201005212 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種光源及其被動散熱裝置，特別是關於 一種發光二極體（Light Emitting Diode; LED)光源及其 被動散熱裝置。 【先前技術】 近幾年來，由於LED之照明應用需求，使LED之亮度、 功率被積極地提昇。可是，日增之功率且密集之排列，使 φ LED之散熱成為LED應用之一主要問題。若不解決散熱問 題而讓LED的熱無法排除，進而使LED的工作溫度上升， 會造成發光亮度減弱及使用壽命衰減，因此LED散熱問題 不容小覷。 一般習知之LED光源之散熱係以具複數鰭片之散熱 器、熱管等手段來達成，部份甚至加入風扇，這樣多種元 件之組合會造成高昂的成本以及加重LED光源之重量。此 外，複雜的散熱構造，對維修保養上也是一大負擔。美國 • 專利公開號第US20070215328號揭示一種散熱裝置，該散 熱裝置係以熱管、鋁擠型鰭片、銅製導熱座及鋁製導熱座 等組件所組成，其過多之組件不僅加重其重量也增加其物 料成本。而且多組合件之結合關係也會造成熱阻累加之效 應，並進而降低散熱之效果。美國專利公開號第 US2003024693號揭示一種將銅與鋁密合後，再加工成具 複數鰭片之散熱器。此專利揭示之散熱器需較複雜之加工 方法，因此會使其加工成本高，且因其使用材料多，故重 201005212 置較重。又因其配合風扇運作，而一般風扇之壽命約為l5 至30千小時，所以運用在LED冷卻的場合時，會因其壽命 較LED燈短而產生使用上之不便。 另外，美國專利公開號第US7133284號揭示一種三件分 離之鋁擠型鰭片及穿設於其間之熱管等所組合之散熱 器。此專利揭示之散熱器由於構件數量多，因此於製作 呀，需較多之製造模具。且由於構件多，因此使用材料多 且重量較重。更因為熱傳導需經由熱管，增加熱傳連結介 面，故其熱阻高而對散熱有負面效果。美國專利公開號第 US5421406號之散熱器係於一基板上排列一列梳子狀之 針狀散熱柱。由於散熱器是兩金屬元件共組而成，因此重 量偏重。且因針狀散熱柱面積較小，造成其熱交換效率較 低。梳子狀之針狀散熱柱與基板之連接製程不易控制，容 易影響量產速度。 綜觀上述，除LED散熱效率之要求外，隨著LED的普及 化，其成本要求必曰益嚴苛，因此每個LED燈具構件之成 本必須加以錙銖必較，故構件本身之成本、構件的製造成 本必須加以嚴加控管，方能滿足日後市場之要求。再者， 為達一定水準之散熱功效而使用沉重之散熱器，將使燈具 之支撐設計複雜化與厚實化，除使成本上升外，更會造成 且使用上之不便。此外，如鋁擠型等之散熱鰭片，會因為 使用大小之不同而需製作不同之製造模具，而因不同應用 而製作大量之模具，對成本的影響甚鉅。由此亦顯示使用 鋁擠型等之散熱鰭片之習知技術缺乏彈性v因此，[ED照 201005212 明產業急需一種具高散熱效率、輕量化及低成本的解決方 案。 【發明内容】 本發明提供—種光源及其被動散熱裝置，係為—散熱鰭 片以固接部貼著熱源之方式進行散熱，此可減少熱源與 散熱鰭片間之串聯熱阻，從而提昇散熱效率。另一方面， 藉由本發明之被動散熱裝置設計，可使該被動散熱裝置具 重量fe、元件數2；少、簡易且使用具極大之彈性、具擴充 性、使用材料少使得相對成本較低等之優點。 本發明一實施例之光源之被動散熱裝置包含一散熱鰭 片及至少一固接部。該固接部和該散熱鰭片之一側邊垂直 相接，其中該固接部係用於貼著於該發光二極體之一散熱 表面。 本發明另一實施例之光源之被動散熱裝置包含兩散熱 鰭片及至少一固接部。兩散熱鰭片係以平行方式排列。固 接部係與該等散熱鰭片同側之兩側邊相連接，其中該固接 部係用於貼著於該發光二極體之一散熱表面。 本發明一實施例之光源包含一二極體發光模組及一被 動散熱裝置。二極體發光模組包含一電路板及至少一發光 二極體，其中該發光二極體係設置於該電路板上，且該發 光二極體包含一散熱表面。被動散熱裝置包含一散熱鰭片 及至少一於該散熱鶴片之一側邊垂直相接之固接部，其中 該固接部係貼著於該散熱表面。 本發明另一實施例之光源包含包含一前述之二極體發 201005212 光模組及一被動散熱裝置。被動散熱裝置包含兩平行排列 之散熱鰭片及與該等散熱鰭片同侧之兩側邊相連接之至少 一固接部，其中該固接部係貼著於發光二極體之散熱表面。 【實施方式】 參照圖1，LED光源1〇〇包含二極體發光模組丨1〇及複數片 散熱縛片106’而該二極體發光模組丨丨〇包含電路板及複 數個LED 104。LED 104嵌設於電路板1〇2上，且以兩排並 列的方式沿電路板102長邊方向規則地表面黏著（或可以其 ⑩ 他預定之方式表面黏著）。散熱鰭片106亦依LED 104於電路 板102長邊方向排列，形成一散熱鰭片】〇6陣列，其中兩個 並列之LED 104共用相同之散熱鰭片1〇6以進行散熱。 參照圖2及圖3，電路板1〇2上具複數個較LED 1〇4稍大之 孔洞202 ’此可使相對應之LED 104喪設於其中，並讓LED 104背面204 (與發光面相對）上之一散熱表面2〇4a可裸露 出電路板102之上（如圖3所示）’而有利於本發明散熱結構 之施行。LED 104之複數個接腳206電性連接於電路板1〇2 ® 之導線層208上，因此可自電路板1〇2獲得驅動之電能。一 實施例中’電路板102可為金屬核心印刷電路板（Metal201005212 IX. Description of the Invention: [Technical Field] The present invention relates to a light source and a passive heat sink thereof, and more particularly to a light emitting diode (LED) light source and a passive heat sink thereof. [Prior Art] In recent years, the brightness and power of LEDs have been actively increased due to the lighting application requirements of LEDs. However, the increasing power and dense arrangement make the heat dissipation of φ LED a major problem in LED applications. If the heat problem of the LED is not solved, the heat of the LED cannot be removed, and the operating temperature of the LED is increased, which causes the luminance of the LED to be weakened and the service life to be attenuated. Therefore, the problem of heat dissipation of the LED cannot be underestimated. The heat dissipation of the conventional LED light source is achieved by means of a heat sink with a plurality of fins, a heat pipe, etc., and some even add a fan, so that the combination of various components causes high cost and weight of the LED light source. In addition, the complicated heat dissipation structure is also a big burden for maintenance. US Patent Publication No. US20070215328 discloses a heat dissipating device which is composed of a heat pipe, an aluminum extruded fin, a copper heat conducting seat and an aluminum heat conducting seat, and the excessive components thereof not only increase its weight but also increase its weight. cost of material. Moreover, the combination of the multiple assemblies also causes the effect of the thermal resistance to be added, and further reduces the effect of heat dissipation. U.S. Patent Publication No. US2003024693 discloses a heat sink in which copper is bonded to aluminum and then processed into a plurality of fins. The heat sink disclosed in this patent requires a relatively complicated processing method, so that it is costly to process, and because of its use of many materials, it is heavier than 201005212. Because it works with the fan, the life of the fan is about 15 to 30 thousand hours. Therefore, when the LED is cooled, the life is shorter than the LED lamp, which is inconvenient to use. In addition, U.S. Patent No. 7,133,284 discloses a heat dissipator of a combination of three separate aluminum extruded fins and a heat pipe interposed therebetween. The heat sink disclosed in this patent has a large number of components, so it is necessary to manufacture a mold. And because of the large number of components, the materials used are heavy and heavy. Moreover, since heat conduction needs to pass through the heat pipe to increase the heat transfer connection interface, the heat resistance is high and has a negative effect on heat dissipation. The heat sink of U.S. Patent No. 5,421,406 is a column of comb-like pin-shaped heat dissipating columns arranged on a substrate. Since the heat sink is a combination of two metal components, the weight is heavy. Moreover, due to the small area of the pin-shaped heat dissipating column, the heat exchange efficiency is low. The connection process of the comb-like needle-shaped heat-dissipating column and the substrate is not easy to control, and the volume production speed is easily affected. Looking at the above, in addition to the requirements for LED heat dissipation efficiency, with the popularization of LEDs, the cost requirements must be severe, so the cost of each LED lamp component must be compared, so the cost of the component itself and the manufacture of components. The cost must be strictly controlled to meet the requirements of the future market. Furthermore, the use of a heavy heat sink for a certain level of heat dissipation will complicate and thicken the support design of the luminaire. In addition to increasing the cost, it will cause inconvenience in use. In addition, heat-dissipating fins such as aluminum extrusion type require different manufacturing molds due to different sizes of use, and a large number of molds are produced for different applications, which has a great impact on cost. This also shows that the conventional technology of using heat sink fins such as aluminum extrusion type lacks flexibility. Therefore, [ED 201005212] the industry urgently needs a solution with high heat dissipation efficiency, light weight and low cost. SUMMARY OF THE INVENTION The present invention provides a light source and a passive heat dissipating device thereof, wherein the heat dissipating fins dissipate heat by means of a fixing portion against a heat source, which can reduce the series thermal resistance between the heat source and the heat dissipating fins, thereby improving Cooling efficiency. On the other hand, with the passive heat sink design of the present invention, the passive heat sink can have a weight of fe and a number of components 2; less, simple, and extremely flexible, expandable, and use less material, resulting in relatively low cost, etc. The advantages. A passive heat sink for a light source according to an embodiment of the invention includes a heat sink fin and at least one fastening portion. The fixing portion and the side of one of the heat dissipating fins are perpendicularly connected to each other, wherein the fixing portion is for adhering to a heat dissipating surface of the light emitting diode. A passive heat sink for a light source according to another embodiment of the present invention includes two heat dissipating fins and at least one fixing portion. The two fins are arranged in a parallel manner. The fixing portion is connected to the two sides of the same side of the heat dissipating fins, wherein the fixing portion is for adhering to one of the heat dissipating surfaces of the light emitting diode. The light source according to an embodiment of the invention comprises a diode light emitting module and a passive heat sink. The LED module includes a circuit board and at least one light emitting diode. The light emitting diode system is disposed on the circuit board, and the light emitting diode comprises a heat dissipating surface. The passive heat dissipating device comprises a heat dissipating fin and at least one fixing portion perpendicularly connected to one side of the heat dissipating fin, wherein the fixing portion is attached to the heat dissipating surface. A light source according to another embodiment of the present invention includes a diode module 201005212 optical module and a passive heat sink. The passive heat dissipating device comprises two heat dissipating fins arranged in parallel and at least one fixing portion connected to the two sides of the same side of the heat dissipating fins, wherein the fixing portion is attached to the heat dissipating surface of the light emitting diode. Embodiment 1 Referring to FIG. 1 , an LED light source 1 〇〇 includes a diode light emitting module 丨 1 〇 and a plurality of heat sinking tabs 106 ′, and the diode light emitting module 丨丨〇 includes a circuit board and a plurality of LEDs 104 . . The LEDs 104 are embedded on the circuit board 1〇2 and are regularly adhered to the surface of the circuit board 102 in a juxtaposed manner in two rows (or may be surface-bonded in a predetermined manner). The heat dissipating fins 106 are also arranged in the longitudinal direction of the circuit board 102 according to the LEDs 104 to form an array of heat dissipating fins, wherein the two parallel LEDs 104 share the same heat dissipating fins 1〇6 for heat dissipation. Referring to FIG. 2 and FIG. 3, the circuit board 1〇2 has a plurality of holes 202 that are slightly larger than the LEDs 1〇4, which can cause the corresponding LEDs 104 to be disposed therein, and the rear surface 204 of the LEDs 104 (with the light-emitting surface) The upper heat dissipating surface 2〇4a can be exposed on the circuit board 102 (as shown in FIG. 3) to facilitate the implementation of the heat dissipating structure of the present invention. The plurality of pins 206 of the LEDs 104 are electrically connected to the conductor layer 208 of the circuit board 1〇2®, so that the driving power can be obtained from the circuit board 1〇2. In one embodiment, the circuit board 102 can be a metal core printed circuit board (Metal
Core Printed Circuit Board; MCPCB )。一實施例中，LED 104 之封裝結構係將晶粒焊接於一散熱基板（sub mount )或散 熱片（heat sink)上’然後再把晶粒以環氧樹脂或高分子 保護材料包覆。 參照圖4，LED 1 04之散熱係利用設於其上之單一散熱鰭 片106來提昇其散熱之能力，使led 104得避免發光亮度減 201005212 弱及使用壽命衰減。於此一實施例中，被動散熱裝置ι〇8 包含一四邊形之散熱鰭片1〇6及於該散熱鰭片1〇6之—侧邊 上設置之至少一固接部402。固接部402係和散熱鰭片1〇6 垂直相接，故可使散熱鰭片1〇6安置於led 104上時可呈矗 立之狀態。一實施例中，該固接部4〇2與該散熱鰭片1〇6可 為金屬沖壓一體成型製成，而該固接部4〇2可為彎折加工而 成。固接部402係以貼著之方式固定於LED 1〇4之散熱表面 204a’藉此達到最大的熱傳遞效果。固接部々ο]可與該散熱 表面204a大小相當，然可依實際散熱設計而不以此為限。 一實施例中’固接部402係以焊接方式貼著於該散熱表面 204a’其中焊接使用之材料係金、銀、鎳/金、鎳/鈀/金、 錫、錫/銀、錫/銅、及錫/銀/銅之其中一者。以焊接之方式 固著，可使接觸表面間之熱傳效率達到最佳之狀態。 參照圖1 ’為節省加工成本，可將散熱鰭片1〇6設計具有 兩個固接部402，使得兩並列之LED 104可共同利用同一散 熱鰭片106來提高各自之散熱能力。從此例可得知，只要能 符合散熱之要求，散熱鰭片106可共接於多個LED 104。亦 即，本發明揭示之被動散熱裝置108可彈性設計並應用於各 種形式排列之LED光源1 〇〇。 綜上所述，本發明所揭示之技術係分別利用散熱鰭片1 〇6 與LED 104之散熱表面204a直接連接，使LED 104可直接利 用個別散熱鰭片106散熱’因此可減少熱源與散熱鰭片】〇6 間之串聯熱阻。本發明揭示之技術係利用散熱鰭片1 〇6以自 然熱對流、熱輻射等被動方式散熱，無需使用主動方式（強 201005212 制對流）料達到散熱之目# ;❿本發明揭#之技術相較 於以強制對流來達到熱傳者，具使用上之經濟性及輕便 眭。舉例言，本發明揭示之技術免用熱管、風扇等主動散 熱元件，故可較鋁擠型散熱器等使用主動散熱元件者降低 重量約50%。除此之外，使用上的彈性亦是本發明所具之 最大優勢，亦即傳統鋁擠型散熱器受限於製作模具而無法 彈丨生改變尺寸以因應不同形式排列發光二極體之光源。本 發明所揭示之技術不因使用外型、大小之改變而必須因應 加開額外之模具，其可以簡單裁切之方式來滿足所有之要 求’故可彈性地滿足各種需求。 參照圖5，上述之立設於散熱鰭片1 〇6 一側邊之固接部4〇2 係往散熱鰭片106之單一側表面延伸。除此之外，固接部 亦了在散熱縛片106'之兩邊側表面來延伸（如箭頭方向 所示），使其呈倒T型。如此之設計可縮短固接部402兩端 熱傳距離，而增進熱傳效率。 參照圖6’於大功率LED 1〇4，的應用下，單一散熱鰭片ι〇6 可能不敷使用’此時可設兩立置之散熱鰭片（1〇6m和1〇6，,，） 之方式達到加大散熱面積、提高散熱量之效果。兩立置之 散熱縛片（106’’和1〇6，，，）之同側之兩側邊係以一固接部 4〇2"相連’而藉由該固接部402'，貼著於其相對應之LED 104’上’使該LED 104'得藉散熱鰭片（106，’和106，，，）將產 生之熱量散出。 參照圖7 ’單一列（行）排列之LED 104可設計以每個LED 104均具其各自之散熱鰭片1〇6，πι來提高散熱效率。 201005212 參照圖8,從一環狀光源100,之散熱技術之配置方式，可 看出此技術應用之彈性及擴充性。本發明揭示之技術因為 直接將散熱鰭片106直接設置於LED 104，因此無論LED 104之排列方式如何均可將散熱鰭片1〇6彈性地設置於其 上，達到散熱的效果，由此可知本發明揭示之技術極具彈 性與擴充性。環狀光源1〇〇,之LED 1〇4係以環型方式排列於 電路板102’，因此使接著於其上之散熱鰭片1〇6亦呈現與其 相對應之環型排列方式。 系示5之’本發明所揭露之技術較習知技術具有散熱較使 用銘擠型之散熱器為佳、元件數量少、簡易且使用具極大 之彈性、具擴充性、使用材料少使得相對成本較低等之優 點。 本發明之技術内容及技術特點已揭示如上，然而熟悉本 項技術之人士仍可能基於本發明之教示及揭示而作種種不 背離本發明精神之替換及修飾。因此，本發明之保護範圍 應不限於實施例所揭示者’而應包括各種不背離本發明之 替換及修飾’並為以下之申請專利範圍所涵蓋。 【圖式簡單說明】 圖1顯示本發明一實施例之LED光源之立體示意圖； 圖2顯示圖1之局部俯視圖； 圖3顯示圖1之局部側視圖； 圖4顯示本發明一實施例之散熱鰭片示意圖； 圖5顯示本發明另一實施例之散熱鰭片示意圖； 圖6顯示本發明又一實施例之散熱鰭片示意圖； -11- 201005212 圖7顯示本發明另一實施例之LED光源之立體示意圖；及 圖8顯示本發明一實施例之環狀光源之立體示意圖。 【主要元件符號說明】 100 LED光源 100' 環狀光源 102、 102' 電路板 104、 104' LED 106、 106'、106，'、106,M、 106"" 散熱鰭片 108 被動散熱裝置 110 二極體發光模組 202 孔洞 204 背面 204a 散熱表面 206 接腳 208 導線層 402 ' 402' ' 402"固接部 參 -12Core Printed Circuit Board; MCPCB). In one embodiment, the package structure of the LEDs 104 solders the die to a sub mount or heat sink and then coats the die with an epoxy or polymeric protective material. Referring to FIG. 4, the heat dissipation of the LED 104 utilizes a single heat sink fin 106 disposed thereon to enhance its heat dissipation capability, so that the LED 104 can avoid the illumination brightness minus the 201005212 weak and the service life attenuation. In this embodiment, the passive heat sink ι 8 includes a quadrilateral heat dissipating fin 1 〇 6 and at least one fixing portion 402 disposed on a side of the heat dissipating fin 1 〇 6 . The fixing portion 402 is perpendicularly connected to the heat dissipating fins 1〇6, so that the heat dissipating fins 1〇6 can be placed in the standing state when placed on the led 104. In one embodiment, the fixing portion 4〇2 and the heat dissipation fins 1〇6 may be integrally formed by metal stamping, and the fixing portion 4〇2 may be formed by bending. The fixing portion 402 is fixed to the heat dissipating surface 204a' of the LED 1〇4 in abutting manner to thereby achieve the maximum heat transfer effect. The fixing portion 々ο] can be equivalent in size to the heat dissipating surface 204a, but can be designed according to the actual heat dissipation. In one embodiment, the fixing portion 402 is adhered to the heat dissipating surface 204a' in a soldering manner, and the materials used for soldering are gold, silver, nickel/gold, nickel/palladium/gold, tin, tin/silver, tin/copper. And one of tin/silver/copper. Fixing by welding can achieve the best heat transfer efficiency between the contact surfaces. Referring to FIG. 1 ′ to save processing costs, the heat dissipating fins 1〇6 can be designed with two fixing portions 402, so that the two parallel LEDs 104 can jointly utilize the same heat dissipating fins 106 to improve their respective heat dissipating capabilities. It can be seen from this example that the heat sink fins 106 can be commonly connected to the plurality of LEDs 104 as long as they meet the heat dissipation requirements. That is, the passive heat sink 108 disclosed in the present invention can be flexibly designed and applied to various forms of the LED light source 1 〇〇. In summary, the technology disclosed in the present invention is directly connected to the heat dissipation surface 204a of the LED 104 by using the heat dissipation fins 1 and 6 respectively, so that the LEDs 104 can directly dissipate heat by using the individual heat dissipation fins 106, thereby reducing the heat source and the heat dissipation fins. Chip] 串联6 series thermal resistance. The technology disclosed in the present invention utilizes the heat dissipating fins 1 〇6 to radiate heat in a passive manner such as natural heat convection and heat radiation, without using an active method (strong 201005212 convection) material to achieve heat dissipation. Compared with the use of forced convection to achieve heat transfer, it is economical and lightweight. For example, the technology disclosed in the present invention is free of active heat radiating elements such as heat pipes and fans, so that the active heat dissipating component can be reduced by about 50% compared with an aluminum extruded heat sink. In addition, the elasticity of use is also the greatest advantage of the present invention, that is, the conventional aluminum extruded radiator is limited to the production of the mold and cannot be elasticized to change the size to arrange the light source of the LED in different forms. . The technique disclosed in the present invention does not require an additional mold because of the change in the shape and size of the use, and it can be easily cut to meet all the requirements, so that it can flexibly satisfy various demands. Referring to FIG. 5, the fixing portion 4?2 which is disposed on one side of the heat dissipation fins 1?6 extends to a single side surface of the heat dissipation fins 106. In addition, the fixing portion also extends on both side surfaces of the heat dissipating tab 106' (as indicated by the direction of the arrow) to make it an inverted T shape. Such a design can shorten the heat transfer distance between the two ends of the fixing portion 402 and improve the heat transfer efficiency. Referring to Figure 6's application of high-power LED 1〇4, a single heat-dissipating fin ι〇6 may not be used. 'At this time, two standing heat-dissipating fins (1〇6m and 1〇6,,, The way to increase the heat dissipation area and increase the heat dissipation. The two sides of the two opposite heat dissipation tabs (106'' and 1〇6,,) are attached to each other by a fixing portion 4〇2"connected' On the corresponding LED 104', the LED 104' is caused to dissipate heat generated by the heat sink fins (106, 'and 106,,,). Referring to Fig. 7, the single row (row) array of LEDs 104 can be designed such that each of the LEDs 104 has its own heat sink fins 1 〇 6, πι to improve heat dissipation efficiency. 201005212 Referring to FIG. 8, the flexibility and expandability of the application of the technology can be seen from the configuration of the heat dissipation technology of an annular light source 100. The technology disclosed in the present invention directly disposes the heat dissipation fins 106 on the LEDs 104, so that the heat dissipation fins 1〇6 can be elastically disposed thereon regardless of the arrangement of the LEDs 104, thereby achieving the effect of heat dissipation. The technology disclosed in the present invention is extremely flexible and expandable. The ring-shaped light source 1〇〇, the LEDs 1〇4 are arranged in a ring-like manner on the circuit board 102', so that the heat-dissipating fins 1〇6 next thereto also exhibit a ring-shaped arrangement corresponding thereto. The technique disclosed in the present invention has better heat dissipation than the conventionally used heat sink, the number of components is small, the ease of use is extremely flexible, the expansion is large, and the use of materials is relatively low. Lower advantage. The technical contents and technical features of the present invention have been disclosed as above, and those skilled in the art can still make various substitutions and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is not to be construed as being limited by the scope of the inventions BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing an LED light source according to an embodiment of the present invention; FIG. 2 is a partial plan view of FIG. 1; FIG. 3 is a partial side view of FIG. FIG. 5 is a schematic view showing a heat sink fin according to another embodiment of the present invention; FIG. 6 is a schematic view showing a heat sink fin according to still another embodiment of the present invention; -11- 201005212 FIG. 7 is a view showing an LED light source according to another embodiment of the present invention. FIG. 8 is a perspective view showing an annular light source according to an embodiment of the present invention. [Main component symbol description] 100 LED light source 100' annular light source 102, 102' circuit board 104, 104' LED 106, 106', 106, ', 106, M, 106 "" heat sink fin 108 passive heat sink 110 Diode light-emitting module 202 hole 204 back surface 204a heat-dissipating surface 206 pin 208 wire layer 402 '402' '402" fixed part reference-12