【發明所屬之技術領域】· 本發明係關於一種石墨導熱片的加工方法，尤指利用 以導散晶片等電子元件所產生熱之石墨導熱片的加工方 法。 【先前技術】 石墨導熱片常利用於筆記型電腦等電子裝置中，貼附 於高熱之處理器、晶片組…等電子元件，以導散電子元件 所產生的熱。 石墨導熱片主要成份為石墨與填充物（fi 1 ler)所組 成。石墨能導熱，填充物使聱個石墨導熱片質軟易加工。 有時候，爲配合貼附晶片等電子元件，會自石墨導熱片之 上、下表面以模具壓折石墨導熱片，使石墨導熱片上、下 凹、凸成型，以能配合電子元件之外型。 請參閱圖一，圖一係習知技術壓折後石墨導熱片2之 示意圖。習知技術將石墨導熱片2壓折後，彎折處4受拉 伸的作用，使此部份之石墨密度會明顯低於平板處6之石 墨密度’因此’石墨導熱片2 折處4的熱傳導速率就 會降低，換句話說，此彎折處4會形成整個石墨導熱片2 傳熱之阻礙。 此外，請參_二，圖二係習知技術散熱組件10之示 意圖。圖二係美國專利公開號第US 2003/0116312 A1號專 利，所示圖式係於石墨導熱片2±表面嵌插上複數個散執 件14，習知技術構成-理想之散熱組件1〇，然而，散熱件 U往往娜穩m祕插於軟質的石墨導刻2巾，遇到外 力很容易就脫落而被破壞。 =此’本發明社要目的在於提供—種 加工方法，以改善上述問題。 【發明内容】 種石墨導熱片的加工方法，能 月&補強以解決彎折處石墨密度 本發明之目的在提供一 大幅提高導熱效率，並且， 變小而導熱效率變差的問題 本發明之另一目 導熱片表面。 的在使放熱件能更IIIU的嵌插於石墨 本發明係關於-種石墨導熱片的加工方法，該石墨導 …片並具有-特定輪斜型，該加工方法係包含下列步驟： 首先，合姆應之—組公、母模包夾涵切一石墨 導熱板材’以裁_石墨導熱域㈣雜定輪斜型之 石墨導熱片，其中該石墨導熱#具有-第-厚度。 接著’該組公、母模繼續愿擠裁切後之石墨導敎片， 利用設置於該組公、母模間之職，控制使該組公:母模 將該石墨導熱片自該第一厚度塵擠至預定之第二厚度，進 而使該石墨導糾之石墨密度提高，也 的導埶敎案。 ·，、、月 ，進步’於裁切出具該特定輪廓外型之石墨導熱片之 後，該加工方法進一步還包含下列步驟·· 係，以該組公、母模自該石墨導熱片之上、下表_ 折該石墨導熱片，使該石墨導熱片上、下凹、凸成型。 後續’將壓折後之石墨導熱片自該第一厚度壓擠至預 疋之第二厚度，會使該石墨導熱片彎折處之石墨密度近似 於該石墨導熱片於該第二厚度之平板處之石墨密度。 此外，於裁切出具該特定輪廓外型之石墨導熱片之 後，該加工方法還可以進一步包含下列步驟： 首先，於該石墨導熱片之上表面產生至少一第一凹陷 部。 接著，將一散熱件之底端嵌入該第一凹陷部中，其中 該散熱件之底端之側面係橫向具有至少一第二凹陷部。 後續，將該石墨導熱片自該第一厚度壓擠至預定之第 一厚度，係會使該第一凹陷部侧面部份之石墨導熱片陷入 該第二凹陷部中，使該散熱件穩gj連接於該石墨導熱片。 因此，藉由本發明利用以導散晶片等電子元件所產生 •、^石墨導熱片的加卫方法’利用公、母模間之頂模，控 制壓擠石墨導熱片至預定較薄之厚度，能大幅提高石墨密 ，而，善導熱效^並且，_此壓擠之方法，能補強以 決脊折處石墨密度變小而導熱效率變差的問題。此外， t利用此壓擠之方法’錄齡能更_的傭於石墨導 熱片表面。 關於本發明之優賴精神可以藉由以下的發明詳述及 所附圖式得到進一步的瞭解。 【實施方式】 請參閱圖三’圖三係本發明石墨導熱片30加工方法之 "表圖。本發明係、關於—種石墨導熱>i 30的加工方法，所 加工後之石墨導熱片3〇如圖四-般具有一特定輪廓外型 31如圖中之石墨導熱片30係為二層紹羯32包夾-石墨 層34以組成’實務上，可單獨僅為石墨層％ *不需任何 薄層包夾’或部份或是全部的轉32以銅賊背膠來取 代。進一步’石墨層34係由石墨與填充物（filler)所組 成，石墨提供以傳熱之功能，填充物使其質軟而易加工。 此加工方法係配合圖五之模具結構39，來進行所述加 工方法之步驟。模具結構39包含-公模40以及一母模 42 a模40側邊設有頂模41，母模42内部底面設有内托 料板44 ’母模42和内托料板44皆可設置在一個作為支撐 2底板46上，進一步，内托料板44與底板46之間尚可以 叹置如彈簧之彈性部件48(也可不設置），而石墨導熱板材 35係放置於公模40以及母模42之間。 配δ圖四、圖五以參考圖三，該加工方法係包含下列 步驟： 步驟S02 :首先’配合相對應之該組公、母模4〇、42 包夹並壓切石墨導熱板材35,以裁切石墨導熱板材35成 為特定輪廓外型31之石墨導熱片30，其中石墨導熱片30 具有一第一厚度D1。 步驟S06 :接著，該組公、母模40、42繼續壓擠裁切 後之石墨導熱片30(如圖五係進一步以公模40與内托料板 44麼擠裁切後之石墨導熱片30)，利用設置於該組公、母 模40、42間之頂模41 ’控制使該組公、母模4〇、42將石 墨導熱片30自第一厚度D1壓擠至預定之第二厚度!)2,其 中第-厚度D2小於第-厚度d卜所以壓擠後之石墨導熱 片3〇中石墨费度較南’因此’壓播後之石墨導軌片加導 熱效果較佳。 "月參閱圖六以及圖七’圖六係本發明使石墨導熱片％ 上下凹、凸成型之流程圖，圖七係本發明配合圖六模具 結構39之示意圖。石墨導熱片3〇為配合如 ^ 件之外型，須有凹、凸成型的部分55(由圖二中可見其外 觀），如習知所述，凹、凸成型的部分55所產生之彎折處 52會使石墨密度較獅，本發_六所實行之步驟係用以 克服此問顯。 依圖六係於前述步驟S〇2裁切出具特定輪廓外型31 之石墨導熱片30之後，該加工方法進—步包含下列步驟： 步驟S04 :以該組公、母模40、42自石墨導熱片3〇 之上、下表面壓折石墨導熱片30 ’使石墨導熱片3〇產生 上、下凹、凸成型的部分55。 【^丁刚返芡驟將壓折後之石墨導熱片3〇繼 、·只擠壓’使石墨導熱片30自第一厚度m壓擠至預定之第 二厚度D2。如此，不僅提高石墨密度而加快導熱效率， 使石墨導熱片30平板處54之部份石墨擠壓至彎折處52， ，使石墨導熱片3〇彎折處52之石墨密度近似於石哉 30:第二厚度D2之平板處54之石墨密度，而免除習: 技術彎折處熱傳導障礙的問題。 〃 、圖六之加工方法係配合圖七之模具結構39,來 述加工方法之步驟。如壯所示，母模42 _底部所=置 托底板46 ’係配合與公模40底部凹、凸成型。接著， 利用公模40與内托底板46以自石墨導熱片3〇之上 面壓折石墨導熱片30,使石墨導熱片3〇形成上、下凹、 凸成型的部分55。 此外’請參閱圖八以及圖九，圖八係本發明使散熱件 7〇嵌插於石墨導熱片30上之流程圖，圖九係圖八所形成 石墨導熱片30之示意圖。依圖九所示，係於石墨導熱片 =0上複數個第一凹陷部62中嵌插複數個散熱件，每個 政.’、、件70之底^嵌入第一凹陷部62中之底端之側面係橫 向具有至少-第二凹陷部64’第二凹陷部64的形狀可如 圖九A、圖九B、以及圖九c所示一般。 參閱圖八，於前述步驟S02裁切出具特定輪廊外型31 之石墨導熱片3G之後，該力uji方法還可以進—步包含下列 步驟： 步驟S03 :首先，於石墨導熱片3〇之上表面產生至少 —個第一凹陷部62。 步驟S05 :接著，將散熱件70之底端嵌入第_凹陷部 62中，其中散熱件70之底端之侧面係橫向具有至少一個 第二凹陷部64。 後續進行前述步驟S06 ’透過前述之模具結構39，自 石墨導熱片30上方對石墨導熱片30施壓，將石墨導熱片 3〇自第一厚度D1壓擠至預定之第二厚度此，除了石墨密 度因此提高之外’也會使第一凹陷部62側面部份之石墨導 熱片30受壓擠而陷入第二凹陷部64中，以使石墨導熱片 3〇牛牛連接散熱件70。·因此，除了提 使散熱件7〇穩固連接於石墨導熱片30。……'之外，更 如則述之，其材質可為金屬材質或 =也為，質，請參_十’圖== 底端嵌入第一凹陷部62中之前 列步驟： 乃次進一步包含下 、步驟S010 :配合相對應之一組公、母模BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of processing a graphite thermally conductive sheet, and more particularly to a method of processing a graphite thermally conductive sheet which is used to dissipate heat generated by an electronic component such as a wafer. [Prior Art] Graphite thermal conductive sheets are often used in electronic devices such as notebook computers, and are attached to electronic components such as high-heat processors, wafer sets, etc. to dissipate heat generated by electronic components. The main component of the graphite thermal sheet is composed of graphite and filler (fi 1 ler). Graphite can conduct heat, and the filler makes the graphite heat conductive sheet soft and easy to process. Sometimes, in order to match the electronic components such as wafers, the graphite thermal conductive sheets are folded from the upper and lower surfaces of the graphite thermal conductive sheet by a mold, so that the graphite thermal conductive sheets are formed on the upper, lower, and convex shapes to match the appearance of the electronic components. Please refer to FIG. 1. FIG. 1 is a schematic view of a graphite thermal conductive sheet 2 after a conventional technique. After the graphite heat transfer sheet 2 is folded, the bending portion 4 is stretched, so that the graphite density of this portion is significantly lower than the graphite density at the flat plate 6 so that the graphite thermal conductive sheet 2 is folded at 4 The rate of heat transfer is reduced, in other words, the bend 4 will form an obstacle to heat transfer throughout the graphite fin 2 . In addition, please refer to _2, and Fig. 2 is a schematic diagram of a conventional heat dissipating component 10. Figure 2 is a U.S. Patent Publication No. US 2003/0116312 A1, which is shown on the surface of a graphite heat-conducting sheet 2± with a plurality of loose-leaf members 14 embedded therein, and the conventional technology constitutes an ideal heat-dissipating component. However, the heat sink U tends to be inserted into the soft graphite guide engraved 2 towel, and it is easy to fall off and be destroyed when the external force is encountered. The purpose of the present invention is to provide a processing method to improve the above problems. SUMMARY OF THE INVENTION A method for processing a graphite thermal conductive sheet, which can reinforce the graphite density at a bend to solve the problem of the present invention, provides a problem of greatly improving the heat conduction efficiency, and is small, and the heat conduction efficiency is deteriorated. Another surface of the thermal sheet. The method for processing the graphite material of the present invention is to insert the graphite element into the graphite. The graphite film has a specific wheel skew type, and the processing method comprises the following steps: First,姆应之—Group of male and female molds, culvert and cut a graphite heat-conducting sheet 'to cut _ graphite heat-conducting domain (four) miscellaneous wheel-type graphite thermal conductive sheet, wherein the graphite heat conduction # has - the first thickness. Then, the group of male and female molds continue to squeeze the cut graphite guide piece, and use the position set between the male and female molds to control the group: the female mold to the graphite thermal conductive sheet from the first The thickness of the dust is squeezed to a predetermined second thickness, which in turn increases the graphite density of the graphite, which is also a guide. ·,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, The following table _ folds the graphite thermal conductive sheet to make the graphite thermal conductive sheet upper, lower, and convex. Subsequently pressing the pressed graphite thermal conductive sheet from the first thickness to the second thickness of the pre-twist, the graphite density at the bend of the graphite thermal conductive sheet is similar to the flat surface of the graphite thermal conductive sheet at the second thickness The density of the graphite. In addition, the processing method may further include the following steps after cutting the graphite heat conductive sheet having the specific contour shape: First, at least one first recess portion is formed on the upper surface of the graphite heat conductive sheet. Next, a bottom end of a heat sink is embedded in the first recess, wherein a side of the bottom end of the heat sink has at least one second recess in a lateral direction. Subsequently, the graphite heat conducting sheet is pressed from the first thickness to a predetermined first thickness, so that the graphite heat conducting sheet of the side portion of the first recessed portion is trapped in the second recessed portion, so that the heat dissipating member is stable Connected to the graphite thermal sheet. Therefore, according to the present invention, by using a method of dispersing an electronic component such as a wafer and the like, a method of reinforcing a graphite heat conductive sheet is to use a top mold between the male and female molds to control the pressed graphite thermal conductive sheet to a predetermined thickness. The graphite density is greatly improved, and the heat conduction effect is good. Moreover, the method of pressing can reinforce the problem that the graphite density becomes smaller and the heat conduction efficiency becomes worse. In addition, t uses this method of crushing to record the age of the graphite heat guide surface. The spirit of the present invention can be further understood from the following detailed description of the invention and the accompanying drawings. [Embodiment] Please refer to Fig. 3 'Fig. 3' for the processing method of the graphite thermal conductive sheet 30 of the present invention. The invention relates to a method for processing graphite heat conduction > i 30, and the processed graphite heat conductive sheet 3 has a specific contour shape as shown in FIG. 4, and the graphite heat conductive sheet 30 is a second layer. Shaolu 32 packs - graphite layer 34 to form 'practical, can only be graphite layer % alone * no need for any thin layer folder ' or part or all of the turn 32 replaced with copper thief gum. Further, the graphite layer 34 is composed of graphite and a filler, and the graphite provides a function of heat transfer, and the filler makes it soft and easy to process. This processing method is carried out in conjunction with the mold structure 39 of Fig. 5 to carry out the steps of the processing method. The mold structure 39 includes a male mold 40 and a female mold 42 a. The mold 40 is provided with a top mold 41 on the side, and the inner bottom surface of the female mold 42 is provided with an inner tray 44. The mother mold 42 and the inner tray 44 can be disposed at One is used as the support 2 bottom plate 46. Further, between the inner tray 44 and the bottom plate 46, an elastic member 48 such as a spring may be slid (or not provided), and the graphite heat conductive plate 35 is placed in the male mold 40 and the female mold. Between 42. With reference to FIG. 4 and FIG. 5 to refer to FIG. 3, the processing method includes the following steps: Step S02: First, 'matching the corresponding group of male and female molds 4〇, 42 and clamping and pressing the graphite heat conductive sheet 35 to The cut graphite heat conductive sheet 35 becomes the graphite heat conductive sheet 30 of the specific outline shape 31, wherein the graphite heat conductive sheet 30 has a first thickness D1. Step S06: Next, the group of male and female molds 40 and 42 continue to press the cut graphite thermal conductive sheet 30 (as shown in FIG. 5, further, the graphite thermal conductive sheet is cut by the male mold 40 and the inner tray 44. 30), using the top mold 41' disposed between the set of male and female molds 40, 42 to control the set of male and female molds 4, 42 to press the graphite thermal conductive sheet 30 from the first thickness D1 to a predetermined second Thickness!) 2, wherein the first-thickness D2 is smaller than the first-thickness d, so the graphite graphite in the extruded graphite heat-conducting sheet 3 has a higher graphite efficiency than the south. "Month Referring to Figure 6 and Figure 7' Figure 6 is a flow chart of the present invention for making the graphite thermal conductive sheet % concave and convex, convex drawing, and Figure 7 is a schematic view of the present invention in conjunction with the Figure 6 mold structure 39. The graphite heat-conducting sheet 3〇 has a concave and convex shaped portion 55 (the appearance of which can be seen from Fig. 2), and the curved portion is formed by the concave and convex shaped portion 55 as is conventionally known. The fold 52 will make the graphite density better than the lion. The steps taken in this issue are used to overcome this problem. After cutting the graphite thermal conductive sheet 30 having the specific contour shape 31 according to the foregoing step S2, the processing method further comprises the following steps: Step S04: using the group of male and female molds 40 and 42 from the graphite The graphite heat transfer sheet 30' is pressed over the heat transfer sheet 3'' and the lower surface to make the graphite heat transfer sheet 3's upper, lower, convexly shaped portion 55. [^ 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 In this way, not only the graphite density is increased, but also the heat conduction efficiency is accelerated, and part of the graphite at the flat plate 54 of the graphite heat conducting sheet 30 is extruded to the bending portion 52, so that the graphite density of the graphite heat conducting sheet 3 〇 bend 52 is similar to that of the sarcophagus 30. : The graphite density at the flat plate 54 of the second thickness D2, and the exemption: the problem of heat conduction barrier at the technical bend. The processing method of Fig. 6 and Fig. 6 is combined with the mold structure 39 of Fig. 7 to describe the steps of the processing method. As shown in the figure, the female mold 42_bottom=the bottom plate 46' is fitted and concavely formed at the bottom of the male mold 40. Next, the graphite heat transfer sheet 30 is pressed from the upper surface of the graphite heat transfer sheet 3 by the male mold 40 and the inner bottom plate 46, so that the graphite heat transfer sheet 3 is formed into a concave, convexly formed portion 55. Further, please refer to FIG. 8 and FIG. 9. FIG. 8 is a flow chart of the present invention for inserting the heat dissipating member 7 into the graphite thermal conductive sheet 30, and FIG. 9 is a schematic view showing the graphite thermal conductive sheet 30. According to FIG. 9 , a plurality of heat dissipating members are embedded in the plurality of first recessed portions 62 of the graphite thermal conductive sheet =0, and the bottom of each of the slabs 70 is embedded in the bottom of the first recessed portion 62. The side of the end has at least a second recess 64' in the lateral direction. The shape of the second recess 64 can be generally as shown in FIGS. 9A, 9B, and 9c. Referring to FIG. 8 , after cutting the graphite thermal conductive sheet 3G having the specific shape of the outer surface of the wheelhouse 31 in the foregoing step S02, the force uji method may further include the following steps: Step S03: First, above the graphite thermal conductive sheet 3〇 The surface produces at least one first recess 62. Step S05: Next, the bottom end of the heat sink 70 is embedded in the first recessed portion 62, wherein the side of the bottom end of the heat sink 70 has at least one second recessed portion 64 in the lateral direction. Subsequently, the foregoing step S06' is performed to press the graphite thermal conductive sheet 30 from above the graphite thermal conductive sheet 30 through the above-mentioned mold structure 39, and the graphite thermal conductive sheet 3 is pressed from the first thickness D1 to a predetermined second thickness, except for graphite. The density is thus increased, and the graphite heat conducting sheet 30 on the side portion of the first recessed portion 62 is also pressed into the second recessed portion 64 so that the graphite heat conducting sheet 3 is connected to the heat sink 70. Therefore, in addition to the heat sink 7 is firmly connected to the graphite heat conductive sheet 30. ...... 'Besides, as described above, the material can be metal or = also, quality, please refer to _ ten' figure == the bottom end is embedded in the first recess 62 before the steps: Next, step S010: matching a group of male and female models
並壓切散熱件70,其中散熱件7Q具有—第三厚戶。匕A 散熱後之 =:、:r、42 將二 部62之寬度度，其中該第四厚度係不超過第一凹陷 上述之第-凹陷部62可以為一溝槽 Γ凹陷f槽時’散熱㈣之外型係為板狀。當第一= ==熱件70之外型係為柱狀。上述的2 斤慣稱之散熱鰭片，於本案，散熱件7。的外型 並不又本賴示所限制，而各種外型皆可。 中之步Γ05散熱件70之底端嵌入第一凹陷㈣ 固的ΐ入第'γ 70之底端可以先塗佈黏著劑，以便於更穩 固的嵌入第一凹陷部62尹。 前述將石墨導熱片30壓擠之技術，除了如 刚迷各項圖式所示將石墨導熱片30整體擠壓而提高石墨 為也可以擠壓部份之石墨導熱片30，受壓擠部份 二厚ί πΊ3ί)自該第—厚度D1受壓擠至預定較薄之第 ’、他°卩份之石墨導熱片30保持於較厚之第— 厚度D1。 古較缚之第二厚度的石墨導熱片30因為石墨密度較 向’具有較高的熱導效率，較厚之第—厚度的石墨導 3〇因為石墨密度較低’具有較差的熱導效率，翻於其他 冋的應用領域中，同樣也在本發明特徵所涵蓋之範圍内。 因此’藉由本發明利用以導散晶片等電子元件所 …之石^墨導熱片30的加工方法，利用公、母模4〇、 41 ’控制麼擠石墨導熱片30至預定較薄之厚度， :同石墨密度而大幅提高導熱效率。並且，_此壓擠 == 解決彎折處52石墨密度變小而導熱效率 ，差的問.此外’也_此壓擠之方法，使散 症更穩_紐於石墨導熱片3()表面。 上健频#_辑述，騎雜更加清楚 之特徵與精神，而鱗以上述所揭露的較佳且 體貫施例來對本發明之鱗加以_。相反地，其目岐 蓋各觀變及具鱗性的鋪於本發日騎欲申請 之專利範圍的範轉内。 【圖式簡單說明】 圖-係習知技術塵折後石墨導熱片之示意圖 圖二係習知技術散熱組件之示意圖； 12 1336034 圖三係本發明石墨導熱片加工方法之流程圖； * 圖四係本發明石墨導熱片之示意圖； ’ 圖五係本發明圖三所需模具結構之橫向剖面示意圖； 圖六係本發明使石墨導熱片上、下凹、凸成型之流程 " 圖； 圖七係本發明配合圖六模具結構之示意圖； 圖八係本發明使散熱件嵌插於石墨導熱片上之流程 ® 圖； 圖九係圖八所形成石墨導熱片之不意圖； 圖九A、B、C係圖九之另外三種實施例之示意圖；以 及 圖十係本發明石墨材質散熱件製作之流成圖。 【主要元件符號說明】 散熱組件10 石墨導熱片2、30 特定輪廓外型31 鋁箔32 石墨層34 石墨導熱板材35 模具結構39 公模40 頂模41 母模42 内托料板44 底板46 彈性部件48 第一厚度D1 第二厚度D2 13 1336034 彎折處4、52 凹、凸成型之部分55 第二凹陷部64 平板處6、54 第一凹陷部62 散熱件14、70And the heat sink 70 is pressed, wherein the heat sink 7Q has a third thick household.匕A after heat dissipation =:, :r, 42 The width of the two portions 62, wherein the fourth thickness does not exceed the first recess. The first recessed portion 62 may be a trench Γ recessed f slot when 'heat dissipation (4) The external type is plate-shaped. When the first === heat member 70, the type is columnar. The above 2 kg of the heat sink fins are conventionally referred to, in this case, the heat sink 7. The appearance is not limited by the original, but all kinds of appearances are acceptable. The bottom end of the heat sink 70 is embedded in the first recess (4). The bottom end of the solid ΐ γ 70 can be coated with an adhesive to facilitate the more stable embedding of the first recess 62. The above-mentioned technique of pressing the graphite thermal conductive sheet 30, except that the graphite thermal conductive sheet 30 is integrally extruded as shown in the various drawings, and the graphite is extruded to partially press the graphite thermal conductive sheet 30, and the pressed portion is pressed. The second thickness ί Ί ί ί ί 自 自 自 自 自 自 自 自 自 自 厚度 厚度 厚度 厚度 厚度 厚度 厚度 石墨 石墨 石墨 石墨 石墨 石墨 石墨 石墨 石墨 石墨 石墨 石墨 石墨 石墨 石墨 石墨 石墨 石墨 石墨 石墨 石墨 石墨 石墨 石墨The second thickness of the graphite thermal conductive sheet 30 is more dense than the graphite having a higher thermal conductivity, and the thicker first-thickness graphite has a lower thermal density, because of the lower graphite density. It is also within the scope of the features of the invention to be applied to other fields of application. Therefore, by the method of the present invention, the graphite thermal conductive sheet 30 is controlled by the male and female molds 4, 41' to a predetermined thin thickness by using a method of processing the conductive heat conductive sheet 30 for dissipating electronic components such as wafers. : Significantly improve thermal conductivity with graphite density. And, _ this squeeze == solve the bending point 52 graphite density becomes smaller and the heat conduction efficiency, the difference between the question. In addition, 'this _ this method of compression, make the disease more stable _ New to graphite heat transfer sheet 3 () surface . The upper frequency of the ## is described, the characteristics and spirit of the ride are more clearly, and the scales are applied to the scale of the present invention in the preferred and physical embodiment disclosed above. On the contrary, it has a wide range of observations and scales that are placed in the scope of the patent application scope of this day. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 2 is a schematic view showing a conventional heat dissipating component of a graphite after being dusted by a conventional technique; 12 1336034 FIG. 3 is a flow chart of a method for processing a graphite thermal conductive sheet of the present invention; BRIEF DESCRIPTION OF THE DRAWINGS FIG. 5 is a schematic transverse cross-sectional view of a mold structure required for the third embodiment of the present invention; FIG. 6 is a flow diagram of the upper, lower concave and convex molding of the graphite thermal conductive sheet according to the present invention; The present invention cooperates with the schematic diagram of the mold structure of Fig. 6; Fig. 8 is a flow diagram of the present invention for inserting the heat sink into the graphite heat conductive sheet; Fig. 9 is a schematic diagram of the graphite thermal conductive sheet formed by Fig. 8; Fig. 9A, B, C FIG. 9 is a schematic view showing the other three embodiments of the present invention; and FIG. 10 is a flow diagram of the graphite material heat dissipating member of the present invention. [Main component symbol description] Heat dissipating component 10 Graphite thermal sheet 2, 30 Specific contour profile 31 Aluminum foil 32 Graphite layer 34 Graphite heat conduction plate 35 Mold structure 39 Male mold 40 Top mold 41 Female mold 42 Inner material plate 44 Base plate 46 Elastic parts 48 First thickness D1 Second thickness D2 13 1336034 Bending 4, 52 Concave, convexly shaped portion 55 Second recess 64 Flat plate 6, 54 First recess 62 Heat sink 14, 70