TWI414591B - Thermal interface material and preparation method thereof - Google Patents

Abstract

A thermal interface material includes an array of carbon nanotubes, a first matrix material and a plurality of conductive particles. The first matrix material is disposed on at least one end of the array of carbon nanotubes. The plurality of conductive particles are incorporated into the first matrix material. A part of the plurality of conductive particles are contacted With the array of carbon nanotubes. The thermal interface material has small contact thermal resistance and high thermal conductivity. The present disclosure also provides a method for making the thermal interface material.

Description

Thermal interface material and preparation method thereof

The invention relates to a thermal interface material and a preparation method thereof, in particular to a nano carbon tube thermal interface material and a preparation method thereof.

In recent years, with the rapid development of semiconductor device integration technology, the integration degree of semiconductor devices is getting higher and higher, the device volume is getting smaller and smaller, and the demand for heat dissipation is getting higher and higher, and high efficiency heat dissipation has become a more and more The more important the problem. In order to meet the heat dissipation requirement, a thermal interface material with a high thermal conductivity is usually added between the heat sink and the semiconductor device, so that the contact between the heat sink and the semiconductor device is tighter, and the heat conduction between the semiconductor device and the heat sink is enhanced. .

Previous thermal interface materials disperse particles having a higher thermal conductivity in a polymer matrix to form a composite, such as particles of graphite, boron nitride, cerium oxide, aluminum oxide, silver, or other metals dispersed in a polymer matrix. The general defect of this type of material is that the thermal conductivity of the overall material is small, generally 1W/m. K, this has been unable to adapt to the need for heat dissipation due to the increased level of semiconductor integration. Increasing the content of the thermal conductive particles of the polymer matrix so that the particles and the particles are in contact with each other as much as possible can increase the thermal conductivity of the entire composite material, such as the thermal conductivity of some special thermal interface materials, so that it can reach 4 W/m. K-8 W/m. K, however, when the content of the thermally conductive particles of the polymer matrix is increased to a certain extent, the properties of the polymer matrix are changed. If the polymer-based system rubber, the rubber The glue becomes harder, loses its flexibility, and greatly reduces the interface contact performance of the thermal interface material, thereby increasing the thermal resistance between the heat sink and the semiconductor device.

In order to improve the thermal conductivity of the thermal interface material and improve the thermal conductivity, various materials have been extensively tested. The carbon nanotubes have a large aspect ratio and a length of several thousand times. The strength of the carbon nanotubes is one hundred times that of steel, but the weight is only one-sixth of that of steel; the toughness of carbon nanotubes Excellent in elasticity and excellent in thermal conductivity. Therefore, dispersing carbon nanotubes as thermally conductive particles in a polymer matrix to form a carbon nanotube thermal interface material has become an important direction for thermal interface materials research. However, the arrangement of the carbon nanotubes in the carbon nanotube thermal interface material prepared by the dispersion method is not suitable for fully utilizing the radial thermal conductivity of the carbon nanotubes, so that the carbon nanotube thermal interface material is Thermal conductivity is limited.

In order to make full use of the radial thermal conductivity of the carbon nanotubes, the industry usually encloses the carbon nanotube array in the matrix material. However, the height of the carbon nanotube array is small, usually not exceeding the order of millimeters. During the embedding process, the end of the carbon nanotube is easily buried in the matrix material, and cannot reach the heat source and the heat dissipating component. Good contact between the two, so that the surface of the carbon nanotube thermal interface material has a large contact thermal resistance, reducing its actual thermal conductivity.

In order to overcome the drawbacks, the carbon nanotubes buried in the matrix material are usually "exposed" by friction or etching. A thermal interface material and a method of making the same are disclosed in the patent application entitled "Carbon Nanotube Thermal Interface Structures", published in U.S. Patent No. 2,030,117, 770, issued toJ. The thermal interface material includes at least one carbon nanotube (bundle) array and a polymer filled in the at least one carbon nanotube (bundle) array. The carbon nanotubes in the at least one carbon nanotube (bundle) array are parallel to each other, and at least one carbon nanotube (beam) array The columns are arranged in a direction parallel to the direction of their heat conduction. The thermal interface material is prepared by injecting a polymer around a carbon nanotube (beam) array to support an array of carbon nanotubes (beams), and removing the growth carbon nanotube (beam) array by mechanical grinding or chemical etching. The substrate is removed and the excess polymer is removed by chemical mechanical polishing or mechanical milling to form a thermal interface material.

The thermal interface material prepared by the method used in the patent application removes excess polymer by chemical mechanical polishing or mechanical grinding, so that the carbon nanotubes are exposed on the surface of the polymer, and the heat conduction efficiency thereof is large. However, due to the chemical mechanical polishing or mechanical grinding process, the surface flatness of the thermal interface material is lowered, so that the thermal resistance of the contact between the thermal interface material and the heat source is large, and the heat dissipation efficiency is lowered. In addition, the use of chemical mechanical polishing or mechanical grinding process makes its production cost higher.

In view of the above, it is indeed necessary to provide a thermal interface material which can make a carbon nanotube contact with a heat source and has a high thermal conductivity and a method for producing the same.

A thermal interface material comprising an array of carbon nanotubes and a first substrate disposed at one end of the array of carbon nanotubes, wherein the thermal interface material further comprises a plurality of the plurality of distributions in the first substrate The first thermally conductive particles, the plurality of thermally conductive particles of the plurality of first thermally conductive particles are in contact with the array of carbon nanotubes.

A method for preparing a thermal interface material, comprising the steps of: providing a carbon nanotube array; placing a first substrate at one end of the carbon nanotube array; and adding a plurality of first thermally conductive particles to the first In a substrate, a portion of the plurality of thermally conductive particles of the first thermally conductive particles are brought into contact with the array of carbon nanotubes to form the thermal interface material.

Compared with the prior art, the thermal interface material increases the actual thermal contact area of the thermal interface material and the heat source due to the contact of the plurality of first heat conductive particles with the carbon nanotube array, thereby avoiding the decrease of the flatness of the thermal interface material. And the contact heat resistance is large, thereby improving the heat conduction efficiency.

The method for preparing the thermal interface material comprises adding a plurality of first heat conductive particles in the first substrate, so that the thermal interface material and the heat source form a good heat conduction channel; the method and the friction or etching method enable the thermal interface material to Compared with the method in which the heat source forms a good heat conduction channel, it has the characteristics of simple operation and low cost.

2‧‧‧Nano Carbon Tube Array

8‧‧‧Organic

10‧‧‧Hot interface materials

12‧‧‧Base

14‧‧‧ catalyst film

42‧‧‧First substrate

44‧‧‧Second substrate

62‧‧‧First thermal conductive particles

64‧‧‧Second thermal particles

1 is a schematic structural view of a thermal interface material according to a first embodiment of the present invention.

2 is a schematic structural view of a carbon nanotube array of a method for preparing a thermal interface material according to a second embodiment of the present invention.

3 is a flow chart of a method for preparing a thermal interface material according to a second embodiment of the present invention.

The thermal interface material provided by the present invention and its preparation method will be further described in detail below with reference to the accompanying drawings.

Referring to FIG. 1 , a first embodiment of the present invention provides a thermal interface material 10 including a carbon nanotube array 2 , an organic material 8 , a first substrate 42 , a second substrate 44 , and a first substrate 42 . The plurality of first thermally conductive particles 62, the plurality of second thermally conductive particles 64 dispersed in the second substrate 44, and an organic substance 8. The first substrate 42 and the second substrate 44 are respectively disposed at two ends of the carbon nanotube array 2, and the organic material 8 is filled between the carbon nanotubes in the carbon nanotube array 2. In the gap.

The two ends of the carbon nanotube array 2 are a first end and a second end opposite to the first end. The height of the carbon nanotube array 2 can be determined according to the needs of the actual application. The carbon nanotube array 2 includes a plurality of carbon nanotubes including one of a single-walled carbon nanotube, a double-walled carbon nanotube, and a multi-walled carbon nanotube, or any combination thereof. In this embodiment, the carbon nanotubes are multi-walled carbon nanotubes. The carbon nanotube array 2 is preferably an array of super-sequential carbon nanotubes, i.e., the majority of the carbon nanotubes in the array of carbon nanotubes 2 are parallel to each other.

The first substrate 42 is disposed at the first end of the carbon nanotube array 2, and the first end of at least a portion of the carbon nanotubes of the carbon nanotube array 2 extends into the first substrate 42. The second substrate 44 is disposed at the second end of the carbon nanotube array 2, and the second end of at least a portion of the carbon nanotubes of the carbon nanotube array 2 extends into the second substrate 44. The thickness of the first substrate 42 and the second substrate 44 may be determined according to the needs of practical applications. The materials of the first base body 42 and the second base body 44 are one of a phase change material, a resin material and a thermal conductive adhesive, or any combination thereof. The phase change material is paraffin wax. The resin material is an epoxy resin, an acrylic resin, or a enamel resin. The selection of the materials of the first substrate 42 and the second substrate 44 should be determined according to practical applications. When the temperature of the first substrate 42 is higher than the melting point of the first substrate 42, the first substrate 42 is in a molten state to ensure that the thermal interface material 10 forms good contact with the heat source, thereby improving heat conduction efficiency. The second substrate 44 has the same properties at the melting point as the first substrate 42 at the melting point. In this embodiment, the materials of the first substrate 42 and the second substrate 44 are all paraffin wax.

The plurality of first thermally conductive particles 62 are dispersed in the first substrate 42 and a portion of the thermally conductive particles 62 are in contact with the first end of the carbon nanotube array 2. The plurality of second thermally conductive particles 64 are dispersed in the second substrate 44, and a portion of the second thermally conductive particles 64 are in contact with the second end of the carbon nanotube array 2. The first heat conductive particles 62 and the second heat conductive particles 64 It is one of particles such as metals, alloys, oxides and non-metal particles or any combination thereof. The metal is one of a metal such as tin, copper, indium, lead, antimony, gold, silver, antimony or aluminum or any combination thereof. The alloy is one or more of alloys of any combination of metals such as tin, copper, indium, lead, antimony, gold, silver, bismuth and aluminum. The oxide is one of an oxide of a metal oxide and cerium oxide or any combination thereof. The non-metallic particles are one of graphite or a non-metallic particle such as ruthenium or any combination thereof. The diameters of the first heat conductive particles 62 and the second heat conductive particles 64 are respectively from 10 nm to 10,000 nm, and the specific size of the diameter is determined as the case may be. The shapes of the first heat conductive particles 62 and the second heat conductive particles 64 are respectively one of a shape of a rod, a sheet, a powder, and a particle, or any combination thereof. In this embodiment, the first heat conductive particles 62 and the second heat conductive particles 64 are aluminum powders each having a diameter of 10 nm to 1000 nm.

The organic material 8 is filled in a space between the carbon nanotubes of the carbon nanotube array 2, and both ends of the carbon nanotube array 2 expose the surface of the organic material 8. The organic material 8 is disposed at or spaced apart from the first base body 42 and the second base body 44. The organic matter 8 is a silicone rubber series, a polyethylene glycol, a polyester, an epoxy resin series, an anoxic rubber series, an acrylic rubber series or a rubber. The material of the organic material 8 may be the same as the material of the first substrate 42 or the second substrate 44. In this embodiment, the organic material 8 is disposed in contact with the first base body 42 and the second base body 44. The organic material 8 is a two-component anthrone elastomer.

When the thermal interface material 10 of the present embodiment is applied to an electronic device, when the temperature is heated above the melting points of the first substrate 42 and the second substrate 44, the first substrate 42 and the second substrate 44 undergo a phase change. At this time, the first substrate 42 and the second substrate 44 in the molten state and the plurality of first heat conductive particles 62 and the plurality of second heat conductive particles 64 dispersed therein can directly contact the interface of the electronic device, thereby increasing With electronic devices The actual thermal contact area avoids the unevenness of the end of the carbon nanotubes in the carbon nanotube array 2, resulting in a large contact thermal resistance and improved thermal conductivity. In addition, since a portion of the first thermally conductive particles 62 and the plurality of second thermally conductive particles 64 are in direct contact with both ends of the carbon nanotube array 2, the carbon nanotubes in the carbon nanotube array 2 pass through the plurality of A thermally conductive particle 62 and the plurality of second thermally conductive particles 64 are in contact with the electronic device to ensure that the radial thermal conductivity of the carbon nanotube is fully utilized to increase the thermal conductivity of the thermal interface material 10, thereby improving the overall electronic device. heat radiation.

It can be understood that the thermal interface material provided in this embodiment may have only the first substrate 42 or the second substrate 44. In addition, the thermal interface material provided in this embodiment may not be filled with the organic material 8.

Referring to FIG. 1 , FIG. 2 and FIG. 3 , a second embodiment of the present invention provides a method for preparing a thermal interface material, which includes the following steps:

Step 1: Provide a carbon nanotube array 2.

The carbon nanotube array 2 has a first end and a second end disposed opposite the first end. The carbon nanotube array 2 also has a substrate 12. The substrate 12 is disposed adjacent to the second end of the carbon nanotube array 2 and disposed opposite the first end of the carbon nanotube array 2. The height of the carbon nanotube array 2 can be determined according to the needs of the actual application. The carbon nanotube array 2 includes a plurality of carbon nanotubes including one of a single-walled carbon nanotube, a double-walled carbon nanotube, and a multi-walled carbon nanotube, or any combination thereof. In this embodiment, the carbon nanotubes are multi-walled carbon nanotubes. The carbon nanotube array 2 is a super-sequential carbon nanotube array, that is, most of the carbon nanotubes in the carbon nanotube array 2 are parallel to each other.

The method for preparing the carbon nanotube array 2 provided in this embodiment adopts chemical vapor deposition The method specifically includes the following steps: First, a uniform catalyst film 14 is formed on a substrate 12. This step can be achieved by a method such as thermal deposition, electron beam deposition or sputtering. The material of the substrate 12 may be glass, quartz, ruthenium or alumina. In this embodiment, a porous crucible is used, and the porous crucible has a porous layer on the surface thereof, and the porous layer has a plurality of pores, and the plurality of pores have a very small diameter, generally less than 3 nm. The material of the catalyst film 14 is iron, and may be other materials such as gallium nitride, cobalt, nickel or any combination thereof.

Next, the catalyst film 14 is oxidized to form catalyst particles, and the substrate 12 on which the catalyst particles are distributed is placed in a reaction furnace, heated to 700-1000 degrees Celsius in a protective gas atmosphere, and carbon source gas is introduced to grow 5 A micron array of carbon nanotubes of 1 micron to 500,000 micrometers was prepared in minutes to 30 minutes. The carbon source gas may be a hydrocarbon such as acetylene, ethylene or methane, and the height of the carbon nanotube array 2 can be controlled by controlling the growth time. The carbon source gas may be a chemically active hydrocarbon such as acetylene, ethylene or methane. The shielding gas is nitrogen or an inert gas. The inert gas is helium, neon, argon, helium or neon. In this embodiment, the carbon source gas is acetylene, and the shielding gas is argon gas.

It can be understood that the carbon nanotube array 10 provided in the embodiment is not limited to the preparation method. It can also be a graphite electrode constant current arc discharge deposition method or a laser ablation method. For details, please refer to the document "Self-Oriented Regular Arrays of Carbon Nanotubes and Their Field Emission Properties" (Shoushan Fan et al., Science, 1999, vol. 283, p512-414), "Isotope Labeling of Carbon Nanotubes and Formation of ¹² C- ¹³ C Nanotube Junctions" (Liang Liu et al., J. Am. Chem. Soc, 2001, 123, 11502-11503) and US Patent No. 6,350, 488 (Application Date June 9, 2000, Announcement Japanese February 26, 2002).

Step 2: An organic substance 8 is filled in the space between the carbon nanotube arrays 2, and the first end of the carbon nanotube array 2 is exposed to the surface of the organic substance 8.

The step is specifically: first, a polyester sheet protective layer is formed on the first end of the carbon nanotube array 2. Next, the carbon nanotube array 2 having the protective layer is immersed in a solution or a melt of the organic substance 8 so that the organic substance 8 fills a space between the carbon nanotubes in the carbon nanotube array 2. Then, the carbon nanotube array 2 is taken out to solidify or solidify the organic material 8 filled in the carbon nanotube array 2. Finally, the protective layer is directly removed such that the first end of the carbon nanotube array 2 exposes the surface of the organic material 8. Wherein, the protective layer is formed by placing a polyester sheet on the first end of the carbon nanotube array 2, and gently pressing the polyester sheet to make the polyester sheet and the carbon nanotube array 2 One end is in close contact to form the protective layer. The method of solidifying or solidifying the organic matter 8 includes natural drying, high temperature drying or cooling drying. The organic material 8 includes a silicone rubber series, a polyethylene glycol, a polyester, an epoxy resin series, an anoxic rubber series, an acrylic rubber series or a rubber. In this embodiment, the organic substance 8 is a two-component anthrone elastomer. The curing method of the organic material 8 is natural drying.

It can be understood that the method for realizing the surface of the first end of the carbon nanotube array 2 to expose the surface of the organic material 8 is not limited to the method described, and the first end of the carbon nanotube array 2 may be exposed to organic substances by other methods. The surface of 8 is, for example, first injecting a solution or melt of organic matter 8 into the carbon nanotube array 2, controlling the height of the solution or melt of the organic substance 8 in the carbon nanotube array 2, so that the carbon nanotube array is The first end is not surrounded by a solution or melt of organic matter 8; then the solution or melt of organics 8 is solidified.

Step 3: A first substrate 42 is disposed at the first end of the carbon nanotube array 2.

Specifically, a first substrate 42 is coated on the first end of the carbon nanotube array 2 by printing or brushing, and the first substrate 42 is disposed or contacted with the organic material 8 , and The carbon nanotube array 2 is embedded to expose the first end of the surface of the organic material 8. The first substrate 42 is a mixture of a phase change material, a resin material, and a thermal conductive paste or any combination thereof. The phase change material includes paraffin wax. The resin material is an epoxy resin, an acrylic resin or a enamel resin. The material of the first substrate 42 and the material of the organic material 8 may be the same. In this embodiment, the first substrate 42 is disposed in contact with the organic material 8. The first substrate 42 is paraffin wax.

Step 4: Adding a plurality of first heat conductive particles 62 to the first substrate 42 to contact a portion of the first heat conductive particles 62 with the first end of the carbon nanotube array 2.

Specifically, the plurality of first heat conductive particles 62 are sprinkled on the surface of the first base body 42 such that the surface of the first base body 42 is covered with the plurality of first heat conductive particles 62; and the first base body 42 is heated. The surface is slightly higher than the melting point of the first substrate 42; at this time, the plurality of first heat conductive particles 62 are immersed in the first substrate 42, and the first heat conductive particles 62 and the first end of the carbon nanotube array 2 are Contact. Wherein, the depth of the plurality of first heat conductive particles 62 immersed in the first base body 42 can be controlled by the number of the plurality of first heat conductive particles 62 sprinkled on the first base body 42 The first end of at least a portion of the carbon nanotubes in the carbon nanotube array 2 is surrounded by a plurality of layers.

The material of the first heat conductive particles 62 is one of heat conductive particles such as metals, alloys, oxides, and non-metal particles, or any combination thereof. The metal is one of a metal such as tin, copper, indium, lead, antimony, gold, silver, antimony or aluminum or any combination thereof. The alloy is one or more of alloys of any combination of metals such as tin, copper, indium, lead, antimony, gold, silver, antimony and aluminum. The oxide is one of an oxide of a metal oxide and cerium oxide or any combination thereof. The non-metallic particles are non-metallic particles such as graphite and ruthenium One of them or any combination thereof. The diameter of the first thermally conductive particles 62 is from 10 nm to 10,000 nm, and the specific size of the diameter depends on the case. The shape of the first heat conductive particles 62 is one of a shape of a rod, a sheet, a powder, a particle, or the like, or any combination thereof. In this embodiment, the first heat conductive particles 62 are aluminum powders having a diameter of 10 nm to 1000 nm.

Step 5: A second substrate 44 is disposed at the second end of the carbon nanotube array 2.

The step specifically includes: first, removing the substrate 12 of the carbon nanotube array 2 such that the second end of at least a portion of the carbon nanotubes of the carbon nanotube array 2 is exposed on the surface of the organic material 8. Wherein, the method of removing the substrate 12 of the carbon nanotube array 2 is to directly remove the substrate 12 from the carbon nanotube array 2; or chemically removing the substrate 12. Next, the method of coating the second substrate 44 at the second end of the carbon nanotube array 2 is the same as the method of applying a first substrate 42 at the first end of the carbon nanotube array 2 in the third step. . The material of the second substrate 44 is the same as the material of the first substrate 42. In this embodiment, the second substrate 44 is disposed in contact with the organic material 8. The second substrate 44 is paraffin wax.

Step 6: Adding a plurality of second heat conductive particles 64 to the second substrate 44 to contact a portion of the second heat conductive particles 64 with the second end of the carbon nanotube array 2 to form the thermal interface material 10.

Specifically, the plurality of second heat conductive particles 64 are sprinkled on the surface of the second substrate 44, so that the surface of the second substrate 44 is filled with the plurality of second heat conductive particles 64; and the second substrate 44 is heated. The surface is slightly higher than the melting point of the second substrate 44; at this time, the plurality of second thermally conductive particles 64 are immersed in the second substrate 44, and part of the second thermally conductive particles 64 are adjacent to the second end of the carbon nanotube array 2. Contact; thereby forming the thermal interface material 10. Wherein the depth of the plurality of second heat conductive particles 64 is immersed in the second substrate 44 The second thermally conductive particles 64 may be surrounded by at least a portion of the carbon nanotube array 2 as much as possible by controlling the number of the plurality of second thermally conductive particles 64 scattered on the second substrate 44. end. The material, shape and diameter of the second thermally conductive particles 64 are the same as the material, shape and diameter of the first thermally conductive particles 62. In this embodiment, the second heat conductive particles 64 are aluminum powders having a diameter of 10 nm to 1000 nm.

The thermal interface material and the preparation method thereof provided by the embodiments of the present invention have the following advantages: First, since the plurality of first heat conductive particles and a part of the second heat conductive particles are in contact with the carbon nanotube array, The carbon nanotubes in the carbon nanotube array are in contact with the heat source through the plurality of first heat conductive particles and the plurality of second heat conductive particles, thereby ensuring that the radial heat conduction performance of the carbon nanotubes is fully exerted to improve heat The thermal conductivity of the interface material. Secondly, when the thermal interface material is in operation, the first substrate and the second substrate are converted into a molten state, the first substrate in the molten state and a part of the heat conductive particles of the plurality of first heat conductive particles dispersed therein, The second substrate in the molten state and a part of the thermally conductive particles of the plurality of second thermally conductive particles dispersed therein can be in direct contact with the heat source, and the actual thermal contact area of the thermal interface material and the heat source can be increased to avoid the thermal interface material. The flatness is lowered, and the contact thermal resistance is large, which improves the heat conduction efficiency. Thirdly, the method for preparing the thermal interface material comprises forming a plurality of first heat conductive particles and a plurality of second heat conductive particles in the first substrate and the second substrate respectively, so that the thermal interface material and the heat source form a good heat conduction channel. Compared with the method of using chemical mechanical polishing or mechanical grinding to make the thermal interface material and the heat source form a good heat conduction channel, the method has the characteristics of simple operation and low cost.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Anyone who is familiar with the skill of this case will be assisted by the essence of the invention. Equivalent modifications or variations made by God are to be covered by the following patents.

2‧‧‧Nano Carbon Tube Array

8‧‧‧Organic

10‧‧‧Hot interface materials

42‧‧‧First substrate

44‧‧‧Second substrate

62‧‧‧First thermal conductive particles

64‧‧‧Second thermal particles

Claims (30)

A thermal interface material comprising an array of carbon nanotubes and a first substrate disposed at one end of the array of carbon nanotubes, wherein the thermal interface material further comprises a distribution in the first substrate The plurality of first thermally conductive particles, the plurality of thermally conductive particles of the plurality of first thermally conductive particles are in contact with the array of carbon nanotubes, the array of carbon nanotubes being composed of a plurality of linear carbon nanotubes. The thermal interface material of claim 1, wherein the thermal interface material further comprises a second substrate disposed at the other end of the array of carbon nanotubes. The thermal interface material according to claim 1, wherein the thermal interface material further comprises a plurality of second thermally conductive particles distributed in the second substrate, a portion of the plurality of thermally conductive particles of the second thermally conductive particles and the The carbon nanotube array is in contact. The thermal interface material according to claim 1, wherein the first thermally conductive particles are one of a metal, an alloy, an oxide, and a non-metallic particle, or any combination thereof. The thermal interface material according to claim 1, wherein the first thermally conductive particles and the second thermally conductive particles are each one of a metal, an alloy, an oxide, and a non-metallic particle, or any combination thereof. The thermal interface material according to claim 4 or 5, wherein the metal is one of tin, copper, indium, lead, antimony, gold, silver, antimony and aluminum or any combination thereof. The thermal interface material according to claim 4 or 5, wherein the alloy is one of an alloy of any combination of tin, copper, indium, lead, antimony, gold, silver, antimony and aluminum or A variety. The thermal interface material according to claim 1, wherein the first thermally conductive particles have a diameter of from 10 nm to 10,000 nm. The thermal interface material according to claim 1, wherein the shape of the first thermally conductive particles is one of a rod shape, a sheet shape, a powder form, and a granular form, or any combination thereof. The thermal interface material according to claim 3, wherein the diameters of the first heat conductive particles and the second heat conductive particles are respectively from 10 nm to 10,000 nm. The thermal interface material according to claim 3, wherein the shapes of the first heat conductive particles and the second heat conductive particles are one of a rod shape, a sheet shape, a powder shape and a granular shape, or any combination thereof. The thermal interface material of claim 1, wherein at least a portion of the carbon nanotubes of the array of carbon nanotubes extend into the first substrate. The thermal interface material according to claim 2, wherein the two ends of at least a portion of the carbon nanotubes of the carbon nanotube array are respectively penetrated into the first substrate and the second substrate. The thermal interface material according to claim 1, wherein the material of the first substrate is one of a phase change material, a resin material, and a thermal conductive paste, or any combination thereof. The thermal interface material according to claim 2, wherein the materials of the first substrate and the second substrate are one of a phase change material, a resin material and a thermal conductive adhesive, or any combination thereof. The thermal interface material of claim 14 or 15, wherein the phase change material is paraffin wax. The thermal interface material according to claim 14 or 15, wherein the resin material is an epoxy resin, an acrylic resin or a enamel resin. The thermal interface material according to claim 1, wherein the interstices between the carbon nanotubes in the array of carbon nanotubes further comprise an organic substance disposed in contact with the first substrate. The thermal interface material according to claim 2, wherein the interstices between the carbon nanotubes in the array of carbon nanotubes further comprise an organic substance disposed in contact with the first substrate and the second substrate. The thermal interface material according to claim 18 or 19, wherein the organic substance is a silicone series, a polyethylene glycol, a polyester, an epoxy resin series, an anoxic glue series, an acrylic glue series or a rubber. A method of preparing a thermal interface material, comprising the steps of: providing a carbon nanotube array; placing a first substrate at one end of the carbon nanotube array; and adding a plurality of first thermally conductive particles to In the first substrate, a portion of the plurality of thermally conductive particles of the first thermally conductive particles are contacted with the array of carbon nanotubes, wherein the array of carbon nanotubes is composed of a plurality of linear carbon nanotubes Tube composition. The method for preparing a thermal interface material according to claim 21, wherein the method of disposing a first substrate on one end of the carbon nanotube array is to apply the material of the first substrate to the nanometer. One end of the carbon tube array forms the first substrate. The method for preparing a thermal interface material according to claim 21, wherein the step of forming a thermal interface material comprises: adding a plurality of first heat conductive particles to a surface of the first substrate; heating the first substrate to the first a melting point of the substrate such that the plurality of first thermally conductive particles are immersed in the first substrate, and a portion of the thermally conductive particles are brought into contact with one end of the array of carbon nanotubes. The method for preparing a thermal interface material according to claim 21, wherein the step of providing an array of carbon nanotubes further comprises filling an organic material in a space between the carbon nanotubes of the carbon nanotube array in. The method for preparing a thermal interface material according to claim 21, wherein the plurality of first heat conductive particles are added to the first substrate, and the plurality of heat conductive particles of the plurality of first heat conductive particles are combined with the nano The step of contacting the carbon tube array further includes disposing a second substrate at the other end of the array of carbon nanotubes. The method of preparing the thermal interface material according to claim 25, wherein a plurality of second heat conductive particles are added to the surface of the second substrate; and the second substrate is heated to a melting point thereof, so that the plurality of second heat conductive particles The second substrate is immersed and a portion of the thermally conductive particles are brought into contact with the other end of the array of carbon nanotubes. The method of preparing a thermal interface material according to claim 21, wherein the first thermally conductive particles are one of a metal, an alloy, an oxide, and a non-metallic particle, or any combination thereof. The method for preparing a thermal interface material according to claim 21, wherein the first thermally conductive particles have a diameter of from 10 nm to 10,000 nm. The method for preparing a thermal interface material according to claim 26, wherein the first thermally conductive particles and the second thermally conductive particles are each one of a metal, an alloy, an oxide, and a non-metallic particle, or any combination thereof. The method for preparing a thermal interface material according to claim 26, wherein the diameters of the first heat conductive particles and the second heat conductive particles are respectively from 10 nm to 10,000 nm.