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TW200817697A - Detection device for chip - Google Patents

Detection device for chip Download PDF

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Publication number
TW200817697A
TW200817697A TW095137526A TW95137526A TW200817697A TW 200817697 A TW200817697 A TW 200817697A TW 095137526 A TW095137526 A TW 095137526A TW 95137526 A TW95137526 A TW 95137526A TW 200817697 A TW200817697 A TW 200817697A
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TW
Taiwan
Prior art keywords
wafer
circuit board
replacement
pins
chip
Prior art date
Application number
TW095137526A
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English (en)
Other versions
TWI310460B (en
Inventor
Yung-Shun Kao
Chih-Ming Lai
Original Assignee
Giga Byte Tech Co Ltd
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Publication date
Application filed by Giga Byte Tech Co Ltd filed Critical Giga Byte Tech Co Ltd
Priority to TW095137526A priority Critical patent/TWI310460B/zh
Priority to CN200610136684.3A priority patent/CN101169464A/zh
Priority to US11/654,558 priority patent/US7768288B2/en
Priority to FR0700694A priority patent/FR2907229B1/fr
Priority to JP2007163767A priority patent/JP4456620B2/ja
Publication of TW200817697A publication Critical patent/TW200817697A/zh
Application granted granted Critical
Publication of TWI310460B publication Critical patent/TWI310460B/zh

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317Testing of digital circuits
    • G01R31/3181Functional testing
    • G01R31/319Tester hardware, i.e. output processing circuits
    • G01R31/31903Tester hardware, i.e. output processing circuits tester configuration
    • G01R31/31905Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317Testing of digital circuits
    • G01R31/31718Logistic aspects, e.g. binning, selection, sorting of devices under test, tester/handler interaction networks, Test management software, e.g. software for test statistics or test evaluation, yield analysis
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/141One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04Assemblies of printed circuits
    • H05K2201/049PCB for one component, e.g. for mounting onto mother PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10053Switch
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10295Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303Pin-in-hole mounted pins
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10507Involving several components
    • H05K2201/1053Mounted components directly electrically connected to each other, i.e. not via the PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10689Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/225Correcting or repairing of printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

200817697 九、發明說明: 【發明所屬之技術領域】 本發明係有關於一種晶片檢修輔助裝置。 【先前技術】 當電路板上的晶片發生故障無法正常運作時,習知對 電路板的維修方式,需先將電路板上可能有毁損晶片的區 塊中之晶片一個一個拆卸下來做檢測,若拆卸下的晶片若 僅為資料毁損,則將資料毀損的晶片的内部資料做更新, 然後連接回電路板上,並且將無法修復之晶片改以良好的 晶片連接在電路板上,讓電路板能正常運作。由上可知, 習知的檢測步驟無法先確定毀損之晶片位置,因此,必須 找出電路板上可能有毁損晶片的區塊,再將該區塊中的所 有晶片不論正常與否皆逐一拆下做檢驗,無法達到事半功 倍之效。 【發明内容】 為了改善上述缺點,本發明係提供一種晶片檢修輔助 裝置,用以檢修電路板上之晶片,其中該晶片檢修輔助裝 置包括有替代晶片以及替代電路板,替代電路板與替代晶 片電性連接,該替代電路板包括有對應替代晶片針腳而設 置於替代電路板的複數針腳,其中該複數針腳分別與所對 應的替代晶片針腳電性連接。如此,當檢修輔助裝置放置 於毁損之晶片上時,替代晶片的針腳即可與毁損晶片針腳 電性連接。另外,可更新資料的晶片通常會具有一針腳, 一般稱為Hold或Select (以下稱Hold),藉由控制該
Clienfs Docket No.: TW95037GB TT’s Docket N〇:0932-A50711 -TW/fmal/ 5 200817697
Hold針腳訊號的High或Low,即可使該晶片Disable或 Enable。所以只要將晶片檢修輔助裝置與毁損晶片電連 接,並將該毀損晶片Disable,即可並在不拆下毀損晶片 的情形下,利用替代晶片完成毁損晶片所應做的動作,之 後即可更新毀損晶片的資料。以下並以具有雙BIOS及具 有單一 BIOS的主機板為例來說明:
1. 雙 BIOS 當只有一個BIOS資料錯誤時,系統會自動將另一個BIOS 的資料複製資料錯誤的BIOS中;當兩個BIOS資料皆錯誤 時,則可利用本發明來予以檢修。假設兩個BIOS分別為 BIOS-1與BIOS-2,檢修裝置上的是BIOS-N。首先將檢修 裝置與BIOS-1電連接,並將BIOS-1設為Disable。然後 開機,此時電腦會以BI0S-N來開機,接下來主機板會自 動將BI0S-N的資料複製到BI0S-2上。待更新完畢,就可 以將檢修裝置拿起,只要再重新開機,主機板便會將 BI0S-2的資料複製到BI0S-1之中。
2. 單一 BIOS 假設資料錯誤的BIOS為BI0S-F,檢修裝置上的是 BI0S-N,首先將檢修裝置與BI0S-F電連接,並將BIOS-F 設為Disable。然後開機,此時電腦會以BI0S-N來開機, 待開機完成後,執行BIOS更新軟體,但在把正確的BIOS 更新到BI0S-F之前(此時軟體通常會有一個確認動作, 待使用者輸入),再將BI0S-F設為Enable (BIOS-N設為 Disable),然後繼續BIOS更新軟體,即可將儲存裝置中 的正確BIOS檔案複製到BI0S-F中。 為了讓本發明之上述和其他目的、特徵和優點能更明
Clienfs Docket No.: TW95037GB TT’s Docket Ν〇:0932-Α507 Π-TW/final/ 6 200817697 =明:ΐ特別舉出較佳實施例,並配合所附圖示,作 【實施方式】 請參閱第1Α圖,曰H q 4人+ 路板11電性連接,= 電路板11上並與電 20’用以檢修電路板UX卜明係為一種晶片檢修輔助裝置 之晶片10有毀損的情況^晶片10日’若是電路板11上 上之替代a # 21 則可利用晶片檢修輔助裝置20 暫時',二=== 片的功能’使電路板11可 新後仍無法正常=再更才::==’如果更 Η。與如十4而將5亥晶片拆下更換正常的晶 片。舉例來說’當主機板的m 障而無法開機時 )1⑽日日片因為負料損毀或故 BI〇s θ 則先將曰曰片檢修辅助裝置20放置於 日日片上,w後將BI0S晶片Disable,接下來即可門 機,開機時因為ΒΙΟς θ ΰ σ / 丧卜木即可開 取替代晶片21上之‘m=bie,主機板便會讀 完成#,gp Τ Ήν Β 、枓,來元成開機動作;待開機 來更新BI0S晶片中的資料 = 曼猎由权體 後仍無法正常運作或無法進行更新:則;二0^ 毀,才需將其拆下更換。 職不BIOS晶片抽 晶片檢修辅助裝置2〇包括有替代晶片2卜替代電路 板3,其中替代電路板幻與秩 請搭配參_ IB ®,f代電^ f 電'丨連接。再 ;=25對應替代晶片針腳2ιι而設置於替娜 曰^—iL,亚與替代晶片的針腳211電性連接。當使用 曰曰片^修辅助裝置20日寺,替代電路板23之針腳25鱼晶 200817697 片10之晶片針腳101電性連接。替代電路板23上 切換開關29 (為圖式簡單,僅顯示於第、’ =晶…替代晶…狀二 a e。*要檢修晶片1〇時,則可利用此切換 ^晶片U)D脱ble及替代晶片21Enable,此時替^ 會,代晶片10,即可使電路板u暫時順利運作。=述 代二、?關在設定晶片1〇為―此時’也會同時將替 2片2i設為Enable;在設定晶片1〇為_ =%將替代晶片21設為Dlsable。由於此類切換開關之 作法為廣泛使用之習知數位邏輯電路,在此不另贅述。 的声ί於晶片1〇之晶片針腳101可能會有位置高低不均 避免針腳/5與;片針腳101有接觸不良之 帅51。:二^可It用圖所示之彈簧針腳(P〇g° ^片^當晶片檢修辅助裝置20放置 ,=20盘曰:二只需稍加下壓,即可確保晶片檢修辅助 3^圖A另、Γ ” 片針腳1〇1能穩固的電性連接。第 252 l a ^ 〇 "?; Βθθ " ^# ^ ^ ^ ^ 20 ,, i腳1〇1電性連接。請參照㈣圖, 二=? 放置於晶片1〇上時,只需稱加下 經,針腳25會盥晶片沾曰ρ μ 1 性針腳257 f 片針腳101電性連接,而彈 而>水平方253可隨著晶片1(3的晶片針腳101 Γ〇Γ^ΐ 以確保晶片檢修輔助裝置20與晶片 10的曰曰片針腳ΗΠ能穩固的電性連接。 放置=有:2第4 Α圖,為避免晶片檢修輔助裝置2 0 持,可斜的情形’或者㈣之後高度不易維 了以在料板23上設置
Clients Docket No, TW95037CR ^ 1 _ 电路扳 丁T’S D〇ckei N〇:0932-A507I丁W/finaJ/ 200817697 11亦配合該固定接腳24開設有孔洞12。則當放置晶片檢 修輔助裝置20時,在固定接腳24與孔洞12卡合後,可 使晶片檢修輔助裝置20與晶片10的晶片針腳101穩固連 接。再者,請參照第4B圖(未顯示針腳25 ),由於晶片 10的每一根針腳都有不同的電器信號,為避免放置晶片 檢修輔助裝置20時,連接到錯誤的針腳,則替代電路板 23上只需設置三個固定接腳24,電路板11上也配合固定 接腳24的位置開設三個孔洞12,則在設置晶片檢修輔助 裝置20時,就不會發生接錯針腳的情形。 請參閱第5A圖,係為本發明之另一實施例,替代電 路板23下方設置有一殼體26 (第5A圖之殼體26為剖 面),殼體26包圍針腳25,並在晶片檢修輔助裝置20 放置於晶片10之上時,可以提供固定晶片檢修輔助裝置 20的功能。請參閱第5B圖(殼體26之下視圖)及第5C 圖,殼體26中有一晶片容置空間27,大小恰可容納晶片 10,如此則可避免晶片檢修輔助裝置20放置時可能會有 偏移或傾斜以及按壓之後高度不易維持的情形。此外,若 殼體26上可增設固定柱261,電路板11上也在對應的位 置開設孔洞,則在設置晶片檢修輔助裝置20時,亦可避 免接錯針腳的情形。 再請參閱第6圖,係為本發明之另一實施例,晶片檢 修輔助裝置40包括有替代晶片41、連接電路板42、替代 電路板43,其中連接電路板42藉由連接腳421與替代電 路板43電性連接,而替代晶片41與連接腳421電性連 接。替代電路板43包括有複數針腳431,針腳431對應 替代晶片41之針腳設置於替代電路板43之二侧,並與連
Client’s Docket No.: TW95037GB TT’s Docket N〇:0932-A50711 -TW/fmal/ 9 200817697 接腳421電性連接。晶片檢修輔助裝置40放置於晶片10 之上時,針腳431可使替代電路板43與晶片10電性連 接。本實施例之晶片檢修輔助裝置40中,針腳431亦可 採用如第2A〜3B圖所示的針腳,而替代電路板43亦可 設置如第4A〜5C圖所示的固定接腳或殼體,以下不另贅 述。 雖然本發明已以較佳實施例揭露如上,然其並非用以 限定本發明,任何熟習此技藝者,在不脫離本發明之精神 和範圍内,當可作些許之更動與潤飾,因此本發明之保護 範圍當視後附之申請專利範圍所界定者為準。
Client’s Docket No·: TW95037GB 1〇 TT5s Docket N〇:0932-A50711 -TW/final/ 200817697 【圖式簡單說明】 第1A-1B圖係為本發明之晶片檢修輔助裝置與電路 板之不意圖, 第2A-2B圖係為本發明之晶片檢修輔助裝置之另一 實施例之不意圖; 第3A-3B圖係為本發明之晶片檢修輔助裝置之另一 實施例之示意圖; 第4A-4B圖係為本發明之晶片檢修輔助裝置之另一 實施例與電路板結合之作動圖; 第5A-5C圖係為本發明之晶片檢修辅助裝置之另一 實施例與電路板結合之作動圖; 第6圖係為本發明之晶片檢修輔助裝置之另一實施例 之示意圖。 【主要元件符號說明】 本發明 101〜針腳; 12〜孔洞; 10〜晶片; 11〜電路板; 20、40〜晶片檢修輔助裝置;21、41〜替代晶片; 23、43〜替代電路板; 24〜固定接腳; 25、431〜針腳·, 261〜固定柱; 29〜切換開關; 421〜連接腳。 26〜殼體; 27〜容置空間; 42〜連接電路板;
Client’s Docket No.: TW95037GB TT5s Docket N〇:0932-A50711-TW/fmal/

Claims (1)

  1. 200817697 十、申請專利範圍: 1 · 一種晶片檢修輔助裝置,用以檢修一晶片,並且該 晶片與一電路板電性連接,該裝置包括有: 一替代晶片, 一替代電路板,與該替代晶片電性連接,該替代電路 板包括有複數針腳,該等針腳對應該替代晶片之針腳設置 於該替代電路板之二側,並與該替代晶片之針腳電性連 接,且使該替代電路板與該晶片電性連接;以及 一切換開關,用以設定該晶片與該替代晶片之狀態。 2. —種晶片檢修輔助裝置,用以檢修一晶片,並且該 晶片與一電路板電性連接,該裝置包括有: 一替代晶片; 一連接電路板,與該替代晶片電性連接,包括有複數 連接腳; 一替代電路板,該連接電路板藉由該等連接腳與該替 代電路板電性連接,而該替代電路板包括有複數針腳,該 等針腳對應替代晶片之針腳設置於該替代電路板之二 侧,並與該替代晶片之針腳電性連接,且使該替代電路板 與該晶片電性連接;以及 一切換開關,用以設定該晶片與該替代晶片之狀態。 3. 如申請專利範圍第1項或第2項所述之晶片檢修輔 助裝置,該替代電路板設置有固定接腳,用以與該電路板 卡合。 4. 如申請專利範圍第3項所述之晶片檢修輔助裝置, 其中該固定接腳糸為二個。 5. 如申請專利範圍第1項或第2項所述之晶片檢修輔 Client’s Docket No.: TW95037GB TT^ Docket Ν〇:0932-Α50711-TW/fmal/ 12 200817697 殼體’用以固定該晶片檢 助裝置,該替代電路板設置有 修輔助裝置。 其二申體==【:項所述之晶片檢修輔助裝置, 、负 』谷置该晶片之容置空間。 8·如申請專利範圍第i項或第2項所述之曰 助叙置’其中該等針腳係為彈*針腳(pog。pin)'欢 •如申請專利範圍第i 曰^ 助裝置,其中該針腳係為彈性針腳。貝斤这之日日片檢修辅 =如申請專利範圍第9項所述之 置’其中該彈性針腳之自由端係可沿水平方向移動辅Μ Client’s Docket No.: TW95037GB TT5s Docket N〇:0932-A50711 -TW/fmal/
TW095137526A 2006-10-12 2006-10-12 Detection device for chip TWI310460B (en)

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TW095137526A TWI310460B (en) 2006-10-12 2006-10-12 Detection device for chip
CN200610136684.3A CN101169464A (zh) 2006-10-12 2006-10-27 芯片检修辅助装置
US11/654,558 US7768288B2 (en) 2006-10-12 2007-01-18 Detection device
FR0700694A FR2907229B1 (fr) 2006-10-12 2007-01-31 Dispositif de detection.
JP2007163767A JP4456620B2 (ja) 2006-10-12 2007-06-21 検出装置

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TWI310460B TWI310460B (en) 2009-06-01

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EP2317330B1 (en) 2009-09-11 2013-12-11 Giga-Byte Technology Co., Ltd. Pin connector and chip test fixture having the same
CN102095956B (zh) * 2009-12-11 2013-02-13 名硕电脑(苏州)有限公司 检测装置及检测方法
JP6365467B2 (ja) * 2015-08-28 2018-08-01 株式会社デンソー 断線検出装置
CN108076588A (zh) * 2016-11-11 2018-05-25 技嘉科技股份有限公司 电子装置
CN110553832A (zh) * 2019-10-17 2019-12-10 苏州晟达力芯电子科技有限公司 一种机械部件旋转检测的装置
US20250372892A1 (en) * 2024-05-29 2025-12-04 Dell Products L.P. Information handling system dongle with swappable antenna

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JPH01160377A (ja) 1987-12-15 1989-06-23 Matsushita Electric Works Ltd インバータの制御回路
JPH0477834A (ja) 1990-07-16 1992-03-11 Nippon Chemicon Corp インサーキットエミュレータ
JPH0695908A (ja) 1992-06-02 1994-04-08 Nec Corp マイクロコンピュータ開発用システム・ボードの評価方 法およびその評価用プローブ
US6885213B2 (en) * 2002-09-13 2005-04-26 Logicvision, Inc. Circuit and method for accurately applying a voltage to a node of an integrated circuit
US7129730B2 (en) * 2004-12-15 2006-10-31 Chipmos Technologies (Bermuda) Ltd. Probe card assembly

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US20080155312A1 (en) 2008-06-26
CN101169464A (zh) 2008-04-30
FR2907229B1 (fr) 2012-12-21
TWI310460B (en) 2009-06-01
JP4456620B2 (ja) 2010-04-28
US7768288B2 (en) 2010-08-03
JP2008096421A (ja) 2008-04-24
FR2907229A1 (fr) 2008-04-18

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