TWI286721B - Heat-dissipating apparatus for a back light module of a liquid crystal display - Google Patents
Heat-dissipating apparatus for a back light module of a liquid crystal display Download PDFInfo
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- TWI286721B TWI286721B TW095128911A TW95128911A TWI286721B TW I286721 B TWI286721 B TW I286721B TW 095128911 A TW095128911 A TW 095128911A TW 95128911 A TW95128911 A TW 95128911A TW I286721 B TWI286721 B TW I286721B
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- heat
- backlight
- circuit board
- panel display
- substrate
- Prior art date
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- 239000004973 liquid crystal related substance Substances 0.000 title abstract description 3
- 230000017525 heat dissipation Effects 0.000 claims description 61
- 239000000758 substrate Substances 0.000 claims description 56
- 229910000679 solder Inorganic materials 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 239000000344 soap Substances 0.000 claims 1
- 239000000956 alloy Substances 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000007769 metal material Substances 0.000 description 6
- 238000001816 cooling Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 239000002918 waste heat Substances 0.000 description 2
- 101150081525 LIMK1 gene Proteins 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
- F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
- F21V29/677—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans the fans being used for discharging
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
- F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133628—Illuminating devices with cooling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Liquid Crystal (AREA)
- Planar Illumination Modules (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
1286721 九、發明說明: 【發明所屬之技術領域】 本發明係關於一種平面顯示器之背光源散熱裝置, 特別是關於在一電路板開設至少一組裝孔,且至少一背光 單元之一導熱部係經由該組裝孔直接貼接於一散熱基板之 背面’以提升散熱效率之平面顯示器之背光源散熱裝置。 【先前技術】 習用平面顯示器之背光源散熱裝置,請參照第i圖 所示,其包含數個背光單元6、一電路板7、一支撐框架 J及一散熱基板9。該背光單元6設置於該電路板7之一 侧,且與該電路板7電性連接,以便藉由該電路板7控制 該背光單元ό提供一背光源。該背光單元6具有一基座61 、一發光元件62及至少二極片63。該基座61係設有一 容置空間〔未標示〕,以便容置定位該發光元件62及極 片63。該發光元件62係選自一發光二極體〔led〕,以 提供足夠之光源。該極片63係由一導電金屬材質製成, 該極片63係穿設於該基座61之側面,且該極片63與該 發光元件62電性連接。 請再參照第1圖所示,該電路板7係選自一軟性印 刷電路板,該背光單元6利用該極片63電性連接於該電 路板7之一側。該支撐框架8設有一容置空間80,以供 容置該背光單元6及電路板7。該散熱基板9係由鋁或銅 等高導熱能力之金屬材質製成,其結合於該支撐框架8之 一侧,以便該電路板7經由該容置空間80與該散熱基板 —5 — C:\Limta\lt Pnt\PKI0134.doc 06/08/07/01:37 P« 1286721 9相互貼接。 當該背光單元6之發光元件62產生一背光源供一平 面顯示器〔未繪示,flat panel display〕形成影像時,該發 光元件62產生之熱能經由熱傳導方式傳遞至該電路板7 ,接著再由該散熱基板9之金屬材質間接吸收該電路板7 上之熱能。由於該高導熱能力之散熱基板9之一側設有數 個鰭片構造〔未標示〕,進而增加該散熱基板9與空氣之 熱交換面積,以便快速將所吸收之熱能釋放至大氣中,進 一步達到快速冷卻降溫之功效。 一般而言,上述習用平面顯示器之背光源散熱裝置
散熱基板9進行一熱交換動作,而必須間接透過該電路板 7將該背光單元6產生之減傳導魏散熱基板9進行散 熱,以致大幅降低該背光單元6之散熱效率。再者,該電 路板7大部分係選自-雛印刷f路板,其構造之材質必 d 3有導熱旎力較低之材質〔例如··玻璃纖維等〕,導致 降低該電路板7之導熱效率,進而造成該f光單元6之散 熱效率低^。基於上述原因,其確實有必要進—步改良上 述習用平面顯示器之背光源散熱裴置。 夕電路板開設至少一組裝孔, 之一導熱部經由該組裝孔直接貼 面,以提升散熱效率。再者,該 小^於此’本發明改良上述之缺點,其储由在至 且分別將至少一背光單元 設於至少一散熱基板之背 一基座的底部具有一預定高度差, w亥導熱部相對該背光單元之 差’該預定高度差不小於於 一 6 —
M/0«/07/01:37 W 1286721 … 該組裝孔之厚度,以便該導熱部經由該組裝孔緊密的貼設 於該散熱基板之背面,進一步增進組裝可靠度。藉此,本 發明確實能有效提升背光源散熱效率,進而延長平面顯示 器之使用壽命。 ^ 【發明内容】 本發明之主要目的係提供一種平面顯示器之背光源 散熱裝置,其係藉由在至少一電路板開設至少一組裝孔, 且分別將至少一背光單元之一導熱部經由該組裝孔直接貼 • 設於至少一散熱基板之背面,使得本發明具有提升背光源 散熱效率之功效。 I々 本發明之次要目的係提供一種平面顯示器之背光源 散熱裝置,其中至少一背光單元之一導熱部相對該背光單 元之一基座的底部具有一預定高度差,以便該背光單元之, 導熱部得以經由該組裝孔緊密的貼設於該散熱基板之背面 ,使彳于本發明具有提升背光源散熱效率及組裝可靠度之功 效。 籲 根據本發明之平面顯示器之背光源散熱裝置,其包 3至少一背光單元、至少一電路板及至少一散熱基板。該背 光單元及電路板共同構成一背光源模組。該背光單元設有一 發光元件及一導熱部,該導熱部係設置於該發光元件之一 端,以吸收該發光元件產生之熱能。該電路板設置於該散 熱基板之背面,且該發光單元之導熱部係通過該電路板之 ^ 至少一組裝孔直接貼設於談散熱基板之背面,以便該散熱 基板直接吸收及驅散該背光源模組產生之熱能。 —7 — C:\Linda\K Pttt\PKI0|34. doc 0β/08/07/0|:37 Ρ« 1286721 【實施方式】 為讓本發明之上述及其他目的、特徵及優點能更明 顯易懂’下文特舉本發明之較佳實施例,並配合所附圖式 ,作詳細說明如下:
請參照第2及4圖所示,本發明第一實施例之平面 顯示器之背光源散熱裝置較佳係用以結合於一平面顯示器 a〔 flat panel display,FPD〕之背面,該平面顯示器a較 佳可選自液晶顯示器〔liquid crystal display,LCD〕或電 漿顯示器〔plasma display panel,PDP〕等,以便提供背 光之光線,同時進行散熱動作。 請參照第2及3圖所示,本發明第一實施例之平面 顯示器之背光源散熱裝置其係包含至少一背光源模組工、 一支撐框架2及至少一散熱基板3,該背光源模組丨與該 支撑框架2係緊密貼設於該散熱基板3之背面,以便對該 平面顯示器a進行散熱動作。該背光源模組丨具有至少一 背光單元11及-電路板12,該f光單元u係與該電路 板12電性連接,藉由該電路板12控制該背光單元u之 發光動作,以提供一背光源。該電路板12較佳選自一軟 性印刷電路板,但亦可選自—硬性印刷電路板。該電路板 12開設至少-組裝孔⑵’以供該背光單元u透過該組 裝孔121與該散熱基板3相貼接。 =參照第2及3圖所示,本發明第—實施例之支 擇框架2具有至少—容置空間2(),且該 侧可用以結合該散熱基板3,及其另―側可用^Μ平 —8 一 C:\Linda\PK Pat\PII0i3Cdoc 1286721 3不$ a。更詳言之,該支撐购2較佳係選擇由一高 了、性金屬或合金所製成,例純、銅、金、銀或其合金 該#仁亦可選擇由非金屬材料製成,例如塑膠或泡棉等。 2置工間2G係對應該背光賴組1之雜開設形成在 二擇框架2上,該容置空間2〇用以組裝容置該背光源 m ’以便該背光源模組1不致凸出至該支撐框架2外 0 埶π再參照帛2及3圖所示,本發明第一實施例之散 了基板3係由—高導熱性金屬或合金所製成,例如銘、銅 為,:掉金銀或其合金等。該散熱基板3之正面設有數個散熱 及數個散熱鰭片32。該散熱鰭片係相對於該 散熱基板3之縱向凸設排列於該散熱基板3之正面,且各 相4該散熱鰭片32之間係形成該散熱槽道31,該散熱 :道31、亦相對於該散熱基板3之縱向排列形成。藉由該 、槽道31及政熱鰭片32增加該散熱基板3與空氣之熱 交換面積,以驅散該散熱基板3所吸收之熱能。 、…咕再參照第2及3圖所示,本發明第一實施例之背 光疋件11各設有一基座lu、一發光元件112、至少二導 ,件113及-導熱部114。該基座ln之中心位置具有〆 容置空間〔未標示〕,其可供容設定位該發光元件112及 該導熱部114。該發光元件112較佳選自一發光二極體〔 LEf〕’特別是-白光發光二極體。該導接件113係由一 :、同導電忐力之金屬材質製成,例如銅、銀或其合金等, 該導接件113係穿設於該基座lu之側面,其一端與位於 C:\Linda\PK P«mi0l34. doc
0β/0«/Ο7/ΟΙ:37 W —9 — I2S6721 該基座111内之發光元件112電性連接,而該導接件113 之另一端用以電性連接該電路板12。該導熱部114係, 自一具咼導熱月b力之金屬或合金材質製成,例如銘、銅、 金、銀或其合金等。該導熱部114選擇設置於該基座ηι 之底部’且其一端與該發光元件112相接觸。另外,該導 熱部114之另一端相對該基座ln之底部凸出且裸露於外 部,該導熱部114與該基座in之底部形成一預定高度差 〔未標示〕,該預定高度差不小於該電路板12之組裝孔 121之厚度,且該組裝孔121之直徑係大於該導熱部H4 之直徑,以便該導熱部114恰可透過該組裝孔121貼接於 該散熱基板3之背面。 二二》‘請再參照第2至4圖所示,當使用本發明第一實施 例之平面顯示器之背光源散熱裝置時,將該支撐框架2之 一侧結合於該平面顯示器a之背面。該背光單元u之發 光元件112發射一背光源供該平面顯示器a形成影像,同 時該發光元件112亦產生廢熱。由於該背光單元η之導 熱部114對應穿過該電路板12之組裝孔121直接貼設於 該散熱基板3之背面,以致該背光單元u之導熱部114 藉由熱傳導方式吸收該廢熱之熱能,且經由該導熱部114 本身之高導熱能力,直接將熱能傳導至該散熱基板3。藉 此,本發明確實可有效提升該背光源模組1之散熱效率。 再者,請參照本案第5及6圖所示,本發明第一實 轭例係另設有數個散熱風扇b,由於該散熱槽道31及散 熱鰭片32係相對該散熱基板3形成縱向排列,因此有利 C:\Linda\ft ΡΜΜΤΕΙΟ丨% joe —10 — 0β/0β/07/0!:37 Μ 1286721 於藉由熱空氣上升之對流原理產生熱對流,以增進散熱效 率。藉此,該散熱風扇b較佳係選擇設置於該散熱基板3 之下方,且該散熱風扇b之出風口〔未標示〕亦相對該散 熱槽道31之通道方向設置,以便藉由該扇熱風扇b加速 該散熱槽道31内之空氣對流,進而提昇該散熱基板3之 散熱效率。 請參照第7至8圖所示,其揭示本發明第二實施例 多平面顯示器之背光源散熱裝置。相較於第一實施例,第 三實施例之電路板12係進一步選擇直接成型於該散熱基 板3之背面,且該電路板12預留至少一組裝孔121,該 散熱基板3之背面經由該電路板12之組裝孔121而可供 該背光單元11之導熱部114直接貼設,藉此有效提昇該 背光源模組1之散熱效率。 另外,當本發明第一實施例或第二實施例之背光單 元11經由該組裝孔121貼設於該散熱基板3之背面時, 該該背光單元11之導熱部114的結合侧可預設一焊料層 〔未、、、日示〕’透過一表面黏著技術〔Surface M〇unt Technology,SMT〕製程加熱熔融該焊料層,藉此將該背 光單元11穩m的結合於該散熱基板3之背面,以提升該 背光源模組1與該散熱基板3間之結合可靠度。另外,該 焊料層之材f較佳係選自—具高導熱能力之焊料〔例如Γ 錫膏等〕’進而增_背光源模組1與該散熱基板3間之 熱傳導效率。 如上所述才目較於第i圖之習用平面顯示器之背光 C:\Limk\PK Pftt\PK1013idoc °6/Οβ/〇7/〇|:37 η 〜11 — 1286721
源散熱裝置必賴接豸過一電路板7#-背光單元6所產 生之熱能傳導至—散熱基板9進行熱交換動作,以致大幅 降低該發光單元6之散熱效率等缺點,第2圖之本發明藉 由在該電路板12開設該組裝孔121,且分別將該背光^ 兀11之導熱部114係經由該組裝孔121直接貼接於該散 熱基板3之背面,以提升該發光單元u之散熱效率。再 者,該導熱部114相對該背光單元u之基座ln的底部 具有一預定高度差,該預定高度差不小於於該組裝孔ΐ2ι 之厚度,以便該導熱部114經由該組裝孔121緊密的貼接 缝該散熱基板3之背面,增進崎可靠度。藉此,本發明 讀實能有效提升背絲散熱料,進而延長平面顯示器之 使用壽命。 雖然本發明已利用上述較佳實施例揭示,然其並非 用以限定本發明’任何熟習此技藝者,在不脫離本發明之 精神和範圍之内,當可作各種更動與修改,因此本發明之 保護範圍當視後附之t請專·圍所界定者為準。 C:\Linda\PK Pftt\PX10I34.doc
06/08/07/01:37 PN 〜12 — 1286721 【圖式簡單說明】 第1圖:習用平面顯示器之背光源散熱裝置之分解立 體圖。 第 2圖 第 3圖 .第 4圖 第 5圖 .扉第 6圖 第 7圖 第 8圖
••本發明第一實施例之平面顯示器之背光源散 熱裝置之分解立體及放大圖。 :本發明第一實施例之平面顯示器之背光源散 熱裝置之組合剖視圖。 :本發明第一實施例之平面顯示器之背光源散 熱裝置之分解立體圖。 ••本發明第一實施例之平面顯示器之背光源散 熱裝置及散熱風扇之分解立體圖。 ••本發明第一實施例之平面顯示器之背光源散 熱裝置及散熱風扇之組合剖視及示意圖。 :本發明第二實施例之平面顯示器之背光源散 熱裝置之分解立體圖。 :本發明第二實施例之平面顯示器之背光源散 熱裝置之組合剖視圖。 【主要元件符號說明】 1 背光源模組 111基座 113導接件 12 電路板 2 支撐框架 11背光單元 112發光元件 114導熱部 121組裝孔 20 容置空間
—13 — 06/08/07/01:37 PM 1286721 3 散熱基板 31 32 散熱鰭片 6 61 基座 62 63 極片 7 8 支撐框架 80 9 散熱基板 a b 散熱風扇 散熱槽道 背光單元 發光元件 電路板 容置空間 平面顯示器 CAUndaVPC Pat\PCIOI34. doc
Claims (1)
1286721 十、申請專利範圍: ’ 1、一種平面顯示器之背光源散熱裝置,其包含: 至少一背光單元,其設有一發光元件及一導熱部,該 導熱部用以吸收該發光元件產生之熱能; 一電路板,其設有至少一組裝孔,且該電路板與該背 光單元電性連接,以構成一背光源模組; 至少一散熱基板’其中該電路板設置於該散熱基板之 馨月面’且該發光皁元之導熱部係通過該電路板之組穿 孔直接貼設於該散熱基板之背面,以便該散熱基板吸 收及驅散該背光源模組產生之熱能。 2、 依申請專利範圍第1項所述之平面顯示器之背光源散 歸置,其中該背光單元另設有—基座,其用以容置 定位該發光元件及導熱部。 3、 依申請專利範圍第丨項所述之平面顯示器之背光源散 熱裝置,其中該背光單元另設有至少二導接件,該導 • 接件一端與該發光元件電性連接,其另一端與該電路 板電性連接,以便藉由該電路板控制該發光元件提供 一背光源。 ’、 4、 依申請專利範圍第2項所述之平面顯示器之背光源散 ”、、裝置其中該導熱部之一端相對該基座之底部凸出 • 路於外部,且該導熱部與該基座之底部形成一預 • 疋同度差,該預定高度差不小於該電路板之組裝孔的 厚度。 巾θ專利範圍第1項所述之平面顯示器之背光源散 C:\Linda\K Pkt\PKIOI34.tk)c 06/08/07/01:37 PM —15 — 1286721 • -· 熱裝置,其中該組裝孔之直徑大於該導熱部之直徑, , 則更該導熱部恰可透過該組裝孔貼言史於該散熱基板之 背面。 6依申明專利範圍第i項所述之平面顯示器之背光源散 齡置另包含-讀框架,其對應該背統模組之形 狀開汉有至少一容置空間,以便組裝容置該背光源模 組。 7依申°月專利範圍第1項所述之平面顯示器之背光源散 熱裝置’其巾該f路板係直接成型於概熱基板之背 面。 8、 依申料鄕圍第1項所述之平面顯示器之背光源散 齡置,財該導熱部與該賴基板之結合侧係設有 一焊料層。 9、 依申料截圍第8項所述之平面顯示器之背光源散 熱裝置,其中該焊料層係選自一錫膏。 φ 1〇、依申請專利範圍第1項所述之平面顯示器之背光源散 熱裝置,其中該散熱基板之正面設有數個散熱鰭片及 數個散熱槽道,該散熱鰭片及散熱槽道相對該散熱基 板之縱向形成延伸,該散熱槽道用以導引空氣由下而 上縱向流動,以驅散該散熱鰭片表面之熱能。 .U、依申㈣利範圍第1項所述之平面顯示ϋ之背光源散 熱裝置,其中該電路板選自一軟性印刷電路板及一硬 , 性印刷電路板之一。 12依申巧專利範圍第!項所述之平面顯示器之背光源散 C:\Linda\K Pat\PICIOI34. doc 0«/0β/07/01:37 Ρ« —16 — 1286721 熱裝置,其中該發光元件選自一發光二極體〔LED〕 應 〇 ’ 13、依申請專利範圍第6項所述之平面顯示器之背光源散 熱裝置,其中另設有數個散熱風扇,該散熱風扇設置 於該散熱基板之下方,以提昇該散熱基板之散熱效率 〇 14、依申請專利範圍第1項所述之平面顯示器之背光源散 熱裝置,其中該導熱部係設置於該發光元件之一端。 • 15、依申請專利範圍第1項所述之平面顯示器之背光源散 熱裝置,其中該導熱部之材質係選自銘、銅、金及銀 — 0
C:\Linda\PK Pat\PKlOI34.doc ——17—— 06/08/07/01:37 PM
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW095128911A TWI286721B (en) | 2006-08-07 | 2006-08-07 | Heat-dissipating apparatus for a back light module of a liquid crystal display |
| JP2007011265A JP2008041638A (ja) | 2006-08-07 | 2007-01-22 | 平面ディスプレイのためのバックライト光源用熱放散デバイス |
| GB0701544A GB2440748A (en) | 2006-08-07 | 2007-01-26 | Heat-dissipating device for a back light source in a flat panel display |
| DE102007006594A DE102007006594A1 (de) | 2006-08-07 | 2007-02-09 | Wärmeableitungsvorrichtung für Hintergrund-Lichtquelle für Flachbildschirme |
| FR0753815A FR2904749A1 (fr) | 2006-08-07 | 2007-03-14 | Dispositif de dissipation thermique pour une source de retroeclairage |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW095128911A TWI286721B (en) | 2006-08-07 | 2006-08-07 | Heat-dissipating apparatus for a back light module of a liquid crystal display |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI286721B true TWI286721B (en) | 2007-09-11 |
| TW200809713A TW200809713A (en) | 2008-02-16 |
Family
ID=37872861
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095128911A TWI286721B (en) | 2006-08-07 | 2006-08-07 | Heat-dissipating apparatus for a back light module of a liquid crystal display |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP2008041638A (zh) |
| DE (1) | DE102007006594A1 (zh) |
| FR (1) | FR2904749A1 (zh) |
| GB (1) | GB2440748A (zh) |
| TW (1) | TWI286721B (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7903416B2 (en) | 2009-01-05 | 2011-03-08 | Coretronic Display Solution Corporation | Flat panel display |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5266879B2 (ja) * | 2008-05-28 | 2013-08-21 | 岩崎電気株式会社 | 面照明装置 |
| TWI385343B (zh) * | 2008-07-24 | 2013-02-11 | Advanced Optoelectronic Tech | 一種光源及其被動散熱裝置 |
| KR100910917B1 (ko) | 2009-01-21 | 2009-08-05 | 주식회사 지앤에이치 | 조명기구용 엘이디 모듈의 방열장치 |
| JP2011146225A (ja) * | 2010-01-14 | 2011-07-28 | Sharp Corp | 光源装置およびそれを備えたバックライト装置 |
| KR101079151B1 (ko) | 2011-08-18 | 2011-11-02 | 이슬기 | 발광다이오드 조명 모듈 |
| EP2584245A1 (de) * | 2011-10-17 | 2013-04-24 | Luminova GmbH | LED-Modul mit Kühlblech |
| CN102661533A (zh) * | 2012-04-11 | 2012-09-12 | 深圳市华星光电技术有限公司 | 背光模组及液晶显示装置 |
| CN108337857B (zh) * | 2018-02-01 | 2020-04-07 | 深圳创维-Rgb电子有限公司 | 电视机 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001043594A (ja) * | 1999-07-30 | 2001-02-16 | Matsushita Electric Ind Co Ltd | カセット搬送装置 |
| US6428189B1 (en) * | 2000-03-31 | 2002-08-06 | Relume Corporation | L.E.D. thermal management |
| US6999318B2 (en) * | 2003-07-28 | 2006-02-14 | Honeywell International Inc. | Heatsinking electronic devices |
| US6966674B2 (en) * | 2004-02-17 | 2005-11-22 | Au Optronics Corp. | Backlight module and heat dissipation structure thereof |
| TWI255377B (en) * | 2004-11-05 | 2006-05-21 | Au Optronics Corp | Backlight module |
| TWI262342B (en) * | 2005-02-18 | 2006-09-21 | Au Optronics Corp | Device for fastening lighting unit in backlight module |
| TWI307799B (en) * | 2005-05-25 | 2009-03-21 | Coretronic Corp | Backlight module |
| TWI256454B (en) * | 2005-06-03 | 2006-06-11 | Au Optronics Corp | Light module |
-
2006
- 2006-08-07 TW TW095128911A patent/TWI286721B/zh not_active IP Right Cessation
-
2007
- 2007-01-22 JP JP2007011265A patent/JP2008041638A/ja active Pending
- 2007-01-26 GB GB0701544A patent/GB2440748A/en not_active Withdrawn
- 2007-02-09 DE DE102007006594A patent/DE102007006594A1/de not_active Withdrawn
- 2007-03-14 FR FR0753815A patent/FR2904749A1/fr active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7903416B2 (en) | 2009-01-05 | 2011-03-08 | Coretronic Display Solution Corporation | Flat panel display |
Also Published As
| Publication number | Publication date |
|---|---|
| GB0701544D0 (en) | 2007-03-07 |
| DE102007006594A1 (de) | 2008-02-21 |
| FR2904749A1 (fr) | 2008-02-08 |
| TW200809713A (en) | 2008-02-16 |
| JP2008041638A (ja) | 2008-02-21 |
| GB2440748A (en) | 2008-02-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |