[go: up one dir, main page]

TWI560300B - Film forming device and film forming method - Google Patents

Film forming device and film forming method

Info

Publication number
TWI560300B
TWI560300B TW103128367A TW103128367A TWI560300B TW I560300 B TWI560300 B TW I560300B TW 103128367 A TW103128367 A TW 103128367A TW 103128367 A TW103128367 A TW 103128367A TW I560300 B TWI560300 B TW I560300B
Authority
TW
Taiwan
Prior art keywords
film forming
forming method
forming device
film
forming
Prior art date
Application number
TW103128367A
Other languages
Chinese (zh)
Other versions
TW201510263A (en
Inventor
Satoru Ozaki
Yuu TOKUTAKE
Original Assignee
Shimadzu Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shimadzu Corp filed Critical Shimadzu Corp
Publication of TW201510263A publication Critical patent/TW201510263A/en
Application granted granted Critical
Publication of TWI560300B publication Critical patent/TWI560300B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32091—Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/332—Coating
    • H01J2237/3321—CVD [Chemical Vapor Deposition]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
TW103128367A 2013-09-10 2014-08-19 Film forming device and film forming method TWI560300B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013187429 2013-09-10

Publications (2)

Publication Number Publication Date
TW201510263A TW201510263A (en) 2015-03-16
TWI560300B true TWI560300B (en) 2016-12-01

Family

ID=52665438

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103128367A TWI560300B (en) 2013-09-10 2014-08-19 Film forming device and film forming method

Country Status (4)

Country Link
JP (1) JP6202098B2 (en)
CN (1) CN105555995B (en)
TW (1) TWI560300B (en)
WO (1) WO2015037315A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6477221B2 (en) * 2015-05-12 2019-03-06 株式会社島津製作所 Deposition method
JP6555078B2 (en) * 2015-10-29 2019-08-07 株式会社島津製作所 Deposition method
JP7094154B2 (en) * 2018-06-13 2022-07-01 東京エレクトロン株式会社 Film forming equipment and film forming method
JP7188281B2 (en) * 2019-06-05 2022-12-13 株式会社島津製作所 Film forming method, resin product manufacturing method and film forming apparatus
JP7518165B2 (en) * 2020-02-24 2024-07-17 アプライド マテリアルズ インコーポレイテッド VACUUM PROCESSING APPARATUS, VACUUM SYSTEM, GAS PARTIAL PRESSURE CONTROL ASSEMBLY, AND METHOD FOR CONTROLLING GAS PARTIAL PRESSURE IN A VACUUM PROCESSING CHAMBER - Patent application

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002088472A (en) * 2000-04-11 2002-03-27 Applied Materials Inc High density plasma source for ionized metal deposition capable of exciting plasma waves

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0371600A (en) * 1989-08-09 1991-03-27 Sumitomo Metal Ind Ltd Plasma apparatus and use of same apparatus
JP3091326B2 (en) * 1992-08-25 2000-09-25 松下電工株式会社 Film formation method
JP3071600B2 (en) * 1993-02-26 2000-07-31 日本電気株式会社 Semiconductor storage device
JP2003306771A (en) * 2002-04-17 2003-10-31 Ulvac Japan Ltd Film deposition system with glove box
JP2007188707A (en) * 2006-01-12 2007-07-26 Sony Corp Transparent conductive film, method for manufacturing the same, and touch panel
CA2660085C (en) * 2006-07-13 2016-02-09 Teer Coatings Limited Coating apparatus and method
GB0613877D0 (en) * 2006-07-13 2006-08-23 Teer Coatings Ltd Coating apparatus and coating for an article
JP2010047783A (en) * 2008-08-19 2010-03-04 Toppan Printing Co Ltd Vacuum film deposition apparatus, and its maintenance method
JP2010163662A (en) * 2009-01-16 2010-07-29 National Institute For Materials Science Dry process apparatus
JP5373905B2 (en) * 2009-07-17 2013-12-18 株式会社アルバック Film forming apparatus and film forming method
JP2011058048A (en) * 2009-09-10 2011-03-24 Nikuni:Kk Vacuum film deposition method and device therefor
JP2011091242A (en) * 2009-10-23 2011-05-06 Elpida Memory Inc Manufacturing method of semiconductor device
JP2012177191A (en) * 2011-02-03 2012-09-13 Canon Inc Film-forming apparatus and film-forming method
JP5405549B2 (en) * 2011-10-20 2014-02-05 株式会社日本製鋼所 Vacuum film forming method and vacuum film forming apparatus
JP6042196B2 (en) * 2011-12-22 2016-12-14 キヤノンアネルバ株式会社 Sputtering apparatus, sputtering apparatus control apparatus, and film forming method
WO2013136576A1 (en) * 2012-03-16 2013-09-19 島津エミット株式会社 Film forming device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002088472A (en) * 2000-04-11 2002-03-27 Applied Materials Inc High density plasma source for ionized metal deposition capable of exciting plasma waves

Also Published As

Publication number Publication date
JP6202098B2 (en) 2017-09-27
CN105555995B (en) 2017-11-07
JPWO2015037315A1 (en) 2017-03-02
TW201510263A (en) 2015-03-16
WO2015037315A1 (en) 2015-03-19
CN105555995A (en) 2016-05-04

Similar Documents

Publication Publication Date Title
GB2538167B (en) ALD device and method
EP3029566A4 (en) Application packaging device and method
EP3089466A4 (en) Method and device for same-screen interaction
GB201302787D0 (en) Method and apparatus
GB201311264D0 (en) Apparatus and method
EP3048709A4 (en) Coil-end-molding device and method
EP3051807A4 (en) Predicted-route presentation device and predicted-route presentation method
GB201306083D0 (en) Method and apparatus
EP2953382A4 (en) Sound-emitting device and sound-emitting method
GB201311150D0 (en) Apparatus and method
GB201309915D0 (en) Stall-start method and apparatus
GB201306495D0 (en) Apparatus and method
EP3006595A4 (en) Film forming device and film forming method using same
EP3010224A4 (en) Photographing method and device
EP3076227A4 (en) Transmittance-variable film and method for producing same
GB201604534D0 (en) Nucleic-acid-sequence determination device and nucleic-acid-sequence determination method
GB201314252D0 (en) Apparatus and method
GB201309689D0 (en) Method and apparatus
SG11201508944UA (en) Coating device and coating method
TWI560300B (en) Film forming device and film forming method
EP3077788A4 (en) Device and method
PL3043945T3 (en) Skiving method and corresponding device
GB201305942D0 (en) Apparatus and method
SG11201604314VA (en) Method and device for embossing structures
EP2960357A4 (en) Film formation method and film formation device