1289032 九、發明說明： 【發明所屬之技術領域】 本發明係運用於電路板之回收製程，特別是可針對 具有特殊造型之電路板進行快速切割與接合，以達到回收 良品電路板之目的者。 【先前技術】 業界常見的電路基板（panel)中係内含有數個電路 板，若在電路基板製程中測得内含之電路板有不良品時， 則將該電路基板報廢，造成該電路基板上其他良品電路板 的浪費，同時為補回報廢電路基板的數量， 電路基板以達到目標產量。為了不造成浪費 產電路基板所須之時間與成本，目前已有不少相關的發明 案件被揭露，例如中華民國發明專利公告號第44繼號 之電路板之製造方法」中，揭露一種電路板之製造方法， 該方法包括：（a)係於_大面積的基板上同㈣作有複數 個同型的子電路板，並以成形沖模沖出子電路板的外形， 或以CNC榜床撥出子電路板的外形，^使該子電路板與基 板之間環接有複數個連接片；（b)將上述之基板的各個子 電路板經過電路測試；（c)若在基板上有—子電路板損 杈、則以切斷模組將損壞的子電路板與基板之間的連接 片冲斷以將知壞的子電路板取下，使該基板留下一樣 孔’⑷再以一精修模組沖修連接片；（e)另以-剪邊模组 在一備用的基板沖下修補用的良品子電路板；⑴再將修 補用的良口口子電路板以一製具將其引導至基板的樣孔 1289032 内’使該修_的良品子電路板得定位在樣孔内，以將其 黏接固疋在基板的樣孔内，俾得以更換修復損壞的基板。 但由於現今電子化的普及’使得電子產品變得更為 多樣化’也因此，電子產品的重要核心裝置―電路板，將 依照電子產品的型態而製作成各式各樣的形狀，例如圓 形、多邊形、拋物線形、流線形等，更甚有許多不規則形 狀，造成業者在製造時的困難，因此在電路基板上具特殊 造形之電路板更較以往容易出現不良品的情況，進而使得 此類電路板需再進行回收製程的貨流量大增。 然而正因此類f路板的造形特殊，更加提高電路板 回收的困難度，並致使業者無法輕易利用如上述「電路板 之製造方法」的一般正規電路板回收方法。這是因為電路 板容置於電路基板内時，是藉由數個連接片與電路基板相 接，而在電路板快速回收方法中，無論是將此類電路板由 電路基板取出，或是將此類電路板置回電路基板内，都需 要先對不規則分佈之複數個連接片進行切割或粘合。 因此，當電路板的造型愈是特殊，其連接片的分佈 愈是難以用一般製程機台藉由精確的定位進行電路板的 取出與置回粘合，如此不僅容易造成回收製程上的失誤， 更會在製程機台精準尋找多個分散的連接片中浪費許多 時間。若是因電路板的造型特殊，使得業者因考量回收製 私所耗費的日守間與成本而不願進行回收時，將再次產生此 類電路板產品不良即丟棄的現象，如此不僅浪費資源，更 會造成許多廢品丟棄上的垃圾問題，造成社會上的一大負 擔。 習知技術中相關於電路板快速回收方法係僅針對具 1289032 有規則形狀之電路板，對於現今特殊形狀電路板之回收製 程卻可能無法提供全面而完整解決方案。因此，提供一種 完善的電路板快速回收方法已具有極為迫切需求。 【發明内容】 本發明之主要目的係在於提供一種電路板快速回收 方法’無論是具有一般如方形態樣之規則形狀或是如圓 形、多邊形、拋物線形、流線形等特殊形狀之電路板，皆 可利用本發明之電路板快速回收方法以快速地由電路基 板取出電路板並將電路板置回電路基板内。 本發明之次要目的係在於利用本發明之電路板快速 回收方法，以避免大量良品電路板因無法回收而廢棄，進 而即省重新生產電路板所需之時間與成本，並能有效達到 貝源回收的效果，藉以提昇整體產業競爭力。 本發明之另一目的係在於運用一電路板方塊卡合裁 刀方去’使電路基板與電路板方塊增加對位接合上之方便 14並提局電路板方塊與電路基板接合時之契密度。 #本發明係有關於一種電路板快速回收方法，首先將 第電路基板内之一不良品電路板方塊切下，以形成一 缺魏處，其巾，該不良品電路板方塊係包含有-不良品電 路板、與該不良品電路板相連接之複數個連接>}及部份第 電路基板，再來將_第二電路基板内之—良品電路板方 7 1289032 塊切下，其中，該良品電路板方塊之形狀係與該第一電路 基板之該缺塊處形狀相似，且該良品電路板方塊係包含有 一良品電路板、與該良品電路板相連接之複數個連接片及 ” 部份第二電路基板，最後將該良品電路板方塊置回並接合 - 於該第一電路基板之該缺塊處，使該第一電路基板成為全 為良品電路板之一完整第一電路基板。 此外’本發明亦提供一種電路板方塊卡合裁切方 法，係於一電路基板上運用卡合裁切方式以切割一第三電 路板方塊，使得該第三電路板方塊具有一公卡合結構，且 讓該電路基板具有與該公卡合結構相對應之一母卡合結 構，其中，該第二電路板方塊係包含有一第三電路板、與 該第三電路板相連接之複數個連接片及部份電路基板。 爲使熟悉該項技藝人士暸解本發明之目的、特徵及 功效，茲藉由下述具體實施例，並配合所附之圖式，對本 發明詳加說明如後： 【實施方式】 請參閱第1圖及第2圖，第1圖係為本發明一較佳 實施例之流程圖’第2圖係為本發明一較佳實施例之立體 示意圖一。本發明係有關於一種電路板快速回收方法，首 先尋找一第一電路基板1上之複數第一定位孔10，接著 藉由該第一定位孔10以提供一切割裝置（圖中未示）之定 位模組進行定位搜尋，其中，該切割裝置係可搭配一精密 操控系統（圖中未示）’如CNC系統（Computer Numerical Control)，並可配置至少一個攝影鏡頭（圖中未示），該攝 81289032 IX. Description of the Invention: [Technical Field] The present invention is applied to a recycling process of a circuit board, and particularly, can be quickly cut and joined for a circuit board having a special shape to achieve the purpose of recycling a good circuit board. [Prior Art] A circuit board commonly used in the industry contains a plurality of circuit boards. If the circuit board included in the circuit substrate process has a defective product, the circuit substrate is scrapped, resulting in the circuit substrate. The waste of other good boards, while replenishing the number of waste circuit boards, the circuit board to achieve the target output. In order not to waste the time and cost of producing circuit boards, many related invention cases have been disclosed, such as the manufacturing method of the circuit board of the Republic of China Invention Patent No. 44, which discloses a circuit board. The manufacturing method comprises the following steps: (a) laying on a large-area substrate and (4) making a plurality of sub-circuit boards of the same type, and punching out the shape of the sub-board by a forming die, or dialing out on a CNC list. The shape of the sub-board, such that a plurality of connecting pieces are connected between the sub-board and the substrate; (b) the sub-boards of the substrate are subjected to circuit testing; (c) if there is a sub-substrate on the substrate If the circuit board is damaged, the connection module between the damaged sub-board and the substrate is broken by the cutting module to remove the bad sub-board, so that the substrate leaves the same hole '(4) and then refined The module is used to repair the connecting piece; (e) the trimming module is used to punch the repaired good sub-board in a spare substrate; (1) the repaired good-mouth circuit board is guided by a tool Inside the sample hole 1280032 to the substrate Sub circuit board obtained in the sample aperture is positioned to be in bonding the solid Cloth-like hole of the substrate, the substrate serve to repair damaged replacement. However, due to the popularity of electronic technology today, electronic products have become more diverse. Therefore, the important core device of electronic products, the circuit board, will be made into various shapes according to the type of electronic products, such as a circle. Shape, polygon, parabola, streamline, etc., and many more irregular shapes, which cause difficulties for the manufacturer in manufacturing. Therefore, the circuit board with special shape on the circuit board is more prone to defective products than before, which makes This type of circuit board needs to carry out a large increase in the flow rate of the recycling process. However, the shape of the f-type board is particularly complicated, and the difficulty in recycling the board is further improved, and the general conventional board recycling method such as the above-mentioned "manufacturing method of the board" cannot be easily used. This is because when the circuit board is placed in the circuit substrate, it is connected to the circuit substrate by a plurality of connecting pieces, and in the rapid recovery method of the circuit board, whether the circuit board is taken out from the circuit substrate or When such a circuit board is placed back into the circuit substrate, it is necessary to first cut or bond the irregularly distributed plurality of connecting pieces. Therefore, when the shape of the circuit board is more special, the distribution of the connecting piece is more difficult to be taken out and back-bonded by the precise positioning of the general process machine, which is not only easy to cause mistakes in the recycling process, It also wastes a lot of time in the process machine to accurately find a plurality of scattered connecting pieces. If the shape of the circuit board is special, the manufacturer will be reluctant to recycle due to consideration of the daily cost and cost of recycling the private system. This will cause the failure of such a board product to be discarded, which not only wastes resources, but also wastes resources. It will cause a lot of waste on the waste, which will cause a huge burden on the society. The fast recovery method associated with the board in the prior art is only for boards with a regular shape of 1289032, which may not provide a comprehensive and complete solution for the recycling process of today's special shaped boards. Therefore, there is an urgent need to provide a sophisticated circuit board rapid recovery method. SUMMARY OF THE INVENTION The main object of the present invention is to provide a circuit board rapid recovery method, whether it has a regular shape such as a square shape or a special shape such as a circular, polygonal, parabolic, streamlined shape, etc. The circuit board rapid recovery method of the present invention can be utilized to quickly take out the circuit board from the circuit substrate and return the circuit board to the circuit substrate. The secondary object of the present invention is to utilize the rapid recovery method of the circuit board of the present invention to avoid a large number of good circuit boards being discarded due to the inability to recycle, thereby saving time and cost for remanufacturing the circuit board, and effectively achieving the source. The effect of recycling is to enhance the overall industrial competitiveness. Another object of the present invention is to use a circuit board to engage the cutter to increase the ease of alignment of the circuit substrate and the circuit board and to ascertain the density of the circuit board when it is bonded to the circuit substrate. The invention relates to a method for quickly recovering a circuit board, which first cuts a defective circuit board in a circuit board to form a defect, and the defective circuit board block contains - no a good circuit board, a plurality of connections> and a part of the circuit board connected to the defective circuit board, and then cutting off the good circuit board side 7 1289032 in the second circuit substrate, wherein The shape of the good circuit board is similar to the shape of the missing portion of the first circuit substrate, and the good circuit board includes a good circuit board, a plurality of connecting pieces connected to the good circuit board, and a part The second circuit substrate is finally placed back and bonded to the missing portion of the first circuit substrate, so that the first circuit substrate becomes a complete first circuit substrate of one of the good circuit boards. The present invention also provides a circuit board block snapping method, which uses a snap-cut method on a circuit substrate to cut a third circuit board block so that the third circuit board block has a male snap-fit structure, and the circuit board has a female snap-fit structure corresponding to the male snap-fit structure, wherein the second circuit board block includes a third circuit board, and the third circuit board The plurality of connecting pieces and a part of the circuit board are connected. In order to make the person skilled in the art understand the purpose, features and effects of the present invention, the present invention will be further exemplified by the following specific embodiments and with the accompanying drawings. The following is a first embodiment of the present invention. The present invention relates to a method for quickly recovering a circuit board, first searching for a plurality of first positioning holes 10 on a first circuit substrate 1, and then providing a cutting device (not shown) by the first positioning holes 10 The positioning module performs a positioning search, wherein the cutting device can be combined with a precision control system (not shown) such as a CNC system (Computer Numerical Control), and at least one photographic lens can be configured (not shown) The photo 8
1289032 影鏡頭可為下列裝置之一：CMOS鏡頭、CCD鏡頭、Super CCD 鏡頭或VPS鏡頭，以便於進行快速且精確之定位搜尋，此 外’該切割裝置可為下列裝置之一 ：CNC加工機、雷射切 割機、模具刀組。隨後運用該切割装置之切割模組以直線 方式將該第一電路基板1内之一不良品電路板方塊12切 下（S1) ’而在該第一電路基板1内留下一缺塊處12a，其 中’該不良品電路板方塊12係包含有一不良品電路板 122、與該不良品電路板122相連接之複數個第一連接片 124及部份第一電路基板126。 請參閱第3圖，第3圖係為本發明一較佳實施例之 立體示意圖二。再來運用該切割裝置尋找一第二電路基板 2上之複數第二定位孔20，藉由該第二定位孔20以提供 該切割裝置之定位模組進行定位搜尋，隨之運用該切割裝 置之切割模組以直線方式將該第二電路基板2内之一良 品電路板方塊22切下（S2)(請參閱第1圖所示），其中， 該良品電路板方塊22之形狀係與該第一電路基板1之該 缺塊處12A形狀相似，且該良品電路板方塊22係包含有 一良品電路板222、與該良品電路板222相連接之複數個 第二連接片224及部份第二電路基板226。 請參閱第4圖，第4圖係為本發明一較佳實施例之 立體示意圖三。接下來運用一接合裝置以尋找該第一電路 基板1上之該第一定位孔10，藉由該第一定位孔10以提 供該接合裝置之定位模組進行定位搜尋，再運用該接合裝 置之補塊模組將該良品電路板方塊22接合於該第一電路 基板1之該缺塊處12A(S3)(請參閱第1圖所示），使該The 1289032 lens can be one of the following: CMOS lens, CCD lens, Super CCD lens or VPS lens for quick and accurate positioning search. In addition, the cutting device can be one of the following: CNC machine, mine Shot cutting machine, mold knife set. Then, the cutting module of the cutting device is used to cut a defective circuit board block 12 in the first circuit substrate 1 in a straight line (S1)', and a missing block 12a is left in the first circuit substrate 1. The defective circuit board block 12 includes a defective circuit board 122, a plurality of first connecting pieces 124 connected to the defective circuit board 122, and a portion of the first circuit substrate 126. Please refer to FIG. 3, which is a perspective view of a second embodiment of the present invention. Then, the cutting device is used to search for a plurality of second positioning holes 20 on the second circuit substrate 2, and the second positioning hole 20 is used for positioning and searching by the positioning module for providing the cutting device, and then the cutting device is used. The cutting module cuts off one of the good circuit board blocks 22 in the second circuit substrate 2 in a straight line (S2) (refer to FIG. 1), wherein the shape of the good circuit board block 22 is the same as the first The missing circuit portion 12A of the circuit board 1 is similar in shape, and the good circuit board block 22 includes a good circuit board 222, a plurality of second connecting pieces 224 connected to the good circuit board 222, and a part of the second circuit. Substrate 226. Please refer to FIG. 4, which is a perspective view of a third embodiment of the present invention. Then, the first positioning hole 10 on the first circuit substrate 1 is searched by using a bonding device, and the first positioning hole 10 is used for positioning and searching by the positioning module for providing the bonding device, and then the bonding device is used. The patch module joins the good board square 22 to the missing portion 12A (S3) of the first circuit substrate 1 (see FIG. 1), so that the
1289032 第一電路基板1成為全為良品電路板之完整第一電路基 板1。 若本發明之該第一電路基板1有一個以上不良品電 路板122時，仍可運用上述方法進行取出不良品電路板方 塊12及補回良品電路板方塊22，進而形成完整的一良品 電路基板。 須注意者，上述切割裝置係以垂直於電路基板1、2 之上表面方向由上而下貫穿切割方式為例，然實作上其切 割方式可搭配運用任何卡合裁切方法以增加良品電路板 方塊22與第一電路基板1接合上之對位方便性，如凸齒 狀、鋸齒狀、拋物線狀、鳶形齒狀、斜切入電路基板之上 表面所形成之斜切面狀等卡合裁切方法均無不可。 請參閱第5圖，第5圖係為本發明另一較佳實施例之 立體示意圖。本發明亦提供一種電路板方塊卡合裁切方 法，係於一第三電路基板3搭配運用卡合裁切方式，於該 第三電路基板3之一上表面由上而下貫穿切割一第三電 路板方塊32，使該第三電路基板3具有一第三母卡合結 構343，且讓該第三電路板方塊32具有與該第三母卡合 結構343相對應之一第三公卡合結構323，使該第三電路 基板3與該第三電路板方塊32接合時增加該第三電路基 板3與該第三電路板方塊32對位之方便性，並提高該第 三電路板方塊32與該第三電路基板3接合時之契密度， 其中，該第三電路板方塊32係包含一第三電路板322、 與該第三電路板322相連接之複數個第三連接片324及部 份第三電路基板326，此外，該第三公卡合結構323與該 1289032 第三母卡合結構343係可相互搭配為下述形狀之一：鋸齒 狀、拋物線狀、凸齒狀、鳶形齒狀、斜切入該第三電路基 板3之一上表面所形成之斜切面狀。1289032 The first circuit substrate 1 becomes a complete first circuit substrate 1 of a good circuit board. If the first circuit board 1 of the present invention has more than one defective circuit board 122, the method of removing the defective circuit board block 12 and the replenishing circuit board block 22 can be performed by the above method, thereby forming a complete good circuit board. . It should be noted that the above-mentioned cutting device is exemplified by a top-to-bottom cutting method perpendicular to the upper surface of the circuit substrates 1, 2, but the cutting method can be used in combination with any snap cutting method to increase the good circuit. The alignment convenience of the board block 22 and the first circuit board 1 is matched, such as a convex tooth shape, a zigzag shape, a parabola shape, a meandering tooth shape, and a chamfered surface formed by obliquely cutting into the upper surface of the circuit substrate. The cutting method is indispensable. Please refer to FIG. 5, which is a perspective view of another preferred embodiment of the present invention. The present invention also provides a circuit board block-cutting and cutting method, which is applied to a third circuit substrate 3 in a clamping and cutting manner, and a third surface of the third circuit substrate 3 is cut through the top surface from top to bottom. The circuit board block 32 has the third circuit substrate 3 having a third female engaging structure 343, and the third circuit board square 32 has a third male snap corresponding to the third female engaging structure 343. The structure 323 is configured to increase the convenience of the third circuit substrate 3 and the third circuit board block 32 when the third circuit substrate 3 is joined to the third circuit board block 32, and to improve the third circuit board block 32. The third circuit board block 32 includes a third circuit board 322, and a plurality of third connecting pieces 324 and portions connected to the third circuit board 322. The third circuit board 326, in addition, the third male engaging structure 323 and the 1280032 third female engaging structure 343 can be matched with each other into one of the following shapes: zigzag, parabola, convex tooth, dome Toothed and beveled into one of the third circuit substrates 3 The chamfer is formed planar.
請參閱第6圖，第6圖係為本發明又一較佳實施例之 立體示意圖。本發明亦提供一種電路板方塊卡合裁切方 法’係於一第四電路基板4搭配運用卡合裁切方式，於該 第四電路基板4之一端側面穿透切割至該第四電路基板4 之另一端侧面，以取下一第四電路板方塊42，使該第四 電路基板4具有一第四母卡合結構443，且讓該第四電路 板方塊42具有與該母卡合結構443相對應之一第四公卡 合結構423,使該第四電路基板4與該第四電路板方塊42 接合時增加該第四電路基板4與該第四電路板方塊42對 位之方便性，並提高該第四電路板方塊42與該第四電路 基板4接合時之契密度，其中，該第四電路板方塊42係 包含一第四電路板422、與該第四電路板422相連接之複 數個第四連接片424及部份第四電路基板426，此外，該 第四公卡合結構423與該第四母卡合結構443係可包含下 述所形成形狀之一：鋸齒狀、拋物線狀、凸齒狀、鳶形齒 狀、斜切入該第四電路基板4之一上表面所形成之斜切面 狀0 綜上所述，由於本發明之電路板快速回收方法係以簡 易之規則狀切割方式及方便之結合方法，將電路板由電路 基板中分離，故無須沿著電路板之形狀而對電路板之連接 片進行裁切或接合，可省卻製程機台因連接片之複雜分佈 以進行多次搜尋與定位所耗費的時間，並能有效避免因連 11Please refer to Fig. 6, which is a perspective view of still another preferred embodiment of the present invention. The present invention also provides a circuit board block-cutting and cutting method of the fourth circuit substrate 4 in a manner of engaging and cutting, and is cut and cut to the fourth circuit substrate 4 at one end side of the fourth circuit substrate 4. The other end side of the circuit board 42 is taken to make the fourth circuit board 4 have a fourth female engaging structure 443, and the fourth circuit board block 42 has the female engaging structure 443. Corresponding to the fourth common card structure 423, the fourth circuit substrate 4 and the fourth circuit board block 42 are joined to increase the convenience of the fourth circuit substrate 4 and the fourth circuit board block 42. And increasing the density of the fourth circuit board block 42 and the fourth circuit substrate 4, wherein the fourth circuit board block 42 includes a fourth circuit board 422 connected to the fourth circuit board 422. a plurality of fourth connecting pieces 424 and a portion of the fourth circuit substrate 426. Further, the fourth male engaging structure 423 and the fourth female engaging structure 443 may include one of the following shapes: zigzag, parabola Shape, convex tooth, 鸢 tooth shape, oblique cut into the first The chamfered surface formed by the upper surface of one of the four circuit substrates 4 is as described above. Since the circuit board rapid recovery method of the present invention is a simple regular cutting method and a convenient combination method, the circuit board is used in the circuit substrate. Separating, so that it is not necessary to cut or join the connecting pieces of the circuit board along the shape of the circuit board, thereby eliminating the time taken for the processing machine to perform multiple searching and positioning due to the complicated distribution of the connecting pieces, and can effectively avoid Because even 11
1289032 接片之分佈所造成裁切或接合上的失誤，進而大幅提昇電 路板回收製程時的良率。且無論電路基板上之電路板的形 狀為何，均可用此方式加以進行快速切割與接合。而相較 於切割與接合電路板上之數個分佈不定的連接片，本發明 之電路板快速回收方法所運用之製程步驟與所花費的時 間均微乎其微。故本發明不僅可回收規則形狀與特殊形狀 的電路板，增加電路板回收製程時的良率，並能減少電路 板回收製程時所需之步驟，有效縮短電路板回收製程的所 須時間，大幅提高產業競爭力，因此本發明極具進步性及 符合申請發明專利之要件，爰依法提出申請，祈鈞局早 曰賜准專利，實感德便。 以上已將本發明做一詳細說明，惟以上所述者，僅 爲本發明之一較佳實施例而已，當不能限定本發明實施之 範圍。即凡依本發明申請範圍所作之均等變化與修飾等， 皆應仍屬本發明之專利涵蓋範圍内。 【圖式簡單說明】 第1圖係為本發明一較佳實施例之流程圖； 第2圖係為本發明一較佳實施例之立體示意圖一； 第3圖係為本發明一較佳實施例之立體示意圖二； 第4圖係為本發明一較佳實施例之立體示意圖三； 第5圖係為本發明另一較佳實施例之立體示意圖； 第6圖係為本發明又一較佳實施例之立體示意圖。 121289032 The distribution of the tabs causes errors in cutting or bonding, which in turn greatly increases the yield of the board recycling process. Regardless of the shape of the circuit board on the circuit board, this method can be used for rapid cutting and bonding. The process steps and time taken by the board rapid recovery method of the present invention are minimal compared to the number of discretely connected tabs on the dicing and bonding board. Therefore, the present invention can not only recover the regular shape and the special shape of the circuit board, increase the yield of the circuit board recycling process, and can reduce the steps required for the circuit board recycling process, thereby effectively shortening the time required for the circuit board recycling process, and greatly To improve the competitiveness of the industry, the present invention is highly progressive and conforms to the requirements of applying for invention patents, and the application is made according to law, and the Prayer Council has granted patents as soon as possible. The present invention has been described in detail above, but the foregoing is only a preferred embodiment of the invention, and is not intended to limit the scope of the invention. That is, the equivalent changes and modifications made by the scope of the present application should remain within the scope of the patent of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a flow chart of a preferred embodiment of the present invention; FIG. 2 is a perspective view of a preferred embodiment of the present invention; FIG. 3 is a preferred embodiment of the present invention 3 is a perspective view of a preferred embodiment of the present invention; FIG. 5 is a perspective view of another preferred embodiment of the present invention; A schematic view of a preferred embodiment. 12
1289032 【主要元件符號說明】 si 由第一電路基板切下不良品電路板方塊 52 由第二電路基板切下良品電路板方塊 53 將良品電路板方塊接合於第一電路基板之缺塊處 1 第一電路基板 10 第一定位孔 12 不良品電路板方塊 12A缺塊處 122不良品電路板 124第一連接片 126部份第一電路基板 2 第二電路基板 20 第二定位孔 22 良品電路板方塊 222良品電路板 224第二連接片 226部份第二電路基板 3 第三電路基板 32 第三電路板方塊 322第三電路板 323第三公卡合結構 324第三連接片 326部份第三電路基板 343第三母卡合結構 4 第四電路基板 13 12890321289032 [Description of main component symbols] si Cutting the defective circuit board from the first circuit board 52 Blocking the good circuit board from the second circuit board 53 Joining the good circuit board to the missing part of the first circuit board 1 a circuit substrate 10 first positioning hole 12 defective product circuit board block 12A missing block 122 defective product circuit board 124 first connecting piece 126 part first circuit substrate 2 second circuit substrate 20 second positioning hole 22 good circuit board square 222 good circuit board 224 second connecting piece 226 part second circuit substrate 3 third circuit board 32 third circuit board block 322 third circuit board 323 third male snap structure 324 third connecting piece 326 part of the third circuit Substrate 343 third female engaging structure 4 fourth circuit substrate 13 1289032
42 第四電路板方塊 422第四電路板 423第四公卡合結構 424第四連接片 426部份第四電路基板 443第四母卡合結構 1442 fourth circuit board block 422 fourth circuit board 423 fourth male snap structure 424 fourth connecting piece 426 part of fourth circuit substrate 443 fourth female snap structure 14