TWI443369B - Image capturing system - Google Patents

Description

Optical imaging system

The present invention relates to an optical imaging system.

Currently, sensing wafers in various optical imaging devices, such as CCD (Charge Coupled Device) or CMOS (Complementary Metal Oxide Semiconductor), are generally in line with the lens and imaging target in the optical imaging device, even though there is currently a paraxial optical A camera of an imaging system, which also uses a plane mirror or a total reflection mirror to reflect light onto the optical element. The configuration of the optical imaging system is such that the field of view of the optical imaging system is limited to a certain range, and in some cases, it is required to be extremely large. In the field of view angle, it is often necessary to use some auxiliary devices to assist the optical imaging system to rotate to obtain a larger field of view. This mechanism is more complicated and requires an operator to operate autonomously, which is cumbersome.

In view of this, it is necessary to provide an optical imaging system having a wide field of view.

An optical imaging system includes a sensing wafer, at least one set of optical lenses, and a curved mirror. The optical lens is disposed in an optical path of the sensing chip for modulating light. The curved mirror is disposed on the other side of the optical lens corresponding to the sensing wafer for reflecting light in an optical path of the optical imaging system.

Compared to the prior art, the optical imaging system of the present invention utilizes a curved mirror to reflect light in the optical imaging system, since the curved mirror has a larger reflection The characteristics of the field-wide light, therefore, the optical imaging system can achieve a larger field of view.

100,200‧‧‧Optical imaging system

110,210‧‧‧Sensor wafer

120,220‧‧‧Optical lenses

130,230‧‧‧ curved mirror

140,240‧‧‧Support arm

150,250‧‧‧ support

160, 260‧ ‧ aperture

1 is a schematic view of a first preferred embodiment of an optical imaging system of the present invention; and FIG. 2 is a schematic view of a second preferred embodiment of the optical imaging system of the present invention.

The following preferred embodiments will be described in detail below with reference to the accompanying drawings.

Referring to FIG. 1 , an optical imaging system 100 according to a first preferred embodiment of the present invention includes a sensing wafer 110 , at least one set of optical lenses 120 , and a curved mirror 130 . The optical lens 120 is disposed in the optical path of the sensing wafer 110 for arranging light, and the curved mirror 130 is disposed on the other side of the optical lens 120 corresponding to the sensing wafer 110 for reflection. Light in the optical path of the optical imaging system 100.

The sensing chip 110 is disposed on a support arm 140 for supporting the sensing wafer 110, which may be a camera body or an element such as a display frame. The sensing wafer 110 is used to image light rays that are irradiated on the sensing wafer 110, which may be any one of CCD or CMOS. In this embodiment, the support arm 140 is rotatably coupled to a support base 150. The angle between the support arm 140 and the support base 150 is between 60 degrees and 150 degrees.

The at least one set of optical lenses 120 is used to modulate light in the optical path through the optical imaging system 100 such that light passing through the optical lens 120 can be clearly imaged. At least one set of optical lenses 120 may be disposed on the sensing crystal through a lens barrel (not shown) On the sheet 110.

The curved mirror 130 is used to enlarge the angle of view of the optical imaging system 100. The curved mirror 130 is a convex mirror, and the reflective surface of the convex mirror may be a spherical surface or an aspheric surface. The curved mirror 130 may be disposed at an optical entrance of the lens barrel housing the optical lens 120.

In use, please refer to FIG. 1 to select three points A, B, and C on the support 150, and the light rays x, y, and z reflected by the three points are respectively projected onto the reflective surface of the curved mirror 130. And being reflected by the curved mirror 130 into the optical lens 120, the light rays x, y, z being projected onto the sensing wafer 110 after being adjusted by the optical lens 120, the curved mirror 130 Light rays that are off the optical axis of the optical lens 120 and at different angles to the optical axis are reflected into the sensing wafer 110, thereby expanding the field of view of the optical imaging system 100.

Referring to FIG. 2, an optical imaging system 200 is provided in the second preferred embodiment of the present invention. The optical imaging system 200 is similar to the optical imaging system 100, wherein corresponding reference numerals, such as 110 and 210, represent the same components. The difference is that the curved mirror 230 in the optical imaging system 200 in the embodiment is a concave mirror, and the reflective surface of the concave mirror is a spherical surface or an aspheric surface. In use, three points E, F, and G are selected on the support 250, and the light rays l, m, and n reflected by the three points are respectively projected onto the reflective surface of the curved mirror 230 and passed through the curved surface. The mirror 230 is reflected into the optical lens 220, and the light rays l, m, n are projected onto the sensing wafer 210 after being disposed by the optical lens 220, and the curved mirror 230 will deviate from the optical lens. Light rays of the optical axis of 220 and at different angles to the optical axis are reflected into the sensing wafer 210, thereby expanding the field of view of the optical imaging system 200.

It will be appreciated that the two curved mirrors 130 of the optical imaging system 100, 200 Before the 230, an aperture 160, 260 is respectively disposed to control the amount of light entering/extracting of the optical imaging systems 100, 200.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

100‧‧‧Optical imaging system

110‧‧‧Sensor wafer

120‧‧‧Optical lenses

130‧‧‧ curved mirror

140‧‧‧Support arm

150‧‧‧ support

160‧‧‧ aperture

Claims (6)

An optical imaging system comprising a sensing wafer, at least one set of optical lenses, and a curved mirror disposed in an optical path of the sensing wafer for modulating light, the curved reflection a mirror corresponding to the sensing wafer disposed on the other side of the optical lens for reflecting light in an optical path of the optical imaging system; the sensing wafer is disposed on a support arm, the support arm being rotatably connected On a support base. The optical imaging system of claim 1, wherein: the curved mirror is a convex mirror or a concave mirror. The optical imaging system of claim 1, wherein: the sensing wafer is a CCD or a CMOS. The optical imaging system of claim 1, wherein: the reflective surface of the curved mirror is spherical or aspherical. The optical imaging system of claim 1, wherein: the angle between the support arm and the support arm is between 60 degrees and 150 degrees. The optical imaging system of claim 1, wherein an aperture is disposed in front of the curved mirror of the optical imaging system for controlling the amount of light entering/extracting the optical imaging system.