振箱之示意圖。 4 is a schematic diagram of a portion of electronic components of a first device 11 in accordance with an embodiment of the present invention. FIG. 5 is a schematic diagram of another portion of the resonance box of the first device 11 according to an embodiment of the present invention.
參照圖2、圖4與圖5所示,第一裝置11包含一撓性基板111、複數第一線圈112、至少一第二線圈113,及一共振箱模組114。複數第一線圈112與至少一第二線圈113,形成於撓性基板111。第一線圈112可為微小型線圈。第一線圈112用於產生超音波振動。第二線圈113用於產生可聽之聲音(audible sound)。撓性基板111是固定在共振箱模組114。撓性基板111可貼合在共振箱模組114。撓性基板111可黏合在共振箱模組114。在一些實施例中,至少一第二線圈113包含大、中、小型線圈,而該些大、小不同的線圈,可發出低頻、中頻、高頻的可聽之聲音。 Referring to FIGS. 2, 4 and 5, the first device 11 includes a flexible substrate 111, a plurality of first coils 112, at least one second coil 113, and a resonance box module 114. The plurality of first coils 112 and the at least one second coil 113 are formed on the flexible substrate 111. The first coil 112 can be a micro-miniature coil. The first coil 112 is used to generate ultrasonic vibration. The second coil 113 is for generating an audible sound. The flexible substrate 111 is fixed to the resonance box module 114. The flexible substrate 111 can be attached to the resonance box module 114. The flexible substrate 111 can be bonded to the resonance box module 114. In some embodiments, at least one of the second coils 113 includes large, medium, and small coils, and the large and small coils can emit low frequency, intermediate frequency, and high frequency audible sounds.
在一些實施例中,撓性基板111的邊界可做熱處理,以消除撓性基板111的張力,這樣施作使撓性基板111,在接觸身體的各個部位時,可以更貼附。 In some embodiments, the boundary of the flexible substrate 111 can be heat treated to eliminate the tension of the flexible substrate 111, so that the flexible substrate 111 can be attached more when it contacts various parts of the body.
共振箱模組114可分隔成複數微小型凹槽1141,複數微小型凹槽1141是對應複數第一線圈112而設置。在一些實施例中,至少一第二線圈113包含大型線圈,而共振箱模組114可包含大型凹槽1142,其中大型凹槽1142對應大型線圈設置。在一些實施例中,至少一第二線圈113包含兩中型線圈,而共振箱模組114可包含兩分開的中型凹槽1143,其中兩中線圈分別位在兩中型凹槽1143的上方。在一些實施例中,至少一第二 線圈113包含一小型線圈,而共振箱模組114包含複數小型凹槽1144,其中、小型線圈位在複數小型凹槽1144的上方。 The resonant box module 114 can be partitioned into a plurality of micro-miniature recesses 1141, and the plurality of micro-miniature recesses 1141 are disposed corresponding to the plurality of first coils 112. In some embodiments, at least one of the second coils 113 includes a large coil, and the resonant box module 114 can include a large recess 1142, wherein the large recess 1142 is corresponding to a large coil. In some embodiments, the at least one second coil 113 includes two medium-sized coils, and the resonant box module 114 can include two separate medium-sized recesses 1143, wherein the two middle coils are respectively positioned above the two medium-sized recesses 1143. In some embodiments, at least one second The coil 113 includes a small coil, and the resonant box module 114 includes a plurality of small recesses 1144, wherein the small coils are positioned above the plurality of small recesses 1144.
再參照圖2所示,共振箱模組114包含磁性片117,其中磁性片117,是對應複數第一線圈112(如圖4),與至少一第二線圈113而設置。第一線圈112可產生一正向磁場和一反轉磁場。該正向磁場與該反轉磁場,和共振箱模組114底部磁性片的磁場,會產生吸引或排斥作用,使位在對應凹槽1141(如圖5)正上方,未被固定的撓性基板111的部分,產生超音波振動。在一些實施例中,位在對應凹槽1141正上方,撓性基板111部分的四周,可被固定。第二線圈113所產生的正向磁場與反轉磁場,和共振箱模組114的底部磁性片的磁場,也會產生吸引或排斥作用,使位在凹槽(1142、1143和1144)上方,撓性基板111上未被固定的部分,從而產生可聽之聲音。在一些實施例中,共振箱模組114包含磁性片。在一些實施例中,每一凹槽(1142、1143和1144)的底部,設置磁性片。在一些實施例中,磁性片的厚度,介於100~1000微米(但本發明並不以此為限)。在一些實施例中,磁性片包含鐵、鈷、鎳等磁性,及高分子材料(但本發明並不以此為限)。 Referring again to FIG. 2, the resonant box module 114 includes a magnetic sheet 117, wherein the magnetic sheet 117 is disposed corresponding to the plurality of first coils 112 (FIG. 4) and the at least one second coil 113. The first coil 112 can generate a forward magnetic field and a reverse magnetic field. The forward magnetic field and the reversing magnetic field, and the magnetic field of the magnetic piece at the bottom of the resonance box module 114, may cause attraction or repulsion to be positioned directly above the corresponding groove 1141 (Fig. 5), without being fixed. Ultrasonic vibration is generated in a portion of the substrate 111. In some embodiments, the position is directly above the corresponding recess 1141, and the periphery of the portion of the flexible substrate 111 can be fixed. The forward magnetic field and the reverse magnetic field generated by the second coil 113, and the magnetic field of the bottom magnetic piece of the resonance box module 114, also cause attraction or repulsion to be placed above the grooves (1142, 1143, and 1144). A portion of the flexible substrate 111 that is not fixed, thereby producing an audible sound. In some embodiments, the resonant box module 114 includes a magnetic sheet. In some embodiments, a magnetic sheet is disposed at the bottom of each of the grooves (1142, 1143, and 1144). In some embodiments, the thickness of the magnetic sheet is between 100 and 1000 microns (but the invention is not limited thereto). In some embodiments, the magnetic sheet comprises magnetic materials such as iron, cobalt, nickel, and the like, and the polymer material (but the invention is not limited thereto).
在一些實施例中,第一線圈112與第二線圈113包含銀。在一些實施例中,第一線圈112與第二線圈113包含高分子材料和銀。在一些實施例中,第一線圈112與第二線圈113是利用銀膠製作。在一些實施例中,第一線圈112與第二線圈113包含金、鉻及鎳等金屬之組合。在一些實施例中,第一線圈112或第二線圈113的厚度,為10至100微米(但本發明並不以此為限)。 In some embodiments, the first coil 112 and the second coil 113 comprise silver. In some embodiments, the first coil 112 and the second coil 113 comprise a polymeric material and silver. In some embodiments, the first coil 112 and the second coil 113 are fabricated using silver glue. In some embodiments, the first coil 112 and the second coil 113 comprise a combination of metals such as gold, chromium, and nickel. In some embodiments, the thickness of the first coil 112 or the second coil 113 is 10 to 100 micrometers (but the invention is not limited thereto).
參照圖4所示,第一裝置11包含晶片115。晶片115設置在撓性基板111,並耦接複數第一線圈112(未繪示),與至少一第二線圈113。晶片115可用於提供電流,給複數第一線圈112,與至少一第二線圈113。在一些實施例中,晶片115包含無線通訊元件,例如:射頻辨識標籤(RFID)、ZIGBEE或藍牙元件,使得晶片115可以無線方式,控制其工作模式及相關參數的設定(如表1),如晶片內包含一萬用信號及波形產生器(Universal Signal and Function Generator),可運用遙控器,以無線方式設定晶片,產生超音波振動的波形(如弦式波,方波,鋸齒波,或是脈波),並設定振動頻率, 及振動時間,及任務週期(詳如表1)。 Referring to FIG. 4, the first device 11 includes a wafer 115. The wafer 115 is disposed on the flexible substrate 111 and coupled to the plurality of first coils 112 (not shown) and the at least one second coil 113. Wafer 115 can be used to provide current to a plurality of first coils 112, and at least a second coil 113. In some embodiments, the wafer 115 includes a wireless communication component, such as a radio frequency identification tag (RFID), ZIGBEE, or Bluetooth component, such that the wafer 115 can be wirelessly controlled to control its operating mode and associated parameter settings (eg, Table 1), such as The chip contains a universal signal and function generator (Universal Signal and Function Generator), which can use the remote control to wirelessly set the chip to generate ultrasonic vibration waveforms (such as string wave, square wave, sawtooth wave, or Pulse wave) and set the vibration frequency, And vibration time, and task cycle (see Table 1).
表1為超音波振動的波形(如弦式波,方波,鋸齒波,或是脈波),振動頻率,振動時間,及任務週期設定對照表(但本發明並不以此為限)。 Table 1 is a waveform of ultrasonic vibration (such as a string wave, a square wave, a sawtooth wave, or a pulse wave), a vibration frequency, a vibration time, and a duty cycle setting table (but the invention is not limited thereto).
00:弦式波,01:方波,10:鋸齒波,11:脈波 00: string wave, 01: square wave, 10: sawtooth wave, 11: pulse wave
00:1分鐘,01:2分鐘,1 0:3分鐘,11:4分鐘 00:1 minute, 01:2 minutes, 1 0:3 minutes, 11:4 minutes
00:30KHz,01:40KHz,1 0:50KHz,11:60KHz 00:30KHz, 01:40KHz, 1 0:50KHz, 11:60KHz
00:10%,01:25%,1 0:50%,11:75% 00:10%, 01:25%, 1 0:50%, 11:75%
在一些實施例中,晶片115包含非揮發記憶體(Non-Volatile Memory),例如:電抹可程式記憶體(Electrical Erasable and Programmable Read-Only-Memory,EEPROM),或快閃記憶體(Flash Memory)。在一些實施例中,晶片115的非揮發記憶體,可儲存音樂檔,而晶片115可將該音樂檔,轉成音頻信號(audio signals),並根據該音頻信號,驅動提供電流於至少一第二線圈113,以產生音樂。在一些實施例中,晶片115包含一放大器,其中放大器用於放大音頻,或超音波信號。 In some embodiments, the wafer 115 includes a Non-Volatile Memory, such as an Electrical Erasable and Programmable Read-Only-Memory (EEPROM), or a Flash Memory (Flash Memory). ). In some embodiments, the non-volatile memory of the wafer 115 can store music files, and the wafer 115 can convert the music file into audio signals, and according to the audio signal, drive the current supply to at least one The second coil 113 is used to generate music. In some embodiments, wafer 115 includes an amplifier, wherein the amplifier is used to amplify audio, or an ultrasonic signal.
參照圖4所示,第一裝置11包含電池接墊116。電池接墊116耦接晶片115。電池接墊116上可設置電池,以提供電源給晶片115。 Referring to FIG. 4, the first device 11 includes a battery pad 116. The battery pad 116 is coupled to the wafer 115. A battery can be placed on the battery pad 116 to provide power to the wafer 115.
圖6為本發明一實施例之第二裝置12之部分電子元件之示 意圖。圖7為本發明一實施例之第二裝置12之另一部分共振箱之示意圖。 FIG. 6 is a diagram showing a part of electronic components of a second device 12 according to an embodiment of the present invention; intention. FIG. 7 is a schematic diagram of another portion of the resonance box of the second device 12 according to an embodiment of the present invention.
參照圖3、圖6與圖7所示,第二裝置12包含一撓性基板121、複數線圈122,及一共振箱模組123。線圈122可為微小型線圈。線圈122用於產生超音波。複數線圈122形成於撓性基板121上。撓性基板121是固定在共振箱模組123上。撓性基板121可貼合在共振箱模組123之上。撓性基板121可黏合在共振箱模組123上。在一些實施例中,線圈122包含銀。在一些實施例中,線圈122包含高分子材料與銀。在一些實施例中,線圈122是利用銀膠製作。在一些實施例中,線圈122包含金、鉻及鎳等金屬之組合(但本發明並不以此為限)。在一些實施例中,線圈122的厚度為10至100微米(但本發明並不以此為限)。 Referring to FIGS. 3, 6, and 7, the second device 12 includes a flexible substrate 121, a plurality of coils 122, and a resonant box module 123. The coil 122 can be a micro-miniature coil. The coil 122 is used to generate ultrasonic waves. The complex coil 122 is formed on the flexible substrate 121. The flexible substrate 121 is fixed to the resonance box module 123. The flexible substrate 121 can be attached to the resonance box module 123. The flexible substrate 121 can be bonded to the resonance box module 123. In some embodiments, the coil 122 contains silver. In some embodiments, the coil 122 comprises a polymeric material and silver. In some embodiments, the coil 122 is fabricated from silver glue. In some embodiments, the coil 122 comprises a combination of metals such as gold, chromium, and nickel (but the invention is not limited thereto). In some embodiments, the thickness of the coil 122 is 10 to 100 microns (but the invention is not limited thereto).
參照圖1所示,第二裝置12的撓性基板121,是與第一裝置11的撓性基板111相接合。在一些實施例中,第二裝置12的撓性基板121,與第一裝置11的撓性基板111,是利用加熱接合。 Referring to FIG. 1, the flexible substrate 121 of the second device 12 is bonded to the flexible substrate 111 of the first device 11. In some embodiments, the flexible substrate 121 of the second device 12, and the flexible substrate 111 of the first device 11, are joined by heat.
在一些實施例中,撓性基板121的邊界可做熱處理,以消除撓性基板121的張力,這樣施作在身體的各個部位時,可以更貼附。 In some embodiments, the boundary of the flexible substrate 121 may be heat treated to eliminate the tension of the flexible substrate 121, so that it can be attached more when applied to various parts of the body.
共振箱模組123可分隔成複數微小型凹槽1231。複數微小型凹槽1231,是對應複數線圈122而設置。共振箱模組123包含磁性片127,其中磁性片127,是對應複數線圈122而設置,如圖3所示。在一些實施例中,每一凹槽1231的底部,設置磁性片。在一些實施例中,磁性片的厚度,介於100~1000微米(但本發明並不以此為限)。在一些實施例中,磁性片包含鐵、鈷、鎳等磁性,及高分子材料(但本發明並不以此為限)。 The resonance box module 123 can be divided into a plurality of micro-miniature grooves 1231. The plurality of micro-miniature grooves 1231 are provided corresponding to the plurality of coils 122. The resonance box module 123 includes a magnetic sheet 127, wherein the magnetic sheet 127 is disposed corresponding to the plurality of coils 122, as shown in FIG. In some embodiments, a magnetic sheet is disposed at the bottom of each of the grooves 1231. In some embodiments, the thickness of the magnetic sheet is between 100 and 1000 microns (but the invention is not limited thereto). In some embodiments, the magnetic sheet comprises magnetic materials such as iron, cobalt, nickel, and the like, and the polymer material (but the invention is not limited thereto).
參照圖6所示,第二裝置12可包含晶片125。晶片125設置在撓性基板121上。晶片125耦接複數線圈122(未繪示),以提供電流於線圈122。在一些實施例中,晶片125包含無線通訊元件,例如:射頻辨識標籤(RFID)、ZIGBEE或藍牙元件,使得晶片125可以無線方式,控制其工作模式及相關參數的設定(如表1)。如晶片內包含一萬用信號及波形產生器(Universal Signal and Function Generator),可運用遙控器,以無線方式設定晶片,產生超音波振動的波形(如弦式波,方波,鋸齒波,或是脈波),並設定振動頻率,及振動時間,及任務週期(詳如表1)。第二裝置12可包含電 池接墊126。電池接墊126耦接晶片125。電池接墊126上可設置電池,以提供電源給晶片125。 Referring to FIG. 6, the second device 12 can include a wafer 125. The wafer 125 is disposed on the flexible substrate 121. The wafer 125 is coupled to a plurality of coils 122 (not shown) to provide current to the coils 122. In some embodiments, the wafer 125 includes a wireless communication component, such as a radio frequency identification tag (RFID), ZIGBEE, or Bluetooth component, such that the wafer 125 can be wirelessly controlled to control its operating mode and associated parameter settings (see Table 1). If the chip contains a 10,000-channel signal and function generator (Universal Signal and Function Generator), the remote control can be used to wirelessly set the chip to generate ultrasonic vibration waveforms (such as string wave, square wave, sawtooth wave, or Is the pulse wave), and set the vibration frequency, and the vibration time, and the task period (see Table 1). The second device 12 can include electricity Pool pads 126. Battery pad 126 is coupled to wafer 125. A battery can be placed on the battery pad 126 to provide power to the wafer 125.
圖8為本發明一實施例之第三裝置13之部分電子元件之示意圖。圖9為本發明一實施例之第三裝置13之另一部份共振箱之示意圖。 FIG. 8 is a schematic diagram of a portion of electronic components of a third device 13 in accordance with an embodiment of the present invention. FIG. 9 is a schematic diagram of another portion of the resonance box of the third device 13 according to an embodiment of the present invention.
參照圖2、圖8與圖9所示,第三裝置13類似第一裝置11。第三裝置13包含撓性基板131、複數第一線圈132、至少一第二線圈133,及共振箱模組134。複數第一線圈132和至少一第二線圈133,形成於撓性基板131上。第一線圈132可為微小型線圈。第一線圈132用於產生超音波。第二線圈133,用於產生可聽之聲音(audible sound)。撓性基板131固定在共振箱模組134上。撓性基板131可貼合在共振箱模組134上。撓性基板131可黏合在共振箱模組134上。在一些實施例中,至少一第二線圈133包含大、中、小型線圈,而該些大小不同的線圈,可發出低頻、中頻、高頻可聽之聲音。 Referring to Figures 2, 8 and 9, the third device 13 is similar to the first device 11. The third device 13 includes a flexible substrate 131, a plurality of first coils 132, at least one second coil 133, and a resonance box module 134. The plurality of first coils 132 and the at least one second coil 133 are formed on the flexible substrate 131. The first coil 132 can be a micro-miniature coil. The first coil 132 is used to generate ultrasonic waves. The second coil 133 is for generating an audible sound. The flexible substrate 131 is fixed to the resonance box module 134. The flexible substrate 131 can be attached to the resonance box module 134. The flexible substrate 131 can be bonded to the resonance box module 134. In some embodiments, at least one of the second coils 133 includes large, medium, and small coils, and the coils of different sizes can emit low frequency, intermediate frequency, and high frequency audible sounds.
在一些實施例中,撓性基板131的邊界可做熱處理,以消除撓性基板131的張力,這樣施作在身體的各個部位時,可以更貼附。 In some embodiments, the boundary of the flexible substrate 131 can be heat treated to eliminate the tension of the flexible substrate 131, so that it can be attached more when applied to various parts of the body.
共振箱模組134可分隔成複數微小型凹槽1341,及至少一凹槽(1342、1343或1344)。複數微小型凹槽1341是對應複數第一線圈132而設置。至少一凹槽(1342、1343或1344)對應至少一第二線圈133。在一些實施例中,至少一第二線圈133包含大、中、小型線圈,其中大型線圈對應共振箱模組134的大型凹槽1342,各中型線圈對應共振箱模組134的中型凹槽1343,而小型線圈對應共振箱模組134的小型凹槽1344。 The resonance box module 134 can be divided into a plurality of micro-miniature grooves 1341, and at least one groove (1342, 1343 or 1344). The plurality of micro-miniature grooves 1341 are provided corresponding to the plurality of first coils 132. At least one groove (1342, 1343 or 1344) corresponds to at least one second coil 133. In some embodiments, the at least one second coil 133 includes large, medium, and small coils, wherein the large coil corresponds to the large recess 1342 of the resonant box module 134, and each of the medium coils corresponds to the medium recess 1343 of the resonant box module 134. The small coil corresponds to the small recess 1344 of the resonant box module 134.
參照圖2、圖8與圖9所示,共振箱模組134包含磁性片137,其中磁性片137是對應複數第一線圈132,和至少一第二線圈133而設置。在一些實施例中,共振箱模組134包含磁性片。在一些實施例中,每一凹槽(1341、1342、1343或1344)的底部,設置磁性片137。在一些實施例中,磁性片的厚度,介於100~1000微米(但本發明並不以此為限)。在一些實施例中,磁性片包含鐵、鈷或鎳等磁性材料,及高分子材料(但本發明並不以此為限)。 Referring to FIGS. 2, 8, and 9, the resonant box module 134 includes a magnetic sheet 137, wherein the magnetic sheet 137 is disposed corresponding to the plurality of first coils 132 and at least one second coil 133. In some embodiments, the resonant box module 134 includes a magnetic sheet. In some embodiments, a magnetic sheet 137 is disposed at the bottom of each of the grooves (1341, 1342, 1343, or 1344). In some embodiments, the thickness of the magnetic sheet is between 100 and 1000 microns (but the invention is not limited thereto). In some embodiments, the magnetic sheet comprises a magnetic material such as iron, cobalt or nickel, and a polymer material (but the invention is not limited thereto).
在一些實施例中,第一線圈132和第二線圈133包含銀。在 一些實施例中,第一線圈132和第二線圈133包含高分子材料和銀。在一些實施例中,第一線圈132和第二線圈133是利用銀膠製作。在一些實施例中,第一線圈132和第二線圈133,包含金、鉻及鎳等金屬之組合。在一些實施例中,第一線圈132和第二線圈133的厚度,為10至100微米(但本發明並不以此為限)。 In some embodiments, the first coil 132 and the second coil 133 comprise silver. in In some embodiments, the first coil 132 and the second coil 133 comprise a polymeric material and silver. In some embodiments, the first coil 132 and the second coil 133 are fabricated using silver glue. In some embodiments, the first coil 132 and the second coil 133 comprise a combination of metals such as gold, chromium, and nickel. In some embodiments, the first coil 132 and the second coil 133 have a thickness of 10 to 100 microns (but the invention is not limited thereto).
參照圖8所示,第三裝置13包含晶片135。晶片135設置在撓性基板131,並耦接複數第一線圈132(未繪示),和至少一第二線圈133。晶片135可用於提供電流於複數第一線圈132,和至少一第二線圈133。在一些實施例中,晶片135包含無線通訊元件,例如:射頻辨識標籤(RFID)、ZIGBEE或藍牙元件,使得晶片135可進行無線通訊。如晶片內包含一萬用信號及波形產生器(Universal Signal and Function Generator),可運用遙控器,以無線方式設定晶片,產生超音波振動的波形(如弦式波,方波,鋸齒波,或是脈波),並設定振動頻率,及振動時間,及任務週期(詳如表1)。在一些實施例中,晶片135包含非揮發記憶體(Non-Volatile Memory),例如:電抹可程式記憶體(Electrical Erasable and Programmable Read-Only-Memory,EEPROM),或快閃記憶體(Flash Memory)。在一些實施例中,晶片135的非揮發記憶體,可儲存音樂檔,而晶片135可將該音樂檔,轉成音頻信號(audio signals),並根據該音頻信號,驅動提供電流給至少一第二線圈133,以產生音樂。在一些實施例中,晶片115包含一放大器,其中放大器用於放大音頻或超音波信號。 Referring to FIG. 8, the third device 13 includes a wafer 135. The wafer 135 is disposed on the flexible substrate 131 and coupled to the plurality of first coils 132 (not shown) and the at least one second coil 133. The wafer 135 can be used to provide current to the plurality of first coils 132, and at least one second coil 133. In some embodiments, wafer 135 includes a wireless communication component, such as a radio frequency identification tag (RFID), ZIGBEE, or Bluetooth component, such that wafer 135 can communicate wirelessly. If the chip contains a 10,000-channel signal and function generator (Universal Signal and Function Generator), the remote control can be used to wirelessly set the chip to generate ultrasonic vibration waveforms (such as string wave, square wave, sawtooth wave, or Is the pulse wave), and set the vibration frequency, and the vibration time, and the task period (see Table 1). In some embodiments, the wafer 135 includes a non-volatile memory (Electronic-Erasable and Programmable Read-Only-Memory (EEPROM), or a flash memory (Flash Memory). ). In some embodiments, the non-volatile memory of the wafer 135 can store music files, and the wafer 135 can convert the music file into audio signals, and according to the audio signal, drive the current to at least one Two coils 133 to produce music. In some embodiments, wafer 115 includes an amplifier that is used to amplify an audio or ultrasonic signal.
參照圖8所示,第三裝置13包含電池接墊136,其中電池接墊116上可設置電池,以提供電源給晶片135。 Referring to FIG. 8, the third device 13 includes a battery pad 136, wherein a battery can be disposed on the battery pad 116 to provide power to the wafer 135.
參照圖1所示,第三裝置13的撓性基板131,可接合第一裝置11的撓性基板111。在一些實施例中,第三裝置13的撓性基板131,與第一裝置11的撓性基板111,是利用加熱接合。 Referring to FIG. 1, the flexible substrate 131 of the third device 13 can be bonded to the flexible substrate 111 of the first device 11. In some embodiments, the flexible substrate 131 of the third device 13 and the flexible substrate 111 of the first device 11 are joined by heat.
圖10為本發明一實施例之第四裝置之部分電子元件之示意圖。圖11為本發明一實施例之第四裝置之另一部分之示意圖。 10 is a schematic diagram of a portion of electronic components of a fourth device in accordance with an embodiment of the present invention. Figure 11 is a schematic illustration of another portion of a fourth apparatus in accordance with an embodiment of the present invention.
參照圖3、圖9與圖10所示,第四裝置14類似上述的第二裝置12。第四裝置14包含一撓性基板141、複數線圈142,及一共振箱模 組143。線圈142可為微小型線圈。線圈142用於產生超音波。複數線圈142形成於撓性基板141。撓性基板141固定在共振箱模組143上。撓性基板141可貼合在共振箱模組143上。撓性基板141可黏合在共振箱模組143上。在一些實施例中,線圈142包含銀。在一些實施例中,線圈142包含高分子材料與銀。在一些實施例中,線圈142是利用銀膠製作。在一些實施例中,線圈142包含金、鉻及鎳等金屬之組合。在一些實施例中,線圈142的厚度,為10至100微米(但本發明並不以此為限)。 Referring to Figures 3, 9, and 10, the fourth device 14 is similar to the second device 12 described above. The fourth device 14 includes a flexible substrate 141, a plurality of coils 142, and a resonant box mold. Group 143. The coil 142 can be a micro-miniature coil. The coil 142 is used to generate ultrasonic waves. The complex coil 142 is formed on the flexible substrate 141. The flexible substrate 141 is fixed to the resonance box module 143. The flexible substrate 141 can be attached to the resonance box module 143. The flexible substrate 141 can be bonded to the resonance box module 143. In some embodiments, the coil 142 comprises silver. In some embodiments, the coil 142 comprises a polymeric material and silver. In some embodiments, the coil 142 is fabricated using silver glue. In some embodiments, coil 142 comprises a combination of metals such as gold, chromium, and nickel. In some embodiments, the thickness of the coil 142 is 10 to 100 microns (but the invention is not limited thereto).
參照圖1所示,第四裝置14的撓性基板141,是與第三裝置13的撓性基板131相接合。在一些實施例中,第四裝置14的撓性基板141,與第三裝置13的撓性基板131,是利用加熱接合。 Referring to FIG. 1, the flexible substrate 141 of the fourth device 14 is bonded to the flexible substrate 131 of the third device 13. In some embodiments, the flexible substrate 141 of the fourth device 14 and the flexible substrate 131 of the third device 13 are joined by heat.
在一些實施例中,撓性基板141的邊界可做熱處理,以消除撓性基板141的張力,這樣施作在身體的各個部位時,可以更貼附。 In some embodiments, the boundary of the flexible substrate 141 may be heat treated to eliminate the tension of the flexible substrate 141, so that it can be attached more when applied to various parts of the body.
第四裝置14的撓性基板141,是與第二裝置12的撓性基板121相接合。在一些實施例中,第四裝置14的撓性基板141,與第二裝置12的撓性基板121,是利用加熱接合。 The flexible substrate 141 of the fourth device 14 is bonded to the flexible substrate 121 of the second device 12. In some embodiments, the flexible substrate 141 of the fourth device 14 and the flexible substrate 121 of the second device 12 are joined by heat.
參照3圖與圖11所示,共振箱模組143可包含複數微小型凹槽1431。複數微小型凹槽1431是對應複數線圈142而設置。共振箱模組143包含磁性片147,其中磁性片147是對應複數線圈142而設置。在一些實施例中,每一凹槽1431的底部,設置磁性片。在一些實施例中,磁性片的厚度,介於100~1000微米(但本發明並不以此為限)。在一些實施例中,磁性片包含鐵、鈷或鎳等磁性材料,及高分子材料(但本發明並不以此為限)。 Referring to FIG. 3 and FIG. 11, the resonance box module 143 may include a plurality of micro-miniature grooves 1431. The plurality of micro-miniature grooves 1431 are provided corresponding to the plurality of coils 142. The resonance box module 143 includes a magnetic sheet 147, wherein the magnetic sheet 147 is disposed corresponding to the plurality of coils 142. In some embodiments, a magnetic sheet is disposed at the bottom of each of the grooves 1431. In some embodiments, the thickness of the magnetic sheet is between 100 and 1000 microns (but the invention is not limited thereto). In some embodiments, the magnetic sheet comprises a magnetic material such as iron, cobalt or nickel, and a polymer material (but the invention is not limited thereto).
參照圖10所示,第四裝置14包含晶片145。晶片145設置在撓性基板141上。晶片145耦接複數線圈142(未繪示),以提供複數線圈142電流。在一些實施例中,晶片145包含無線通訊元件,例如:射頻辨識標籤(RFID)、ZIGBEE或藍牙元件,使得晶片145可以無線方式,控制其工作模式及相關參數的設定(如表1)。如晶片內包含一萬用信號及波形產生器(Universal Signal and Function Generator),可運用遙控器,以無線方式設定晶片,產生超音波振動的波形(如弦式波,方波,鋸齒波,或是脈波),並設 定振動頻率,及振動時間,及任務週期(詳如表1)。第四裝置14可包含電池接墊146。電池接墊146耦接晶片145。電池接墊146上可設置電池,以提供電源給晶片145。 Referring to FIG. 10, the fourth device 14 includes a wafer 145. The wafer 145 is disposed on the flexible substrate 141. The wafer 145 is coupled to a plurality of coils 142 (not shown) to provide a plurality of coils 142 current. In some embodiments, wafer 145 includes a wireless communication component, such as a radio frequency identification tag (RFID), ZIGBEE, or Bluetooth component, such that wafer 145 can be wirelessly controlled to control its operating mode and associated parameter settings (see Table 1). If the chip contains a 10,000-channel signal and function generator (Universal Signal and Function Generator), the remote control can be used to wirelessly set the chip to generate ultrasonic vibration waveforms (such as string wave, square wave, sawtooth wave, or Is the pulse wave) Determine the vibration frequency, and the vibration time, and the task period (see Table 1). The fourth device 14 can include a battery pad 146. Battery pad 146 is coupled to wafer 145. A battery can be placed on the battery pad 146 to provide power to the wafer 145.
在一些實施例中,當戴上喇叭與按摩器組合1後,第一裝置11與第三裝置13罩住雙頰;而第二裝置12與第四裝置14罩住下顎。如此可以一邊以超音波清潔牙齒,一邊聽音樂。在一些實施例中,第一裝置11的共振箱模組114的凹槽(1141、1142、1143和1144),與第三裝置13的共振箱模組134的凹槽(1341、1342、1343和1344),是左右對稱。 In some embodiments, when the horn and the massager combination 1 are worn, the first device 11 and the third device 13 cover the cheeks; and the second device 12 and the fourth device 14 cover the chin. This way you can listen to music while cleaning your teeth with ultrasound. In some embodiments, the grooves (1141, 1142, 1143, and 1144) of the resonance box module 114 of the first device 11 and the grooves (1341, 1342, 1343 and the resonance box module 134 of the third device 13 are 1344), is symmetrical.
在一些實施例中,撓性基板111、撓性基板121、撓性基板131或撓性基板141上,可形成或開出複數個孔洞,以利振動時氣體的對流,加強振動的效果。在一些實施例中,各撓性基板的各線圈靠外圍邊緣附近,可形成開洞。 In some embodiments, a plurality of holes may be formed or formed on the flexible substrate 111, the flexible substrate 121, the flexible substrate 131, or the flexible substrate 141 to enhance the convection of the gas during vibration and enhance the vibration. In some embodiments, each of the coils of each flexible substrate may be formed adjacent to a peripheral edge to form an opening.
在一些實施例中,可由遙控晶片方式,進行喇叭與按摩器組合1多種工作模式的設定,包含三種工作模式:(1)「立體音響」工作模式:當選擇「立體音響」之工作模式時,則只送「立體音響」信號,讓晶片115或135控制「低音、中音,及高音喇叭」工作,故這種喇叭與按摩器組合1可像「隨身聽」一般,容易使用而又舒服;(2)「按摩」工作模式:只送「按摩」信號給「低音、中音,高音及超音波喇叭」,進行身體各部份肌肉及穴位的按摩;(3)「立體音響及按摩」之雙重模式:將「立體音響」及「超音波」信號,都先「混合」後,再送給「低音、中音,高音,及超音波喇叭」工作。所以在聽「立體音響」的時候,也可進行「肌肉及穴位按摩」,不必躺在床上,或是坐在椅子上,而是可隨身攜帶,不影響工作,非常輕便而舒適,效果自然大增。 In some embodiments, the horn and the massager can be combined in a plurality of working modes by a remote control chip mode, and includes three working modes: (1) "stereo" working mode: when the "stereo" working mode is selected, Only the "stereo" signal is sent to allow the chip 115 or 135 to control the "bass, midrange, and tweeter" work. Therefore, the speaker and massager combination 1 can be used as a "walkman", and is easy to use and comfortable. (2) "Massage" mode: only send "massage" signals to "bass, midrange, treble and ultrasonic speakers" for massage of muscles and acupuncture points in various parts of the body; (3) "Stereo and Massage" Dual mode: The "stereo" and "supersonic" signals are first "mixed" and then sent to "bass, midrange, treble, and ultrasonic speakers". Therefore, when listening to "stereo", you can also perform "muscle and acupressure". You don't have to lie on the bed or sit on a chair, but you can carry it with you, it doesn't affect your work. It is very light and comfortable, and the effect is naturally big. increase.
參照圖2與圖3所示,第一裝置11、第二裝置12、第三裝置13和第四裝置14,各包含一絕緣層(如118、128、138或148)。絕緣層(118、128、138和148)分別填充於第一裝置11、第二裝置12、第三裝置13,和第四裝置14的線圈之間的空隙,並至少部分覆蓋線圈。在一些實施例中,絕緣層(118、128、138和148),包含負光阻(如聚乙烯胺(Polyimide;PI),厚度為0.5至10微米,但本發明並不以此為限)。此外,在第一裝置11、第 二裝置12、第三裝置13,和第四裝置14上之每一線圈的內端部,各連接一導體(119、129、139或149),導體(119、129、139和149)分別形成於絕緣層(118、128、138和148)上,並往對應線圈外延伸,以使線圈的內端部,可連接至晶片115、125、135和145(未繪示)。在一些實施例中,導體(119、129、139和149)可以網印導電膠之方式來形成。 Referring to Figures 2 and 3, the first device 11, the second device 12, the third device 13, and the fourth device 14 each include an insulating layer (e.g., 118, 128, 138, or 148). The insulating layers (118, 128, 138, and 148) are filled in the gaps between the coils of the first device 11, the second device 12, the third device 13, and the fourth device 14, respectively, and at least partially cover the coil. In some embodiments, the insulating layers (118, 128, 138, and 148) comprise a negative photoresist (eg, Polyimide (PI) having a thickness of 0.5 to 10 microns, but the invention is not limited thereto) . In addition, in the first device 11, the first The inner ends of each of the coils of the second device 12, the third device 13, and the fourth device 14 are each connected to a conductor (119, 129, 139 or 149), and the conductors (119, 129, 139 and 149) are respectively formed. On the insulating layers (118, 128, 138, and 148), and extending beyond the corresponding coils, the inner ends of the coils can be connected to the wafers 115, 125, 135, and 145 (not shown). In some embodiments, the conductors (119, 129, 139, and 149) can be formed by screen printing a conductive paste.
在一些實施例中,第一裝置11與第三裝置13,包含D-Type音頻輸入插座(Connector)。在一些實施例中,第一裝置11與第三裝置13,包含插塞式(Plug-in)的音頻輸入插座。 In some embodiments, the first device 11 and the third device 13 include a D-Type audio input jack. In some embodiments, the first device 11 and the third device 13 comprise a plug-in audio input jack.
參照圖1所示,包覆件10具有兩末端,兩末端可彼此固定。在一些實施例中,兩末端包含魔鬼貼。在一些實施例中,包覆件10包含鬆緊帶。 Referring to Figure 1, the cover member 10 has two ends, and the ends are fixed to each other. In some embodiments, the two ends contain a devil sticker. In some embodiments, the cover 10 includes an elastic band.
圖12為本發明一實施例之喇叭與按摩器組合1a之示意圖。參照圖12所示,喇叭與按摩器組合1a包含一包覆件10、至少一壓電驅動模組15、一上蓋16、複數圍籬式壩條(dam bars)17及一下蓋18。至少一模組15可固定在包覆件10上。上蓋16與下蓋18分別界定共振腔。至少一模組15位在上蓋16與下蓋18之間。複數圍籬式壩條(dam bars)17接合上蓋16、至少一壓電驅動模組15與下蓋18。 Figure 12 is a schematic illustration of a horn and massager combination 1a in accordance with one embodiment of the present invention. Referring to Figure 12, the horn and massager assembly 1a includes a cover member 10, at least one piezoelectric drive module 15, an upper cover 16, a plurality of fenced dam bars 17 and a lower cover 18. At least one module 15 can be fixed to the cover member 10. The upper cover 16 and the lower cover 18 respectively define a resonant cavity. At least one module 15 is located between the upper cover 16 and the lower cover 18. A plurality of dam bars 17 engage the upper cover 16, at least one piezoelectric drive module 15 and the lower cover 18.
參照圖12至圖14所示,至少一壓電驅動模組15包含一可彎曲薄膜151、複數第一驅動裝置152及複數第二驅動裝置153。可彎曲薄膜151可固定在包覆件10。複數第一驅動裝置152,形成於可彎曲薄膜151。複數第一驅動裝置152,用於驅動可彎曲薄膜151,以產生可聽之聲音。複數第二驅動裝置153形成於可彎曲薄膜151。複數第二驅動裝置153,用於驅動可彎曲薄膜151,以產生超音波。 Referring to FIGS. 12-14, at least one piezoelectric driving module 15 includes a flexible film 151, a plurality of first driving devices 152, and a plurality of second driving devices 153. The flexible film 151 can be fixed to the cover member 10. A plurality of first driving devices 152 are formed on the flexible film 151. A plurality of first driving means 152 for driving the flexible film 151 to produce an audible sound. A plurality of second driving devices 153 are formed on the flexible film 151. A plurality of second driving means 153 for driving the flexible film 151 to generate ultrasonic waves.
各第一驅動裝置152包含兩電極1521和1522,及一壓電材料1523。壓電材料1523設置在兩電極1521和1522之間。電極1521或1522包含至少一金屬。在一些實施例中,電極1521或1522包含鈦及白金層。在一些實施例中,白金層位在鈦層上。在一些實施例中,壓電材料1523包含聚偏二氟乙烯(PVDF)或聚對二甲苯(parylene)。 Each of the first driving devices 152 includes two electrodes 1521 and 1522 and a piezoelectric material 1523. Piezoelectric material 1523 is disposed between the two electrodes 1521 and 1522. Electrode 1521 or 1522 comprises at least one metal. In some embodiments, electrode 1521 or 1522 comprises a layer of titanium and platinum. In some embodiments, the platinum layer is on the titanium layer. In some embodiments, piezoelectric material 1523 comprises polyvinylidene fluoride (PVDF) or parylene.
類似地,各第二驅動裝置153,包含兩電極及壓電材料,其 中壓電材料位在兩電極之間。各第二驅動裝置153的電極,包含至少一金屬。在一些實施例中,各第二驅動裝置153的電極,包含鈦及白金層。在一些實施例中,白金層位在鈦層上。在一些實施例中,各第二驅動裝置153的壓電材料包含聚偏二氟乙烯(PVDF)或聚對二甲苯(parylene)。 Similarly, each of the second driving devices 153 includes two electrodes and a piezoelectric material, The medium piezoelectric material is located between the two electrodes. The electrodes of each of the second driving devices 153 include at least one metal. In some embodiments, the electrodes of each of the second driving devices 153 comprise a layer of titanium and platinum. In some embodiments, the platinum layer is on the titanium layer. In some embodiments, the piezoelectric material of each of the second driving devices 153 comprises polyvinylidene fluoride (PVDF) or parylene.
參照圖14所示,複數第一驅動裝置152中,至少部分之壓電材料的尺寸不同,藉此製作出低音、中音、高音的喇叭。 Referring to Fig. 14, in the plurality of first driving means 152, at least a part of the piezoelectric material has a different size, thereby producing a bass, a middle, and a high-pitched horn.
喇叭與按摩器組合1a可包含至少一晶片,其中晶片耦接第一驅動裝置152,與第二驅動裝置153。晶片用於驅動第一驅動裝置152,與第二驅動裝置153,以發出聲音與超音波。而晶片內尚包含一萬用信號及波形產生器(Universal Signal and Function Generator),可運用遙控器,以無線方式設定晶片,產生超音波振動的波形(如弦式波,方波,鋸齒波,或是脈波),並設定振動頻率,及振動時間,及任務週期(詳如表1)。在一些實施例中,晶片包含一非揮發性記憶體,其中非揮發性記憶體儲存音樂檔,而晶片將音樂檔轉成音頻信號,並傳送至該些第一驅動裝置。 The horn and massager combination 1a can include at least one wafer, wherein the wafer is coupled to the first driving device 152 and the second driving device 153. The wafer is used to drive the first driving device 152 and the second driving device 153 to emit sound and ultrasonic waves. The chip also contains a 10,000 signal and a waveform generator (Universal Signal and Function Generator), which can be used to wirelessly set the chip to generate ultrasonic vibration waveforms (such as string wave, square wave, sawtooth wave, etc.). Or pulse wave), and set the vibration frequency, and the vibration time, and the task cycle (see Table 1). In some embodiments, the wafer includes a non-volatile memory, wherein the non-volatile memory stores music files, and the wafer converts the music files into audio signals and transmits them to the first driving devices.
以下說明本發明一實施例之喇叭與按摩器組合1a之製備方法。 Next, a method of preparing the horn and massager combination 1a according to an embodiment of the present invention will be described.
參照圖15與圖16所示,在一可彎曲薄膜151之上,利用金屬光罩,蒸鍍一層鈦(Ti)及白金(Pt),以形成複數下電極1521及導線。 Referring to Figures 15 and 16, a layer of titanium (Ti) and platinum (Pt) is deposited on a flexible film 151 by a metal mask to form a plurality of lower electrodes 1521 and wires.
接著,參照圖13與圖14所示,在下電極1521之上,利用網版印刷,印上一層膠狀的壓電材料(如聚偏氟乙烯(PVDF),或是對二甲苯(Parylene)),而後烤乾。此法可重複數次,以增加壓電材料的厚度,將來施加音波或超音波電壓時,才能產生足夠的應變及應力,使薄膜彎曲,產生足夠的振動,推動喇叭,發出聲音,或進行超音波按摩。 Next, referring to FIG. 13 and FIG. 14, on the lower electrode 1521, a gel-like piezoelectric material (such as polyvinylidene fluoride (PVDF) or parylene) is printed by screen printing. And then dry it. This method can be repeated several times to increase the thickness of the piezoelectric material. When the sound wave or ultrasonic voltage is applied in the future, sufficient strain and stress can be generated to bend the film, generate enough vibration, push the horn, make a sound, or perform super. Sonic massage.
然後,在上述可彎曲薄膜151之上,先旋塗上一層光阻(Photo Resist),而後利用黃光製程及光罩技術,蝕刻出要蒸鍍一層鈦(Ti)及白金(Pt),作為上電極1522及導線的部分。而後,利用,用金屬光罩,蒸鍍一層白金(Pt)及鈦(Ti)(此部分面積(或上電極1522)較下層電1521極稍小,以免有對不準時,造成上、下電極1523與1521的短路(Short Circuit))。 Then, on the flexible film 151, a layer of photoresist (Photo Resist) is first spin-coated, and then a layer of titanium (Ti) and platinum (Pt) is etched by using a yellow light process and a mask technique. Upper electrode 1522 and portions of the wires. Then, using a metal mask, vapor deposit a layer of platinum (Pt) and titanium (Ti) (this part of the area (or upper electrode 1522) is slightly smaller than the lower layer of electricity 1521, so as to avoid the on-time, causing the upper and lower electrodes Short circuit of 1523 and 1521).
參照圖17與圖18所示,製作一對模具(Mold),這一對模具 中間有一些空隙,其形狀是作為產生低音、中音、高音,及超音波壓電材料的共振腔161,所以可將塑膠一類的軟性材料,注入其間的流道空隙之中(Injection Molding),以作為低音、中音、高音,及超音波壓電材料的音箱或喇叭(Speaker)的上蓋16。共振腔161對應複數第一驅動裝置152及複數第二驅動裝置153設置。用同樣的方法,製作具有共振腔(Resonant Chamber)的下蓋(Bottom Cover)18,其中下蓋18的共振腔對應複數第一驅動裝置152,及複數第二驅動裝置153設置。 Referring to Figures 17 and 18, a pair of molds (Mold) are produced, the pair of molds There are some gaps in the middle, which are shaped as a resonant cavity 161 for generating bass, midrange, high-pitched, and ultrasonic piezoelectric materials, so that a soft material such as plastic can be injected into the flow gap between them (Injection Molding). The upper cover 16 of a speaker or speaker as a bass, midrange, treble, and ultrasonic piezoelectric material. The resonant cavity 161 is provided corresponding to the plurality of first driving devices 152 and the plurality of second driving devices 153. In the same manner, a Bottom Cover 18 having a Resonant Chamber is formed, wherein the resonant cavity of the lower cover 18 is provided corresponding to the plurality of first driving devices 152 and the plurality of second driving devices 153.
參照圖19所示,上蓋16的共振腔161的周圍,及上蓋16之蓋緣162,以網印方式,塗上一層黏膠,作為封裝邊界圍籬式壩條(dam bars)17之用。封裝邊界圍籬式壩條(dam bars)17時,左側及右側,要預留出空間,給上、下電極接線之用。類似地,複數圍籬式壩條(dam bars)17形成在下蓋18上,並圍繞共振腔及下蓋蓋緣。 Referring to Fig. 19, the periphery of the cavity 161 of the upper cover 16 and the cover edge 162 of the upper cover 16 are screen printed with a layer of adhesive for use as a package boundary fence dam bars 17. When encapsulating the boundary dam bars 17 on the left and right sides, space should be reserved for the upper and lower electrodes. Similarly, a plurality of dam bars 17 are formed on the lower cover 18 and surround the resonant cavity and the lower cover edge.
然後,以上蓋16及下蓋18夾住可彎曲薄膜151,並均勻施壓,而後烘乾即可完成線圈及共振箱模組的整合。 Then, the upper cover 16 and the lower cover 18 sandwich the flexible film 151 and uniformly apply pressure, and then the drying can complete the integration of the coil and the resonance box module.
最後,在可彎曲薄膜151上,安裝電源及聲音與超音波信號之放大器,或RFID天線及晶片,使其成為可由無線方式,控制其工作模式及相關參數的設定(如表1)。最後將上述模組,固定在一個包覆件10的內部即可完成。 Finally, on the flexible film 151, an amplifier for power and sound and ultrasonic signals, or an RFID antenna and a chip are mounted, so that the setting of the operating mode and related parameters can be controlled wirelessly (see Table 1). Finally, the above module can be fixed in the inside of a covering member 10.
本揭露之技術內容及技術特點已揭示如上,然而熟悉本項技術之人士仍可能基於本揭露之教示及揭示而作種種不背離本揭露精神之替換及修飾。因此,本揭露之保護範圍應不限於實施範例所揭示者,而應包括各種不背離本揭露之替換及修飾,並為以下之申請專利範圍所涵蓋。 The technical content and technical features of the present disclosure have been disclosed as above, and those skilled in the art can still make various substitutions and modifications without departing from the spirit and scope of the disclosure. Therefore, the scope of the present disclosure is not to be construed as being limited by the scope of
1a‧‧‧喇叭與按摩器組合 1a‧‧‧ horn and massager combination
10‧‧‧包覆件 10‧‧‧Cover parts
15‧‧‧壓電驅動模組 15‧‧‧Piezoelectric drive module
16‧‧‧上蓋 16‧‧‧Upper cover
17‧‧‧圍籬式壩條 17‧‧‧Fence dam
18‧‧‧下蓋 18‧‧‧Under the cover
151‧‧‧薄膜 151‧‧‧film
1521、1522‧‧‧電極 1521, 1522‧‧‧ electrodes
1523‧‧‧壓電材料 1523‧‧‧Piezoelectric materials
Claims (18)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103126144A TWI572211B (en) | 2014-07-31 | 2014-07-31 | Speaker and massager assembly |
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| Application Number | Priority Date | Filing Date | Title |
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| TW103126144A TWI572211B (en) | 2014-07-31 | 2014-07-31 | Speaker and massager assembly |
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| TW201605253A TW201605253A (en) | 2016-02-01 |
| TWI572211B true TWI572211B (en) | 2017-02-21 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11759757B1 (en) | 2022-12-14 | 2023-09-19 | Chun-Ming Lin | Device and apparatus for agitation of liquid |
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| JPS6449559A (en) * | 1987-08-20 | 1989-02-27 | Toshio Takagi | Massager operated by acoustic signal |
| JPH09166583A (en) * | 1995-12-13 | 1997-06-24 | Ebara Corp | Electromagnetic ultrasonic transducer for deflected transverse wave |
| US20020126867A1 (en) * | 2001-03-07 | 2002-09-12 | Eliezer Aizik | Flexible ribbon speaker |
| US20050254674A1 (en) * | 2004-05-11 | 2005-11-17 | Industrial Technology Research Institute | Flexible electronic device with flexible speaker |
| TWI293233B (en) * | 2005-12-30 | 2008-02-01 | Ind Tech Res Inst | Flexible loudspeaker and its fabricating method |
| TW200824670A (en) * | 2006-12-07 | 2008-06-16 | Ind Tech Res Inst | Ultrasonic wave device |
| TW201328373A (en) * | 2011-12-27 | 2013-07-01 | Univ Chung Hua | Electro-acoustic transducer and method of manufacturing the same |
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| JPS61216600A (en) * | 1985-03-22 | 1986-09-26 | Matsushita Electric Ind Co Ltd | High power ultrasonic speaker |
| JPS6449559A (en) * | 1987-08-20 | 1989-02-27 | Toshio Takagi | Massager operated by acoustic signal |
| JPH09166583A (en) * | 1995-12-13 | 1997-06-24 | Ebara Corp | Electromagnetic ultrasonic transducer for deflected transverse wave |
| US20020126867A1 (en) * | 2001-03-07 | 2002-09-12 | Eliezer Aizik | Flexible ribbon speaker |
| US20050254674A1 (en) * | 2004-05-11 | 2005-11-17 | Industrial Technology Research Institute | Flexible electronic device with flexible speaker |
| TWI293233B (en) * | 2005-12-30 | 2008-02-01 | Ind Tech Res Inst | Flexible loudspeaker and its fabricating method |
| TW200824670A (en) * | 2006-12-07 | 2008-06-16 | Ind Tech Res Inst | Ultrasonic wave device |
| TW201328373A (en) * | 2011-12-27 | 2013-07-01 | Univ Chung Hua | Electro-acoustic transducer and method of manufacturing the same |
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| US11759757B1 (en) | 2022-12-14 | 2023-09-19 | Chun-Ming Lin | Device and apparatus for agitation of liquid |
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| TW201605253A (en) | 2016-02-01 |
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