TW201903108A - Solvent based adhesive composition - Google Patents
Solvent based adhesive composition Download PDFInfo
- Publication number
- TW201903108A TW201903108A TW107114956A TW107114956A TW201903108A TW 201903108 A TW201903108 A TW 201903108A TW 107114956 A TW107114956 A TW 107114956A TW 107114956 A TW107114956 A TW 107114956A TW 201903108 A TW201903108 A TW 201903108A
- Authority
- TW
- Taiwan
- Prior art keywords
- solvent
- adhesive composition
- polyester
- based adhesive
- foregoing
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 126
- 239000000853 adhesive Substances 0.000 title claims abstract description 79
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 79
- 239000002904 solvent Substances 0.000 title claims abstract description 65
- -1 phosphate ester compound Chemical class 0.000 claims abstract description 105
- 229910019142 PO4 Inorganic materials 0.000 claims abstract description 55
- 239000010452 phosphate Substances 0.000 claims abstract description 54
- 239000012948 isocyanate Substances 0.000 claims abstract description 53
- 229920005989 resin Polymers 0.000 claims abstract description 42
- 239000011347 resin Substances 0.000 claims abstract description 42
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims abstract description 42
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 24
- 238000000034 method Methods 0.000 claims abstract description 18
- 238000002156 mixing Methods 0.000 claims abstract description 14
- 239000007787 solid Substances 0.000 claims abstract description 9
- 238000010790 dilution Methods 0.000 claims abstract description 8
- 239000012895 dilution Substances 0.000 claims abstract description 8
- 239000000758 substrate Substances 0.000 claims description 24
- 150000002513 isocyanates Chemical class 0.000 claims description 14
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 12
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 229920005906 polyester polyol Polymers 0.000 claims description 8
- 125000000962 organic group Chemical group 0.000 claims description 5
- 239000007795 chemical reaction product Substances 0.000 claims description 4
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 claims description 2
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 claims description 2
- 229920000098 polyolefin Polymers 0.000 claims description 2
- 238000007865 diluting Methods 0.000 abstract description 2
- 235000021317 phosphate Nutrition 0.000 description 42
- 229920005862 polyol Polymers 0.000 description 38
- 150000003077 polyols Chemical class 0.000 description 35
- 239000002243 precursor Substances 0.000 description 23
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 21
- 238000000576 coating method Methods 0.000 description 13
- 150000001875 compounds Chemical class 0.000 description 13
- 229920000137 polyphosphoric acid Polymers 0.000 description 13
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 12
- 125000004432 carbon atom Chemical group C* 0.000 description 11
- 239000000047 product Substances 0.000 description 11
- 239000011248 coating agent Substances 0.000 description 10
- 125000005442 diisocyanate group Chemical group 0.000 description 9
- 239000000126 substance Substances 0.000 description 9
- 235000011187 glycerol Nutrition 0.000 description 8
- 239000005056 polyisocyanate Substances 0.000 description 8
- 229920001228 polyisocyanate Polymers 0.000 description 8
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 7
- 239000002253 acid Substances 0.000 description 7
- 125000000217 alkyl group Chemical group 0.000 description 7
- 235000013305 food Nutrition 0.000 description 7
- 229920002635 polyurethane Polymers 0.000 description 7
- 239000004814 polyurethane Substances 0.000 description 7
- 125000003118 aryl group Chemical group 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- 239000005025 cast polypropylene Substances 0.000 description 6
- 239000011888 foil Substances 0.000 description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 235000011007 phosphoric acid Nutrition 0.000 description 6
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 5
- 239000005058 Isophorone diisocyanate Substances 0.000 description 5
- 125000001931 aliphatic group Chemical group 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 5
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 5
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 5
- 239000012939 laminating adhesive Substances 0.000 description 5
- 238000004806 packaging method and process Methods 0.000 description 5
- 229920000728 polyester Polymers 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 4
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical compound ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 4
- 125000004429 atom Chemical group 0.000 description 4
- 238000005266 casting Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 229920006255 plastic film Polymers 0.000 description 4
- 239000002985 plastic film Substances 0.000 description 4
- 229920005749 polyurethane resin Polymers 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- DLYUQMMRRRQYAE-UHFFFAOYSA-N tetraphosphorus decaoxide Chemical compound O1P(O2)(=O)OP3(=O)OP1(=O)OP2(=O)O3 DLYUQMMRRRQYAE-UHFFFAOYSA-N 0.000 description 4
- 239000002023 wood Substances 0.000 description 4
- 239000004721 Polyphenylene oxide Substances 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- 238000010411 cooking Methods 0.000 description 3
- 239000000539 dimer Substances 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 238000009472 formulation Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 3
- 229920000570 polyether Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 238000001542 size-exclusion chromatography Methods 0.000 description 3
- 239000013638 trimer Substances 0.000 description 3
- FDYWJVHETVDSRA-UHFFFAOYSA-N 1,1-diisocyanatobutane Chemical compound CCCC(N=C=O)N=C=O FDYWJVHETVDSRA-UHFFFAOYSA-N 0.000 description 2
- VKLNMSFSTCXMSB-UHFFFAOYSA-N 1,1-diisocyanatopentane Chemical compound CCCCC(N=C=O)N=C=O VKLNMSFSTCXMSB-UHFFFAOYSA-N 0.000 description 2
- ATOUXIOKEJWULN-UHFFFAOYSA-N 1,6-diisocyanato-2,2,4-trimethylhexane Chemical compound O=C=NCCC(C)CC(C)(C)CN=C=O ATOUXIOKEJWULN-UHFFFAOYSA-N 0.000 description 2
- QGLRLXLDMZCFBP-UHFFFAOYSA-N 1,6-diisocyanato-2,4,4-trimethylhexane Chemical compound O=C=NCC(C)CC(C)(C)CCN=C=O QGLRLXLDMZCFBP-UHFFFAOYSA-N 0.000 description 2
- WJIOHMVWGVGWJW-UHFFFAOYSA-N 3-methyl-n-[4-[(3-methylpyrazole-1-carbonyl)amino]butyl]pyrazole-1-carboxamide Chemical compound N1=C(C)C=CN1C(=O)NCCCCNC(=O)N1N=C(C)C=C1 WJIOHMVWGVGWJW-UHFFFAOYSA-N 0.000 description 2
- 238000003855 Adhesive Lamination Methods 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- KEZMBAQUUXDDDQ-UHFFFAOYSA-N CCC.N=C=O.N=C=O Chemical compound CCC.N=C=O.N=C=O KEZMBAQUUXDDDQ-UHFFFAOYSA-N 0.000 description 2
- ZHESOIPTRUDICE-UHFFFAOYSA-N CCCCCCCCC.N=C=O.N=C=O.N=C=O Chemical compound CCCCCCCCC.N=C=O.N=C=O.N=C=O ZHESOIPTRUDICE-UHFFFAOYSA-N 0.000 description 2
- NAUBYZNGDGDCHH-UHFFFAOYSA-N N=C=O.N=C=O.CCCC(C)C Chemical compound N=C=O.N=C=O.CCCC(C)C NAUBYZNGDGDCHH-UHFFFAOYSA-N 0.000 description 2
- KYIMHWNKQXQBDG-UHFFFAOYSA-N N=C=O.N=C=O.CCCCCC Chemical compound N=C=O.N=C=O.CCCCCC KYIMHWNKQXQBDG-UHFFFAOYSA-N 0.000 description 2
- OEMVAFGEQGKIOR-UHFFFAOYSA-N N=C=O.N=C=O.CCCCCCCC Chemical compound N=C=O.N=C=O.CCCCCCCC OEMVAFGEQGKIOR-UHFFFAOYSA-N 0.000 description 2
- FUCRTFHCJZBKBB-UHFFFAOYSA-N N=C=O.N=C=O.CCCCCCCCC Chemical compound N=C=O.N=C=O.CCCCCCCCC FUCRTFHCJZBKBB-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000002318 adhesion promoter Substances 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- JGCWKVKYRNXTMD-UHFFFAOYSA-N bicyclo[2.2.1]heptane;isocyanic acid Chemical compound N=C=O.N=C=O.C1CC2CCC1C2 JGCWKVKYRNXTMD-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000013256 coordination polymer Substances 0.000 description 2
- XXKOQQBKBHUATC-UHFFFAOYSA-N cyclohexylmethylcyclohexane Chemical compound C1CCCCC1CC1CCCCC1 XXKOQQBKBHUATC-UHFFFAOYSA-N 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- SNRUBQQJIBEYMU-UHFFFAOYSA-N dodecane Chemical compound CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 2
- STBLQDMGPBQTMI-UHFFFAOYSA-N heptane;isocyanic acid Chemical compound N=C=O.N=C=O.CCCCCCC STBLQDMGPBQTMI-UHFFFAOYSA-N 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- 239000010985 leather Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000000123 paper Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920002098 polyfluorene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000000376 reactant Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- RSJKGSCJYJTIGS-UHFFFAOYSA-N undecane Chemical compound CCCCCCCCCCC RSJKGSCJYJTIGS-UHFFFAOYSA-N 0.000 description 2
- VGHSXKTVMPXHNG-UHFFFAOYSA-N 1,3-diisocyanatobenzene Chemical compound O=C=NC1=CC=CC(N=C=O)=C1 VGHSXKTVMPXHNG-UHFFFAOYSA-N 0.000 description 1
- ROHUXHMNZLHBSF-UHFFFAOYSA-N 1,4-bis(isocyanatomethyl)cyclohexane Chemical compound O=C=NCC1CCC(CN=C=O)CC1 ROHUXHMNZLHBSF-UHFFFAOYSA-N 0.000 description 1
- ALQLPWJFHRMHIU-UHFFFAOYSA-N 1,4-diisocyanatobenzene Chemical compound O=C=NC1=CC=C(N=C=O)C=C1 ALQLPWJFHRMHIU-UHFFFAOYSA-N 0.000 description 1
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 1
- FPWRWTXOOZSCTB-UHFFFAOYSA-N 1-isocyanato-2-[(4-isocyanatocyclohexyl)methyl]cyclohexane Chemical compound C1CC(N=C=O)CCC1CC1C(N=C=O)CCCC1 FPWRWTXOOZSCTB-UHFFFAOYSA-N 0.000 description 1
- LFSYUSUFCBOHGU-UHFFFAOYSA-N 1-isocyanato-2-[(4-isocyanatophenyl)methyl]benzene Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=CC=C1N=C=O LFSYUSUFCBOHGU-UHFFFAOYSA-N 0.000 description 1
- ICLCCFKUSALICQ-UHFFFAOYSA-N 1-isocyanato-4-(4-isocyanato-3-methylphenyl)-2-methylbenzene Chemical compound C1=C(N=C=O)C(C)=CC(C=2C=C(C)C(N=C=O)=CC=2)=C1 ICLCCFKUSALICQ-UHFFFAOYSA-N 0.000 description 1
- SLTRQVXYVXRZTG-UHFFFAOYSA-N CC(CCC)C.N#CO Chemical compound CC(CCC)C.N#CO SLTRQVXYVXRZTG-UHFFFAOYSA-N 0.000 description 1
- SNYXHPGLJPPRHM-UHFFFAOYSA-N CCCCCCCCCC.N=C=O.N=C=O.N=C=O Chemical compound CCCCCCCCCC.N=C=O.N=C=O.N=C=O SNYXHPGLJPPRHM-UHFFFAOYSA-N 0.000 description 1
- QMFJYNOVTQYLTA-UHFFFAOYSA-N CCCCCCCCCCC.N=C=O.N=C=O.N=C=O Chemical compound CCCCCCCCCCC.N=C=O.N=C=O.N=C=O QMFJYNOVTQYLTA-UHFFFAOYSA-N 0.000 description 1
- AWCTXTJHHJEPJE-UHFFFAOYSA-N CCCCCCCCCCCC.N=C=O.N=C=O.N=C=O.N=C=O Chemical compound CCCCCCCCCCCC.N=C=O.N=C=O.N=C=O.N=C=O AWCTXTJHHJEPJE-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- OMRDSWJXRLDPBB-UHFFFAOYSA-N N=C=O.N=C=O.C1CCCCC1 Chemical compound N=C=O.N=C=O.C1CCCCC1 OMRDSWJXRLDPBB-UHFFFAOYSA-N 0.000 description 1
- IXQBIOPGDNZYNA-UHFFFAOYSA-N N=C=O.N=C=O.CC1=CC=CC=C1C1=CC=CC=C1C Chemical compound N=C=O.N=C=O.CC1=CC=CC=C1C1=CC=CC=C1C IXQBIOPGDNZYNA-UHFFFAOYSA-N 0.000 description 1
- HDONYZHVZVCMLR-UHFFFAOYSA-N N=C=O.N=C=O.CC1CCCCC1 Chemical compound N=C=O.N=C=O.CC1CCCCC1 HDONYZHVZVCMLR-UHFFFAOYSA-N 0.000 description 1
- CLWKGFMSGOQXNJ-UHFFFAOYSA-N N=C=O.N=C=O.CCC1(CC)CCCCC1C Chemical compound N=C=O.N=C=O.CCC1(CC)CCCCC1C CLWKGFMSGOQXNJ-UHFFFAOYSA-N 0.000 description 1
- QCJBVWNJRIOSDN-UHFFFAOYSA-N N=C=O.N=C=O.CCC1CCCCC1 Chemical compound N=C=O.N=C=O.CCC1CCCCC1 QCJBVWNJRIOSDN-UHFFFAOYSA-N 0.000 description 1
- GNFBHJRVKAKFNZ-UHFFFAOYSA-N N=C=O.N=C=O.CCCC1CCCCC1 Chemical compound N=C=O.N=C=O.CCCC1CCCCC1 GNFBHJRVKAKFNZ-UHFFFAOYSA-N 0.000 description 1
- DGOMVSNLFKNSAR-UHFFFAOYSA-N N=C=O.N=C=O.CCCCCCCCCC Chemical compound N=C=O.N=C=O.CCCCCCCCCC DGOMVSNLFKNSAR-UHFFFAOYSA-N 0.000 description 1
- DSSJCBOUEXFVFJ-UHFFFAOYSA-N N=C=O.N=C=O.CCCCCCCCCCC Chemical compound N=C=O.N=C=O.CCCCCCCCCCC DSSJCBOUEXFVFJ-UHFFFAOYSA-N 0.000 description 1
- SGXQOOUIOHVMEJ-UHFFFAOYSA-N N=C=O.N=C=O.CCCCCCCCCCCC Chemical compound N=C=O.N=C=O.CCCCCCCCCCCC SGXQOOUIOHVMEJ-UHFFFAOYSA-N 0.000 description 1
- 229920013701 VORANOL™ Polymers 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- WNLRTRBMVRJNCN-UHFFFAOYSA-L adipate(2-) Chemical compound [O-]C(=O)CCCCC([O-])=O WNLRTRBMVRJNCN-UHFFFAOYSA-L 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 229920003232 aliphatic polyester Polymers 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 125000002993 cycloalkylene group Chemical group 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 150000002016 disaccharides Chemical class 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000009459 flexible packaging Methods 0.000 description 1
- 239000003517 fume Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 150000002314 glycerols Chemical class 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- HLJDOURGTRAFHE-UHFFFAOYSA-N isocyanic acid;3,5,5-trimethylcyclohex-2-en-1-one Chemical compound N=C=O.N=C=O.CC1=CC(=O)CC(C)(C)C1 HLJDOURGTRAFHE-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000007644 letterpress printing Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000003550 marker Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 150000002772 monosaccharides Chemical class 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 1
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 description 1
- 125000004437 phosphorous atom Chemical group 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 229910001392 phosphorus oxide Inorganic materials 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 230000036316 preload Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 235000021487 ready-to-eat food Nutrition 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 125000003698 tetramethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- VSAISIQCTGDGPU-UHFFFAOYSA-N tetraphosphorus hexaoxide Chemical compound O1P(O2)OP3OP1OP2O3 VSAISIQCTGDGPU-UHFFFAOYSA-N 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- 150000004072 triols Chemical class 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
- C08G18/50—Polyethers having heteroatoms other than oxygen
- C08G18/5075—Polyethers having heteroatoms other than oxygen having phosphorus
- C08G18/5081—Polyethers having heteroatoms other than oxygen having phosphorus having phosphorus bound to oxygen only
- C08G18/5084—Phosphate compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
- C08G18/12—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step using two or more compounds having active hydrogen in the first polymerisation step
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
- C08G18/50—Polyethers having heteroatoms other than oxygen
- C08G18/5075—Polyethers having heteroatoms other than oxygen having phosphorus
- C08G18/509—Polyethers having heteroatoms other than oxygen having phosphorus having nitrogen in addition to phosphorus
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
- C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
- C08G18/7657—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings
- C08G18/7664—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups
- C08G18/7671—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups containing only one alkylene bisphenyl group
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/06—Polyurethanes from polyesters
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Abstract
Description
本發明係關於溶劑基黏著劑組合物。更特定言之,本發明係關於用於例如高效能層壓黏著劑應用之溶劑基黏著劑組合物,所述組合物呈現對金屬結構(諸如箔)改良的黏著力,及改良的耐熱性及耐化學性。所述溶劑基黏著劑組合物包含經磷酸酯化合物修飾之聚酯-胺基甲酸酯樹脂及脂族異氰酸酯固化劑。本發明進一步係關於用於製備此類溶劑基黏著劑組合物之方法。The present invention relates to a solvent-based adhesive composition. More specifically, the present invention relates to solvent-based adhesive compositions for use in, for example, high-performance laminating adhesive applications, which compositions exhibit improved adhesion to metal structures such as foils, and improved heat resistance and Chemical resistance. The solvent-based adhesive composition includes a polyester-urethane resin modified with a phosphate compound and an aliphatic isocyanate curing agent. The invention further relates to a method for preparing such a solvent-based adhesive composition.
黏著劑組合物適用於各種目的。舉例而言,一些黏著劑用以將基板的層黏附在一起,由此形成包含兩個或多於兩個基板層的層狀結構。將可撓性封裝層壓黏著劑塗覆於層壓膜之間用於封裝食品、藥劑及工業消費品。層壓黏著劑通常可分為三個類別:(1)溶劑基層壓黏著劑,(2)無溶劑層壓黏著劑,及(3)水基層壓黏著劑。在溶劑基類別內,溶劑基聚胺基甲酸酯已廣泛用於達成相對良好的耐熱性、耐潮濕性及耐化學性。The adhesive composition is suitable for various purposes. For example, some adhesives are used to adhere the layers of the substrate together, thereby forming a layered structure including two or more substrate layers. A flexible packaging laminated adhesive is applied between the laminated films for packaging food, pharmaceuticals and industrial consumer products. Laminating adhesives can generally be divided into three categories: (1) solvent-based laminating adhesives, (2) solvent-free laminating adhesives, and (3) water-based laminating adhesives. Within the solvent-based category, solvent-based polyurethanes have been widely used to achieve relatively good heat resistance, moisture resistance, and chemical resistance.
溶劑基黏著劑組合物可用於高效能層製品應用(例如殺菌釜、熱裝罐、蒸煮袋等)中。為了實現此類應用所需之高效能,包含環氧化雙酚A之聚酯系統為常用的。使用雙酚A環氧樹脂最近遇到關於食品包裝之雙酚A基材料感知安全性之監管及使用者挑戰。Solvent-based adhesive compositions can be used in high-performance layered product applications (such as retorts, hot cans, cooking bags, etc.). To achieve the high performance required for such applications, polyester systems containing epoxidized bisphenol A are commonly used. The use of bisphenol A epoxy resins has recently encountered regulatory and user challenges regarding the perceived safety of bisphenol A based materials for food packaging.
因此,需要適用於高效能應用,尤其用於高效能應用中使用之層壓結構之無雙酚A黏著劑組合物。Therefore, there is a need for a bisphenol A-free adhesive composition suitable for high-performance applications, especially for laminated structures used in high-performance applications.
本文揭示溶劑基黏著劑組合物。在一些實施例中,所述溶劑基黏著劑組合物包含:包括(A)聚酯-胺基甲酸酯樹脂及(B)磷酸酯化合物之第一部分及包括(C)脂族異氰酸酯固化劑之第二部分。第二部分之脂族異氰酸酯固化劑(C)交聯第一部分之組分。在一些實施例中,磷酸酯化合物具有結構(I):, (I) 其中R1 為任何有機基。Disclosed herein are solvent-based adhesive compositions. In some embodiments, the solvent-based adhesive composition includes: a first part including (A) a polyester-urethane resin and (B) a phosphate compound and a (C) aliphatic isocyanate curing agent the second part. The aliphatic isocyanate curing agent (C) of the second part crosslinks the components of the first part. In some embodiments, the phosphate compound has structure (I): (I) wherein R 1 is any organic group.
亦揭示用於製備溶劑基黏著劑組合物之方法。所述方法包含提供聚酯-胺基甲酸酯樹脂,提供磷酸酯化合物,將聚酯-胺基甲酸酯樹脂及磷酸酯化合物混合以形成樹脂混合物,在溶劑中稀釋所述樹脂混合物以形成具有以經稀釋之樹脂混合物之總重量計25至55重量百分比之應用固體含量之經稀釋之樹脂混合物,及以100:1至100:12之混合比率(稀釋前的樹脂混合物重量份:脂族異氰酸酯固化劑重量份)用脂族異氰酸酯固化劑固化經稀釋之樹脂混合物。A method for preparing a solvent-based adhesive composition is also disclosed. The method includes providing a polyester-urethane resin, providing a phosphate ester compound, mixing the polyester-urethane resin and the phosphate ester compound to form a resin mixture, and diluting the resin mixture in a solvent to form A diluted resin mixture having an applied solid content of 25 to 55 weight percent based on the total weight of the diluted resin mixture, and a mixing ratio of 100: 1 to 100: 12 (parts by weight of the resin mixture before dilution: aliphatic Isocyanate curing agent parts by weight) The diluted resin mixture is cured with an aliphatic isocyanate curing agent.
所揭示之黏著劑組合物無雙酚A且尤其適用於高效能食品封裝應用中使用之層壓結構,諸如殺菌釜應用、熱裝罐應用及蒸煮袋應用。所揭示之黏著劑組合物尤其適用於高效能應用中使用之層壓結構。The disclosed adhesive composition is bisphenol A-free and is particularly suitable for laminated structures used in high-performance food packaging applications, such as retort applications, hot-fill applications, and retort pouch applications. The disclosed adhesive composition is particularly suitable for laminated structures used in high performance applications.
本文所揭示之溶劑基黏著劑組合物適用於包括兩個或多於兩個可撓性或剛性基板之層壓結構。在一些實施例中,基板可包含低密度或中等密度塑膠(例如選自聚苯乙烯、聚乙烯、ABS、聚胺基甲酸酯、聚對苯二甲酸伸乙酯、聚對苯二甲酸伸丁酯、聚丙烯、聚苯、聚碳酸酯、聚丙烯酸酯、聚氯乙烯、聚碸或其混合物之類型)、紙、木材及復原木材產品、經聚合物塗佈之基板、經蠟塗佈之紙板、卡紙板、粒子板、紡織物、皮革及金屬(例如鋁、二價鐵以及其他非二價鐵)、金屬化塑膠(例如金屬化塑膠膜)或其類似者。在一些實施例中,使用所揭示之溶劑基黏著劑組合物製備之層壓結構可包括多層/基板,各層/基板為本文所描述之材料中之任一者及其類似物。The solvent-based adhesive composition disclosed herein is suitable for a laminated structure including two or more flexible or rigid substrates. In some embodiments, the substrate may comprise a low- or medium-density plastic (eg, selected from polystyrene, polyethylene, ABS, polyurethane, polyethylene terephthalate, polyterephthalate Types of butyl, polypropylene, polybenzene, polycarbonate, polyacrylate, polyvinyl chloride, polyfluorene or mixtures thereof), paper, wood and recovered wood products, polymer coated substrates, wax coated Cardboard, cardboard, particle board, textiles, leather and metals (such as aluminum, ferrous iron and other non-ferrous iron), metalized plastics (such as metalized plastic films), or the like. In some embodiments, a laminated structure prepared using the disclosed solvent-based adhesive composition may include multiple layers / substrates, each layer / substrate being any of the materials described herein and the like.
黏著劑組合物尤其適用於經受殺菌釜處理(例如曝露於120℃或更高溫度30分鐘或更久)、熱灌裝處理(例如曝露於66℃或更高溫度30分鐘或更久)及蒸煮袋處理(例如曝露於100℃或更高溫度30分鐘或更久)(亦即,高效能應用)之層壓結構。在一些實施例中,溶劑基黏著劑組合物可用於金屬食品封裝應用,諸如具有金屬封蓋或可撓性熱密封封蓋之深拉罐(deep drawn can)及容器中。在一些實施例中,溶劑基黏著劑組合物可用於食品小袋,即食食物、罐塗層等中。The adhesive composition is particularly suitable for being subjected to retort treatment (for example, exposure to 120 ° C or higher for 30 minutes or more), hot filling treatment (for example, exposure to 66 ° C or higher for 30 minutes or more), and cooking Laminated structure for bag treatment (eg, exposure to 100 ° C. or higher for 30 minutes or more) (ie, high performance applications). In some embodiments, the solvent-based adhesive composition can be used in metal food packaging applications, such as deep drawn cans and containers with metal closures or flexible heat-sealed closures. In some embodiments, the solvent-based adhesive composition can be used in food pouches, ready-to-eat food, can coatings, and the like.
在一些實施例中,所述溶劑基黏著劑組合物包含:包括(A)聚酯-胺基甲酸酯樹脂及(B)磷酸酯化合物之第一部分及包括(C)脂族異氰酸酯之第二部分。第二部分之脂族異氰酸酯固化劑(C)使第一部分之組分交聯,由此產生聚酯-胺基甲酸酯-聚胺基甲酸酯聚合物網路。In some embodiments, the solvent-based adhesive composition includes: a first part including (A) a polyester-urethane resin and (B) a phosphate compound and a second part including (C) an aliphatic isocyanate section. The aliphatic isocyanate curing agent (C) of the second part crosslinks the components of the first part, thereby producing a polyester-urethane-polyurethane polymer network.
在接觸基板(例如當施加在層壓機器上時)之前混合所揭示之黏著劑組合物之兩個部分。將混合黏著劑施加至一個基板上且在施加另一層基板之前乾燥。層製品可隨後在環境溫度或高溫下固化。第一部分:( A )聚酯 - 胺基甲酸酯樹脂 The two parts of the disclosed adhesive composition are mixed before contacting the substrate (for example when applied on a laminating machine). The mixed adhesive is applied to one substrate and dried before applying another layer of substrate. The layered article can then be cured at ambient or elevated temperatures. A first portion :( A) a polyester - urethane resin
在一些實施例中,溶劑基黏著劑組合物包含包括(A)聚酯-胺基甲酸酯樹脂之第一部分。在一些實施例中,聚酯-胺基甲酸酯樹脂為羥基封端之聚胺基甲酸酯樹脂。適合的羥基封端之聚胺基甲酸酯樹脂可經由異氰酸酯(例如單體異氰酸酯及/或聚異氰酸酯)及聚酯多元醇之反應製備。如本文所使用,「聚異氰酸酯」為含有兩個或多於兩個異氰酸酯基之任何化合物。舉例而言,聚異氰酸酯可包含二聚物、三聚物等。在此類反應中,聚酯多元醇以過量存在以便產生羥基封端之聚胺基甲酸酯樹脂,換言之,羥基與異氰酸酯基之化學計量比率應高於1。In some embodiments, the solvent-based adhesive composition includes a first portion including (A) a polyester-urethane resin. In some embodiments, the polyester-urethane resin is a hydroxy-terminated polyurethane resin. Suitable hydroxy-terminated polyurethane resins can be prepared via the reaction of isocyanates (such as monomeric isocyanates and / or polyisocyanates) and polyester polyols. As used herein, a "polyisocyanate" is any compound containing two or more than two isocyanate groups. For example, the polyisocyanate may include a dimer, a trimer, and the like. In such reactions, the polyester polyol is present in excess in order to produce a hydroxyl-terminated polyurethane resin, in other words, the stoichiometric ratio of hydroxyl to isocyanate groups should be higher than one.
本發明之適用的異氰酸酯包含(但不限於)芳族異氰酸酯、脂族異氰酸酯、環脂族異氰酸酯及其兩者或多於兩者之組合。「芳族異氰酸酯」為含有鍵結至芳基之異氰酸酯基且含有一或多個芳族環之異氰酸酯。「脂族聚異氰酸酯」為含有鍵結至脂族基之異氰酸酯基(其可鍵結至其他脂族基)、環脂族基或芳族環(基團)之異氰酸酯。「環脂族聚異氰酸酯」為脂族異氰酸酯之子組,其中化學鏈為環結構化的。Suitable isocyanates of the present invention include, but are not limited to, aromatic isocyanates, aliphatic isocyanates, cycloaliphatic isocyanates, and combinations of two or more thereof. An "aromatic isocyanate" is an isocyanate containing an isocyanate group bonded to an aryl group and containing one or more aromatic rings. An "aliphatic polyisocyanate" is an isocyanate containing an isocyanate group (which can be bonded to other aliphatic groups), a cycloaliphatic group, or an aromatic ring (group) bonded to an aliphatic group. "Cycloaliphatic polyisocyanates" are a subgroup of aliphatic isocyanates in which the chemical chain is ring-structured.
適合的芳族異氰酸酯包含(但不限於)二異氰酸1,3-伸苯酯與二異氰酸1,4-伸苯酯、二異氰酸1,5-伸萘酯、二異氰酸2,6-甲苯酯(「2,6-TDI」)、二異氰酸2,4-甲苯酯(「2,4-TDI」)、2,4′-二苯基甲烷二異氰酸酯(「2,4′-MDI」)、4,4′-二苯基甲烷二異氰酸酯(「4,4′-MDI」)、3,3′-二甲基-4,4′-聯苯二異氰酸酯(「TODI」)及其兩者或多於兩者之混合物。Suitable aromatic isocyanates include, but are not limited to, 1,3-phenylene diisocyanate and 1,4-phenylene diisocyanate, 1,5-naphthyl diisocyanate, and diisocyanate. Acid 2,6-tolyl ester ("2,6-TDI"), 2,4-tolyl diisocyanate ("2,4-TDI"), 2,4'-diphenylmethane diisocyanate (" 2,4′-MDI ”), 4,4′-diphenylmethane diisocyanate (“ 4,4′-MDI ”), 3,3′-dimethyl-4,4′-biphenyl diisocyanate ( "TODI") or a mixture of two or more of them.
適合的脂族異氰酸酯具有直鏈或分支鏈亞烷基殘基中之3至16個碳原子或4至12個碳原子,諸如二異氰酸己二酯(「 HDI 」) 、1,4-二異氰酸酯基丁烷、二異氰酸1,3-二甲苯酯(「1,3-XDI」)及二異氰酸1,4-二甲苯酯(「1,4-XDI」)。適合的環脂族異氰酸酯在伸環烷基殘基中具有4至18個碳原子或6至15個碳原子。環脂族二異氰酸酯係指環結合及脂族結合之NCO基團,諸如異佛酮二異氰酸酯(「IPDI」)、1,3/1,4-二異氰酸酯基環己烷1,3-/1,4-雙(異氰酸酯基甲基)環己烷及二異氰酸基二環己基甲烷(「H12 MDI」)。Suitable aliphatic isocyanates have 3 to 16 carbon atoms or 4 to 12 carbon atoms in a linear or branched alkylene residue, such as hexamethylene diisocyanate (" HDI ") , 1,4- Diisocyanate butane, 1,3-xylyl diisocyanate ("1,3-XDI") and 1,4-xylyl diisocyanate ("1,4-XDI"). Suitable cycloaliphatic isocyanates have 4 to 18 carbon atoms or 6 to 15 carbon atoms in the cycloalkylene residue. Cycloaliphatic diisocyanate refers to ring-bound and aliphatic-bound NCO groups, such as isophorone diisocyanate ("IPDI"), 1,3 / 1,4-diisocyanate cyclohexane 1,3- / 1, 4-bis (isocyanatomethyl) cyclohexane and diisocyanatodicyclohexylmethane ("H 12 MDI").
適合的脂族及環脂族異氰酸酯包含(但不限於)環己烷二異氰酸酯、甲基環己烷二異氰酸酯、乙基環己烷二異氰酸酯、丙基環己烷二異氰酸酯、甲基二乙基環己烷二異氰酸酯、丙烷二異氰酸酯、丁烷二異氰酸酯、戊烷二異氰酸酯、己烷二異氰酸酯、庚烷二異氰酸酯、辛烷二異氰酸酯、壬烷二異氰酸酯、壬烷三異氰酸酯(諸如4-異氰酸酯基甲基-1,8-辛烷二異氰酸酯(「TIN」))、癸烷二異氰酸酯及癸烷三異氰酸酯、十一烷二異氰酸酯與十一烷三異氰酸酯及十二烷二異氰酸酯與十二烷三異氰酸酯、異佛酮二異氰酸酯(「IPDI」)、二異氰酸六亞甲酯(「HDI」)、二異氰酸酯基二環己基甲烷(「H12 MDI」)、2-甲基戊烷二異氰酸酯(「MPDI」)、二異氰酸2,2,4-三甲基六亞甲酯/二異氰酸2,4,4-三甲基六亞甲酯(「TMDI」)、降冰片烷二異氰酸酯(「NBDI」)、二異氰酸二甲苯酯(「XDI」)、二異氰酸四甲基二甲苯酯及其兩者或多於兩者之二聚體、三聚體及混合物。Suitable aliphatic and cycloaliphatic isocyanates include, but are not limited to, cyclohexane diisocyanate, methylcyclohexane diisocyanate, ethylcyclohexane diisocyanate, propylcyclohexane diisocyanate, methyldiethyl Cyclohexane diisocyanate, propane diisocyanate, butane diisocyanate, pentane diisocyanate, hexane diisocyanate, heptane diisocyanate, octane diisocyanate, nonane diisocyanate, nonane triisocyanate, such as Methyl-1,8-octane diisocyanate ("TIN"), decane diisocyanate and decane triisocyanate, undecane diisocyanate and undecane triisocyanate, and dodecane diisocyanate and dodecane triisocyanate Isocyanate, isophorone diisocyanate ("IPDI"), hexamethylene diisocyanate ("HDI"), diisocyanate dicyclohexylmethane ("H 12 MDI"), 2-methylpentane diisocyanate ("MPDI"), 2,2,4-trimethylhexamethylene diisocyanate / 2,4,4-trimethylhexamethylene diisocyanate ("TMDI"), norbornane Diisocyanate ("NBDI"), diisocyanate Acid ditolyl ester ("XDI"), tetramethyl ditolyl diisocyanate, and dimers, trimers, and mixtures of two or more thereof.
根據本發明適用之額外異氰酸酯包含(但不限於)4-甲基-環己烷1,3-二異氰酸酯、二異氰酸2-丁基-2-乙基伸戊酯、異氰酸3(4)-異氰酸酯基甲基-1-甲基環己酯、異氰酸2-異氰酸酯基丙基環己酯、2,4′-亞甲基雙(環己基)二異氰酸酯、1,4-二異氰酸-4-甲基-戊烷及其兩者或多於兩者之混合物。Additional isocyanates suitable according to the invention include, but are not limited to, 4-methyl-cyclohexane 1,3-diisocyanate, 2-butyl-2-ethylpentyl diisocyanate, and isocyanate 3 (4 ) -Isocyanate methyl-1-methylcyclohexyl, 2-isocyanate propylcyclohexyl isocyanate, 2,4′-methylene bis (cyclohexyl) diisocyanate, 1,4-diiso 4-methyl-pentane cyanate and a mixture of two or more thereof.
如本文所使用,「多元醇」係指每分子具有兩個或多於兩個羥基(亦即,-OH)之化合物。如本文所使用,「酯」係指含有酯鍵之化合物。如本文所使用,「聚酯」係指每分子含有兩個或多於兩個酯鍵之化合物。作為聚酯及多元醇之化合物為「聚酯多元醇」。脂族聚酯多元醇為在其分子中不含芳族環之聚酯多元醇。芳族聚酯多元醇為在其分子中含有一或多個芳族環之聚酯多元醇。As used herein, "polyol" refers to a compound having two or more hydroxyl groups (ie, -OH) per molecule. As used herein, "ester" refers to a compound containing an ester bond. As used herein, "polyester" refers to a compound containing two or more ester bonds per molecule. The compound of polyester and polyol is "polyester polyol". An aliphatic polyester polyol is a polyester polyol which does not contain an aromatic ring in its molecule. Aromatic polyester polyols are polyester polyols that contain one or more aromatic rings in their molecules.
在一些實施例中,聚酯-胺基甲酸酯樹脂佔聚酯-胺基甲酸酯樹脂(A)及磷酸酯(B)之總重量之65至99.5重量百分比。在一些實施例中,聚酯-胺基甲酸酯樹脂佔聚酯-胺基甲酸酯樹脂(A)及磷酸酯(B)之總重量之95至99重量百分比。In some embodiments, the polyester-urethane resin accounts for 65 to 99.5 weight percent of the total weight of the polyester-urethane resin (A) and the phosphate ester (B). In some embodiments, the polyester-urethane resin accounts for 95 to 99 weight percent of the total weight of the polyester-urethane resin (A) and the phosphate ester (B).
根據本發明適用之聚酯-胺基甲酸酯樹脂之可商購實例包含可購自陶氏化學公司(The Dow Chemical Company)之ADCOTE™ 811A EA。第一部分 :( B ) 磷酸酯化合物 Commercially available examples of polyester-urethane resins suitable for use in accordance with the present invention include ADCOTE ™ 811A EA, which is available from The Dow Chemical Company. Part I : ( B ) Phosphate Ester Compound
在一些實施例中,溶劑基黏著劑組合物包含包括(B)磷酸酯化合物之第一部分。在不受理論束縛之情況下,據認為,聚酯-胺基甲酸酯樹脂(A)及磷酸酯化合物(B)經由羥基與異氰酸酯官能基之間的反應與異氰酸酯固化反應劑(C)反應以產生均勻聚酯-胺基甲酸酯-聚胺基甲酸酯網路。另外,磷酸酯化合物之磷酸酯官能基與金屬膜、經金屬氧化物塗佈之膜或聚合物膜上之反應性位點反應/複合以改良黏著力。In some embodiments, the solvent-based adhesive composition includes a first portion including (B) a phosphate compound. Without being bound by theory, it is believed that the polyester-urethane resin (A) and the phosphate compound (B) react with the isocyanate curing reagent (C) via a reaction between a hydroxyl group and an isocyanate functional group. To produce a uniform polyester-urethane-polyurethane network. In addition, the phosphate functional group of the phosphate compound reacts / complexes with a reactive site on a metal film, a metal oxide-coated film, or a polymer film to improve adhesion.
在一些實施例中,磷酸酯化合物佔聚酯-胺基甲酸酯樹脂(A)及磷酸酯化合物(B)之總重量之0.5至35重量百分比。在一些實施例中,磷酸酯佔聚酯-胺基甲酸酯樹脂(A)及磷酸酯化合物(B)之總重量之0.5至5重量百分比。In some embodiments, the phosphoric acid ester compound accounts for 0.5 to 35 weight percent of the total weight of the polyester-urethane resin (A) and the phosphoric acid ester compound (B). In some embodiments, the phosphate ester is 0.5 to 5 weight percent of the total weight of the polyester-urethane resin (A) and the phosphate ester compound (B).
在一些實施例中,磷酸酯化合物具有結構(I):, (I) 其中R1 為任何有機基。除了結構(I)中所展示之側基之外,R1 可或可不具有一或多個額外側接-OH基團,且R1 可或可不具有結構(I)之一或多個額外側基。-OH基團及結構(I)之基團中之任何兩個或多於兩個可或可不連接至R1 之同一原子。較佳地,各-OH基團及結構(I)中之各基團連接至R1 之單獨原子。In some embodiments, the phosphate compound has structure (I): (I) wherein R 1 is any organic group. In addition to the pendant groups shown in Structure (I), R 1 may or may not have one or more additional pendant -OH groups, and R 1 may or may not have one or more additional pendants of Structure (I) base. Any two or more of the -OH group and the group of structure (I) may or may not be connected to the same atom of R 1 . Preferably, each -OH group and each group in structure (I) are connected to a separate atom of R 1 .
表徵R1 之適宜方式為描述具有結構(II)之化合物:, (II) 其中R1 與結構(I)中相同。具有結構(II)之化合物本文中已知為「前驅體多元醇」。A suitable way to characterize R 1 is to describe a compound having structure (II): (II) where R 1 is the same as in structure (I). Compounds having structure (II) are known herein as "precursor polyols".
在一些實施例中,適合的前驅體多元醇具有90或更高,或200或更高,或400或更高之數目平均分子量。在一些實施例中,適合的前驅體多元醇具有4,000或更低,或2,000或更低,或1,200或更低,或900或更低,或500或更低之數目平均分子量。在一些實施例中,適合的前驅體多元醇具有200至4,000,或400至2,000,或400至1,200,或400至900之數目平均分子量。In some embodiments, a suitable precursor polyol has a number average molecular weight of 90 or higher, or 200 or higher, or 400 or higher. In some embodiments, a suitable precursor polyol has a number average molecular weight of 4,000 or less, or 2,000 or less, or 1,200 or less, or 900 or less, or 500 or less. In some embodiments, a suitable precursor polyol has a number average molecular weight of 200 to 4,000, or 400 to 2,000, or 400 to 1,200, or 400 to 900.
在一些實施例中,適合的前驅體多元醇為烷基更高多元醇、單醣、雙醣及具有結構(III)之化合物:, (III) 其中R2 、R3 、R4 及R5 中之每一者彼此獨立地為任何有機基;n1 、n2 及n3 中之每一者彼此獨立地為0至10之整數。除了結構(III)中所展示之側基之外,R2 可或可不具有一或多個額外側基。進一步理解,側基中之任何兩個或多於兩個可或可不連接至R2 之同一原子。在一些實施例中,存在具有結構(III)之化合物之混合物,其中結構(III)之化合物之n1 、n2 及n3 中之一或多者之值彼此不同。本文藉由闡述參數n1 、n2 或n3 之非整數值描述此類混合物,其中非整數值表示所述參數之數目平均值。當需要評估此類混合物之分子量時,使用數目平均分子量。In some embodiments, suitable precursor polyols are higher alkyl polyols, monosaccharides, disaccharides, and compounds having structure (III): (III) wherein each of R 2 , R 3 , R 4 and R 5 is independently any organic group; each of n 1 , n 2 and n 3 is independently 0 to 10 each Integer. In addition to the pendant groups shown in structure (III), R 2 may or may not have one or more additional pendant groups. It is further understood that any two or more of the pendant groups may or may not be attached to the same atom of R 2 . In some embodiments, there is a mixture of compounds having the structure (III), wherein the values of one or more of n 1 , n 2, and n 3 of the compound of the structure (III) are different from each other. Such mixtures are described herein by describing the non-integer values of the parameters n 1 , n 2 or n 3 , where the non-integer values represent the average number of the parameters. When it is necessary to evaluate the molecular weight of such a mixture, a number average molecular weight is used.
在具有結構(III)之前驅體多元醇中,較佳地,各側基連接至R2 之單獨原子。In the precursor polyol having structure (III), preferably, each pendant group is connected to a separate atom of R 2 .
在具有結構(III)之前驅體多元醇中,較佳地,R3 、R4 及R5 中之一或多者為具有1至4個碳原子,或2至3個碳原子,或3個碳原子之烴基。在具有結構(III)之前驅體多元醇中,較佳地,R3 、R4 及R5 中之一或多者為烷基,其可為直鏈或環狀或分支鏈的或其組合;更佳地,R3 、R4 及R5 中之一或多者為直鏈或分支鏈烷基;更佳地,R3 、R4 及R5 中之一或多者為分支鏈烷基。較佳地,R3 、R4 及R5 彼此相同。In the precursor polyol having structure (III), preferably, one or more of R 3 , R 4 and R 5 are those having 1 to 4 carbon atoms, or 2 to 3 carbon atoms, or 3 Hydrocarbon group of 1 carbon atom. In the precursor polyol having structure (III), preferably, one or more of R 3 , R 4 and R 5 is an alkyl group, which may be linear or cyclic or branched or a combination thereof ; More preferably, one or more of R 3 , R 4, and R 5 are linear or branched alkyl groups; more preferably, one or more of R 3 , R 4, and R 5 are branched alkanes; base. Preferably, R 3 , R 4 and R 5 are the same as each other.
在具有結構(III)之前驅體多元醇中,較佳地,n1 、n2 及n3 中之一或多者為0至8。在具有結構(III)之前驅體多元醇中,較佳地,n1 、n2 及n3 中之一或多者為1或大於1。在具有結構(III)之前驅體多元醇中,較佳地,n1 、n2 及n3 中之一或多者為6或小於6。在具有結構(III)之前驅體多元醇中,較佳地,n1 、n2 及n3 彼此相同。In the precursor polyol having the structure (III), preferably, one or more of n 1 , n 2 and n 3 are 0 to 8. In the precursor polyol having the structure (III), it is preferable that one or more of n 1 , n 2 and n 3 is 1 or more. In the precursor polyol having the structure (III), it is preferable that one or more of n 1 , n 2 and n 3 is 6 or less. In the precursor polyol having the structure (III), preferably, n 1 , n 2 and n 3 are the same as each other.
具有結構(III)之前驅體多元醇之較佳群組為其中R2 、R3 、R4 及R5 中之每一者為烷基之化合物;此類前驅體多元醇在本文中已知為烷氧基化烷基三醇。在三醇中,當n1 、n2 及n3 中之至少一者為1或大於1且R2 具有結構(IV)時:, (IV) 則三醇在本文中已知為烷氧基化丙三醇。在烷氧基化三醇中,當R3 、R4 及R5 中之每一者為恰好具有3個碳原子之分支鏈烷基時,烷氧基化三醇在本文中已知為丙氧基化三醇。丙氧基化三醇(其中R2 具有結構(IV))在本文中已知為丙氧基化丙三醇。A preferred group of precursor polyols having structure (III) are compounds in which each of R 2 , R 3 , R 4, and R 5 is an alkyl group; such precursor polyols are known herein Is an alkoxylated alkyltriol. In triol, when at least one of n 1 , n 2 and n 3 is 1 or more and R 2 has a structure (IV): (IV) The triol is known herein as an alkoxylated glycerol. In alkoxylated triols, when each of R 3 , R 4 and R 5 is a branched chain alkyl group having exactly 3 carbon atoms, the alkoxylated triol is known herein as prop Oxytriol. A propoxylated triol (wherein R 2 has the structure (IV)) is known herein as a propoxylated glycerol.
在為烷基更高多元醇之前驅體多元醇中,較佳為具有10個或更少碳原子彼等者;更佳為具有6個或更少碳原子之彼等者;更佳為具有3個或更少碳原子之彼等者;更佳為丙三醇。Among the precursor polyols which are higher alkyl polyols, those having 10 or fewer carbon atoms are preferred; those having 6 or fewer carbon atoms are more preferred; Those of 3 or less carbon atoms; more preferably glycerol.
更佳前驅體多元醇為烷基更高多元醇及具有結構(III)之化合物。應注意,若n1 =n2 =n3 =0且R2 為烷基或具有羥基之烷基,則具有結構IV之化合物為烷基更高多元醇。More preferred precursor polyols are higher alkyl polyols and compounds having structure (III). It should be noted that if n 1 = n 2 = n 3 = 0 and R 2 is an alkyl group or an alkyl group having a hydroxyl group, the compound having the structure IV is an alkyl higher polyol.
前驅體多元醇之較佳群組為烷基三醇及烷氧基化烷基三醇。其中,更佳為丙三醇及烷氧基化甘油;更佳為烷氧基化甘油。在烷氧基化甘油中,較佳為丙氧基化甘油。Preferred groups of precursor polyols are alkyltriols and alkoxylated alkyltriols. Of these, glycerol and alkoxylated glycerol are more preferred; alkoxylated glycerol is more preferred. Among the alkoxylated glycerols, propoxylated glycerol is preferred.
適合的磷酸酯化合物之另一等級為含有胺基甲酸酯鍵之彼等者。含有胺基甲酸酯鍵之磷酸酯化合物藉由使一或多種適合的磷酸酯官能性多元醇與一或多種聚異氰酸酯(較佳地包含一或多種二異氰酸酯)反應來製得。較佳地,聚異氰酸酯之量保持足夠低以使得反應產物中之一些或全部為磷酸酯官能性多元醇。或者,多元醇可首先與聚異氰酸酯反應以製得隨後與聚磷酸反應之-OH封端的預聚物。具有胺基甲酸酯鍵之磷酸酯化合物將具有在1,000至6,000範圍內且較佳在1,200至4,000範圍內,且更佳在1,400至3,000範圍內之數目平均分子量。Another class of suitable phosphate compounds are those containing urethane bonds. Phosphate compounds containing urethane bonds are prepared by reacting one or more suitable phosphate-functional polyols with one or more polyisocyanates, preferably containing one or more diisocyanates. Preferably, the amount of polyisocyanate is kept low enough that some or all of the reaction products are phosphate-functional polyols. Alternatively, the polyol may be first reacted with a polyisocyanate to make an -OH terminated prepolymer which is then reacted with polyphosphoric acid. A phosphate compound having a urethane bond will have a number average molecular weight in the range of 1,000 to 6,000, preferably in the range of 1,200 to 4,000, and more preferably in the range of 1,400 to 3,000.
在一些實施例中,磷酸酯化合物為包含前驅體多元醇及磷酸類型酸之反應物、具有結構(I)之磷酸酯化合物之反應產物。In some embodiments, the phosphate compound is a reactant comprising a precursor polyol and a phosphoric acid-type acid, and a reaction product of a phosphate compound having structure (I).
較佳地,選擇磷酸類型酸及前驅體多元醇之量以測定如下Mp :Mx 比率: Mhy =每分子前驅體多元醇之羥基數目 Nx = Mhy - 2 Mx =(前驅體多元醇莫耳)×(Nx ) Mp =磷酸類型酸中所含有之磷原子之莫耳Preferably, the amount of phosphoric acid and precursor polyol is selected to determine the ratio of M p : M x as follows: M hy = number of hydroxyl groups per molecule of precursor polyol N x = M hy -2 M x = (precursor Polyol Morr) × (N x ) M p = Morr of phosphorus atom contained in phosphoric acid
在一些實施例中,Mp :Mx 之比率為0.1:1或更高,或0.2:1或更高,或0.5:1或更高,或0.75:1或更高。在一些實施例中,Mp :Mx 之比率為1.1:1或更小。In some embodiments, the ratio of M p : M x is 0.1: 1 or higher, or 0.2: 1 or higher, or 0.5: 1 or higher, or 0.75: 1 or higher. In some embodiments, the ratio of M p : M x is 1.1: 1 or less.
在一些實施例中,磷酸類型酸與前驅體多元醇之重量比為0.005:1或更高,或0.01:1或更高,或0.02:1或更高。在一些實施例中,磷酸類型酸與前驅體多元醇之重量比為0.3:1或更低,或0.2:1或更低,或0.12:1或更低。In some embodiments, the weight ratio of phosphoric acid-type acid to precursor polyol is 0.005: 1 or higher, or 0.01: 1 or higher, or 0.02: 1 or higher. In some embodiments, the weight ratio of phosphoric acid-type acid to precursor polyol is 0.3: 1 or less, or 0.2: 1 or less, or 0.12: 1 or less.
在一些實施例中,磷酸類型酸含有聚磷酸。在一些實施例中,磷酸類型酸中之聚磷酸之量為以磷酸類型酸之重量計75重量%或更多,或80重量%或更多,或90重量%或更多。可購得各種等級之聚磷酸;各等級藉由百分比表徵。為了測定等級,首先認識到,純單體正磷酸、五氧化磷之含量考慮為72.4%。亦可分析任何等級之聚磷酸以考慮一莫耳聚磷酸(分子量標記「Fppa」)含有五氧化磷標記「Nppo」之莫耳數,且藉由PCppo=(Nppo×142)/Fppa給出五氧化磷百分比(「PCppo」),表示為百分比。隨後,聚磷酸等級為比率,表示為百分比:等級=PCppo/72.4。In some embodiments, the phosphoric acid contains a polyphosphoric acid. In some embodiments, the amount of polyphosphoric acid in the phosphoric acid-type acid is 75 wt% or more, or 80 wt% or more, or 90 wt% or more based on the weight of the phosphoric acid. Various grades of polyphosphoric acid are available; each grade is characterized by percentage. In order to determine the grade, it was first recognized that the content of pure monomer orthophosphoric acid and phosphorus pentoxide was considered to be 72.4%. Polyphosphoric acid of any grade can also be analyzed to consider the molar number of a mole polyphosphoric acid (molecular weight marker "Fppa") containing phosphorus pentoxide labeled "Nppo", and given by PCppo = (Nppo × 142) / Fppa Percent phosphorus oxide ("PCppo") expressed as a percentage. The polyphosphoric acid grade is then a ratio, expressed as a percentage: grade = PCppo / 72.4.
在一些實施例中,使用具有100%或更高,或110%或更高等級之聚磷酸。在一些實施例中,使用具有150%或更低,或125%或更低之等級之聚磷酸。In some embodiments, polyphosphoric acid having a grade of 100% or higher, or 110% or higher is used. In some embodiments, polyphosphoric acid having a grade of 150% or less, or 125% or less is used.
在一些實施例中,除了一或多種磷酸酯官能性多元醇之外,所揭示之溶劑基黏著劑組合物亦含有一或多種無磷多元醇。In some embodiments, in addition to one or more phosphate-functional polyols, the disclosed solvent-based adhesive composition also contains one or more phosphorus-free polyols.
關於適合的磷酸酯及其製備之其他資訊可見於PCT公開案第WO/2015/168670號中,其以全文引用的方式併入本文中。第二部分:( C )脂族異氰酸酯固化劑 Additional information on suitable phosphates and their preparation can be found in PCT Publication No. WO / 2015/168670, which is incorporated herein by reference in its entirety. Part II: ( C ) aliphatic isocyanate curing agent
在一些實施例中,溶劑基黏著劑組合物包含包括脂族異氰酸酯固化劑(C)之第二部分。在一些實施例中,聚酯-胺基甲酸酯樹脂(A)及磷酸酯化合物(B)組合形成樹脂混合物。在溶劑中稀釋樹脂混合物以形成具有以經稀釋之樹脂混合物之總重量計25至55重量百分比,或30至45重量百分比,或35至40重量百分比之應用固體含量之經稀釋之樹脂混合物。經稀釋之樹脂混合物可隨後以100:1至100:12之混合比率(稀釋前的樹脂混合物重量份:脂族異氰酸酯固化劑重量份)用脂族異氰酸酯固化劑(C)固化。In some embodiments, the solvent-based adhesive composition includes a second portion including an aliphatic isocyanate curing agent (C). In some embodiments, the polyester-urethane resin (A) and the phosphate compound (B) are combined to form a resin mixture. The resin mixture is diluted in a solvent to form a diluted resin mixture having an applied solid content of 25 to 55 weight percent, or 30 to 45 weight percent, or 35 to 40 weight percent based on the total weight of the diluted resin mixture. The diluted resin mixture may then be cured with an aliphatic isocyanate curing agent (C) at a mixing ratio of 100: 1 to 100: 12 (parts by weight of the resin mixture before dilution: parts by weight of the aliphatic isocyanate curing agent).
所採用之脂族異氰酸酯可為任何適合的脂族異氰酸酯。適合的脂族異氰酸酯包含(但不限於)丙烷二異氰酸酯、丁烷二異氰酸酯、戊烷二異氰酸酯、己烷二異氰酸酯、庚烷二異氰酸酯、辛烷二異氰酸酯、壬烷二異氰酸酯、壬烷三異氰酸酯(諸如4-異氰酸酯基甲基-1,8-辛烷二異氰酸酯(「TIN」))、癸烷二及三異氰酸酯、十一烷二及三異氰酸酯、十二烷二及三異氰酸酯、異佛酮二異氰酸酯(「IPDI」)、二異氰酸己二酯(「HDI」)、二異氰酸基二環己基甲烷(「H12 MDI」)、2-甲基戊烷二異氰酸酯(「MPDI」)、二異氰酸2,2,4-三甲基六亞甲酯/二異氰酸2,4,4-三甲基六亞甲酯(「TMDI」)、降冰片烷二異氰酸酯(「NBDI」)、二異氰酸二甲酯(「XDI」)、二異氰酸四甲基二甲苯酯及其兩者或多於兩者之二聚體、三聚體及混合物。The aliphatic isocyanate used may be any suitable aliphatic isocyanate. Suitable aliphatic isocyanates include, but are not limited to, propane diisocyanate, butane diisocyanate, pentane diisocyanate, hexane diisocyanate, heptane diisocyanate, octane diisocyanate, nonane diisocyanate, nonane triisocyanate ( Such as 4-isocyanatomethyl-1,8-octane diisocyanate ("TIN"), decane di and triisocyanate, undecane di and triisocyanate, dodecane di and triisocyanate, isophorone di Isocyanate ("IPDI"), diisocyanate adipate ("HDI"), diisocyanate dicyclohexylmethane ("H 12 MDI"), 2-methylpentane diisocyanate ("MPDI") 2,2,4-trimethylhexamethylene diisocyanate / 2,4,4-trimethylhexamethylene diisocyanate ("TMDI"), norbornane diisocyanate ("NBDI "), Dimethyl diisocyanate (" XDI "), tetramethylxylyl diisocyanate, and dimers, trimers, and mixtures of two or more thereof.
如自前述收集,本發明預期採用兩個部分,其較佳地在塗覆至基板之前或期間使用適合的混合器(例如電動、氣動或以其他方式提供動力之機械混合器)混合以形成黏著劑組合物。混合可在製程中任何適合的時間進行,諸如在塗覆製程之前、期間或作為塗覆製程之結果。所有本發明步驟可在環境室溫條件下進行。按需要可採用加熱或冷卻。As collected from the foregoing, the present invention contemplates the use of two parts, which are preferably mixed using a suitable mixer (such as an electric, pneumatic, or otherwise powered mechanical mixer) before or during coating to the substrate to form an adhesive剂 组合 物。 Composition. Mixing can occur at any suitable time in the process, such as before, during, or as a result of the coating process. All steps of the invention can be carried out at ambient room temperature. Heating or cooling can be used as required.
本文揭示用於製備溶劑基黏著劑組合物之方法。在一些實施例中,提供聚酯-胺基甲酸酯樹脂,提供磷酸酯化合物,將聚酯-胺基甲酸酯樹脂及磷酸酯化合物混合以形成樹脂混合物,在溶劑中稀釋樹脂混合物以形成具有以經稀釋之樹脂混合物之總重量計25至55重量百分比,或30至45重量百分比,或35至40重量百分比之應用固體含量之經稀釋之樹脂混合物,且以100:1至100:12,或100:4至100:10之混合比率(稀釋前的樹脂混合物重量份:脂族異氰酸酯固化劑重量份)用脂族異氰酸酯固化劑固化經稀釋之樹脂混合物。Methods for preparing solvent-based adhesive compositions are disclosed herein. In some embodiments, a polyester-urethane resin is provided, a phosphate compound is provided, the polyester-urethane resin and the phosphate compound are mixed to form a resin mixture, and the resin mixture is diluted in a solvent to form A diluted resin mixture having an applied solid content of 25 to 55 weight percent, or 30 to 45 weight percent, or 35 to 40 weight percent, based on the total weight of the diluted resin mixture, and 100: 1 to 100: 12 , Or a mixing ratio of 100: 4 to 100: 10 (parts by weight of the resin mixture before dilution: parts by weight of the aliphatic isocyanate curing agent) the diluted resin mixture is cured with the aliphatic isocyanate curing agent.
所揭示之黏著劑組合物適用於將基板黏合在一起。基板可為類似材料或不同材料。複數個基板層之濕式及乾式黏合層壓為可能的。所揭示之黏著劑組合物可使用習知塗覆技術塗覆至所期望的基板,所述塗覆技術諸如輪轉凹版印刷、彈性凸版印刷、習知或無空氣噴塗、滾塗法、刷塗、繞線棒塗、刮刀塗法或塗佈製程,諸如幕塗、溢流塗佈、鐘塗佈、碟塗佈及浸塗製程。用黏著劑組合物塗佈可在整個表面上或僅其之一部分(諸如沿邊緣或在間斷的位置)上進行。一旦塗覆至基板,組合物諸如藉由施加熱及空氣流或一些其他適合的途徑來乾燥,用於移除大體上所有剩餘的溶劑。The disclosed adhesive composition is suitable for bonding substrates together. The substrate may be a similar material or a different material. Wet and dry adhesive lamination of a plurality of substrate layers is possible. The disclosed adhesive composition can be applied to a desired substrate using conventional coating techniques such as rotogravure printing, flexible letterpress printing, conventional or airless spraying, roll coating, brush coating, Winding rod coating, doctor blade coating or coating processes such as curtain coating, overflow coating, bell coating, dish coating and dip coating. Coating with an adhesive composition may be performed on the entire surface or only a portion thereof, such as along the edges or in intermittent locations. Once applied to the substrate, the composition is dried, such as by applying heat and air flow, or some other suitable route, to remove substantially all of the remaining solvent.
所揭示之黏著劑組合物可在廣泛多種的一個或複數個適合的基板上使用,所述基板諸如高、低或中密度塑膠(例如選自以下之類型:聚苯乙烯、聚乙烯、ABS、聚胺基甲酸酯、聚對苯二甲酸伸乙酯、聚對苯二甲酸伸丁酯、聚丙烯、聚苯、聚碳酸酯、聚丙烯酸酯、聚氯乙烯、聚碸或其混合物)、紙張、木材及經復原木材產品、經聚合物塗佈之基板、經蠟塗佈之紙板、卡紙板、粒子板、織物、皮革及金屬(例如鋁、二價鐵以及其他非二價鐵)、金屬化塑膠(例如金屬化塑膠膜)或其類似者。黏著劑組合物尤其對於封裝及密封應用具有吸引力。舉例而言,塑膠膜、金屬膜或金屬化塑膠膜可用本發明之黏著劑組合物層壓(例如在其表面之全部或至少一部分上,諸如沿其邊緣或在間斷的位置處)。在一些實施例中,食品可經封裝用於蒸煮袋製備,或所得層製品可用於密封或封裝一些其他製品。當在層壓結構中採用大尺寸箔時,可冷拉所得層製品以產生可填充有食品之杯子或封裝,且隨後用類似層壓結構覆蓋及密封以形成密封容器。The disclosed adhesive composition can be used on a wide variety of one or more suitable substrates, such as high, low, or medium density plastics (eg, selected from the following types: polystyrene, polyethylene, ABS, Polyurethane, polyethylene terephthalate, polybutylene terephthalate, polypropylene, polybenzene, polycarbonate, polyacrylate, polyvinyl chloride, polyfluorene, or mixtures thereof), Paper, wood and recovered wood products, polymer-coated substrates, wax-coated cardboard, cardboard, particle board, fabrics, leather, and metals (such as aluminum, ferrous and other non-ferrous), Metallized plastic (such as metallized plastic film) or similar. Adhesive compositions are particularly attractive for packaging and sealing applications. For example, a plastic film, metal film, or metallized plastic film can be laminated (eg, on all or at least a portion of its surface, such as along its edges or at intermittent locations) with the adhesive composition of the present invention. In some embodiments, the food can be packaged for cooking bag preparation, or the resulting layered article can be used to seal or encapsulate some other article. When a large-size foil is used in a laminated structure, the resulting layered product can be cold-drawn to produce a cup or package that can be filled with food, and then covered and sealed with a similar laminated structure to form a sealed container.
為了黏著劑系統之冷可拉性及最佳效能,重要的為最終層壓結構具有平衡機械特性。平衡機械特性將准許在溫度變化之層製品之製造及使用條件下負荷及應力分佈於層製品上。具有磷酸酯之黏著劑能夠使得層製品具有改良的機械特性以平衡及轉移層壓結構內之負荷及應力。具有或不具有磷酸酯添加劑之經固化之純聚酯-胺基甲酸酯-聚胺基甲酸酯之儲存模數將在約50至1,500 MPa(在0℃下)及0.7至6.0 MPa(在25℃下)及0.10至1.50(在60℃下)範圍內。重要的效能不同將為觀測到層壓結構隨定向變化之伸長率%。縱向及橫向方向上之伸長率%將在兩個方向上更加平衡,在8.0至10.5%範圍內,且縱向及橫向方向之差值將為約0.0至0.30%之絕對值,歸因於磷酸酯與基板表面相互作用之能力且幫助平衡層壓結構上力分佈差值。For the cold drawability and best performance of the adhesive system, it is important that the final laminated structure has balanced mechanical properties. Balanced mechanical properties will allow load and stress to be distributed on the layered product under conditions of manufacture and use of the layered product with temperature changes. Phosphate-based adhesives can provide laminates with improved mechanical properties to balance and transfer loads and stresses within the laminated structure. The storage modulus of cured pure polyester-urethane-polyurethane with or without phosphate ester additives will be about 50 to 1,500 MPa (at 0 ° C) and 0.7 to 6.0 MPa ( At 25 ° C) and 0.10 to 1.50 (at 60 ° C). An important performance difference will be the percent elongation of the laminated structure as a function of orientation. The elongation% in the longitudinal and transverse directions will be more balanced in both directions, in the range of 8.0 to 10.5%, and the difference between the longitudinal and transverse directions will be an absolute value of about 0.0 to 0.30%, due to the phosphate ester The ability to interact with the substrate surface and help balance the difference in force distribution across the laminated structure.
現將藉由論述說明性實例(「IE」)及比較實例(「CE」)(統稱「實例」)進一步詳細描述本發明。然而,本發明之範疇當然不限於IE。原材料 The invention will now be described in further detail by discussing illustrative examples ("IE") and comparative examples ("CE") (collectively "examples"). However, the scope of the present invention is of course not limited to IE. Raw materials
所述實例使用原材料製備,所述原材料包含可以商標名ADCOTE™ 811A EA購自陶氏化學公司(The Dow Chemical Company)之聚酯-聚胺基甲酸酯樹脂、可以商標名MOR-FREE™ 200C及ADCOTE™ 811B購自陶氏化學公司之脂族異氰酸酯固化劑、可以商標名VORNAOL™ CP 450購自陶氏化學公司之聚醚多醇、可以商標名ISONATE™ 125M購自陶氏化學公司之異氰酸酯、可購自西格瑪-阿爾德里奇(Sigma-Aldrich)之115%聚磷酸及可購自西格瑪-阿爾德里奇之乙酸乙酯及甲基乙基酮。The examples are prepared using raw materials including polyester-polyurethane resins available under the trade name ADCOTE ™ 811A EA from The Dow Chemical Company, and trade names MOR-FREE ™ 200C And ADCOTE ™ 811B are aliphatic isocyanate curing agents available from The Dow Chemical Company, polyether polyols available from the Dow Chemical Company under the trade name VORNAOL ™ CP 450, and isocyanates available from the Dow Chemical Company under the trade name ISONATE ™ 125M 11.115% polyphosphoric acid available from Sigma-Aldrich and ethyl acetate and methyl ethyl ketone available from Sigma-Aldrich.
酸值(AV)係藉由ASTM D 3655-06(美國測試與材料協會(American Society for Testing and Materials),美國賓夕法尼亞州西康舍霍肯)之方法量測。Acid value (AV) is measured by ASTM D 3655-06 (American Society for Testing and Materials, West Conshohocken, PA, USA).
羥基數目(OHN)係藉由ASTM D 4274-88(美國測試與材料協會,美國賓夕法尼亞州西康舍霍肯)之方法量測。The number of hydroxyl groups (OHN) was measured by ASTM D 4274-88 (American Society for Testing and Materials, West Conshohocken, PA, USA).
尺寸排阻層析法(SEC)使用了兩個PLgel Mix-B及PLgel Mixed-D管柱及Viscotek三重偵測器。使用聚苯乙烯標準品產生普適校準曲線,以測定重量平均分子量及數量平均分子量。在分析之前,樣品用THF稀釋至約2.5 mg/ml之聚合物濃度。Size exclusion chromatography (SEC) uses two PLgel Mix-B and PLgel Mixed-D columns and a Viscotek triple detector. Polystyrene standards were used to generate universal calibration curves to determine weight average molecular weight and number average molecular weight. Prior to analysis, samples were diluted with THF to a polymer concentration of approximately 2.5 mg / ml.
溶液黏度係根據方法ASTM D2196-10(ASTM;美國賓夕法尼亞州西康舍霍肯(West Conshohocken, PA, USA)),用布洛克菲爾德黏度計量測。Solution viscosity was measured according to method ASTM D2196-10 (ASTM; West Conshohocken, PA, USA), using Brookfield viscosity measurement.
所述實例使用膜製備,所述膜包含:Prelam,其為以3.26 g/m2 (2.00磅/),層壓成具有ADCOTE™/共反應物F之0.00035密耳鋁箔之12 μm(48規格)聚酯(「PET」)膜,可購自陶氏化學公司;1.5規格鋁箔;及厚度為1密耳或2密耳之流延聚丙烯(「CPP」)膜。製備磷酸酯黏著促進劑 The example was prepared using a film comprising: Prelam, which is laminated at 3.26 g / m 2 (2.00 pounds /) into 12 μm (48 gauge) of 0.00035 mil aluminum foil with ADCOTE ™ / co-reactant F ) Polyester ("PET") film, available from The Dow Chemical Company; 1.5 gauge aluminum foil; and cast polypropylene ("CPP") film with a thickness of 1 or 2 mils. Preparation of phosphate ester adhesion promoter
在烘箱中乾燥1 L多頸圓底燒瓶,用乾燥N2 沖洗30分鐘,隨後裝入150公克VORANOL™ CP 450聚醚多元醇且放入70 mL/min之N2 吹掃下。注射器裝載有4公克115%聚磷酸(PPA)。在激烈攪動下將PPA逐滴添加至聚醚多元醇中。觀測到極小溫度提高。將反應器內含物加熱至100℃持續1小時,隨後冷卻至45℃。添加40公克乙酸乙酯,繼而緩慢添加50公克ISONATE™ 125 M二異氰酸酯。藉由施加冰批料控制顯著放熱以使反應罐保持低於75℃且觀測到黃色至琥珀色顯影。隨後將反應器維持在65℃下1小時,此時內含物冷卻且已封裝。產物具有以下特性:76.0%固體,112 mg KOH/g之OHN,19.0 mg KOH/g之AV,在25℃下1665 mPa·s之黏度,Mn 1700、Mw 4100之SEC分析,2.4之多分散性,4.4%≤500道爾頓,且16.0%≤1000道爾頓。The 1 L multi-neck round bottom flask was dried in an oven, rinsed with dry N 2 for 30 minutes, then charged with 150 g of VORANOL ™ CP 450 polyether polyol and placed under a N 2 purge at 70 mL / min. The syringe was loaded with 4 grams of 115% polyphosphoric acid (PPA). PPA was added dropwise to the polyether polyol under vigorous agitation. An extremely small temperature increase was observed. The reactor contents were heated to 100 ° C for 1 hour and then cooled to 45 ° C. Add 40 grams of ethyl acetate, then slowly add 50 grams of ISONATE ™ 125 M diisocyanate. A significant exotherm was controlled by applying an ice batch to keep the reaction tank below 75 ° C and a yellow to amber development was observed. The reactor was then maintained at 65 ° C for 1 hour, at which time the contents were cooled and sealed. The product has the following characteristics: 76.0% solids, 112 mg KOH / g OOH, 19.0 mg KOH / g AV, viscosity of 1665 mPa · s at 25 ° C, SEC analysis of Mn 1700, Mw 4100, polydispersity of 2.4 , 4.4% ≤ 500 Daltons, and 16.0% ≤ 1000 Daltons.
包含相關原材料之比較實例(「CE」)及說明性實例(「IE」)之詳細黏著劑調配物概述在表1中。 表1:CE1、CE2、CE3及IE1至IE5之黏著劑調配物
以各種混合比率用脂族異氰酸酯固化劑固化各種聚酯-胺基甲酸酯及聚酯-胺基甲酸酯/磷酸酯化合物摻合物系統。藉由獲取約15公克聚酯-胺基甲酸酯及聚酯-胺基甲酸酯/磷酸酯化合物摻合物溶液且以各種混合比率在瓶子中將其與脂族異氰酸酯混合來製備黏著劑鑄件。將黏著劑溶液混合約15至30分鐘,且隨後將其倒入聚甲基戊烯皮氏培養皿(petri dish)中。使溶劑在通風櫥中在水平面上蒸發隔夜,且隨後將鑄件放入對流烘箱中並在45℃下固化7天。A variety of polyester-urethane and polyester-urethane / phosphate compound blend systems are cured with aliphatic isocyanate curing agents at various mixing ratios. An adhesive was prepared by taking about 15 grams of a polyester-urethane and polyester-urethane / phosphate compound blend solution and mixing it with an aliphatic isocyanate in a bottle at various mixing ratios. casting. The adhesive solution was mixed for about 15 to 30 minutes, and then poured into a polymethylpentene petri dish. The solvent was allowed to evaporate on a horizontal surface in a fume hood overnight, and then the casting was placed in a convection oven and cured at 45 ° C. for 7 days.
經由DMA(TA儀器公司(TA Instruments)Q800),使用多頻率應變模式分析鑄件。自-100℃至150℃使用單一施加之頻率1 Hz,且加熱速率為3℃/min且施加之應力為0.01%,且使用0.01 N之預載力。The castings were analyzed via DMA (TA Instruments Q800) using a multi-frequency strain mode. From -100 ° C to 150 ° C, a single applied frequency of 1 Hz is used, the heating rate is 3 ° C / min, the applied stress is 0.01%, and a preload force of 0.01 N is used.
使用具有自動取樣器及與使用Q系列軟體之TA Advantage之桌上型電腦接合之RCS之TA儀器公司Q100 DSC測定玻璃轉移溫度(Tg)。將約10毫克樣品放入具有鋁密閉式蓋子之t-零盤中。使用以下條件操作樣品: 初始熱量:80℃持續5分鐘。 初始熱量:-85℃×10℃/min=>200℃。 冷卻循環:200℃×10℃/min=>-85℃。 2nd 熱量:-85℃×10℃/min=>240℃;回到室溫。The glass transition temperature (Tg) was measured using a TA instrument company Q100 DSC with an automatic sampler and RCS connected to a desktop computer using Q series software. Approximately 10 mg of the sample was placed in a t-zero plate with an aluminum closed lid. The samples were operated using the following conditions: Initial heat: 80 ° C for 5 minutes. Initial heat: -85 ℃ × 10 ℃ / min => 200 ℃. Cooling cycle: 200 ℃ × 10 ℃ / min = >-85 ℃. 2 nd heat: -85 ° C × 10 ° C / min => 240 ° C; return to room temperature.
經由DSC報導第二加熱循環Tg 。Via a second DSC heating cycle reported T g.
所分析之樣品之重要特性概述在表2中。具有良好維持之機械特性之均勻聚合物網路藉由將磷酸酯黏著促進劑引入系統中形成。具有或不具有磷酸酯添加劑之經固化之純聚酯-胺基甲酸酯-聚胺基甲酸酯之儲存模數將在約50至1,500 MPa(在0℃下)及0.7至6.0 MPa(在25℃下)及0.10至1.50(在60℃下)範圍內。 表2:DMA特徵結果
以各種混合比率用脂族異氰酸酯固化劑固化各種聚酯-胺基甲酸酯及聚酯-胺基甲酸酯/磷酸酯化合物摻合物系統。黏著劑調配物之組成概述在表1中。將黏著劑溶液混合大約15至30分鐘,且隨後用邁爾桿(Mayer rod)塗佈於Prelam上以產生約4.48至4.88 g/m2 (2.75至3.00磅/令)之塗料重量,且隨後使用82℃之壓軋溫度層壓至2密耳CPP膜上。在對流烘箱中在45℃下固化層製品長達14天。A variety of polyester-urethane and polyester-urethane / phosphate compound blend systems are cured with aliphatic isocyanate curing agents at various mixing ratios. The composition of the adhesive formulation is summarized in Table 1. The adhesive solution was mixed for about 15 to 30 minutes, and then coated on the Prelam with a Mayer rod to produce a coating weight of about 4.48 to 4.88 g / m 2 (2.75 to 3.00 lb / ream), and then Laminate onto a 2 mil CPP film using a rolling temperature of 82 ° C. The layered article was cured in a convection oven at 45 ° C for up to 14 days.
在Thwing-Albert拉伸測試器(型號QC-3A)上用50牛頓測力計(Newton load cell)以10.0 cm/min速率在15 mm寬之層製品條帶上測定黏著黏結強度。使用以下縮寫來描述測試結果:「AS」為黏著劑分流,「FT」為膜撕裂,「FS」為膜延伸,「AT」為黏著劑轉移,且「AF」為黏著失效。The adhesive bonding strength was measured on a 15 mm wide layered strip on a Thwing-Albert tensile tester (model QC-3A) using a 50 Newton load cell (Newton load cell) at a rate of 10.0 cm / min. The following abbreviations are used to describe the test results: "AS" is the adhesive shunt, "FT" is the film tear, "FS" is the film extension, "AT" is the adhesive transfer, and "AF" is the adhesion failure.
藉由在25.4 mm×175 mm之層製品條帶上,利用Instron拉伸測試器在縱向及橫向方向上檢查層製品(箔/CPP)之伸長率%來測定層製品之可拉性。Instron拉伸測試器之測試條件為:固定件空隙為7.62 cm,測力計為0-50牛頓,延伸速率(頭速度)為5.08 cm/min,記錄斷裂伸長率(%)。The tensile properties of the laminated product were determined by inspecting the elongation percentage of the laminated product (foil / CPP) in the longitudinal and transverse directions using an Instron tensile tester on a laminated product strip of 25.4 mm × 175 mm. The test conditions of the Instron tensile tester are: the gap of the fixture is 7.62 cm, the dynamometer is 0-50 Newtons, the elongation rate (head speed) is 5.08 cm / min, and the elongation at break (%) is recorded.
典型的黏合強度數據及伸長率%數據概述在表3中。Typical bond strength data and% elongation data are summarized in Table 3.
重要的效能不同將為觀測到層壓結構隨定向變化之伸長率%。縱向及橫向方向上之伸長率%將在兩個方向上更加平衡,在8.0至10.5%範圍內,且縱向及橫向方向之差值將為約0.0至0.30%之絕對值,歸因於磷酸酯與基板表面相互作用之能力且幫助平衡層壓結構上力分佈差值。 表3:黏合強度及伸長率%數據之彙總
除了上文所描述之實施例及實例中所闡述之實施例之外,特定組合之許多實施例屬於本發明之範疇內,下文描述其中一些:In addition to the embodiments described above and the examples described in the examples, many embodiments of specific combinations fall within the scope of the present invention, some of which are described below:
實施例1. 一種溶劑基黏著劑組合物,包括: (A)聚酯-胺基甲酸酯樹脂; (B)磷酸酯化合物;及 (C)脂族異氰酸酯固化劑。Example 1. A solvent-based adhesive composition comprising: (A) a polyester-urethane resin; (B) a phosphate ester compound; and (C) an aliphatic isocyanate curing agent.
實施例2. 如任何前述或後續實施例之溶劑基黏著劑組合物,其中所述聚酯-胺基甲酸酯樹脂為聚酯多元醇與異氰酸酯之反應產物。Embodiment 2. The solvent-based adhesive composition according to any of the foregoing or subsequent embodiments, wherein the polyester-urethane resin is a reaction product of a polyester polyol and an isocyanate.
實施例3. 如任何前述或後續實施例之溶劑基黏著劑組合物,其中所述聚酯-胺基甲酸酯樹脂佔聚酯-胺基甲酸酯樹脂(A)及磷酸酯(B)之總重量之65至99.5重量百分比。Embodiment 3. The solvent-based adhesive composition according to any of the foregoing or subsequent embodiments, wherein the polyester-urethane resin accounts for the polyester-urethane resin (A) and the phosphate ester (B) 65 to 99.5 weight percent of the total weight.
實施例4. 如任何前述或後續實施例之溶劑基黏著劑組合物,其中所述聚酯-胺基甲酸酯樹脂佔所述聚酯-胺基甲酸酯樹脂(A)及所述磷酸酯(B)之總重量之95至99重量百分比。Embodiment 4. The solvent-based adhesive composition according to any of the foregoing or subsequent embodiments, wherein the polyester-urethane resin accounts for the polyester-urethane resin (A) and the phosphoric acid 95 to 99 weight percent of the total weight of the ester (B).
實施例5. 如任何前述或後續實施例之溶劑基黏著劑組合物,其中所述磷酸酯化合物佔所述聚酯-胺基甲酸酯樹脂(A)及所述磷酸酯(B)之總重量之0.5至35重量百分比。Embodiment 5. The solvent-based adhesive composition according to any of the foregoing or subsequent embodiments, wherein the phosphate ester compound accounts for the total of the polyester-urethane resin (A) and the phosphate ester (B) 0.5 to 35 weight percent.
實施例6. 如任何前述或後續實施例之溶劑基黏著劑組合物,其中所述磷酸酯化合物佔所述聚酯-胺基甲酸酯樹脂(A)及所述磷酸酯(B)之總重量之1至5重量百分比。Embodiment 6. The solvent-based adhesive composition according to any of the foregoing or subsequent embodiments, wherein the phosphate ester compound accounts for the total of the polyester-urethane resin (A) and the phosphate ester (B) 1 to 5 weight percent.
實施例7. 如任何前述或後續實施例之溶劑基黏著劑組合物,其中所述磷酸酯化合物具有結構(I):, (I) 其中R1 為任何有機基。Embodiment 7. The solvent-based adhesive composition according to any of the foregoing or subsequent embodiments, wherein the phosphate compound has the structure (I): (I) wherein R 1 is any organic group.
實施例8. 如任何前述或後續實施例之溶劑基黏著劑組合物,其中R1 具有結構(II):, (II) 其中R1 與結構(I)中相同。Embodiment 8. The solvent-based adhesive composition according to any of the foregoing or subsequent embodiments, wherein R 1 has the structure (II): (II) where R 1 is the same as in structure (I).
實施例9. 如任何前述或後續實施例之溶劑基黏著劑組合物,其中所述磷酸酯化合物包括胺基甲酸酯鍵。Embodiment 9. The solvent-based adhesive composition of any preceding or subsequent embodiment, wherein the phosphate compound comprises a urethane bond.
實施例10. 如任何前述或後續實施例之溶劑基黏著劑組合物,進一步包括溶劑。Example 10. The solvent-based adhesive composition of any of the foregoing or subsequent examples, further comprising a solvent.
實施例11. 如任何前述或後續實施例之溶劑基黏著劑組合物,其中所述溶劑選自由以下各者組成之群:乙酸乙酯、甲基乙基酮、乙酸甲酯及其組合。Embodiment 11. The solvent-based adhesive composition of any preceding or subsequent embodiment, wherein the solvent is selected from the group consisting of ethyl acetate, methyl ethyl ketone, methyl acetate, and combinations thereof.
實施例12. 一種用於製備溶劑基黏著劑組合物之方法,所述方法包括: 提供聚酯-胺基甲酸酯樹脂; 提供磷酸酯化合物; 將所述聚酯-胺基甲酸酯樹脂及所述磷酸酯化合物混合以形成樹脂混合物; 在溶劑中稀釋所述樹脂混合物以形成經稀釋之樹脂混合物,其具有以所述經稀釋之樹脂混合物之總重量計25至55重量百分比之應用固體含量;及 以100:1至100:12之混合比率(稀釋前的樹脂混合物重量份:脂族異氰酸酯固化劑重量份)用脂族異氰酸酯固化劑固化所述經稀釋之樹脂混合物。Embodiment 12. A method for preparing a solvent-based adhesive composition, the method comprising: providing a polyester-urethane resin; providing a phosphate ester compound; and applying the polyester-urethane resin And the phosphate ester compound are mixed to form a resin mixture; the resin mixture is diluted in a solvent to form a diluted resin mixture having an application solid of 25 to 55 weight percent based on the total weight of the diluted resin mixture Content; and the diluted resin mixture is cured with an aliphatic isocyanate curing agent at a mixing ratio of 100: 1 to 100: 12 (parts by weight of resin mixture before dilution: parts by weight of aliphatic isocyanate curing agent).
實施例13. 如任何前述或後續實施例之用於製備溶劑基黏著劑組合物之方法,其中所述經稀釋之樹脂混合物具有以所述經稀釋之樹脂混合物之總重量計35至40重量百分比之應用固體含量。Embodiment 13. The method for preparing a solvent-based adhesive composition according to any of the foregoing or subsequent embodiments, wherein the diluted resin mixture has a weight percentage of 35 to 40 based on the total weight of the diluted resin mixture Application of solid content.
實施例14. 如任何前述或後續實施例之用於製備溶劑基黏著劑組合物之方法,其中所述混合比率(稀釋前的樹脂混合物重量份:脂族異氰酸酯重量份)為100:4至100:10。Embodiment 14. The method for preparing a solvent-based adhesive composition according to any of the foregoing or subsequent embodiments, wherein the mixing ratio (parts by weight of resin mixture before dilution: parts by weight of aliphatic isocyanate) is 100: 4 to 100 : 10.
實施例15. 一種層狀結構,包括任何前述或後續實施例之黏著劑組合物。Embodiment 15. A layered structure comprising the adhesive composition of any of the foregoing or subsequent embodiments.
實施例16. 根據任何前述或後續實施例之層狀結構,進一步包括金屬基板。Embodiment 16. The layered structure according to any of the foregoing or subsequent embodiments, further comprising a metal substrate.
實施例17. 根據任何前述或後續實施例之層狀結構,進一步包括聚烯烴基板。Embodiment 17. The layered structure according to any of the foregoing or subsequent embodiments, further comprising a polyolefin substrate.
Claims (17)
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| KR20250150028A (en) * | 2023-02-15 | 2025-10-17 | 아르끄마 프랑스 | Two-component solvent-based laminating adhesive for medical cold forming packages |
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