TWI298079B - Coatability-improvement agent for photosensitive resin composition and photosensitive resin composition containing the same - Google Patents
Coatability-improvement agent for photosensitive resin composition and photosensitive resin composition containing the same Download PDFInfo
- Publication number
- TWI298079B TWI298079B TW092132491A TW92132491A TWI298079B TW I298079 B TWI298079 B TW I298079B TW 092132491 A TW092132491 A TW 092132491A TW 92132491 A TW92132491 A TW 92132491A TW I298079 B TWI298079 B TW I298079B
- Authority
- TW
- Taiwan
- Prior art keywords
- resin composition
- photosensitive resin
- photoresist
- alkali
- substrate
- Prior art date
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- 239000011342 resin composition Substances 0.000 title claims description 44
- 238000000576 coating method Methods 0.000 claims description 27
- -1 poly(dimethyloxoxane-diphenylnonane) copolymer Polymers 0.000 claims description 21
- 239000011248 coating agent Substances 0.000 claims description 19
- 229920002120 photoresistant polymer Polymers 0.000 claims description 18
- 229920005989 resin Polymers 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 17
- 239000003795 chemical substances by application Substances 0.000 claims description 10
- 229940044949 eucalyptus oil Drugs 0.000 claims description 6
- 239000010642 eucalyptus oil Substances 0.000 claims description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 5
- 229920003986 novolac Polymers 0.000 claims description 5
- 125000000217 alkyl group Chemical group 0.000 claims description 4
- 239000003623 enhancer Substances 0.000 claims description 4
- WTQZSMDDRMKJRI-UHFFFAOYSA-N 4-diazoniophenolate Chemical group [O-]C1=CC=C([N+]#N)C=C1 WTQZSMDDRMKJRI-UHFFFAOYSA-N 0.000 claims description 3
- 125000003118 aryl group Chemical group 0.000 claims description 3
- 125000004432 carbon atom Chemical group C* 0.000 claims description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 25
- 239000010408 film Substances 0.000 description 15
- 238000000034 method Methods 0.000 description 11
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 9
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Natural products CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 5
- 239000002253 acid Substances 0.000 description 5
- 239000003921 oil Substances 0.000 description 5
- IXQGCWUGDFDQMF-UHFFFAOYSA-N 2-Ethylphenol Chemical compound CCC1=CC=CC=C1O IXQGCWUGDFDQMF-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 210000003298 dental enamel Anatomy 0.000 description 4
- 238000011161 development Methods 0.000 description 4
- 239000004922 lacquer Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 150000001299 aldehydes Chemical class 0.000 description 3
- 239000003513 alkali Substances 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 150000004820 halides Chemical class 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000004528 spin coating Methods 0.000 description 3
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 2
- OGRAOKJKVGDSFR-UHFFFAOYSA-N 2,3,5-trimethylphenol Chemical compound CC1=CC(C)=C(C)C(O)=C1 OGRAOKJKVGDSFR-UHFFFAOYSA-N 0.000 description 2
- QSZCGGBDNYTQHH-UHFFFAOYSA-N 2,3-dimethoxyphenol Chemical compound COC1=CC=CC(O)=C1OC QSZCGGBDNYTQHH-UHFFFAOYSA-N 0.000 description 2
- QWBBPBRQALCEIZ-UHFFFAOYSA-N 2,3-dimethylphenol Chemical compound CC1=CC=CC(O)=C1C QWBBPBRQALCEIZ-UHFFFAOYSA-N 0.000 description 2
- VXSCPERJHPWROZ-UHFFFAOYSA-N 2,4,5-trimethylphenol Chemical compound CC1=CC(C)=C(O)C=C1C VXSCPERJHPWROZ-UHFFFAOYSA-N 0.000 description 2
- CPEXFJVZFNYXGU-UHFFFAOYSA-N 2,4,6-trihydroxybenzophenone Chemical compound OC1=CC(O)=CC(O)=C1C(=O)C1=CC=CC=C1 CPEXFJVZFNYXGU-UHFFFAOYSA-N 0.000 description 2
- NKTOLZVEWDHZMU-UHFFFAOYSA-N 2,5-xylenol Chemical compound CC1=CC=C(C)C(O)=C1 NKTOLZVEWDHZMU-UHFFFAOYSA-N 0.000 description 2
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 2
- WJQOZHYUIDYNHM-UHFFFAOYSA-N 2-tert-Butylphenol Chemical compound CC(C)(C)C1=CC=CC=C1O WJQOZHYUIDYNHM-UHFFFAOYSA-N 0.000 description 2
- YCOXTKKNXUZSKD-UHFFFAOYSA-N 3,4-xylenol Chemical compound CC1=CC=C(O)C=C1C YCOXTKKNXUZSKD-UHFFFAOYSA-N 0.000 description 2
- XQDNFAMOIPNVES-UHFFFAOYSA-N 3,5-Dimethoxyphenol Chemical compound COC1=CC(O)=CC(OC)=C1 XQDNFAMOIPNVES-UHFFFAOYSA-N 0.000 description 2
- TUAMRELNJMMDMT-UHFFFAOYSA-N 3,5-xylenol Chemical compound CC1=CC(C)=CC(O)=C1 TUAMRELNJMMDMT-UHFFFAOYSA-N 0.000 description 2
- HMNKTRSOROOSPP-UHFFFAOYSA-N 3-Ethylphenol Chemical compound CCC1=CC=CC(O)=C1 HMNKTRSOROOSPP-UHFFFAOYSA-N 0.000 description 2
- ASHGTJPOSUFTGB-UHFFFAOYSA-N 3-methoxyphenol Chemical compound COC1=CC=CC(O)=C1 ASHGTJPOSUFTGB-UHFFFAOYSA-N 0.000 description 2
- HXDOZKJGKXYMEW-UHFFFAOYSA-N 4-ethylphenol Chemical compound CCC1=CC=C(O)C=C1 HXDOZKJGKXYMEW-UHFFFAOYSA-N 0.000 description 2
- FNYDIAAMUCQQDE-UHFFFAOYSA-N 4-methylbenzene-1,3-diol Chemical compound CC1=CC=C(O)C=C1O FNYDIAAMUCQQDE-UHFFFAOYSA-N 0.000 description 2
- IKHGUXGNUITLKF-UHFFFAOYSA-N Acetaldehyde Chemical compound CC=O IKHGUXGNUITLKF-UHFFFAOYSA-N 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- 150000001896 cresols Chemical class 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 238000003618 dip coating Methods 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N ethylene glycol monomethyl ether acetate Natural products COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- LHGVFZTZFXWLCP-UHFFFAOYSA-N guaiacol Chemical compound COC1=CC=CC=C1O LHGVFZTZFXWLCP-UHFFFAOYSA-N 0.000 description 2
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- OIPPWFOQEKKFEE-UHFFFAOYSA-N orcinol Chemical compound CC1=CC(O)=CC(O)=C1 OIPPWFOQEKKFEE-UHFFFAOYSA-N 0.000 description 2
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 2
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- SMQUZDBALVYZAC-UHFFFAOYSA-N salicylaldehyde Chemical compound OC1=CC=CC=C1C=O SMQUZDBALVYZAC-UHFFFAOYSA-N 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000010345 tape casting Methods 0.000 description 2
- 125000003944 tolyl group Chemical group 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- OKJFKPFBSPZTAH-UHFFFAOYSA-N (2,4-dihydroxyphenyl)-(4-hydroxyphenyl)methanone Chemical compound C1=CC(O)=CC=C1C(=O)C1=CC=C(O)C=C1O OKJFKPFBSPZTAH-UHFFFAOYSA-N 0.000 description 1
- ZDROXNKXVHPNBJ-UHFFFAOYSA-N (2,6-dihydroxyphenyl)-(2,3,4-trihydroxyphenyl)methanone Chemical compound OC1=C(O)C(O)=CC=C1C(=O)C1=C(O)C=CC=C1O ZDROXNKXVHPNBJ-UHFFFAOYSA-N 0.000 description 1
- HJIAMFHSAAEUKR-UHFFFAOYSA-N (2-hydroxyphenyl)-phenylmethanone Chemical class OC1=CC=CC=C1C(=O)C1=CC=CC=C1 HJIAMFHSAAEUKR-UHFFFAOYSA-N 0.000 description 1
- VGGDYBIHBNQCIF-UHFFFAOYSA-N (3,5-diethylphenyl)hydrazine Chemical compound CCC1=CC(CC)=CC(NN)=C1 VGGDYBIHBNQCIF-UHFFFAOYSA-N 0.000 description 1
- ZRDYULMDEGRWRC-UHFFFAOYSA-N (4-hydroxyphenyl)-(2,3,4-trihydroxyphenyl)methanone Chemical compound C1=CC(O)=CC=C1C(=O)C1=CC=C(O)C(O)=C1O ZRDYULMDEGRWRC-UHFFFAOYSA-N 0.000 description 1
- 150000005206 1,2-dihydroxybenzenes Chemical class 0.000 description 1
- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 description 1
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 description 1
- HTQNYBBTZSBWKL-UHFFFAOYSA-N 2,3,4-trihydroxbenzophenone Chemical compound OC1=C(O)C(O)=CC=C1C(=O)C1=CC=CC=C1 HTQNYBBTZSBWKL-UHFFFAOYSA-N 0.000 description 1
- XRUGBBIQLIVCSI-UHFFFAOYSA-N 2,3,4-trimethylphenol Chemical compound CC1=CC=C(O)C(C)=C1C XRUGBBIQLIVCSI-UHFFFAOYSA-N 0.000 description 1
- LZUXBFQRKAOYHH-UHFFFAOYSA-N 2,3,5-triethylcyclohexa-2,5-diene-1,4-dione Chemical compound C(C)C=1C(C(=C(C(C1)=O)CC)CC)=O LZUXBFQRKAOYHH-UHFFFAOYSA-N 0.000 description 1
- UMPSXRYVXUPCOS-UHFFFAOYSA-N 2,3-dichlorophenol Chemical class OC1=CC=CC(Cl)=C1Cl UMPSXRYVXUPCOS-UHFFFAOYSA-N 0.000 description 1
- RLEWTHFVGOXXTN-UHFFFAOYSA-N 2,3-diethylphenol Chemical compound CCC1=CC=CC(O)=C1CC RLEWTHFVGOXXTN-UHFFFAOYSA-N 0.000 description 1
- ZXDDPOHVAMWLBH-UHFFFAOYSA-N 2,4-Dihydroxybenzophenone Chemical compound OC1=CC(O)=CC=C1C(=O)C1=CC=CC=C1 ZXDDPOHVAMWLBH-UHFFFAOYSA-N 0.000 description 1
- KYFBKHRLIHDKPB-UHFFFAOYSA-N 2,5-Dimethoxyphenol Chemical compound COC1=CC=C(OC)C(O)=C1 KYFBKHRLIHDKPB-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- NGNBDVOYPDDBFK-UHFFFAOYSA-N 2-[2,4-di(pentan-2-yl)phenoxy]acetyl chloride Chemical compound CCCC(C)C1=CC=C(OCC(Cl)=O)C(C(C)CCC)=C1 NGNBDVOYPDDBFK-UHFFFAOYSA-N 0.000 description 1
- ISPYQTSUDJAMAB-UHFFFAOYSA-N 2-chlorophenol Chemical compound OC1=CC=CC=C1Cl ISPYQTSUDJAMAB-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- PPPFYBPQAPISCT-UHFFFAOYSA-N 2-hydroxypropyl acetate Chemical compound CC(O)COC(C)=O PPPFYBPQAPISCT-UHFFFAOYSA-N 0.000 description 1
- ZTMADXFOCUXMJE-UHFFFAOYSA-N 2-methylbenzene-1,3-diol Chemical compound CC1=C(O)C=CC=C1O ZTMADXFOCUXMJE-UHFFFAOYSA-N 0.000 description 1
- AAMHBRRZYSORSH-UHFFFAOYSA-N 2-octyloxirane Chemical compound CCCCCCCCC1CO1 AAMHBRRZYSORSH-UHFFFAOYSA-N 0.000 description 1
- QQOMQLYQAXGHSU-UHFFFAOYSA-N 236TMPh Natural products CC1=CC=C(C)C(O)=C1C QQOMQLYQAXGHSU-UHFFFAOYSA-N 0.000 description 1
- HORNXRXVQWOLPJ-UHFFFAOYSA-N 3-chlorophenol Chemical compound OC1=CC=CC(Cl)=C1 HORNXRXVQWOLPJ-UHFFFAOYSA-N 0.000 description 1
- CYEKUDPFXBLGHH-UHFFFAOYSA-N 3-tert-Butylphenol Chemical compound CC(C)(C)C1=CC=CC(O)=C1 CYEKUDPFXBLGHH-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- FNFYXIMJKWENNK-UHFFFAOYSA-N 4-[(2,4-dihydroxyphenyl)methyl]benzene-1,3-diol Chemical compound OC1=CC(O)=CC=C1CC1=CC=C(O)C=C1O FNFYXIMJKWENNK-UHFFFAOYSA-N 0.000 description 1
- YMSALPCDWZMQQG-UHFFFAOYSA-N 4-[2-(2,4-dihydroxyphenyl)propan-2-yl]benzene-1,3-diol Chemical compound C=1C=C(O)C=C(O)C=1C(C)(C)C1=CC=C(O)C=C1O YMSALPCDWZMQQG-UHFFFAOYSA-N 0.000 description 1
- WXNZTHHGJRFXKQ-UHFFFAOYSA-N 4-chlorophenol Chemical compound OC1=CC=C(Cl)C=C1 WXNZTHHGJRFXKQ-UHFFFAOYSA-N 0.000 description 1
- RGHHSNMVTDWUBI-UHFFFAOYSA-N 4-hydroxybenzaldehyde Chemical compound OC1=CC=C(C=O)C=C1 RGHHSNMVTDWUBI-UHFFFAOYSA-N 0.000 description 1
- ZBCATMYQYDCTIZ-UHFFFAOYSA-N 4-methylcatechol Chemical compound CC1=CC=C(O)C(O)=C1 ZBCATMYQYDCTIZ-UHFFFAOYSA-N 0.000 description 1
- QHPQWRBYOIRBIT-UHFFFAOYSA-N 4-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C=C1 QHPQWRBYOIRBIT-UHFFFAOYSA-N 0.000 description 1
- NYUABOGYMWADSF-UHFFFAOYSA-N 5-methylbenzene-1,2,3-triol Chemical compound CC1=CC(O)=C(O)C(O)=C1 NYUABOGYMWADSF-UHFFFAOYSA-N 0.000 description 1
- LPEKGGXMPWTOCB-UHFFFAOYSA-N 8beta-(2,3-epoxy-2-methylbutyryloxy)-14-acetoxytithifolin Natural products COC(=O)C(C)O LPEKGGXMPWTOCB-UHFFFAOYSA-N 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- HCVBQXINVUFVCE-UHFFFAOYSA-N Citronensaeure-beta-methylester Natural products COC(=O)C(O)(CC(O)=O)CC(O)=O HCVBQXINVUFVCE-UHFFFAOYSA-N 0.000 description 1
- FGUOEYGYAYQFNE-UHFFFAOYSA-N ClC1=C(C=CC=C1)O.NN Chemical compound ClC1=C(C=CC=C1)O.NN FGUOEYGYAYQFNE-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- 241000237502 Ostreidae Species 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- 241000237503 Pectinidae Species 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 150000003973 alkyl amines Chemical class 0.000 description 1
- 150000001346 alkyl aryl ethers Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 150000008109 benzenetriols Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
- 238000005660 chlorination reaction Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- DIOQZVSQGTUSAI-NJFSPNSNSA-N decane Chemical compound CCCCCCCCC[14CH3] DIOQZVSQGTUSAI-NJFSPNSNSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- ODQWQRRAPPTVAG-GZTJUZNOSA-N doxepin Chemical compound C1OC2=CC=CC=C2C(=C/CCN(C)C)/C2=CC=CC=C21 ODQWQRRAPPTVAG-GZTJUZNOSA-N 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 229940116333 ethyl lactate Drugs 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 229910000449 hafnium oxide Inorganic materials 0.000 description 1
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 239000012216 imaging agent Substances 0.000 description 1
- 150000003903 lactic acid esters Chemical class 0.000 description 1
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 1
- FDZZZRQASAIRJF-UHFFFAOYSA-M malachite green Chemical compound [Cl-].C1=CC(N(C)C)=CC=C1C(C=1C=CC=CC=1)=C1C=CC(=[N+](C)C)C=C1 FDZZZRQASAIRJF-UHFFFAOYSA-M 0.000 description 1
- 229940107698 malachite green Drugs 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910001463 metal phosphate Inorganic materials 0.000 description 1
- OJURWUUOVGOHJZ-UHFFFAOYSA-N methyl 2-[(2-acetyloxyphenyl)methyl-[2-[(2-acetyloxyphenyl)methyl-(2-methoxy-2-oxoethyl)amino]ethyl]amino]acetate Chemical compound C=1C=CC=C(OC(C)=O)C=1CN(CC(=O)OC)CCN(CC(=O)OC)CC1=CC=CC=C1OC(C)=O OJURWUUOVGOHJZ-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 229940057867 methyl lactate Drugs 0.000 description 1
- JFTBTTPUYRGXDG-UHFFFAOYSA-N methyl violet Chemical compound Cl.C1=CC(=NC)C=CC1=C(C=1C=CC(=CC=1)N(C)C)C1=CC=C(N(C)C)C=C1 JFTBTTPUYRGXDG-UHFFFAOYSA-N 0.000 description 1
- DIOQZVSQGTUSAI-UHFFFAOYSA-N n-butylhexane Natural products CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 1
- HZVGIXIRNANSHU-UHFFFAOYSA-N naphthalene-1,2,3,4-tetrone Chemical compound C1=CC=C2C(=O)C(=O)C(=O)C(=O)C2=C1 HZVGIXIRNANSHU-UHFFFAOYSA-N 0.000 description 1
- 150000004780 naphthols Chemical class 0.000 description 1
- 239000012788 optical film Substances 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 150000002923 oximes Chemical class 0.000 description 1
- 235000020636 oyster Nutrition 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920001483 poly(ethyl methacrylate) polymer Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- QMYDVDBERNLWKB-UHFFFAOYSA-N propane-1,2-diol;hydrate Chemical compound O.CC(O)CO QMYDVDBERNLWKB-UHFFFAOYSA-N 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- NEJUDBOAMQMLPZ-UHFFFAOYSA-N ruthenium(2+) diazide Chemical compound [Ru](N=[N+]=[N-])N=[N+]=[N-] NEJUDBOAMQMLPZ-UHFFFAOYSA-N 0.000 description 1
- 235000015067 sauces Nutrition 0.000 description 1
- 235000020637 scallop Nutrition 0.000 description 1
- 230000001235 sensitizing effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 210000002784 stomach Anatomy 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 1
- KAKZBPTYRLMSJV-UHFFFAOYSA-N vinyl-ethylene Natural products C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 150000003739 xylenols Chemical class 0.000 description 1
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
- Paints Or Removers (AREA)
- Silicon Polymers (AREA)
Description
1298079 玖、發明說明: 【發明所屬之技術領域】 本發明係有關一種感光性樹脂組成物塗布性提昇劑及 含有該感光性樹脂組成物塗布性提昇劑之感光性樹脂組成 物,更具體而言係有關在製造平面•板·顯示器(FDP)等所 使用的大型基板上塗覆由鹼可溶性樹脂及感光劑所成感光 性樹脂組成物時,可解決因微小膜厚差產生光阻膜之鱗狀 斑,及可降低基板端部之光阻膜的隆起情形之感光性樹脂 組成物塗布性提昇劑及含有它之感光性樹脂組成物。 【先前技術】 於製造半導體積體電路元件、濾色器、液晶顯示元件 等技術中,以往爲進行微細加工時使用微影術,近年來進 行開發可以半微米或四分之一微米埃之微細加工技術。該 微影術技術中,係在基板上視其所需形成防止反射膜後, 塗覆正型或負型感光性樹脂組成物,進行加熱處理(預烘 烤)、形成光阻膜。 然後,該光阻膜藉由紫外線、遠紫外線、電子束、X 光線等各種放射線圖樣曝光後予以顯像,形成光阻圖樣。 感光性樹脂組成物之塗覆方法有旋轉塗覆法、輕塗覆法、 刀背塗覆法、流延塗覆法、刮刀塗覆法、浸漬塗覆法等各 種方法,係爲已知。例如於製造半導體積體電路元件中, 光阻劑原料爲正型感光性樹脂組成物時大多採用旋轉塗覆 法作爲塗覆方法。另外,於製造液晶顯示元件等之F D P中 多年 大近 料’ 材外 劑另 阻 光 使 之 爲 〇 物Μ 成尺 組用 旨使 nfl 樹, 性中 光造 感製 型 P 正 用
D
Xmm 1298079 1 2 5 0 m m等之大型基板,故要求更高精細化。自古以來,特 別是在大型基板上塗覆感光性樹脂組成物時,會有因塗覆 面之微小膜厚差、在塗膜上產生鱗狀斑(鱗斑)的問題,此 係產生光阻圖樣之線寬不齊性原因,結果在顯示器上會有 顯示斑的問題。直至目前,爲解決該鱗斑時,試行改良者(例 如參照專利文獻1、2)雖可解決鱗斑,惟於塗覆時基板端部 產生隆起(波紋)之另一問題,故目前企求改良塗覆性。 【專利文獻1】
日本特開平5 - 1 8 1 266號公報(1,2,8,10頁) 【專利文獻2】 曰本特開平9 - 5 9 8 8號公報(1,2,6頁) 【發明內容】
本發明之目的係爲解決如上述習知問題時的添加劑及 含它之具優異塗覆性的感光性樹脂組成物,具體而言在大 型基板上塗覆時,不易產生鱗斑,及同時可降低塗覆時基 板端部產生波紋情形之感光性樹脂組成物塗布性提昇劑及 含有它之感光性樹脂組成物。 本發明人等再三檢討深入硏究的結果,發現以往不容 易同時解決光阻劑塗覆時在基板上產生的鱗斑與基板端部 形成波紋的問題,藉由在感光性樹脂組成物中含有下述通 式(1)所示特定矽油,可同時解決鱗斑與波紋形成的問題, 遂而完成本發明。 換言之,本發明係有關一種感光性樹脂組成物塗布性 提昇劑,其特徵爲由下述通式(1)所示聚(二甲基矽氧烷-二 苯基矽氧烷)共聚物矽油(以下稱爲「甲基苯基矽油」)所成。 1298079
Si— Rc I Re
(其中’ R】、R2、R3、R4、^及R6係各表示獨立的氫原 子、羥基、碳數1〜4之烷基、或芳基,m係表示1〜40、η 係表示1〜40之整數)
另外,本發明係有關一種含有鹼可溶性樹脂及感光劑 之感光性樹脂組成物,其特徵爲含有上述通式(1)所示甲基 苯基矽氧烷矽油。 於下述中更詳細說明本發明。
本發明由甲基苯基矽油所成的感光性樹脂組成物塗布 性提昇劑,只要是上述通式(1)所示者即可,沒有特別的限 制。其中,碳數1〜4之烷基以甲基較佳,芳基以苯基較佳。 此等通式(1)所示甲基苯基矽油可藉由習知製法製造,市售 品例如信越化學工業(股)製矽油KF-5 3。本發明之由甲基苯 基矽油所成感光性樹脂組成物塗覆性提昇劑可降低感光性 樹脂組成物之表面張力,改善與矽等基板之濕潤性。 本發明感光性樹脂組成物塗布性提昇劑之添加量’通 常對感光性樹脂組成物之全部固體成分而言爲5 0〜 5,000ppm、較佳者爲2,000〜4,000ppm。若感光性樹脂組成 物塗覆性提昇劑之添加量小於5 Oppm時無法發揮塗覆性提 昇效果,而若大於5,000ppm時會引起因矽油之塗覆缺陷、 及產生波紋寬度大增的問題。 1298079 本發明感光性樹脂組成物之鹼可溶性樹脂例如酚醛淸 漆樹脂、具有苯酚性羥基之乙烯基聚合物、具有羧基之乙 烯基聚合物,以酚醛淸漆樹脂較佳。鹼可溶性酚醛淸漆樹 脂爲藉由至少一種苯酚類與甲醛等醛類聚縮合所得的酚醛 型苯酚樹脂。 製造該鹼可溶性酚醛淸漆樹脂時使用的苯酚類例如有 0-甲酚、p-甲酚及m-甲酚等之甲酚類;3,5 -二甲苯酚、2,5-二甲苯酚、2,3-二甲苯酚、3,4-二甲苯酚等之二甲苯酚類;
2.3.4- 三甲基苯酚、2,3,5-三甲基苯酚、2,4,5-三甲基苯酚、
3.4.5- 三甲基苯酚等之三甲基苯酚類;2-t-丁基苯酚、3-t-丁基苯酚、4-t-丁基苯酚等之t-丁基苯酚類;2-甲氧基苯 酚、3 -甲氧基苯酚、4 -甲氧基苯酚、2,3 -二甲氧基苯酚、2,5-二甲基氧基苯酚、3,5 -二甲氧基苯酚等之甲氧基苯酚類;2-乙基苯酚、3-乙基苯酚、4-乙基苯酚、2,3-二乙基苯酚、3,5-二乙基苯酣、2,3,5·三乙基苯酣、3,4,5 -三乙基苯酣等之乙 基苯酚類;〇 ·氯苯酚、m -氯苯酚、p -氯苯酚、2,3 -二氯苯酚 等之氯苯酚類;間苯二酚、2-甲基間苯二酚、4-甲基間苯 二酚、5 -甲基間苯二酚等之間苯二酚類;5 -甲基兒茶酚等 之兒茶酚類;5 -甲基苯三酚等之苯三酚類;雙酚a、b、C、 D、E、F等之雙酚類;2,6-二羥甲基甲酚等之羥甲基化 甲酚類;α -萘酚、β -萘酚等之萘酚類等。此等可以單獨使 $或數種之混合物使用。 此外,醛類除甲醛外,例如水楊醛、對甲醛、乙醛、 苯甲醛、羥基苯甲醛、氯化乙醛等,此等可以單獨使用或 數種混合物使用。 1298079 鹼可溶性酚醛淸漆樹脂可以爲分別除去低分子量成分 者’亦可以爲沒有分別除去低分子量成分者。分別除去酉分 酉签淸漆樹脂之低分子量成分的方法,例如在2種具有不同 溶解性之溶劑中分別酚醛淸漆樹脂之液-液分別法、或藉由 離心分離除去低分子成分的方法等。
而且,感光劑例如含有醌二疊氮基之感光劑爲典型 者。含醌二疊氮基之感光劑可使用習知醌二疊氮基-酚醛淸 漆樹脂系光阻劑所使用的習知感光劑中任何一種。該感光 劑以藉由萘醌二疊氮磺酸氯化物或苯并醌二疊氮基磺酸氯 化物等之醒二疊氮基磺酸鹵化物、及具有可與此等酸鹵化 物縮合反應的官能基之低分子化合物或高分子化合物反應 所得的化合物較佳。此處可與酸鹵化物縮合的官能基例如 羥基、胺基等,以羥基較佳。含有可與酸鹵化物縮合的羥 基之化合物例如氫醌、間苯二册、2,4-二羥基二苯甲酮、 2,3,4-三羥基二苯甲酮、2,4,6-三羥基二苯甲酮、2,4,4’-三 羥基二苯甲酮、2,3,4,4’-四羥基二苯甲酮、2,25,4,4’-四羥 基二苯甲酮、2,2’,3,4,6’-五羥基二苯甲酮等之羥基二苯甲 酮類、雙(2,4-二羥基苯基)甲烷、雙(2,3,4-三羥基苯基)甲 烷、雙(2,4-二羥基苯基)丙烷等之羥基苯基鏈烷類、4,4 5, 3 ”,4 ” -四羥基-3,5,3,,5 5 -四甲基三苯基甲烷、4,4,,2 ”, 3 ”,4,,-五羥基-3,5,3,,5,-四甲基三苯基甲烷等之羥基三苯 基甲烷類。此等可單獨使用或2種以上組合使用。含醌二 疊氮基之感光劑的配合量對1 〇〇重量份鹼可溶性樹脂而言 通常爲5〜50重量份、較佳者爲10〜40重量份。 本發明感光性樹脂組成物之溶劑例如乙二醇單甲醚、 -10- 1298079 一醉卓乙醚等之乙二醇單烷醚類、乙二醇單甲醚乙酸 酉曰、乙二醇單乙醚乙酸酯等之乙二醇單烷醚乙酸酯類、丙 一^單甲酸、丙二醇單乙醚等之丙二醇單烷醚類、丙二醇 早甲s迷乙酸醋、丙二醇單乙醚乙酸酯等之丙二醇單烷醚乙 酸酉曰類、乳酸甲酯、乳酸乙酯等之乳酸酯類、甲苯、二甲 本等之芳香族烴類、甲基乙酮、2-庚酮、環己酮等之酮類、 Μ ’ N-一甲基乙醯胺、N_甲基吡咯烷酮等之醯胺類、卜丁內 酉曰胃之內酯類等。此等溶劑可以單獨使用或2種以上混合 使用。 &本:¾明2感光性樹脂組成物中視其所需可配合染 料、黏合助劑等。染料例如甲基紫、結晶紫、孔雀綠等。 黏合助劑例如烷基咪唑啉、丁酸、烷基酸、聚羥基苯乙烯、 聚乙燦基甲醚、N 丁基酚醛淸漆樹脂、環氧基矽烷、環氧 基聚合物、矽烷等。 #發明之感光性樹脂組成物係使上述鹼可溶性樹脂、 胃1齊!1、甲基苯基矽氧烷矽油及視其所需其他添加劑以所 f »溶劑溶解,視其所需以過濾器過濾製造。如此所製造 白勺感光性樹脂組成物可塗覆於爲製造半導體積體電路元. 件、濾色器、液晶顯示元件等之FPD等基板上。塗覆本發 明感光性樹脂組成物之基板例如玻璃基板、矽基板等任意 基板,其尺寸可以爲任意尺寸。而且,此等基板可以爲形 成鉻膜、氧化矽膜等之被膜。感光性樹脂組成物塗覆於基 板可以藉由旋轉塗覆法、輥塗覆法、刀背塗覆法、流延塗 覆法、刮刀塗覆法、浸漬塗覆法等習知任何一種方法。感 光性樹脂組成物塗覆於基板後予以預烘烤,形成光阻膜。 1298079 〜後,使光阻腠藉由習知或周知的方法曝光、顯像,可形 成沒有線寬度不齊性、且形狀良好的光阻圖樣。 上述顯像時使用的顯像劑可使用習知感光性樹脂組成 物於顯像時使用的任意顯像劑。較佳的顯像劑例如氫氧化 四k錢、膽驗、鹼金屬氫氧化物、鹼金屬甲基矽酸鹽(水合 物)、驗金屬磷酸鹽(水合物)、銨水、烷胺、烷醇胺、雜環 式胺等之驗性化合物水溶液的鹼顯像液,較佳的鹼顯像液 爲氮氧化四甲錢水溶液。此等顯像液視其所需可另含有甲 醇、乙醇等之水溶性有機溶劑、或界面活性劑。藉由鹼顯 φ 像液進行顯像後,通常予以水洗。 【實施方式】 實施例 於下述中藉由實施例更具體地說明本發明,惟本發明 之形態不受此等實施例所限制。 實施例1
使對1 00重量份重量平均分子量以聚苯乙烯換算 1 5,000之酚醛淸漆樹脂而言25重量份2,3,4,4,-四羥基二苯 甲酮與1,2 -萘醌二疊氮基-5 -磺醯基氯化物之酯化物溶解於 丙二醇單甲醚乙酸酯中,且對全部固體成分而言添加 2,00(^?111〇-53(信越化學工業(股)製)予以攪拌後,以〇.24111 過濾器過濾,調製本發明之感光性樹脂組成物。使該組成 物在尺寸爲3 6 0 m m X 4 6 5 m m附鉻之玻璃基板上回轉塗覆, 在1 0 0 °C下、於熱板上烘烤9 0秒後,製得1 . 5 μ m光阻膜。 藉由目視觀察該光阻膜,以下述評估基準進行鱗斑之評 估。而且,藉由光學式膜厚測定機(那羅梅頓里谷斯(譯音) >12- 1298079 •曰本(股)製那羅史貝克(譯音)M65 00)自基板端部以 之刻度測定膜厚,進行測定基板端部之隆起寬度。結果如 下述表1所示。而且,於表1中波紋寬度係表示在基板端 部產生的波紋寬度。 (鱗斑之評估)
◎:沒有鱗斑 〇:有部分鱗斑 x :有很多鱗斑 實施例2 除使KF-53之添加量以3,000ppm取代2,000PPm外, 與實施例1相同地可得表1之結果。 比較例1 除添加氟系界面活性劑之FC-43 0(住友史里耶姆(譯音) 公司製)取代KF-53外,與實施例1相同地進行,可得表1 之結果。 比較例2
除添加聚矽氧烷水平劑之KP3 23 (信越化學工業(股)製) 取代KF-53外,與實施例1相同地進行,可得表1之結果。 比較例3 除沒有添加KF-53外’與實施例1相同地進行,可得 表1之結果。 1298079 表1 鱗斑 波紋寬度(mm) 實 施 例 1 ◎ 7.0 實 施 例 2 ◎ 7.5 比 較 例 1 X 4.0 比 較 例 2 〇 15.5 比 較 例 3 X 4.0
由表1可知,藉由添加本發明之塗布性提昇劑,可解 決基板上產生的鱗斑,同時可降低基板端部之隆起寬度。 【發明效果】 如上所述,本發明使用甲基苯基矽氧烷矽油作爲感光 性樹脂組成物塗布性提昇劑,藉由在感光性樹脂組成物中 添加該物,可製得沒有鱗斑、改善基板端部之波紋寬度等 具有優異塗覆性之感光性樹脂組成物。結果’特別是藉由 使用本發明感光性樹脂組成物製造FDP等’可製得沒有顯 示斑之製品,可得極爲優異的效果。
【圖示簡單說明】:無 -14-
Claims (1)
- 第92 1 3249 1號「感光性樹脂組成物塗布性提昇劑及含有它之 感光性樹脂組成物」專利案 (2008年1月22日修正) 六、申請專利範圍: 1 . 一種光阻用感光性樹脂組成物塗布性提昇劑,其特徵爲 由下述通式(1)所示聚(二甲基矽氧烷-二苯基矽氧烷)共 聚物矽油所成,一一(1)(其中,Ri、R2、R3、R4、R5及係各表示獨立的氫原子、 羥基、碳數1〜4之烷基、或芳基,m係表示1〜40、η 係表示1〜40之整數)。 2. —種光阻用感光性樹脂組成物,其係於含有鹼可溶性樹 脂及感光劑之光阻用感光性樹脂組成物中,其特徵爲光 阻用感光性樹脂組成物含有如申請專利範圍第1項之通 φ 式(1)所示聚(二甲基矽氧烷-二苯基矽氧烷)共聚物矽油 所成。 3.如申請專利範圍第2項之光阻用感光性樹脂組成物,其 中鹼可溶性樹脂爲酚醛清漆樹脂,感光劑爲含有醌二疊 氮基之化合物。
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| JP2002341331A JP3844236B2 (ja) | 2002-11-25 | 2002-11-25 | 感光性樹脂組成物塗布性向上剤を含有する感光性樹脂組成物 |
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| US (1) | US20060052498A1 (zh) |
| EP (1) | EP1598700A1 (zh) |
| JP (1) | JP3844236B2 (zh) |
| KR (1) | KR100945386B1 (zh) |
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| KR101428718B1 (ko) | 2007-02-02 | 2014-09-24 | 삼성디스플레이 주식회사 | 감광성 유기물, 이의 도포 방법, 이를 이용한 유기막 패턴형성 방법, 이로써 제조되는 표시 장치 |
| CN101215381B (zh) * | 2008-01-14 | 2011-02-16 | 杭州师范大学 | 一种甲基苯基含氢硅油的制备方法 |
| KR101418026B1 (ko) * | 2014-02-06 | 2014-08-08 | 동우 화인켐 주식회사 | 열경화성 잉크 조성물 |
| US9972271B2 (en) * | 2016-05-12 | 2018-05-15 | Novatek Microelectronics Corp. | Display panel |
| KR102752172B1 (ko) | 2019-10-11 | 2025-01-10 | 주식회사 동진쎄미켐 | 포지티브형 감광성 수지 조성물, 및 이를 이용한 디스플레이 소자 |
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| JPS62170392A (ja) * | 1986-01-24 | 1987-07-27 | Riso Kagaku Corp | 感熱性孔版原紙 |
| JP2978206B2 (ja) * | 1990-04-28 | 1999-11-15 | 東レ・ダウコーニング・シリコーン株式会社 | ジフェニルシロキサン・ジメチルシロキサン共重合体の製造方法 |
| US5320923A (en) * | 1993-01-28 | 1994-06-14 | Hewlett-Packard Company | Reusable, positive-charging organic photoconductor containing phthalocyanine pigment, hydroxy binder and silicon stabilizer |
| JPH07281018A (ja) * | 1994-04-06 | 1995-10-27 | Sumitomo Chem Co Ltd | ポジ型レジスト組成物 |
| US5604039A (en) * | 1996-01-22 | 1997-02-18 | Eastman Kodak Company | Thermally stable release agents |
| TW505521B (en) * | 1997-06-25 | 2002-10-11 | Kao Corp | Hair cosmetics |
| GB9722862D0 (en) * | 1997-10-29 | 1997-12-24 | Horsell Graphic Ind Ltd | Pattern formation |
| JP2000003047A (ja) * | 1998-06-17 | 2000-01-07 | Nippon Paint Co Ltd | 感光性樹脂組成物およびそれを用いるパターン形成方法 |
| EP1087260A4 (en) * | 1999-02-15 | 2002-01-16 | Clariant Finance Bvi Ltd | PHOTO SENSITIVE RESIN COMPOSITION |
| JP3357014B2 (ja) * | 1999-07-23 | 2002-12-16 | 大日本印刷株式会社 | 光硬化性樹脂組成物及び凹凸パターンの形成方法 |
| JP2001064356A (ja) * | 1999-08-30 | 2001-03-13 | Takeda Chem Ind Ltd | 感光性樹脂およびそれを用いたレジストインキ組成物 |
| JP2001166128A (ja) | 1999-09-30 | 2001-06-22 | Toray Ind Inc | カラーフィルター用硬化性樹脂溶液組成物、透明保護膜、カラーフィルターおよび液晶表示装置 |
| US6300025B1 (en) * | 2000-06-01 | 2001-10-09 | Lexmark International, Inc. | Photoconductors with polysiloxane and polyvinylbutyral blends |
| JP2003131371A (ja) * | 2001-10-24 | 2003-05-09 | Kanegafuchi Chem Ind Co Ltd | 難燃性の感光性ドライフィルムレジスト |
| KR100518533B1 (ko) * | 2002-06-14 | 2005-10-04 | 삼성전자주식회사 | 에폭시 링을 포함하는 베이스 폴리머와 실리콘 함유가교제로 이루어지는 네가티브형 레지스트 조성물 및 이를이용한 반도체 소자의 패턴 형성 방법 |
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- 2003-11-14 WO PCT/JP2003/014506 patent/WO2004049066A1/ja not_active Ceased
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| WO2004049066A1 (ja) | 2004-06-10 |
| TW200502693A (en) | 2005-01-16 |
| JP3844236B2 (ja) | 2006-11-08 |
| JP2004177513A (ja) | 2004-06-24 |
| CN100547486C (zh) | 2009-10-07 |
| US20060052498A1 (en) | 2006-03-09 |
| KR20050085055A (ko) | 2005-08-29 |
| CN1714315A (zh) | 2005-12-28 |
| EP1598700A1 (en) | 2005-11-23 |
| KR100945386B1 (ko) | 2010-03-05 |
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