TW552687B - Passivation packaging method of organic EL device and its structure - Google Patents

Abstract

In order to extend the lifetime of organic EL device, it is necessary to directly plate a passivation structure on the surface of the layered organic EL device to fully isolate the organic layer material and electrode layer material from contacting the external environment. When the evaporation of the organic layer and electrode material is completed, air-blocking inorganic material is selectively plated on the surface of the device to preliminarily protect the cathode, and then polymer passivation material is directly coated on the device by spraying or screen printing. After thermal curing or UV curing, the polymer layer is able to provide the device surface with filling and planarization capability and eliminate the step effect of the gap between the device and rib, so as to easily achieve the densification of passivation structure in plating the passivation material such as dielectric and/or metal, thereby completely isolating the organic EL device from the external. Finally, the whole passivation surface is coated and sealed by packaging material to provide the final protection for the EL device.

Description

552687 i 90101069

V. Description of the invention (1) The technical field to which the invention belongs] The present invention relates to an organic light emitting diode (OLED) element. In order to ensure that the inside of the element is not affected by the external environment, a type developed by spraying or A technology developed by coating a polymer layer by screen printing, and achieving the purpose of protecting the organic EL element formed on a substrate in the organic light emitting diode (OLED) element. [Prior art] Organic EL elements are elements with a layered structure, and the materials of each layer are extremely sensitive to the external environment. In order to facilitate the injection of electrons, the cathode uses a material with a low work function. However, if a material with a low work function is used, it will be easily troubled by oxidation 'and the oxidation of the cathode material will greatly reduce the efficiency of the element. In addition, the light-emitting layer formed by the fluorescent organic solid of the device, and the injection layer and transport layer of electrons and holes formed by using organic materials are extremely sensitive to moisture, oxygen, and other environmental changes, which makes it easy to make the device. The organic material in the crystallized, causing the phenomenon of separation between the organic material layer and the cathode, the so-called black spots appear; so in the absence of a perfect package to protect the material layers inside the element, the traditional organic The EL element has only a very short luminous lifetime. Therefore, in order to increase the service life of the organic tritium element, the cathode and the organic layer in the element should be more closely protected to prevent the influence of other external environments such as tritium gas, oxygen, and the like.

552687 Case No. 901010fig V. Description of the invention (2) Wide ^ ^ \ Phenomena occur 'However, there are many stepped and cavity-shaped surfaces between the layered organic layer and the ribs (^ b), so it is undergoing isolation There are considerable difficulties in manufacturing the package. Can improve the resistance of organic EL elements to moisture and oxygen, i can be used in the packaging of organic EL elements, must invent a highly dense barrier, (Γ = νΓίοη〆) structure mining method to improve the current organic EL elements ί Τίϊ PaSS1VaUon) process, and eliminate the design of metal or glass packaging cans used in traditional techniques; & improve the efficiency of the organic 1-piece barrier (paSSlvatl0n) structure, avoiding exposure of the components to the environment, to extend Operating life. The conventional organic EL element seals of Shilu Dalice have the following disadvantages: 1 · When using metal or general, its metal packaging cans are weighing and other disadvantages; glass packaging canners, fragile, bulky, heavy cans and substrates The airtightness of the flat part of the bonding place is not good, and it is limited, and the metal or glass seal 2-generally used multilayer, spin coating, dip plating, etc., and the cost of the organic EL element is high, and the organic EL element The production method is dealt with, and it takes cost and its barrier (PaSSi Vat) structure to stop the cost to the manufacturing point. In addition, among the dry demands, the use of

Page 7 Glass packaging has the precision of lack of weight in manufacturing. Encapsulation cans. Environmental protection. Canning structure. Plating; Ma Ang, it takes a long time. The outer ring is easy to be formed by oxygen, and the metal causes spin-coating of a variety of south molecular layer vaporization methods due to the moisture absorption of the agent. The effect is limited. It takes time to spend steam and dip plating method continuously. 552687 V. Description of the invention (3) In the multilayer barrier structure, the barrier elements and rib barrier drawers: the resulting SteP effect, which will cause the coating service Step frost plug: = poor coverage of the interlayer; and although the CVD method can overcome the shortcomings of ΓΓΓ, it takes a long time and the disadvantages of the known technology, and the present invention provides a package el # 友 ^ ， 二 结构 'Directly with a multi-layer waterproof, oxygen-permeable barrier layer, etc. Material = two Γ-layer packaging materials to encapsulate the plutonium element, instead of metal or glass, f / canning, in addition to saving Outside the packaging tank space and weight, case #. It can avoid the problem of package alignment, so it is better to use the package can procedure to argue 1¾ The method of ramie invention is to form 1 το on the organic substrate with a transparent substrate to form an organic film on the anode layer by evaporation or coating. After applying the cathode layer of the working function of Youyou 5 and spraying or screen printing the same 3 layers with the knife layer 'except to fill the gap between the element and the rib (rib),' for surface flatness to avoid The step effect (cover ef fec- ') in the cover is good for the compactness of the barrier material such as dielectric and metal when plated, so that the component is completely isolated from the external environment under the protection of the multilayer barrier material. In addition to the passivation structure and plating method disclosed in the present invention, in addition to reducing the weight of the device and being suitable for a flexible display, it has the following features:

552687 ------ Serial No. 90101069_Year Month: π__ V. Description of the invention (P '-way to make the passivation structure and introduce consistent production) KING 3 · Exempt from using metal Or glass packaging cans can reduce product weight and thickness, reduce volume, and have good flexibility. Organic EL elements suitable for plastic substrates are more suitable for electronic products such as portable communications. 4. The method of spraying or screen printing, which can be coated with polymer barrier layer ′ is simple and fast, which improves production efficiency and is suitable for mass production. 5 · It can improve the step effect when the barrier material is plated due to the uneven structure between the component and the rib (r i b). [Summary of the Invention] The present invention is a combination technology of a passivation structure and a plating (coating) process developed for an organic EL display. It is based on the concept of waterproofing and rolling barrier structure, and practically considers the EL element and the surface structure of the rib. It provides a plating (coating) process suitable for mass production. It also greatly improves the connection with the external environment. Blocking effect. Finally, the entire barrier surface is sealed with a packaging material to replace the design of the package 'can to provide final protection of the EL element. In order to achieve the above object, the present invention provides a passivation packaging method and structure of an organic EL element, including: providing a transparent substrate on which a plurality of organic EL element pixels have been formed and having a plurality of pixels; A rib (ri b); a protective layer is plated, and the organic EL element is plated with a

Page 9 Bao 552687 --- September 90101069 a____ V. Description of the invention (5) " 'Protective layer, and the protective layer is an inorganic material; one or more layers of barrier (passivati0n) ) Material layer, the barrier material layer is directly formed on the surface of the organic EL element pixel or the protective layer, and seals the entire surface of the barrier material layer, and is coated with a sealing material to encapsulate the barrier material layer. . [Embodiment] As shown in the first to fourth figures, the embodiment of the present invention is a passivating method for packaging organic EL elements. As shown in the first figure, a transparent substrate is provided. In one step, a plurality of organic EL elements 102 are formed on the transparent substrate 101, and a plurality of ribs 103 are formed on the transparent substrate 101. A transparent substrate 101 and an organic EL element pixel 102 have a The IT0 anode layer 104 is used as an anode of the organic EL element pixel 102, and an upper surface of the organic EL element pixel 102 has a cathode layer 105. The rib 103 is designed to prevent the element ^. ^ The talk phenomenon occurs. As shown in the second figure, in order to form a protective layer, a surface of the organic EL element pixel 102 is plated with a cathode protective layer 106, and the protective layer 106 is an inorganic material; and The protective layer 10 is deposited in a low-temperature chemical vapor deposition method. The film thickness of the protective layer can be controlled between 1 and 100Q0A. The material of the protective layer 106 can be S i 0X, S i Nx, S i 0X Ny, T i 0X,

A10X and other inorganic materials. Υ X

552687 Case No. 90101069 Amendment V. Description of the invention (6) As shown in the second (A) diagram, it is a step of depositing one or more layers of passivation material, wherein the passivating material layer 107 At least one layer is a polymer layer, and the barrier material layer 107 is directly filled between the organic EL element pixel 102 and the rib material 103, or is formed on the protective layer 106; however, it is layered There are many stepped and cavity-shaped surfaces between the organic EL element pixels 102 and the ribs 103 (r 1 b), so it is quite difficult to make a pass i vat ion packaging technology Sex. Therefore, the present invention uses at least one polymer layer material, which is coated on the organic EL element by spraying, combining with a mask pattern or screen printing, and the like, in addition to filling organic EL element pixels 1 〇 2 And the gap between rib 103 and rib '' and provide surface flatness to avoid step effect when covering '' to facilitate other dielectric materials 108 and / or metal materials 109, etc. When the barrier material is plated, as shown in FIG. 3 (B), the denseness of the barrier structure is achieved, wherein the polymer layer material of the barrier material layer may be a thermosetting, UV curing Polymer layer made of materials such as solvent-free oligomer, sol-gei, or organic / inorganic hybrid, and the film thickness of the polymer layer is not less than the height of the rib, and is controlled between 1 and 1000 vm. between. In addition, as shown in the fifth (A) to fifth (B) drawings, the number of 511 mask patterns (Mask Patterns) sprayed or screen-printed and the organic EL formed on the transparent substrate 50 The number of element areas 501 is the same and the positions are opposite, and the size of the mask pattern 511 must be larger than the size of the organic ^ element area 501. The sprayed Mask or the alignment symbol 512 on the screen 51, The alignment symbol 502 on the transparent substrate 50 needs to be aligned when spraying or printing, wherein the organic EL element area

Μ 5526 ^ 7 correction

No. 1 901_ftQ V. Description of the invention (7) 501 includes thousands of organic pixel elements 503. Finally, as shown in the fourth figure, the step of coating and sealing the entire surface of the barrier layer is coated with a seal of 110 and sealed with EP 0xy, Acrylic, Silicon, and other sealing materials. In particular, … The cathodic protection layer 106 is plated in the step of each of the two thermally-protected layers of the rubber type 2 of this method, and the dielectric material 108 and the metal material i in the material layer step are blocked by more than one layer = = i = ssi_vati0n). The material can be selectively used according to its actual implementation requirements. In addition, the present invention also discloses a passivation packaging structure of an organic EL element, as shown in the sixth (A) diagram, including: one to one transparent A substrate 601. The transparent substrate 601 is provided with a plurality of organic EL elements 602 and has a plurality of ribs 603. The surface of the transparent substrate 601 and the organic EL element are 602. Two have an IT0 anode layer 604 'as the anode of the organic EL element pixel 602, and the organic el element pixel 602 has a cathode layer 605 on the upper surface. A protective layer, the protective layer The 〇6 system is located on the surface of the pixel 〇2 of the organic EL element. The surface of the organic EL element is coated with a cathodic protection layer 6 0 6, and the protection layer 6 0 6 is an inorganic material. One or more layers of passivation material layers 607, 6 0, 6 0 9 'wherein the barrier material layer, at least one molecular layer 6 0 7, and the polymer layer 6 7 of the barrier material layer is directly shaped

Page 12 552687 SS__901〇l〇69 V. Description of the invention (8) The correction f is filled in between the organic tritium element 602 and the rib 603, or formed on the protective layer 60 6; Then other barrier materials such as dielectric material 608 and metallic material 609 are formed. A packaging material layer 6 10 is coated to seal the entire surface of the barrier material layer 60 7, 608, 60 9. Among them, the protective layer and the passivation material layer 608, Tian Ranyu can be selectively used in the barrier (pa ssivati ο η) packaging structure, as shown in FIG. 6 (B) to FIG. 6 (D). Show.

The organic EL element pixel 602 passivation layer, 608, and 609 are composed of organic EL element pixels 60 formed on a transparent substrate 601. 2) The inorganic material is selectively recorded on the organic EL element pixels 602. The surface is preliminarily protected. The purpose of the protective layer 606 is to prevent the residual solvent of the polymer 607 or the curing of the chemical substance CHIYO organic EL element pixel 602 after curing. The polymer 607 barrier material is directly plated on the element by spraying or screen printing, and then heat-cured or UV-cured, so that the polymer layer 607 can provide filling and flattening of the surface of the element, and eliminate The step effect of the gap between the element and the rib is beneficial to the barrier materials such as dielectric 60 8 and / or metal 60 9 when they are plated to achieve the compactness of the passi vatiorO structure, which makes the organic element element pixel 602 completely. It is isolated from the outside world. Finally, the packaging structure is coated with a sealing material 6 丨 〇 to seal the entire passivation surface to provide an organic element element pixel 602. Finally, according to the present invention, a "passivation seal for an organic EL element" Method and structure "can indeed use the techniques disclosed

13 Page 13 552687 _Case No. 90101069_ Year Month Amendment _ V. Description of the invention (9) The technology can achieve the expected purpose and effect, which meets the requirements of novelty, advancement and industrial utilization of invention patents. However, the drawings and descriptions disclosed above are only preferred embodiments of the present invention, and are not intended to limit the implementation of the present invention. Any person familiar with the technology will make changes based on the spirit of the present invention. Or modifications should be covered by the scope of patent application in the following case.

Page 14 552687 ——No. 90in | j ^ 弍 Simply say% ^ [Simplified illustration of the figure] The first picture is a transparent substrate that has been worn ^ ^ w into an organic EL element. The first ® is ^ a protective layer. Schematic diagram = The second diagram is the schematic diagram of the layer of the material with the spacer. The picture is the diagram of the dielectric / metal material. The diagram is the schematic diagram of the coating material of the sealer. The fifth (A) is the screen of spraying or screen printing. Schematic diagram of the cover pattern = ⑻ The diagram shows the organic el element area formed on the transparent substrate. The sixth (A) to sixth (D) diagrams are schematic diagrams of the packaging structure of the Passivation of the present invention. Description of number] 101 1〇2 1〇3 1 〇4 105 1 06 1 07 transparent substrate organic EL element pixel rib (r ib) IT 0 anode layer cathode layer protection layer polymer barrier material layer

Page 15 ----- 552687 _ Case No. 90101069 Revised diagram Brief description of the passivation material layer dielectric material 丨 〇8 Passivation material layer metal material 〇09 Encapsulation material 11 () Transparent substrate 50 Organic EL element area 501 Registration mark on transparent substrate 502 Organic EL element pixel 503 Sprayed Mask or screen 51 Mask pattern 511 Sprayed mask or screen 512 Transparent Substrate 601 Organic EL element 602 Rib 603 IT0 Anode layer Cathode layer 605 Protective layer 606 South molecular barrier material layer 607 Dielectric material barrier material layer 608 Metal barrier material layer 609 Packaging material layer 610

Page 16

Claims (1)

552687 __ 索 号 90101069__ 年月 说 倐 炎 _ 6. Scope of patent application 1. A method for passivation packaging of an organic EL element, comprising: providing a transparent substrate on which a plurality of organics have been formed; An EL element is a pixel and has a plurality of ribs; a protective layer is formed on the surface of the organic EL element and a protective layer is plated, and the protective layer is an inorganic material; a layer or One or more passivation material layers, wherein at least one of the passivation material layers is a polymer layer, and the barrier material layer is directly formed to fill a gap between the organic EL element pixel and the rib material, or to form On the protective layer; coating and sealing the entire surface of the barrier material layer, and coating and covering the barrier material layer with a sealing material. The protective encapsulation method of the organic EL element described in item ^^ 1 of the scope, and the protective layer of the middle layer, is a low temperature chemical vapor deposition plating method, as described in item 1 of the scope of ^^ The material of the organic EL element that has no two layers, such as A10x, can be ^ ~, SiNx, SiOA, Ti〇x, 4 · As for the patent application method, which is described in item 1 The film thickness of the barrier encapsulation side Λ "of the organic EL element is controlled between 1 and 1,000. 552687 ___Case No. 90101069__Year Month Date__ VI. Scope of Patent Application 5. The method for barrier packaging of organic EL elements as described in item 1 of the scope of patent application, wherein the polymer layer material of the passivation material layer 'It can be a polymer layer formed from materials such as thermosetting, UV curing, solvent-free oligomer, sol-gel, or organic / inorganic hybrid materials. 6. The barrier packaging method for the organic EL element according to item 1 of the scope of the patent application, wherein the polymer layer material of the passivation material layer is spray-bonded with a mask pattern or screen printing Coated on the organic EL element in such a manner. 7. The barrier packaging method of the organic EL element as described in item 6 of the scope of the patent application, wherein the number of mask patterns sprayed or screen-printed and the area of the organic EL element formed on the transparent substrate The number is the same and the positions are opposite, and the mask pattern size must be larger than the organic EL element area size. 8 · The barrier packaging method for the organic EL element as described in the first item of the scope of patent application ^ wherein the thickness of the south molecular layer of the passivation material layer is not less than the height of the rib and is controlled. Between 1 and 1 0 0 0 // m. The barrier packaging method of the organic EL element described in item 1 of the scope of the patent application, wherein the material of the one or more layers of the passivation material layer may be a barrier material such as a dielectric material or a metal material. 552687 Amendment No. 90101069 6. Application for Patent Scope 10 · The barrier packaging method for organic el elements described in item 1 of the scope of application for patent. Method 'where the packaging material is Ερ ο X y glue, A cry 1 ic Glue, Si 1 i cone glue or various kinds of heat curing, UV glue and other packaging materials. 11 A passivati packaging structure including an organic EL element, including a transparent substrate, the transparent substrate having a plurality of organic EL element pixels, and having a plurality of ribs; a protective layer, The protective layer is located on the pixel surface of the organic EL element, and the protective layer is an inorganic material; one or more layers of a passivation material layer, wherein at least one of the passivation material layer is a polymer layer And the barrier material layer is directly formed to fill the space between the organic EL element pixel and the rib material, or formed on the protective layer; a packaging material layer is coated to seal the entire surface of the barrier (passivati) material layer surface . 12. The barrier packaging structure of the organic EL element according to item 11 of the scope of the patent application, wherein the protective layer is formed by plating in a low-temperature chemical vapor deposition method. 13. The barrier packaging structure of the organic EL element according to item 11 of the scope of the patent application, wherein the material of the protective layer may be S i 0X, S i Nx, S i 0X Ny, T i 0 Page 19 552687 --- Case No. 901010M_Year Month Date____ Sixth, the scope of patent application x, A 1 Ox and other inorganic materials. 14. The barrier packaging structure of the organic EL element according to item 丨 丨 of the scope of application for patent, wherein the film thickness of the protective layer is controlled between 1 and 10,000A. 15. The barrier packaging structure of the organic EL element according to item 11 of the scope of the patent application, wherein the polymer layer material of the pass i vat ion material layer may be a thermosetting, UV curing, solvent-free type. Polymer layer made of igomer, sol-gei or organic / inorganic hybrid materials. 16. The barrier packaging structure of the organic EL element as described in item 11 of the scope of the patent application, wherein the polymer layer material of the passivati material layer is spray-bonded with a mask pattern (Mask Pat tern) or Screen printing or the like is applied to the organic element element pixels. 17. The barrier packaging structure of the organic EL element according to item 16 of the scope of the patent application, wherein the number of mask patterns of the spray coating or screen printing and the number of organic EL element regions formed on the transparent substrate The size of the mask pattern must be larger than the size of the organic ELS device. 18. The barrier packaging structure of the organic EL element as described in item 丨 丨 of the scope of the patent application, wherein the polymer layer film thickness of the barrier ({) & 5 to " 1: 丨 〇 11) material layer is based on Not less than the height of ribs, and controlled between 1 and 100 #m Page 20 552687 --- tE 90101QRQ_year, month and day 6. Between the scope of patent application 0 1 9 · The barrier packaging structure of organic EL elements as described in item 11 of the scope of patent application, where one or more layers of barrier (pass 丨The material 'of the material layer' may be a barrier material such as a dielectric material or a metal material. 20. The barrier packaging structure of the organic EL element according to item 11 of the scope of the patent application, wherein the packaging material is made of Ep0xy glue, Acry η c glue, Silicone glue, or various types of heat curing, UV glue and other packaging materials. 21. A passivating packaging method for an organic EL element, comprising: providing a transparent substrate on which a plurality of organic EL element pixels have been formed, and having a plurality of ribs A layer of one or more passivation material layers, wherein at least one layer of the passivation material layer is a polymer layer, and the far-off barrier material layer is directly formed to fill the organic EL element pixels and The ribs are formed on the protective layer; the entire surface of the barrier material layer is coated and sealed, and the barrier material layer is covered by coating with a sealing material. 2 2 · The barrier packaging method for an organic el element as described in item 21 of the patent application, wherein the polymer layer material of the passivation material layer may be a thermosetting, UV curing, solvent-free type. ig〇mer 、 s〇 卜 gel 552687 _Case No. 90101069_ Year Month_ Amendment ___ 6. Scope of patent application or polymer layer formed of materials such as organic / inorganic hybrid materials. 2 3 · The method for blocking and sealing the organic EL element according to item 21 of the scope of patent application, wherein the polymer layer material of the pass i vat ion material layer is spray-bonded with a curtain pattern (M ask P a 11 er η) or screen printing on the organic EL element pixels. 24. The method for barrier packaging of an organic EL element as described in item 23 of the scope of the patent application, wherein the number of mask patterns on the sprayed or screen printing and the organic formed on the transparent substrate The number of EL element regions is the same and the positions are opposite, and the mask pattern size must be larger than the organic EL element region size. 25. The method for barrier packaging of an organic EL device as described in item 21 of the scope of patent application, wherein the polymer layer film thickness of the passivation material layer is not less than the height of the rib, And controlled between 1 and 100 V m. 26. The method for blocking and sealing an organic EL element according to item 21 of the scope of the patent application, wherein the material of the one or more layers of the passivation material layer may be a barrier material such as a dielectric material or a metal material. 2 7 · The method for blocking and sealing organic EL elements as described in item 21 of the scope of patent application, wherein the packaging material is made of Epoxy glue, Acrylic glue, 552687 Silicone glue or all kinds of heat curing, UV glue and other packaging materials. 28 · —A passivating package structure of an organic EL element, comprising: a transparent substrate 'the transparent substrate has a plurality of organic EL elements on the substrate' and has a plurality of ribs; a layer or More than one layer of passivation material, of which the passivation material layer is at least one polymer layer, and the delta barrier material layer is directly formed to fill the space between the organic EL element and the rib. 'Or formed on the protective layer; a packaging material layer is coated to seal the entire surface of the barrier (passi ν ati η) material layer. 29. The barrier package of the organic EL element as described in item 28 of the scope of the patent application, wherein the polymer layer material of the passivation material layer may be a thermosetting, UV curing, solvent-free type. 1 i gome r, sol-gei or organic / inorganic hybrid polymer layer. 30. The barrier packaging structure of the organic EL element according to item 28 of the scope of the patent application, wherein the polymer layer material of the barrier (1) 335 丨 port 1 ^ 〇11) material layer is spray-bonded with a curtain pattern (Mask Pat tern) or screen printing on the organic EL element pixels. 3 1 · Barrier packaging of organic EL elements as described in item 30 of the scope of patent application Page 23 552687 ------ 90101069_year, month, month, month, month, month, month, month, month, month, month, month, month, month, month, month, month, month, month, month, month, month, month, month, month, month, month, month, month, month, month, month, month, month, month, month, month, month, month, month, month, month, month, month, month, month, month, month, month, month, month, month, month, month, month to month to month to month to come to, the scope of application for patent, structure The number of organic EL element areas is the same and the positions are relative, and the mask pattern size must be larger than the organic element area size. 32. The barrier packaging structure of the organic EL element described in item 28 of the scope of the patent application, wherein the polymer layer film thickness of the passivating material layer is not less than the height of the rib, And controlled between 1 and 1 0 0 0 // m 0 33. The barrier structure of the organic EL element as described in item 28 of the scope of patent application, wherein more than one layer of passivati ο η material layer The material can be a barrier material such as a dielectric material or a metal material. 3 4 · The barrier packaging structure of the organic EL element as described in item 28 of the scope of patent application, wherein the packaging material is made of ε ρ ο X y glue, A cry 1 ic glue, Si 1 i cone glue or various types Thermal curing, UV glue and other packaging materials. Page 24