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TWI308085B - - Google Patents

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Publication number
TWI308085B
TWI308085B TW095128700A TW95128700A TWI308085B TW I308085 B TWI308085 B TW I308085B TW 095128700 A TW095128700 A TW 095128700A TW 95128700 A TW95128700 A TW 95128700A TW I308085 B TWI308085 B TW I308085B
Authority
TW
Taiwan
Prior art keywords
substrate
coating
slit nozzle
mounting portion
height
Prior art date
Application number
TW095128700A
Other languages
English (en)
Chinese (zh)
Other versions
TW200716264A (en
Inventor
Shinji Takase
Atsuo Kajima
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of TW200716264A publication Critical patent/TW200716264A/zh
Application granted granted Critical
Publication of TWI308085B publication Critical patent/TWI308085B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1015—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target
    • B05C11/1018—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target responsive to distance of target
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • H10P76/00—

Landscapes

  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW095128700A 2005-09-21 2006-08-04 A coating device and coating method TW200716264A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005273083A JP4803714B2 (ja) 2005-09-21 2005-09-21 塗布装置及び塗布方法

Publications (2)

Publication Number Publication Date
TW200716264A TW200716264A (en) 2007-05-01
TWI308085B true TWI308085B (ja) 2009-04-01

Family

ID=37953496

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095128700A TW200716264A (en) 2005-09-21 2006-08-04 A coating device and coating method

Country Status (4)

Country Link
JP (1) JP4803714B2 (ja)
KR (1) KR100739310B1 (ja)
CN (1) CN100569686C (ja)
TW (1) TW200716264A (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5416925B2 (ja) * 2008-06-24 2014-02-12 東京応化工業株式会社 塗布装置
JP5621486B2 (ja) * 2009-10-06 2014-11-12 三菱化学株式会社 シリカ系多孔質体の製造方法
JP5470474B2 (ja) * 2013-02-04 2014-04-16 東京応化工業株式会社 塗布装置
CN104138825B (zh) * 2013-05-08 2016-05-04 冠伟科技股份有限公司 点胶机定位方法
CN103771719B (zh) * 2014-01-16 2015-09-09 北京京东方光电科技有限公司 一种涂布装置
KR102641446B1 (ko) * 2017-07-19 2024-02-28 주식회사 탑 엔지니어링 디스펜싱 장치
CN109293251B (zh) * 2018-09-29 2021-06-18 芜湖中义玻璃有限公司 一种玻璃表面高效喷涂装置
JP7077994B2 (ja) * 2019-02-28 2022-05-31 株式会社豊田自動織機 塗工装置及び塗工装置の位置合わせ方法
JP7344533B2 (ja) * 2019-05-14 2023-09-14 Ａｉメカテック株式会社 塗布装置及び塗布方法
JP6775907B1 (ja) * 2019-08-08 2020-10-28 中外炉工業株式会社 塗布装置及び塗布方法
CN113083616B (zh) * 2021-04-07 2022-07-26 深圳市曼恩斯特科技股份有限公司 一种涂布挤压模头面密度外部调节装置
CN113534112B (zh) * 2021-09-16 2022-01-14 常州铭赛机器人科技股份有限公司 一种弧形透明工件激光测高校准方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06343912A (ja) * 1993-06-10 1994-12-20 Seikosha Co Ltd ディスペンサの駆動方法
JP3645586B2 (ja) * 1994-06-08 2005-05-11 大日本スクリーン製造株式会社 処理液塗布装置
JP2000167467A (ja) * 1998-12-02 2000-06-20 Sanken Electric Co Ltd ディスペンサ移動制御装置
JP3022562B1 (ja) * 1999-06-25 2000-03-21 中外炉工業株式会社 テ―ブル型ダイコ―タ
JP2003093946A (ja) 2001-09-25 2003-04-02 Shimadzu Corp 液体コーティング装置
JP2004335728A (ja) * 2003-05-07 2004-11-25 Hoya Corp 基板塗布装置及び基板塗布方法
JP2004351261A (ja) * 2003-05-27 2004-12-16 Canon Inc 塗布装置および塗布方法
JP4105613B2 (ja) * 2003-09-04 2008-06-25 大日本スクリーン製造株式会社 基板処理装置
JP4372606B2 (ja) 2004-04-16 2009-11-25 東京エレクトロン株式会社 塗布膜形成装置
JP4523442B2 (ja) 2005-02-10 2010-08-11 東京エレクトロン株式会社 塗布膜形成装置および塗布膜形成方法、コンピュータプログラム
KR101097519B1 (ko) 2005-06-25 2011-12-22 엘지디스플레이 주식회사 도포액 도포장치 및 이를 이용한 도포막의 형성방법

Also Published As

Publication number Publication date
CN1935722A (zh) 2007-03-28
KR20070033279A (ko) 2007-03-26
JP4803714B2 (ja) 2011-10-26
JP2007083131A (ja) 2007-04-05
TW200716264A (en) 2007-05-01
CN100569686C (zh) 2009-12-16
KR100739310B1 (ko) 2007-07-12

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