200815727 九、發明說明： 【發明所屬技術領域】 本發明係有關於-種散熱基板，尤其係有關於一種具 有電性絕緣層之銘散熱基板，其一方面可阻隔電流傳遞， 另一方面卻可導熱。 【先前技術】 隨著科技的魏，各式各樣的電子元件或裝置已㈣ 展出。這些使用電力驅動的電子元件或裝置，會难 心轉換成其他形式的能量’例如光、位能、動能 轉換率並無法達到_，因此於能. 程中會有-部分的電能會散失掉，此種散失㈣ ㈣⑦王現的形式即為熱能。因此，在習 置藉由電力運作的過程中會產生埶牛或本 的熱能會進—步導致電子元件或裝二：，、二這些蓄賴 便一故，這些不想要的熱散掉 習知具有良好熱傳導效率的材料 二，雖然具有良好的導熱性，但同時為 要-緣的狀況下。故而積極尋找一 ：卜又需 具有絕緣性之熱性但又 【發明内容】 200815727 為了克服習知技術所遭遇之困難與問題，本發明之目 的即在於提供—種具電絕緣性之錄熱基板，其不但具有 ^子的、、、傳導性可將電子元件或裝置所產生的熱散去，同 ¥亦具有良好的電性阻隔效果。 根據本發明所指出之一種具電絕緣性之銘散熱基板， 其包括： 一銘或紹合金基板；以及200815727 IX. DESCRIPTION OF THE INVENTION: 1. Field of the Invention The present invention relates to a heat dissipating substrate, and more particularly to a heat dissipating substrate having an electrically insulating layer, which can block current transfer on the one hand, and Thermal conductivity. [Prior Art] With the Wei of science and technology, various electronic components or devices have been exhibited (4). These electronically driven electronic components or devices can be difficult to convert into other forms of energy, such as light, potential energy, and kinetic energy conversion rate, and cannot reach _, so that some of the energy will be lost during the process. Lost (4) (4) The form of the 7 king is heat. Therefore, in the process of using electricity to operate, the yak or the heat of the yak will be generated, which will lead to the electronic components or the installation of the second:, and the second, these unresolved heats are lost. The material 2 with good heat conduction efficiency, although having good thermal conductivity, is simultaneously in the condition of the edge. Therefore, it is necessary to actively search for one: Bu needs to have the thermal property of insulation, but also [invention] 200815727 In order to overcome the difficulties and problems encountered by the prior art, the object of the present invention is to provide a thermal insulation substrate with electrical insulation. The utility model not only has the characteristics of the electrons, but also has the conductivity to dissipate the heat generated by the electronic component or the device, and has the same electrical barrier effect as the ¥. An electrically insulating heat-dissipating substrate according to the present invention, comprising: an inscription or alloy substrate;
形成於该鋁或鋁合金基板上之電性絕緣層， /、中"亥甩性絕緣層係為一氧化鋁層，其具有由柱狀 結晶體所構成的多孔結構，且該多孔結構之孔隙率在 20%-50%之間，且厚度在2〇_1〇〇μιη之間。 本發明之另_目的係提供一種製備上述具電絕緣性之 铭政熱基板的方法，其步驟包含： 提供一鋁或鋁合金基板；以及 對該1呂或紹合金基板之表面進行陽極處理，以使其表 面上形成一具多孔結構的氧化鋁層。 本發明將藉由參考下列的實施方式做進一步的說明， 在此所述之實施方式並不限制本發明前面所揭示之内容。 热習本發明之技#者，可做些許之改良與㈣，但仍 離本發明之齡.疃。 ^ 【實施方式】 參閱第-圖，為本發明具電絕緣性之链散熱基被 面不意圖。本發明具電絕緣性之域熱基板包含-叙或銘 6 200815727 合金基板1G，以及—形成於喊IS合金基板1G上，作為 電性絕緣層之氧化鋁層12。 … 則述之氧化鋁層具有由柱狀結晶體所構成的多孔結 構，為使其具有較佳之熱料效果且㈣能達成電絕緣 性’其厚度較佳為2(Μ〇0μπι，更佳為3〇-8〇μπι，且孔係 較佳為篇福，更佳為狐45%。另外，其孔徑大小於 本發明巾並沒料別的聞，但為麟較佳賴傳導效 果’其較佳為50-5〇〇nm。 本务明月丨』述之氧化!呂層，可藉由任何習知可製得 纽結構的方絲製備，__祕合金基板表面進行 陽極處理’以使其表面長出具有規狀纽結構紹氧化 層，亦即電性絕緣層’但並不僅限於此。 為使电子疋件或裝置之熱可均勻且快速的經由本發明 電性絕緣料出，可進—步於本發明電性絕緣層上形成一 導=金屬層14’ Μ使該電子元件或裝置所散發出來的熱 更容易聚集並傳導至本發明電性絕緣層上，如第二圖所 不此至屬層可藉由任何習知的方法形成於電性絕緣層 上’例如真^蒸錢法’但並不僅限於此。 藉此’電子元件或裝置所產的熱將可經 快速的傳導至本發明電性絕緣層上。由於空氣中通常= 由水分t所;!成之;&度，因此傳導至本發明電性絕緣層上 的熱’冒使：本發明電性絕緣層的溫度上升。當溫度上升 至40-60 C時’本發明電性絕緣層之㈣ 分子即會輯習知_流的物理顧，開騎本發明電^ 7 200815727 絕緣層的孔隙中流動 因而造成一自動循環的散熱效果， 而將熱自金屬板傳遞线—合金基板。之後，再進一步 傳遞，纽中，以相散熱之目的。由於習知氧化紹具有 電絕、纟豕性’因此電性絕緣；g 豕增即可有效的將電流阻隔。另一 方面，由於此氧化鋁層之厘疮k — 由此層傳遞出去 ^ χ 予度極溽，因此熱即可很快的噔An electrical insulating layer formed on the aluminum or aluminum alloy substrate, and the intermediate insulating layer is an aluminum oxide layer having a porous structure composed of columnar crystals, and the pores of the porous structure The ratio is between 20% and 50%, and the thickness is between 2〇_1〇〇μιη. Another object of the present invention is to provide a method for preparing the above-mentioned electrically insulating Mingzheng thermal substrate, the method comprising: providing an aluminum or aluminum alloy substrate; and anodizing the surface of the 1 Lu or Shao alloy substrate, A layer of alumina having a porous structure is formed on the surface thereof. The invention will be further illustrated by reference to the following embodiments, which are not intended to limit the invention. Those skilled in the art of the present invention may make some improvements and (4), but still be at the age of the present invention. [Embodiment] Referring to the drawings, it is not intended to be an electrically insulating chain heat sink base of the present invention. The electrically insulating domain thermal substrate of the present invention comprises -Synthesis 6 200815727 alloy substrate 1G, and an aluminum oxide layer 12 formed on the IS alloy substrate 1G as an electrically insulating layer. The aluminum oxide layer described above has a porous structure composed of columnar crystals, and has a preferred hot material effect and (4) electrical insulation is achieved. The thickness thereof is preferably 2 (Μ〇0 μm, more preferably 3). 〇-8〇μπι, and the pore system is better for the blessing, more preferably 45% for the fox. In addition, the pore size of the present invention is not unexpected, but it is better for the lining. It is 50-5〇〇nm. The oxidation of the Luna layer can be prepared by any conventionally known square wire, and the surface of the alloy substrate is anodized to make its surface The oxide layer, that is, the electrical insulating layer, is grown to have a regular structure, but is not limited thereto. In order to make the heat of the electronic component or device uniformly and quickly through the electrical insulating material of the present invention, it is possible to Forming a conductive metal layer 14' on the electrically insulating layer of the present invention, so that the heat emitted by the electronic component or device is more easily aggregated and conducted to the electrical insulating layer of the present invention, as shown in the second figure. The subordinate layer can be formed on the electrically insulating layer by any conventional method 'for example, steaming The money method is 'but not limited to this. The heat produced by the 'electronic component or device' will be quickly transferred to the electrically insulating layer of the invention. Since the air is usually = by the moisture t; Therefore, the heat transmitted to the electrically insulating layer of the present invention causes the temperature of the electrically insulating layer of the present invention to rise. When the temperature rises to 40-60 C, the (four) molecules of the electrically insulating layer of the present invention will The physics of the _ stream, open the ride of the invention ^ 7 200815727 The flow in the pores of the insulation layer thus causes an automatic cycle of heat dissipation, and the heat from the metal plate transfer line - alloy substrate. After that, further transfer, New Zealand, for the purpose of heat dissipation. Because the known oxidation oxide has electrical and sturdy properties, so it is electrically insulated; g 豕 increase can effectively block the current. On the other hand, due to the alumina layer k — the layer is passed out ^ χ to the extreme, so the heat can be quickly 噔
習知技藝者藉由閱讀 於電性絕緣層之金屬層， 線來替代。 本發明說明後均可了解到前述位 可以具有所需電路圖樣之金屬導 雖然柄明已以較佳實施例揭露如上’然其並非用以 限定本發明’任何熟習此㈣者，在錢離本發明之= 和範圍内，當可作些許之更動與潤飾，因此本發明^ 範圍當視後附之申請專利範圍所界定者為準。 不邊 200815727 【圖式簡單說明】 第一圖為本發明具電絕緣性之鋁散熱基板之一實施例的 剖面示意圖；以及 第二圖為本發明具電絕緣性之鋁散熱基板的另一實施例 的剖面示意圖。 【主要元件符號說明】 ίο 鋁或鋁合金基板 12 氧化鋁層 14 金屬層The skilled artisan replaces it by reading the metal layer of the electrically insulating layer. After the description of the present invention, it can be understood that the above-mentioned bits can have the metal trace of the required circuit pattern. Although the handle has been disclosed in the preferred embodiment as above, it is not intended to limit the invention to any of the four (four) persons. The invention is defined by the scope of the appended claims, and the scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic cross-sectional view showing an embodiment of an electrically insulating aluminum heat dissipating substrate of the present invention; and a second view showing another embodiment of an electrically insulating aluminum heat dissipating substrate of the present invention. A schematic cross-sectional view of an example. [Main component symbol description] ίο Aluminum or aluminum alloy substrate 12 Alumina layer 14 Metal layer