TWI444321B - Coating device, substrate receiving method, and coating method - Google Patents

Description

Coating device, substrate receiving method, and coating method

The present invention relates to a coating apparatus, a method of receiving a substrate, and a coating method.

The present application claims priority based on Japanese Patent Application No. 2007-183388 filed on July 12, 2007 in Japan, the content of which is incorporated herein.

A fine pattern such as a wiring pattern or an electrode pattern is formed on a glass substrate constituting a display panel such as a liquid crystal display. Generally, such a pattern is formed by a method such as photolithography. In the photolithography technique, a step of forming a photoresist film on a glass substrate, a step of patterning the photoresist film, and a step of developing the photoresist film are performed.

A known coating device for applying a photoresist film on a surface of a substrate is, for example, a slit nozzle fixed to apply a photoresist to a glass substrate that is moved under the slit nozzle. In the conventional coating apparatus, the substrate is floated and moved by ejecting a gas onto the stage (for example, refer to the specific document 1). In such a coating apparatus, a lift pin is provided in a substrate loading area and a substrate carry-out area, and when the board is received from the outside of the apparatus, the board can be lifted by the lift pin to carry the outside. The mechanism moves to the space on the lower side of the substrate, thereby performing the receiving operation.

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2005-270841

However, when a lift pin is used, a large mechanism such as a lift mechanism of the lift pin must be mounted on the coating device, and the cost of power consumed when the lift mechanism is actuated can be added. Moreover, it is necessary to receive space for the substrate.

In view of the above circumstances, an object of the present invention is to provide a coating apparatus, a substrate receiving method, and a coating method, which can reduce the cost at the time of use.

According to a first aspect of the present invention, there is provided a substrate transporting unit that transports a substrate and transports the substrate, and a coating portion that applies a liquid to the surface of the substrate while transporting the substrate by the substrate transporting unit. In the above-described substrate transporting unit, the substrate carrying unit is provided with a substrate carrying-in area into which the substrate is carried in and a substrate carrying-out area for carrying out the substrate, and at least one of the substrate carrying-in area and the substrate carrying-out area is provided with: When the substrate is received from the external transport mechanism, the portion of the external transport mechanism is accommodated.

According to the first aspect of the present invention, the substrate transporting portion is provided with a substrate carrying-in area into which the substrate is carried in and a substrate carrying-out area for carrying out the substrate, and at least one of the substrate carrying-in area and the substrate carrying-out area is provided: When the substrate is received between the external transport mechanism and the external transport mechanism, the portion of the external transport mechanism is accommodated. Therefore, when the external transport mechanism is housed, the substrate can be received. Thereby, the substrate can be received without providing the lift pins, whereby the cost can be reduced. Further, since the substrate can be received without providing the lift pins, the processing cycle can be shortened. Since the substrate can be directly received in the substrate loading area or the substrate carrying-out area, the space on the board conveying portion can be efficiently utilized. Thereby, the coating apparatus can be miniaturized.

In the above-described coating apparatus, a region in which the accommodating portion is provided in the substrate loading region and the substrate carrying-out region is provided, and a gas discharge port for discharging a gas for floating the substrate is provided in a region other than the accommodating portion. .

In the first aspect of the present invention, a region in which the accommodating portion is provided in the substrate carrying-in region and the substrate carrying-out region is provided, and in a region other than the accommodating portion, a gas discharge port that discharges a gas for floating the substrate is provided. It is not necessary to eject the gas to the entire surface of the substrate carrying-in area and the substrate carrying-out area. Thereby, the cost required for the gas ejection can be reduced as compared with the method of discharging the gas to the entire surface.

In the above coating apparatus, the accommodating portion is provided in plural at predetermined intervals.

In the first aspect of the present invention, a plurality of accommodating portions are provided at predetermined intervals, and a part of the external transport mechanism can be accommodated widely even in an external transport mechanism having a different structure.

In the above coating apparatus, the accommodating portion is provided in a direction along the conveying direction.

In the first aspect of the present invention, the accommodating portion is disposed in the direction along the transport direction, and the substrate can be smoothly transported after the substrate is received.

In the above-described coating apparatus, the accommodating portion is provided at least in the substrate loading region, and a periphery of a region in which the accommodating portion is provided in the substrate loading region is provided to adjust a position of the substrate to correspond to the coating portion. A first alignment mechanism that performs the location of the coating.

In the first aspect of the present invention, the accommodating portion is provided at least in the substrate loading region, and the periphery of the region in which the accommodating portion is provided in the substrate loading region is provided to adjust the position of the substrate to be coated corresponding to the coating portion. The first alignment mechanism at the position of the cloth can smoothly carry the substrate after the substrate is carried in. After that, the liquid material can be applied to the correct position on the substrate, so that an appropriate coating operation can be performed next.

In the above coating apparatus, the accommodating portion is provided at least in the substrate carrying-out region, and a periphery of a region where the accommodating portion is provided in the substrate carrying-out region is provided to adjust a position of the substrate to be used for the substrate. The second alignment mechanism corresponding to the position of the external transport mechanism that is carried out.

In the first aspect of the present invention, the accommodating portion is provided at least in the substrate carrying-out region, and the periphery of the region where the accommodating portion is provided in the substrate carrying-out region is provided to adjust the position of the substrate to the outside for carrying out the substrate. The second alignment mechanism corresponding to the position of the transport mechanism can smoothly transfer the substrate to the external transport mechanism when the substrate is carried out.

According to a second aspect of the present invention, there is provided a substrate transporting unit that transports a substrate and transports the substrate, and a coating portion that applies a liquid to the surface of the substrate while transporting the substrate by the substrate transporting unit. And a method of accommodating a substrate for receiving a substrate between the external transfer mechanisms that hold the substrate and transporting the substrate; and the substrate transport unit is provided with a substrate into which the substrate is carried And a substrate carrying-out area in which the substrate is carried out; and at least one of the substrate loading area and the substrate carrying-out area is provided to be a part of the external transport mechanism when the substrate is received between the external transport mechanism and the external transport mechanism The accommodating portion to be accommodated; the portion of the external transport mechanism is housed in the accommodating portion, and the substrate is placed on the substrate transport portion to receive the substrate.

According to a second aspect of the present invention, the substrate transporting unit is provided with a substrate carrying-in area into which the substrate is carried in and a substrate carrying-out area for carrying out the substrate, and at least one of the substrate carrying-in area and the substrate carrying-out area is provided: When the substrate is received between the external transport mechanism and the external transport mechanism, the external transport mechanism is partially housed in the storage portion, and the substrate is placed on the substrate transport portion. Since the substrate is received, the substrate can be received without providing the lift pin, thereby reducing the cost. Further, since the substrate can be received without providing the lift pins, the processing cycle can be shortened.

In the method of receiving the substrate, an alignment operation is performed in the substrate loading region so that the position of the substrate corresponds to a position at which the coating portion is applied.

In the method of receiving the substrate, the alignment operation is performed in the substrate loading region so that the position of the substrate corresponds to the position where the application portion is applied, and the substrate can be smoothly conveyed after the substrate is loaded. After that, the liquid material can be applied to the correct position on the substrate, so that an appropriate coating operation can be performed next.

In the method of receiving the substrate, an alignment operation is performed in the substrate carry-out area so that the position of the substrate corresponds to the position of the external transport mechanism for carrying out the substrate.

According to a second aspect of the present invention, in the substrate carrying-out region, the alignment operation is performed so that the position of the substrate corresponds to the position of the external transport mechanism for carrying out the substrate, and the substrate can be smoothly transferred when the substrate is carried out. Go to the external handling mechanism.

In the above-described substrate receiving method, when the substrate is received, the substrate transporting portion restricts the movement of the substrate.

According to the second aspect of the present invention, when the substrate is transported, the movement of the substrate is restricted in the substrate transporting portion, and the substrate can be prevented from shifting before the substrate is transported.

In the coating method of the present invention, the substrate is received by the method of receiving the substrate.

In the second aspect of the present invention, when the lift pins are not provided for the substrate, the overall cost can be reduced when the coating device is used. Even if the lift pins are not provided, the substrate can be received, so that the processing beat can be shortened.

According to the present invention, it is possible to provide a coating apparatus, a substrate receiving method, and a coating method, which can reduce the cost at the time of use.

Embodiments of the present invention will be described below based on the drawings.

Fig. 1 is a perspective view of the coating device 1 of the present embodiment. The main structure of the coating device 1 of the present invention will be described with reference to this drawing.

As shown in FIG. 1 , the coating device 1 of the present embodiment is, for example, a coating device that applies a photoresist to a glass substrate used for a liquid crystal panel or the like, and is a substrate conveying unit 2 and a coating unit 3 . The management unit 4 is a main constituent element. In the coating device 1, the substrate is transported by the substrate transport unit 2, and the photoresist is applied to the substrate by the application unit 3, and the application unit 4 manages the application unit 3. status. In the board conveyance unit 2, the characteristic components of the present embodiment, that is, the accommodating portions 25b and 28b (see FIG. 3) are provided.

2 is a front view of the coating device 1, FIG. 3 is a plan view of the coating device 1, and FIG. 4 is a side view of the coating device 1. The configuration of the coating device 1 will be described in detail with reference to these drawings.

(substrate conveying unit)

First, the structure of the substrate conveyance unit 2 will be described.

The board conveyance unit 2 includes a board loading area 20, a coating processing area 21, a substrate carry-out area 22, a transport mechanism 23, and a frame portion 24 that supports these structures. In the substrate transport unit 2, the substrate S is sequentially transported to the substrate loading area 20, the coating processing area 21, and the substrate carrying-out area 22 by the transport mechanism 23. The substrate loading area 20, the coating processing area 21, and the substrate carrying-out area 22 are arranged in this order from the upstream side to the downstream side in the substrate conveyance direction. The transport mechanism 23 is provided on one side of each of the portions in order to cover the substrate loading area 20, the coating processing area 21, and the substrate carrying-out area 22.

Hereinafter, in explaining the structure of the coating apparatus 1, the directions in the drawings will be described using XYZ coordinates for ease of display. The longitudinal direction of the substrate conveyance unit 2, that is, the conveyance direction of the substrate is referred to as the X direction. The direction perpendicular to the X direction (substrate conveyance direction) as viewed from the plan view is referred to as the Y direction. The direction perpendicular to the plane including the X-axis and the Y-axis is referred to as the Z direction. In the X direction, the Y direction, and the Z direction, respectively, the direction of the arrow in the figure is the + direction, and the direction opposite to the direction of the arrow is the - direction.

The substrate loading area 20 is a portion into which the substrate S conveyed from the outside of the apparatus is carried, and has a loading side table (work table) 25.

The loading side table 25 is provided on the upper portion of the frame portion 24, and is, for example, a plate-like member which is formed of SUS or the like and has a rectangular shape when viewed from a plan view. The loading side table 25 has a long axis in the X direction. The loading side table 25 is provided with a plurality of air ejection holes 25a and a plurality of housing portions 25b.

The air ejection hole 25a is a hole that ejects air to the table surface 25c of the loading side table 25. For example, the area where the substrate S passes through the loading side table 25 is arranged in a matrix shape as seen from a plan view. The air ejection hole 25a is provided to penetrate the loading side table 25. An air supply source (not shown) is connected to the air ejection hole 25a. The loading side table 25 can float the substrate S in the +Z direction by the air ejected from the air ejection hole 25a.

The accommodating portion 25b is a portion that accommodates a part of the external transport mechanism when the substrate S is received from the external transport mechanism. The accommodating portion 25b is provided in the loading region of the substrate S of the loading side table 25 from the end portion in the -X direction to almost the entire surface in the +X direction. The accommodating portion 25b is provided in plural in the Y direction.

One alignment device 25d is provided at each of the both ends of the loading side table 25 in the Y direction. The alignment device 25d is a device that positions the substrate S carried into the loading side table 25. Each of the alignment devices 25d has a long hole portion and a positioning member (not shown) provided in the long hole portion, and mechanically sandwiches the substrate carried into the loading side table 25 from both sides.

The coating treatment region 21 is a portion where the coating process of the photoresist is performed, and a processing table 27 that floats and supports the substrate S is provided.

The processing table 27 is a plate-shaped member that is rectangular in plan view when the light-absorbing material having a hard aluminum oxide film as a main component is used as a main component of the hard aluminum oxide film, and is provided on the +X direction side with respect to the loading side table 25. The portion of the processing table 27 covered with the light absorbing material suppresses reflection of light such as laser light. The processing table 27 has a long axis in the Y direction. The size of the processing table 27 in the Y direction is substantially the same as the size of the loading side table 25 in the Y direction. The processing table 27 is provided with a plurality of air ejection holes 27a for discharging air onto the table surface 27c, and a plurality of air suction holes 27b for sucking air on the table surface 27c. These air ejection holes 27a and air suction holes 27b are provided to penetrate the processing table 27.

In the processing table 27, the pitch of the air ejection holes 27a is narrower than the pitch of the air ejection holes 25a provided in the loading side table 25, and the air ejection holes 27a are provided closer than the loading side table 25. Therefore, the amount of floating of the substrate can be adjusted at a higher accuracy than the other stages, and the amount of floating of the substrate can be controlled, for example, to 100 μm or less, and preferably 50 μm or less.

The substrate carry-out area 22 is a portion for carrying out the substrate S coated with the photoresist to the outside of the device, and has a carry-out side table (work table) 28. The carry-out side stand 28 is provided on the +X direction side of the processing table 27, and is formed of substantially the same material and size as the carry-in side stand 25 provided in the substrate carry-in area 20. Similarly to the loading side table 25, the unloading side table 28 is provided with an air ejection hole 28a and an accommodating portion 28b.

The accommodating portion 28b is a portion that accommodates a part of the external transport mechanism when the substrate S is sent to the external transport mechanism. The accommodating portion 28b is provided in a predetermined width from the end portion in the +X direction to the -X direction among the carry-out regions of the substrate S among the carry-out side tables 28. The accommodating portion 28b is provided in plural in the Y direction.

The transport mechanism 23 has a transporter 23a, a vacuum pad 23b, and a rail 23c. The structure of the transporter 23a is internally provided with, for example, a linear motor, and the linear motor is driven to move the transporter 23a on the rail 23c.

The conveyor 23a is disposed so that a predetermined portion 23d is superposed on the end portion in the -Y direction of the substrate S as viewed in a plan view. The portion 23d overlapping the substrate S is disposed at a position lower than the height position of the back surface of the substrate when the substrate S is floated.

The vacuum pad 23b has a plurality of portions 23d which are arranged in the carrier 23a and overlap the substrate S. The vacuum pad 23b has an adsorption surface for vacuum-adsorbing the substrate S, and is disposed such that the adsorption surface faces upward. The vacuum pad 23b can hold the substrate S by allowing the adsorption surface to adsorb the rear end portion of the substrate S. Each of the vacuum pads 23b is adjustable in height from the upper surface of the conveyor 23a. For example, the height position of the vacuum pad 23b can be adjusted up and down in response to the amount of floating of the substrate S. The rail 23c extends over the side of the loading side table 25, the processing table 27, and the unloading side table 28, and slides on the rail 23c to move the transporter 23a along the respective bases. .

(coating section)

Next, the structure of the coating portion 3 will be described.

The coating portion 3 is a portion for applying a photoresist on the substrate S, and has a gate frame 31 and a nozzle 32.

The portal frame 31 has a pillar member 31a and a bridge member 31b that are disposed to cross the processing table 27 in the Y direction. Each of the pillar members 31a is provided on the Y-direction side of the processing table 27, and each pillar member 31a is supported by both side surfaces of the frame portion 24 on the Y-direction side. Each of the strut members 31a is disposed such that the height positions of the upper end portions thereof coincide. The bridging member 31b is bridged between the upper end portions of the respective strut members 31a, and is movable up and down with respect to the strut members 31a.

The portal frame 31 is connected to the moving mechanism 31c and is movable in the X direction. The door frame 31 is movable between it and the management unit 4 by the moving mechanism 31c. That is, the nozzle 32 provided to the portal frame 31 is movable between it and the management portion 4. The door frame 31 can also be moved in the Z direction by a moving mechanism (not shown).

The nozzle 32 is formed in an elongated shape in which one direction is a long axis, and is a surface provided on the -Z direction side of the bridge member 31b of the portal frame 31. In the tip end of the nozzle 32 in the -Z direction, a slit-shaped opening portion 32a is provided along the longitudinal direction of the nozzle 32, and the photoresist is discharged from the opening portion 32a. In the nozzle 32, the longitudinal direction of the opening 32a is parallel to the Y direction, and the opening 32a is disposed to face the processing table 27. The dimension of the opening portion 32a in the major axis direction is smaller than the dimension of the substrate S to be transported in the Y direction, and the photoresist is not applied to the peripheral region of the substrate S. Inside the nozzle 32, a flow path (not shown) through which the photoresist flows to the opening 32a is provided, and a flow of the photoresist (not shown) is connected to the flow path. The photoresist supply source has, for example, a pump (not shown), and the photoresist is ejected from the opening 32a by pushing the photoresist to the opening 32a by the pump. The nozzle 32 is provided with a moving mechanism, and the strut member 31a is provided with a moving mechanism (not shown), and the moving mechanism allows the nozzle 32 held by the bridging member 31b to move in the Z direction. The bridge member 31b is provided with an inductor 33 for measuring the distance in the Z direction between the opening 32a of the nozzle 32, that is, the tip end of the nozzle 32 and the opposing surface facing the tip end of the nozzle 32.

(Management)

The configuration of the management unit 4 will be described.

The management unit 4 is a portion for managing the nozzle 32 in order to limit the amount of discharge of the photoresist (liquid) discharged to the substrate S, and is disposed so as to overlap the substrate transport unit 2 as viewed in plan view. On the -X direction side of the coating portion 3 (upstream side in the substrate conveyance direction). The management unit 4 includes a preliminary discharge mechanism 41, a dipping tank 42, a nozzle cleaning device 43, an accommodating portion 44 for accommodating these structures, and a holding member 45 for holding the accommodating portion. The holding member 45 is connected to the moving mechanism 45a. The accommodating portion 44 is movable in the X direction by the moving mechanism 45a.

The preliminary discharge mechanism 41, the immersion tank 42, and the nozzle cleaning device 43 are arranged in the -X direction side in this order. The sizes of the preliminary discharge mechanism 41, the immersion tank 42, and the nozzle cleaning device 43 in the Y direction are smaller than the distance between the pillar members 31a of the door frame 31, and the door frame 31 spans the respective portions. Come to pick up.

The preliminary discharge mechanism 41 is a portion that preliminarily discharges the photoresist. The preliminary discharge mechanism 41 is disposed closest to the nozzle 32. The immersion tank 42 is a liquid tank in which a solvent such as a diluent is stored inside. The nozzle cleaning device 43 is a device for rinsing the nozzle 32.

The nozzle cleaning device 43 is provided with a moving mechanism, and has a larger size in the X direction than the preliminary discharge mechanism 41 and the immersion tank 42. When the nozzle cleaning device 43 is disposed at a position close to the nozzle 32 (+X direction side), the other portion is disposed at a position farther from the nozzle 32 (the −X direction side). In this case, when the nozzle 32 is connected to other portions in the accommodating portion 44, it is necessary to pass the moving mechanism, thereby making the moving distance of the nozzle 32 long.

The nozzle cleaning device 43 of the present embodiment is provided at a position closer to the -X direction than the preliminary discharge mechanism 41 and the immersion tank 42, and the moving mechanism of the nozzle cleaning device 43 is provided in the nozzle cleaning device 43. Since the washing mechanism is further on the -X direction side, the nozzle 32 is not passed through the moving mechanism, and is arranged to minimize the moving distance of the nozzle 32. Of course, the arrangement of the preliminary discharge mechanism 41, the immersion tank 42, and the nozzle cleaning device 43 is not limited to the arrangement of the present embodiment, and other arrangements may be used.

(Operation of coating device)

Next, the operation of the coating apparatus 1 having the above configuration will be described.

5A to 10 are views showing the operation of the coating device 1. The action of applying a photoresist to the substrate S will be described with reference to the respective drawings. In this operation, the substrate S is carried into the substrate loading area 20 by the external transport mechanism, the substrate S is floated and transported, and the photoresist is applied to the coating processing region 21 to apply the photoresist. The substrate S of the agent is carried out from the substrate carry-out area 22. In the sixth to ninth drawings, the outline of the portal frame 31 (the management unit 4 is a solid line and has been deleted) is displayed by a broken line, and the configuration of the nozzle 32 and the processing table 27 can be easily determined. The detailed operation of each part will be described below.

The coating device 1 is placed on standby before the substrate is carried into the substrate loading area 20. Specifically, the transporter 23a is disposed on the -Y direction side of the substrate loading position of the loading side table 25, and the height position of the vacuum cushion 23b is positioned at the floating height position of the substrate, and the air ejection hole from the loading side table 25 is provided. 25a, the air ejection hole 27a of the processing table 27, the air suction hole 27b, and the air ejection hole 28a of the carry-out side stand 28 are respectively ejected or sucked by the air, and the air is supplied to the state where the substrate is floated on the surface of each mesa. .

In this state, for example, as shown in FIG. 5A, the external transport mechanism such as the transport arm 60 transports the substrate S to the substrate carry-in position from the outside. When the substrate S is carried onto the loading side table 25, as shown in FIG. 5B, the transport arm 60 is moved in the -Z direction, and a part of the transport arm 60 is housed in the housing portion provided at the loading side table 25. Within 25b. When the transport arm 60 is carried into the table surface 25c of the side table 25, the substrate S is held by the air supplied to the table surface 25c, and is separated from the transport arm 60. Then, as shown in FIG. 5C, the transport arm 60 in the accommodating portion 25b is moved toward the -X direction side, and the transport arm 60 is moved outside the accommodating portion 25.

The substrate S held in a state of being floated with respect to the table surface 25c by air is positioned by the positioning member of the positioning device 25d. In this positioning operation, in particular, the position in the Y direction is aligned to a position corresponding to the nozzle 32 of the coating unit 3. Then, the vacuum pad 23b of the conveyor 23a disposed on the -Y direction side of the substrate loading position is vacuum-adsorbed to the end portion of the substrate S on the -Y direction side. Fig. 6 shows a state in which the end portion of the substrate S in the -Y direction side is adsorbed. After the end portion on the -Y direction side of the substrate S is sucked by the vacuum pad 23b, the carrier 23a is moved along the rail 23c. Since the substrate S is in the floating state, even if the driving force of the conveyor 23a is small, the substrate S can smoothly move along the rail 23c.

When the leading end of the substrate S in the conveyance direction reaches the position of the opening 32a of the nozzle 32, as shown in Fig. 7, the photoresist is discharged from the opening 32a of the nozzle 32 toward the substrate S. The discharge operation of the photoresist is performed by fixing the position of the nozzle 32 and transporting the substrate S by the transporter 23a.

As the substrate S moves, the photoresist film R is applied onto the substrate S as shown in FIG. The resist film R is formed in a predetermined region of the substrate S by passing the substrate S through the lower surface of the opening 32a of the photoresist.

The substrate S on which the photoresist film R is formed is conveyed toward the carry-out side table 28 by the transporter 23a. The unloading side table 28 is conveyed to the substrate carrying-out position as shown in FIG. 9 in a state of being floated on the table surface 28c.

Once the substrate S reaches the substrate carry-out position, the suction of the vacuum liner 23b is first released. Then, as shown in FIGS. 10A to 10C, for example, a part of the external transport mechanism such as the transport arm 61 is moved into the accommodating portion 28b, and the transport arm 61 is moved in the +Z direction, and the transport arm 61 receives the substrate S. After the substrate S is received, the transport arm 61 is moved toward the +X direction side. The substrate S is sent to the transfer arm 61. After the substrate S is sent to the transport arm 61, the transporter 23a is returned to the substrate loading position of the loading side table 25, and stands by until the next substrate S is to be transported.

While the next substrate S has not yet been transported, the application portion 3 performs a preliminary discharge operation for holding the discharge state of the nozzles 32. As shown in Fig. 11, the door frame 31 is moved to the position of the management unit 4 in the -X direction by the moving mechanism 31c.

After the door frame 31 is moved to the position of the management unit 4, the position of the door frame 31 is adjusted to connect the nozzle 32 to the nozzle cleaning device 43, and the nozzle cleaning device 43 cleans the nozzle 32.

After the nozzle 32 is cleaned, the nozzle 32 is connected to the preliminary discharge mechanism 41. In the preliminary discharge mechanism 41, the opening 32a of the nozzle 32 is moved to a predetermined position in the Z direction while the distance between the opening 32a and the preliminary discharge surface is measured, and the nozzle 32 is moved in the -X direction. The photoresist is prepared to be discharged from the opening 32a.

After the preliminary discharge operation, the portal frame 31 is returned to the original position. When the next substrate S is to be transported, as shown in Fig. 12, the nozzle 32 is moved to a predetermined position in the Z direction. By applying the coating operation of the photoresist film R and the preliminary discharge operation to the substrate S, a favorable photoresist film R is formed on the substrate S.

Alternatively, if necessary, for example, the management unit 4 is connected every predetermined number of times, and the nozzle 32 is brought into the immersion tank 42. In the immersion tank 42, the nozzle 32 is prevented from drying by exposing the opening 32a of the nozzle 32 to a vapor atmosphere of a solvent (diluent) stored in the immersion tank 42.

In the present embodiment, the loading side table 25 and the unloading side table 28 of the board conveying unit 2 are provided with a housing portion 25b that accommodates a part of the external conveying mechanism when the substrate S is received between the external conveying mechanism and the external conveying mechanism. Since it is 28b, when the external transport mechanism is partially housed, the substrate S can be received. Thereby, the substrate S can be received without providing the lift pins, whereby the cost can be reduced. Further, since the substrate S can be directly received in the substrate loading area or the substrate carrying-out area, the space on the board conveying unit 2 can be utilized efficiently. Thereby, the coating apparatus 1 can be miniaturized. Further, since the substrate can be received without providing the lift pins, the processing cycle can be shortened.

The technical scope of the present invention is not limited to the above-described embodiments, and can be appropriately modified without departing from the scope of the present invention.

In the entire configuration of the coating device 1, in the above-described embodiment, the transport mechanism 23 is disposed on the -Y direction side of each of the table portions, and is not limited thereto. For example, the transport mechanism 23 may be disposed on the +Y direction side of each of the stages. Further, as shown in Fig. 13, the transport mechanism 23 (the transporter 23a, the vacuum cushion 23b, and the rail 23c) may be disposed on the -Y direction side of each of the bases, and the transport mechanism 23 may be disposed on the +Y direction side. The transport mechanism 53 (the transporter 53a, the vacuum cushion 53b, and the rail 53c) having the same structure can transport different substrates by the transport mechanism 23 and the transport mechanism 53. For example, as shown in the figure, the substrate S1 is transported by the transport mechanism 23, and the substrate S2 is transported by the transport mechanism 53. In this case, the conveyance mechanism 23 and the conveyance mechanism 53 can mutually convey a board|substrate, and productivity can be improved. On the other hand, when the substrate having the area of half of the substrates S, S1, and S2 is to be transported, for example, the transport mechanism 23 and the transport mechanism 53 are held one by one, and the transport mechanism 23 and the transport mechanism 53 are moved toward the +. When the X direction is in the same direction, it is possible to carry two substrates at the same time. With this configuration, productivity can be improved.

In the above-described embodiment, the alignment device 25d is provided only on the loading side table 25 side of the substrate conveying portion 2, and the present invention is not limited thereto. For example, the aligning device may be provided on the carry-out side table 28. In this case, the alignment device of the carry-out side table 28 is aligned with the transfer arm 61 so that the position of the substrate S is aligned.

In the above embodiment, the alignment operation is performed by the alignment device 25d when the substrate S is carried into the loading side table 25, and is not limited thereto. For example, unlike the alignment device 25, the substrate S may be provided to be restricted. Mobile movement limiting mechanism. For example, the movement restricting member that can be present on the table surface 25c is disposed so as to surround the substrate loading area of the loading side table 25, and the movement restricting member protrudes from the table surface 25c when the substrate S is loaded. The same structure may be provided for the substrate carry-out area of the carry-out side stand 28.

1. . . Coating device

2. . . Substrate handling unit

3. . . Coating department

4. . . Management

25. . . Move into the side

25b. . . Containment department

25d. . . Alignment device

28. . . Moving out of the side

28b. . . Containment department

S. . . Substrate

R. . . Photoresist film

Fig. 1 is a perspective view showing the structure of a coating apparatus according to an embodiment of the present invention.

Fig. 2 is a front elevational view showing the structure of a coating apparatus according to the above embodiment of the present invention.

Fig. 3 is a plan view showing the structure of the coating apparatus of the above embodiment of the present invention.

Fig. 4 is a side view showing the configuration of the coating apparatus of the above embodiment of the present invention.

Fig. 5A is a view showing the operation of the coating apparatus of the above embodiment of the present invention.

Fig. 5B is a view showing the operation of the coating apparatus according to the embodiment of the present invention.

Fig. 5C is a view showing the operation of the coating apparatus according to the embodiment of the present invention.

Fig. 6 is a view showing the operation of the coating apparatus of the above embodiment of the present invention.

Fig. 7 is a view showing the operation of the coating apparatus of the above embodiment of the present invention.

Fig. 8 is a view showing the operation of the coating apparatus of the above embodiment of the present invention.

Fig. 9 is a view showing the operation of the coating apparatus of the above embodiment of the present invention.

Fig. 10A is a view showing the operation of the coating apparatus of the above embodiment of the present invention.

Fig. 10B is a view showing the operation of the coating apparatus of the above embodiment of the present invention.

Fig. 10C is a view showing the operation of the coating device of the above embodiment of the present invention.

Fig. 11 is a view showing the operation of the nozzle cleaning device according to the embodiment of the present invention.

Fig. 12 is a view showing the operation of the nozzle cleaning device according to the embodiment of the present invention.

Fig. 13 is a plan view showing the configuration of a coating apparatus according to another embodiment of the present invention.

25. . . Move into the side

25a. . . Air ejection hole

25b. . . Containment department

25c. . . Table surface

25d. . . Alignment device

60. . . Transport arm

S. . . Substrate

Claims (11)

A coating device includes a substrate transporting unit that transports a substrate and transports the substrate, and a coating device that applies a liquid to the surface of the substrate while transporting the substrate in the substrate transporting unit. The substrate transporting unit is provided with: a substrate carrying-in area into which the substrate is carried in and a substrate carrying-out area in which the substrate is carried out; and at least one of the substrate carrying-in area and the substrate carrying-out area is provided with: When the substrate is received from the external transport mechanism, the portion of the external transport mechanism is accommodated in the accommodating portion, and the substrate transport portion has a gas supply portion, and the gas supply portion is before the substrate is received. In the substrate loading area, gas is supplied between the substrate and the substrate, and the substrate is brought into a floating state when the substrate is carried from the external transport mechanism to the substrate loading region. The coating device according to claim 1, wherein a region in which the accommodating portion is provided in the substrate loading region and the substrate carrying-out region is provided in a region other than the accommodating portion for discharging the substrate The gas discharge port of the floating gas. A coating apparatus according to claim 1, wherein the accommodating portion is provided at a predetermined interval. Such as the coating device of claim 1 of the patent scope, wherein the above-mentioned The volume is disposed in a direction along the conveying direction. The coating apparatus according to claim 1, wherein the storage unit is provided at least in the substrate loading area, and a periphery of a region in which the storage unit is provided in the substrate loading area is provided by being carried in The substrate in the substrate loading region is mechanically sandwiched from both sides in a direction orthogonal to the conveyance direction of the substrate, and the position of the substrate is adjusted to correspond to a coating position applied by the coating portion. The first alignment mechanism. The coating device according to claim 1, wherein the storage portion is provided at least in the substrate carrying-out region, and a region around the region where the storage portion is provided in the substrate carrying-out region is provided by The substrate in the substrate carrying-out area is mechanically sandwiched from both sides in a direction orthogonal to the conveyance direction of the substrate, and the position of the substrate is adjusted to correspond to the position of the external conveyance mechanism for carrying out the substrate. The second alignment mechanism. A method of accommodating a substrate, comprising: a substrate transporting unit that transports the substrate and transporting the substrate, and a coating portion that applies a liquid to the surface of the substrate while transporting the substrate in the substrate transporting unit; In the method of receiving a substrate, the substrate transporting unit is provided with a substrate carrying area in which the substrate is carried in, and a method of transferring the substrate to the external transport unit that holds and transports the substrate. a substrate carry-out area from which the substrate is carried out; and at least one of the substrate carry-in area and the substrate carry-out area is provided when the substrate is transferred to and from the external transport mechanism An accommodating portion for accommodating a part of the transport mechanism; the substrate is placed in the accommodating portion by placing a part of the external transport mechanism in the accommodating portion, and the substrate is transported to perform the substrate Before the reception, the gas is supplied to the substrate so that the substrate floats to the extent that the substrate is floated, and the substrate is carried from the external transport mechanism to the substrate carry-in region in a floating state. The substrate receiving method according to the seventh aspect of the invention, wherein the substrate loading region is mechanically supported on both sides in a direction orthogonal to a conveyance direction of the substrate by the substrate carried in the substrate loading region The substrate is sandwiched to perform an alignment operation of the substrate such that the position of the substrate corresponds to a coating position applied by the coating portion. The substrate receiving method according to claim 7, wherein the substrate disposed in the substrate carrying-out region has mechanical properties on both sides in a direction orthogonal to a conveyance direction of the substrate. The substrate is sandwiched to perform the alignment operation of the substrate so that the position of the substrate corresponds to the position of the external transport mechanism for carrying out the substrate. The method of receiving a substrate according to claim 7, wherein the substrate transporting unit restricts movement of the substrate when the substrate is received. A coating method characterized in that the substrate is received by the method of receiving the substrate of claim 7 of the patent application.