[go: up one dir, main page]

TW402166U - Device for deposition of thin layers on a substrate - Google Patents

Device for deposition of thin layers on a substrate

Info

Publication number
TW402166U
TW402166U TW088201776U TW88201776U TW402166U TW 402166 U TW402166 U TW 402166U TW 088201776 U TW088201776 U TW 088201776U TW 88201776 U TW88201776 U TW 88201776U TW 402166 U TW402166 U TW 402166U
Authority
TW
Taiwan
Prior art keywords
deposition
substrate
thin layers
layers
thin
Prior art date
Application number
TW088201776U
Other languages
English (en)
Inventor
Manfred Schuhmacher
Erwin Winter
Andreas Sauer
Dietmar Marquardt
Original Assignee
Leybold Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leybold Ag filed Critical Leybold Ag
Publication of TW402166U publication Critical patent/TW402166U/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02—Manufacture of electrodes or electrode systems
    • H01J9/18—Assembling together the component parts of electrode systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3438—Electrodes other than cathode

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
TW088201776U 1995-04-11 1996-02-10 Device for deposition of thin layers on a substrate TW402166U (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19513691A DE19513691A1 (de) 1995-04-11 1995-04-11 Vorrichtung zum Aufbringen dünner Schichten auf ein Substrat

Publications (1)

Publication Number Publication Date
TW402166U true TW402166U (en) 2000-08-11

Family

ID=7759457

Family Applications (1)

Application Number Title Priority Date Filing Date
TW088201776U TW402166U (en) 1995-04-11 1996-02-10 Device for deposition of thin layers on a substrate

Country Status (9)

Country Link
US (1) US5662784A (zh)
EP (2) EP0737998A3 (zh)
JP (1) JPH08291383A (zh)
KR (1) KR100230072B1 (zh)
CN (1) CN1068639C (zh)
BR (1) BR9601309A (zh)
CA (1) CA2173891A1 (zh)
DE (2) DE19513691A1 (zh)
TW (1) TW402166U (zh)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19715245C2 (de) * 1997-04-12 1999-09-02 Leybold Systems Gmbh Vakuumbehandlungsvorrichtung zum Aufbringen dünner Schichten
DE19734079A1 (de) * 1997-08-07 1999-02-11 Leybold Systems Gmbh Kathode für eine Vorrichtung zum Zerstäuben eines Targets
DE19741708A1 (de) * 1997-09-22 1999-04-01 Leybold Systems Gmbh Vorrichtung zum Aufbringen dünner Schichten auf ein Substrat
DE29717418U1 (de) * 1997-09-26 1998-01-22 Leybold Systems GmbH, 63450 Hanau Vorrichtung zum Aufbringen dünner Schichten auf ein Substrat
DE19755837A1 (de) * 1997-12-16 1999-06-17 Leybold Ag Sputteranlage
US6943066B2 (en) * 2002-06-05 2005-09-13 Advantech Global, Ltd Active matrix backplane for controlling controlled elements and method of manufacture thereof
US7166199B2 (en) * 2002-12-18 2007-01-23 Cardinal Cg Company Magnetron sputtering systems including anodic gas distribution systems
US8500973B2 (en) * 2004-08-20 2013-08-06 Jds Uniphase Corporation Anode for sputter coating
US7879209B2 (en) * 2004-08-20 2011-02-01 Jds Uniphase Corporation Cathode for sputter coating
JPWO2006097994A1 (ja) * 2005-03-14 2008-08-21 株式会社薄膜プロセス スパッタリング装置
KR101174146B1 (ko) * 2005-06-28 2012-08-14 엘지디스플레이 주식회사 스퍼터링 장치
US7850828B2 (en) * 2006-09-15 2010-12-14 Cardinal Cg Company Enhanced virtual anode
US8557093B2 (en) * 2007-03-22 2013-10-15 Sunpower Corporation Deposition system with electrically isolated pallet and anode assemblies
US20090217872A1 (en) * 2008-02-28 2009-09-03 Applied Materials, Inc. Backside coating prevention device, coating chamber device for coating plate-shaped substrates, and method of coating
EP2096192A1 (en) * 2008-02-28 2009-09-02 Applied Materials, Inc. Backside coating prevention device.
CN102002675B (zh) * 2009-08-28 2013-07-03 鸿富锦精密工业（深圳）有限公司 真空溅镀设备的进气装置
CN102623656A (zh) * 2012-04-06 2012-08-01 西北工业大学 一种用于水下航行器电池组的固定器
CN103898462B (zh) * 2012-12-29 2017-08-22 深圳富泰宏精密工业有限公司 磁控溅射镀膜装置
DE102013204132B4 (de) * 2013-03-11 2015-04-02 Von Ardenne Gmbh Vorrichtung zur Anodenhalterung beim Magnetron-Sputtern
JP6189122B2 (ja) * 2013-07-19 2017-08-30 日東電工株式会社 スパッタ装置
CN107208249B (zh) 2015-02-03 2019-08-20 卡迪奈尔镀膜玻璃公司 包括气体分配系统的喷溅装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2522227A1 (de) * 1975-05-20 1976-12-02 Telic Corp Verfahren und vorrichtung zur erzeugung einer glimmentladung
US4407708A (en) * 1981-08-06 1983-10-04 Eaton Corporation Method for operating a magnetron sputtering apparatus
US4425218A (en) * 1982-03-30 1984-01-10 Shatterproof Glass Corporation Gas distribution system for sputtering cathodes
DE3521053A1 (de) * 1985-06-12 1986-12-18 Leybold-Heraeus GmbH, 5000 Köln Vorrichtung zum aufbringen duenner schichten auf ein substrat
DE3800449A1 (de) * 1988-01-09 1989-07-20 Leybold Ag Verfahren und einrichtung zur herstellung magnetooptischer, speicher- und loeschfaehiger datentraeger
US4849087A (en) * 1988-02-11 1989-07-18 Southwall Technologies Apparatus for obtaining transverse uniformity during thin film deposition on extended substrate
DE4006411C2 (de) * 1990-03-01 1997-05-28 Leybold Ag Vorrichtung zum Aufbringen dünner Schichten auf ein Substrat

Also Published As

Publication number Publication date
EP0957507A1 (de) 1999-11-17
KR100230072B1 (ko) 1999-11-15
CN1068639C (zh) 2001-07-18
CN1140206A (zh) 1997-01-15
DE19513691A1 (de) 1996-10-17
US5662784A (en) 1997-09-02
JPH08291383A (ja) 1996-11-05
KR960039050A (ko) 1996-11-21
EP0737998A2 (de) 1996-10-16
BR9601309A (pt) 1998-01-13
CA2173891A1 (en) 1996-10-12
EP0737998A3 (de) 1998-05-13
DE19515088A1 (de) 1997-01-02

Similar Documents

Publication Publication Date Title
TW402166U (en) Device for deposition of thin layers on a substrate
GB2305939B (en) Thermally depositing a composite coating on a substrate
AU1274297A (en) Aligner for a substrate carrier
GB9711080D0 (en) Film or coating deposition on a substrate
GB9809856D0 (en) Process for depositing a layer of material on a substrate and a planting system
GB9225270D0 (en) Depositing different materials on a substrate
AU4605897A (en) A process and apparatus for depositing a carbon-rich coating on a moving substrate
IL119355A0 (en) Method of forming a conductive coating on a substrate
EP0444253A3 (en) Apparatus for the deposition of thin layers on a substrate
AU4681596A (en) Method and devices for laying a thread on a substrate
AU4194896A (en) Apparatus for depositing a layer of material on a substrate
AU1497295A (en) Method of depositing solid substance on a substrate
EP0765020A3 (de) Anordnung zum dichten Umschliessen eines Substrates
AU6574594A (en) Forming a hard layer on a substrate
IL109698A0 (en) A device for etching thin layers
GB9511492D0 (en) Thin film deposition
AU7377094A (en) Device for depositing diamond-like carbon films on a substrate
SG54589A1 (en) Deposition of a thin film on a substrate using a multi-beam source
AU1364697A (en) Overlay for application onto a substrate
EP0470386A3 (en) Method for depositing an inorganic thin film on a substrate
FI953779A7 (fi) Menetelmä ohuen kalvon kerrostamiseksi alustalle käyttämällä etäiskylm ätyppiplasmaa
AU7617896A (en) Process and devices for coating a substrate
AU3582793A (en) Method for depositing a thin film on a semiconductor circuit
GB9525505D0 (en) A method of depositing films on a substrate
GB2335929B (en) Apparatus for depositing a thin film on a substrate

Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees